SA5090D-T [NXP]
暂无描述;型号: | SA5090D-T |
厂家: | NXP |
描述: | 暂无描述 驱动器 继电器 |
文件: | 总6页 (文件大小:97K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Philips Semiconductors Linear Products
Product specification
Addressable relay driver
NE/SA5090
DESCRIPTION
PIN CONFIGURATION
The NE/SA5090 addressable relay driver is a high-current latched
driver, similar in function to the 9934 address decoder. The device
has 8 open-collector Darlington power outputs, each capable of
150mA load current. The outputs are turned on or off by respectively
loading a logic “1” or logic “0” into the device data input. The
required output is defined by a 3-bit address. The device must be
enabled by a CE input line which also serves the function of further
address decoding. A common clear input, CLR, turns all outputs off
when a logic “0” is applied. The device is packaged in a 16-pin
plastic or Cerdip package.
1
D , N Packages
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A
A
V
0
1
CC
CLR
CE
A
Q
2
D
0
1
2
Q
Q
Q
7
Q
6
Q
Q
5
3
GND
Q
4
FEATURES
• 8 high-current outputs
TOP VIEW
• Low-loading bus-compatible inputs
• Power-on clear ensures safe operation
• Will operate in addressable or demultiplex mode
• Allows random (addressed) data entry
• Easily expandable
NOTE:
1. SOL - Released in Large SO package only.
APPLICATIONS
• Relay driver
• Pin-compatible with 9334 (Siliconix or Fairchild)
• Indicator lamp driver
• Triac trigger
• LED display digit driver
• Stepper motor driver
BLOCK DIAGRAM
CLR
CE
LATCH
Q
0
LATCH
LATCH
LATCH
Q
1
2
3
Q
Q
A
0
A
CONTROL
GATE
1–OF–8
DECODER
1
2
LATCH
Q
Q
Q
4
5
6
7
A
LATCH
LATCH
D
LATCH
Q
INPUT STAGE
OUTPUT STAGE
V
CC
512
August 31, 1994
853-0892 13721
Philips Semiconductors Linear Products
Product specification
Addressable relay driver
NE/SA5090
PIN DESIGNATION
PIN NO.
SYMBOL
A -A
NAME AND FUNCTION
1-3
A 3-bit binary address on these pins defines which of the 8 output latches is to receive the data.
The 8 device outputs.
0
2
4-7, 9-12
13
Q -Q
0
7
D
The data input. When the chip is enabled, this data bit is transferred to the defined output such that:
“1” turns output switch “ON”
“0” turns output switch “OFF”
14
15
CE
The chip enable. When this input is low, the output latches will accept data. When CE goes high, all
outputs will retain their existing state, regardless of address of data input condition.
CLR
The clear input. When CLR goes low all output switches are turned “OFF”. The high data input will
override the clear function on the addressed latch.
ORDERING INFORMATION
DESCRIPTION
TEMPERATURE RANGE
0 to +70°C
ORDER CODE
NE5090D
DWG #
0171B
0406C
0406C
0171B
16-Pin Plastic Small Outline Large (SOL) Package
16-Pin Plastic Dual In-Line Package (DIP)
16-Pin Plastic Dual In-Line Package (DIP)
16-Pin Plastic Small Outline Large (SOL) Package
0 to +70°C
NE5090N
-40 to +85°C
SA5090N
–40 to +85°C
SA5090D
TRUTH TABLE
INPUTS
OUTPUTS
MODE
CL
R
C
E
D
A
0
A
1
A
2
Q
0
Q
1
Q
2
Q
3
Q
4
Q
5
Q
6
Q
7
L
L
H
L
L
L
L
L
L
H
L
L
L
L
L
L
X
L
X
X
X
H
H
H
H
H
H
H
H
Clear
L
L
L
L
L
L
H
L
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
H
L
L
H
H
H
H
X
L
L
L
H
H
H
H
Demultiplex
L
H
L
L
L
L
H
H
X
L
H
H
X
L
H
H
L
H
X
L
H
H
H
H
H
H
H
Q
Memory
N-1
H
Q
N-1
H
L
L
L
L
L
Q
N-1
H
H
H
H
L
L
Q
H
Q
Addressable Latch
N-1
N-1
N-1
N-1
N-1
H
L
L
L
Q
Q
Q
L
Q
N-1
H
H
H
H
H
L
H
NOTES:
X=Don’t care condition
=Previous output state
Q
N-1
L=Low voltage level/“ON” output state
H=High voltage level/“OFF” output state
513
August 31, 1994
Philips Semiconductors Linear Products
Product specification
Addressable relay driver
NE/SA5090
ABSOLUTE MAXIMUM RATINGS
T =25°C, unless otherwise specified.
A
SYMBOL
PARAMETER
RATING
-0.5 to +7
-0.5 to +15
0 to +30
500
UNIT
V
V
V
V
Supply voltage
Input voltage
CC
IN
V
Output voltage
Ground current
V
OUT
GND
I
mA
Output current
Each output
I
200
mA
OUT
P
D
Maximum power dissipation,
1
T =25°C (still-air)
A
N package
1712
1315
mW
mW
°C
D package
T
A
Ambient temperature range
Junction temperature
Storage temperature range
0 to +70
150
T
J
°C
T
STG
T
SOLD
-65 to +150
300
°C
Lead soldering temperature (10sec. max)
°C
NOTES:
1. Derate above 25°C at the following rates:
F package at 11.1mW/°C
N package at 13.7mW/°C
D package at 10.5mW/°C
DC ELECTRICAL CHARACTERISTICS
1
V
= 4.75V to 5.25V, 0°C ≤T ≤ +70°C, unless otherwise specified.
CC
A
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
UNIT
Min
Typ
Max
Input voltage
V
V
High
Low
2.0
V
IH
0.8
IL
Output voltage
Low
V
OL
I
OL
=150mA, T =25°C
1.05
1.30
1.50
V
A
Over temperature
Input current
High
I
I
I
V
=V
CC
<1.0
-3.0
5
10
µA
µA
IH
IN
Low
V
=0V
-250
250
IL
IN
Leakage current
Supply current
All outputs low
All outputs high
Power dissipation
V
OUT
=28V,
OH
I
I
V
CC
=5.25V
35
22
60
50
mA
mW
CCL
CCH
P
No output load
315
D
NOTES:
1. All typical values are at V =5V and T =25°C
CC
A
514
August 31, 1994
Philips Semiconductors Linear Products
Product specification
Addressable relay driver
NE/SA5090
SWITCHING CHARACTERISTICS
V
CC
=5V, T =25°C, V
=5V, I =100MA, V =0.8V, V =2.0V.
OUT OUT IL IH
A
SYMBOL
PARAMETER
TO
FROM
MIN
TYP
MAX
UNIT
Propagation delay time
1
t
Low-to-high
Output
CE
900
130
920
1800
260
ns
PLH
1
t
t
High-to-low
PHL
PLH
2
Low-to-high
1850
Output
Output
Output
Data
Address
CLR
ns
ns
ns
2
t
t
High-to-low
130
900
260
PHL
3
Low-to-high
1800
PLH
3
t
t
High-to-low
130
920
260
PHL
4
Low-to-high
1850
PLH
4
t
High-to-low
PHL
Switching setup requirements
Setup time high
Setup time low
Chip enable
Chip enable
High data
Low data
40
50
t
t
t
t
ns
ns
ns
ns
S(H)
Address setup time
Chip enable
Address
40
S(A)
Hold time high
Hold time low
Chip enable
Chip enable
High data
Low data
10
10
H(H)
1
Chip enable pulse width
40
PW(E)
NOTES:
1. See Turn-On and Turn-Off Delays, Enable-to-Output and Enable Pulse Width timing diagram.
2. See Turn-On and Turn-Off Delays, Data-to-Output timing diagram.
3. See Turn-On and Turn-Off Delays, Address-to-Output timing diagram.
4. See Turn-Off Delay, Clear-to-Output timing diagram.
5. See Setup and Hold Time, Data-to-Enable timing diagram.
6. See Setup Time, Address-to-Enable timing diagram.
The maximum die junction temperature must be limited to 165°C,
and the temperature rise above ambient and the junction
temperature are defined as:
FUNCTIONAL DESCRIPTION
This peripheral driver has latched outputs which hold the input date
until cleared. The NE5090 has active-Low, open-collector outputs,
all of which are cleared when power is first applied. This device is
identical to the NE590, except the outputs can withstand 28V.
T =θ ×P
D
R
JA
T =T +t
J
A
R
where
Addressable Latch Function
Any given output can be turned on or off by presenting the address
of the output to be set or cleared to the three address pins, by
holding the “D” input High to turn on the selected output, or by
holding it Low to turn off, holding the CLR input High, and bringing
the CE input Low. Once an output is turned on or off, it will remain
so until addressed again, or until all outputs are cleared by bringing
the CLR input Low while holding the CE input High.
For example, if we are using the NE5090 in a plastic package in an
application where the ambient temperature is never expected to rise
above 50°C, and the output current at the 8 outputs, when on, are
100, 40, 50, 200, 15, 30, 80, and 10mA, we find from the graph of
output voltage vs load current that the output voltages are expected
to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4V,
respectively. Total device power due to these loads is found to be
473.5mW. Adding the 200mW due to the power supply brings total
device power dissipation to 723.5mW. The thermal resistances are
83°C,per W for plastic packages and 100°C per W for Cerdips.
Using the equations above we find:
Demultiplexer Operation
By holding the CLR and CE inputs Low and the ”D“ input High, the
addressed output will remain on and all other outputs will be off.
High Current Outputs
Plastic T =83×0.7235=60°C
R
The obvious advantage of this device over other drivers such as the
9334 and N74LS259 is the fact that the outputs of the NE5090 are
each capable of 200mA and 28V. It must be noted, however, that the
total power dissipation would be over 2.5W if all 8 outputs were on
together and carrying 200mA each. Since the total power dissipation
is limited by the package to 1W, and since power dissipation due to
supply current is 0.25W, the total load power dissipation by the
device is limited to 0.75W at room temperature, and decreases as
ambient temperature rises.
Plastic T =50+60=100°C
J
Cerdip T =100×0.7235=72.4°C
R
Cerdip T =50+72.4=122.4°C
J
Thus we find that T for either package is below the 165°C
J
maximum and either package could be used in this application. The
graphs of total load power vs ambient temperature would also give
us this same information, although interpreting the graphs would not
yield the same accuracy.
515
August 31, 1994
Philips Semiconductors Linear Products
Product specification
Addressable relay driver
NE/SA5090
TIMING DIAGRAMS
D
D
t
t
PW
PW
CE
t
t
PHL
PLH
t
t
PHL
PLH
Q
Q
NOTE:
Other Inputs: CLR = H, A = Stable
NOTE:
Other Inputs: CE = I, CLR = H, A = Stable
Turn-On and Turn-Off Delays, Enable-to-Output
and Enable Pulse Width
Turn-On and Turn-Off Delays, Data-to-Output
A
CLR
t
PLH
A
Q
Q
t
t
PHL
PLH
NOTE:
Other Inputs: CE = L, CLR = L, D = H
Turn-On and Turn-Off Delays, Address-to-Output
Turn-Off Delays, Clear-to-Output
D
t
t
HH
HL
t
SH
A
t
SL
CE
t
S
CE
Q
NOTE:
Other Inputs: CLR = H, A = Stable
NOTE:
Other Inputs: CLR = H
Setup and Hold Time, Data-to-Enable
Setup Time, Address-to-Enable
516
August 31, 1994
Philips Semiconductors Linear Products
Product specification
Addressable relay driver
NE/SA5090
TYPICAL APPLICATIONS
+ 5V
+5V TO 28V
R
L
+28V
DATA
BUS
Q
Q
Q
0
1
2
µP
+ 5V
D
4
+ 5V
Q
Q
Q
Q
Q
3
0
5090
RELAY
LOAD
5
6
7
CE
D
A
A
A
Q
Q
Q
Q
Q
Q
Q
Q
A
A
A
Q
0
2
1
0
0
1
2
3
0
5
6
7
2
1
0
Q
1
Q
2
Q
3
5090
5090
Q
0
Q
5
Driving Simple Loads
CE
CLR
CE
CLR
Q
6
Q
7
IQ
CONTROL
+5V
+5V
+5V
CLEAR
Q
Q
Q
0
1
2
D
A
A
A
0
1
3–BIT
COUNTER
Q
Q
Q
Q
Q
3
0
555
NOTE:
5090
2
A
, A , A may be connected to the address bus if permitted by system design.
5
6
7
0
1
2
CE
CLR
Interfacing With a Microprocessor System
Operating in Demultiplex Mode
TYPICAL PERFORMANCE CHARACTERISTICS
Output Voltage
vs Load Current
Total Load Power
vs Temperature
1.2
1.0
1.0
N PACKAGE
0.75
0.8
0.50
0.25
0 C
25 C
F PACKAGE
0.6
70 C
0.4
0
200
50
100
0
25
50
75
100
125
150
o
TEMPERATURE ( C)
OUTPUT LOAD CURRENT (mA)
517
August 31, 1994
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