S56F8365W0MFGE_技术文档

56F8365/56F8165

Data Sheet

Technical Data

56F8300

16-bit Digital Signal Controllers

MC56F8365

Rev. 9

02/2012

freescale.com

Document Revision History

Version History

Rev 0

Description of Change

Pre-release, Alpha customers only

Rev 1.0

Rev 2.0

Initial Public Release

Added output voltage maximum value and note to clarify in Table 10-1; also removed overall life

expectancy note, since life expectancy is dependent on customer usage and must be

determined by reliability engineering. Clarified value and unit measure for Maximum allowed P_D

in Table 10-3. Corrected note about average value for Flash Data Retention in Table 10-4.

Added new RoHS-compliant orderable part numbers in Table 13-1.

Rev 3.0

Rev 4.0

Corrected Data Flash on page 5

Deleted RSTO from Pin Group 2 (listed after Table 10-1). Deleted formula for Max Ambient

Operating Temperature (Automotive) and Max Ambient Operating Temperature (Industrial) in

Table 10-4. Added RoHS-compliance and “pb-free” language to back cover.

Rev 5.0

Added information/corrected state during reset in Table 2-2. Clarified external reference crystal

frequency for PLL in Table 10-14 by increasing maximum value to 8.4MHz.

Rev 6.0

Rev. 7

Replaced “Tri-stated” with an explanation in State During Reset column in Table 2-2.

• Added the following note to the description of the TMS signal in Table 2-2:

Note: Always tie the TMS pin to V_DDthrough a 2.2K resistor.

• Added the following note to the description of the TRST signal in Table 2-2:

Note: For normal operation, connect TRST directly to V_SS. If the design is to be used in a debugging

environment, TRST may be tied to V_SSthrough a 1K resistor.

• Remove pullup comment from PWM pins in Table 2-2.

• Add Figure 10-1 showing current voltage characteristics.

Rev. 8

• In Table 10-23, correct interpretation of Calibration Factors to be viewed as worst case

factors.

• Add to Table 10-23 the DC drift of ADC over temperature.

• Removed “Preliminary” markings.

Rev 8.1

Please see http://www.freescale.com for the most current data sheet revision.

56F8365 Technical Data, Rev. 9

2

Freescale Semiconductor

Table of Contents

Part 1: Overview 5

Part 8: General Purpose Input/Output (GPIO)

133

1.1. 56F8365/56F8165 Features 5

1.2. Device Description 8

1.3. Award-Winning Development Environment 10

1.4. Architecture Block Diagram 10

1.5. Product Documentation 13

1.6. Data Sheet Conventions 14

8.1. Introduction 133

8.2. Memory Maps 133

8.3. Configuration 133

Part 9: Joint Test Action Group (JTAG) 138

9.1. JTAG Information 138

Part 2: Signal/Connection Descriptions 14

2.1. Introduction 14

Part 10: Specifications 138

10.1. General Characteristics 138

2.2. Signal Pins 18

10.2. DC Electrical Characteristics 143

10.3. AC Electrical Characteristics 148

10.4. Flash Memory Characteristics 148

10.5. External Clock Operation Timing 149

10.6. Phase Locked Loop Timing 149

10.7. Crystal Oscillator Timing 150

10.8. Reset, Stop, Wait, Mode Select, and Interrupt

Timing 150

10.9. Serial Peripheral Interface (SPI) Timing 153

10.10. Quad Timer Timing 157

10.11. Quadrature Decoder Timing 157

10.12. Serial Communication Interface (SCI) Timing 158

10.13. Controller Area Network (CAN) Timing 159

10.14. JTAG Timing 159

Part 3: On-Chip Clock Synthesis (OCCS) 36

3.1. Introduction 36

3.2. External Clock Operation 36

3.3. Registers 38

Part 4: Memory Map 38

4.1. Introduction 38

4.2. Program Map 39

4.3. Interrupt Vector Table 41

4.4. Data Map 44

4.5. Flash Memory Map 45

4.6. EOnCE Memory Map 46

4.7. Peripheral Memory Mapped Registers 47

4.8. Factory Programmed Memory 79

10.15. Analog-to-Digital Converter (ADC) Parameters

161

10.16. Equivalent Circuit for ADC Inputs 163

10.17. Power Consumption 164

Part 5: Interrupt Controller (ITCN) 79

5.1. Introduction 79

5.2. Features 79

5.3. Functional Description 80

5.4. Block Diagram 81

5.5. Operating Modes 81

5.6. Register Descriptions 82

5.7. Resets 109

Part 11: Packaging 166

11.1. 56F8365 Package and Pin-Out Information 166

11.2. 56F8165 Package and Pin-Out Information 169

Part 12: Design Considerations 174

12.1. Thermal Design Considerations 174

12.2. Electrical Design Considerations 175

12.3. Power Distribution and I/O Ring Implementation

176

Part 6: System Integration Module (SIM) 110

6.1. Introduction 110

6.2. Features 110

6.3. Operating Modes 111

6.4. Operating Mode Register 111

6.5. Register Descriptions 112

6.6. Clock Generation Overview 127

6.7. Power-Down Modes Overview 127

6.8. Stop and Wait Mode Disable Function 128

6.9. Resets 128

Part 13: Ordering Information 178

Part 7: Security Features 129

7.1. Operation with Security Enabled 129

7.2. Flash Access Blocking Mechanisms 129

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

3

56F8365/56F8165 General Description

Note: Features in italics are NOT available in the 56F8165 device.

• Up to 60 MIPS at 60MHz core frequency

• DSP and MCU functionality in a unified,

C-efficient architecture

• 512KB Program Flash

• 4KB Program RAM

• 32KB Data Flash

• 32KB Data RAM

• 32KB Boot Flash

• Up to two 6-channel PWM modules

• Four 4-channel, 12-bit ADCs

• Temperature Sensor

• Up to two Quadrature Decoders

• Up to two FlexCAN modules

• Optional On-Chip Regulator

• Two Serial Communication Interfaces (SCIs)

• Up to two Serial Peripheral Interface (SPIs)

• Up to four general-purpose Quad Timers

• Computer Operating Properly (COP)/Watchdog

• JTAG/Enhanced On-Chip Emulation (OnCE™) for unobtrusive, real-time debugging

• Up to 49 GPIO lines

• 128-pin LQFP Package

56F8365 Technical Data, Rev. 9

4

Freescale Semiconductor

56F8365/56F8165 Features

OCR_DIS

RSTO

RESET

V

SSA

PP

CAP

DD

SS

DDA

5

2

4

7

5

2

JTAG/

EOnCE

Port

6

Digital Reg

Analog Reg

PWM Outputs

PWMA

Low Voltage

Supervisor

Current Sense Inputs

or GPIOC

16-Bit

56800E Core

3

4

Fault Inputs

Data ALU

Program Controller

and Hardware

Looping Unit

Address

Generation

Unit

Bit

Manipulation

Unit

16 x 16 + 36 -> 36-Bit MAC

Three 16-bit Input Registers

Four 36-bit Accumulators

PWM Outputs

PWMB

Current Sense Inputs

or GPIOD

3

4

PAB

PDB

Fault Inputs

CDBR

CDBW

4

AD0

ADCA

AD1

4

5

4

R/W Control

Memory

XDB2

XAB1

XAB2

VREF

6

Program Memory

256K x 16 Flash

2K x 16 RAM

* External

Address Bus

Switch

A8-13 or GPIOA0-5

GPIOB0-4 or A16-20

AD0

ADCB

5

PAB

4

AD1

Boot ROM

16K x 16 Flash

System Bus

Control

PDB

Temp_Sense

* External

Data

Bus Switch

CDBR

CDBW

Data Memory

16K x 16 Flash

16K x 16 RAM

D7-10 or GPIOF0-3

GPIOD2-5 or CS4-7

Quadrature

Decoder 0 or

Quad

4

Timer A or

GPIOC

* Bus

Control

Quadrature

Decoder 1 or

Quad

Timer B or

SP1I or

IPBus Bridge (IPBB)

4

GPIO or

EMI CS or

FlexCAN2

GPIOD0 (CS2 or CAN2_TX)

GPIOD1 (CS3 or CAN2_RX)

Peripheral

Device Selects

RW

IPAB IPWDB

IPRDB

Control

GPIOC

Decoding

* EMI not functional in

this package; use as

GPIO pins

Quad Timer

C or GPIOE

Peripherals

2

Clock

resets

PLL

O

Quad Timer

D or GPIOE

4

System

P

O

R

SCI1 or

SPI0 or

GPIOE

SCI0 or

GPIOE

Interrupt

Controller

COP/

Watchdog

Integration

XTAL

Clock

2

FlexCAN

GPIOD

S

Module

Generator

EXTAL

C

2

4

2

CLKO

IRQA IRQB

CLKMODE

56F8365/56F8165 Block Diagram

Part 1 Overview

1.1 56F8365/56F8165 Features

1.1.1

Core

•

Efficient 16-bit 56800E family controller engine with dual Harvard architecture

Up to 60 Million Instructions Per Second (MIPS) at 60MHz core frequency

Single-cycle 16  16-bit parallel Multiplier-Accumulator (MAC)

Four 36-bit accumulators, including extension bits

Arithmetic and logic multi-bit shifter

Parallel instruction set with unique DSP addressing modes

Hardware DO and REP loops

Three internal address buses

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

5

•

Four internal data buses

Instruction set supports both DSP and controller functions

Controller-style addressing modes and instructions for compact code

Efficient C compiler and local variable support

Software subroutine and interrupt stack with depth limited only by memory

JTAG/EOnCE debug programming interface

1.1.2

Differences Between Devices

Table 1-1 outlines the key differences between the 56F8365 and 56F8165 devices.

Table 1-1 Device Differences

Feature

56F8365

56F8165

Guaranteed Speed

Program RAM

Data Flash

60MHz/60 MIPS

40MHz/40MIPS

Not Available

1 x 6

4KB

32KB

2 x 6

2

PWM

CAN

Not Available

2

Quad Timer

4

Quadrature Decoder

Temperature Sensor

2 x 4

1

1 x 4

Not Available

1.1.3

Memory

Note: Features in italics are NOT available in the 56F8165 device.

•

Harvard architecture permits as many as three simultaneous accesses to program and data memory

Flash security protection feature

On-chip memory, including a low-cost, high-volume Flash solution

— 512KB of Program Flash

— 4KB of Program RAM

— 32KB of Data Flash

— 32KB of Data RAM

— 32KB of Boot Flash

•

EEPROM emulation capability

1.1.4

Peripheral Circuits

Note: Features in italics are NOT available in the 56F8165 device.

•

Pulse Width Modulator module:

56F8365 Technical Data, Rev. 9

6

Freescale Semiconductor

56F8365/56F8165 Features

— In the 56F8365, two Pulse Width Modulator modules, each with six PWM outputs, three Current Sense

inputs, and four Fault inputs; fault-tolerant design with dead time insertion; supports both center-aligned

and edge-aligned modes

— In the 56F8165, one Pulse Width Modulator module with six PWM outputs, three Current Sense inputs

and three Fault inputs; fault-tolerant design with dead time insertion; supports both center-aligned and

edge-aligned modes

•

Four 12-bit, Analog-to-Digital Converters (ADCs), which support four simultaneous conversions with

quad, 4-pin multiplexed inputs; ADC and PWM modules can be synchronized through Timer C, channels

2 and 3

Quadrature Decoder:

— In the 56F8365, two four-input Quadrature Decoders or two additional Quad Timers

— In the 56F8165, one four-input Quadrature Decoder, which works in conjunction with Quad Timer A

•

Temperature Sensor can be connected, on the board, to any of the ADC inputs to monitor the on-chip

temperature

Quad Timer:

— In the 56F8365, four dedicated general-purpose Quad Timers totaling six dedicated pins: Timer C with

two pins and Timer D with four pins

— In the 56F8165, two Quad Timers; Timer A and Timer C both work in conjunction with GPIO

Optional On-Chip Regulator

•

Up to two FlexCAN (CAN Version 2.0 B-compliant) modules with 2-pin port for transmit and receive

Two Serial Communication Interfaces (SCIs), each with two pins (or four additional GPIO lines)

Up to two Serial Peripheral Interfaces (SPIs), both with configurable 4-pin port (or eight additional GPIO

lines); SPI1 can also be used as Quadrature Decoder 1 or Quad Timer B

•

Computer Operating Properly (COP)/Watchdog timer

Two dedicated external interrupt pins

49 General Purpose I/O (GPIO) pins; 28 pins dedicated to GPIO

External reset input pin for hardware reset

External reset output pin for system reset

Integrated low-voltage interrupt module

JTAG/Enhanced On-Chip Emulation (OnCE) for unobtrusive, processor speed-independent, real-time

debugging

•

Software-programmable, Phase Lock Loop (PLL)-based frequency synthesizer for the core clock

1.1.5

Energy Information

•

Fabricated in high-density CMOS with 5V-tolerant, TTL-compatible digital inputs

On-board 3.3V down to 2.6V voltage regulator for powering internal logic and memories; can be disabled

On-chip regulators for digital and analog circuitry to lower cost and reduce noise

Wait and Stop modes available

ADC smart power management

Each peripheral can be individually disabled to save power

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

7

1.2 Device Description

The 56F8365 and 56F8165 are members of the 56800E core-based family of controllers. Each combines,

on a single chip, the processing power of a Digital Signal Processor (DSP) and the functionality of a

microcontroller with a flexible set of peripherals to create an extremely cost-effective solution. Because

of their low cost, configuration flexibility, and compact program code, the 56F8365 and 56F8165 are

well-suited for many applications. The devices include many peripherals that are especially useful for

motion control, smart appliances, steppers, encoders, tachometers, limit switches, power supply and

control, automotive control (56F8365 only), engine management, noise suppression, remote utility

metering, industrial control for power, lighting, and automation applications.

The 56800E core is based on a Harvard-style architecture consisting of three execution units operating in

parallel, allowing as many as six operations per instruction cycle. The MCU-style programming model and

optimized instruction set allow straightforward generation of efficient, compact DSP and control code.

The instruction set is also highly efficient for C/C++ Compilers to enable rapid development of optimized

control applications.

The 56F8365 and 56F8165 support program execution from internal memories. Two data operands can be

accessed from the on-chip data RAM per instruction cycle. These devices also provide two external

dedicated interrupt lines and up to 49 General Purpose Input/Output (GPIO) lines, depending on peripheral

configuration.

1.2.1

56F8365 Features

The 56F8365 controller includes 512KB of Program Flash and 32KB of Data Flash (each programmable

through the JTAG port) with 4KB of Program RAM and 32KB of Data RAM. A total of 32KB of Boot

Flash is incorporated for easy customer inclusion of field-programmable software routines that can be used

to program the main Program and Data Flash memory areas. Both Program and Data Flash memories can

be independently bulk erased or erased in pages. Program Flash page erase size is 1KB. Boot and Data

Flash page erase size is 512 bytes. The Boot Flash memory can also be either bulk or page erased.

A key application-specific feature of the 56F8365 is the inclusion of two Pulse Width Modulator (PWM)

modules. These modules each incorporate three complementary, individually programmable PWM signal

output pairs (each module is also capable of supporting six independent PWM functions, for a total of 12

PWM outputs) to enhance motor control functionality. Complementary operation permits programmable

dead time insertion, distortion correction via current sensing by software, and separate top and bottom

output polarity control. The up-counter value is programmable to support a continuously variable PWM

frequency. Edge-aligned and center-aligned synchronous pulse width control (0% to 100% modulation) is

supported. The device is capable of controlling most motor types: ACIM (AC Induction Motors); both

BDC and BLDC (Brush and Brushless DC motors); SRM and VRM (Switched and Variable Reluctance

Motors); and stepper motors. The PWMs incorporate fault protection and cycle-by-cycle current limiting

with sufficient output drive capability to directly drive standard optoisolators. A “smoke-inhibit”,

write-once protection feature for key parameters is also included. A patented PWM waveform distortion

correction circuit is also provided. Each PWM is double-buffered and includes interrupt controls to permit

integral reload rates to be programmable from 1 to 16. The PWM modules provide reference outputs to

synchronize the Analog-to-Digital Converters through two channels of Quad Timer C.

56F8365 Technical Data, Rev. 9

8

Freescale Semiconductor

Device Description

The 56F8365 incorporates two Quadrature Decoders capable of capturing all four transitions on the

two-phase inputs, permitting generation of a number proportional to actual position. Speed computation

capabilities accommodate both fast- and slow-moving shafts. An integrated watchdog timer in the

Quadrature Decoder can be programmed with a time-out value to alert when no shaft motion is detected.

Each input is filtered to ensure only true transitions are recorded.

This controller also provides a full set of standard programmable peripherals that include two Serial

Communications Interfaces (SCIs); two Serial Peripheral Interfaces (SPIs); and four Quad Timers. Any of

these interfaces can be used as General Purpose Input/Outputs (GPIOs) if that function is not required.

Two Flex Controller Area Network (FlexCAN) interfaces (CAN Version 2.0 B-compliant) and an internal

interrupt controller are also a part of the 56F8365.

1.2.2

56F8165 Features

The 56F8165 hybrid controller includes 128KB of Program Flash, programmable through the JTAG port,

and 8KB of Data RAM. A total of 8KB of Boot Flash is incorporated for easy customer inclusion of

field-programmable software routines that can be used to program the main Program Flash memory area.

The Program Flash memory can be independently bulk erased or erased in pages; Program Flash page

erase size is 1KB. The Boot Flash page erase size is 512 bytes; Boot Flash memory can also be either bulk

or page erased.

A key application-specific feature of the 56F8165 is the inclusion of one Pulse Width Modulator (PWM)

module. This module incorporates three complementary, individually programmable PWM signal output

pairs and can also support six independent PWM functions to enhance motor control functionality.

Complementary operation permits programmable dead time insertion, distortion correction via current

sensing by software, and separate top and bottom output polarity control. The up-counter value is

programmable to support a continuously variable PWM frequency. Edge-aligned and center-aligned

synchronous pulse width control (0% to 100% modulation) is supported. The device is capable of

controlling most motor types: ACIM (AC Induction Motors); both BDC and BLDC (Brush and Brushless

DC motors); SRM and VRM (Switched and Variable Reluctance Motors); and stepper motors. The PWM

incorporates fault protection and cycle-by-cycle current limiting with sufficient output drive capability to

directly drive standard optoisolators. A “smoke-inhibit”, write-once protection feature for key parameters

is also included. A patented PWM waveform distortion correction circuit is also provided. The PWM is

double-buffered and includes interrupt controls to permit integral reload rates to be programmable from 1

to 16. The PWM module provides reference outputs to synchronize the Analog-to-Digital Converters

through two channels of Quad Timer C.

The 56F8165 incorporates a Quadrature Decoder capable of capturing all four transitions on the two-phase

inputs, permitting generation of a number proportional to actual position. Speed computation capabilities

accommodate both fast- and slow-moving shafts. An integrated watchdog timer in the Quadrature Decoder

can be programmed with a time-out value to alert when no shaft motion is detected. Each input is filtered

to ensure only true transitions are recorded.

This controller also provides a full set of standard programmable peripherals that include two Serial

Communications Interfaces (SCIs); two Serial Peripheral Interfaces (SPIs); and two Quad Timers. Any of

these interfaces can be used as General Purpose Input/Outputs (GPIOs) if that function is not required. An

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

9

internal interrupt controller is also a part of the 56F8165.

1.3 Award-Winning Development Environment

TM

Processor Expert

(PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use

component-based software application creation with an expert knowledge system.

The CodeWarrior Integrated Development Environment is a sophisticated tool for code navigation,

compiling, and debugging. A complete set of evaluation modules (EVMs) and development system cards

will support concurrent engineering. Together, PE, CodeWarrior and EVMs create a complete, scalable

tools solution for easy, fast, and efficient development.

1.4 Architecture Block Diagram

Note: Features in italics are NOT available in the 56F8165 device and are shaded in the following figures.

The 56F8365/56F8165 architecture is shown in Figure 1-1 and Figure 1-2. Figure 1-1 illustrates how the

56800E system buses communicate with internal memories and the IPBus Bridge. Table 1-2 lists the

internal buses in the 56800E architecture and provides a brief description of their function. Figure 1-2

shows the peripherals and control blocks connected to the IPBus Bridge. The figures do not show the

on-board regulator and power and ground signals. They also do not show the multiplexing between

peripherals or the dedicated GPIOs. Please see Part 2, Signal/Connection Descriptions, to see which

signals are multiplexed with those of other peripherals.

Also shown in Figure 1-2 are connections between the PWM, Timer C and ADC blocks. These

connections allow the PWM and/or Timer C to control the timing of the start of ADC conversions. The

Timer C channel indicated can generate periodic start (SYNC) signals to the ADC to start its conversions.

In another operating mode, the PWM load interrupt (SYNC output) signal is routed internally to the Timer

C input channel as indicated. The timer can then be used to introduce a controllable delay before

generating its output signal. The timer output then triggers the ADC. To fully understand this interaction,

please see the 56F8300 Peripheral User Manual for clarification on the operation of all three of these

peripherals.

56F8365 Technical Data, Rev. 9

10

Freescale Semiconductor

Architecture Block Diagram

5

JTAG / EOnCE

Boot

Flash

pdb_m[15:0]

pab[20:0]

Program

Flash

Program

RAM

cdbw[31:0]

56800E

EMI*

11

4

Address

CHIP

TAP

Data

Controller

6

Control

TAP

Linking

Module

Data RAM

xab1[23:0]

xab2[23:0]

Data

Flash

External

JTAG

Port

cdbr_m[31:0]

xdb2_m[15:0]

To Flash

Control Logic

IPBus

Bridge

Flash

Memory

Module

NOT available on the 56F8165 device.

* EMI not functional in this package; since only part of

the address/data bus is bonded out, use as GPIO pins

IPBus

Figure 1-1 System Bus Interfaces

Note:

Flash memories are encapsulated within the Flash Memory (FM) Module. Flash control is

accomplished by the I/O to the FM over the peripheral bus, while reads and writes are completed

between the core and the Flash memories.

The primary data RAM port is 32 bits wide. Other data ports are 16 bits.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

11

To/From IPBus Bridge

Interrupt

CLKGEN

Controller

(OSC/PLL)

Low Voltage Interrupt

POR and LVI

Timer A

System POR

RESET

4

Quadrature Decoder 0

Timer D

SIM

4

COP Reset

COP

Timer B

2

FlexCAN

FlexCAN2

4

Quadrature Decoder 1

SPI1

13

PWMA

SYNC Output

13

GPIOA

GPIOB

GPIOC

GPIOD

GPIOE

GPIOF

PWMB

SYNC Output

ch2i

ch3i

2

Timer C

ch3i

ch2i

8

ADCB

4

SPI0

SCI0

8

ADCA

2

1

TEMP_SENSE

2

SCI1

Note: ADC A and ADC B use the same voltage

reference circuit with V_REFH, V_REFP,V_REFMID

V_REFN, and V_REFLOpins.

IPBus

,

NOT available on the 56F8165 device.

56F8365 Technical Data, Rev. 9

12

Freescale Semiconductor

Product Documentation

Figure 1-2 Peripheral Subsystem

Table 1-2 Bus Signal Names

Name

Function

Program Memory Interface

pdb_m[15:0]

cdbw[15:0]

Program data bus for instruction word fetches or read operations.

Primary core data bus used for program memory writes. (Only these 16 bits of the cdbw[31:0] bus

are used for writes to program memory.)

pab[20:0]

Program memory address bus. Data is returned on pdb_m bus.

Primary Data Memory Interface Bus

cdbr_m[31:0] Primary core data bus for memory reads. Addressed via xab1 bus.

cdbw[31:0]

xab1[23:0]

Primary core data bus for memory writes. Addressed via xab1 bus.

Primary data address bus. Capable of addressing bytes¹, words, and long data types. Data is written

on cdbw and returned on cdbr_m. Also used to access memory-mapped I/O.

Secondary Data Memory Interface

xdb2_m[15:0] Secondary data bus used for secondary data address bus xab2 in the dual memory reads.

xab2[23:0]

Secondary data address bus used for the second of two simultaneous accesses. Capable of

addressing only words. Data is returned on xdb2_m.

Peripheral Interface Bus

IPBus [15:0]

Peripheral bus accesses all on-chip peripherals registers. This bus operates at the same clock rate

as the Primary Data Memory and therefore generates no delays when accessing the processor.

Write data is obtained from cdbw. Read data is provided to cdbr_m.

1. Byte accesses can only occur in the bottom half of the memory address space. The MSB of the address will be forced

to 0.

1.5 Product Documentation

The documents listed in Table 1-3 are required for a complete description and proper design with the

56F8365/56F8165 devices.. Documentation is available from local Freescale distributors, Freescale

semiconductor sales offices, Freescale Literature Distribution Centers, or online at

http://www.freescale.com.

Table 1-3 Chip Documentation

Topic

DSP56800E

Description

Order Number

DSP56800EERM

Detailed description of the 56800E family architecture,

16-bit controller core processor, and the instruction set

Reference Manual

56F8300 Peripheral

User Manual

Detailed description of peripherals of the 56F8300

family of devices

MC56F8300UM

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

13

Table 1-3 Chip Documentation

Topic

Description

Order Number

MC56F83xxBLUM

56F8300 SCI/CAN

Bootloader User

Manual

Detailed description of the SCI/CAN Bootloaders

56F8300 family of devices

56F8365/56F8165

Technical Data Sheet

Electrical and timing specifications, pin descriptions,

device specific peripheral information and package

descriptions (this document)

MC56F8365

Errata

Details any chip issues that might be present

MC56F8365E

MC56F8165E

1.6 Data Sheet Conventions

This data sheet uses the following conventions:

OVERBAR

This is used to indicate a signal that is active when pulled low. For example, the RESET pin is

active when low.

“asserted”

“deasserted”

Examples:

A high true (active high) signal is high or a low true (active low) signal is low.

A high true (active high) signal is low or a low true (active low) signal is high.

Voltage¹

Signal/Symbol

Logic State

True

Signal State

Asserted

V_IL/V_OL

False

Deasserted

Asserted

V_IH/V_OH

V_IL/V_OL

True

False

Deasserted

1. Values for V , V , V , and V are defined by individual product specifications.

IL

OL

IH

OH

Part 2 Signal/Connection Descriptions

2.1 Introduction

The input and output signals of the 56F8365 and 56F8165 are organized into functional groups, as detailed

in Table 2-1 and as illustrated in Figure 2-1. In Table 2-2, each table row describes the signal or signals

present on a pin.

56F8365 Technical Data, Rev. 9

14

Freescale Semiconductor

Introduction

Table 2-1 Functional Group Pin Allocations

Number of Pins in Package

Functional Group

56F8365

56F8165

Power (V_DDor V_DDA

)

9

Power Option Control

Ground (V_SSor V_SSA

1

6

1

6

)

Supply Capacitors¹& V_PP

6

PLL and Clock

4

6

4

6

Bus Control

Interrupt and Program Control

Pulse Width Modulator (PWM) Ports

Serial Peripheral Interface (SPI) Port 0

Serial Peripheral Interface (SPI) Port 1

4

26

4

13

4

—

4

Quadrature Decoder Port 0²

4

Quadrature Decoder Port 1³

Serial Communications Interface (SCI) Ports

CAN Ports

4

—

4

2

4

—

21

4

Analog-to-Digital Converter (ADC) Ports

Timer Module Ports

21

6

JTAG/Enhanced On-Chip Emulation (EOnCE)

Temperature Sense

5

1

—

28

Dedicated GPIO ( Address Bus = 11; Data Bus = 4⁴)

28

1. If the on-chip regulator is disabled, the V

pins serve as 2.5V V

power inputs

DD_CORE

CAP

2. Alternately, can function as Quad Timer pins or GPIO

3. Pins in this section can function as Quad Timer, SPI 1, orGPIO

4. EMI not functional in these packages; use as GPIO pins.

Note: See Table 1-1 for 56F8165 functional differences.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

15

V

Power

Quadrature

Decoder 0

or Quad

Timer A or

GPIO

DD_IO

PHASEA0 (TA0, GPIOC4)

PHASEB0(TA1, GPIOC5 )

INDEX0 (TA2, GPIOC6)

HOME0 (TA3, GPIOC7)

1

7

1

5

1

V

DDA_OSC_PLL

V_{DDA_ADC}

Power

V_SS

Ground

V_{SSA_ADC}

56F8365

SCLK0 (GPIOE4)

MOSI0 (GPIOE5)

MISO0 (GPIOE6)

SS0 (GPIOE7)

1

OCR_DIS

1

SPI0 or

GPIO

Other

Supply

Ports

V

_CAP1 - V_CAP

V_PP1 & V_PP

4

2

4

2

Quadrature

Decoder 1 or

Quad Timer B

or SPI1 or

GPIO

PHASEA1 (TB0, SCLK1, GPIOC0)

PHASEB1 (TB1, MOSI1, GPIOC1)

INDEX1 (TB2, MISO1, GPIOC2)

HOME1 (TB3, SS1, GPIOC3)

1

CLKMODE

1

PLL

and

Clock

EXTAL

XTAL

1

CLKO

PWMA0 - 5

6

3

4

*External

Address

Bus

A8 - A13 (GPIOA0 - 5)

GPIOB0-4 (A16 - 20)

ISA0 - 2 (GPIOC8 - 10)

FAULTA0 - 3

PWMA

6

5

or GPIO

PWMB0 - 5

6

3

4

*External

Data Bus

D7 - D10 (GPIOF0 - 3)

ISB0 - 2 (GPIOD10 - 12)

4

PWMB

FAULTB0 - 3

ANA0 - 7

V_REF

GPIOD0 (CS2, CAN2_TX)

GPIOD1 (CS3, CAN2_RX)

GPIOD2 - 5 (CS4 - 7)

ADCA

ADCB

8

1

*External

Bus

Control

5

8

ANB0 - 7

4

Temperature

Sensor

TEMP_SENSE

1

CAN_RX

CAN_TX

1

CAN

TXD0 (GPIOE0)

RXD0 (GPIOE1)

SCI0 or

GPIOE

1

Quad

TC0 - 1 (GPIOE8 - 9)

2

4

Timer C

and D or

GPIO

TXD1 (GPIOD6)

RXD1 (GPIOD7)

SCI1 or

GPIO

1

TD0 - 3 (GPIOE10 - 13)

TCK

TMS

TDI

1

IRQA

1

JTAG/

EOnCE

Port

1

Interrupt/

Program

Control

IRQB

RESET

RSTO

TDO

TRST

1

* EMI not functional in this package; use as GPIO pins

1

Figure 2-1 56F8365 Signals Identified by Functional Group (128-Pin LQFP)

1. Alternate pin functionality is shown in parenthesis; pin direction/type shown is the default functionality.

56F8365 Technical Data, Rev. 9

16

Freescale Semiconductor

Introduction

Quadrature

V

PHASEA0 (TA0, GPIOC4)

PHASEB0(TA1, GPIOC5 )

INDEX0 (TA2, GPIOC6)

Power

DD_IO

1

7

1

5

1

Decoder 0

or Quad

Timer A or

GPIO

V_{DDA_ADC}

V

DDA_OSC_PLL

V_SS

HOME0 (TA3, GPIOC7)

Ground

1

V_{SSA_ADC}

56F8165

OCR_DIS

SCLK0 (GPIOE4)

MOSI0 (GPIOE5)

MISO0 (GPIOE6)

1

SPI0 or

GPIO

Other

Supply

Ports

V

_CAP1 - V_CAP

V_PP1 & V_PP

4

2

4

2

1

SS0 (GPIOE7)

CLKMODE

1

(SCLK1, GPIOC0)

(MOSI1, GPIOC1)

PLL

and

Clock

EXTAL

XTAL

1

SPI1 or

GPIO

(MISO1, GPIOC2)

(SS1,GPIOC3)

CLKO

1

A8 - A13 (GPIOA0 - 5)

GPIOB0-4 (A16 - 20)

6

5

*External

Address

Bus

(GPIOC8 - 10)

GPIO

3

or GPIO

PWMB0 - 5

6

D7 - D10 (GPIOF0 - 3)

GPIOD0 - 5 (CS2 - 7)

*External

Data Bus

ISB0 - 2 (GPIOD10 - 12)

PWMB

4

6

3

4

FAULTB0-3

ANA0 - 7

V_REF

ADCA

ADCB

8

*External

Bus

Control

5

8

ANB0 - 7

TXD0 (GPIOE0)

RXD0 (GPIOE1)

SCI0 or

GPIOE

1

TXD1 (GPIOD6)

RXD1 (GPIOD7)

TC0 - 1 (GPIOE8 - 9)

(GPIOE10 - 13)

QUAD

Timer C or

GPIO

SCI1 or

GPIO

1

2

4

TCK

TMS

TDI

1

JTAG/

EOnCE

Port

IRQA

1

Interrupt/

Program

Control

IRQB

TDO

1

RESET

RSTO

TRST

1

* EMI not functional in this package; use as GPIO pins

1

Figure 2-2 56F8165 Signals Identified by Functional Group (128-Pin LQFP)

1. Alternate pin functionality is shown in parenthesis; pin direction/type shown is the default functionality.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

17

2.2 Signal Pins

After reset, each pin is configured for its primary function (listed first). Any alternate functionality must

be programmed.

EMI is not functional in this package; since only part of the address/data bus is bonded out, use as GPIO

pins.

Note: Signals in italics are NOT available in the 56F8165 device.

If the “State During Reset” lists more than one state for a pin, the first state is the actual reset state. Other

states show the reset condition of the alternate function, which you get if the alternate pin function is

selected without changing the configuration of the alternate peripheral. For example, the A8/GPIOA0 pin

shows that it is tri-stated during reset. If the GPIOA_PER is changed to select the GPIO function of the

pin, it will become an input if no other registers are changed.

Table 2-2 Signal and Package Information for the 128-Pin LQFP

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

V_{DD_IO}

V_{DDA_ADC}

4

14

25

36

62

76

112

94

Supply

I/O Power — This pin supplies 3.3V power to the chip I/O

interface and also the Processor core throught the on-chip voltage

regulator, if it is enabled.

Supply

ADC Power — This pin supplies 3.3V power to the ADC modules.

It must be connected to a clean analog power supply.

V_{DDA_OSC_}

72

Oscillator and PLL Power — This pin supplies 3.3V power to the

OSC and to the internal regulator that in turn supplies the Phase

Locked Loop. It must be connected to a clean analog power

supply.

PLL

56F8365 Technical Data, Rev. 9

18

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

V_SS

3

Supply

Ground — These pins provide ground for chip logic and I/O

drivers.

21

35

59

65

95

V_SS

V_{SSA_ADC}

Supply

Input

ADC Analog Ground — This pin supplies an analog ground to

the ADC modules.

OCR_DIS

71

Input

On-Chip Regulator Disable —

Tie this pin to V_SSto enable the on-chip regulator

Tie this pin to V_DDto disable the on-chip regulator

This pin is intended to be a static DC signal from power-up to

shut down. Do not try to toggle this pin for power savings

during operation.

V_CAP

1

2

3

49

122

75

Supply

V_CAP1 - 4 — When OCR_DIS is tied to V_SS(regulator enabled),

connect each pin to a 2.2F or greater bypass capacitor in order

to bypass the core logic voltage regulator, required for proper chip

operation. When OCR_DIS is tied to V_DD(regulator disabled),

these pins become V_{DD_CORE}and should be connected to a

regulated 2.5V power supply.

V_CAP4

13

Note: This bypass is required even if the chip is powered

with an external supply.

V

_PP1

V_PP

CLKMODE

119

5

Input

V_PP1 - 2 — These pins should be left unconnected as an open

circuit for normal functionality.

2

79

Clock Input Mode Selection — This input determines the

function of the XTAL and EXTAL pins.

1 = External clock input on XTAL is used to directly drive the input

clock of the chip. The EXTAL pin should be grounded.

0 = A crystal or ceramic resonator should be connected between

XTAL and EXTAL.

EXTAL

74

Input

External Crystal Oscillator Input — This input can be

connected to an 8MHz external crystal. Tie this pin low if XTAL is

driven by an external clock source.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

19

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

XTAL

73

Input/

Chip-driven Crystal Oscillator Output — This output connects the internal

Output

crystal oscillator output to an external crystal.

If an external clock is used, XTAL must be used as the input and

EXTAL connected to GND.

The input clock can be selected to provide the clock directly to the

core. This input clock can also be selected as the input clock for

the on-chip PLL.

CLKO

6

Output

In reset,

output is

disabled

Clock Output — This pin outputs a buffered clock signal. Using

the SIM CLKO Select Register (SIM_CLKOSR), this pin can be

programmed as any of the following: disabled, CLK_MSTR

(system clock), IPBus clock, oscillator output, prescaler clock and

postscaler clock. Other signals are also available for test

purposes.

See Part 6.5.7 for details.

A8

15

Output

In reset,

output is

disabled,

pull-up is

enabled

Address Bus — A8 - A13 specify six of the address lines for

external program or data memory accesses. Depending upon the

state of the DRV bit in the EMI bus control register (BCR), A8 -

A13 and EMI control signals are tri-stated when the external bus

is inactive.

(GPIOA0)

Schmitt

Input/

Port A GPIO — These six GPIO pins can be individually

programmed as input or output pins.

A9

(GPIOA1)

16

17

18

19

20

Output

After reset, these pins default to address bus functionality and

must be programmed as GPIO.

A10

(GPIOA2)

To deactivate the internal pull-up resistor, clear the appropriate

GPIO bit in the GPIOA_PUR register.

A11

(GPIOA3)

Example: GPIOA0, clear bit 0 in the GPIOA_PUR register.

A12

(GPIOA4)

Note: Primary function is not available in this package

configuration; GPIO function must be used instead.

A13

(GPIOA5)

56F8365 Technical Data, Rev. 9

20

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

GPIOB0

27

Schmitt

Input/

Output

Input,

pull-up

enabled

Port B GPIO — These four GPIO pins can be individually

programmed as an input or output pin.

(A16)

GPIOB1

(A17)

Output

Address Bus — A16 - A19 specify four of the address lines for

external program or data memory accesses. Depending upon the

state of the DRV bit in the EMI bus control register (BCR), A16 -

A19 and EMI control signals are tri-stated when the external bus

is inactive.

28

29

30

31

GPIOB2

(A18)

After reset, the default state is GPIO.

To deactivate the internal pull-up resistor, clear bit 0 in the

GPIOB_PUR register.

GPIOB3

(A19)

Example: GPIOB1, clear bit 1 in the GPIOB_PUR register.

GPIOB4

Schmitt

Input/

Output

Input,

pull-up

enabled

Port B GPIO — This GPIO pin can be individually programmed

as an input or output pin.

(A20)

Output

Address Bus — A20 specifies one of the address lines for

external program or data memory accesses. Depending upon the

state of the DRV bit in the EMI bus control register (BCR), A20

and EMI control signals are tri-stated when the external bus is

inactive.

(prescaler_

clock)

Output

Clock Output — can be used to monitor the prescaler_clock on

GPIOB4.

After reset, the default state is GPIO.

This pin can also be used to view the prescaler_clock. In these

cases, the GPIOB_PER can be used to disable the GPIO. The

CLKOSR register in the SIM can then be used to choose between

address and clock functions; see

Part 6.5.7 for details

To deactivate the internal pull-up resistor, clear bit 4 in the

GPIOB_PUR register.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

21

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

D7

22

Input/

Output

In reset,

output is

disabled,

pull-up is

enabled

Data Bus — D7 - D10 specify part of the data for external

program or data memory accesses. Depending upon the state of

the DRV bit in the SEMI bus control register (BCR), D7 - D10 are

tri-stated when the external bus is inactive

(GPIOF0)

Input/

Port F GPIO — These four GPIO pins can be individually

Output

programmed as input or output pins.

D8

(GPIOF1)

23

24

26

After reset, these pins default to Data Bus functionality and should

be programmed as GPIO.

D9

(GPIOF2)

To deactivate the internal pull-up resistor, clear the appropriate

GPIO bit in the GPIOF_PUR register.

D10

(GPIOF3)

Example: GPIOF0, clear bit 0 in the GPIOF_PUR register.

Note: Primary function is not available in this package

configuration; GPIO function must be used instead.

GPIOD0

(CS2)

42

Input/

Output

Input,

pull-up

enabled

Port D GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

Chip Select — CS2 may be programmed within the EMI module

to act as a chip select for specific areas of the external memory

map. Depending upon the state of the DRV bit in the EMI Bus

Control Register (BCR),CS2 is tri-stated when the external bus is

inactive.

(CAN2_TX)

Open

Drain

FlexCAN2 Transmit Data — CAN output.

Output

At reset, this pin is configured as GPIO. This configuration can be

changed by setting bit 0 in the GPIO_D_PER register, then

change bit 4 in the SIM_GPS register to select the desired

peripheral function.

To deactivate the internal pull-up resistor, clear bit 0 in the

GPIOD_PUR register.

56F8365 Technical Data, Rev. 9

22

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

GPIOD1

(CS3)

43

Schmitt

Input/

Output

Input,

pull-up

enabled

Port D GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

Chip Select — CS3 may be programmed within the EMI module

to act as a chip select for specific areas of the external memory

map.

Depending upon the state of the DRV bit in the EMI Bus Control

Register (BCR), CS3 is tri-stated when the external bus is

inactive.

(CAN2_RX)

Schmitt

Input

FlexCAN2 Receive Data — This is the CAN input. This pin has

an internal pull-up resistor.

At reset, this pin is configured as GPIO. This configuration can be

changed by setting bit 1 in the GPIO_D_PER register, then

change bit 5 in the SIM_GPS register to select the desired

peripheral function.

To deactivate the internal pull-up resistor, clear bit 1 in the

GPIOD_PUR register.

GPIOD2

(CS4)

44

Input/

Output

Input,

pull-up

enabled

Port D GPIO — These four GPIO pins can be individually

programmed as input or output pins.

Output

Chip Select — CS4 - CS7 may be programmed within the EMI

module to act as chip selects for specific areas of the external

memory map.

GPIOD3

(CS5)

45

46

47

Depending upon the state of the DRV bit in the EMI bus control

register (BCR), CS4 - CS7 are tri-stated when the external bus is

inactive

GPIOD4

(CS6)

GPIOD5

(CS7)

After reset, these pins are configured as GPIO.

To deactivate the internal pull-up resistor, clear the appropriate

GPIO bit in the GPIOD_PUR register.

Example: GPIOD2, clear bit 2 in the GPIOD_PUR register.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

23

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

TXD0

7

Output

In reset,

output is

disabled,

pull-up is

enabled

Transmit Data — SCI0 transmit data output

(GPIOE0)

Input/

Output

Port E GPIO — This GPIO pin can be individually programmed as

an input or output pin.

After reset, the default state is SCI output.

To deactivate the internal pull-up resistor, clear bit 0 in the

GPIOE_PUR register.

RXD0

8

Input

Input,

pull-up

enabled

Receive Data — SCI0 receive data input

(GPIOE1)

Input/

Port E GPIO — This GPIO pin can be individually programmed as

Output

an input or output pin.

After reset, the default state is SCI output.

To deactivate the internal pull-up resistor, clear bit 1 in the

GPIOE_PUR register.

TXD1

40

Output

In reset,

output is

disabled,

pull-up is

enabled

Transmit Data — SCI1 transmit data output

(GPIOD6)

Input/

Output

Port D GPIO — This GPIO pin can be individually programmed

as an input or output pin.

After reset, the default state is SCI output.

To deactivate the internal pull-up resistor, clear bit 6 in the

GPIOD_PUR register.

RXD1

41

Input

Input,

pull-up

enabled

Receive Data — SCI1 receive data input

(GPIOD7)

Input/

Port D GPIO — This GPIO pin can be individually programmed

Output

as an input or output pin.

After reset, the default state is SCI input.

To deactivate the internal pull-up resistor, clear bit 7 in the

GPIOD_PUR register.

TCK

115

Schmitt

Input

Input,

pulled low

internally

Test Clock Input — This input pin provides a gated clock to

synchronize the test logic and shift serial data to the

JTAG/EOnCE port. The pin is connected internally to a pull-down

resistor.

56F8365 Technical Data, Rev. 9

24

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

TMS

116

Schmitt

Input

Input,

pulled high

internally

Test Mode Select Input — This input pin is used to sequence the

JTAG TAP controller’s state machine. It is sampled on the rising

edge of TCK and has an on-chip pull-up resistor.

To deactivate the internal pull-up resistor, set the JTAG bit in the

SIM_PUDR register.

Note: Always tie the TMS pin to V_DDthrough a 2.2K resistor.

TDI

117

Schmitt

Input

Input,

pulled high

internally

Test Data Input — This input pin provides a serial input data

stream to the JTAG/EOnCE port. It is sampled on the rising edge

of TCK and has an on-chip pull-up resistor.

To deactivate the internal pull-up resistor, set the JTAG bit in the

SIM_PUDR register.

TDO

118

114

Output

In reset,

output is

disabled,

pull-up is

enabled

Test Data Output — This tri-stateable output pin provides a serial

output data stream from the JTAG/EOnCE port. It is driven in the

shift-IR and shift-DR controller states, and changes on the falling

edge of TCK.

TRST

Schmitt

Input

Input,

pulled high

internally

Test Reset — As an input, a low signal on this pin provides a

reset signal to the JTAG TAP controller. To ensure complete

hardware reset, TRST should be asserted whenever RESET is

asserted. The only exception occurs in a debugging environment

when a hardware device reset is required and the JTAG/EOnCE

module must not be reset. In this case, assert RESET, but do not

assert TRST.

To deactivate the internal pull-up resistor, set the JTAG bit in the

SIM_PUDR register.

Note: For normal operation, connect TRST directly to V_SS. If the

design is to be used in a debugging environment, TRST may be tied to

V_SSthrough a 1K resistor.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

25

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

Phase A — Quadrature Decoder 0, PHASEA input

TA0 — Timer A, Channel 0

PHASEA0

(TA0)

127

Schmitt

Input

Input,

pull-up

enabled

Schmitt

Input/

Output

(GPIOC4)

Schmitt

Input/

Port C GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

After reset, the default state is PHASEA0.

To deactivate the internal pull-up resistor, clear bit 4 of the

GPIOC_PUR register.

PHASEB0

(TA1)

128

Schmitt

Input

Input,

pull-up

enabled

Phase B — Quadrature Decoder 0, PHASEB input

Schmitt

Input/

TA1 — Timer A, Channel 1

Output

(GPIOC5)

Schmitt

Input/

Port C GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

After reset, the default state is PHASEB0.

To deactivate the internal pull-up resistor, clear bit 5 of the

GPIOC_PUR register.

INDEX0

(TA2)

1

Schmitt

Input

Input,

pull-up

enabled

Index — Quadrature Decoder 0, INDEX input

Schmitt

Input/

TA2 — Timer A, Channel 2

Output

(GPIOC6)

Schmitt

Input/

Port C GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

After reset, the default state is INDEX0.

To deactivate the internal pull-up resistor, clear bit 6 of the

GPIOC_PUR register.

56F8365 Technical Data, Rev. 9

26

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

Home — Quadrature Decoder 0, HOME input

TA3 — Timer A, Channel 3

HOME0

(TA3)

2

Schmitt

Input

Input,

pull-up

enabled

Schmitt

Input/

Output

(GPIOC7)

Schmitt

Input/

Port C GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

After reset, the default state is HOME0.

To deactivate the internal pull-up resistor, clear bit 7 of the

GPIOC_PUR register.

SCLK0

124

Schmitt

Input/

Output

Input,

pull-up

enabled

SPI 0 Serial Clock — In the master mode, this pin serves as an

output, clocking slaved listeners. In slave mode, this pin serves as

the data clock input.

(GPIOE4)

Schmitt

Input/

Port E GPIO — This GPIO pin can be individually programmed as

an input or output pin.

Output

After reset, the default state is SCLK0.

To deactivate the internal pull-up resistor, clear bit 4 in the

GPIOE_PUR register.

MOSI0

126

Input/

Output

In reset,

output is

disabled,

pull-up is

enabled

SPI 0 Master Out/Slave In — This serial data pin is an output

from a master device and an input to a slave device. The master

device places data on the MOSI line a half-cycle before the clock

edge the slave device uses to latch the data.

(GPIOE5)

Input/

Port E GPIO — This GPIO pin can be individually programmed as

Output

an input or output pin.

After reset, the default state is MOSI0.

To deactivate the internal pull-up resistor, clear bit 5 in the

GPIOE_PUR register.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

27

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

MISO0

125

Input/

Output

Input,

pull-up

enabled

SPI 0 Master In/Slave Out — This serial data pin is an input to a

master device and an output from a slave device. The MISO line

of a slave device is placed in the high-impedance state if the slave

device is not selected. The slave device places data on the MISO

line a half-cycle before the clock edge the master device uses to

latch the data.

(GPIOE6)

Input/

Port E GPIO — This GPIO pin can be individually programmed as

Output

an input or output pin.

After reset, the default state is MISO0.

To deactivate the internal pull-up resistor, clear bit 6 in the

GPIOE_PUR register.

SS0

123

Input

Input,

pull-up

enabled

SPI 0 Slave Select — SS0 is used in slave mode to indicate to

the SPI module that the current transfer is to be received.

(GPIOE7)

Input/

Port E GPIO — This GPIO pin can be individually programmed as

Output

an input or output pin.

After reset, the default state is SS0.

To deactivate the internal pull-up resistor, clear bit 7 in the

GPIOE_PUR register.

PHASEA1

9

Schmitt

Input

Input,

pull-up

enabled

Phase A1 — Quadrature Decoder 1, PHASEA input for decoder

1.

(TB0)

Schmitt

Input/

TB0 — Timer B, Channel 0

Output

(SCLK1)

Schmitt

Input/

Output

SPI 1 Serial Clock — In the master mode, this pin serves as an

output, clocking slaved listeners. In slave mode, this pin serves as

the data clock input. To activate the SPI function, set the

PHSA_ALT bit in the SIM_GPS register. For details, see Part

6.5.8.

(GPIOC0)

Schmitt

Input/

Port C GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

In the 56F8365, the default state after reset is PHASEA1.

In the 56F8165, the default state is not one of the functions

offered and must be reconfigured.

To deactivate the internal pull-up resistor, clear bit 0 in the

GPIOC_PUR register.

56F8365 Technical Data, Rev. 9

28

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

PHASEB1

10

Schmitt

Input

Input,

pull-up

enabled

Phase B1 — Quadrature Decoder 1, PHASEB input for decoder

1.

(TB1)

Schmitt

Input/

TB1 — Timer B, Channel 1

Output

(MOSI1)

Schmitt

Input/

Output

SPI 1 Master Out/Slave In — This serial data pin is an output

from a master device and an input to a slave device. The master

device places data on the MOSI line a half-cycle before the clock

edge the slave device uses to latch the data. To activate the SPI

function, set the PHSB_ALT bit in the SIM_GPS register. For

details, see Part 6.5.8.

(GPIOC1)

Schmitt

Input/

Port C GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

In the 56F8365, the default state after reset is PHASEB1.

In the 56F8165, the default state is not one of the functions

offered and must be reconfigured.

To deactivate the internal pull-up resistor, clear bit 1 in the

GPIOC_PUR register.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

29

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

Index1 — Quadrature Decoder 1, INDEX input

TB2 — Timer B, Channel 2

INDEX1

11

Schmitt

Input

Input,

pull-up

enabled

(TB2)

Schmitt

Input/

Output

(MISO1)

Schmitt

Input/

Output

SPI 1 Master In/Slave Out — This serial data pin is an input to a

master device and output from a slave device. The MISO line of a

slave device is placed in the high-impedance state if the slave

device is not selected. The slave device places data on the MISO

line a half-cycle before the clock edge the master device uses to

latch the data. To activate the SPI function, set the INDEX_ALT

bit in the SIM_GPS register. See Part 6.5.8 for details.

(GPIOC2)

Schmitt

Input/

Port C GPIO — This GPIO pin can be individually programmed

as an input or output pin.

Output

In the 56F8365, the default state after reset is INDEX1.

In the 56F8165, the default state is not one of the functions

offered and must be reconfigured.

To deactivate the internal pull-up resistor, clear bit 2 in the

GPIOC_PUR register.

HOME1

12

Schmitt

Input

Input,

pull-up

enabled

Home — Quadrature Decoder 1, HOME input

(TB3)

Schmitt

Input/

TB3 — Timer B, Channel 3

Output

(SS1)

Schmitt

Input

SPI 1 Slave Select — In the master mode, this pin is used to

arbitrate multiple masters. In slave mode, this pin is used to select

the slave. To activate the SPI function, set the HOME_ALT bit in

the SIM_GPS register. See Part 6.5.8 for details.

(GPIOC3)

Schmitt

Input/

Port C GPIO — This GPIO pin can be individually programmed

as input or output pin.

Output

In the 56F8365, the default state after reset is HOME1.

In the 56F8165, the default state is not one of the functions

offered and must be reconfigured.

To deactivate the internal pull-up resistor, clear bit 3 in the

GPIOC_PUR register.

56F8365 Technical Data, Rev. 9

30

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

PWMA0

PWMA1

PWMA2

PWMA3

PWMA4

PWMA5

ISA0

58

60

Output

In reset,

output is

disabled

PWMA0 - 5 — These are six PWMA output pins.

61

63

64

66

104

Schmitt

Input

Input,

pull-up

enabled

ISA0 - 2 — These three input current status pins are used for

top/bottom pulse width correction in complementary channel

operation for PWMA.

(GPIOC8)

Schmitt

Input/

Port C GPIO — These GPIO pins can be individually

programmed as input or output pins.

ISA1

(GPIOC9)

105

106

Output

In the 56F8365, these pins default to ISA functionality.

ISA2

In the 56F8165, the default state is not one of the functions

offered and must be reconfigured.

(GPIOC10)

To deactivate the internal pull-up resistor, clear the appropriate bit

of the GPIOC_PUR register. See Part 6.5.6 for details.

FAULTA0

FAULTA1

FAULTA2

67

68

69

Schmitt

Input

Input,

pull-up

enabled

FAULTA0 - 2 — These three fault input pins are used for

disabling selected PWMA outputs in cases where fault conditions

originate off-chip.

To deactivate the internal pull-up resistor, set the PWMA0 bit in

the SIM_PUDR register. See Part 6.5.6 for details.

FAULTA3

70

Schmitt

Input

Input,

pull-up

enabled

FAULTA3 — This fault input pin is used for disabling selected

PWMA outputs in cases where fault conditions originate off-chip.

To deactivate the internal pull-up resistor, set the PWMA1 bit in

the SIM_PUDR register. See Part 6.5.6 for details.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

31

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

PWMB0

PWMB1

PWMB2

PWMB3

PWMB4

PWMB5

ISB0

32

33

34

37

38

39

48

Output

In reset,

output is

disabled

PWMB0 - 5 — Six PWMB output pins.

Schmitt

Input

Input,

pull-up

enabled

ISB0 - 2 — These three input current status pins are used for

top/bottom pulse width correction in complementary channel

operation for PWMB.

(GPIOD10)

Schmitt

Input/

Port D GPIO — These GPIO pins can be individually

programmed as input or output pins.

ISB1

(GPIOD11)

50

51

Output

At reset, these pins default to ISA functionality.

ISB2

Deactivate pull-up by setting the approproate bit of the

GPIOD_PUR register. See Part 6.5.6 for details.

(GPIOD12)

FAULTB0

FAULTB1

FAULTB2

FAULTB3

ANA0

54

55

56

57

80

81

82

83

84

85

86

87

93

Schmitt

Input

Input,

pull-up

enabled

FAULTB0 - 3 — These four fault input pins are used for disabling

selected PWMB outputs in cases where fault conditions originate

off-chip.

To deactivate the internal pull-up resistor, set the PWMB bit in the

SIM_PUDR register. See Part 6.5.6 for details.

Input

Analog

Input

ANA0 - 3 — Analog inputs to ADC A, channel 0

ANA1

ANA2

ANA3

ANA4

Analog

Input

ANA4 - 7 — Analog inputs to ADC A, channel 1

ANA5

ANA6

ANA7

V_REFH

Analog

Input

V_REFH— Analog Reference Voltage High. V_REFHmust be less

than or equal to V_{DDA_ADC.}

56F8365 Technical Data, Rev. 9

32

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

V_REFP

V_REFMID

V_REFN

92

91

90

89

Input/

Output

Analog

Input/

Output

V

_REFP, V_REFMID& V_REFN— Internal pins for voltage reference

which are brought off-chip so that they can be bypassed. Connect

to a 0.1 F low ESR capacitor.

V_REFLO

Input

Analog

Input

V_REFLO— Analog Reference Voltage Low. This should normally

be connected to a low-noise V_SSA

.

ANB0

ANB1

ANB2

ANB3

ANB4

ANB5

ANB6

ANB7

96

97

Analog

Input

ANB0 - 3 — Analog inputs to ADC B, channel 0

98

99

100

101

102

103

88

Input

Analog

Input

ANB4 - 7 — Analog inputs to ADC B, channel 1

TEMP_

SENSE

Output

Analog

Output

Temp Sense Diode — This signal connects to an on-chip diode

that can be connected to one of the ADC inputs and is used to

monitor the temperature of the die. Must be bypassed with a

0.01 F capacitor.

CAN_RX

CAN_TX

121

120

Schmitt

Input

Input,

pull-up

enabled

FlexCAN Receive Data — This is the CAN input. This pin has an

internal pull-up resistor.

To deactivate the internal pull-up resistor, set the CAN bit in the

SIM_PUDR register.

Open

Drain

Open

Drain

FlexCAN Transmit Data — CAN output with internal pull-up

enable at reset.*

Output

* Note: If a pin is configured as open drain output mode, internal

pull-up will automatically be disabled when it outputs low. Internal

pull-up will be enabled unless it has been manually disabled by

clearing the corresponding bit in the PUREN register of the GPIO

module, when it outputs high.

If a pin is configured as push-pull output mode, internal pull-up will

automatically be disabled, whether it outputs low or high.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

33

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

TC0

111

Schmitt

Input/

Output

Input,

pull-up

enabled

TC0 - 1 — Timer C, Channels 0 and 1

(GPIOE8)

Schmitt

Input/

Port E GPIO — These GPIO pins can be individually

programmed as input or output pins.

TC1

(GPIOE9)

113

107

Output

At reset, these pins default to Timer functionality.

To deactivate the internal pull-up resistor, clear the appropriate bit

of the GPIOE_PUR register. See Part 6.5.6 for details.

TD0

Schmitt

Input/

Input,

pull-up

enabled

TD0 - TD3 — Timer D, Channels 0, 1, 2 and 3

Output

(GPIOE10)

Schmitt

Input/

Port E GPIO — These GPIO pins can be individually

programmed as input or output pins.

TD1

(GPIOE11)

108

109

110

Output

At reset, these pins default to Timer functionality.

TD2

(GPIOE12)

To deactivate the internal pull-up resistor, clear the appropriate bit

of the GPIOE_PUR register. See Part 6.5.6 for details.

TD3

(GPIOE13)

IRQA

IRQB

52

53

Schmitt

Input

Input,

pull-up

enabled

External Interrupt Request A and B — The IRQA and IRQB

inputs are asynchronous external interrupt requests during Stop

and Wait mode operation. During other operating modes, they are

synchronized external interrupt requests, which indicate an

external device is requesting service. They can be programmed to

be level-sensitive or negative-edge triggered.

To deactivate the internal pull-up resistor, set the IRQ bit in the

SIM_PUDR register. See Part 6.5.6 for details.

56F8365 Technical Data, Rev. 9

34

Freescale Semiconductor

Signal Pins

Table 2-2 Signal and Package Information for the 128-Pin LQFP (Continued)

State

During

Reset

Signal

Name

Pin No.

Type

Signal Description

RESET

78

Schmitt

Input

Input,

pull-up

enabled

Reset — This input is a direct hardware reset on the processor.

When RESET is asserted low, the device is initialized and placed

in the reset state. A Schmitt trigger input is used for noise

immunity. The internal reset signal will be deasserted

synchronous with the internal clocks after a fixed number of

internal clocks.

To ensure complete hardware reset, RESET and TRST should be

asserted together. The only exception occurs in a debugging

environment when a hardware device reset is required and the

JTAG/EOnCE module must not be reset. In this case, assert

RESET, but do not assert TRST.

Note: The internal Power-On Reset will assert on initial power-up.

To deactivate the internal pull-up resistor, set the RESET bit in the

SIM_PUDR register. See Part 6.5.6. for details.

RSTO

77

Output

Reset Output — This output reflects the internal reset state of the

chip.

EXTBOOT

Internal

Ground

Schmitt

Input

Input,

pull-up

enabled

External Boot —This input is tied to V_DDto force the device to

boot from off-chip memory (assuming that the on-chip Flash

memory is not in a secure state). Otherwise, it is tied to ground.

For details, see Table 4-4.

Note: When this pin is tied low, the customer boot software

should disable the internal pull-up resistor by setting the XBOOT

bit of the SIM_PUDR; see Part 6.5.6.

Note: This pin is internally tied low (to V_SS).

EMI_MODE

Internal

Ground

Schmitt

Input

Input,

pull-up

enabled

External Memory Mode — This device will boot from internal

Flash memory under normal operation.

This function is also affected by EXTBOOT and the Flash security

mode; see Table 4-4 for details.

Note: When this pin is tied low, the customer boot software

should disable the internal pull-up resistor by setting the

EMI_MODE bit of the SIM_PUDR; see Part 6.5.6.

Note: This pin is internally tied low (to V_SS).

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

35

Part 3 On-Chip Clock Synthesis (OCCS)

3.1 Introduction

Refer to the OCCS chapter of the 56F8300 Peripheral User Manual for a full description of the OCCS.

The material contained here identifies the specific features of the OCCS design. Figure 3-1 shows the

specific OCCS block diagram to reference in the OCCS chapter of the 56F8300 Peripheral User Manual.

CLKMODE

XTAL

ZSRC

Crystal

OSC

Prescaler CLK

PLLCOD

SYS_CLK2

Source to SIM

EXTAL

PLLCID

PLLDB

PLL

F_OUT

F_OUT/2

Postscaler

Prescaler

 (1,2,4,8)

Postscaler CLK

2

x (1 to 128)

 (1,2,4,8)

Bus

Interface

Bus Interface & Control

LCK

Lock

Detector

Loss of Reference

Clock Interrupt

Loss of

Reference

Clock

Detector

Figure 3-1 OCCS Block Diagram

3.2 External Clock Operation

The system clock can be derived from an external crystal, ceramic resonator, or an external system clock

signal. To generate a reference frequency using the internal oscillator, a reference crystal or ceramic

resonator must be connected between the EXTAL and XTAL pins.

3.2.1

Crystal Oscillator

The internal oscillator is designed to interface with a parallel-resonant crystal resonator in the frequency

range specified for the external crystal in Table 10-15. A recommended crystal oscillator circuit is shown

in Figure 3-2. Follow the crystal supplier’s recommendations when selecting a crystal, since crystal

parameters determine the component values required to provide maximum stability and reliable start-up.

56F8365 Technical Data, Rev. 9

36

Freescale Semiconductor

External Clock Operation

The crystal and associated components should be mounted as near as possible to the EXTAL and XTAL

pins to minimize output distortion and start-up stabilization time.

Crystal Frequency = 4 - 8MHz (optimized for 8MHz)

EXTAL XTAL

R_z

EXTAL XTAL

R_z

Sample External Crystal Parameters:

R_z= 750 K

Note: If the operating temperature range is limited to

CLKMODE = 0

below 85^oC (105^oC junction), then R_z= 10 Meg 

CL1

CL2

Figure 3-2 Connecting to a Crystal Oscillator

Note:

The OCCS_COHL bit must be set to 1 when a crystal oscillator is used. The reset condition on the

OCCS_COHL bit is 0. Please see the COHL bit in the Oscillator Control (OSCTL) register, discussed

in the 56F8300 Peripheral User Manual.

3.2.2

Ceramic Resonator (Default)

It is also possible to drive the internal oscillator with a ceramic resonator, assuming the overall system

design can tolerate the reduced signal integrity. A typical ceramic resonator circuit is shown in Figure 3-3.

Refer to the supplier’s recommendations when selecting a ceramic resonator and associated components.

The resonator and components should be mounted as near as possible to the EXTAL and XTAL pins.

Resonator Frequency = 4 - 8MHz (optimized for 8MHz)

3 Terminal

2 Terminal

EXTAL XTAL

R_z

Sample External Ceramic Resonator Parameters:

R_z= 750 K

EXTAL XTAL

R_z

CLKMODE = 0

CL1

CL2

C1

C2

Figure 3-3 Connecting a Ceramic Resonator

Note:

The OCCS_COHL bit must be set to 0 when a ceramic resonator is used. The reset condition on the

OCCS_COHL bit is 0. Please see the COHL bit in the Oscillator Control (OSCTL) register, discussed

in the 56F8300 Peripheral User Manual.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

37

3.2.3

External Clock Source

The recommended method of connecting an external clock is illustrated in Figure 3-4. The external clock

source is connected to XTAL and the EXTAL pin is grounded. Set OCCS_COHL bit high when using an

external clock source as well.

Note: When using an external clocking source

XTAL

EXTAL

with this configuration, the input “CLKMODE”

should be high and the COHL bit in the OSCTL

register should be set to 1.

V

External

Clock

SS

Figure 3-4 Connecting an External Clock Signal Register

3.3 Registers

When referring to the register definitions for the OCCS in the 56F8300 Peripheral User Manual, use the

register definitions without the internal Relaxation Oscillator, since the 56F8365/56F8165 devices do

NOT contain this oscillator.

Part 4 Memory Map

4.1 Introduction

The 56F8365 and 56F8165 devices are 16-bit motor-control chips based on the 56800E core. These parts

use a Harvard-style architecture with two independent memory spaces for Data and Program. On-chip

RAM and Flash memories are used in both spaces.

This section provides memory maps for:

•

Program Address Space, including the Interrupt Vector Table

Data Address Space, including the EOnCE Memory and Peripheral Memory Maps

On-chip memory sizes for each device are summarized in Table 4-1. Flash memories’ restrictions are

identified in the “Use Restrictions” column of Table 4-1.

Note: Data Flash and Program RAM are NOT available on the 56F8165 device.

Table 4-1 Chip Memory Configurations

On-Chip Memory

56F8365

56F8165

Use Restrictions

Program Flash

512KB

Erase/Program via Flash interface unit and word writes to

CDBW

56F8365 Technical Data, Rev. 9

38

Freescale Semiconductor

Program Map

Table 4-1 Chip Memory Configurations

On-Chip Memory

56F8365

56F8165

Use Restrictions

Data Flash

32KB

—

Erase/Program via Flash interface unit and word writes to

CDBW. Data Flash can be read via either CDBR or XDB2, but

not by both simultaneously

Program RAM

Data RAM

4KB

32KB

—

None

32KB

Program Boot Flash

Erase/Program via Flash Interface unit and word writes to

CDBW

4.2 Program Map

The Program memory map is located in Table 4-4. The operating mode control bits (MA and MB) in the

Operating Mode Register (OMR) control the Program memory map. At reset, these bits are set as indicated

in Table 4-2.

EXT_BOOT = EMI_MODE = 0 and cannot be changed in the 56F8365 or 56F8165.

Note: Program RAM is NOT available on the 56F8165 device.

1

Table 4-2 OMR MB/MA Value at Reset

OMR MB =

OMR MA =

Flash Secured

State^2,3

Chip Operating Mode

EXTBOOT Pin

0

Mode 0 – Internal Boot; EMI is configured to use 16 address lines; Flash

Memory is secured; external P-space is not allowed; the EOnCE is disabled

1

Not valid; cannot boot externally if the Flash is secured and will actually

configure to 00 state

1

0

1

Mode 0 – Internal Boot; EMI is configured to use 16 address lines

Mode 1 – External Boot; Flash Memory is not secured; EMI configuration is

determined by the state of the EMI_MODE pin

1. Information in shaded areas not applicable to 56F8365/56F8165.

2. This bit is only configured at reset. If the Flash secured state changes, this will not be reflected in MB until the next reset.

3. Changing MB in software will not affect Flash memory security.

After reset, the OMR MA bit can be changed and will have an effect on the P-space memory map, as shown

in Table 4-3. Changing the OMR MB bit will have no effect.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

39

Table 4-3 Changing OMR MA Value During Normal Operation

OMR MA

Chip Operating Mode

0

Use internal P-space memory map configuration

1¹

Use external P-space memory map configuration – If MB = 0 at reset, changing this bit has no effect.

1. Setting this bit can cause unpredictable results and is not recommended, since the EMI is not functional in this package.

Table 4-4 shows the memory map options of the 56F8365/56F8165. The two right columns cannot be

used, since the EMI pins are not provided in the package; therefore, only the Mode 0 column is relevant.

Note: Program RAM is NOT available on the 56F8165 device.

Table 4-4 Program Memory Map at Reset

Mode 1¹(MA = 1)

Mode 0 (MA = 0)

Begin/End

Address

Internal Boot

External Boot

EMI_MODE = 0^{2, 3}

EMI_MODE = 1⁴

Internal Boot

16-Bit External Address Bus

20-Bit External Address Bus

P:$1F FFFF

P:$10 0000

External Program Memory

External Program Memory⁵

External Program Memory⁶

P:$0F FFFF

P:$05 0000

P:$04 FFFF

P:$04 F800

On-Chip Program RAM

4KB

On-Chip Program RAM

4KB

P:$04 F7FF

P:$04 4000

Reserved

92KB

P:$04 3FFF

P:$04 0000

Boot Flash

32KB

COP Reset Address = 04 0002

Boot Location = 04 0000

Boot Flash

32KB

(Not Used for Boot in this Mode)

External Program Memory

COP Reset Address = 04 0002

Boot Location = 04 0000

Internal Program Flash⁷

256KB

P:$03 FFFF

P:$02 0000

Internal Program Flash

256KB

P:$01 FFFF

P:$01 0000

Internal Program Flash

128KB

Internal Program Flash⁷

256KB

P:$00 FFFF

P:$00 0000

External Program Memory

COP Reset Address = 00 0002

Boot Location = 00 0000

1. Cannot be used since MA = EXTBOOT = 0 and the EMI is not available; information in shaded areas not applicable to

56F8365/56F8165.

2. This mode provides maximum compatibility with 56F80x parts while operating externally.

3. “EMI_MODE = 0”, EMI_MODE pin is tied to ground at boot up.

4. “EMI_MODE = 1”, EMI_MODE pin is tied to V at boot up.

DD

56F8365 Technical Data, Rev. 9

40

Freescale Semiconductor

Interrupt Vector Table

5. Not accessible in reset configuration, since the address is above P:$00 FFFF. The higher bit address/GPIO (and/or chip selects)

pins must be reconfigured before this external memory is accessible.

6. Not accessible in this part, since the EMI is not fully pinned out in this package; information in shaded areas not applicable

to 56F8365/56F8165.

7. Two independent program flash blocks allow one to be programmed/erased while executing from another. Each block must have

its own mass erase.

4.3 Interrupt Vector Table

Table 4-5 provides the reset and interrupt priority structure, including on-chip peripherals. The table is

organized with higher-priority vectors at the top and lower-priority interrupts lower in the table. The

priority of an interrupt can be assigned to different levels, as indicated, allowing some control over

interrupt priorities. All level 3 interrupts will be serviced before level 2, and so on. For a selected priority

level, the lowest vector number has the highest priority.

The location of the vector table is determined by the Vector Base Address (VBA) register. Please see Part

5.6.11 for the reset value of the VBA.

In some configurations, the reset address and COP reset address will correspond to vector 0 and 1 of the

interrupt vector table. In these instances, the first two locations in the vector table must contain branch or

JMP instructions. All other entries must contain JSR instructions.

Note: PWMA, FlexCAN, Quadrature Decoder 1, and Quad Timers B and D are NOT available on the

56F8165 device.

1

Table 4-5 Interrupt Vector Table Contents

Vector

Number

Priority

Level

Vector Base

Address +

Peripheral

Interrupt Function

Reserved for Reset Overlay²

Reserved for COP Reset Overlay²

Illegal Instruction

core

2

3

4

5

6

7

3

P:$04

P:$06

P:$08

P:$0A

P:$0C

P:$0E

core

SW Interrupt 3

HW Stack Overflow

Misaligned Long Word Access

OnCE Step Counter

OnCE Breakpoint Unit 0

Reserved

1-3

core

9

1-3

P:$12

P:$14

P:$16

OnCE Trace Buffer

10

11

OnCE Transmit Register Empty

OnCE Receive Register Full

Reserved

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

41

1

Table 4-5 Interrupt Vector Table Contents (Continued)

Vector

Number

Priority

Level

Vector Base

Address +

Peripheral

core

Interrupt Function

14

2

1

0

P:$1C

P:$1E

P:$20

P:$22

P:$24

SW Interrupt 2

SW Interrupt 1

SW Interrupt 0

IRQA

core

15

16

17

18

0-2

IRQB

Reserved

LVI

PLL

FM

20

21

22

23

24

0-2

P:$28

P:$2A

P:$2C

P:$2E

P:$30

Low-Voltage Detector (power sense)

PLL

FM Access Error Interrupt

FM Command Complete

FM Command, data and address Buffers Empty

Reserved

FLEXCAN

GPIOF

26

27

28

29

30

31

32

33

34

35

0-2

P:$34

P:$36

P:$38

P:$3A

P:$3C

P:$3E

P:$40

P:$42

P:$44

P:$46

FLEXCAN Bus Off

FLEXCAN Error

FLEXCAN Wake Up

FLEXCAN Message Buffer Interrupt

GPIO F

GPIOE

GPIO E

GPIOD

GPIO D

GPIOC

GPIO C

GPIOB

GPIO B

GPIOA

GPIO A

Reserved

SPI1

SPI0

SCI1

38

39

40

41

42

43

0-2

P:$4C

P:$4E

P:$50

P:$52

P:$54

P:$56

SPI 1 Receiver Full

SPI 1 Transmitter Empty

SPI 0 Receiver Full

SPI 0 Transmitter Empty

SCI 1 Transmitter Empty

SCI 1 Transmitter Idle

Reserved

SCI1

45

46

0-2

P:$5A

P:$5C

SCI 1 Receiver Error

SCI 1 Receiver Full

56F8365 Technical Data, Rev. 9

42

Freescale Semiconductor

Interrupt Vector Table

1

Table 4-5 Interrupt Vector Table Contents (Continued)

Vector

Number

Priority

Level

Vector Base

Address +

Peripheral

Interrupt Function

DEC1

DEC0

47

0-2

P:$5E

P:$60

P:$62

P:$64

Quadrature Decoder #1 Home Switch or Watchdog

Quadrature Decoder #1 INDEX Pulse

Quadrature Decoder #0 Home Switch or Watchdog

Quadrature Decoder #0 INDEX Pulse

Reserved

48

49

50

0-2

TMRD

TMRC

TMRB

TMRA

SCI0

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

0-2

P:$68

P:$6A

P:$6C

P:$6E

P:$70

P:$72

P:$74

P:$76

P:$78

P:$7A

P:$7C

P:$7E

P:$80

P:$82

P:$84

P:$86

P:$88

P:$8A

Timer D, Channel 0

Timer D, Channel 1

Timer D, Channel 2

Timer D, Channel 3

Timer C, Channel 0

Timer C, Channel 1

Timer C, Channel 2

Timer C, Channel 3

Timer B, Channel 0

Timer B, Channel 1

Timer B, Channel 2

Timer B, Channel 3

Timer A, Channel 0

Timer A, Channel 1

Timer A, Channel 2

Timer A, Channel 3

SCI 0 Transmitter Empty

SCI 0 Transmitter Idle

SCI0

Reserved

SCI0

71

72

73

74

75

76

77

78

0-2

P:$8E

P:$90

P:$92

P:$94

P:$96

P:$98

P:$9A

P:$9C

SCI 0 Receiver Error

SCI0

SCI 0 Receiver Full

ADCB

ADCA

ADCB

ADCA

PWMB

PWMA

ADC B Conversion Compete / End of Scan

ADC A Conversion Complete / End of Scan

ADC B Zero Crossing or Limit Error

ADC A Zero Crossing or Limit Error

Reload PWM B

Reload PWM A

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

43

1

Table 4-5 Interrupt Vector Table Contents (Continued)

Vector

Number

Priority

Level

Vector Base

Address +

Peripheral

Interrupt Function

PWMB

79

0-2

P:$9E

P:$A0

P:$A2

P:$A4

P:$A6

P:$A8

P:$AA

PWM B Fault

PWMA

80

81

82

83

84

85

0-2

- 1

PWM A Fault

core

SW Interrupt LP

FlexCAN Bus-Off

FlexCAN Error

FlexCAN Wake Up

FLEXCAN2

0-2

FlexCAN Message Buffer Interrupt

1. Two words are allocated for each entry in the vector table. This does not allow the full address range to be referenced

from the vector table, providing only 19 bits of address.

2. If the VBA is set to $0400 (or VBA = 0000 for Mode 1, EMI_MODE = 0), the first two locations of the vector table are

the chip reset addresses; therefore, these locations are not interrupt vectors.

4.4 Data Map

Note: Data Flash is NOT available on the 56F8165 device.

1, 2

Table 4-6 Data Memory Map

Begin/End

Address

EX = 0³

EX = 1⁴

X:$FF FFFF

X:$FF FF00

EOnCE

256 locations allocated

EOnCE

256 locations allocated

X:$FF FEFF

X:$01 0000

External Memory

X:$00 FFFF

X:$00 F000

On-Chip Peripherals

4096 locations allocated

On-Chip Peripherals

4096 locations allocated

X:$00 EFFF

X:$00 8000

External Memory

X:$00 7FFF

X:$00 4000

On-Chip Data Flash

32KB

External Memory

X:$003FFF

X:$00 0000

On-Chip Data RAM

32KB⁵

1. Information in shaded areas not applicable to 56F8365/56F8165.

2. All addresses are 16-bit Word addresses, not byte addresses.

3. In the Operating Mode Register

4. Setting EX = 1 is not recommended in the 56F8365/56F8165, since the EMI is not functional in this package.

5. The Data RAM is organized as an 8K x 32-bit memory to allow single-cycle, long-word operations.

56F8365 Technical Data, Rev. 9

44

Freescale Semiconductor

Flash Memory Map

4.5 Flash Memory Map

Figure 4-1 illustrates the Flash Memory (FM) map on the system bus.

The Flash Memory is divided into three functional blocks. The Program and boot memories reside on the

Program Memory buses. They are controlled by one set of banked registers. Data Memory Flash resides

on the Data Memory buses and is controlled separately by its own set of banked registers.

The top nine words of the Program Memory Flash are treated as special memory locations. The content of

these words is used to control the operation of the Flash Controller. Because these words are part of the

Flash Memory content, their state is maintained during power-down and reset. During chip initialization,

the content of these memory locations is loaded into Flash Memory control registers, detailed in the Flash

Memory chapter of the 56F8300 Peripheral User Manual. In the 56F8365, these configuration

parameters are located between $03_FFF7 and $03_FFFF.

Program Memory

Data Memory

FM_BASE + $14

FM_BASE + $00

BOOT_FLASH_START + $3FFF

Banked Registers

32KB

Boot

Unbanked Registers

BOOT_FLASH_START = $04_0000

PROG_FLASH_START + $03_FFFF

FM_PROG_MEM_TOP = $01_FFFF

Configure Field

DATA_FLASH_START + $3FFF

DATA_FLASH_START + $0000

256KB

Program

32KB

Note: Data Flash

is NOT available in

the 56F8165

device.

BLOCK 1 Odd (2 Bytes) $02_0003

BLOCK 1 Even (2 Bytes) $02_0002

BLOCK 1 Odd (2 Bytes) $02_0001

BLOCK 1 Even (2 Bytes) $02_0000

PROG_FLASH_START + $02_0000

PROG_FLASH_START + $01_FFFF

256KB

Program

BLOCK 0 Odd (2 Bytes) $00_0003

BLOCK 0 Even (2 Bytes) $00_0002

BLOCK 0 Odd (2 Bytes) $00_0001

BLOCK 0 Even (2 Bytes) $00_0000

PROG_FLASH_START = $00_0000

Figure 4-1 Flash Array Memory Maps

Table 4-7 shows the page and sector sizes used within each Flash memory block on the chip.

Note: Data Flash is NOT available on the 56F8165 device.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

45

Table 4-7. Flash Memory Partitions

Flash Size

Sectors

Sector Size

Page Size

Program Flash

Data Flash

512KB

32KB

16

4

16K x 16 bits

1024 x 16 bits

4K x 16 bits

1024x 16 bits

256 x 16 bits

512 x 16 bits

Boot Flash

Please see the 56F8300 Peripheral User Manual for additional Flash information.

4.6 EOnCE Memory Map

Table 4-8 EOnCE Memory Map

Address

Register Acronym

Register Name

Reserved

X:$FF FF8A

X:$FF FF8E

OESCR

External Signal Control Register

Reserved

OBCNTR

Breakpoint Unit [0] Counter

Reserved

X:$FF FF90

X:$FF FF91

X:$FF FF92

X:$FF FF93

X:$FF FF94

X:$FF FF95

X:$FF FF96

X:$FF FF97

X:$FF FF98

X:$FF FF99

X:$FF FF9A

X:$FF FF9B

X:$FF FF9C

X:$FF FF9D

X:$FF FF9E

OBMSK (32 bits)

Breakpoint 1 Unit [0] Mask Register

Breakpoint 2 Unit [0] Address Register

Breakpoint 1 Unit [0] Address Register

Breakpoint Unit [0] Control Register

Trace Buffer Register Stages

Trace Buffer Pointer Register

Trace Buffer Control Register

Peripheral Base Address Register

Status Register

—

OBAR2 (32 bits)

—

OBAR1 (24 bits)

—

OBCR (24 bits)

—

OTB (21-24 bits/stage)

—

OTBPR (8 bits)

OTBCR

OBASE (8 bits)

OSR

OSCNTR (24 bits)

Instruction Step Counter

56F8365 Technical Data, Rev. 9

46

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-8 EOnCE Memory Map (Continued)

Address

Register Acronym

Register Name

X:$FF FF9F

X:$FF FFA0

—

Instruction Step Counter

Control Register

Reserved

OCR (bits)

X:$FF FFFC

X:$FF FFFD

X:$FF FFFE

X:$FF FFFF

OCLSR (8 bits)

Core Lock / Unlock Status Register

OTXRXSR (8 bits)

OTX / ORX (32 bits)

OTX1 / ORX1

Transmit and Receive Status and Control Register

Transmit Register / Receive Register

Transmit Register Upper Word

Receive Register Upper Word

4.7 Peripheral Memory Mapped Registers

On-chip peripheral registers are part of the data memory map on the 56800E series. These locations may

be accessed with the same addressing modes used for ordinary Data memory, except all peripheral

registers should be read/written using word accesses only.

Table 4-9 summarizes base addresses for the set of peripherals on the 56F8365 and 56F8165 devices.

Peripherals are listed in order of the base address.

The following tables list all of the peripheral registers required to control or access the peripherals.

Note: Features in italics are NOT available in the 56F8165 device.

Table 4-9 Data Memory Peripheral Base Address Map Summary

Peripheral

Prefix

Base Address

Table Number

External Memory Interface

Timer A

EMI

X:$00 F020

X:$00 F040

X:$00 F080

X:$00 F0C0

X:$00 F100

X:$00 F140

X:$00 F160

X:$00 F180

X:$00 F190

X:$00 F1A0

X:$00 F200

X:$00 F240

4-10

4-11

4-12

4-13

4-14

4-15

4-16

4-17

4-18

4-19

4-20

4-21

TMRA

TMRB

TMRC

TMRD

PWMA

PWMB

DEC0

DEC1

ITCN

Timer B

Timer C

Timer D

PWM A

PWM B

Quadrature Decoder 0

Quadrature Decoder 1

ITCN

ADC A

ADCA

ADCB

ADC B

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

47

Table 4-9 Data Memory Peripheral Base Address Map Summary (Continued)

Peripheral

Prefix

TSENSOR

Base Address

Table Number

Temperature Sensor

SCI #0

X:$00 F270

X:$00 F280

X:$00 F290

X:$00 F2A0

X:$00 F2B0

X:$00 F2C0

X:$00 F2D0

X:$00 F2E0

X:$00 F300

X:$00 F310

X:$00 F320

X:$00 F330

X:$00 F340

X:$00 F350

X:$00 F360

X:$00 F400

X:$00 F800

X:$00 FA00

4-22

4-23

4-24

4-25

4-26

4-27

4-28

4-29

4-30

4-31

4-32

4-33

4-34

4-35

4-36

4-37

4-38

4-39

SCI0

SCI1

SPI0

SCI #1

SPI #0

SPI #1

SPI1

COP

PLL, OSC

GPIO Port A

GPIO Port B

GPIO Port C

GPIO Port D

GPIO Port E

GPIO Port F

SIM

CLKGEN

GPIOA

GPIOB

GPIOC

GPIOD

GPIOE

GPIOF

SIM

Power Supervisor

FM

LVI

FM

FlexCAN

FC

FlexCAN2

FC

56F8365 Technical Data, Rev. 9

48

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-10 External Memory Integration Registers Address Map

(EMI_BASE = $00 F020)

Register Acronym

Address Offset

Register Description

CSBAR 0

CSBAR 1

CSBAR 2

CSBAR 3

CSBAR 4

CSBAR 5

CSBAR 6

CSBAR 7

CSOR 0

CSOR 1

CSOR 2

CSOR 3

CSOR 4

CSOR 5

CSOR 6

CSOR 7

CSTC 0

CSTC 1

CSTC 2

CSTC 3

CSTC 4

CSTC 5

CSTC 6

CSTC 7

BCR

$0

$1

Chip Select Base Address Register 0

Chip Select Base Address Register 1

Chip Select Base Address Register 2

Chip Select Base Address Register 3

Chip Select Base Address Register 4

Chip Select Base Address Register 5

Chip Select Base Address Register 6

Chip Select Base Address Register 7

Chip Select Option Register 0

$2

$3

$4

$5

$6

$7

$8

$9

Chip Select Option Register 1

$A

Chip Select Option Register 2

$B

Chip Select Option Register 3

$C

$D

$E

Chip Select Option Register 4

Chip Select Option Register 5

Chip Select Option Register 6

$F

Chip Select Option Register 7

$10

$11

$12

$13

$14

$15

$16

$17

$18

Chip Select Timing Control Register 0

Chip Select Timing Control Register 1

Chip Select Timing Control Register 2

Chip Select Timing Control Register 3

Chip Select Timing Control Register 4

Chip Select Timing Control Register 5

Chip Select Timing Control Register 6

Chip Select Timing Control Register 7

Bus Control Register

Table 4-11 Quad Timer A Registers Address Map

(TMRA_BASE = $00 F040)

Register Acronym

Address Offset

Register Description

Compare Register 1

TMRA0_CMP1

$0

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

49

Table 4-11 Quad Timer A Registers Address Map (Continued)

(TMRA_BASE = $00 F040)

Register Acronym

Address Offset

Register Description

Compare Register 2

TMRA0_CMP2

TMRA0_CAP

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

Capture Register

TMRA0_LOAD

TMRA0_HOLD

TMRA0_CNTR

TMRA0_CTRL

TMRA0_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRA0_CMPLD1

TMRA0_CMPLD2

TMRA0_COMSCR

TMRA1_CMP1

TMRA1_CMP2

TMRA1_CAP

$10

$11

$12

$13

$14

$15

$16

$17

$18

$19

$1A

Compare Register 1

Compare Register 2

Capture Register

TMRA1_LOAD

TMRA1_HOLD

TMRA1_CNTR

TMRA1_CTRL

TMRA1_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRA1_CMPLD1

TMRA1_CMPLD2

TMRA1_COMSCR

TMRA2_CMP1

TMRA2_CMP2

TMRA2_CAP

$20

$21

$22

$23

$24

$25

$26

$27

$28

Compare Register 1

Compare Register 2

Capture Register

TMRA2_LOAD

TMRA2_HOLD

TMRA2_CNTR

TMRA2_CTRL

TMRA2_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

TMRA2_CMPLD1

56F8365 Technical Data, Rev. 9

50

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-11 Quad Timer A Registers Address Map (Continued)

(TMRA_BASE = $00 F040)

Register Acronym

Address Offset

$29

Register Description

Comparator Load Register 2

TMRA2_CMPLD2

TMRA2_COMSCR

$2A

Comparator Status and Control Register

Reserved

TMRA3_CMP1

TMRA3_CMP2

TMRA3_CAP

$30

$31

$32

$33

$34

$35

$36

$37

$38

$39

$3A

Compare Register 1

Compare Register 2

Capture Register

TMRA3_LOAD

TMRA3_HOLD

TMRA3_CNTR

TMRA3_CTRL

TMRA3_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

TMRA3_CMPLD1

TMRA3_CMPLD2

TMRA3_COMSCR

Table 4-12 Quad Timer B Registers Address Map

(TMRB_BASE = $00 F080)

Quad Timer B is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Compare Register 1

TMRB0_CMP1

TMRB0_CMP2

TMRB0_CAP

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

Compare Register 2

Capture Register

TMRB0_LOAD

TMRB0_HOLD

TMRB0_CNTR

TMRB0_CTRL

TMRB0_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRB0_CMPLD1

TMRB0_CMPLD2

TMRB0_COMSCR

TMRB1_CMP1

$10

Compare Register 1

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

51

Table 4-12 Quad Timer B Registers Address Map (Continued)

(TMRB_BASE = $00 F080)

Quad Timer B is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Compare Register 2

TMRB1_CMP2

TMRB1_CAP

$11

$12

$13

$14

$15

$16

$17

$18

$19

$1A

Capture Register

TMRB1_LOAD

TMRB1_HOLD

TMRB1_CNTR

TMRB1_CTRL

TMRB1_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRB1_CMPLD1

TMRB1_CMPLD2

TMRB1_COMSCR

TMRB2_CMP1

TMRB2_CMP2

TMRB2_CAP

$20

$21

$22

$23

$24

$25

$26

$27

$28

$29

$2A

Compare Register 1

Compare Register 2

Capture Register

TMRB2_LOAD

TMRB2_HOLD

TMRB2_CNTR

TMRB2_CTRL

TMRB2_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRB2_CMPLD1

TMRB2_CMPLD2

TMRB2_COMSCR

TMRB3_CMP1

TMRB3_CMP2

TMRB3_CAP

TMRB3_LOAD

TMRB3_HOLD

TMRB3_CNTR

TMRB3_CTRL

TMRB3_SCR

$30

$31

$32

$33

$34

$35

$36

$37

Compare Register 1

Compare Register 2

Capture Register

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

56F8365 Technical Data, Rev. 9

52

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-12 Quad Timer B Registers Address Map (Continued)

(TMRB_BASE = $00 F080)

Quad Timer B is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Comparator Load Register 1

TMRB3_CMPLD1

TMRB3_CMPLD2

TMRB3_COMSCR

$38

$39

$3A

Comparator Load Register 2

Comparator Status and Control Register

Table 4-13 Quad Timer C Registers Address Map

(TMRC_BASE = $00 F0C0)

Register Acronym

Address Offset

Register Description

Compare Register 1

TMRC0_CMP1

TMRC0_CMP2

TMRC0_CAP

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

Compare Register 2

Capture Register

TMRC0_LOAD

TMRC0_HOLD

TMRC0_CNTR

TMRC0_CTRL

TMRC0_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRC0_CMPLD1

TMRC0_CMPLD2

TMRC0_COMSCR

TMRC1_CMP1

TMRC1_CMP2

TMRC1_CAP

$10

$11

$12

$13

$14

$15

$16

$17

$18

$19

$1A

Compare Register 1

Compare Register 2

Capture Register

TMRC1_LOAD

TMRC1_HOLD

TMRC1_CNTR

TMRC1_CTRL

TMRC1_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRC1_CMPLD1

TMRC1_CMPLD2

TMRC1_COMSCR

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

53

Table 4-13 Quad Timer C Registers Address Map (Continued)

(TMRC_BASE = $00 F0C0)

Register Acronym

Address Offset

Register Description

Compare Register 1

TMRC2_CMP1

TMRC2_CMP2

TMRC2_CAP

$20

$21

$22

$23

$24

$25

$26

$27

$28

$29

$2A

Compare Register 2

Capture Register

TMRC2_LOAD

TMRC2_HOLD

TMRC2_CNTR

TMRC2_CTRL

TMRC2_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRC2_CMPLD1

TMRC2_CMPLD2

TMRC2_COMSCR

TMRC3_CMP1

TMRC3_CMP2

TMRC3_CAP

$30

$31

$32

$33

$34

$35

$36

$37

$38

$39

$3A

Compare Register 1

Compare Register 2

Capture Register

TMRC3_LOAD

TMRC3_HOLD

TMRC3_CNTR

TMRC3_CTRL

TMRC3_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

TMRC3_CMPLD1

TMRC3_CMPLD2

TMRC3_COMSCR

Table 4-14 Quad Timer D Registers Address Map

(TMRD_BASE = $00 F100)

Quad Timer D is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Compare Register 1

TMRD0_CMP1

TMRD0_CMP2

TMRD0_CAP

TMRD0_LOAD

$0

$1

$2

$3

Compare Register 2

Capture Register

Load Register

56F8365 Technical Data, Rev. 9

54

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-14 Quad Timer D Registers Address Map (Continued)

(TMRD_BASE = $00 F100)

Quad Timer D is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

TMRD0_HOLD

TMRD0_CNTR

TMRD0_CTRL

TMRD0_SCR

$4

$5

$6

$7

$8

$9

$A

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRD0_CMPLD1

TMRD0_CMPLD2

TMRD0_COMSCR

TMRD1_CMP1

TMRD1_CMP2

TMRD1_CAP

$10

$11

$12

$13

$14

$15

$16

$17

$18

$19

$1A

Compare Register 1

Compare Register 2

Capture Register

TMRD1_LOAD

TMRD1_HOLD

TMRD1_CNTR

TMRD1_CTRL

TMRD1_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

Reserved

TMRD1_CMPLD1

TMRD1_CMPLD2

TMRD1_COMSCR

TMRD2_CMP1

TMRD2_CMP2

TMRD2_CAP

$20

$21

$22

$23

$24

$25

$26

$27

$28

$29

$2A

Compare Register 1

Compare Register 2

Capture Register

TMRD2_LOAD

TMRD2_HOLD

TMRD2_CNTR

TMRD2_CTRL

TMRD2_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

TMRD2_CMPLD1

TMRD2_CMPLD2

TMRD2_COMSCR

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

55

Table 4-14 Quad Timer D Registers Address Map (Continued)

(TMRD_BASE = $00 F100)

Quad Timer D is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Reserved

TMRD3_CMP1

TMRD3_CMP2

TMRD3_CAP

$30

$31

$32

$33

$34

$35

$36

$37

$38

$39

$3A

Compare Register 1

Compare Register 2

Capture Register

TMRD3_LOAD

TMRD3_HOLD

TMRD3_CNTR

TMRD3_CTRL

TMRD3_SCR

Load Register

Hold Register

Counter Register

Control Register

Status and Control Register

Comparator Load Register 1

Comparator Load Register 2

Comparator Status and Control Register

TMRD3_CMPLD1

TMRD3_CMPLD2

TMRD3_COMSCR

Table 4-15 Pulse Width Modulator A Registers Address Map

(PWMA_BASE = $00 F140)

PWMA is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

PWMA_PMCTL

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

$B

$C

$D

Control Register

PWMA_PMFCTL

PWMA_PMFSA

Fault Control Register

Fault Status Acknowledge Register

Output Control Register

Counter Register

PWMA_PMOUT

PWMA_PMCNT

PWMA_PWMCM

PWMA_PWMVAL0

PWMA_PWMVAL1

PWMA_PWMVAL2

PWMA_PWMVAL3

PWMA_PWMVAL4

PWMA_PWMVAL5

PWMA_PMDEADTM

PWMA_PMDISMAP1

Counter Modulo Register

Value Register 0

Value Register 1

Value Register 2

Value Register 3

Value Register 4

Value Register 5

Dead Time Register

Disable Mapping Register 1

56F8365 Technical Data, Rev. 9

56

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-15 Pulse Width Modulator A Registers Address Map (Continued)

(PWMA_BASE = $00 F140)

PWMA is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Disable Mapping Register 2

PWMA_PMDISMAP2

PWMA_PMCFG

PWMA_PMCCR

PWMA_PMPORT

PWMA_PMICCR

$E

$F

Configure Register

$10

$11

$12

Channel Control Register

Port Register

PWM Internal Correction Control Register

Table 4-16 Pulse Width Modulator B Registers Address Map

(PWMB_BASE = $00 F160)

Register Acronym

Address Offset

Register Description

PWMB_PMCTL

$0

$1

Control Register

PWMB_PMFCTL

PWMB_PMFSA

Fault Control Register

Fault Status Acknowledge Register

Output Control Register

Counter Register

$2

PWMB_PMOUT

$3

PWMB_PMCNT

$4

PWMB_PWMCM

PWMB_PWMVAL0

PWMB_PWMVAL1

PWMB_PWMVAL2

PWMB_PWMVAL3

PWMB_PWMVAL4

PWMB_PWMVAL5

PWMB_PMDEADTM

PWMB_PMDISMAP1

PWMB_PMDISMAP2

PWMB_PMCFG

$5

Counter Modulo Register

Value Register 0

$6

$7

Value Register 1

$8

Value Register 2

$9

Value Register 3

$A

$B

$C

$D

$E

$F

$10

$11

$12

Value Register 4

Value Register 5

Dead Time Register

Disable Mapping Register 1

Disable Mapping Register 2

Configure Register

PWMB_PMCCR

Channel Control Register

Port Register

PWMB_PMPORT

PWMB_PMICCR

PWM Internal Correction Control Register

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

57

Table 4-17 Quadrature Decoder 0 Registers Address Map

(DEC0_BASE = $00 F180)

Register Acronym

Address Offset

Register Description

Decoder Control Register

DEC0_DECCR

DEC0_FIR

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

$B

$C

$D

Filter Interval Register

DEC0_WTR

DEC0_POSD

DEC0_POSDH

DEC0_REV

Watchdog Time-out Register

Position Difference Counter Register

Position Difference Counter Hold Register

Revolution Counter Register

Revolution Hold Register

DEC0_REVH

DEC0_UPOS

DEC0_LPOS

DEC0_UPOSH

DEC0_LPOSH

DEC0_UIR

Upper Position Counter Register

Lower Position Counter Register

Upper Position Hold Register

Lower Position Hold Register

Upper Initialization Register

Lower Initialization Register

Input Monitor Register

DEC0_LIR

DEC0_IMR

Table 4-18 Quadrature Decoder 1 Registers Address Map

(DEC1_BASE = $00 F190)

Quadrature Decoder 1 is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Decoder Control Register

DEC1_DECCR

DEC1_FIR

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

$B

$C

Filter Interval Register

DEC1_WTR

DEC1_POSD

DEC1_POSDH

DEC1_REV

Watchdog Time-out Register

Position Difference Counter Register

Position Difference Counter Hold Register

Revolution Counter Register

Revolution Hold Register

DEC1_REVH

DEC1_UPOS

DEC1_LPOS

DEC1_UPOSH

DEC1_LPOSH

DEC1_UIR

Upper Position Counter Register

Lower Position Counter Register

Upper Position Hold Register

Lower Position Hold Register

Upper Initialization Register

Lower Initialization Register

DEC1_LIR

56F8365 Technical Data, Rev. 9

58

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-18 Quadrature Decoder 1 Registers Address Map (Continued)

(DEC1_BASE = $00 F190)

Quadrature Decoder 1 is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Input Monitor Register

DEC1_IMR

$D

Table 4-19 Interrupt Control Registers Address Map

(ITCN_BASE = $00 F1A0)

Register Acronym

IPR 0

Address Offset

Register Description

Interrupt Priority Register 0

$0

$1

IPR 1

Interrupt Priority Register 1

IPR 2

$2

Interrupt Priority Register 2

IPR 3

$3

Interrupt Priority Register 3

IPR 4

$4

Interrupt Priority Register 4

IPR 5

$5

Interrupt Priority Register 5

IPR 6

$6

Interrupt Priority Register 6

IPR 7

$7

Interrupt Priority Register 7

IPR 8

$8

Interrupt Priority Register 8

IPR 9

$9

Interrupt Priority Register 9

VBA

$A

$B

$C

$D

$E

$F

Vector Base Address Register

Fast Interrupt Match Register 0

Fast Interrupt Vector Address Low 0 Register

Fast Interrupt Vector Address High 0 Register

Fast Interrupt Match Register 1

Fast Interrupt Vector Address Low 1 Register

Fast Interrupt Vector Address High 1 Register

IRQ Pending Register 0

FIM0

FIVAL0

FIVAH0

FIM1

FIVAL1

FIVAH1

IRQP 0

IRQP 1

IRQP 2

IRQP 3

IRQP 4

IRQP 5

Reserved

ICTL

$10

$11

$12

$13

$14

$15

$16

IRQ Pending Register 1

IRQ Pending Register 2

IRQ Pending Register 3

IRQ Pending Register 4

IRQ Pending Register 5

$1D

Interrupt Control Register

Reserved

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

59

Table 4-19 Interrupt Control Registers Address Map (Continued)

(ITCN_BASE = $00 F1A0)

Register Acronym

IPR10

Address Offset

Register Description

Interrupt Priority Register 10

$1F

Table 4-20 Analog-to-Digital Converter Registers Address Map

(ADCA_BASE = $00 F200)

Register Acronym

Address Offset

Register Description

Control Register 1

ADCA_CR1

$0

$1

ADCA_CR2

Control Register 2

ADCA_ZCC

$2

Zero Crossing Control Register

Channel List Register 1

Channel List Register 2

Sample Disable Register

Status Register

ADCA_LST 1

ADCA_LST 2

ADCA_SDIS

$3

$4

$5

ADCA_STAT

ADCA_LSTAT

ADCA_ZCSTAT

ADCA_RSLT 0

ADCA_RSLT 1

ADCA_RSLT 2

ADCA_RSLT 3

ADCA_RSLT 4

ADCA_RSLT 5

ADCA_RSLT 6

ADCA_RSLT 7

ADCA_LLMT 0

ADCA_LLMT 1

ADCA_LLMT 2

ADCA_LLMT 3

ADCA_LLMT 4

ADCA_LLMT 5

ADCA_LLMT 6

ADCA_LLMT 7

ADCA_HLMT 0

ADCA_HLMT 1

$6

$7

Limit Status Register

Zero Crossing Status Register

Result Register 0

$8

$9

$A

Result Register 1

$B

Result Register 2

$C

$D

$E

Result Register 3

Result Register 4

Result Register 5

$F

Result Register 6

$10

$11

$12

$13

$14

$15

$16

$17

$18

$19

$1A

Result Register 7

Low Limit Register 0

Low Limit Register 1

Low Limit Register 2

Low Limit Register 3

Low Limit Register 4

Low Limit Register 5

Low Limit Register 6

Low Limit Register 7

High Limit Register 0

High Limit Register 1

56F8365 Technical Data, Rev. 9

60

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-20 Analog-to-Digital Converter Registers Address Map (Continued)

(ADCA_BASE = $00 F200)

Register Acronym

Address Offset

$1B

Register Description

High Limit Register 2

ADCA_HLMT 2

ADCA_HLMT 3

ADCA_HLMT 4

ADCA_HLMT 5

ADCA_HLMT 6

ADCA_HLMT 7

ADCA_OFS 0

ADCA_OFS 1

ADCA_OFS 2

ADCA_OFS 3

ADCA_OFS 4

ADCA_OFS 5

ADCA_OFS 6

ADCA_OFS 7

ADCA_POWER

ADCA_CAL

$1C

$1D

$1E

$1F

$20

$21

$22

$23

$24

$25

$26

$27

$28

$29

$2A

High Limit Register 3

High Limit Register 4

High Limit Register 5

High Limit Register 6

High Limit Register 7

Offset Register 0

Offset Register 1

Offset Register 2

Offset Register 3

Offset Register 4

Offset Register 5

Offset Register 6

Offset Register 7

Power Control Register

ADC Calibration Register

Table 4-21 Analog-to-Digital Converter Registers Address Map

(ADCB_BASE = $00 F240)

Register Acronym

Address Offset

Register Description

Control Register 1

ADCB_CR1

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

$B

ADCB_CR2

Control Register 2

ADCB_ZCC

Zero Crossing Control Register

Channel List Register 1

Channel List Register 2

Sample Disable Register

Status Register

ADCB_LST 1

ADCB_LST 2

ADCB_SDIS

ADCB_STAT

ADCB_LSTAT

ADCB_ZCSTAT

ADCB_RSLT 0

ADCB_RSLT 1

ADCB_RSLT 2

Limit Status Register

Zero Crossing Status Register

Result Register 0

Result Register 1

Result Register 2

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

61

Table 4-21 Analog-to-Digital Converter Registers Address Map (Continued)

(ADCB_BASE = $00 F240)

Register Acronym

Address Offset

Register Description

Result Register 3

ADCB_RSLT 3

ADCB_RSLT 4

ADCB_RSLT 5

ADCB_RSLT 6

ADCB_RSLT 7

ADCB_LLMT 0

ADCB_LLMT 1

ADCB_LLMT 2

ADCB_LLMT 3

ADCB_LLMT 4

ADCB_LLMT 5

ADCB_LLMT 6

ADCB_LLMT 7

ADCB_HLMT 0

ADCB_HLMT 1

ADCB_HLMT 2

ADCB_HLMT 3

ADCB_HLMT 4

ADCB_HLMT 5

ADCB_HLMT 6

ADCB_HLMT 7

ADCB_OFS 0

ADCB_OFS 1

ADCB_OFS 2

ADCB_OFS 3

ADCB_OFS 4

ADCB_OFS 5

ADCB_OFS 6

ADCB_OFS 7

ADCB_POWER

ADCB_CAL

$C

$D

Result Register 4

$E

Result Register 5

$F

Result Register 6

$10

$11

$12

$13

$14

$15

$16

$17

$18

$19

$1A

$1B

$1C

$1D

$1E

$1F

$20

$21

$22

$23

$24

$25

$26

$27

$28

$29

$2A

Result Register 7

Low Limit Register 0

Low Limit Register 1

Low Limit Register 2

Low Limit Register 3

Low Limit Register 4

Low Limit Register 5

Low Limit Register 6

Low Limit Register 7

High Limit Register 0

High Limit Register 1

High Limit Register 2

High Limit Register 3

High Limit Register 4

High Limit Register 5

High Limit Register 6

High Limit Register 7

Offset Register 0

Offset Register 1

Offset Register 2

Offset Register 3

Offset Register 4

Offset Register 5

Offset Register 6

Offset Register 7

Power Control Register

ADC Calibration Register

56F8365 Technical Data, Rev. 9

62

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-22 Temperature Sensor Register Address Map

(TSENSOR_BASE = $00 F270)

Temperature Sensor is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

TSENSOR_CNTL

$0

Control Register

Table 4-23 Serial Communication Interface 0 Registers Address Map

(SCI0_BASE = $00 F280)

Register Acronym

Address Offset

Register Description

Baud Rate Register

SCI0_SCIBR

SCI0_SCICR

$0

$1

Control Register

Reserved

SCI0_SCISR

SCI0_SCIDR

$3

$4

Status Register

Data Register

Table 4-24 Serial Communication Interface 1 Registers Address Map

(SCI1_BASE = $00 F290)

Register Acronym

Address Offset

Register Description

Baud Rate Register

SCI1_SCIBR

SCI1_SCICR

$0

$1

Control Register

Reserved

SCI1_SCISR

SCI1_SCIDR

$3

$4

Status Register

Data Register

Table 4-25 Serial Peripheral Interface 0 Registers Address Map

(SPI0_BASE = $00 F2A0)

Register Acronym

Address Offset

Register Description

Status and Control Register

SPI0_SPSCR

SPI0_SPDSR

SPI0_SPDRR

SPI0_SPDTR

$0

$1

$2

$3

Data Size Register

Data Receive Register

Data Transmitter Register

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

63

Table 4-26 Serial Peripheral Interface 1 Registers Address Map

(SPI1_BASE = $00 F2B0)

Register Acronym

Address Offset

Register Description

Status and Control Register

SPI1_SPSCR

SPI1_SPDSR

SPI1_SPDRR

SPI1_SPDTR

$0

$1

$2

$3

Data Size Register

Data Receive Register

Data Transmitter Register

Table 4-27 Computer Operating Properly Registers Address Map

(COP_BASE = $00 F2C0)

Register Acronym

Address Offset

Register Description

COPCTL

COPTO

$0

$1

$2

Control Register

Time Out Register

Counter Register

COPCTR

Table 4-28 Clock Generation Module Registers Address Map

(CLKGEN_BASE = $00 F2D0)

Register Acronym

PLLCR

Address Offset

Register Description

$0

$1

$2

Control Register

PLLDB

PLLSR

Divide-By Register

Status Register

Reserved

SHUTDOWN

OSCTL

$4

$5

Shutdown Register

Oscillator Control Register

Table 4-29 GPIOA Registers Address Map

(GPIOA_BASE = $00 F2E0)

Address Offset

Register Description

Pull-up Enable Register

Reset Value

0 x 3FFF

0 x 0000

Register Acronym

GPIOA_PUR

$0

$1

$2

$3

GPIOA_DR

Data Register

GPIOA_DDR

GPIOA_PER

Data Direction Register

Peripheral Enable Register

0 x 0000

0 x 3FFF

56F8365 Technical Data, Rev. 9

64

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-29 GPIOA Registers Address Map (Continued)

(GPIOA_BASE = $00 F2E0)

Address Offset

$4

Register Description

Interrupt Assert Register

Reset Value

0 x 0000

0 x 3FFF

—

Register Acronym

GPIOA_IAR

GPIOA_IENR

$5

$6

$7

$8

$9

$A

Interrupt Enable Register

Interrupt Polarity Register

Interrupt Pending Register

Interrupt Edge-Sensitive Register

Push-Pull Mode Register

Raw Data Input Register

GPIOA_IPOLR

GPIOA_IPR

GPIOA_IESR

GPIOA_PPMODE

GPIOA_RAWDATA

Table 4-30 GPIOB Registers Address Map

(GPIOB_BASE = $00 F300)

Register Acronym

Address Offset

Register Description

Pull-up Enable Register

Reset Value

GPIOB_PUR

GPIOB_DR

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

0 x 00FF

0 x 0000

0 x 00FF

—

Data Register

GPIOB_DDR

GPIOB_PER

GPIOB_IAR

Data Direction Register

Peripheral Enable Register

Interrupt Assert Register

Interrupt Enable Register

Interrupt Polarity Register

Interrupt Pending Register

Interrupt Edge-Sensitive Register

Push-Pull Mode Register

Raw Data Input Register

GPIOB_IENR

GPIOB_IPOLR

GPIOB_IPR

GPIOB_IESR

GPIOB_PPMODE

GPIOB_RAWDATA

Table 4-31 GPIOC Registers Address Map

(GPIOC_BASE = $00 F310)

Register Acronym

Address Offset

Register Description

Pull-up Enable Register

Reset Value

GPIOC_PUR

GPIOC_DR

GPIOC_DDR

GPIOC_PER

GPIOC_IAR

$0

$1

$2

$3

$4

0 x 07FF

0 x 0000

0 x 07FF

0 x 0000

Data Register

Data Direction Register

Peripheral Enable Register

Interrupt Assert Register

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

65

Table 4-31 GPIOC Registers Address Map (Continued)

(GPIOC_BASE = $00 F310)

Register Acronym

Address Offset

Register Description

Reset Value

GPIOC_IENR

$5

$6

$7

$8

$9

$A

Interrupt Enable Register

Interrupt Polarity Register

Interrupt Pending Register

Interrupt Edge-Sensitive Register

Push-Pull Mode Register

Raw Data Input Register

0 x 0000

0 x 07FF

—

GPIOC_IPOLR

GPIOC_IPR

GPIOC_IESR

GPIOC_PPMODE

GPIOC_RAWDATA

Table 4-32 GPIOD Registers Address Map

(GPIOD_BASE = $00 F320)

Register Acronym

Address Offset

Register Description

Pull-up Enable Register

Reset Value

GPIOD_PUR

GPIOD_DR

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

0 x 1FFF

0 x 0000

0 x 1FC0

0 x 0000

0 x 1FFF

—

Data Register

GPIOD_DDR

GPIOD_PER

GPIOD_IAR

Data Direction Register

Peripheral Enable Register

Interrupt Assert Register

Interrupt Enable Register

Interrupt Polarity Register

Interrupt Pending Register

Interrupt Edge-Sensitive Register

Push-Pull Mode Register

Raw Data Input Register

GPIOD_IENR

GPIOD_IPOLR

GPIOD_IPR

GPIOD_IESR

GPIOD_PPMODE

GPIOD_RAWDATA

Table 4-33 GPIOE Registers Address Map

(GPIOE_BASE = $00 F330)

Register Acronym

Address Offset

Register Description

Pull-up Enable Register

Reset Value

GPIOE_PUR

GPIOE_DR

$0

$1

$2

$3

$4

$5

0 x 3FFF

0 x 0000

0 x 3FFF

0 x 0000

Data Register

GPIOE_DDR

GPIOE_PER

GPIOE_IAR

GPIOE_IENR

Data Direction Register

Peripheral Enable Register

Interrupt Assert Register

Interrupt Enable Register

56F8365 Technical Data, Rev. 9

66

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-33 GPIOE Registers Address Map (Continued)

(GPIOE_BASE = $00 F330)

Register Acronym

Address Offset

Register Description

Interrupt Polarity Register

Reset Value

GPIOE_IPOLR

GPIOE_IPR

$6

$7

$8

$9

$A

0 x 0000

0 x 3FFF

—

Interrupt Pending Register

Interrupt Edge-Sensitive Register

Push-Pull Mode Register

Raw Data Input Register

GPIOE_IESR

GPIOE_PPMODE

GPIOE_RAWDATA

Table 4-34 GPIOF Registers Address Map

(GPIOF_BASE = $00 F340)

Register Acronym

Address Offset

Register Description

Pull-up Enable Register

Reset Value

GPIOF_PUR

GPIOF_DR

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

0 x FFFF

0 x 0000

0 x FFFF

0 x 0000

0 x FFFF

—

Data Register

GPIOF_DDR

GPIOF_PER

GPIOF_IAR

Data Direction Register

Peripheral Enable Register

Interrupt Assert Register

Interrupt Enable Register

Interrupt Polarity Register

Interrupt Pending Register

Interrupt Edge-Sensitive Register

Push-Pull Mode Register

Raw Data Input Register

GPIOF_IENR

GPIOF_IPOLR

GPIOF_IPR

GPIOF_IESR

GPIOF_PPMODE

GPIOF_RAWDATA

Table 4-35 System Integration Module Registers Address Map

(SIM_BASE = $00 F350)

Register Acronym

Address Offset

Register Description

SIM_CONTROL

SIM_RSTSTS

SIM_SCR0

$0

$1

$2

$3

$4

$5

$6

Control Register

Reset Status Register

Software Control Register 0

Software Control Register 1

Software Control Register 2

Software Control Register 3

Most Significant Half JTAG ID

SIM_SCR1

SIM_SCR2

SIM_SCR3

SIM_MSH_ID

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

67

Table 4-35 System Integration Module Registers Address Map (Continued)

(SIM_BASE = $00 F350)

Register Acronym

Address Offset

Register Description

Least Significant Half JTAG ID

SIM_LSH_ID

SIM_PUDR

$7

$8

Pull-up Disable Register

Reserved

SIM_CLKOSR

SIM_GPS

$A

$B

$C

$D

$E

$F

Clock Out Select Register

Quad Decoder 1 / Timer B / SPI 1 Select Register

Peripheral Clock Enable Register

I/O Short Address Location High Register

I/O Short Address Location Low Register

Peripheral Clock Enable Register 2

SIM_PCE

SIM_ISALH

SIM_ISALL

SIM_PCE2

Table 4-36 Power Supervisor Registers Address Map

(LVI_BASE = $00 F360)

Register Acronym

Address Offset

Register Description

LVI_CONTROL

LVI_STATUS

$0

$1

Control Register

Status Register

Table 4-37 Flash Module Registers Address Map

(FM_BASE = $00 F400)

Register Acronym

Address Offset

Register Description

Clock Divider Register

FMCLKD

FMMCR

$0

$1

Module Control Register

Reserved

FMSECH

FMSECL

$3

$4

Security High Half Register

Security Low Half Register

Reserved

FMPROT

$10

$11

Protection Register (Banked)

Protection Boot Register (Banked)

Reserved

FMPROTB

FMUSTAT

FMCMD

$13

$14

User Status Register (Banked)

Command Register (Banked)

56F8365 Technical Data, Rev. 9

68

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-37 Flash Module Registers Address Map (Continued)

(FM_BASE = $00 F400)

Register Acronym

Address Offset

Register Description

Reserved

FMOPT 0

$1A

16-Bit Information Option Register 0

Hot temperature ADC reading of Temperature Sensor;

value set during factory test

FMOPT 1

FMOPT 2

$1B

$1C

16-Bit Information Option Register 1

Not used

16-Bit Information Option Register 2

Room temperature ADC reading of Temperature Sensor;

value set during factory test

Table 4-38 FlexCAN Registers Address Map

(FC_BASE = $00 F800)

FlexCAN is NOT available in the 56F8165 device

Register Acronym

FCMCR

Address Offset

Register Description

Module Configuration Register

$0

Reserved

FCCTL0

FCCTL1

FCTMR

$3

$4

$5

$6

Control Register 0 Register

Control Register 1 Register

Free-Running Timer Register

Maximum Message Buffer Configuration Register

Reserved

FCMAXMB

FCRXGMASK_H

FCRXGMASK_L

FCRX14MASK_H

FCRX14MASK_L

FCRX15MASK_H

FCRX15MASK_L

$8

$9

$A

$B

$C

$D

Receive Global Mask High Register

Receive Global Mask Low Register

Receive Buffer 14 Mask High Register

Receive Buffer 14 Mask Low Register

Receive Buffer 15 Mask High Register

Receive Buffer 15 Mask Low Register

Reserved

FCSTATUS

$10

$11

$12

$13

Error and Status Register

FCIMASK1

Interrupt Masks 1 Register

Interrupt Flags 1 Register

FCIFLAG1

FCR/T_ERROR_CNTRS

Receive and Transmit Error Counters Register

Reserved

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

69

Table 4-38 FlexCAN Registers Address Map (Continued)

(FC_BASE = $00 F800)

FlexCAN is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Reserved

FCMB0_CONTROL

FCMB0_ID_HIGH

FCMB0_ID_LOW

FCMB0_DATA

$40

$41

$42

$43

$44

$45

$46

Message Buffer 0 Control / Status Register

Message Buffer 0 ID High Register

Message Buffer 0 ID Low Register

Message Buffer 0 Data Register

Reserved

FCMB0_DATA

FCMSB1_CONTROL

FCMSB1_ID_HIGH

FCMSB1_ID_LOW

FCMB1_DATA

$48

$49

$4A

$4B

$4C

$4D

$4E

Message Buffer 1 Control / Status Register

Message Buffer 1 ID High Register

Message Buffer 1 ID Low Register

Message Buffer 1 Data Register

Reserved

FCMB1_DATA

FCMB2_CONTROL

FCMB2_ID_HIGH

FCMB2_ID_LOW

FCMB2_DATA

$50

$51

$52

$53

$54

$55

$56

Message Buffer 2 Control / Status Register

Message Buffer 2 ID High Register

Message Buffer 2 ID Low Register

Message Buffer 2 Data Register

Reserved

FCMB2_DATA

FCMB3_CONTROL

FCMB3_ID_HIGH

FCMB3_ID_LOW

FCMB3_DATA

$58

$59

$5A

$5B

$5C

Message Buffer 3 Control / Status Register

Message Buffer 3 ID High Register

Message Buffer 3 ID Low Register

Message Buffer 3 Data Register

FCMB3_DATA

56F8365 Technical Data, Rev. 9

70

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-38 FlexCAN Registers Address Map (Continued)

(FC_BASE = $00 F800)

FlexCAN is NOT available in the 56F8165 device

Register Acronym

FCMB3_DATA

Address Offset

Register Description

Message Buffer 3 Data Register

$5D

$5E

FCMB3_DATA

Message Buffer 3 Data Register

Reserved

FCMB4_CONTROL

FCMB4_ID_HIGH

FCMB4_ID_LOW

FCMB4_DATA

$60

$61

$62

$63

$64

$65

$66

Message Buffer 4 Control / Status Register

Message Buffer 4 ID High Register

Message Buffer 4 ID Low Register

Message Buffer 4 Data Register

Reserved

FCMB4_DATA

FCMB5_CONTROL

FCMB5_ID_HIGH

FCMB5_ID_LOW

FCMB5_DATA

$68

$69

$6A

$6B

$6C

$6D

$6E

Message Buffer 5 Control / Status Register

Message Buffer 5 ID High Register

Message Buffer 5 ID Low Register

Message Buffer 5 Data Register

Reserved

FCMB5_DATA

FCMB6_CONTROL

FCMB6_ID_HIGH

FCMB6_ID_LOW

FCMB6_DATA

$70

$71

$72

$73

$74

$75

$76

Message Buffer 6 Control / Status Register

Message Buffer 6 ID High Register

Message Buffer 6 ID Low Register

Message Buffer 6 Data Register

Reserved

FCMB6_DATA

FCMB7_CONTROL

FCMB7_ID_HIGH

FCMB7_ID_LOW

FCMB7_DATA

$78

$79

$7A

$7B

Message Buffer 7 Control / Status Register

Message Buffer 7 ID High Register

Message Buffer 7 ID Low Register

Message Buffer 7 Data Register

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

71

Table 4-38 FlexCAN Registers Address Map (Continued)

(FC_BASE = $00 F800)

FlexCAN is NOT available in the 56F8165 device

Register Acronym

FCMB7_DATA

Address Offset

Register Description

Message Buffer 7 Data Register

$7C

$7D

$7E

FCMB7_DATA

Message Buffer 7 Data Register

Reserved

FCMB8_CONTROL

FCMB8_ID_HIGH

FCMB8_ID_LOW

FCMB8_DATA

$80

$81

$82

$83

$84

$85

$86

Message Buffer 8 Contro l /Status Register

Message Buffer 8 ID High Register

Message Buffer 8 ID Low Register

Message Buffer 8 Data Register

Reserved

FCMB8_DATA

FCMB9_CONTROL

FCMB9_ID_HIGH

FCMB9_ID_LOW

FCMB9_DATA

$88

$89

$8A

$8B

$8C

$8D

$8E

Message Buffer 9 Control / Status Register

Message Buffer 9 ID High Register

Message Buffer 9 ID Low Register

Message Buffer 9 Data Register

Reserved

FCMB9_DATA

FCMB10_CONTROL

FCMB10_ID_HIGH

FCMB10_ID_LOW

FCMB10_DATA

$90

$91

$92

$93

$94

$95

$96

Message Buffer 10 Control / Status Register

Message Buffer 10 ID High Register

Message Buffer 10 ID Low Register

Message Buffer 10 Data Register

Reserved

FCMB11_CONTROL

FCMB11_ID_HIGH

FCMB11_ID_LOW

$98

$99

$9A

Message Buffer 11 Control / Status Register

Message Buffer 11 ID High Register

Message Buffer 11 ID Low Register

56F8365 Technical Data, Rev. 9

72

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-38 FlexCAN Registers Address Map (Continued)

(FC_BASE = $00 F800)

FlexCAN is NOT available in the 56F8165 device

Register Acronym

FCMB11_DATA

Address Offset

Register Description

Message Buffer 11 Data Register

$9B

$9C

$9D

$9E

FCMB11_DATA

Message Buffer 11 Data Register

Reserved

FCMB12_CONTROL

FCMB12_ID_HIGH

FCMB12_ID_LOW

FCMB12_DATA

$A0

$A1

$A2

$A3

$A4

$A5

$A6

Message Buffer 12 Control / Status Register

Message Buffer 12 ID High Register

Message Buffer 12 ID Low Register

Message Buffer 12 Data Register

Reserved

FCMB13_CONTROL

FCMB13_ID_HIGH

FCMB13_ID_LOW

FCMB13_DATA

$A8

$A9

$AA

$AB

$AC

$AD

$AE

Message Buffer 13 Control / Status Register

Message Buffer 13 ID High Register

Message Buffer 13 ID Low Register

Message Buffer 13 Data Register

Reserved

FCMB14_CONTROL

FCMB14_ID_HIGH

FCMB14_ID_LOW

FCMB14_DATA

$B0

$B1

$B2

$B3

$B4

$B5

$B6

Message Buffer 14 Control / Status Register

Message Buffer 14 ID High Register

Message Buffer 14 ID Low Register

Message Buffer 14 Data Register

Reserved

FCMB15_CONTROL

FCMB15_ID_HIGH

$B8

$B9

Message Buffer 15 Control / Status Register

Message Buffer 15 ID High Register

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

73

Table 4-38 FlexCAN Registers Address Map (Continued)

(FC_BASE = $00 F800)

FlexCAN is NOT available in the 56F8165 device

Register Acronym

FCMB15_ID_LOW

Address Offset

Register Description

$BA

$BB

$BC

$BD

$BE

Message Buffer 15 ID Low Register

Message Buffer 15 Data Register

Reserved

FCMB15_DATA

Table 4-39 FlexCAN2 Registers Address Map

(FC2_BASE = $00 FA00)

FlexCAN2 is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Module Configuration Register

FC2MCR

$0

Reserved

FC2CTL0

$3

$4

$5

$6

$7

$8

$9

$A

$B

$C

$D

Control Register 0 Register

Control Register 1 Register

Free-Running Timer Register

Maximum Message Buffer Configuration Register

Interrupt Masks 2 Register

FC2CTL1

FC2TMR

FC2MAXMB

FC2IMASK2

FC2RXGMASK_H

FC2RXGMASK_L

FC2RX14MASK_H

FC2RX14MASK_L

FC2RX15MASK_H

FC2RX15MASK_L

Receive Global Mask High Register

Receive Global Mask Low Register

Receive Buffer 14 Mask High Register

Receive Buffer 14 Mask Low Register

Receive Buffer 15 Mask High Register

Receive Buffer 15 Mask Low Register

Reserved

FC2STATUS

$10

$11

$12

$13

Error and Status Register

FC2IMASK1

Interrupt Masks 1 Register

FC2IFLAG1

Interrupt Flags 1 Register

FC2R/T_ERROR_CNTRS

Receive and Transmit Error Counters Register

Reserved

FC2IFLAG 2

$1B

Interrupt Flags 2 Register

56F8365 Technical Data, Rev. 9

74

Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-39 FlexCAN2 Registers Address Map (Continued)

(FC2_BASE = $00 FA00)

FlexCAN2 is NOT available in the 56F8165 device

Register Acronym

Address Offset

Register Description

Reserved

FC2MB0_CONTROL

FC2MB0_ID_HIGH

FC2MB0_ID_LOW

FC2MB0_DATA

$40

$41

$42

$43

$44

$45

$46

Message Buffer 0 Control / Status Register

Message Buffer 0 ID High Register

Message Buffer 0 ID Low Register

Message Buffer 0 Data Register

Reserved

FC2MSB1_CONTROL

FC2MSB1_ID_HIGH

FC2MSB1_ID_LOW

FC2MB1_DATA

$48

$49

$4A

$4B

$4C

$4D

$4E

Message Buffer 1 Control / Status Register

Message Buffer 1 ID High Register

Message Buffer 1 ID Low Register

Message Buffer 1 Data Register

Reserved

FC2MB1_DATA

FC2MB2_CONTROL

FC2MB2_ID_HIGH

FC2MB2_ID_LOW

FC2MB2_DATA

$50

$51

$52

$53

$54

$55

$56

Message Buffer 2 Control / Status Register

Message Buffer 2 ID High Register

Message Buffer 2 ID Low Register

Message Buffer 2 Data Register

Reserved

FC2MB3_CONTROL

FC2MB3_ID_HIGH

FC2MB3_ID_LOW

FC2MB3_DATA

$58

$59

$5A

$5B

$5C

$5D

Message Buffer 3 Control / Status Register

Message Buffer 3 ID High Register

Message Buffer 3 ID Low Register

Message Buffer 3 Data Register

FC2MB3_DATA

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

75

Table 4-39 FlexCAN2 Registers Address Map (Continued)

(FC2_BASE = $00 FA00)

FlexCAN2 is NOT available in the 56F8165 device

Register Acronym

FC2MB3_DATA

Address Offset

Register Description

Message Buffer 3 Data Register

$5E

Reserved

FC2MB4_CONTROL

FC2MB4_ID_HIGH

FC2MB4_ID_LOW

FC2MB4_DATA

$60

$61

$62

$63

$64

$65

$66

Message Buffer 4 Control / Status Register

Message Buffer 4 ID High Register

Message Buffer 4 ID Low Register

Message Buffer 4 Data Register

Reserved

FC2MB5_CONTROL

FC2MB5_ID_HIGH

FC2MB5_ID_LOW

FC2MB5_DATA

$68

$69

$6A

$6B

$6C

$6D

$6E

Message Buffer 5 Control / Status Register

Message Buffer 5 ID High Register

Message Buffer 5 ID Low Register

Message Buffer 5 Data Register

Reserved

FC2MB6_CONTROL

FC2MB6_ID_HIGH

FC2MB6_ID_LOW

FC2MB6_DATA

$70

$71

$72

$73

$74

$75

$76

Message Buffer 6 Control / Status Register

Message Buffer 6 ID High Register

Message Buffer 6 ID Low Register

Message Buffer 6 Data Register

Reserved

FC2MB7_CONTROL

FC2MB7_ID_HIGH

FC2MB7_ID_LOW

FC2MB7_DATA

$78

$79

$7A

$7B

$7C

Message Buffer 7 Control / Status Register

Message Buffer 7 ID High Register

Message Buffer 7 ID Low Register

Message Buffer 7 Data Register

FC2MB7_DATA

56F8365 Technical Data, Rev. 9

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Freescale Semiconductor

Peripheral Memory Mapped Registers

Table 4-39 FlexCAN2 Registers Address Map (Continued)

(FC2_BASE = $00 FA00)

FlexCAN2 is NOT available in the 56F8165 device

Register Acronym

FC2MB7_DATA

Address Offset

Register Description

Message Buffer 7 Data Register

$7D

$7E

FC2MB7_DATA

Message Buffer 7 Data Register

Reserved

FC2MB8_CONTROL

FC2MB8_ID_HIGH

FC2MB8_ID_LOW

FC2MB8_DATA

$80

$81

$82

$83

$84

$85

$86

Message Buffer 8 Contro l /Status Register

Message Buffer 8 ID High Register

Message Buffer 8 ID Low Register

Message Buffer 8 Data Register

Reserved

FC2MB9_CONTROL

FC2MB9_ID_HIGH

FC2MB9_ID_LOW

FC2MB9_DATA

$88

$89

$8A

$8B

$8C

$8D

$8E

Message Buffer 9 Control / Status Register

Message Buffer 9 ID High Register

Message Buffer 9 ID Low Register

Message Buffer 9 Data Register

Reserved

FC2MB10_CONTROL

FC2MB10_ID_HIGH

FC2MB10_ID_LOW

FC2MB10_DATA

$90

$91

$92

$93

$94

$95

$96

Message Buffer 10 Control / Status Register

Message Buffer 10 ID High Register

Message Buffer 10 ID Low Register

Message Buffer 10 Data Register

Reserved

FC2MB11_CONTROL

FC2MB11_ID_HIGH

FC2MB11_ID_LOW

FC2MB11_DATA

$98

$99

$9A

$9B

Message Buffer 11 Control / Status Register

Message Buffer 11 ID High Register

Message Buffer 11 ID Low Register

Message Buffer 11 Data Register

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

77

Table 4-39 FlexCAN2 Registers Address Map (Continued)

(FC2_BASE = $00 FA00)

FlexCAN2 is NOT available in the 56F8165 device

Register Acronym

FC2MB11_DATA

Address Offset

Register Description

Message Buffer 11 Data Register

$9C

$9D

$9E

FC2MB11_DATA

Message Buffer 11 Data Register

Reserved

FC2MB12_CONTROL

FC2MB12_ID_HIGH

FC2MB12_ID_LOW

FC2MB12_DATA

$A0

$A1

$A2

$A3

$A4

$A5

$A6

Message Buffer 12 Control / Status Register

Message Buffer 12 ID High Register

Message Buffer 12 ID Low Register

Message Buffer 12 Data Register

Reserved

FC2MB13_CONTROL

FC2MB13_ID_HIGH

FC2MB13_ID_LOW

FC2MB13_DATA

$A8

$A9

$AA

$AB

$AC

$AD

$AE

Message Buffer 13 Control / Status Register

Message Buffer 13 ID High Register

Message Buffer 13 ID Low Register

Message Buffer 13 Data Register

Reserved

FC2MB14_CONTROL

FC2MB14_ID_HIGH

FC2MB14_ID_LOW

FC2MB14_DATA

$B0

$B1

$B2

$B3

$B4

$B5

$B6

Message Buffer 14 Control / Status Register

Message Buffer 14 ID High Register

Message Buffer 14 ID Low Register

Message Buffer 14 Data Register

Reserved

FC2MB15_CONTROL

FC2MB15_ID_HIGH

FC2MB15_ID_LOW

$B8

$B9

$BA

Message Buffer 15 Control / Status Register

Message Buffer 15 ID High Register

Message Buffer 15 ID Low Register

56F8365 Technical Data, Rev. 9

78

Freescale Semiconductor

Factory Programmed Memory

Table 4-39 FlexCAN2 Registers Address Map (Continued)

(FC2_BASE = $00 FA00)

FlexCAN2 is NOT available in the 56F8165 device

Register Acronym

FC2MB15_DATA

Address Offset

Register Description

Message Buffer 15 Data Register

$BB

$BC

$BD

$BE

FC2MB15_DATA

Message Buffer 15 Data Register

Reserved

4.8 Factory Programmed Memory

The Boot Flash memory block is programmed during manufacturing with a default Serial Bootloader

program. The Serial Bootloader application can be used to load a user application into the Program and

Data Flash (NOT available in the 56F8165) memories of the device. The 56F83xx SCI/CAN Bootloader

User Manual (MC56F83xxBLUM) provides detailed information on this firmware. An application note,

Production Flash Programming (AN1973), details how the Serial Bootloader program can be used to

perform production Flash programming of the on-board Flash memories, as well as other potential

methods.

Like all the Flash memory blocks the Boot Flash can be erased and programmed by the user. The Serial

Bootloader application is programmed as an aid to the end user, but is not required to be used or maintained

in the Boot Flash memory.

Part 5 Interrupt Controller (ITCN)

5.1 Introduction

The Interrupt Controller (ITCN) module is used to arbitrate between various interrupt requests (IRQs), to

signal to the 56800E core when an interrupt of sufficient priority exists, and to what address to jump in

order to service this interrupt.

5.2 Features

The ITCN module design includes these distinctive features:

•

Programmable priority levels for each IRQ

Two programmable Fast Interrupts

Notification to SIM module to restart clocks out of Wait and Stop modes

Drives initial address on the address bus after reset

For further information, see Table 4-5, Interrupt Vector Table Contents.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

79

5.3 Functional Description

The Interrupt Controller is a slave on the IPBus. It contains registers allowing each of the 86 interrupt

sources to be set to one of four priority levels, excluding certain interrupts of fixed priority. Next, all of

the interrupt requests of a given level are priority encoded to determine the lowest numerical value of the

active interrupt requests for that level. Within a given priority level, 0 is the highest priority, while number

85 is the lowest.

5.3.1

Normal Interrupt Handling

Once the ITCN has determined that an interrupt is to be serviced and which interrupt has the highest

priority, an interrupt vector address is generated. Normal interrupt handling concatenates the VBA and the

vector number to determine the vector address. In this way, an offset is generated into the vector table for

each interrupt.

5.3.2

Interrupt Nesting

Interrupt exceptions may be nested to allow an IRQ of higher priority than the current exception to be

serviced. The following tables define the nesting requirements for each priority level.

Table 5-1 Interrupt Mask Bit Definition

SR[9]¹

SR[8]¹

Permitted Exceptions

Masked Exceptions

None

0

1

0

1

0

1

Priorities 0, 1, 2, 3

Priorities 1, 2, 3

Priorities 2, 3

Priority 3

Priority 0

Priorities 0, 1

Priorities 0, 1, 2

1. Core status register bits indicating current interrupt mask within the core.

Table 5-2. Interrupt Priority Encoding

Current Interrupt

Priority Level

Required Nested

Exception Priority

IPIC_LEVEL[1:0]¹

00

01

10

11

No Interrupt or SWILP

Priority 0

Priorities 0, 1, 2, 3

Priorities 1, 2, 3

Priorities 2, 3

Priority 3

Priority 1

Priorities 2 or 3

1. See IPIC field definition in Part 5.6.30.2

5.3.3

Fast Interrupt Handling

Fast interrupts are described in the DSP56800E Reference Manual. The interrupt controller recognizes

fast interrupts before the core does.

A fast interrupt is defined (to the ITCN) by:

56F8365 Technical Data, Rev. 9

80

Freescale Semiconductor

Block Diagram

1. Setting the priority of the interrupt as level 2, with the appropriate field in the IPR registers

2. Setting the FIMn register to the appropriate vector number.

3. Setting the FIVALn and FIVAHn registers with the address of the code for the fast interrupt

When an interrupt occurs, its vector number is compared with the FIM0 and FIM1 register values. If a

match occurs, and it is a level 2 interrupt, the ITCN handles it as a fast interrupt. The ITCN takes the vector

address from the appropriate FIVALn and FIVAHn registers, instead of generating an address that is an

offset from the VBA.

The core then fetches the instruction from the indicated vector adddress and if it is not a JSR, the core starts

its fast interrupt handling.

5.4 Block Diagram

any0

Priority

Level

Level 0

82 -> 7

Priority

Encoder

7

2 -> 4

Decode

INT1

INT

VAB

IPIC

CONTROL

any3

IACK

SR[9:8]

Level 3

Priority

Level

82 -> 7

Priority

PIC_EN

7

Encoder

2 -> 4

Decode

INT82

Figure 5-1 Interrupt Controller Block Diagram

5.5 Operating Modes

The ITCN module design contains two major modes of operation:

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

81

•

Functional Mode

The ITCN is in this mode by default.

Wait and Stop Modes

During Wait and Stop modes, the system clocks and the 56800E core are turned off. The ITCN will signal

a pending IRQ to the System Integration Module (SIM) to restart the clocks and service the IRQ. An IRQ

can only wake up the core if the IRQ is enabled prior to entering the Wait or Stop mode. Also, the IRQA

and IRQB signals automatically become low-level sensitive in these modes, even if the control register bits

are set to make them falling-edge sensitive. This is because there is no clock available to detect the falling

edge.

A peripheral which requires a clock to generate interrupts will not be able to generate interrupts during Stop

mode. The FlexCAN module can wake the device from Stop, and a reset will do just that, or IRQA and

IRQB can wake it up.

5.6 Register Descriptions

A register address is the sum of a base address and an address offset. The base address is defined at the

system level and the address offset is defined at the module level. The ITCN peripheral has 24 registers.

Table 5-3 ITCN Register Summary

(ITCN_BASE = $00F1A0)

Register

Acronym

Base Address +

Register Name

Section Location

IPR0

$0

$1

$2

$3

$4

$5

$6

$7

$8

$9

$A

$B

$C

$D

$E

$F

$10

Interrupt Priority Register 0

5.6.1

5.6.2

IPR1

Interrupt Priority Register 1

IPR2

Interrupt Priority Register 2

5.6.3

IPR3

Interrupt Priority Register 3

5.6.4

IPR4

Interrupt Priority Register 4

5.6.5

IPR5

Interrupt Priority Register 5

5.6.6

IPR6

Interrupt Priority Register 6

5.6.7

IPR7

Interrupt Priority Register 7

5.6.8

IPR8

Interrupt Priority Register 8

5.6.9

IPR9

Interrupt Priority Register 9

5.6.10

5.6.11

5.6.12

5.6.13

5.6.14

5.6.15

5.6.16

5.6.17

VBA

Vector Base Address Register

Fast Interrupt 0 Match Register

Fast Interrupt 0 Vector Address Low Register

Fast Interrupt 0 Vector Address High Register

Fast Interrupt 1 Match Register

Fast Interrupt 1 Vector Address Low Register

Fast Interrupt 1 Vector Address High Register

FIM0

FIVAL0

FIVAH0

FIM1

FIVAL1

FIVAH1

56F8365 Technical Data, Rev. 9

82

Freescale Semiconductor

Register Descriptions

Table 5-3 ITCN Register Summary

(ITCN_BASE = $00F1A0)

Register

Acronym

Base Address +

Register Name

Section Location

IRQP0

$11

$12

$13

$14

$15

$16

IRQ Pending Register 0

5.6.18

5.6.19

5.6.20

5.6.21

5.6.22

5.6.23

IRQP1

IRQP2

IRQP3

IRQP4

IRQP5

Reserved

ICTL

IRQ Pending Register 1

IRQ Pending Register 2

IRQ Pending Register 3

IRQ Pending Register 4

IRQ Pending Register 5

$1D

Interrupt Control Register

5.6.30

5.6.32

Reserved

IPR10

$1F

Interrupt Priority Register 10

Note: IPR10 is NOT available in the 56F8165 device.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

83

Add. Register

Offset

Name

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

R

W

R

0

$0

IPR0

BKPT_U0 IPL

STPCNT IPL

0

$1

$2

IPR1

IPR2

RX_REG IPL

TX_REG IPL

IRQB IPL

TRBUF IPL

IRQA IPL

W

R

0

FMCBE IPL

GPIOD IPL

FMCC IPL

GPIOE IPL

FMERR IPL

GPIOF IPL

LOCK IPL

LVI IPL

W

R

0

$3

IPR3

FCMSGBUF IPL FCWKUP IPL

FCERR IPL

GPIOA IPL

FCBOFF IPL

GPIOB IPL

W

R

0

SPI0_RCV

IPL

SPI1_XMIT

IPL

SPI1_RCV

IPL

$4

IPR4

GPIOC IPL

W

R

SCI1_RCV

IPL

SCI1_RERR

IPL

SCI1_TIDL

IPL

SCI1_XMIT

IPL

SPI0_XMIT

IPL

$5

IPR5

DEC1_XIRQ IPL DEC1_HIRQ IPL

W

R

0

$6

IPR6

TMRC0 IPL

TMRA0 IPL

TMRD3 IPL

TMRB3 IPL

TMRD2 IPL

TMRB2 IPL

TMRD1 IPL

TMRB1 IPL

TMRD0 IPL

TMRB0 IPL

DEC0_XIRQ IPL

TMRC2 IPL

DEC0_HIRQ IPL

TMRC1 IPL

W

R

$7

IPR7

TMRC3 IPL

TMRA3 IPL

W

R

0

$8

IPR8

SCI0_RCV IPL SCI0_RERR IPL

SCI0_TIDL IPL SCI0_XMIT IPL

TMRA2 IPL

TMRA1 IPL

W

R

$9

IPR9

PWMA_F IPL

PWMB_F IPL PWMA_RL IPL PWMB_RL IPL ADCA_ZC IPL

ABCB_ZC IPL

ADCA_CC IPL

ADCB_CC IPL

W

R

0

$A

$B

$C

$D

$E

$F

VBA

VECTOR BASE ADDRESS

0

W

R

0

FIM0

FAST INTERRUPT 0

W

R

FAST INTERRUPT 0

VECTOR ADDRESS LOW

FIVAL0

FIVAH0

FIM1

W

R

0

FAST INTERRUPT 0

VECTOR ADDRESS HIGH

W

R

0

FAST INTERRUPT 1

W

R

FAST INTERRUPT 1

VECTOR ADDRESS LOW

FIVAL1

FIVAH1

IRQP0

IRQP1

IRQP2

IRQP3

IRQP4

W

R

0

FAST INTERRUPT 1

$10

$11

$12

$13

$14

$15

VECTOR ADDRESS HIGH

W

R

PENDING [16:2]

1

W

R

PENDING [32:17]

W

R

PENDING [48:33]

PENDING [64:49]

PENDING [80:65]

W

R

W

R

W

PENDING

[81]

R

1

$16

IRQP5

Reserved

ICTL

W

IRQB

STATE STATE

IRQA

R

INT

0

IPIC

VAB

0

IRQB

EDG

IRQA

EDG

$1D

$1F

INT_DIS

W

Reserved

IPR10

R

0

FLEXCAN2

MSGBUF IPL

FLEXCAN2

WKUP IPL

FLEXCAN2

ERR IPL

FLEXCAN2

BOFF IPL

W

= Reserved

56F8365 Technical Data, Rev. 9

84

Freescale Semiconductor

Register Descriptions

Figure 5-2 ITCN Register Map Summary

5.6.1

Interrupt Priority Register 0 (IPR0)

Base + $0

Read

15

0

14

0

13

12

11

10

9

0

8

0

7

0

6

0

5

0

4

0

3

0

2

0

1

0

BKPT_U0IPL

STPCNT IPL

Write

0

RESET

Figure 5-3 Interrupt Priority Register 0 (IPR0)

5.6.1.1

Reserved—Bits 15–14

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.1.2

EOnCE Breakpoint Unit 0 Interrupt Priority Level (BKPT_U0 IPL)—

Bits13–12

This field is used to set the interrupt priority levels for IRQs. This IRQ is limited to priorities 1 through 3.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 1

10 = IRQ is priority level 2

11 = IRQ is priority level 3

5.6.1.3

EOnCE Step Counter Interrupt Priority Level (STPCNT IPL)—

Bits 11–10

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 1

10 = IRQ is priority level 2

11 = IRQ is priority level 3

5.6.1.4

Reserved—Bits 9–0

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

85

5.6.2

Interrupt Priority Register 1 (IPR1)

Base + $1

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

0

7

0

6

0

5

4

3

2

1

0

RX_REG IPL TX_REG IPL

TRBUF IPL

Write

RESET

0

Figure 5-4 Interrupt Priority Register 1 (IPR1)

5.6.2.1

Reserved—Bits 15–6

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.2.2

EOnCE Receive Register Full Interrupt Priority Level

(RX_REG IPL)—Bits 5–4

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 1

10 = IRQ is priority level 2

11 = IRQ is priority level 3

5.6.2.3

EOnCE Transmit Register Empty Interrupt Priority Level

(TX_REG IPL)—Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 1

10 = IRQ is priority level 2

11 = IRQ is priority level 3

5.6.2.4

EOnCE Trace Buffer Interrupt Priority Level (TRBUF IPL)—

Bits 1–0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 1

10 = IRQ is priority level 2

11 = IRQ is priority level 3

56F8365 Technical Data, Rev. 9

86

Freescale Semiconductor

Register Descriptions

5.6.3

Interrupt Priority Register 2 (IPR2)

Base + $2

Read

15

14

13

12

11

10

9

8

7

6

0

5

0

4

0

3

2

1

0

FMCBE IPL

FMCC IPL

FMERR IPL

LOCK IPL

LVI IPL

IRQB IPL

IRQA IPL

Write

RESET

0

Figure 5-5 Interrupt Priority Register 2 (IPR2)

5.6.3.1

Flash Memory Command, Data, Address Buffers Empty Interrupt

Priority Level (FMCBE IPL)—Bits 15–14

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.3.2

Flash Memory Command Complete Priority Level

(FMCC IPL)—Bits 13–12

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.3.3

Flash Memory Error Interrupt Priority Level

(FMERR IPL)—Bits 11–10

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.3.4

PLL Loss of Lock Interrupt Priority Level (LOCK IPL)—Bits 9–8

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

It is disabled by default.

•

00 = IRQ disabled (default)

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

87

•

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.3.5

Low Voltage Detector Interrupt Priority Level (LVI IPL)—Bits 7–6

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.3.6

Reserved—Bits 5–4

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.3.7

External IRQ B Interrupt Priority Level (IRQB IPL)—Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.3.8

External IRQ A Interrupt Priority Level (IRQA IPL)—Bits 1–0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

It is disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.4

Interrupt Priority Register 3 (IPR3)

Base + $3

Read

15

14

13

12 11 10

9

8

7

6

5

4

3

2

1

0

GPIOD

IPL

GPIOF

IPL

GPIOE IPL

FCMSGBUF IPL

FCWKUP IPL

FCERR IPL

FCBOFF IPL

Write

0

RESET

Figure 5-6 Interrupt Priority Register 3 (IPR3)

56F8365 Technical Data, Rev. 9

88

Freescale Semiconductor

Register Descriptions

5.6.4.1

GPIOD Interrupt Priority Level (GPIOD IPL)—Bits 15–14

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.4.2

GPIOE Interrupt Priority Level (GPIOE IPL)—Bits 13–12

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.4.3

GPIOF Interrupt Priority Level (GPIOF IPL)—Bits 11–10

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.4.4

FlexCAN Message Buffer Interrupt Priority Level (FCMSGBUF IPL)—

Bits 9–8

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.4.5

FlexCAN Wake Up Interrupt Priority Level (FCWKUP IPL)—Bits 7–6

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

89

•

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.4.6

FlexCAN Error Interrupt Priority Level (FCERR IPL)— Bits 5–4

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.4.7

FlexCAN Bus Off Interrupt Priority Level (FCBOFF IPL)— Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.4.8

Reserved—Bits 1–0

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.5

Interrupt Priority Register 4 (IPR4)

Base + $4

Read

15

14

13

12

11

10

9

0

8

0

7

0

6

0

5

4

3

2

1

0

SPI0_RCV

IPL

SPI1_XMIT

IPL

SPI1_RCV

IPL

GPIOA IPL

GPIOB IPL

GPIOC IPL

Write

0

RESET

Figure 5-7 Interrupt Priority Register 4 (IPR4)

SPI 0 Receiver Full Interrupt Priority Level (SPI0_RCV IPL)—Bits 15–14

5.6.5.1

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

56F8365 Technical Data, Rev. 9

90

Freescale Semiconductor

Register Descriptions

5.6.5.2

SPI 1 Transmit Empty Interrupt Priority Level (SPI1_XMIT IPL)—

Bits 13–12

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.5.3

SPI 1 Receiver Full Interrupt Priority Level (SPI1_RCV IPL)—

Bits 11–10

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.5.4

Reserved—Bits 9–6

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.5.5

GPIOA Interrupt Priority Level (GPIOA IPL)—Bits 5–4

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.5.6

GPIOB Interrupt Priority Level (GPIOB IPL)—Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.5.7

GPIOC Interrupt Priority Level (GPIOC IPL)—Bits 1–0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

91

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.6

Interrupt Priority Register 5 (IPR5)

Base + $5

Read

15

14

13

12

11

10

9

8

7

0

6

0

5

4

3

2

1

0

DEC1_XIRQ DEC1_HIRQ

IPL IPL

SCI1_RCV

IPL

SCI1_RERR

IPL

SCI1_TIDL

IPL

SCI1_XMIT

IPL

SPI0_XMIT

IPL

Write

0

RESET

Figure 5-8 Interrupt Priority Register 5 (IPR5)

5.6.6.1

Quadrature Decoder 1 INDEX Pulse Interrupt Priority Level

(DEC1_XIRQ IPL)—Bits 15–14

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.6.2

Quadrature Decoder 1 HOME Signal Transition or Watchdog Timer

Interrupt Priority Level (DEC1_HIRQ IPL)—Bits 13–12

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.6.3

SCI 1 Receiver Full Interrupt Priority Level (SCI1_RCV IPL)—Bits 11–10

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

56F8365 Technical Data, Rev. 9

92

Freescale Semiconductor

Register Descriptions

5.6.6.4

SCI 1 Receiver Error Interrupt Priority Level (SCI1_RERR IPL)—

Bits 9–8

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.6.5

Reserved—Bits 7–6

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.6.6

SCI 1 Transmitter Idle Interrupt Priority Level (SCI1_TIDL IPL)—

Bits 5–4

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.6.7

SCI 1 Transmitter Empty Interrupt Priority Level (SCI1_XMIT IPL)—

Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.6.8

SPI 0 Transmitter Empty Interrupt Priority Level (SPI0_XMIT IPL)—

Bits 1–0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

93

5.6.7

Interrupt Priority Register 6 (IPR6)

Base + $6

Read

15

14

13

12

11

10

9

8

7

6

5

0

4

0

3

2

1

0

DEC0_XIRQ

IPL

DEC0_HIRQ

IPL

TMRC0 IPL

TMRD3 IPL

TMRD2 IPL

TMRD1 IPL

TMRD0 IPL

Write

RESET

0

Figure 5-9 Interrupt Priority Register 6 (IPR6)

Timer C, Channel 0 Interrupt Priority Level (TMRC0 IPL)—Bits 15–14

5.6.7.1

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.7.2

Timer D, Channel 3 Interrupt Priority Level (TMRD3 IPL)—Bits 13–12

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.7.3

Timer D, Channel 2 Interrupt Priority Level (TMRD2 IPL)—Bits 11–10

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.7.4

Timer D, Channel 1 Interrupt Priority Level (TMRD1 IPL)—Bits 9–8

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

56F8365 Technical Data, Rev. 9

94

Freescale Semiconductor

Register Descriptions

5.6.7.5

Timer D, Channel 0 Interrupt Priority Level (TMRD0 IPL)—Bits 7–6

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.7.6

Reserved—Bits 5–4

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.7.7

Quadrature Decoder 0 INDEX Pulse Interrupt Priority Level

(DEC0_XIRQ IPL)—Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.7.8

Quadrature Decoder 0, HOME Signal Transition or Watchdog Timer

Interrupt Priority Level (DEC0_HIRQ IPL)—Bits 1–0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.8

Interrupt Priority Register 7 (IPR7)

Base + $7

Read

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

TMRA0 IPL

TMRB3 IPL

TMRB2 IPL

TMRB1 IPL

TMRB0 IPL

TMRC3 IPL

TMRC2 IPL

TMRC1 IPL

Write

RESET

0

Figure 5-10 Interrupt Priority Register (IPR7)

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

95

5.6.8.1

Timer A, Channel 0 Interrupt Priority Level (TMRA0 IPL)—

Bits 15–14

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.8.2

Timer B, Channel 3 Interrupt Priority Level (TMRB3 IPL)—Bits 13–12

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.8.3

Timer B, Channel 2 Interrupt Priority Level (TMRB2 IPL)—Bits 11–10

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.8.4

Timer B, Channel 1 Interrupt Priority Level (TMRB1 IPL)—Bits 9–8

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.8.5

Timer B, Channel 0 Interrupt Priority Level (TMRB0 IPL)—Bits 7–6

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

56F8365 Technical Data, Rev. 9

96

Freescale Semiconductor

Register Descriptions

•

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.8.6

Timer C, Channel 3 Interrupt Priority Level (TMRC3 IPL)—Bits 5–4

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.8.7

Timer C, Channel 2 Interrupt Priority Level (TMRC2 IPL)—Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.8.8

Timer C, Channel 1 Interrupt Priority Level (TMRC1 IPL)—Bits 1–0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.9

Interrupt Priority Register 8 (IPR8)

Base + $8

Read

15

14

13

12

11

0

10

0

9

8

7

6

5

4

3

2

1

0

SCI0_RCV

IPL

SCI0_RERR

IPL

SCI0_TIDL

IPL

SCI0_XMIT

IPL

TMRA3 IPL

TMRA2 IPL

TMRA1 IPL

Write

0

RESET

Figure 5-11 Interrupt Priority Register 8 (IPR8)

SCI0 Receiver Full Interrupt Priority Level (SCI0_RCV IPL)—Bits 15–14

5.6.9.1

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

97

•

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.9.2

SCI0 Receiver Error Interrupt Priority Level (SCI0_RERR IPL)—

Bits 13–12

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.9.3

Reserved—Bits 11–10

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.9.4

SCI0 Transmitter Idle Interrupt Priority Level (SCI0_TIDL IPL)—

Bits 9–8

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.9.5

SCI0 Transmitter Empty Interrupt Priority Level (SCI0_XMIT IPL)—

Bits 7–6

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.9.6

Timer A, Channel 3 Interrupt Priority Level (TMRA3 IPL)—Bits 5–4

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

56F8365 Technical Data, Rev. 9

98

Freescale Semiconductor

Register Descriptions

•

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.9.7

Timer A, Channel 2 Interrupt Priority Level (TMRA2 IPL)—Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.9.8

Timer A, Channel 1 Interrupt Priority Level (TMRA1 IPL)—Bits 1–0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.10 Interrupt Priority Register 9 (IPR9)

Base + $9

Read

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

PWMA_RL

IPL

PWMB_RL

IPL

ADCA_CC

IPL

ADCB_CC

IPL

PWMA_F IPL PWMB_F IPL

ADCA_ZC IPL ABCB_ZC IPL

Write

0

RESET

Figure 5-12 Interrupt Priority Register 9 (IPR9)

5.6.10.1 PWM A Fault Interrupt Priority Level (PWMA_F IPL)—Bits 15–14

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.10.2 PWM B Fault Interrupt Priority Level (PWMB_F IPL)—Bits 13–12

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

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99

•

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.10.3 Reload PWM A Interrupt Priority Level (PWMA_RL IPL)—Bits 11–10

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.10.4 Reload PWM B Interrupt Priority Level (PWMB_RL IPL)—Bits 9–8

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.10.5 ADC A Zero Crossing or Limit Error Interrupt Priority Level

(ADCA_ZC IPL)—Bits 7–6

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.10.6 ADC B Zero Crossing or Limit Error Interrupt Priority Level

(ADCB_ZC IPL)—Bits 5–4

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

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Freescale Semiconductor

Register Descriptions

5.6.10.7 ADC A Conversion Complete Interrupt Priority Level

(ADCA_CC IPL)—Bits 3–2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.10.8 ADC B Conversion Complete Interrupt Priority Level

(ADCB_CC IPL)—Bits 1–0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.11 Vector Base Address Register (VBA)

Base + $A

Read

15

0

14

0

13

0

12

11

10

9

8

7

6

5

4

0

3

0

2

0

1

0

VECTOR BASE ADDRESS

Write

0

RESET

Figure 5-13 Vector Base Address Register (VBA)

5.6.11.1 Reserved—Bits 15–13

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.11.2 Interrupt Vector Base Address (VECTOR BASE ADDRESS)—Bits 12–0

The contents of this register determine the location of the Vector Address Table. The value in this register

is used as the upper 13 bits of the interrupt Vector Address Bus (VAB[20:0]). The lower eight bits are

determined based upon the highest-priority interrupt. They are then appended onto VBA before presenting

the full interrupt address to the 56800E core; see Part 5.3.1 for details.

56F8365 Technical Data, Rev. 9

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101

5.6.12 Fast Interrupt 0 Match Register (FIM0)

Base + $B

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

0

7

0

6

0

5

0

4

3

2

1

0

FAST INTERRUPT 0

Write

RESET

0

Figure 5-14 Fast Interrupt 0 Match Register (FIM0)

5.6.12.1 Reserved—Bits 15–7

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.12.2 Fast Interrupt 0 Vector Number (FAST INTERRUPT 0)—Bits 6–0

This value determines which IRQ will be a Fast Interrupt 0. Fast interrupts vector directly to a service

routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table

first; see Part 5.3.3. IRQs used as fast interrupts must be set to priority level 2. Unexpected results will

occur if a fast interrupt vector is set to any other priority. Fast interrupts automatically become the

highest-priority level 2 interrupt, regardless of their location in the interrupt table, prior to being declared

as fast interrupt. Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each

IRQ, refer to Table 4-5.

5.6.13 Fast Interrupt 0 Vector Address Low Register (FIVAL0)

Base + $C

Read

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

FAST INTERRUPT 0

VECTOR ADDRESS LOW

Write

0

RESET

Figure 5-15 Fast Interrupt 0 Vector Address Low Register (FIVAL0)

5.6.13.1 Fast Interrupt 0 Vector Address Low (FIVAL0)—Bits 15–0

The lower 16 bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAH0

to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register.

5.6.14 Fast Interrupt 0 Vector Address High Register (FIVAH0)

Base + $D

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

0

7

0

6

0

5

0

4

3

2

1

0

FAST INTERRUPT 0

VECTOR ADDRESS HIGH

Write

0

RESET

Figure 5-16 Fast Interrupt 0 Vector Address High Register (FIVAH0)

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Register Descriptions

5.6.14.1 Reserved—Bits 15–5

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.14.2 Fast Interrupt 0 Vector Address High (FIVAH0)—Bits 4–0

The upper five bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAL0

to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register.

5.6.15 Fast Interrupt 1 Match Register (FIM1)

Base + $E

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

0

7

0

6

5

4

3

2

1

0

FAST INTERRUPT 1

Write

RESET

0

Figure 5-17 Fast Interrupt 1 Match Register (FIM1)

5.6.15.1 Reserved—Bits 15–7

This bit field is reserved or not implemented. It is read as 0, but cannot be modified by writing.

5.6.15.2 Fast Interrupt 1 Vector Number (FAST INTERRUPT 1)—Bits 6–0

This value determines which IRQ will be a Fast Interrupt 1. Fast interrupts vector directly to a service

routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table

first; see Part 5.3.3. IRQs used as fast interrupts must be set to priority level 2. Unexpected results will

occur if a fast interrupt vector is set to any other priority. Fast interrupts automatically become the

highest-priority level 2 interrupt, regardless of their location in the interrupt table, prior to being declared

as fast interrupt. Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each

IRQ, refer to Table 4-5.

5.6.16 Fast Interrupt 1 Vector Address Low Register (FIVAL1)

Base + $F

Read

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

FAST INTERRUPT 1

VECTOR ADDRESS LOW

Write

0

RESET

Figure 5-18 Fast Interrupt 1 Vector Address Low Register (FIVAL1)

5.6.16.1 Fast Interrupt 1 Vector Address Low (FIVAL1)—Bits 15–0

The lower 16 bits of the vector address are used for Fast Interrupt 1. This register is combined with

FIVAH1 to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register.

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Freescale Semiconductor

103

5.6.17 Fast Interrupt 1 Vector Address High Register (FIVAH1)

Base + $10

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

0

7

0

6

0

5

0

4

3

2

1

0

FAST INTERRUPT 1

VECTOR ADDRESS HIGH

Write

RESET

0

Figure 5-19 Fast Interrupt 1 Vector Address High Register (FIVAH1)

5.6.17.1 Reserved—Bits 15–5

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.17.2 Fast Interrupt 1 Vector Address High (FIVAH1)—Bits 4–0

The upper five bits of the vector address are used for Fast Interrupt 1. This register is combined with

FIVAL1 to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register.

5.6.18 IRQ Pending 0 Register (IRQP0)

Base + $11

Read

15

14

13

12

11

10

9

8

7

6

5

4

3

1

2

1

0

1

PENDING [16:2]

Write

1

RESET

Figure 5-20 IRQ Pending 0 Register (IRQP0)

5.6.18.1 IRQ Pending (PENDING)—Bits 16–2

This register combines with the other five to represent the pending IRQs for interrupt vector numbers two

through 81.

•

0 = IRQ pending for this vector number

1 = No IRQ pending for this vector number

5.6.18.2 Reserved—Bit 0

This bit is reserved or not implemented. It is read as 1 and cannot be modified by writing.

5.6.19 IRQ Pending 1 Register (IRQP1)

$Base + $12

Read

15

1

14

1

13

12

11

10

9

8

7

6

5

4

3

1

2

1

0

1

PENDING [32:17]

Write

1

RESET

Figure 5-21 IRQ Pending 1 Register (IRQP1)

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Freescale Semiconductor

Register Descriptions

5.6.19.1 IRQ Pending (PENDING)—Bits 32–17

This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2

through 81.

•

0 = IRQ pending for this vector number

1 = No IRQ pending for this vector number

5.6.20 IRQ Pending 2 Register (IRQP2)

Base + $13

Read

15

14

13

12

11

10

9

8

7

6

1

5

1

4

1

3

1

2

1

0

1

PENDING [48:33]

Write

1

RESET

Figure 5-22 IRQ Pending 2 Register (IRQP2)

5.6.20.1 IRQ Pending (PENDING)—Bits 48–33

This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2

through 81.

•

0 = IRQ pending for this vector number

1 = No IRQ pending for this vector number

5.6.21 IRQ Pending 3 Register (IRQP3)

Base + $14

Read

15

14

13

12

11

10

9

8

7

6

1

5

1

4

1

3

1

2

1

0

1

PENDING [64:49]

Write

1

RESET

Figure 5-23 IRQ Pending 3 Register (IRQP3)

5.6.21.1 IRQ Pending (PENDING)—Bits 64–49

This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2

through 81.

•

0 = IRQ pending for this vector number

1 = No IRQ pending for this vector number

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Freescale Semiconductor

105

5.6.22 IRQ Pending 4 Register (IRQP4)

Base + $15

Read

15

14

13

12

11

10

9

8

7

6

1

5

1

4

1

3

1

2

1

0

1

PENDING [80:65]

Write

RESET

1

Figure 5-24 IRQ Pending 4 Register (IRQP4)

5.6.22.1 IRQ Pending (PENDING)—Bits 80–65

This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2

through 81.

•

0 = IRQ pending for this vector number

1 = No IRQ pending for this vector number

5.6.23 IRQ Pending 5 Register (IRQP5)

Base + $16

Read

15

1

14

1

13

1

12

1

11

1

10

1

9

1

8

1

7

1

6

1

5

1

4

1

3

1

2

1

0

1

PENDING[85:81]

Write

1

RESET

Figure 5-25 IRQ Pending Register 5 (IRQP5)

5.6.23.1 Reserved—Bits 96–86

This bit field is reserved or not implemented. The bits are read as 1 and cannot be modified by writing.

5.6.23.2 IRQ Pending (PENDING)—Bits 81–85

This register combines with the other five to represent the pending IRQs for interrupt vector numbers 2

through 85.

•

0 = IRQ pending for this vector number

1 = No IRQ pending for this vector number

5.6.24 Reserved—Base + 17

5.6.25 Reserved—Base + 18

5.6.26 Reserved—Base + 19

5.6.27 Reserved—Base + 1A

5.6.28 Reserved—Base + 1B

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Register Descriptions

5.6.29 Reserved—Base + 1C

5.6.30 ITCN Control Register (ICTL)

Base + $1D

Read

15

14

13

12 11 10

9

8

7

6

0

5

INT_DIS

0

4

1

3

2

1

0

INT

IPIC

VAB

IRQB STATE IRQA STATE

IRQB IRQA

EDG

Write

RESET

0

1

0

1

0

Figure 5-26 ITCN Control Register (ICTL)

5.6.30.1 Interrupt (INT)—Bit 15

This read-only bit reflects the state of the interrupt to the 56800E core.

•

0 = No interrupt is being sent to the 56800E core

1 = An interrupt is being sent to the 56800E core

5.6.30.2 Interrupt Priority Level (IPIC)—Bits 14–13

These read-only bits reflect the state of the new interrupt priority level bits being presented to the 56800E

core at the time the last IRQ was taken. This field is only updated when the 56800E core jumps to a new

interrupt service routine.

Note:

Nested interrupts may cause this field to be updated before the original interrupt service routine can

read it.

•

00 = Required nested exception priority levels are 0, 1, 2, or 3

01 = Required nested exception priority levels are 1, 2, or 3

10 = Required nested exception priority levels are 2 or 3

11 = Required nested exception priority level is 3

5.6.30.3 Vector Number - Vector Address Bus (VAB)—Bits 12–6

This read-only field shows the vector number (VAB[7:1]) used at the time the last IRQ was taken. This

field is only updated when the 56800E core jumps to a new interrupt service routine.

Note:

Nested interrupts may cause this field to be updated before the original interrupt service routine can

read it.

5.6.30.4 Interrupt Disable (INT_DIS)—Bit 5

This bit allows all interrupts to be disabled.

•

0 = Normal operation (default)

1 = All interrupts disabled

5.6.30.5 Reserved—Bit 4

This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

107

5.6.30.6 IRQB State Pin (IRQB STATE)—Bit 3

This read-only bit reflects the state of the external IRQB pin.

5.6.30.7 IRQA State Pin (IRQA STATE)—Bit 2

This read-only bit reflects the state of the external IRQA pin.

5.6.30.8 IRQB Edge Pin (IRQB Edg)—Bit 1

This bit controls whether the external IRQB interrupt is edge or level sensitive. During Stop and Wait

modes, it is automatically level-sensitive.

•

0 = IRQB interrupt is a low-level sensitive (default)

1 = IRQB interrupt is falling-edge sensitive.

5.6.30.9 IRQA Edge Pin (IRQA Edg)—Bit 0

This bit controls whether the external IRQA interrupt is edge or level sensitive. During Stop and Wait

modes, it is automatically level-sensitive.

•

0 = IRQA interrupt is a low-level sensitive (default)

1 = IRQA interrupt is falling-edge sensitive.

5.6.31 Reserved—Base + $1E

5.6.32 Interrupt Priority Register 10 (IPR10)

Base + $1F

Read

15

0

14

0

13

0

12 11 10

9

0

8

0

7

6

5

4

3

2

1

0

FLEXCAN2_

MSGBUF IPL

FLEXCAN2_

WKUP IPL

FLEXCAN2_

BOFF IPL

FLEXCAN2_

ERR IPL

Write

0

1

0

RESET

Figure 5-27 Interrupt Priority Register 10 (IPR10)

Note: This register is NOT available in the 56F8165 device.

5.6.32.1 Reserved—Bits 15 - 8

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

5.6.32.2 FlexCAN2 Message Buffer Interrupt Priority Level

(FlexCAN2_MSGBUF IPL)—Bits 7 - 6

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

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Freescale Semiconductor

Resets

•

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.32.3 FlexCAN2 Wake Up Interrupt Priority Level (FlexCAN2_WKUP IPL)—

Bits 5 - 4

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.32.4 FlexCAN2 Error Interrupt Priority Level (FlexCAN2_ERR IPL)—Bits 3 - 2

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.6.32.5 FlexCAN2 Bus-Off Interrupt Priority Level (FlexCAN2_BOFF IPL)—

Bits 1 - 0

This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2.

They are disabled by default.

•

00 = IRQ disabled (default)

01 = IRQ is priority level 0

10 = IRQ is priority level 1

11 = IRQ is priority level 2

5.7 Resets

5.7.1

Reset Handshake Timing

The ITCN provides the 56800E core with a reset vector address whenever RESET is asserted. The reset

vector will be presented until the second rising clock edge after RESET is released.

5.7.2

ITCN After Reset

After reset, all of the ITCN registers are in their default states. This means all interrupts are disabled except

the core IRQs with fixed priorities:

•

Illegal Instruction

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

109

•

SW Interrupt 3

HW Stack Overflow

Misaligned Long Word Access

SW Interrupt 2

SW Interrupt 1

SW Interrupt 0

SW Interrupt LP

These interrupts are enabled at their fixed priority levels.

Part 6 System Integration Module (SIM)

6.1 Introduction

The SIM module is a system catchall for the glue logic that ties together the system-on-chip. It controls

distribution of resets and clocks and provides a number of control features. The system integration module

is responsible for the following functions:

•

Reset sequencing

Clock generation & distribution

Stop/Wait control

Pull-up enables for selected peripherals

System status registers

Registers for software access to the JTAG ID of the chip

Enforcing Flash security

These are discussed in more detail in the sections that follow.

6.2 Features

The SIM has the following features:

•

Flash security feature prevents unauthorized access to code/data contained in on-chip Flash memory

Power-saving clock gating for peripheral

Three power modes (Run, Wait, Stop) to control power utilization

— Stop mode shuts down the 56800E core, system clock, peripheral clock, and PLL operation

— Stop mode entry can optionally disable PLL and Oscillator (low power vs. fast restart); must be

explicitly done

— Wait mode shuts down the 56800E core and unnecessary system clock operation

— Run mode supports full part operation

•

Controls to enable/disable the 56800E core WAIT and STOP instructions

Calculates base delay for reset extension based upon POR or RESET operations. Reset delay will be 3 x 32

clocks (phased release of reset) for reset, except for POR, which is 2^21 clock cycles

56F8365 Technical Data, Rev. 9

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Freescale Semiconductor

Operating Modes

•

Controls reset sequencing after reset

Software-initiated reset

Four 16-bit registers reset only by a Power-On Reset usable for general-purpose software control

System Control Register

Registers for software access to the JTAG ID of the chip

6.3 Operating Modes

Since the SIM is responsible for distributing clocks and resets across the chip, it must understand the

various chip operating modes and take appropriate action. These are:

•

Reset Mode, which has two submodes:

— POR and RESET operation

The 56800E core and all peripherals are reset. This occurs when the internal POR is asserted or the

RESET pin is asserted.

— COP reset and software reset operation

The 56800E core and all peripherals are reset. The MA bit within the OMR is not changed. This allows

the software to determine the boot mode (internal or external boot) to be used on the next reset.

•

Run Mode

This is the primary mode of operation for this device. In this mode, the 56800E controls chip operation.

Debug Mode

The 56800E is controlled via JTAG/EOnCE when in debug mode. All peripherals, except the COP and

PWMs, continue to run. COP is disabled and PWM outputs are optionally switched off to disable any motor

from being driven; see the PWM chapter in the 56F8300 Peripheral User Manual for details.

•

Wait Mode

In Wait mode, the core clock and memory clocks are disabled. Optionally, the COP can be stopped.

Similarly, it is an option to switch off PWM outputs to disable any motor from being driven. All other

peripherals continue to run.

Stop Mode

When in Stop mode, the 56800E core, memory and most peripheral clocks are shut down. Optionally, the

COP and CAN can be stopped. For lowest power consumption in Stop mode, the PLL can be shut down.

This must be done explicitly before entering Stop mode, since there is no automatic mechanism for this. The

CAN (along with any non-gated interrupt) is capable of waking the chip up from Stop mode, but is not fully

functional in Stop mode.

6.4 Operating Mode Register

Bit

15

NL

R/W

0

14

13

12

11

10

9

0

8

CM

R/W

0

7

XP

R/W

0

6

SD

R/W

0

5

R

4

SA

R/W

0

3

EX

R/W

0

2

0

1

MB

R/W

X

0

MA

R/W

X

Type

R/W

0

RESET

Figure 6-1 OMR

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

111

The reset state for MB and MA will depend on the Flash secured state. See Part 4.2 and Part 7 for detailed

information on how the Operating Mode Register (OMR) MA and MB bits operate in this device. For

additional information on the EX bit, see Part 4.4. For all other bits, see the DSP56F800E Reference

Manual.

Note:

The OMR is not a Memory Map register; it is directly accessible in code through the acronym OMR.

6.5 Register Descriptions

Table 6-1 SIM Registers (SIM_BASE = $00 F350)

Address Offset

Base + $0

Base + $1

Base + $2

Base + $3

Base + $4

Base + $5

Base + $6

Base + $7

Base + $8

Address Acronym

SIM_CONTROL

SIM_RSTSTS

SIM_SCR0

Register Name

Control Register

Section Location

6.5.1

Reset Status Register

6.5.2

Software Control Register 0

Software Control Register 1

Software Control Register 2

Software Control Register 3

Most Significant Half of JTAG ID

Least Significant Half of JTAG ID

Pull-up Disable Register

6.5.3

SIM_SCR1

6.5.3

SIM_SCR2

6.5.3

SIM_SCR3

6.5.3

SIM_MSH_ID

SIM_LSH_ID

SIM_PUDR

6.5.4

6.5.5

6.5.6

Reserved

Base + $A

Base + $B

Base + $C

Base + $D

Base + $E

Base + $F

SIM_CLKOSR

SIM_GPS

CLKO Select Register

6.5.7

6.5.8

GPIO Peripheral Select Register

Peripheral Clock Enable Register

I/O Short Address Location High Register

I/O Short Address Location Low Register

Peripheral Clock Enable Register 2

SIM_PCE

6.5.9

SIM_ISALH

SIM_ISALL

SIM_PCE2

6.5.10

6.5.11

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Freescale Semiconductor

Register Descriptions

Add.

Offset

Register

Name

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

R

W

R

0

SIM_

CONTROL

ONCE

EBL0

SW

RST

STOP_

DISABLE

WAIT_

DISABLE

$0

$1

$2

$3

$4

$5

$6

$7

$8

0

SIM_

RSTSTS

SWR

COPR EXTR POR

W

R

SIM_SCR0

SIM_SCR1

SIM_SCR2

SIM_SCR3

FIELD

W

R

W

R

W

R

W

R

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

SIM_MSH_

ID

W

R

SIM_LSH_ID

W

R

EMI_

MODE

SIM_PUDR

Reserved

PWMA1 CAN

RESET IRQ XBOOT PWMB PWMA0

CTRL

JTAG

W

R

W

R

0

SIM_

CLKOSR

$A

$B

$C

$D

$E

$F

A23

0

A22

0

A21

0

A20 CLKDIS

CLKOSEL

C2

0

SIM_GPS

SIM_PCE

D1

D0

C3

C1

C0

W

R

EMI

1

ADCB ADCA

CAN

1

DEC1 DEC 0 TMRD TMRC TMRB TMRA

SCI1

1

SCI0

1

SPI1

1

SPI0 PWMB PWMA

W

R

1

0

1

0

1

0

1

0

1

0

1

SIM_ISALH

SIM_ISALL

SIM_PCE2

ISAL[23:22]

W

R

ISAL[21:6]

W

R

0

CAN2

W

= Reserved

Figure 6-2 SIM Register Map Summary

6.5.1

SIM Control Register (SIM_CONTROL)

Base + $0

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

0

7

0

6

0

5

4

3

2

1

0

Read

Write

ONCE SW

EBL0 RST

STOP_

DISABLE

WAIT_

DISABLE

0

RESET

Figure 6-3 SIM Control Register (SIM_CONTROL)

6.5.1.1

Reserved—Bits 15–6

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

6.5.1.2

OnCE Enable (OnCE EBL)—Bit 5

•

0 = OnCE clock to 56800E core enabled when core TAP is enabled

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

113

•

1 = OnCE clock to 56800E core is always enabled

6.5.1.3

Software Reset (SW RST)—Bit 4

This bit is always read as 0. Writing a 1 to this bit will cause the part to reset.

6.5.1.4

Stop Disable (STOP_DISABLE)—Bits 3–2

•

00 = Stop mode will be entered when the 56800E core executes a STOP instruction

01 = The 56800E STOP instruction will not cause entry into Stop mode; STOP_DISABLE can be

reprogrammed in the future

•

10 = The 56800E STOP instruction will not cause entry into Stop mode; STOP_DISABLE can then only be

changed by resetting the device

11 = Same operation as 10

6.5.1.5

Wait Disable (WAIT_DISABLE)—Bits 1–0

•

00 = Wait mode will be entered when the 56800E core executes a WAIT instruction

01 = The 56800E WAIT instruction will not cause entry into Wait mode; WAIT_DISABLE can be

reprogrammed in the future

•

10 = The 56800E WAIT instruction will not cause entry into Wait mode; WAIT_DISABLE can then only

be changed by resetting the device

•

11 = Same operation as 10

6.5.2

SIM Reset Status Register (SIM_RSTSTS)

Bits in this register are set upon any system reset and are initialized only by a Power-On Reset (POR). A

reset (other than POR) will only set bits in the register; bits are not cleared. Only software should clear this

register.

Base + $1

Read

15

0

14

0

13

O

12

0

11

0

10

0

9

0

8

0

7

0

6

0

5

4

3

2

1

0

SWR COPR

EXTR POR

Write

RESET

0

Figure 6-4 SIM Reset Status Register (SIM_RSTSTS)

6.5.2.1

Reserved—Bits 15–6

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

6.5.2.2

Software Reset (SWR)—Bit 5

When 1, this bit indicates that the previous reset occurred as a result of a software reset (write to SW RST

bit in the SIM_CONTROL register). This bit will be cleared by any hardware reset or by software. Writing

a 0 to this bit position will set the bit, while writing a 1 to the bit will clear it.

6.5.2.3

COP Reset (COPR)—Bit 4

When 1, the COPR bit indicates the Computer Operating Properly (COP) timer-generated reset has

56F8365 Technical Data, Rev. 9

114

Freescale Semiconductor

Register Descriptions

occurred. This bit will be cleared by a Power-On Reset or by software. Writing a 0 to this bit position will

set the bit, while writing a 1 to the bit will clear it.

6.5.2.4

External Reset (EXTR)—Bit 3

If 1, the EXTR bit indicates an external system reset has occurred. This bit will be cleared by a Power-On

Reset or by software. Writing a 0 to this bit position will set the bit, while writing a 1 to the bit position

will clear it. Basically, when the EXTR bit is 1, the previous system reset was caused by the external

RESET pin being asserted low.

6.5.2.5

Power-On Reset (POR)—Bit 2

When 1, the POR bit indicates a Power-On Reset occurred some time in the past. This bit can only be

cleared by software or by another type of reset. Writing a 0 to this bit will set the bit, while writing a 1 to

the bit position will clear the bit. In summary, if the bit is 1, the previous system reset was due to a

Power-On Reset.

6.5.2.6

Reserved—Bits 1–0

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

6.5.3

SIM Software Control Registers (SIM_SCR0, SIM_SCR1, SIM_SCR2,

and SIM_SCR3)

Only SIM_SCR0 is shown in this section. SIM_SCR1, SIM_SCR2, and SIM_SCR3 are identical in

functionality.

Base + $2

Read

15

14

13

12

11

10

9

8

7

6

5

4

3

2

0

1

0

FIELD

0

Write

0

POR

Figure 6-5 SIM Software Control Register 0 (SIM_SCR0)

Software Control Data 1 (FIELD)—Bits 15–0

6.5.3.1

This register is reset only by the Power-On Reset (POR). It has no part-specific functionality and is

intended for use by a software developer to contain data that will be unaffected by the other reset sources

(RESET pin, software reset, and COP reset).

6.5.4

Most Significant Half of JTAG ID (SIM_MSH_ID)

This read-only register displays the most significant half of the JTAG ID for the chip. This register reads

$01D6.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

115

Base + $6

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

1

7

1

6

1

5

0

4

1

3

0

2

1

0

Write

RESET

0

1

0

1

0

1

0

Figure 6-6 Most Significant Half of JTAG ID (SIM_MSH_ID)

6.5.5

Least Significant Half of JTAG ID (SIM_LSH_ID)

This read-only register displays the least significant half of the JTAG ID for the chip. This register reads

$D01D.

Base + $7

Read

15

1

14

1

13

0

12

1

11

0

10

0

9

0

8

0

7

0

6

0

5

0

4

1

3

1

2

1

0

1

Write

RESET

1

0

1

0

1

0

1

Figure 6-7 Least Significant Half of JTAG ID (SIM_LSH_ID)

6.5.6

SIM Pull-up Disable Register (SIM_PUDR)

Most of the pins on the chip have on-chip pull-up resistors. Pins which can operate as GPIO can have these

resistors disabled via the GPIO function. Non-GPIO pins can have their pull-ups disabled by setting the

appropriate bit in this register. Disabling pull-ups is done on a peripheral-by-peripheral basis (for pins not

muxed with GPIO). Each bit in the register (see Figure 6-8) corresponds to a functional group of pins. See

Table 2-2 to identify which pins can deactivate the internal pull-up resistor.

Base + $8

Read

15

0

14

13

12

11

10

9

8

7

6

0

5

CTRL

0

4

0

3

JTAG

0

2

0

1

0

EMI_

MODE

PWMA1 CAN

RESET IRQ XBOOT PWMB PWMA0

Write

0

RESET

Figure 6-8 SIM Pull-up Disable Register (SIM_PUDR)

6.5.6.1

Reserved—Bit 15

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

6.5.6.2

PWMA1—Bit 14

This bit controls the pull-up resistors on the FAULTA3 pin.

56F8365 Technical Data, Rev. 9

116

Freescale Semiconductor

Register Descriptions

6.5.6.3

CAN—Bit 13

This bit controls the pull-up resistors on the CAN_RX pin.

6.5.6.4

EMI_MODE—Bit 12

This bit controls the pull-up resistors on the EMI_MODE pin.

Note:

In this package, this input pin is double-bonded with the adjacent V_SSpin and this bit should be

changed to a 1 in order to reduce power consumption.

6.5.6.5

RESET—Bit 11

This bit controls the pull-up resistors on the RESET pin.

6.5.6.6

IRQ—Bit 10

This bit controls the pull-up resistors on the IRQA and IRQB pins.

6.5.6.7

XBOOT—Bit 9

This bit controls the pull-up resistors on the EXTBOOT pin.

Note:

In this package, this input pin is double-bonded with the adjacent V_SSpin and this bit should be

changed to a 1 in order to reduce power consumption.

6.5.6.8

PWMB—Bit 8

This bit controls the pull-up resistors on the FAULTB0, FAULTB1, FAULTB2, and FAULTB3 pins.

6.5.6.9 PWMA0—Bit 7

This bit controls the pull-up resistors on the FAULTA0, FAULTA1, and FAULTA2 pins.

6.5.6.10 Reserved—Bit 6

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

6.5.6.11 CTRL—Bit 5

This bit controls the pull-up resistors on the WR and RD pins.

6.5.6.12 Reserved—Bit 4

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

6.5.6.13 JTAG—Bit 3

This bit controls the pull-up resistors on the TRST, TMS and TDI pins.

6.5.6.14 Reserved—Bit 2–0

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

117

6.5.7

CLKO Select Register (SIM_CLKOSR)

The CLKO select register can be used to multiplex out any one of the clocks generated inside the clock

generation and SIM modules. The default value is SYS_CLK. This path has been optimized in order to

minimize any delay and clock duty cycle distortion. All other clocks primarily muxed out are for test

purposes only, and are subject to significant phase shift at high frequencies.

The upper four bits of the GPIOB register can function as GPIO, [A23:A20], or as additional clock output

signals. GPIO has priority and is enabled/disabled via the GPIOB_PER. If GPIOB[7:4] are programmed

to operate as peripheral outputs, then the choice between [A23:A20] and additional clock outputs is done

here in the CLKOSR. The default state is for the peripheral function of GPIOB[7:4] to be programmed as

[A23:A20]. This can be changed by altering [A23:A20], as shown in Figure 6-9.

Base + $A

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

A23

0

8

A22

0

7

A21

0

6

A20

0

5

4

0

3

0

2

CLKOSEL

0

1

0

CLK

DIS

Write

RESET

0

1

Figure 6-9 CLKO Select Register (SIM_CLKOSR)

6.5.7.1

Reserved—Bits 15–10

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

6.5.7.2

Alternate GPIO_B Peripheral Function for A23 (A23)—Bit 9

•

0 = Peripheral output function of GPIOB[7] is defined to be A[23]

1 = Peripheral output function of GPIOB[7] is defined to be the oscillator_clock (MSTR_OSC, see

Figure 3-4)

6.5.7.3

Alternate GPIO_B Peripheral Function for A22 (A22)—Bit 8

•

0 = Peripheral output function of GPIOB[6] is defined to be A[22]

1 = Peripheral output function of GPIOB[6] is defined to be SYS_CLK2

6.5.7.4

Alternate GPIO_B Peripheral Function for A21 (A21)—Bit 7

•

0 = Peripheral output function of GPIOB[5] is defined to be A[21]

1 = Peripheral output function of GPIOB[5] is defined to be SYS_CLK

6.5.7.5

Alternate GPIO_B Peripheral Function for A20 (A20)—Bit 6

•

0 = Peripheral output function of GPIOB[4] is defined to be A[20]

1 = Peripheral output function of GPIOB[4] is defined to be the prescaler_clock (FREF, see Figure 3-4)

6.5.7.6

Clockout Disable (CLKDIS)—Bit 5

•

0 = CLKOUT output is enabled and will output the signal indicated by CLKOSEL

1 = CLKOUT is tri-stated

56F8365 Technical Data, Rev. 9

118

Freescale Semiconductor

Register Descriptions

6.5.7.7

CLockout Select (CLKOSEL)—Bits 4–0

Selects clock to be muxed out on the CLKO pin.

•

00000 = SYS_CLK (from OCCS - DEFAULT)

00001 = Reserved for factory test—56800E clock

00010 = Reserved for factory test—XRAM clock

00011 = Reserved for factory test—PFLASH odd clock

00100 = Reserved for factory test—PFLASH even clock

00101 = Reserved for factory test—BFLASH clock

00110 = Reserved for factory test—DFLASH clock

00111 = Oscillator output

01000 = F_out(from OCCS)

•

01001 = Reserved for factory test—IPB clock

01010 = Reserved for factory test—Feedback (from OCCS, this is path to PLL)

01011 = Reserved for factory test—Prescaler clock (from OCCS)

01100 = Reserved for factory test—Postscaler clock (from OCCS)

01101 = Reserved for factory test—SYS_CLK2 (from OCCS)

01110 = Reserved for factory test—SYS_CLK_DIV2

01111 = Reserved for factory test—SYS_CLK_D

10000 = ADCA clock

10001 = ADCB clock

6.5.8

GPIO Peripheral Select Register (SIM_GPS)

Some GPIO pads can have more than one peripheral selected as the alternate function instead of GPIO.

For these pads, this register selects which of the alternate peripherals are actually selected for the GPIO

peripheral function. This applies to GPIOC, pins 0-3, and to GPIOD, pins 0 and 1.

The GPIOC Peripheral Select Register can be used to multiplex out any one of the three alternate

peripherals for GPIOC. The default peripheral is Quad Decoder 1 and Quad Timer B (NOT available in

the 56F8165 device); these peripherals work together.

The four I/O pins associated with GPIOC can function as GPIO, Quad Decoder 1/Quad Timer B, or as

SPI 1 signals. GPIO is not the default and is enabled/disabled via the GPIOC_PER, as shown in

Figure 6-10 and Table 6-2. When GPIOC[3:0] are programmed to operate as peripheral I/O, then the

choice between decoder/timer and SPI inputs/outputs is made in the SIM_GPS and in conjunction with the

Quad Timer Status and Control Registers (SCR). The default state is for the peripheral function of

GPIOC[3:0] to be programmed as decoder functions. This can be changed by altering the appropriate

controls in the indicated registers.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

119

GPIOC_PER Register

GPIO Controlled

0

1

I/O Pad Control

SIM_ GPS Register

0

1

Quad Timer Controlled

SPI Controlled

Figure 6-10 Overall Control of GPIOC Pads Using SIM_GPS Control

1

Table 6-2 Control of GPIOC Pads Using SIM_GPS Control

Control Registers

Pin Function

Comments

GPIO Input

0

1

0

1

—

0

—

0

GPIO Output

Quad Timer Input / Quad

Decoder Input ²

—

See the “Switch Matrix for Inputs to the Timer”

table in the 56F8300 Peripheral User Manual

for the definition of timer inputs based on the

Quad Decoder mode configuration.

Quad Timer Output / Quad

Decoder Input ³

1

—

0

1

SPI input

1

—

1

—

See SPI controls for determining the direction

of each of the SPI pins.

SPI output

1. This applies to the four pins that serve as Quad Decoder / Quad Timer / SPI / GPIOC functions. A separate set of control bits

is used for each pin.

2. Reset configuration

3. Quad Decoder pins are always inputs and function in conjunction with the Quad Timer pins.

Two Input/Output pins associated with GPIOD can function as GPIO, EMI (default peripheral) or CAN2

signals. GPIO is the default and is enabled/disabled via the GPIOD_PER, as shown in Figure 6-11 and

Table 6-3. When GPIOD[1:0] are programmed to operate as peripheral input/output, then the choice

between EMI and CAN2 inputs/outputs is made here in the GPS.

56F8365 Technical Data, Rev. 9

120

Freescale Semiconductor

Register Descriptions

GPIOD_PER Register

GPIO Controlled

0

1

I/O Pad Control

SIM_ GPS Register

0

1

EMI Controlled

CAN2 Controlled

Figure 6-11 Overall Control of GPIOD Pads Using SIM_GPS Control

1

Table 6-3 Control of GPIOD Pads Using SIM_GPS Control

Control Registers

Pin Function

Comments

GPIO Input

GPIO Output

EMI I/O

0

1

0

1

—

0

—

EMI CSn pins are always outputs

CAN2

1

CAN2_TX is always an output

CAN2_RX is always an input

1. This applies to the two pins that serve as EMI CSn / CAN2 / GPIOD functions. A separate set of control

bits is used for each pin.

Base + $B

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

0

7

0

6

0

5

D1

0

4

D0

0

3

C3

0

2

C2

0

1

C1

0

C0

0

Write

0

RESET

Figure 6-12 GPIO Peripheral Select Register (SIM_GPS)

Reserved—Bits 15–6

6.5.8.1

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

121

6.5.8.2

GPIOD1 (D1)—Bit 5

This bit selects the alternate function for GPIOD1.

•

0 = CS3

1 = CAN2_RX

6.5.8.3

GPIOD0 (D0)—Bit 4

•

0 = CS2

1 = CAN2_TX

6.5.8.4

GPIOC3 (C3)—Bit 3

This bit selects the alternate function for GPIOC3.

•

0 = HOME1/TB3 (default - see “Switch Matrix Mode” bits of the Quad Decoder DECCR register in the

56F8300 Peripheral User Manual)

•

1 = SS1

6.5.8.5

GPIOC2 (C2)—Bit 2

This bit selects the alternate function for GPIOC2.

•

0 = INDEX1/TB2 (default)

1 = MISO1

6.5.8.6

GPIOC1 (C1)—Bit 1

This bit selects the alternate function for GPIOC1.

•

0 = PHASEB1/TB1 (default)

1 = MOSI1

6.5.8.7

GPIOC0 (C0)—Bit 0

This bit selects the alternate function for GPIOC0.

•

0 = PHASEA1/TB0 (default)

1 = SCLK1

6.5.9

Peripheral Clock Enable Register (SIM_PCE)

The Peripheral Clock Enable register is used to enable or disable clocks to the peripherals as a power

savings feature. The clocks can be individually controlled for each peripheral on the chip.

56F8365 Technical Data, Rev. 9

122

Freescale Semiconductor

Register Descriptions

Base + $C

Read

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

EMI ADCB ADCA CAN DEC1 DEC0 TMRD TMRC TMRB TMRA SCI1 SCI0 SPI1

SPI0 PWMB PWMA

Write

1

RESET

Figure 6-13 Peripheral Clock Enable Register (SIM_PCE)

6.5.9.1

External Memory Interface Enable (EMI)—Bit 15

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.2

Analog-to-Digital Converter B Enable (ADCB)—Bit 14

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.3

Analog-to-Digital Converter A Enable (ADCA)—Bit 13

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.4

FlexCAN Enable (CAN)—Bit 12

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.5

Decoder 1 Enable (DEC1)—Bit 11

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.6

Decoder 0 Enable (DEC0)—Bit 10

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

123

6.5.9.7

Quad Timer D Enable (TMRD)—Bit 9

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.8

Quad Timer C Enable (TMRC)—Bit 8

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.9

Quad Timer B Enable (TMRB)—Bit 7

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.10 Quad Timer A Enable (TMRA)—Bit 6

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.11 Serial Communications Interface 1 Enable (SCI1)—Bit 5

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.12 Serial Communications Interface 0 Enable (SCI0)—Bit 4

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.13 Serial Peripheral Interface 1 Enable (SPI1)—Bit 3

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.14 Serial Peripheral Interface 0 Enable (SPI0)—Bit 2

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

56F8365 Technical Data, Rev. 9

124

Freescale Semiconductor

Register Descriptions

•

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.15 Pulse Width Modulator B Enable (PWMB)—Bit 1

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.9.16 Pulse Width Modulator A Enable (PWMA)—Bit 0

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.5.10 I/O Short Address Location Register (SIM_ISALH and SIM_ISALL)

The I/O Short Address Location registers are used to specify the memory referenced via the I/O short

address mode. The I/O short address mode allows the instruction to specify the lower six bits of address;

the upper address bits are not directly controllable. This register set allows limited control of the full

address, as shown in Figure 6-14.

Note:

If this register is set to something other than the top of memory (EOnCE register space) and the EX bit

in the OMR is set to 1, the JTAG port cannot access the on-chip EOnCE registers, and debug functions

will be affected.

Instruction Portion

“Hard Coded” Address Portion

6 Bits from I/O Short Address Mode Instruction

16 Bits from SIM_ISALL Register

2 Bits from SIM_ISALH Register

Full 24-Bit for Short I/O Address

Figure 6-14 I/O Short Address Determination

With this register set, an interrupt driver can set the SIM_ISALL register pair to point to its peripheral

registers and then use the I/O Short addressing mode to reference them. The ISR should restore this register

to its previous contents prior to returning from interrupt.

Note:

The default value of this register set points to the EOnCE registers.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

125

Note:

The pipeline delay between setting this register set and using short I/O addressing with the new value

is three cycles.

Base + $D

Read

15

1

14

1

13

1

12

1

11

1

10

1

9

1

8

1

7

1

6

1

5

1

4

1

3

1

2

1

0

ISAL[23:22]

Write

1

RESET

Figure 6-15 I/O Short Address Location High Register (SIM_ISALH)

6.5.10.1 Input/Output Short Address Low (ISAL[23:22])—Bit 1–0

This field represents the upper two address bits of the “hard coded” I/O short address.

Base + $E

Read

15

1

14

1

13

1

12

1

11

1

10

1

9

1

8

7

6

1

5

1

4

1

3

1

2

1

0

1

ISAL[21:6]

Write

1

RESET

Figure 6-16 I/O Short Address Location Low Register (SIM_ISAL)

6.5.10.2 Input/Output Short Address Low (ISAL[21:6])—Bit 15–0

This field represents the lower 16 address bits of the “hard coded” I/O short address.

6.5.11 Peripheral Clock Enable Register 2 (SIM_PCE2)

The Peripheral Clock Enable Register 2 is used to enable or disable clocks to the peripherals as a

power-saving feaure. The clocks can be individually controller for each peripheral on the chip.

Base + $D

Read

15

0

14

0

13

0

12

0

11

0

10

0

9

0

8

0

7

0

6

0

5

0

4

0

3

0

2

0

1

0

CAN

2

Write

0

1

RESET

6.5.11.1 Reserved—Bits 15–1

This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing.

6.5.11.2 CAN2 Enable—Bit 0

Each bit controls clocks to the indicated peripheral.

•

1 = Clocks are enabled

56F8365 Technical Data, Rev. 9

126

Freescale Semiconductor

Clock Generation Overview

•

0 = The clock is not provided to the peripheral (the peripheral is disabled)

6.6 Clock Generation Overview

The SIM uses an internal master clock from the OCCS (CLKGEN) module to produce the peripheral and

system (core and memory) clocks. The maximum master clock frequency is 120MHz. Peripheral and

system clocks are generated at half the master clock frequency and therefore at a maximum 60MHz. The

SIM provides power modes (Stop, Wait) and clock enables (SIM_PCE register, CLK_DIS, ONCE_EBL)

to control which clocks are in operation. The OCCS, power modes, and clock enables provide a flexible

means to manage power consumption.

Power utilization can be minimized in several ways. In the OCCS, crystal oscillator, and PLL may be shut

down when not in use. When the PLL is in use, its prescaler and postscaler can be used to limit PLL and

master clock frequency. Power modes permit system and/or peripheral clocks to be disabled when unused.

Clock enables provide the means to disable individual clocks. Some peripherals provide further controls

to disable unused subfunctions. Refer to Part 3 On-Chip Clock Synthesis (OCCS), and the 56F8300

Peripheral User Manual for further details.

6.7 Power-Down Modes Overview

The 56F8365/56F8165 operates in one of three power-down modes, as shown in Table 6-4.

Table 6-4 Clock Operation in Power-Down Modes

Mode

Core Clocks

Active

Peripheral Clocks

Description

Device is fully functional

Run

Wait

Active

Core and memory

clocks disabled

Peripherals are active and can produce interrupts if

they have not been masked off.

Interrupts will cause the core to come out of its

suspended state and resume normal operation.

Typically used for power-conscious applications.

Stop

System clocks continue to be generated in The only possible recoveries from Stop mode are:

the SIM, but most are gated prior to

reaching memory, core and peripherals.

1. CAN traffic (1st message will be lost)

2. Non-clocked interrupts

3. COP reset

4. External reset

5. Power-on reset

All peripherals, except the COP/watchdog timer, run off the IPbus clock frequency, which is the same as

the main processor frequency in this architecture. The maximum frequency of operation is

SYS_CLK = 60MHz.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

127

6.8 Stop and Wait Mode Disable Function

Permanent

D

Q

Disable

D-FLOP

C

56800E

Reprogrammable

Disable

STOP_DIS

D

Q

D-FLOP

Clock

Select

C

R

Note: Wait disable circuit is similar

Reset

Figure 6-17 Internal Stop Disable Circuit

The 56800E core contains both STOP and WAIT instructions. Both put the CPU to sleep. For lowest

power consumption in Stop mode, the PLL can be shut down. This must be done explicitly before entering

Stop mode, since there is no automatic mechanism for this. When the PLL is shut down, the 56800E

system clock must be set equal to the oscillator output.

Some applications require the 56800E STOP and WAIT instructions be disabled. To disable those

instructions, write to the SIM control register (SIM_CONTROL), described in Part 6.5.1. This procedure

can be on either a permanent or temporary basis. Permanently assigned applications last only until their

next reset.

6.9 Resets

The SIM supports four sources of reset. The two asynchronous sources are the external RESET pin and

the Power-On Reset (POR). The two synchronous sources are the software reset, which is generated within

the SIM itself by writing to the SIM_CONTROL register, and the COP reset.

Reset begins with the assertion of any of the reset sources. Release of reset to various blocks is sequenced

21

to permit proper operation of the device. A POR reset is first extended for 2 clock cycles to permit

stabilization of the clock source, followed by a 32 clock window in which SIM clocking is initiated. It is

then followed by a 32 clock window in which peripherals are released to implement Flash security, and,

finally, followed by a 32 clock window in which the core is initialized. After completion of the described

reset sequence, application code will begin execution.

56F8365 Technical Data, Rev. 9

128

Freescale Semiconductor

Operation with Security Enabled

Resets may be asserted asynchronously, but are always released internally on a rising edge of the system

clock.

Part 7 Security Features

The 56F8365/56F8165 offers security features intended to prevent unauthorized users from reading the

contents of the Flash Memory (FM) array. The Flash security consists of several hardware interlocks that

block the means by which an unauthorized user could gain access to the Flash array.

However, part of the security must lie with the user’s code. An extreme example would be user’s code that

dumps the contents of the internal program, as this code would defeat the purpose of security. At the same

time, the user may also wish to put a “backdoor” in his program. As an example, the user downloads a

security key through the SCI, allowing access to a programming routine that updates parameters stored in

another section of the Flash.

7.1 Operation with Security Enabled

Once the user has programmed the Flash with his application code, the device can be secured by

programming the security bytes located in the FM configuration field, which occupies a portion of the FM

array. These non-volatile bytes will keep the part secured through reset and through power-down of the

device. Only two bytes within this field are used to enable or disable security. Refer to the Flash Memory

section in the 56F8300 Peripheral User Manual for the state of the security bytes and the resulting state

of security. When Flash security mode is enabled in accordance with the method described in the Flash

Memory module specification, the device will disable the core EOnCE debug capabilities. Normal

program execution is otherwise unaffected.

7.2 Flash Access Blocking Mechanisms

The 56F8365/56F8165 have several operating functional and test modes. Effective Flash security must

address operating mode selection and anticipate modes in which the on-chip Flash can be compromised

and read without explicit user permission. Methods to block these are outlined in the next subsections.

7.2.1

Forced Operating Mode Selection

At boot time, the SIM determines in which functional modes the device will operate. These are:

•

Unsecured Mode

Secure Mode (EOnCE disabled)

When Flash security is enabled as described in the Flash Memory module specification, the device will

disable the EOnCE debug interface.

7.2.2

Disabling EOnCE Access

On-chip Flash can be read by issuing commands across the EOnCE port, which is the debug interface for

the 56800E core. The TRST, TCLK, TMS, TDO, and TDI pins comprise a JTAG interface onto which the

EOnCE port functionality is mapped. When the device boots, the chip-level JTAG TAP (Test Access Port)

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

129

is active and provides the chip’s boundary scan capability and access to the ID register.

Proper implementation of Flash security requires that no access to the EOnCE port is provided when

security is enabled. The 56800E core has an input which disables reading of internal memory via the

JTAG/EOnCE. The FM sets this input at reset to a value determined by the contents of the FM security

bytes.

7.2.3

Flash Lockout Recovery

If a user inadvertently enables Flash security on the device, a built-in lockout recovery mechanism can be

used to reenable access to the device. This mechanism completely reases all on-chip Flash, thus disabling

Flash security. Access to this recovery mechanism is built into CodeWarrior via an instruction in memory

configuration (.cfg) files. Add, or uncomment the following configuration command:

unlock_flash_on_connect 1

For more information, please see CodeWarrior MC56F83xx/DSP5685x Family Targeting Manual.

The LOCKOUT_RECOVERY instruction has an associated 7-bit Data Register (DR) that is used to

control the clock divider circuit within the FM module. This divider, FM_CLKDIV[6:0], is used to control

the period of the clock used for timed events in the FM erase algorithm. This register must be set with

appropriate values before the lockout sequence can begin. Refer to the JTAG section of the 56F8300

Peripheral User Manual for more details on setting this register value.

The value of the JTAG FM_CLKDIV[6:0] will replace the value of the FM register FMCLKD that divides

down the system clock for timed events, as illustrated in Figure 7-1. FM_CLKDIV[6] will map to the

PRDIV8 bit, and FM_CLKDIV[5:0] will map to the DIV[5:0] bits. The combination of PRDIV8 and DIV

must divide the FM input clock down to a frequency of 150kHz-200kHz. The “Writing the FMCLKD

Register” section in the Flash Memory chapter of the 56F8300 Peripheral User Manual gives specific

equations for calculating the correct values.

56F8365 Technical Data, Rev. 9

130

Freescale Semiconductor

Flash Access Blocking Mechanisms

Flash Memory

SYS_CLK

2

input

clock

DIVIDER

7

FMCLKD

7

FM_CLKDIV

FM_ERASE

JTAG

Figure 7-1 JTAG to FM Connection for Lockout Recovery

Two examples of FM_CLKDIV calculations follow.

EXAMPLE 1: If the system clock is the 8MHz crystal frequency because the PLL has not been set up,

the input clock will be below 12.8MHz, so PRDIV8 = FM_CLKDIV[6] = 0. Using the following equation

yields a DIV value of 19 for a clock of 200kHz, and a DIV value of 20 for a clock of 190kHz. This

translates into an FM_CLKDIV[6:0] value of $13 or $14, respectively.

SYS_CLK

( )

(2)

150[kHz]

200[kHz]

<

(DIV + 1)

EXAMPLE 2: In this example, the system clock has been set up with a value of 32MHz, making the FM

input clock 16MHz. Because that is greater than 12.8MHz, PRDIV = FM_CLKDIV[6] = 1. Using the

following equation yields a DIV value of 9 for a clock of 200kHz, and a DIV value of 10 for a clock of

181kHz. This translates to an FM_CLKDIV[6:0] value of $49 or $4A, respectively.

SYS_CLK

( )

(2)(8)

150[kHz]

200[kHz]

<

(DIV + 1)

Once the LOCKOUT_RECOVERY instruction has been shifted into the instruction register, the clock

divider value must be shifted into the corresponding 7-bit data register. After the data register has been

updated, the user must transition the TAP controller into the RUN-TEST/IDLE state for the lockout

sequence to commence. The controller must remain in this state until the erase sequence has completed.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

131

For details, see the JTAG Section in the 56F8300 Peripheral User Manual.

Note:

Once the lockout recovery sequence has completed, the user must reset both the JTAG TAP controller

(by asserting TRST) and the device (by asserting external chip reset) to return to normal unsecured

operation.

7.2.4

Product Analysis

The recommended method of unsecuring a programmed device for product analysis of field failures is via

the backdoor key access. The customer would need to supply Technical Support with the backdoor key

and the protocol to access the backdoor routine in the Flash. Additionally, the KEYEN bit that allows

backdoor key access must be set.

An alternative method for performing analysis on a secured hybrid controller would be to mass-erase and

reprogram the Flash with the original code, but to modify the security bytes.

To insure that a customer does not inadvertently lock himself out of the device during programming, it is

recommended that he program the backdoor access key first, his application code second, and the security

bytes within the FM configuration field last.

56F8365 Technical Data, Rev. 9

132

Freescale Semiconductor

Introduction

Part 8 General Purpose Input/Output (GPIO)

8.1 Introduction

This section is intended to supplement the GPIO information found in the 56F8300 Peripheral User

Manual and contains only chip-specific information. This information supercedes the generic information

in the 56F8300 Peripheral User Manual.

8.2 Memory Maps

The width of the GPIO port defines how many bits are implemented in each of the GPIO registers. Based

on this and the default function of each of the GPIO pins, the reset values of the GPIOx_PUR and

GPIOx_PER registers change from port to port. Tables 4-29 through 4-34 define the actual reset values of

these registers.

8.3 Configuration

There are six GPIO ports defined on the 56F8365/56F8165. The width of each port and the associated

peripheral function is shown in Table 8-1 and Table 8-2. The specific mapping of GPIO port pins is

shown in Table 8-3.

Table 8-1 56F8365 GPIO Ports Configuration

Available

Port

GPIO Port

Pins in

Peripheral Function

Reset Function

Width

56F8365

EMI Address

N/A

A

B

C

14

6

5

6 pins - EMI Address pins - Can only be used as GPIO

8 pins - EMI Address pins - Not available in this package

GPIO

N/A

8

5 pins - EMI Address pins - Can only be used as GPIO

3 pins - EMI Address pins - Not available in this package

DEC1 / TMRB

DEC0 / TMRA

PWMA current

sense

11

4 pins -DEC1 / TMRB / SPI1

4 pins -DEC0 / TMRA

3 pins -PWMA current sense

EMI Chip Selects

SCI1

N/A

PWMB current

sense

D

E

13

14

11

12

2 pins - EMI CSn

4 pins - EMI CSn - Can only be used as GPIO

2 pins - SCI1

2 pins - EMI CSn - Not available in this package

3 pins -PWMB current sense

2 pins - SCI0

SCI0

N/A

2 pins - EMI Address pins - Not available in this package

4 pins - SPI0

2 pins - TMRC

4 pins - TMRD

SPI0

TMRC

TMRD

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

133

Table 8-1 56F8365 GPIO Ports Configuration

Available

Pins in

56F8365

Port

Width

GPIO Port

Peripheral Function

Reset Function

EMI Data

N/A

F

16

4

4 pins - EMI Data - Can only be used as GPIO

12 pins - EMI Data - Not available in this package

Table 8-2 56F8165 GPIO Ports Configuration

Available

Pins in

56F8165

Port

Width

GPIO Port

Peripheral Function

Reset Function

6 pins - EMI Address pins - Can only be used as GPIO

8 pins - EMI Address pins - Not available in this package

EMI Address

N/A

A

B

C

14

8

6

5

5 pins - EMI Address pins - Can only be used as GPIO

3 pins - EMI Address pins - Not available in this package

GPIO

N/A

4 pins - SPI1

4 pins - DEC0 / TMRA

3 pins - Dedicated GPIO

DEC1 / TMRB

DEC0 / TMRA

GPIO

11

6 pins - EMI CSn - Can only be used as GPIO

2 pins - SCI1

2 pins - EMI CSn - Not available in this package

3 pins - PWMB current sense

EMI Chip Selects

SCI1

N/A

PWMB current

sense

D

E

F

13

14

16

11

12

4

2 pins - SCI0

SCI0

N/A

SPI0

TMRC

GPIO

2 pins - EMI Address pins - Not available in this package

4 pins - SPI0

2 pins - TMRC

4 pins - Dedicated GPIO

4 pins - EMI Data - Can only be used as GPIO

12 pins - EMI Data - Not available in this package

EMI Data

N/A

56F8365 Technical Data, Rev. 9

134

Freescale Semiconductor

Configuration

Table 8-3 GPIO External Signals Map

Pins in shaded rows are not available in 56F8365 / 56F8165

Pins in italics are NOT available in the 56F8165 device

Reset Function

Peripheral

Functional Signal

Package Pin #

GPIO Port

GPIO Bit

A8¹

A9¹

0

1

2

3

4

5

15

16

17

18

19

20

A10¹

A11¹

A12¹

A13¹

6

7

N/A

GPIO

GPIOA

8

9

10

11

12

13

0

A16¹

A17¹

A18¹

27

28

29

30

31

1

2

3

GPIO

A19¹

GPIOB

4

5

6

7

GPIO

N/A

A20 / Prescaler_clock

N/A

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

135

Table 8-3 GPIO External Signals Map (Continued)

Pins in shaded rows are not available in 56F8365 / 56F8165

Pins in italics are NOT available in the 56F8165 device

Reset Function

Peripheral

Functional Signal

Package Pin #

GPIO Port

GPIO Bit

PhaseA1 / TB0 / SCLK1²

PhaseB1 / TB1 / MOSI1²

Index1 / TB2 / MISO1²

0

1

2

3

9

Peripheral

10

11

12

Peripheral

Home1 / TB3 / SS1²

PhaseA0 / TA0

PhaseB0 / TA1

Index0 / TA2

Home0 / TA3

ISA0

Peripheral

4

5

Peripheral

GPIO

127

128

1

GPIOC

6

7

2

8

104

105

106

42

9

ISA1

10

0

ISA2

CS2 / CAN2_TX

CS3 / CAN2_RX

1

GPIO

43

CS4¹

CS5¹

CS6¹

2

GPIO

44

3

4

5

GPIO

45

46

47

CS7¹

TXD1

RXD1

GPIO D

6

7

Peripheral

N/A

40

41

8

9

N/A

10

11

12

Peripheral

ISB0

ISB1

ISB2

48

50

51

56F8365 Technical Data, Rev. 9

136

Freescale Semiconductor

Configuration

Table 8-3 GPIO External Signals Map (Continued)

Pins in shaded rows are not available in 56F8365 / 56F8165

Pins in italics are NOT available in the 56F8165 device

Reset Function

Functional Signal

Package Pin #

GPIO Port

GPIO Bit

0

1

Peripheral

N/A

TXD0

RXD0

7

8

2

3

N/A

4

Peripheral

SCLK0

MOSI0

MISO0

SS0

124

126

125

123

111

113

107

108

109

110

5

6

GPIOE

7

8

TC0

9

TC1

10

11

12

13

TD0

TD1

TD2

TD3

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

137

Table 8-3 GPIO External Signals Map (Continued)

Pins in shaded rows are not available in 56F8365 / 56F8165

Pins in italics are NOT available in the 56F8165 device

Reset Function

Peripheral

Functional Signal

Package Pin #

GPIO Port

GPIO Bit

D7¹

D8¹

0

1

2

3

22

23

24

26

Peripheral

D9¹

Peripheral

D10¹

Peripheral

4

5

N/A

6

7

GPIOF

8

9

10

11

12

13

14

15

1. Not useful in reset configuration in this package - reconfigure as GPIO

2. See Part 6.5.8 to determine how to select peripherals from this set; DEC1 is the selected peripheral at reset

Part 9 Joint Test Action Group (JTAG)

9.1 JTAG Information

Please contact your Freescale marketing representative or authorized distributor for

device/package-specific BSDL information.

Part 10 Specifications

10.1 General Characteristics

The 56F8365/56F8165 are fabricated in high-density CMOS with 5V-tolerant TTL-compatible digital

56F8365 Technical Data, Rev. 9

138

Freescale Semiconductor

General Characteristics

inputs. The term “5V-tolerant” refers to the capability of an I/O pin, built on a 3.3V-compatible process

technology, to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture

of devices designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V- and

5V-compatible I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V

 10% during normal operation without causing damage). This 5V-tolerant capability therefore offers the

power savings of 3.3V I/O levels combined with the ability to receive 5V levels without damage.

Absolute maximum ratings in Table 10-1 are stress ratings only, and functional operation at the maximum

is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent damage to

the device.

Note: All specifications meet both Automotive and Industrial requirements unless individual

specifications are listed.

Note: The 56F8165 device is guaranteed to 40MHz and specified to meet Industrial requirements only.

CAUTION

This device contains protective circuitry to guard against

damage due to high static voltage or electrical fields.

However, normal precautions are advised to avoid application

of any voltages higher than maximum-rated voltages to this

high-impedance circuit. Reliability of operation is enhanced if

unused inputs are tied to an appropriate voltage level.

Note: The 56F8165 device is specified to meet Industrial requirements only; CAN is NOT available on the

56F8165 device.

Table 10-1 Absolute Maximum Ratings

(V_SS= V_{SSA_ADC}= 0)

Characteristic

Supply voltage

Symbol

V_{DD_IO}

Notes

Min

- 0.3

Max

4.0

Unit

V

ADC Supply Voltage

V_{DDA_ADC,}V_REFH

V_REFHmust be less than or

equal to V_{DDA_ADC}

4.0

V

Oscillator / PLL Supply Voltage

Internal Logic Core Supply Voltage

Input Voltage (digital)

V_{DDA_OSC_PLL}

V_{DD_CORE}

V_IN

- 0.3

-0.3

4.0

3.0

6.0

4.0

V

OCR_DIS is High

Pin Groups 1, 2, 5, 6, 9, 10

Pin Groups 11, 12, 13

Input Voltage (analog)

V_INA

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

139

Table 10-1 Absolute Maximum Ratings (Continued)

(V_SS= V_{SSA_ADC}= 0)

Characteristic

Output Voltage

Symbol

Notes

Min

Max

Unit

Pin Groups 1, 2, 3, 4, 5, 6, 7, 8

V_OUT

-0.3

4.0

6.0¹

V

Pin Group 4

Output Voltage (open drain)

V_OD

T_A

-0.3

-40

-55

6.0

125

105

150

125

150

V

Ambient Temperature (Automotive)

Ambient Temperature (Industrial)

Junction Temperature (Automotive)

Junction Temperature (Industrial)

Storage Temperature (Automotive)

Storage Temperature (Industrial)

°C

T_A

T_J

T_STG

1. If corresponding GPIO pin is configured as open drain.

Note: Pins in italics are NOT available in the 56F8165 device.

Pin Group 1: TXD0-1, RXD0-1, SS0, MISO0, MOSI0

Pin Group 2: PHASEA0, PHASEA1, PHASEB0, PHASEB1, INDEX0, INDEX1, HOME0, HOME1, ISB0-2, ISA0-2, TD2-3, TC0-1,

TDO, SCLK0

Pin Group 3: RSTO, TDO

Pin Group 4: CAN_TX

Pin Group 5: D0-15, GPIOD0-5

Pin Group 6: A8-15, GPIOB0-4, TD0-1

Pin Group 7: CLKO

Pin Group 8: PWMA0-5, PWMB0-5

Pin Group 9: IRQA, IRQB, RESET, EXTBOOT, TRST, TMS, TDI, CAN_RX, EMI_MODE, FAULTA0-3, FAULTB0-3

Pin Group 10: TCK

Pin Group 11: XTAL, EXTAL

Pin Group 12: ANA0-7, ANB0-7

Pin Group 13: OCR_DIS, CLKMODE

56F8365 Technical Data, Rev. 9

140

Freescale Semiconductor

General Characteristics

Table 10-2 56F8365/56F8165 ElectroStatic Discharge (ESD) Protection

Characteristic

Min

Typ

Max

Unit

ESD for Human Body Model (HBM)

ESD for Machine Model (MM)

2000

200

—

V

ESD for Charge Device Model (CDM)

500

6

Table 10-3 Thermal Characteristics

Value

Characteristic

Symbol

Unit

Notes

Comments

128-pin LQFP

R

Junction to ambient

50.8

°C/W

2

JA

Natural convection

R

Junction to ambient (@1m/sec)

46.5

43.9

°C/W

2

JMA

R

Junction to ambient

Natural convection

Four layer board (2s2p)

1,2

JMA

(2s2p)

R

Junction to ambient (@1m/sec)

Junction to case

41.7

13.9

°C/W

W

1,2

3

JMA

R

JC



Junction to center of case

I/O pin power dissipation

Power dissipation

1.2

4, 5

JT

P

User-determined

P _D= (I_DDx V_DD+ P _I/O

I/O

P

)

W

D

(TJ - TA) / RJA⁷

P

Maximum allowed P_D

W

DMAX

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-

mal test board.

2. Junction to ambient thermal resistance, Theta-JA (R ) was simulated to be equivalent to the JEDEC specification JESD51-2

JA

in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes

(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name

for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.

3. Junction to case thermal resistance, Theta-JC (R

), was simulated to be equivalent to the measured values using the cold

JC

plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is

described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when

the package is being used with a heat sink.

4. Thermal Characterization Parameter, Psi-JT ( ), is the "resistance" from junction to reference point thermocouple on top cen-

JT

ter of case as defined in JESD51-2.  is a useful value to use to estimate junction temperature in steady-state customer en-

JT

vironments.

5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

6. See Part 12.1 for more details on thermal design considerations.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

141

7. TJ = Junction temperature

TA = Ambient temperature

Note: The 56F8165 device is guaranteed to 40MHz and specified to meet Industrial requirements only;

CAN is NOT available on the 56F8165 device.

Table 10-4 Recommended Operating Conditions

(V_REFLO= 0V, V_SS= V_{SSA_ADC}= 0V_,V_DDA= V_{DDA_ADC}= V_{DDA_OSC_PLL}

)

Characteristic

Supply voltage

Symbol

Notes

Min

3

Typ

3.3

Max

3.6

Unit

V

DD_IO

V

must be less than

REFH

ADC Supply Voltage

3

3.6

DDA_ADC,

or equal to V_{DDA_ADC}

V

REFH

V

Oscillator / PLL Supply Voltage

3

3.3

2.5

3.6

DDA_OSC_PLL

OCR_DIS is High

V

Internal Logic Core Supply

Voltage

2.25

2.75

DD_CORE

MHz

V

FSYSCLK

Device Clock Frequency

Input High Voltage (digital)

Input High Voltage (analog)

0

2

—

60

5.5

Pin Groups 1, 2, 5, 6, 9, 10

Pin Group 13

V

IN

V

V_DDA+0.3

IHA

Pin Group 11

V

Input High Voltage (XTAL/EXTAL,

XTAL is not driven by an external

clock)

V_DDA-0.8

—

V_DDA+0.3

IHC

Pin Group 11

V

Input high voltage (XTAL/EXTAL,

XTAL is driven by an external clock)

2

—

V_DDA+0.3

.8

IHC

Pin Groups

1, 2, 5, 6, 9, 10, 11, 13

V

Input Low Voltage

-0.3

IL

Pin Groups 1, 2, 3

Pin Groups 5, 6, 7

Pin Groups 8

mA

I

Output High Source Current

V_OH= 2.4V (V_OHmin.)

—

-40

—

-4

-8

OH

-12

4

Pin Groups 1, 2, 3, 4

Pin Groups 5, 6, 7

Pin Group 8

mA

I

Output Low Sink Current

V_OL= 0.4V (V_OLmax)

OL

8

12

125

°C

T

Ambient Operating Temperature

(Automotive)

A

105

—

°C

T

Ambient Operating Temperature

(Industrial)

-40

10,000

15

—

A

T_A= -40°C to 125°C

T_A= -40°C to 105°C

T_J<= 85°C avg

Cycles

Years

N

Flash Endurance (Automotive)

(Program Erase Cycles)

F

N

Flash Endurance (Industrial)

(Program Erase Cycles)

—

F

T

Flash Data Retention

(Automotive)

—

R

Note: Total chip source or sink current cannot exceed 200mA

See Pin Groups listed in Table 10-1

56F8365 Technical Data, Rev. 9

142

Freescale Semiconductor

DC Electrical Characteristics

10.2 DC Electrical Characteristics

Note: The 56F8165 device is specified to meet Industrial requirements only; CAN is NOT available on the

56F8165 device.

Table 10-5 DC Electrical Characteristics

At Recommended Operating Conditions; see Table 10-4

Characteristic

Output High Voltage

Output Low Voltage

Symbol

Notes

Min

2.4

—

Typ

—

0

Max

—

Unit

V

Test Conditions

I_OH= I_OHmax

V

OH

I_OL= I_OLmax

V

0.4

V

OL

Pin Groups

1, 2, 5, 6, 9

V_IN= 3.0V to 5.5V

I

Digital Input Current High

pull-up enabled or disabled

—

+/- 2.5

A

IH

Pin Group 10

V_IN= 3.0V to 5.5V

I

Digital Input Current High

with pull-down

40

80

160

A

IH

Pin Group 13

Pin Group 12

V_IN= V_DDA

V_IN= 0V

I

Analog Input Current High

ADC Input Current High

—

0

+/- 2.5

+/- 3.5

-50

A

IHA

I

IHADC

Pin Groups

1, 2, 5, 6, 9

I

Digital Input Current Low

pull-up enabled

-200

-100

IL

Pin Groups

1, 2, 5, 6, 9

V_IN= 0V

I

Digital Input Current Low

pull-up disabled

—

0

+/- 2.5

A

IL

Pin Group 10

I

Digital Input Current Low with

pull-down

IL

Pin Group 13

Pin Group 12

V_IN= 0V

I

Analog Input Current Low

ADC Input Current Low

—

0

+/- 2.5

+/- 3.5

+/- 2.5

A

ILA

I

ILADC

V_IN= V_DDor 0V

I

EXTAL Input Current Low

clock input

EXTAL

CKLMODE = High

CKLMODE = Low

V_IN= V_DDAor 0V

I

XTAL Input Current Low

clock input

—

0

—

0

+/- 2.5

200

A

XTAL

Pin Groups

1, 2, 3, 4, 5, 6, 7, 8

V_OUT= 3.0V to

5.5V or 0V

I

Output Current

High Impedance State

+/- 2.5

OZ

Pin Groups

2, 6, 9,10

—

V

Schmitt Trigger Input

Hysteresis

—

0.3

4.5

5.5

6

—

V

HYS

C

Input Capacitance

(EXTAL/XTAL)

pF

INC

C

Output Capacitance

(EXTAL/XTAL)

OUTC

C

Input Capacitance

IN

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

143

Table 10-5 DC Electrical Characteristics (Continued)

At Recommended Operating Conditions; see Table 10-4

Characteristic

Symbol

Notes

Min

Typ

Max

Unit

Test Conditions

—

C

Output Capacitance

—

6

—

pF

OUT

See Pin Groups listed in Table 10-1

A

0

–10

–30

–50

–70

–90

0

1

2

3

Volts

Figure 10-1 Maximum Current — Schmitt Input DC Response –40 C, 3.6 V

Table 10-6 Power-On Reset Low Voltage Parameters

Characteristic

POR Trip Point

Symbol

Min

1.75

—

Typ

1.8

Max

1.9

—

Units

V

POR

V_EI2.5

V_EI3.3

LVI, 2.5 volt Supply, trip point¹

2.14

LVI, 3.3 volt supply, trip point²

Bias Current

—

2.7

—

V

I _bias

110

130

A

1. When V

2. When V

drops below V

, an interrupt is generated.

DD_CORE

EI2.5

EI3.3

56F8365 Technical Data, Rev. 9

144

Freescale Semiconductor

DC Electrical Characteristics

Table 10-7 Current Consumption per Power Supply Pin (Typical)

On-Chip Regulator Enabled (OCR_DIS = Low)

1

I_{DD_ADC}

I_{DD_OSC_PLL}

Mode

Test Conditions

• 60MHz Device Clock

I_{DD_IO}

RUN1_MAC

155mA

50mA

2.5mA

• All peripheral clocks are enabled

• All peripherals running

• Continuous MAC instructions with fetches from

Data RAM

• ADC powered on and clocked

• 60MHz Device Clock

Wait3

Stop1

91mA

6mA

70A

0A

2.5mA

• All peripheral clocks are enabled

• ADC powered off

• 8MHz Device Clock

• All peripheral clocks are off

• ADC powered off

165A

• PLL powered off

• External Clock is off

• All peripheral clocks are off

• ADC powered off

Stop2

5.1mA

0A

155A

• PLL powered off

1. No Output Switching

2. Includes Processor Core current supplied by internal voltage regulator

Table 10-8 Current Consumption per Power Supply Pin (Typical)

On-Chip Regulator Disabled (OCR_DIS = High)

1

I_{DD_Core}

I_{DD_ADC}

I_{DD_OSC_PLL}

Mode

Test Conditions

• 60MHz Device Clock

I_{DD_IO}

RUN1_MAC

150mA

13A

50mA

2.5mA

• All peripheral clocks are enabled

• All peripherals running

• Continuous MAC instructions with

fetches from Data RAM

• ADC powered on and clocked

• 60MHz Device Clock

Wait3

86mA

13A

70A

2.5mA

• All peripheral clocks are enabled

• ADC powered off

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

145

Table 10-8 Current Consumption per Power Supply Pin (Typical)

On-Chip Regulator Disabled (OCR_DIS = High)

1

I_{DD_Core}

I_{DD_ADC}

I_{DD_OSC_PLL}

Mode

Stop1

Test Conditions

• 8MHz Device Clock

I_{DD_IO}

950A

13A

0A

165A

• All peripheral clocks are off

• ADC powered off

• PLL powered off

• External Clock is off

• All peripheral clocks are off

• ADC powered off

Stop2

100A

13A

0A

155A

• PLL powered off

1. No Output Switching

Table 10-9. Regulator Parameters

Characteristic

Symbol

Min

Typical

Max

Unit

Unloaded Output Voltage

(0mA Load)

V_RNL

2.25

—

2.75

V

Loaded Output Voltage

(200mA load)

V_RL

2.25

—

2.75

V

Line Regulation @ 250mA load

(V_DD33 ranges from 3.0V to 3.6V)

V_R

Short Circuit Current

Iss

—

700

mA

(output shorted to ground)

Bias Current

I _bias

I_pd

—

5.8

0

7

2

mA

A

Power-down Current

Short-Circuit Tolerance

T_RSC

—

30

minutes

(output shorted to ground)

Table 10-10. PLL Parameters

Characteristics

PLL Start-up time

Symbol

T_PS

Min

0.3

Typical

0.5

Max

10

Unit

ms

ps

Resonator Start-up time

Min-Max Period Variation

T_RS

0.1

0.18

—

1

T_PV

120

200

56F8365 Technical Data, Rev. 9

146

Freescale Semiconductor

DC Electrical Characteristics

Table 10-10. PLL Parameters

Characteristics

Peak-to-Peak Jitter

Symbol

T_PJ

Min

—

Typical

—

Max

Unit

ps

175

2

Bias Current

I_BIAS

I_PD

—

1.5

mA

A

Quiescent Current, power-down mode

—

100

150

10.2.1 Temperature Sensor

Note: Temperature Sensor is NOT available in the 56F8165 device.

Table 10-11 Temperature Sense Parametrics

Characteristics

Slope (Gain)¹

Symbol

m

Min

—

Typical

7.762

26

Max

—

Unit

mV/°C

°C

Room Trim Temp. ^{1, 2}

T_RT

24

28

Hot Trim Temp. (Industrial)^1,2

Hot Trim Temp. (Automotive)^1,2

T_HT

122

147

—

125

128

153

—

°C

T_HT

150

°C

Output Voltage @

V_{DDA_ADC}= 3.3V, T_J=0°C¹

V_TS0

1.370

V

Supply Voltage

V_{DDA_ADC}

I_DD-OFF

I_DD-ON

3.0

—

3.3

—

0

3.6

10

V

Supply Current - OFF

Supply Current - ON

A

°C

—

250

6.7

Accuracy^3,1from -40°C to 150°C

Using V_TS= mT + V_TS0

T_ACC

-6.7

Resolution^{4, 5,1}

R_ES

—

0.104

—

°C / bit

1. Includes the ADC conversion of the analog Temperature Sense voltage.

2. The ADC is not calibrated for the conversion of the Temperature Sensor trim value stored in the Flash Memory at

FMOPT0 and FMOPT1.

3. See Application Note, AN1980, for methods to increase accuracy.

4. Assuming a 12-bit range from 0V to 3.3V.

5. Typical resolution calculated using equation:

(V_REFH- V_REFLO) X 1

=

R_ES

2¹²

m

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

147

10.3 AC Electrical Characteristics

Tests are conducted using the input levels specified in Table 10-5. Unless otherwise specified,

propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured

between the 10% and 90% points, as shown in Figure 10-2.

Low

V_IL

High

V_IH

90%

50%

10%

Input Signal

Midpoint1

Fall Time

Note: The midpoint is V_IL+ (V_IH– V_IL)/2.

Rise Time

Figure 10-2 Input Signal Measurement References

Figure 10-3 shows the definitions of the following signal states:

•

Active state, when a bus or signal is driven, and enters a low impedance state

Tri-stated, when a bus or signal is placed in a high impedance state

Data Valid state, when a signal level has reached V_OLor V_OH

•

Data Invalid state, when a signal level is in transition between V_OLand V_OH

Data2 Valid

Data2

Data1 Valid

Data1

Data3 Valid

Data3

Data

Tri-stated

Data Invalid State

Data Active

Figure 10-3 Signal States

10.4 Flash Memory Characteristics

Table 10-12 Flash Timing Parameters

Characteristic

Symbol

Tprog

Terase

Tme

Min

20

Typ

—

Max

—

Unit

s

Program time¹

Erase time²

20

—

ms

Mass erase time

100

—

1. There is additional overhead which is part of the programming sequence. See the 56F8300 Peripheral User Manual

for details. Program time is per 16-bit word in Flash memory. Two words at a time can be programmed within the Pro-

gram Flash module, as it contains two interleaved memories.

56F8365 Technical Data, Rev. 9

148

Freescale Semiconductor

External Clock Operation Timing

2. Specifies page erase time. There are 512 bytes per page in the Data and Boot Flash memories. The Program Flash

module uses two interleaved Flash memories, increasing the effective page size to 1024 bytes.

10.5 External Clock Operation Timing

1

Table 10-13 External Clock Operation Timing Requirements

Characteristic

Symbol

f_osc

Min

0

Typ

—

Max

120

—

Unit

MHz

ns

Frequency of operation (external clock driver)²

Clock Pulse Width³

t_PW

3.0

—

External clock input rise time⁴

t_rise

—

10

ns

External clock input fall time⁵

t_fall

—

10

ns

1. Parameters listed are guaranteed by design.

2. See Figure 10-4 for details on using the recommended connection of an external clock driver.

3. The high or low pulse width must be no smaller than 8.0ns or the chip will not function.

4. External clock input rise time is measured from 10% to 90%.

5. External clock input fall time is measured from 90% to 10%.

V_IH

External

Clock

90%

50%

10%

90%

50%

10%

V_IL

t_fall

t_rise

t_PW

Note: The midpoint is V_IL+ (V_IH– V_IL)/2.

Figure 10-4 External Clock Timing

10.6 Phase Locked Loop Timing

Table 10-14 PLL Timing

Characteristic

Symbol

f_osc

Min

4

Typ

8

Max

8.4

Unit

MHz

External reference crystal frequency for the PLL¹

PLL output frequency²(f_OUT

)

f_op

160

—

260

PLL stabilization time³-40 to +125C

t_plls

—

1

10

ms

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

149

1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work

correctly. The PLL is optimized for 8MHz input crystal.

2. ZCLK may not exceed 60MHz. For additional information on ZCLK and (f

/2), please refer to the OCCS chapter in

OUT

the 56F8300 Peripheral User Manual.

3. This is the minimum time required after the PLL set up is changed to ensure reliable operation.

10.7 Crystal Oscillator Timing

Table 10-15 Crystal Oscillator Parameters

Characteristic

Crystal Start-up time

Symbol

T_CS

Min

4

Typ

5

Max

10

Unit

ms

ohms

ps

Resonator Start-up time

T_RS

0.1

—

0.18

—

1

Crystal ESR

R_ESR

T_D

120

250

1.5

300

290

110

1

Crystal Peak-to-Peak Jitter

Crystal Min-Max Period Variation

Resonator Peak-to-Peak Jitter

Resonator Min-Max Period Variation

Bias Current, high-drive mode

Bias Current, low-drive mode

Quiescent Current, power-down mode

70

0.12

—

T_PV

—

ns

T_RJ

—

ps

T_RP

—

ps

I_BIASH

I_BIASL

I_PD

—

250

80

0

A

—

A

—

A

10.8 Reset, Stop, Wait, Mode Select, and Interrupt Timing

1,2

Table 10-16 Reset, Stop, Wait, Mode Select, and Interrupt Timing

Typical

Min

Typical

Max

Characteristic

Symbol

Unit

See Figure

Minimum RESET Assertion Duration

Edge-sensitive Interrupt Request Width

t_RA

t_IRW

16T

1.5T

18T

14T

—

ns

10-5

10-6

10-7

IRQA, IRQB Assertion to General Purpose

Output Valid, caused by first instruction

execution in the interrupt service routine

t_IG

t_IG- FAST

56F8365 Technical Data, Rev. 9

150

Freescale Semiconductor

Reset, Stop, Wait, Mode Select, and Interrupt Timing

1,2

Table 10-16 Reset, Stop, Wait, Mode Select, and Interrupt Timing

Typical

Min

Typical

Max

Characteristic

Symbol

Unit

See Figure

10-9

IRQA Width Assertion to Recover from Stop

State³

t_IW

1.5T

—

ns

1. In the formulas, T = clock cycle. For an operating frequency of 60MHz, T = 16.67ns. At 8MHz (used during Reset and

Stop modes), T = 125ns.

2. Parameters listed are guaranteed by design.

3. The interrupt instruction fetch is visible on the pins only in Mode 3.

RESET

t_RA

t_RAZ

t_RDA

First Fetch

A0–A15,

D0–D15

Figure 10-5 Asynchronous Reset Timing

IRQA,

IRQB

t_IRW

Figure 10-6 External Interrupt Timing (Negative Edge-Sensitive)

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

151

A0–A15

First Interrupt Instruction Execution

a) First Interrupt Instruction Execution

t_IDM

IRQA,

IRQB

General

Purpose

I/O Pin

t_IG

IRQA,

IRQB

b) General Purpose I/O

Figure 10-7 External Level-Sensitive Interrupt Timing

IRQA,

IRQB

t_IRI

A0–A15

First Interrupt Vector

Instruction Fetch

Figure 10-8 Interrupt from Wait State Timing

t_IW

IRQA

t_IF

A0–A15

First Instruction Fetch

Not IRQA Interrupt Vector

Figure 10-9 Recovery from Stop State Using Asynchronous Interrupt Timing

56F8365 Technical Data, Rev. 9

152

Freescale Semiconductor

Serial Peripheral Interface (SPI) Timing

10.9 Serial Peripheral Interface (SPI) Timing

1

Table 10-17 SPI Timing

Characteristic

Symbol

Min

Max

Unit

See Figure

Cycle time

Master

Slave

t_C

10-10, 10-11,

10-12, 10-13

50

—

ns

Enable lead time

Master

Slave

t_ELD

t_ELG

t_CH

t_CL

10-13

—

25

—

ns

Enable lag time

Master

Slave

—

100

—

ns

Clock (SCK) high time

Master

Slave

10-10, 10-11,

10-12, 10-13

17.6

25

—

ns

Clock (SCK) low time

Master

Slave

10-13

24.1

25

—

ns

Data set up time required for inputs

Master

Slave

t_DS

t_DH

t_A

10-10, 10-11,

10-12, 10-13

20

0

—

ns

Data hold time required for inputs

Master

Slave

10-10, 10-11,

10-12, 10-13

0

2

—

ns

Access time (time to data active from

high-impedance state)

Slave

10-13

4.8

3.7

15

ns

Disable time (hold time to high-impedance state)

Slave

t_D

15.2

Data Valid for outputs

Master

Slave (after enable edge)

t_DV

10-10, 10-11,

10-12, 10-13

—

4.5

20.4

ns

Data invalid

Master

Slave

t_DI

t_R

t_F

10-10, 10-11,

0

—

ns

10-12

Rise time

Master

Slave

10-10, 10-11,

10-12, 10-13

—

11.5

10.0

ns

Fall time

Master

Slave

10-10, 10-11,

10-12, 10-13

—

9.7

9.0

ns

1. Parameters listed are guaranteed by design.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

153

SS

(Input)

SS is held High on master

t_C

t_R

t_F

t_CL

SCLK (CPOL = 0)

(Output)

t_CH

t_F

t_R

t_CL

SCLK (CPOL = 1)

(Output)

t_DH

t_CH

t_DS

MISO

(Input)

MSB in

t_DI

Bits 14–1

LSB in

t_DI(ref)

t_DV

MOSI

(Output)

Master MSB out

t_F

Bits 14–1

Master LSB out

t_R

Figure 10-10 SPI Master Timing (CPHA = 0)

56F8365 Technical Data, Rev. 9

154

Freescale Semiconductor

Serial Peripheral Interface (SPI) Timing

SS

(Input)

SS is held High on master

t_F

t_C

t_R

t_CL

SCLK (CPOL = 0)

(Output)

t_CH

t_F

t_CL

SCLK (CPOL = 1)

(Output)

t_CH

t_DS

t_R

t_DH

MISO

MSB in

Bits 14–1

LSB in

t_DI(ref)

(Input)

t_DV(ref)

t_DI

t_DV

Bits 14– 1

MOSI

(Output)

Master MSB out

t_F

Master LSB out

t_R

Figure 10-11 SPI Master Timing (CPHA = 1)

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

155

SS

(Input)

t_C

t_F

t_ELG

t_CL

t_R

SCLK (CPOL = 0)

(Input)

t_CH

t_ELD

t_CL

SCLK (CPOL = 1)

(Input)

t_CH

t_F

t_A

t_R

t_D

MISO

(Output)

Slave MSB out

Bits 14–1

t_DV

Slave LSB out

t_DI

t_DS

t_DI

t_DH

MOSI

(Input)

MSB in

Bits 14–1

LSB in

Figure 10-12 SPI Slave Timing (CPHA = 0)

SS

(Input)

t_F

t_C

t_R

t_CL

SCLK (CPOL = 0)

(Input)

t_CH

t_ELG

t_ELD

t_CL

SCLK (CPOL = 1)

(Input)

t_DV

t_CH

t_R

t_D

Slave LSB out

t_DI

LSB in

t_A

t_F

MISO

Slave MSB out

Bits 14–1

t_DV

(Output)

t_DS

t_DH

MOSI

(Input)

MSB in

Bits 14–1

Figure 10-13 SPI Slave Timing (CPHA = 1)

56F8365 Technical Data, Rev. 9

156

Freescale Semiconductor

Quad Timer Timing

10.10 Quad Timer Timing

1, 2

Table 10-18 Timer Timing

Characteristic

Timer input period

Symbol

P_IN

Min

Max

—

Unit

ns

See Figure

10-14

2T + 6

1T + 3

1T - 3

0.5T - 3

Timer input high / low period

Timer output period

P_INHL

P_OUT

—

ns

10-14

—

ns

10-14

Timer output high / low period

P_OUTHL

—

ns

10-14

1. In the formulas listed, T = the clock cycle. For 60MHz operation, T = 16.67ns.

2. Parameters listed are guaranteed by design.

Timer Inputs

P_INHL

P_IN

Timer Outputs

P_OUTHL

P_OUT

Figure 10-14 Timer Timing

10.11 Quadrature Decoder Timing

1, 2

Table 10-19 Quadrature Decoder Timing

Characteristic

Symbol

P_IN

Min

Max

—

Unit

See Figure

Quadrature input period

4T + 12

ns

10-15

Quadrature input high / low period

Quadrature phase period

P_HL

P_PH

2T + 6

1T + 3

—

1. In the formulas listed, T = the clock cycle. For 60MHz operation, T=16.67ns.

2. Parameters listed are guaranteed by design.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

157

P_PHP_PHP_PHP_PH

Phase A

(Input)

P_HL

P_IN

P_HL

Phase B

(Input)

P_HL

P_IN

P_HL

Figure 10-15 Quadrature Decoder Timing

10.12 Serial Communication Interface (SCI) Timing

1

Table 10-20 SCI Timing

Characteristic

Baud Rate²

Symbol

BR

Min

—

Max

Unit

See Figure

—

(f_MAX/16)

Mbps

RXD³Pulse Width

TXD⁴Pulse Width

RXD_PW

TXD_PW

0.965/BR

1.04/BR

ns

10-16

0.965/BR

10-17

1. Parameters listed are guaranteed by design.

2. f is the frequency of operation of the system clock, ZCLK, in MHz, which is 60MHz for the 56F8365 device and

MAX

40MHz for the 56F8165 device.

3. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1.

4. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1.

RXD

SCI receive

data pin

RXD_PW

(Input)

Figure 10-16 RXD Pulse Width

56F8365 Technical Data, Rev. 9

158

Freescale Semiconductor

Controller Area Network (CAN) Timing

TXD

SCI receive

data pin

TXD_PW

(Input)

Figure 10-17 TXD Pulse Width

10.13 Controller Area Network (CAN) Timing

Note: CAN is NOT available in the 56F8165 device.

1

Table 10-21 CAN Timing

Characteristic

Baud Rate

Bus Wake Up detection

Symbol

BR_CAN

Min

—

5

Max

1

Unit

See Figure

—

Mbps

T _WAKEUP

s

10-18

—

1. Parameters listed are guaranteed by design

CAN_RX

CAN receive

data pin

T _WAKEUP

(Input)

Figure 10-18 Bus Wake Up Detection

10.14 JTAG Timing

Table 10-22 JTAG Timing

Characteristic

Symbol

f_OP

Min

DC

Max

Unit

See Figure

TCK frequency of operation

using EOnCE¹

SYS_CLK/8

MHz

10-19

TCK frequency of operation not

using EOnCE¹

f_OP

DC

SYS_CLK/4

MHz

10-19

TCK clock pulse width

t_PW

t_DS

t_DH

t_DV

50

5

—

30

ns

10-19

10-20

TMS, TDI data set-up time

TMS, TDI data hold time

TCK low to TDO data valid

5

—

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

159

Table 10-22 JTAG Timing

Characteristic

Symbol

t_TS

Min

—

Max

30

Unit

ns

See Figure

TCK low to TDO tri-state

10-20

2T²

TRST assertion time

t_TRST

—

ns

10-21

1. TCK frequency of operation must be less than 1/8 the processor rate.

2. T = processor clock period (nominally 1/60MHz)

1/f_OP

t_PW

V_IH

V_M

TCK

(Input)

V_IL

V_M= V_IL+ (V_IH– V_IL)/2

Figure 10-19 Test Clock Input Timing Diagram

TCK

(Input)

t_DS

t_DH

TDI

TMS

Input Data Valid

(Input)

t_DV

TDO

(Output)

Output Data Valid

t_TS

TDO

(Output)

t_DV

TDO

(Output)

Output Data Valid

Figure 10-20 Test Access Port Timing Diagram

56F8365 Technical Data, Rev. 9

160

Freescale Semiconductor

Analog-to-Digital Converter (ADC) Parameters

TRST

(Input)

t_TRST

Figure 10-21 TRST Timing Diagram

10.15 Analog-to-Digital Converter (ADC) Parameters

Table 10-23 ADC Parameters

Characteristic

Input voltages

Symbol

V_ADIN

R_ES

Min

V_REFL

12

Typ

—

Max

V_REFH

12

Unit

V

Resolution

—

Bits

Integral Non-Linearity¹

Differential Non-Linearity

LSB²

INL

—

+/- 2.4

+/- 0.7

+/- 3.2

< +1

DNL

—

Monotonicity

GUARANTEED

—

ADC internal clock

f_ADIC

R_AD

0.5

V_REFL

5

MHz

V

Conversion range

—

6

V_REFH

16

t_AICcycles³

ms

ADC channel power-up time

t_ADPU

ADC reference circuit power-up time⁴

Conversion time

t_VREF

t_ADC

—

6

25

—

t_AICcycles³

Sample time

t_ADS

—

1

—

Input capacitance

C_ADI

I_ADI

—

5

—

3

pF

Input injection current⁵, per pin

Input injection current, total

mA

I_ADIT

—

20

V_REFHcurrent

I_VREFH

I_ADCA

I_ADCB

I_ADCQ

E_GAIN

1.2

25

3

ADC A current

—

ADC B current

25

—

mA

A

Quiescent current

Uncalibrated Gain Error (ideal = 1)

0

10

+/- .004

+/- .01

—

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

161

Table 10-23 ADC Parameters (Continued)

Characteristic

Symbol

V_OFFSET

AE_CAL

CF1

Min

—

Typ

Max

+/- 40

—

Unit

mV

LSBs

—

Uncalibrated Offset Voltage

+/- 27

Calibrated Absolute Error⁶

Calibration Factor 1⁷

—

See Figure 10-22

—

0.002289

–25.6

Calibration Factor 2⁷

CF2

—

Crosstalk between channels

Common Mode Voltage

—

–60

—

dB

V

V_common

(V_REFH- V_REFLO) / 2

Signal-to-noise ratio

SNR

SINAD

THD

—

64.6

59.1

60.6

61.1

9.6

—

db

Signal-to-noise plus distortion ratio

Total Harmonic Distortion

Spurious Free Dynamic Range

db

SFDR

ENOB

db

Effective Number Of Bits⁸

Bits

Non-averaged DC drift of error over

—

3

LSB

temperature from 27 C⁹

1. INL measured from V = .1V

to V = .9V

in REFH

in

REFH

10% to 90% Input Signal Range

2. LSB = Least Significant Bit

3. ADC clock cycles

4. Assumes each voltage reference pin is bypassed with 0.1F ceramic capacitors to ground

5. The current that can be injected or sourced from an unselected ADC signal input without impacting the performance of

the ADC. This allows the ADC to operate in noisy industrial environments where inductive flyback is possible.

6. Absolute error includes the effects of both gain error and offset error.

7. Please see the 56F8300Peripheral User’s Manual for additional information on ADC calibration.

8. ENOB = (SINAD - 1.76)/6.02

9. Temperature range –40 C to 150 C

56F8365 Technical Data, Rev. 9

162

Freescale Semiconductor

Equivalent Circuit for ADC Inputs

Figure 10-22 ADC Absolute Error Over Processing and Temperature Extremes Before

and After Calibration for VDC = 0.60V and 2.70V

in

Note: The absolute error data shown in the graphs above reflects the effects of both gain error and offset

error. The data was taken on 25 parts: five each from four processing corner lots as well as five from one

nominally processed lot, each at three temperatures: -40°C, 27°C, and 150°C (giving the 75 data points

shown above), for two input DC voltages: 0.60V and 2.70V. The data indicates that for the given

population of parts, calibration significantly reduced (by as much as 24%) the collective variation (spread)

of the absolute error of the population. It also significantly reduced (by as much as 38%) the mean

(average) of the absolute error and thereby brought it significantly closer to the ideal value of zero.

Although not guaranteed, it is believed that calibration will produce results similar to those shown above

for any population of parts including those which represent processing and temperature extremes.

10.16 Equivalent Circuit for ADC Inputs

Figure 10-23 illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

163

at the same time that S3 is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and

hold circuit moves to V - V / 2, while the other charges to the analog input voltage. When the

REFH

switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended

analog input is switched to a differential voltage centered about V - V / 2. The switches switch

REFH

on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there

are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into

the S/H output voltage, as S1 provides isolation during the charge-sharing phase.

One aspect of this circuit is that there is an on-going input current, which is a function of the analog input

voltage, V

and the ADC clock frequency.

REF

3

Analog Input

4

S1

C1

C2

S/H

S3

(V_REFH- V_REFLO) / 2

S2

2

1

C1 = C2 = 1pF

1. Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pf

2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pf

3. Equivalent resistance for the ESD isolation resistor and the channel select mux; 500 ohms

4. Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only

connected to it at sampling time; 1pf

Figure 10-23 Equivalent Circuit for A/D Loading

10.17 Power Consumption

This section provides additional detail which can be used to optimize power consumption for a given

application.

Power consumption is given by the following equation:

Total power =

A: internal [static component]

+B: internal [state-dependent component]

+C: internal [dynamic component]

+D: external [dynamic component]

+E: external [static]

A, the internal [static component], is comprised of the DC bias currents for the oscillator, leakage current,

PLL, and voltage references. These sources operate independently of processor state or operating

frequency.

B, the internal [state-dependent component], reflects the supply current required by certain on-chip

resources only when those resources are in use. These include RAM, Flash memory and the ADCs.

56F8365 Technical Data, Rev. 9

164

Freescale Semiconductor

Power Consumption

2

C, the internal [dynamic component], is classic C*V *F CMOS power dissipation corresponding to the

56800E core and standard cell logic.

D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading

2

on the external pins of the chip. This is also commonly described as C*V *F, although simulations on two

of the IO cell types used on the device reveal that the power-versus-load curve does have a non-zero

Y-intercept.

Table 10-24 IO Loading Coefficients at 10MHz

Intercept

Slope

PDU08DGZ_ME

PDU04DGZ_ME

1.3

0.11mW / pF

1.15mW

Power due to capacitive loading on output pins is (first order) a function of the capacitive load and

frequency at which the outputs change. Table 10-24 provides coefficients for calculating power dissipated

in the IO cells as a function of capacitive load. In these cases:

Total Power = ((Intercept +Slope*Cload)*frequency/10MHz)

where:

•

Summation is performed over all output pins with capacitive loads

Total Power is expressed in mW

Cload is expressed in pF

Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found

to be fairly low when averaged over a period of time.

E, the external [static component], reflects the effects of placing resistive loads on the outputs of the

2

device. Sum the total of all V /R or IV to arrive at the resistive load contribution to power. Assume V =

0.5 for the purposes of these rough calculations. For instance, if there is a total of eight PWM outputs

driving 10mA into LEDs, then P = 8*.5*.01 = 40mW.

In previous discussions, power consumption due to parasitics associated with pure input pins is ignored,

as it is assumed to be negligible.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

165

Part 11 Packaging

11.1 56F8365 Package and Pin-Out Information

This section contains package and pin-out information for the 56F8365. This device comes in a 128-pin

Low-profile Quad Flat Pack (LQFP). Figure 11-1. shows the package outline for the 128-pin LQFP;

Figure 11-3 shows the mechanical parameters for this package, and Table 11-1. lists the pin-out for the

128-pin LQFP.

56F8365 Technical Data, Rev. 9

166

Freescale Semiconductor

56F8365 Package and Pin-Out Information

Orientation

Mark

INDEX0

HOME0

ANB6

ANB5

103

PIN 1

V

SS

DD_IO

ANB4

ANB3

ANB2

ANB1

ANB0

V

2

PP

CLKO

TXD0

RXD0

PHASEA1

PHASEB1

INDEX1

V

SSA_ADC

DDA_ADC

REFH

V

REFP

HOME1

CAP

V

REFMID

REFN

V

4

V

DD_IO

REFLO

GPIOA0

GPIOA1

GPIOA2

GPIOA3

GPIOA4

GPIOA5

TEMP_SENSE

ANA7

ANA6

ANA5

ANA4

ANA3

V

ANA2

SS

GPIOF0

ANA1

GPIOF1

ANA0

GPIOF2

CLKMODE

RESET

RSTO

V

DD_IO

GPIOF3

GPIOB0

GPIOB1

GPIOB2

GPIOB3

V

DD_IO

V

3

CAP

EXTAL

XTAL

GPIOB4

V

DDA_OSC_PLL

PWMB0

PWMB1

PWMB2

OCR_DIS

FAULTA3

FAULTA2

FAULTA1

FAULTA0

PWMA5

V

SS

V

DD_IO

PWMB3

PWMB4

65

V

SS

39

Figure 11-1 Top View, 56F8365 128-pin LQFP Package

Table 11-1 56F8365 128-Pin LQFP Package Identification by Pin Number

Pin No.

Signal Name

INDEX0

Pin No.

33

Signal Name

PWMB1

Pin No.

65

Signal Name

V_SS

Pin No.

97

Signal Name

ANB1

1

2

HOME0

34

PWMB2

66

PWMA5

98

ANB2

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

167

Table 11-1 56F8365 128-Pin LQFP Package Identification by Pin Number (Continued)

Pin No.

Signal Name

V_SS

Pin No.

35

Signal Name

V_SS

Pin No.

67

Signal Name

FAULTA0

FAULTA1

FAULTA2

Pin No.

99

Signal Name

ANB3

3

4

5

V_{DD_IO}

36

V_{DD_IO}

68

100

ANB4

V_PP2

37

PWMB3

69

101

ANB5

6

7

8

CLKO

TXD0

RXD0

38

39

40

PWMB4

PWMB5

TXD1

70

71

72

FAULTA3

OCR_DIS

102

103

104

ANB6

ANB7

ISA0

V_{DDA_OSC_PLL}

9

PHASEA1

PHASEB1

INDEX1

41

42

43

RXD1

73

74

75

XTAL

105

106

107

ISA1

ISA2

TD0

10

11

GPIOD0

GPIOD1

EXTAL

V

_CAP3

12

13

14

15

16

17

18

19

20

21

20

23

24

25

HOME1

44

45

46

47

48

49

50

51

52

53

54

55

56

57

GPIOD2

GPIOD3

GPIOD4

GPIOD5

ISB0

76

77

78

79

80

81

82

83

84

85

86

87

88

89

V_{DD_IO}

RSTO

108

109

110

111

112

113

114

115

116

117

118

119

120

121

TD1

TD2

V

_CAP4

V_{DD_IO}

RESET

CLKMODE

ANA0

TD3

GPIOA0¹

GPIOA1¹

GPIOA2¹

GPIOA3¹

GPIOA4¹

TC0

V_{DD_IO}

TC1

V_CAP

1

ANA1

ISB1

ISB2

ANA2

TRST

TCK

TMS

TDI

ANA3

GPIOA5¹

V_SS

IRQA

ANA4

IRQB

AN5

GPIOF0¹

GPIOF1¹

FAULTB0

FAULTB1

FAULTB2

FAULTB3

ANA6

TDO

ANA7

V_PP1

GPIOF2¹

V_{DD_IO}

TEMP_SENSE

V_REFLO

CAN_TX

CAN_RX

1. Primary function is not available in this package configuration; GPIO function must be used instead

GPIOF3¹

GPIOB0

26

27

28

58

59

60

PWMA0

V_SS

90

91

92

V_REFN

V_REFMID

V_REFP

122

123

124

V_CAP2

SS0

GPIOB1

PWMA1

SCLK0

56F8365 Technical Data, Rev. 9

168

Freescale Semiconductor

56F8165 Package and Pin-Out Information

Table 11-1 56F8365 128-Pin LQFP Package Identification by Pin Number (Continued)

Pin No.

29

Signal Name

GPIOB2

Pin No.

61

Signal Name

PWMA2

V_{DD_IO}

Pin No.

93

Signal Name

V_REFH

Pin No.

125

Signal Name

MISO0

30

GPIOB3

62

94

V_{DDA_ADC}

V_{SSA_ADC}

ANB0

126

MOSI0

31

GPIOB4

63

PWMA3

PWMA4

95

127

PHASEA0

PHASEB0

32

PWMB0

64

96

128

11.2 56F8165 Package and Pin-Out Information

This section contains package and pin-out information for the 56F8165. This device comes in a 128-pin

Low-profile Quad Flat Pack (LQFP). Figure 11-1. shows the package outline for the 128-pin LQFP,

Figure 11-3 shows the mechanical parameters for this package, and Table 11-1 lists the pin-out for the

128-pin LQFP.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

169

Orientation

Mark

INDEX0

HOME0

ANB6

ANB5

103

PIN 1

V

SS

DD_IO

ANB4

ANB3

ANB2

ANB1

ANB0

V

2

PP

CLKO

TXD0

RXD0

SCLK1

MOSI1

MISO1

V

SSA_ADC

DDA_ADC

REFH

V

REFP

SS1

CAP

V

REFMID

REFN

V

4

DD_IO

REFLO

GPIOA0

GPIOA1

GPIOA2

GPIOA3

GPIOA4

GPIOA5

NC

ANA7

ANA6

ANA5

ANA4

ANA3

ANA2

V

SS

GPIOF0

ANA1

GPIOF1

ANA0

GPIOF2

CLKMODE

RESET

RSTO

V

DD_IO

GPIOF3

GPIOB0

GPIOB1

GPIOB2

GPIOB3

V

DD_IO

V

3

CAP

EXTAL

XTAL

GPIOB4

V

DDA_OSC_PLL

PWMB0

PWMB1

PWMB2

OCR_DIS

NC

V

SS

V

DD_IO

PWMB3

PWMB4

65

V

SS

39

Figure 11-2 Top View, 56F8165 128-pin LQFP Package

Table 11-2 56F8165 128-Pin LQFP Package Identification by Pin Number

Pin No.

Signal Name

Pin No.

Signal Name

Pin No.

Signal Name

Pin No.

Signal Name

1

INDEX0

33

PWMB1

65

V_SS

97

ANB1

56F8365 Technical Data, Rev. 9

170

Freescale Semiconductor

56F8165 Package and Pin-Out Information

Table 11-2 56F8165 128-Pin LQFP Package Identification by Pin Number (Continued)

Pin No.

Signal Name

HOME0

V_SS

Pin No.

34

Signal Name

PWMB2

V_SS

Pin No.

66

Signal Name

Pin No.

98

Signal Name

ANB2

2

3

NC

35

67

99

ANB3

4

5

V_{DD_IO}

36

37

V_{DD_IO}

68

69

NC

100

101

ANB4

ANB5

V_PP2

PWMB3

6

7

8

CLKO

TXD0

RXD0

38

39

40

PWMB4

PWMB5

TXD1

70

71

72

NC

102

103

104

ANB6

ANB7

OCR_DIS

V_{DDA_OSC_PLL}

GPIOC8

9

SCLK1

MOSI1

MISO1

41

42

43

RXD1

73

74

75

XTAL

105

106

107

GPIOC9

GPIOC10

GPIOE10

10

11

GPIOD0

GPIOD1

EXTAL

V_CAP3

12

13

14

15

16

17

18

19

20

21

220

23

24

25

SS1

44

45

46

47

48

49

50

51

52

53

54

55

56

57

GPIOD2

GPIOD3

GPIOD4

GPIOD5

ISB0

76

77

78

79

80

81

82

83

84

85

86

87

88

89

V_{DD_IO}

RSTO

RESET

CLKMODE

ANA0

ANA1

ANA2

ANA3

ANA4

AN5

108

109

110

111

112

113

114

115

116

117

118

119

120

121

GPIOE11

GPIOE12

GPIOE13

TC0

V_CAP

4

V_{DD_IO}

GPIOA0¹

GPIOA1¹

GPIOA2¹

GPIOA3¹

GPIOA4¹

V_{DD_IO}

TC1

V_CAP

1

ISB1

ISB2

TRST

TCK

GPIOA5¹

V_SS

IRQA

TMS

IRQB

TDI

GPIOF0¹

GPIOF1¹

FAULTB0

FAULTB1

FAULTB2

FAULTB3

ANA6

ANA7

NC

TDO

V_PP1

GPIOF2¹

V_{DD_IO}

NC

V_REFLO

1. Primary function is not available in this package configuration; GPIO function must be used instead

GPIOF3¹

GPIOB0

26

27

28

58

59

60

NC

V_SS

NC

90

91

92

V_REFN

V_REFMID

V_REFP

122

123

124

V_CAP2

SS0

GPIOB1

SCLK0

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

171

Table 11-2 56F8165 128-Pin LQFP Package Identification by Pin Number (Continued)

Pin No.

29

Signal Name

GPIOB2

Pin No.

61

Signal Name

Pin No.

93

Signal Name

V_REFH

Pin No.

125

Signal Name

MISO0

NC

V_{DD_IO}

NC

30

GPIOB3

62

94

V_{DDA_ADC}

V_{SSA_ADC}

ANB0

126

MOSI0

31

GPIOB4

63

95

127

PHASEA0

PHASEB0

32

PWMB0

64

NC

96

128

56F8365 Technical Data, Rev. 9

172

Freescale Semiconductor

56F8165 Package and Pin-Out Information

MILLIMETERS

DIM

MIN

---

MAX

1.60

0.15

1.45

0.27

0.23

0.20

0.16

A

A1

A2

b

b1

c

0.05

1.35

0.17

0.09

c1

D

22.00 BSC

D1

e

E

E1

L

20.00BSC

0.50 BSC

16.00 BSC

14.00 BSC

NOTES:

0.45

0.75

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE H IS LOCATED AT BOTTOM OF LEAD

AND IS COINCIDENT WITH THE LEAD WHERE THE

LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF

THE PARTING LINE.

L1

L2

S

R1

R2

0

1.00 REF

0.50 REF

0.20

0.08

---

0.20

0^o

11^o

7^o

---

13^o

4. DATUMS A, B, AND D TO BE DETERMINED AT DATUM

01

02

PLANE H.

5. DIMENSIONS D AND E TO BE DETERMINED AT

SEATING PLANE C.

6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER

SIDE. DIMENSIONS D1 AND E1 DO INCLUDE MOLD

MISMATCH AND ARE DETERMINED AT DATUM

PLANE H.

7. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL NOT

CAUSE THE b DIMENSION TO EXCEED 0.35.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

173

Figure 11-3 128-pin LQFP Mechanical Information

Please see www.freescale.com for the most current case outline.

Part 12 Design Considerations

12.1 Thermal Design Considerations

An estimation of the chip junction temperature, T , can be obtained from the equation:

J

T = T + (R

x P )

D

J

A

J

where:

o

T

R

= Ambient temperature for the package ( C)

A

o

= Junction-to-ambient thermal resistance ( C/W)

J

P

= Power dissipation in the package (W)

D

The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy

estimation of thermal performance. Unfortunately, there are two values in common usage: the value

determined on a single-layer board and the value obtained on a board with two planes. For packages such

as the PBGA, these values can be different by a factor of two. Which value is closer to the application

depends on the power dissipated by other components on the board. The value obtained on a single-layer

board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the

internal planes is usually appropriate if the board has low-power dissipation and the components are well

separated.

When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal

resistance and a case-to-ambient thermal resistance:

R

= R

+ R

JA

JC CA

where:

R

= Package junction-to-ambient thermal resistance °C/W

= Package junction-to-case thermal resistance °C/W

= Package case-to-ambient thermal resistance °C/W

JA

JC

CA

R

is device-related and cannot be influenced by the user. The user controls the thermal environment to

JC

change the case-to-ambient thermal resistance, R

. For instance, the user can change the size of the heat

CA

sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit

board, or change the thermal dissipation on the printed circuit board surrounding the device.

To determine the junction temperature of the device in the application when heat sinks are not used, the

Thermal Characterization Parameter ( ) can be used to determine the junction temperature with a

JT

measurement of the temperature at the top center of the package case using the following equation:

T = T + ( x P )

J

T

JT

D

56F8365 Technical Data, Rev. 9

174

Freescale Semiconductor

Electrical Design Considerations

where:

o

T



= Thermocouple temperature on top of package ( C)

= Thermal characterization parameter ( C)/W

T

o

JT

P

= Power dissipation in package (W)

D

The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T

thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so

that the thermocouple junction rests on the package. A small amount of epoxy is placed over the

thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire

is placed flat against the package case to avoid measurement errors caused by cooling effects of the

thermocouple wire.

When heat sink is used, the junction temperature is determined from a thermocouple inserted at the

interface between the case of the package and the interface material. A clearance slot or hole is normally

required in the heat sink. Minimizing the size of the clearance is important to minimize the change in

thermal performance caused by removing part of the thermal interface to the heat sink. Because of the

experimental difficulties with this technique, many engineers measure the heat sink temperature and then

back-calculate the case temperature using a separate measurement of the thermal resistance of the

interface. From this case temperature, the junction temperature is determined from the junction-to-case

thermal resistance.

12.2 Electrical Design Considerations

CAUTION

This device contains protective circuitry to guard

against damage due to high static voltage or electrical

fields. However, normal precautions are advised to

avoid application of any voltages higher than

maximum-rated voltages to this high-impedance circuit.

Reliability of operation is enhanced if unused inputs are

tied to an appropriate voltage level.

Use the following list of considerations to assure correct operation of the 56F8365/56F8165:

•

Provide a low-impedance path from the board power supply to each V_DDpin on the device, and from the

board ground to each V_SS(GND) pin

•

The minimum bypass requirement is to place six 0.01–0.1F capacitors positioned as close as possible to

the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each

of the V_DD/V_SSpairs, including V_DDA/V_SSA.Ceramic and tantalum capacitors tend to provide better

performance tolerances.

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

175

•

Ensure that capacitor leads and associated printed circuit traces that connect to the chip V_DDand V_SS(GND)

pins are less than 0.5 inch per capacitor lead

•

Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for V_DDand V_SS

Bypass the V_DDand V_SSlayers of the PCB with approximately 100F, preferably with a high-grade

capacitor such as a tantalum capacitor

•

Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal

Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.

This is especially critical in systems with higher capacitive loads that could create higher transient currents

in the V_DDand V_SScircuits.

•

Take special care to minimize noise levels on the V_REF, V_DDAand V_SSApins

Designs that utilize the TRST pin for JTAG port or OnCE module functionality (such as development or

debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means

to assert TRST independently of RESET. Designs that do not require debugging functionality, such as

consumer products, should tie these pins together.

•

Because the Flash memory is programmed through the JTAG/OnCE port, the designer should provide an

interface to this port to allow in-circuit Flash programming

12.3 Power Distribution and I/O Ring Implementation

Figure 12-1 illustrates the general power control incorporated in the 56F8365/56F8165. This chip

contains two internal power regulators. One of them is powered from the V

pin and cannot

DDA_OSC_PLL

be turned off. This regulator controls power to the internal clock generation circuitry. The other regulator

is powered from the V pins and provides power to all of the internal digital logic of the core, all

DD_IO

peripherals and the internal memories. This regulator can be turned off, if an external V

voltage

DD_CORE

is externally applied to the V

pins.

CAP

In summary, the entire chip can be supplied from a single 3.3 volt supply if the large core regulator is

enabled. If the regulator is not enabled, a dual supply 3.3V/2.5V configuration can also be used.

Notes:

•

Flash, RAM and internal logic are powered from the core regulator output

V_PP1 and V_PP2 are not connected in the customer system

•

All circuitry, analog and digital, shares a common V_SSbus

56F8365 Technical Data, Rev. 9

176

Freescale Semiconductor

Power Distribution and I/O Ring Implementation

V

DDA_OSC_PLL

V

DDA_ADC

DD

V

REFH

V

CAP

REG

REFP

REG

I/O

ADC

REFMID

CORE

REFN

OSC

REFLO

V

SS

SSA_ADC

Figure 12-1 Power Management

56F8365 Technical Data, Rev. 9

Freescale Semiconductor

177

Part 13 Ordering Information

Table 13-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor

sales office or authorized distributor to determine availability and to order parts.

Table 13-1 Ordering Information

Ambient

Temperature

Range

Supply

Voltage

Count

Frequency

(MHz)

Part

Package Type

Order Number

MC56F8365

MC56F8165

3.0–3.6 V Low-Profile Quad Flat Pack (LQFP)

128

60

40

-40° to + 105° C

-40° to + 125° C

-40° to + 105° C

MC56F8365VFG60

MC56F8365MFG60

MC56F8165VFG

MC56F8365

MC56F8165

3.0–3.6 V Low-Profile Quad Flat Pack (LQFP)

128

60

40

-40° to + 105° C

-40° to + 125° C

-40° to + 105° C

MC56F8365VFGE*

MC56F8365MFGE*

MC56F8165VFGE*

*This package is RoHS compliant.

56F8365 Technical Data, Rev. 9

178

Freescale Semiconductor

How to Reach Us:

Home Page:

www.freescale.com

Web Support:

http://www.freescale.com/support

USA/Europe or Locations Not Listed:

Freescale Semiconductor, Inc.

Technical Information Center, EL516

2100 East Elliot Road

Tempe, Arizona 85284

+1-800-521-6274 or +1-480-768-2130

www.freescale.com/support

Europe, Middle East, and Africa:

Freescale Halbleiter Deutschland GmbH

Technical Information Center

Schatzbogen 7

81829 Muenchen, Germany

+44 1296 380 456 (English)

+46 8 52200080 (English)

+49 89 92103 559 (German)

+33 1 69 35 48 48 (French)

www.freescale.com/support

Japan:

RoHS-compliant and/or Pb-free versions of Freescale products have the

functionality and electrical characteristics of their non-RoHS-compliant

and/or non-Pb-free counterparts. For further information, see

Freescale Semiconductor Japan Ltd.

Headquarters

ARCO Tower 15F

http://www.freescale.com or contact your Freescale sales representative.

1-8-1, Shimo-Meguro, Meguro-ku,

Tokyo 153-0064

For information on Freescale’s Environmental Products program, go to

http://www.freescale.com/epp.

Japan

0120 191014 or +81 3 5437 9125

support.japan@freescale.com

Information in this document is provided solely to enable system and

software implementers to use Freescale Semiconductor products. There are

no express or implied copyright licenses granted hereunder to design or

fabricate any integrated circuits or integrated circuits based on the

information in this document.

Asia/Pacific:

Freescale Semiconductor China Ltd.

Exchange Building 23F

No. 118 Jianguo Road

Chaoyang District

Beijing 100022

Freescale Semiconductor reserves the right to make changes without further

notice to any products herein. Freescale Semiconductor makes no warranty,

representation or guarantee regarding the suitability of its products for any

particular purpose, nor does Freescale Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation consequential or

incidental damages. “Typical” parameters that may be provided in Freescale

Semiconductor data sheets and/or specifications can and do vary in different

applications and actual performance may vary over time. All operating

parameters, including “Typicals”, must be validated for each customer

application by customer’s technical experts. Freescale Semiconductor does

not convey any license under its patent rights nor the rights of others.

Freescale Semiconductor products are not designed, intended, or authorized

for use as components in systems intended for surgical implant into the body,

or other applications intended to support or sustain life, or for any other

application in which the failure of the Freescale Semiconductor product could

create a situation where personal injury or death may occur. Should Buyer

purchase or use Freescale Semiconductor products for any such unintended

or unauthorized application, Buyer shall indemnify and hold Freescale

Semiconductor and its officers, employees, subsidiaries, affiliates, and

distributors harmless against all claims, costs, damages, and expenses, and

reasonable attorney fees arising out of, directly or indirectly, any claim of

personal injury or death associated with such unintended or unauthorized

use, even if such claim alleges that Freescale Semiconductor was negligent

regarding the design or manufacture of the part.

China

+86 10 5879 8000

support.asia@freescale.com

For Literature Requests Only:

Freescale Semiconductor Literature Distribution Center

1-800-441-2447 or 303-675-2140

Fax: 303-675-2150

LDCForFreescaleSemiconductor@hibbertgroup.com

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor,

Inc. All other product or service names are the property of their respective owners.

This product incorporates SuperFlash® technology licensed from SST.

MC56F8365

Rev. 9

02/2012


型号：	S56F8365W0MFGE
厂家：	NXP
描述：	Digital Signal Processor 外围集成电路
文件：	总180页 (文件大小：1733K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

S56F8365W0MFGE [NXP]

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