SA56004FDP-T_技术文档

SA56004X

±1 °C accurate, SMBus-compatible, 8-pin, remote/local digital

temperature sensor with overtemperature alarms

Rev. 05 — 22 May 2008

Product data sheet

1. General description

The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital

temperature sensor with overtemperature alarms. The remote channel of the SA56004X

monitors a diode junction, such as a substrate PNP of a microprocessor or a diode

connected transistor such as the 2N3904 (NPN) or 2N3906 (PNP). With factory trimming,

remote sensor accuracy of ±1 °C is achieved.

Undertemperature and overtemperature alert thresholds can be programmed to cause

the ALERT output to indicate when the on-chip or remote temperature is out of range. This

output may be used as a system interrupt or SMBus alert. The T_CRIT output is activated

when the on-chip or remote temperature measurement rises above the programmed

T_CRIT threshold register value. This output may be used to activate a cooling fan, send a

warning or trigger a system shutdown. To further enhance system reliability, the

SA56004X employs an SMBus time-out protocol. The SA56004X has a unique device

architecture.

The SA56004X is available in the SO8, TSSOP8 and HVSON8 packages. SA56004X has

8 factory-programmed device address options. The SA56004X is pin-compatible with the

LM86, MAX6657/8, and ADM1032.

2. Features

I Accurately senses temperature of remote microprocessor thermal diodes or diode

connected transistors within ±1 °C

I On-chip local temperature sensing within ±2 °C

I Temperature range of −40 °C to +125 °C

I 11-bit, 0.125 °C resolution

I 8 different device addresses are available for server applications. The SA56004ED

with marking code 56004E, and SA56004EDP with marking code 6004E are address

compatible with the National LM86, the MAX6657/8 and the ADM1032.

I Offset registers available for adjusting the remote temperature accuracy

I Programmable under/overtemperature alarms: ALERT and T_CRIT

I SMBus 2.0 compatible interface, supports TIMEOUT

I Operating voltage range: 3.0 V to 3.6 V

I I²C-bus Standard-mode and Fast-mode compatible

I SO8, TSSOP8 and HVSON8 packages

I Programmable conversion rate (0.0625 Hz to 26 Hz)

I Undervoltage lockout prevents erroneous temperature readings

I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

3. Applications

I System thermal management in laptops, desktops, servers and workstations

I Computers and ofﬁce electronic equipment

I Electronic test equipment and instrumentation

I HVAC

I Industrial controllers and embedded systems

4. Ordering information

Table 1.

Ordering information

Type number^[1]Package

Name

Description

Version

SA56004AD

SA56004BD

SA56004CD

SA56004DD

SA56004ED

SA56004FD

SA56004GD

SA56004HD

SA56004ADP

SA56004BDP

SA56004CDP

SA56004DDP

SA56004EDP

SA56004FDP

SA56004GDP

SA56004HDP

SA56004ATK

SA56004ETK

SA56004FTK

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

TSSOP8

plastic thin shrink small outline package; 8 leads; body width 3 mm

SOT505-1

HVSON8

plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 × 3 × 0.85 mm

SOT782-1

[1] There are 8 device slave address options, as described in Table 2.

4.1 Ordering options

Table 2.

Ordering options

Type number

SA56004AD

SA56004ADP

SA56004ATK

SA56004BD

SA56004BDP

Topside mark

56004A

6004A

Device slave address^[1]

1001 000

6004A

56004B

6004B

1001 001

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

2 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 2.

Ordering options …continued

Type number

SA56004CD

SA56004CDP

SA56004DD

SA56004DDP

SA56004ED^[2]

SA56004EDP^[2]

SA56004ETK^[2]

SA56004FD

Topside mark

56004C

6004C

Device slave address^[1]

1001 010

56004D

6004D

1001 011

1001 100

56004E

6004E

56004F

6004F

1001 101

SA56004FDP

SA56004FTK

SA56004GD

SA56004GDP

SA56004HD

SA56004HDP

6004F

56004G

6004G

1001 110

1001 111

56004H

6004H

[1] The device slave address is factory programmed in OTP device address register.

[2] The SA56004ED/EDP/ETK has the bus address of the National LM86, MAX6657/8 and the ADM1032.

5. Block diagram

SA56004X

ONE-SHOT

REGISTER

V

DD

LOCAL

TEMP

SENSOR

REMOTE OFFSET

REGISTER

CONFIGURATION

REGISTER

COMMAND

REGISTER

CONTROL

LOGIC

CONVERSION

REGISTER

LOCAL HIGH TEMP

THRESHOLD

LOCAL TEMP HIGH

LIMIT REGISTER

LOCAL TEMP

DATA REGISTER

LOCAL LOW TEMP

THRESHOLD

LOCAL TEMP LOW

THRESHOLD

11-BIT

Σ-∆

D+

LOCAL

REMOTE

MUX

A-to-D

CONVERTER

D−

REMOTE TEMP

DATA REGISTER

REMOTE HIGH

TEMP THRESHOLD

REMOTE TEMP

HIGH LIMIT REG.

T_CRIT

HYSTERESIS

REMOTE LOW

TEMP THRESHOLD

REMOTE TEMP

LOW LIMIT REG.

ALERT

INTERRUPT

STATUS REGISTER

GND

OTP DEVICE

ADDRESS REGISTER

T_CRIT

INTERRUPT

SMBus INTERFACE

002aad202

SDATA

SCLK

Fig 1. Block diagram

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

3 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

6. Pinning information

6.1 Pinning

1

2

3

4

8

7

6

5

V

SCLK

SDATA

ALERT

GND

DD

1

2

3

4

8

7

6

5

V

SCLK

SDATA

ALERT

GND

DD

D+

D−

D+

D−

SA56004XD

SA56004XDP

T_CRIT

002aad199

002aad198

Fig 2. Pin conﬁguration for SO8

Fig 3. Pin conﬁguration for TSSOP8

terminal 1

index area

1

2

3

4

8

7

6

5

V

SCLK

SDATA

ALERT

GND

DD

D+

D−

SA56004XTK

T_CRIT

002aad200

Transparent top view

Fig 4. Pin conﬁguration for HVSON8

6.2 Pin description

Table 3.

Symbol

Pin description

Pin Description

V_DD

1

Positive supply voltage. DC voltage from 3.0 V to 5.5 V.

Diode current source (anode).

D+

2

3

4

D−

Diode sink current (cathode).

T_CRIT

T_CRIT alarm is open-drain, active LOW output which requires an external

pull-up resistor. It functions as a system interrupt or power shutdown.

GND

5

6

Power supply ground.

ALERT

ALERT alarm is an open-drain, active LOW output which requires an

external pull-up resistor. It functions as an interrupt indicating that the

temperature of the on-chip or remote diode is above or below programmed

overtemperature or undertemperature thresholds.

SDATA

SCLK

7

8

SMBus/I²C-bus bidirectional data line. This is an open-drain output which

requires an external pull-up resistor.

SMBus/I²C-bus clock input which requires an external pull-up resistor.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

4 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

7. Functional description

Refer to Figure 1 “Block diagram”.

7.1 Serial bus interface

The SA56004X should be connected to a compatible two-wire serial interface System

Management Bus (SMBus) as a slave device using the two device terminals SCLK and

SDATA. The ALERT pin can optionally be used with the SMBus protocol to implement the

ARA response. The controller will provide a clock signal to the device SCLK pin and

write/read data to/from the device through the device SDATA pin. External pull-up

resistors, about 10 kΩ each, are needed for these device pins due to open-drain circuitry.

Data of 8-bit digital byte or word are used for communication between the controller and

the device using SMBus 2.0 protocols which are described more in Section 7.10 “SMBus

interface”. The operation of the device to the bus is described with details in the following

sections.

7.2 Slave address

The SA56004X has a 7-bit slave address register which is factory programmed in OTP

memory. Eight unique devices are available with different slave addresses as deﬁned in

Table 2 “Ordering options”. Up to eight devices can reside on the same SMBus without

conﬂict, provided that their addresses are unique.

7.3 Register overview

The SA56004X contains three types of SMBus addressable registers. These are

read-only (R), write-only (W), and read-write (R/W). Attempting to write to any R-only

register or read data from any W-only register will produce an invalid result. Some of the

R/W registers have separate addresses for reading and writing operations.

The registers of the SA56004X serve four purposes:

• Control and conﬁguration of the SA56004X

• Status reporting

• Temperature measurement storage

• ID and manufacturer test registers

Table 4 describes the names, addresses, Power-On Reset (POR), and functions of each

register. The data of the temperature-related registers is in 2’s complement format in

which the MSB is the sign bit. The 8-bit data of other registers is in 8-bit straight format.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

5 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 4.

Register assignments

Command byte

Register

name

POR state

Function

Bits

Access

Read

Write

address

LTHB

RTHB

SR

00h

01h

02h

03h

04h

05h

06h

07h

08h

n/a

0000 0000

1000

local temperature high byte

remote temperature high byte

status register

8

R

n/a

8

R

n/a

8

R

CON

09h

0Ah

0Bh

0Ch

0Dh

0Eh

0Fh

n/a

conﬁguration register

8

R/W

W

CR

conversion rate

4

LHS

0100 0110

0000 0000

0100 0110

0000 0000

-

local high setpoint

8

LLS

local low setpoint

8

RHSHB

RLSHB

One Shot

RTLB

RTOHB

RTOLB

RHSLB

RLSLB

RCS

remote high setpoint high byte

remote low setpoint high byte

writing register initiates a one shot conversion

remote temperature low byte

remote temperature offset high byte

remote temperature offset low byte

remote high setpoint low byte

remote low setpoint low byte

remote T_CRIT setpoint

local T_CRIT setpoint

8

0

10h

11h

12h

13h

14h

19h

20h

21h

22h

BFh

FEh

FFh

0000 00

0000 0000

000

6 (MSBs)

8

R

11h

12h

13h

14h

19h

20h

21h

n/a

R/W

3 (MSBs) R/W

000

0101 0101

0 1010

8

R/W

R

LCS

8

TH

T_CRIT hysteresis

5

ATLB

AM

0000 0000

0

local temperature low byte

Alert mode

3 (MSBs)

BFh

n/a

1

8

R/W

R

RMID

RDR

1010 0001

0000 0000

read manufacturer’s ID

n/a

read stepping or die revision

R

7.4 Power-on reset

When power is applied to the SA56004X, the device will enter into its Power-On Reset

(POR) state and its registers are reset to their default values. The conﬁguration, status,

and temperature-reading registers remain in these states until after the ﬁrst conversion.

As shown in Table 4 this results in:

1. Command register set to 00h.

2. Local Temperature register (LTHB and LTLB) set to 0 °C.

3. Remote Diode Temperature register (RTHB and RTLB) set to 0 °C until the end of the

ﬁrst conversion.

4. Status register (SR) set to 00h.

5. Conﬁguration register (CON) set to 00h; interrupt latches are cleared, the ALERT and

T_CRIT output drivers are off and the ALERT and T_CRIT pins are pulled HIGH by

the external pull-up resistors.

6. Local T_CRIT temperature setpoints (LCS) and Remote T_CRIT temperature

setpoints (RCS) at 85 °C.

7. Local HIGH setpoint (LHS) and remote HIGH temperature setpoint (RHSHB) at 70 °C.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

6 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

8. Local LOW setpoint (LLS) and Remote LOW temperature setpoints (RLSHB) at 0 °C.

9. Conversion Rate register (CR) is set to 8h; the default value of about 16

conversions/s.

7.5 Starting conversion

Upon POR, the RUN/STOP bit 6 of the conﬁguration register is zero (default condition),

then, the device will enter into its free-running operation mode in which the device A/D

converter is enabled and the measurement function is activated. In this mode, the device

cycles the measurements of the local and remote temperature automatically and

periodically. The conversion rate is deﬁned by the programmable conversion rate stored in

the conversion rate register. It also performs comparison between readings and limits of

the temperature in order to set the ﬂags and interruption accordingly at the end of every

conversion. Measured values are stored in the temp registers, results of the limit

comparisons are reﬂected by the status of the ﬂag bits in the status register and the

interruption is reﬂected by the logical level of the ALERT and T_CRIT output. If the

power-on temperature limit is not suitable, the temp limit values could be written into the

limit registers during the busy-conversion duration of about 38 ms of the ﬁrst conversion

after power-up. Otherwise, the status register must be read and the conﬁguration bit 7

must be reset in order to recover the device from interruption caused by the undesired

temp limits.

7.6 Low power software standby mode

The device can be placed in a software standby mode by setting the RUN/STOP bit 6 in

the conﬁguration register HIGH (logic 1). In standby, the free-running oscillator is stopped,

the supply current is less than 10 µA if there is no SMBus activity, all data in the registers

is retained. However, the SMBus is still active and reading and writing registers can still be

performed. A one-shot command will initiate a single conversion which has the same

effect as any conversion that occurs when the device is in its free-running mode. To

restore the device to free running mode, set the RUN/STOP bit 6 LOW (logic 0).

7.7 Temperature data format

The temperature data can only be read from the Local and Remote Temperature

registers; the setpoint registers (e.g., T_CRIT, LOW, HIGH) are read/write.

Both local and remote temperature reading data is represented by an 11-bit,

2’s complement word with the Least Signiﬁcant Bit (LSB) = 0.125 °C. The temperature

setpoint data for the remote channel is also represented by an 11-bit, 2’s complement

word with the LSB = 0.125 °C. The temperature setpoint data for both the local channel

and the T_CRIT setpoints are represented by 8-bit, 2’s complement words with the

LSB =1.0 °C. For 11-bit temp data, the data format is a left justiﬁed, 16-bit word available

in two 8-bit registers (high byte and low byte). For 8-bit temp data, the data is available in

a single 8-bit register (high byte only).

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

7 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 5.

Temperature data format

Temperature

Digital output

Binary

Hex

+125 °C

+25 °C

+1 °C

0111 1101 0000 0000

0001 1001 0000 0000

0000 0001 0000 0000

0000 0000 0010 0000

0000 0000 0000 0000

1111 1111 1110 0000

1111 1111 0000 0000

1110 0111 0000 0000

1100 1001 0000 0000

7D00h

1900h

0100h

0020h

0000h

FFE0h

FF00h

E700h

C900h

+0.125 °C

0 °C

−0.125 °C

−1 °C

−25 °C

−55 °C

7.8 SA56004X SMBus registers

7.8.1 Command register

The command register selects which register will be read or written to. Data for this

register should be transmitted during the Command Byte of the SMBus write

communication.

7.8.2 Local and remote temperature registers (LTHB, LTLB, RTHB, RTLB)

Table 6.

Byte

LTHB, LTLB, RTHB, RTLB - Local and remote temperature registers

High byte (read only; address 00h, 01h)

Low byte (read only; address 10h)

Bit

D7

D6

D5

D4

D3

D2

D1

D0

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

0.5 0.25 0.125

0

7.8.3 Conﬁguration register (CON)

The conﬁguration register is an 8-bit register with read address 03h and write address

09h. Table 7 shows how the bits in this register are used.

Table 7.

CON - Conﬁguration register (read address 03h; write address 09h)

bit assignments

Bit

Description

POR state

7

ALERT mask.

0

The ALERT interrupt is enabled when this bit is LOW. The ALERT interrupt

is disabled (masked) when this bit is HIGH.

6

RUN/STOP.

0

Standby or run mode control. Running mode is enabled when this bit is

LOW. The SA56004X is in standby mode when this bit is HIGH.

5

4

Not deﬁned; defaults to logic 0.

Remote T_CRIT mask.

0

The T_CRIT output will be activated by a remote temperature that exceeds

the remote T_CRIT setpoint when this bit is LOW. The T_CRIT output will

not be activated under this condition when this bit is HIGH.

3

Not deﬁned; defaults to logic 0.

0

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

8 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 7.

CON - Conﬁguration register (read address 03h; write address 09h)

bit assignments …continued

Bit

Description

POR state

2

Local T_CRIT mask.

0

The T_CRIT output will be activated by a local temperature that exceeds

the local T_CRIT setpoint when this bit is LOW. The T_CRIT output will not

be activated under this condition when this bit is HIGH.

1

0

Not deﬁned; defaults to logic 0.

Fault queue.

0

A single remote temperature measurement outside the HIGH, LOW or

T_CRIT setpoints will trigger an outside limit condition resulting in setting

the status bits and associated output pins when this bit is LOW. Three

consecutive measurements outside of one of these setpoints are required

to trigger an outside of limit condition when this bit is HIGH.

7.8.4 Status register (SR)

The contents of the status register reﬂect condition status resulting from all activities:

comparison between temperature measurements and temperature limits, the status of

A/D conversion, and the hardware condition of external diode to the device. Bit

assignments are listed in Table 8. This register is read-only and its address is 02h. Upon

POR, all bits are set to zero.

Remark: Any one of the fault conditions, with the exceptions of Diode OPEN and

A/D BUSY, introduces an Alert interrupt (see Section 7.9.1.2). Also, whenever a one-shot

command is executed, the status byte should be read after the conversion is completed,

which is about 38 ms (1 conversion time period) after the one-shot command is sent.

Table 8.

SR - Status register (read-only address 02h) bit assignments

Description

Bit

7

Name

BUSY

When logic 1, A/D is busy converting. POR state = n/a.

6

LHIGH When logic 1, indicates local HIGH temperature alarm. POR state = 0.

LLOW When logic 1, indicates a local LOW temperature alarm. POR state = 0.

RHIGH When logic 1, indicates a remote diode HIGH temperature alarm. POR state = 0.

RLOW When logic 1, indicates a remote diode LOW temperature alarm. POR state = 0.

OPEN When logic 1, indicates a remote diode disconnect. POR state = 0.

RCRIT When logic 1, indicates a remote diode critical temperature alarm. POR state = 0.

LCRIT When logic 1, indicates a local critical temperature alarm. POR state = 0.

5

4

3

2

1

0

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

9 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

7.8.5 Conversion rate register (CR)

The conversion rate register is used to store programmable conversion data, which

deﬁnes the time interval between conversions in the standard free-running auto convert

mode. Table 9 shows all applicable data values and rates for the SA56004X. Only the

4 LSBs of the register are used and the other bits are reserved for future use. The register

is R/W using the read address 04h and write address 0Ah. The POR default conversion

data is 08h.

Table 9.

Data value

00h

Conversion rate control byte (CR)

Conversion rate (Hz)

0.06

0.12

0.25

0.50

1.0

2

01h

02h

03h

04h

05h

06h

4

07h

8

08h

16

09h

32

0Ah to FFh

n/a

7.8.6 Temperature limit registers

Table 10. LHS, RHSHB, RHSLB - Local and remote HIGH setpoint registers

Byte

High byte (read only address 05h, 07h;

write address 0Bh, 0Dh)^[1]

Low byte (read/write address 13h)^[2]

Bit

D7

D6

D5

D4

D3

D2

D1

D0

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

0.5 0.25 0.125

0

[1] POR default LHS = RHSHV = 46h (70 °C).

[2] POR default RHSLB = 00h.

Table 11. LLS, RLSHB, RLSLB - Local and remote LOW setpoint registers

Byte

High byte (read address 06h, 08h;

write address 0Ch, 0Eh)^[1]

Low byte (read/write address 14h)^[2]

Bit

D7

D6

D5

D4

D3

D2

D1

D0

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

0.5 0.25 0.125

0

[1] POR default LLS = RLSHV = 00h.

[2] POR default RLSLB = 00h (0 °C).

Table 12. LCS, RCS - Local and remote T_CRIT registers

Byte

Bit

Single high byte (read/write address 20h, 19h)^[1]

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

[1] POR default LCS = RCS = 55h (85 °C).

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

10 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 13. TH - T_CRIT hysteresis register

Byte

Bit

Single high byte (read/write address 21h)^[1]

D7

D6

D5

D4

D3

D2

D1

D0

Value

-

16

8

4

2

1

[1] POR default TH = 0Ah (10 °C).

7.8.7 Programmable offset register (remote only)

Table 14. RTOHB, RTOLB - Remote temperature offset registers

Byte

Bit

High byte (read/write address 11h)^[1]

Low byte (read/write address 12h)^[2]

D7

D6

D5

D4

D3

D2

D1

D0

D7

D6

D5

D4

D3

D2

D1

D0

Value

sign

64

32

16

8

4

2

1

0.5 0.25 0.125

0

[1] POR default RTOHB = RTOLB = 00h.

[2] POR default RTOLB = 00h.

7.8.8 ALERT mode register (AM)

Table 15. AM - ALERT mode register

Read and write address BFh.

Bit

D7

D6

D5

D4

D3

D2

D1

D0

ALERT mode

Value

0

D[7:1] is not deﬁned and defaults to logic 0.

D0: The ALERT output is in interrupt mode when this bit is LOW. The ALERT output is in

comparator mode when this bit is HIGH.

7.8.9 Other registers

The Manufacturers ID register has a default value A1h (1010 0001) and a read address

FEh.

The Die Revision Code register has a default value 00h (0000 0000) and read address

FFh. This register will increment by 1 every time there is a revision to the die.

7.8.10 One-shot register

The one-shot register is used to initiate a single conversion and comparison cycle when

the device is in the standby mode; upon completion of the single conversion cycle, the

device returns to the standby mode. It is not a data register; it is the write operation that

causes the one-shot conversion. The data written to this register is not stored; an FFh

value will always be read from this register. To initiate a one-shot operation, send a

standard write command with the command byte of 0Fh (One-Shot Write Address).

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

11 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

7.9 Interruption logic and functional description

7.9.1 ALERT output

The ALERT output is used to signal Alert interruptions from the device to the SMBus or

other system interrupt handler and it is active LOW. Because this is an open-drain output,

a pull-up resistor (typically 10 kΩ) to V_DDis required. Several slave devices can share a

common interrupt line on the same SMBus.

The ALERT function is very versatile and accommodates three separate operating

modes:

• Temperature comparator

• System interrupt based on temperature

• SMBus Alert Response Address (ARA) response.

The ARA and interrupt modes are different only in how the user interacts with the

SA56004X.

At the end of every temperature reading, digital comparators determine if the readings are

above the HIGH or T_CRIT setpoint or below the LOW setpoint register values. If so, the

corresponding bit in the Status register is set. If the ALERT mask bit 7 of the Conﬁguration

register is not HIGH, then any bit set in the Status register other than the BUSY (D7) and

OPEN (D2) will cause the ALERT output pin to be active LOW. An alert will be triggered

after any conversion cycle that ﬁnds the temperature is out of the limits deﬁned by the

setpoint registers. In order to trigger an ALERT in all alert modes, the ALERT mask bit 7 of

the Conﬁguration register must be cleared (not HIGH).

7.9.1.1 ALERT output in comparator mode

When operating the SA56004X in a system that utilizes an SMBus controller not having

an interrupt, the ALERT output may be operated as a temperature comparator. In this

mode, when the condition that triggered the ALERT to be asserted is no longer present,

the ALERT output is released as it goes HIGH. In order to use the ALERT output as a

temperature comparator, bit D0 (the ALERT conﬁgure bit) in the ALERT Mode (AM)

register must be set HIGH. This is not the POR default.

7.9.1.2 ALERT output in interrupt mode

In the interrupt mode, the ALERT output is used to provide an interrupt signal that remains

asserted until the interrupt service routine has elapsed. In the interrupt operating mode, a

read of the Status register will set the ALERT mask bit 7 of the Conﬁguration register if

any of the temperature alarm bits of the Status register is set, with exception of BUSY

(D7) and OPEN (D2). This protocol prevents further ALERT output triggering until the

master device has reset the ALERT mask bit at the end of the interrupt service routine.

The Status register bits are cleared only upon a read of the Status register by the serial

bus master (see Figure 5). In order for the ALERT output to be used as an interrupt, the

ALERT Conﬁgure bit D0 of the ALERT Mode (AM) register must be set LOW (POR

default).

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

12 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

remote temperature high limit

remote diode temperature

ALERT pin

status register bit 4

(RHIGH)

A

B, C

D

E, F

002aad216

Fig 5. ALERT output in interrupt mode

The following events summarize the ALERT output interrupt mode of operation:

Event A: Master senses ALERT output being active-LOW.

Event B: Master reads the SA56004X Status register to determine what cause the

ALERT interrupt.

Event C: SA56004X clears the Status register, resets the ALERT output HIGH, and sets

the ALERT mask bit 7 in the Conﬁguration register.

Event D: A new conversion result indicates the temperature is still above the high limit,

however the ALERT pin is not activated due to the ALERT mask.

Event E: Master should correct the conditions that caused the ALERT output to be

triggered. For instance, the fan is started, setpoint levels are adjusted.

Event F: Master resets the ALERT mask bit 7 in the Conﬁguration register.

7.9.1.3 ALERT output in SMBus ALERT mode

When several slave devices share a common interrupt line, an SMBus alert line is

implemented. The SA56004X is designed to accommodate the Alert interrupt detection

capability of the SMBus 2.0 Alert Response Address (ARA) protocol, deﬁned in SMBus

speciﬁcation 2.0. This procedure is designed to assist the master in resolving which slave

device generated the interrupt and in servicing the interrupt while minimizing the time to

restore the system to its proper operation. Basically, the SMBus provides Alert response

interrupt pointers in order to identify slave devices which have caused the Alert interrupt.

When the ARA command is received by all devices on the SMBus, the devices pulling the

SMBus alert line LOW send their device addresses to the master; await an

acknowledgement and then release the alert line. This requirement to disengage the

SMBus alert line prevents locking up the alert line. The SA56004X complies with this ARA

disengagement protocol by setting the ALERT mask bit 7 in the Conﬁguration register at

address 09h after successfully sending out its address in response to an ARA command

and releasing the ALERT output. Once the mask bit is activated, the ALERT output will be

disabled until enabled by software. In order to enable the ALERT the master must read the

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

13 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Status register, at address 02h, during the interrupt service routine and then reset the

ALERT mask bit 7 in the Conﬁguration register to logic 0 at the end of the interrupt service

routine (see Figure 6).

In order for the SA56004X to respond to the ARA command, the bit D0 in the ALERT

mode register must be set LOW.

ALERT mask bit 7 and the ALERT mode bit D0 are both LOW for the POR default.

remote temperature high limit

remote diode temperature

temperature

ALERT pin

status register bit 4

(RHIGH)

002aad215

A

B

C

D

Fig 6. ALERT pin in SMBus Alert mode

The following events summarize the ALERT output interrupt operation in the SMBus Alert

mode:

Event A: Master senses the ALERT line being LOW.

Event A to B: Master sends a read command using the common 7-bit Alert Response

Address (ARA) of 0001100.

Event A to B: Alerting device(s) return ACK signal and their addresses using the

I²C-bus Arbitration (the device with the lowest address value sends its address ﬁrst. The

master can repeat the alert reading process and work up through all the interrupts).

Event B: Upon the successful completion of returning address, the SA56004X resets its

ALERT output (to OFF) and sets the ALERT mask bit 7 in its conﬁguration register.

Event C: Master should read the device status register to identify and correct the

conditions that caused the Alert interruption. The status register is reset.

Event D: Master resets the ALERT mask bit 7 in the conﬁguration register to enable the

device ALERT output interruption.

Remark: The bit assignment of the returned data from the ARA reading is listed in

Table 16. If none of the devices on the bus is alerted then the returned data from ARA

reading will be FFh (1111 1111).

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

14 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 16. ALERT response bit assignment

ALERT response bit

Device address bit

Function

7 (MSB)

ADD6

ADD5

ADD4

ADD3

ADD2

ADD1

ADD0

1

address bit 6 (MSB) of alerted device

address bit 5 of alerted device

address bit 4 of alerted device

address bit 3 of alerted device

address bit 2 of alerted device

address bit 1 of alerted device

address bit 0 of alerted device

always logic 1

6

5

4

3

2

1

0

7.9.2 T_CRIT output

The T_CRIT output is LOW when any temperature reading is greater than the preset limit

in the corresponding critical temperature setpoint register. When one of the T_CRIT

setpoint temperatures is exceeded, the appropriate status register bit, 1 (RCRIT) or 0

(LCRIT), is set.

After every local and remote temperature conversion the status register ﬂags and the

T_CRIT output are updated. Figure 7 is a timing diagram showing the relationship of

T_CRIT output, Status bit 1 (RCRIT) and the remote critical temperature setpoint (RCS),

and critical temperature hysteresis (TH) with remote temperature changes. Note that the

T_CRIT output is de-activated only after the remote temperature is below the remote

temperature setpoint, RCS minus the hysteresis, TH. In the interrupt mode only, the

Status register ﬂags are reset after the Status register is read.

RCS

remote temperature

RCS − TH

Status register bit 1

(RCRIT)

T_CRIT output

A

B

C

002aad217

Fig 7. T_CRIT temperature response timing

Event A: T_CRIT goes LOW and Status bit 1 (RCRIT) is set HIGH when Remote

Temperature exceeds RCS, Remote T_CRIT Setpoint.

Event B: Remote Temperature goes below RCS − TH. T_CRIT is de-activated, but

Status register remains unchanged.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

15 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Event C: The Status register bit 1 (RCRIT) is reset by a read of the Status register (in

the interrupt mode).

7.9.3 Fault Queue

To suppress erroneous ALERT or T_CRIT triggering, the SA56004X implements a Fault

Queue for both local and remote channel. The Fault Queue insures a temperature

measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint by not triggering

until three consecutive out-of-limit measurements have been made. The fault queue

defaults OFF upon POR and may be activated by setting bit 0 in the Conﬁguration register

(address 09h) to logic 1.

remote temperature

RCS

RCS − TH

remote HIGH setpoint

remote LOW setpoint

ALERT output

T_CRIT output

events

A

B

C

D

E

F

G

H

I

002aad218

Remark: All events indicate the completion of a conversion.

Fig 8. Fault queue remote HIGH and LOW and T_CRIT, T_CRIT hysteresis setpoint

response (comparator mode)

Event A: The remote temperature has exceeded the Remote HIGH setpoint.

Event B: Three consecutive over limit measurements have been made exceeding the

Remote HIGH setpoint; the ALERT output is activated (goes LOW). By now, the remote

temp has exceeded the Remote T_CRIT setpoint (RCS).

Event C: Three consecutive over limit measurements have been made exceeding RCS;

the T_CRIT output is activated (goes LOW).

Event D: The remote temperature falls below the RCS − TH setpoint.

Event E: The ALERT output is de-activated (goes HIGH) after a below_high_limit

temperature measurement is completed.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

16 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Event F: Three consecutive measurements have been made with the remote

temperature below the RCS − TH threshold; the T_CRIT output is de-activated (goes

HIGH).

Event G: The remote temp falls below the Remote LOW setpoint.

Event H: Three consecutive measurements are made with the temp below the Remote

LOW setpoint; ALERT output is activated (goes LOW).

Event I: The ALERT output is de-activated (goes HIGH) after a above_low_limit

temperature measurement is completed.

7.9.4 Remote diode selection

To measure the remote temperature or the temperature of an externally attached diode,

the device automatically forces two successive currents of about 160 µA and 10 µA at D+

pin. It measures the voltage (V_BE) between D+ and D−, detects the difference between the

two V_BEvoltages or the ∆V_BEand then converts the ∆V_BEinto a temperature data using

the basic PTAT voltage formula as shown in Equation 1. The device typically takes about

38 ms to perform a measurement during each conversion period or cycle, which is

selectable by programming the conversion rate register.

kT

------

q

l2

----

l1

∆V_BE= n ×

× ln

(1)

Where:

n = diode ideality factor

k = Boltzmann’s constant

T = absolute temperature (°K) = 273 °C + T (°C)

q = electron charge

ln = natural logarithm

l2, l1 = two source currents

Because the device does not directly convert the sensed V_BEas in the old method of

temperature measurement systems, the V_BEcalibration is not required. Furthermore, the

device remote temperature error is adjusted at the manufacturer to meet the speciﬁcations

with the use of the reference diode-connected transistors such as the 2N3904/2N3906.

The diode type to be used in customer applications must have the characteristics as close

to the 2N3904/2N3906 as possible in order to obtain optimal results. Finally, to prevent the

effects of system noise on the measured V_BEsignals, an external capacitor of about

2200 pF connected between the D+ and D− pins as well as the grounded-shield cable for

the diode connection wires are recommended.

7.9.5 Diode fault detection

The SA56004X is designed with circuitry to detect the fault conditions of the remote diode.

When the D+ pin is shorted to V_DDor ﬂoating, the Remote Temperature High Byte (RTHB)

register is loaded with +127 °C, the Remote Temperature Low Byte (RTLB) register is

loaded with 0 °C, and the OPEN bit (bit 2 of the Status register) is set. Under the above

conditions of D+ shorted to V_DDor ﬂoating, if the Remote T_CRIT setpoint is set less than

+127 °C, and T_CRIT Mask are disabled, then, the T_CRIT output pins will be pulled

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

17 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

LOW. Furthermore, if the Remote HIGH Setpoint High Byte (RHSHB) register is set to a

value less than +127 °C and the Alert Mask is disabled, then the ALERT output will be

pulled LOW. Note that the OPEN bit itself will not trigger an ALERT.

When the D+ pin is shorted to ground or to D−, the Remote Temperature High Byte

(RTHB) register is loaded with −128 °C (1000 0000) and the OPEN (bit 2 in the Status

register) will not be set. Since operating the SA56004X is beyond its normal limits, this

temperature reading represents this shorted fault condition. If the value in the Remote

Low Setpoint High Byte (RLSHB) register is more than −128 °C and the Alert Mask is

disabled, the ALERT output will be pulled LOW.

7.10 SMBus interface

The device can communicate over a standard two-wire serial interface System

Management Bus (SMBus) or compatible I²C-bus using SCLK and SDATA. The device

employs four standard SMBus protocols: Write Byte, Read Byte, Receive Byte, and

Send Byte. Data formats of four protocols are shown in Figure 9. The following key points

of protocol are important:

• The SMBus master initiates data transfer by establishing a START condition (S) and

terminates data transfer by generating a STOP condition (P).

• Data is sent over the serial bus in sequences of 9 clock pulses according to each 8-bit

data byte followed by 1-bit status of device acknowledgement (A).

• The 7-bit slave address is equivalent to factory-programmed address of the device.

• The command byte is equivalent to the address of the selected device register.

• The Receive Byte format is used for quicker transfer data from a device reading

register that was previously selected.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

18 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

1

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

(cont.)

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

device register command

SDATA

S

W

A

9

A

START

device address

1

2

3

4

5

6

7

SCLK

SDATA

D7 D6 D5 D4 D3 D2 D1 D0

data to be written to register

A

P

STOP

002aad219

a. Write Byte format (to write a data byte to the device register)

1

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

(cont.)

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

device register command

SDATA

S

W

A

9

A

P

START

device address

STOP

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

9

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

data from device register

SDATA

S

R

A

NA

P

RESTART

device address

STOP

002aad220

b. Read Byte format (to read a data byte from the device register)

1

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

(cont.)

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

data from device register

SDATA

S

R

A

NA

P

RESTART

device address

STOP

002aad221

c. Receive Byte format (to read a data byte from already pointed register)

1

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

SCLK

a6

a5

a4

a3

a2

a1

a0

D7 D6 D5 D4 D3 D2 D1 D0

device register command

SDATA

S

W

A

P

START

device address

STOP

002aad222

d. Send Byte format

Fig 9. SMBus interface protocols

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

19 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

7.10.1 Serial interface reset

If the SMBus master attempts to reset the SA56004X while the SA56004X is controlling

the data line and transmitting on the data line, the SA56004X must be returned to a known

state in the communication protocol. This may be accomplished in two ways:

1. When the SDATA is LOW, the SA56004X SMBus state machine resets to the SMBus

idle state if SCLK is held LOW for more than 35 ms (maximum TIMEOUT period).

According to SMBus speciﬁcation 2.0, all devices are required to time-out when the

SCLK line is held LOW for 25 ms to 35 ms. Therefore, to insure a time-out of all

devices on the bus, the SCLK line must be held LOW for at least 35 ms.

2. When the SDATA is HIGH, the master initiates an SMBus START. The SA56004X will

respond properly to a SMBus START condition only during the data retrieving cycle.

After the START, the SA56004X will expect an SMBus Address byte.

8. Simpliﬁed system diagram

V

DD

R

10 kΩ

1

8

V

DD

V

SCLK

CLOCK

DD

100 nF

(1)

SMBus

CONTROLLER

SA56004X

shielded twisted pair

2

3

7

6

D+

SDATA

DATA

2.2 nF

D−

ALERT

INT

remote sensor

V

DD

2N3904 (NPN), 2N3906 (PNP),

or similar standalone, ASIC or

microprocessor thermal diode

R

10 kΩ

4

5

T_CRIT

GND

+5 V

FAN CONTROL

CIRCUIT

002aad201

(1) Typical value; placed close to temperature sensor.

Fig 10. Simpliﬁed system diagram

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

20 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

9. Limiting values

Table 17. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

All voltages are referenced to GND.

Symbol Parameter

Conditions

Min

−0.3

−1

Max

+6

Unit

V

V_DD

supply voltage

voltage at SDATA, SCLK, ALERT, T_CRIT

voltage at positive diode input

voltage at negative diode input

sink current

+6

V

V_D+

V_D−

I_sink

I_D+

V_DD+ 0.3

+0.8

+50

V

SDATA, SCLK, ALERT, T_CRIT

mA

V

D+ input current

−1

+1

[1]

V_esd

electrostatic discharge voltage

Human Body Model

Machine Model

-

2000

200

-

V

T_j(max)

T_stg

maximum junction temperature

storage temperature

-

+150

+165

°C

−65

[1] The D+ and D− pins are 1000 V HBM and 100 V MM due to the higher sensitivity of the analog pins that introduces a limitation to the

circuit protection structure.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

21 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

10. Characteristics

Table 18. Electrical characteristics

V_DD= 3.0 V to 3.6 V; T_amb= −40 °C to +125 °C; unless otherwise speciﬁed.

Symbol Parameter

T_ERRLlocal temperature error

Conditions

Min

−2

Typ

Max

+2

Unit

°C

T_amb= +60 °C to +100 °C

T_amb= −40 °C to +125 °C

T_amb= +25 °C to +85 °C;

±1

-

−3

+3

°C

T_ERRR

remote temperature error

−1

-

+1

°C

T

_RD= +60 °C to +100 °C

T_amb= −40 °C to +85 °C;

_RD= −40 °C to +125 °C

−3

-

+3

°C

T

T_RESR

remote temperature

resolution

-

11

-

bit

°C

bit

°C

ms

V

-

0.125

11

-

T_RESL

local temperature resolution

-

0.125

38

-

T_conv

V_DD

I_DD

conversion period

supply voltage

-

[1]

3.0

-

5.5

-

quiescent current

during conversion,

500

µA

16 Hz conversion rate

shut-down current

SMBus inactive

-

10

160

10

-

µA

V

I_RD

remote diode source current high setting: D+ − D− = +0.65 V

low setting

-

[3]

[4]

UVL

UnderVoltage Lockout (UVL) V_DDinput disables A/D

threshold voltage^[2]

2.6

2.95

conversion

Power-On Reset (POR)

threshold voltage

V_DDinput falling edge

1.8

-

2.4

V

local and remote ALERT high default values set at power-up

default temperature settings

-

+70

0

-

°C

local and remote ALERT low default values set at power-up

default temperature settings

local and remote T_CRIT

default values set at power-up

+85

default temperature settings

T_CRIT hysteresis

default value set at power-up

I_O= 6.0 mA

-

+10

-

°C

ALERT and T_CRIT output

saturation voltage

0.4

V

[1] The SA56004X is optimized for 3.3 V V_DDoperation.

[2] Deﬁnition of Under Voltage Lockout (UVL): The value of V_DDbelow which the internal A/D converter is disabled. This is designed to be a

minimum of 200 mV above the power-on reset. During the time that it is disabled, the temperature that is in the ‘read temperature

registers’ will remain at the value that it was before the A/D was disabled. This is done to eliminate the possibility of reading unexpected

false temperatures due to the A/D converter not working correctly due to low voltage. In case of power-up (rising V_DD), the reading that

is stored in the ‘read temperature registers’ will be the default value of 0 °C. V_DDwill rise to the value of the UVL, at which point the A/D

will function correctly and the normal temperature will be read.

[3] V_DD(rising edge) voltage below which the A/D converter is disabled.

[4] V_DD(falling edge) voltage below which the logic is reset.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

22 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 19. SMBus interface characteristics

V_DD= 3.0 V to 3.6 V; T_amb= −40 °C to +125 °C; unless otherwise speciﬁed.

These speciﬁcations are guaranteed by design and not tested in production.

Symbol

V_IH

Parameter

Conditions

Min

2.2

-

Typ

Max

Unit

V

HIGH-level input voltage

LOW-level input voltage

LOW-level output current

SCLK, SDATA; V_DD= 2.7 V to 5.5 V

ALERT, T_CRIT; V_OL= 0.4 V

SDATA; V_OL= 0.6 V

-

5

-

V_IL

0.8

V

I_OL

1.0

6.0

-

mA

µA

pF

-

I_OH

I_IL

LOW-level output current

LOW-level input current

HIGH-level input current

input capacitance

1.0

-

−1.0

-

I_IH

1.0

-

C_i

SCLK, SDATA

-

SMBus digital switching characteristics^[1]

f_SCLK

SCLK operating frequency

SCLK LOW time

-

400

kHz

ns

t_LOW

10 % to 10 %

90 % to 90 %

600

0

5000

-

t_HIGH

SCLK HIGH time

SMBus free time^[2]

hold time of START condition^[3]10 % of SDATA to 90 % of SCLK

hold time of data^[4]

set-up time of data in^[5]

5000

t_BUF

-

t_HD;STA

t_HD;DAT

t_SU;DAT

t_SU;STA

-

300

250

-

set-up time of repeat START

condition^[6]

90 % to 90 %

t_SU;STO

set-up time of STOP condition^[7]90 % of SCLK to 90 % of SDATA

250

-

ns

µs

ns

ms

t_r

rise time

SCLK and SDATA

-

1

t_f

fall time

SCLK and SDATA

-

300

250

35

t_of

output fall time

SMBus time-out time^[8]

C_L= 400 pF; I_O= 3 mA

-

t_to(SMBus)

25

[1] The switching characteristics of the SA56004X fully meet or exceed all parameters speciﬁed in SMBus version 2.0. The following

parameters specify the timing between the SCLK and SDATA signals in the SA56004X. They adhere to, but are not necessarily speciﬁed

as the SMBus speciﬁcations.

[2] Delay from SDATA STOP to SDATA START.

[3] Delay from SDATA START to ﬁrst SCLK HIGH-to-LOW transition.

[4] Delay from SCLK HIGH-to-LOW transition to SDATA edges.

[5] Delay from SDATA edges to SCLK LOW-to-HIGH transition.

[6] Delay from SCLK LOW-to-HIGH transition to restart SDATA.

[7] Delay from SCLK HIGH-to-LOW transition to SDATA STOP condition.

[8] LOW period for reset of SMBus.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

23 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

t

f

r

t

HD;STA

t

LOW

SCLK

t

HIGH

t

SU;STO

HD;DAT

SU;STA

SU;DAT

t

HD;STA

SDATA

t

BUF

P

S

P

002aad237

Fig 11. Timing measurements

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

24 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

11. Performance curves

002aad228

002aad229

24

800

V

= 5.5 V

3.6 V

3.3 V

3.0 V

V

DD

= 5.5 V

3.6 V

3.3 V

3.0 V

I

DD

I

DD

shutdown

quiescent

(µA)

16

600

400

200

8

0

−50

−25

0

25

50

75

100 125

(°C)

−50

−25

0

25

50

75

100 125

(°C)

T

amb

Fig 12. Typical I_DDshutdown versus temperature and

V_DD

Fig 13. Typical I_DDquiescent current versus

temperature and V_DD(conversion rate = 16 Hz)

002aad230

002aad231

400

500

quiescent

(µA)

(1)

V

= 5.5 V

3.6 V

3.3 V

3.0 V

I

DD

I

DD

quiescent

(µA)

400

300

200

100

(2)

300

200

(3)

(4)

(8)

(9)

(5)

(6)

(7)

100

−50

−25

0

25

50

75

100

amb

125

(°C)

−25

0

25

50

75

100

T (°C)

amb

125

T

Conversion rate:

(1) 16 Hz

(2) 8.0 Hz

(3) 4.0 Hz

(4) 2.0 Hz

(5) 1.0 Hz

(6) 0.5 Hz

(7) 0.25 Hz

(8) 0.12 Hz

(9) 0.06 Hz

Fig 14. Typical I_DDquiescent current versus

temperature and V_DD

Fig 15. Typical I_DDquiescent current versus

temperature and conversion rate (V_DD= 3.3 V)

(conversion rate = 0.06 Hz)

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

25 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

002aad232

002aad234

14

10

V

= 5.5 V

3.6 V

3.3 V

3.0 V

V

= 5.5 V

3.6 V

3.3 V

3.0 V

DD

I

OL

(mA)

10

8

6

4

6

2

−50

−25

0

25

50

75

100 125

(°C)

−50

−25

0

25

50

75

100 125

(°C)

T

amb

Fig 16. Typical T_CRIT I_OLversus temperature and

_DD(V_OL= 0.4 V)

Fig 17. Typical ALERT I_OLversus temperature and V_DD

(V_OL= 0.4 V)

V

002aad233

002aad235

2.80

UVL (V)

2.6

V

POR

(V)

2.78

2.76

2.74

2.72

2.70

2.2

1.8

1.4

1.0

V

= 5.5 V

3.6 V

3.3 V

3.0 V

DD

−50

−25

0

25

50

75

100

amb

125

(°C)

−50

−25

0

25

50

75

100

amb

125

(°C)

T

Fig 18. Typical UVL versus temperature and V_DD

Fig 19. Typical V_PORversus temperature

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

26 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

12. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

v

c

y

H

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

Fig 20. Package outline SOT96-1 (SO8)

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

27 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm

SOT505-1

D

E

A

X

c

y

H

v

M

A

E

Z

5

8

A

(A )

2

A

3

A

1

pin 1 index

θ

L

p

L

1

4

detail X

e

w M

b

p

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

A

b

c

D

E

e

H

E

L

p

UNIT

v

w

y

Z

θ

1

2

3

p

max.

0.15

0.05

0.95

0.80

0.45

0.25

0.28

0.15

3.1

2.9

3.1

2.9

5.1

4.7

0.7

0.4

0.70

0.35

6°

0°

mm

1.1

0.65

0.25

0.94

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-04-09

03-02-18

SOT505-1

Fig 21. Package outline SOT505-1 (TSSOP8)

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

28 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

SOT782-1

0

1

2 mm

scale

X

B

A

D

A

1

E

c

terminal 1

index area

detail X

C

e

1

terminal 1

index area

y

C

1

v

M

C

A B

y

b

e

w M

1

4

L

E

h

8

5

D

h

DIMENSIONS (mm are the original dimensions)

(1)

A

(1)

UNIT

A

b

c

D

E

e

1

L

v

w

y

1

h

max.

0.05 0.35

0.00 0.25

3.1

2.9

2.55

2.25

3.1

2.9

1.75

1.45

0.5

0.3

mm

1

0.65 1.95

0.1

0.05 0.05

0.1

0.2

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

03-01-29

SOT782-1

- - -

MO-229

- - -

Fig 22. Package outline SOT782-1 (HVSON8)

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

29 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

13. Packing information

The SA56004X is packed in reels, as shown in Figure 23.

tape

guard band

reel assembly

tape detail

cover tape

carrier tape

barcode label

box

002aad226

Fig 23. Tape and reel packing method

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reﬂow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

30 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

• Board speciﬁcations, including the board ﬁnish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

14.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 24) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 20 and 21

Table 20. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

235

≥ 350

220

< 2.5

≥ 2.5

220

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

31 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

Table 21. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

260

> 2000

260

< 1.6

1.6 to 2.5

> 2.5

260

250

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 24.

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 24. Temperature proﬁles for large and small components

For further information on temperature proﬁles, refer to Application Note AN10365

“Surface mount reﬂow soldering description”.

15. Mounting

15.1 Printed-circuit board layout considerations

Care must be taken in Printed-Circuit Board (PCB) layout to minimize noise induced at the

remote temperature sensor inputs, especially in extremely noisy environments, such as a

computer motherboard. Noise induced in the traces running between the device sensor

inputs and the remote diode can cause temperature conversion errors. Typical sensor

signal levels to the SA56004X is a few microvolts. The following guidelines are

recommended:

1. Place the SA56004X as close as possible to the remote sensor. It can be from

4 inches to 8 inches, as long as the worst noise sources such as clock generator, data

and address buses, CRTs are avoided.

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

32 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

2. Route the D+ and D− lines parallel and close together with ground guards enclosing

them (see Figure 25).

3. Leakage currents due to printed-circuit board contamination must be considered.

Error can be introduced by these leakage currents.

4. Use wide traces to reduce inductance and noise pick-up. Narrow traces more readily

pick up noise. The minimum width of 10 mil and space of 10 mil are recommended.

5. Place a bypass capacitor of 10 nF close to the V_DDpin and an input ﬁlter capacitor of

2200 pF close to the D+ and D− pins.

6. A shielded twisted pair is recommended if remote sensor is located several feet away

from the temperature sensor. Under this circumstance, connect the shield of the cable

at the device side to the SA56004X GND pin and leave the shield at the remote end

unconnected to avoid ground loop currents. Also notice that the series resistance of

the cable may introduce measurement error; 1 Ω can introduce about 0.5 °C.

GND

D+

D−

GND

002aad227

Fig 25. D+ and D− trace layout

16. Abbreviations

Table 22. Abbreviations

Acronym

A/D

Description

Analog-to-Digital

ARA

Alert Response Address

Application Speciﬁc Integrated Circuit

Cathode Ray Tube

ASIC

CRT

ESD

ElectroStatic Discharge

Human Body Model

HBM

HVAC

I²C-bus

LSB

Heating, Ventilating and Air Conditioning

Inter-Integrated Circuit bus

Least Signiﬁcant Bit

MM

Machine Model

MSB

OTP

Most Signiﬁcant Bit

One-Time Programmable

Power-On Reset

POR

PTAT

SMBus

UVL

Proportional To Absolute Temperature

System Management Bus

Under Voltage Lockout

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

33 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

17. Revision history

Table 23. Revision history

Document ID

SA56004X_5

Modiﬁcations:

Release date

20080522

Data sheet status

Change notice

Supersedes

Product data sheet

-

SA56004X_4

• The format of this data sheet has been redesigned to comply with the new identity guidelines of

NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Added HVSON8 package option

• Table 17 “Limiting values”: removed “P, power dissipation” speciﬁcation from this table

• Table 19 “SMBus interface characteristics”:

–

descriptions of parameters moved to table notes

_LOW: Min changed from “4.7 µs” to “600 ns”; Typ changed from “5.0 µs” to “5000 ns”

t_HIGH: Min changed from “4.0 µs” to “600 ns”; Typ changed from “5.0 µs” to “5000 ns”

_BUF: Min changed from “4.7 µs” to “600 ns”

t

t_HD;STA: Min changed from “4.0 µs” to “600 ns”

t_HD;DAT: Min changed from “-” to “0 ns”

t_SU;STO: Min changed from “4.0 µs” to “250 ns”

symbol “t_TIMEOUT, SMBus TIMEOUT” changed to “t_to(SMBus), SMBus time-out time”

SA56004X_4

20060808

20041006

Product data sheet

-

SA56004X_3

SA56004X_2

SA56004X_3

(9397 750 13841)

SA56004X_2

(9397 750 12015)

20030903

20030819

Objective data

-

SA56004-X_1

-

SA56004-X_1

(9397 750 10993)

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

34 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

18. Legal information

18.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

to result in personal injury, death or severe property or environmental

18.2 Deﬁnitions

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

18.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

18.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

I²C-bus — logo is a trademark of NXP B.V.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

SA56004X_5

Product data sheet

Rev. 05 — 22 May 2008

35 of 36

SA56004X

NXP Semiconductors

Digital temperature sensor with overtemperature alarms

20. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

14

Soldering of SMD packages . . . . . . . . . . . . . . 30

Introduction to soldering. . . . . . . . . . . . . . . . . 30

Wave and reﬂow soldering . . . . . . . . . . . . . . . 30

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 31

Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 31

14.1

14.2

14.3

14.4

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3

4

4.1

5

15

15.1

16

Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Printed-circuit board layout considerations . . 32

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 33

Revision history . . . . . . . . . . . . . . . . . . . . . . . 34

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

17

18

Legal information . . . . . . . . . . . . . . . . . . . . . . 35

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 35

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 35

7

Functional description . . . . . . . . . . . . . . . . . . . 5

Serial bus interface. . . . . . . . . . . . . . . . . . . . . . 5

Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Register overview . . . . . . . . . . . . . . . . . . . . . . . 5

Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 6

Starting conversion. . . . . . . . . . . . . . . . . . . . . . 7

Low power software standby mode . . . . . . . . . 7

Temperature data format . . . . . . . . . . . . . . . . . 7

SA56004X SMBus registers . . . . . . . . . . . . . . . 8

Command register . . . . . . . . . . . . . . . . . . . . . . 8

Local and remote temperature registers

18.1

18.2

18.3

18.4

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

7.8.1

7.8.2

19

20

Contact information . . . . . . . . . . . . . . . . . . . . 35

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

(LTHB, LTLB, RTHB, RTLB) . . . . . . . . . . . . . . . 8

Conﬁguration register (CON) . . . . . . . . . . . . . . 8

Status register (SR) . . . . . . . . . . . . . . . . . . . . . 9

Conversion rate register (CR). . . . . . . . . . . . . 10

Temperature limit registers . . . . . . . . . . . . . . . 10

Programmable offset register (remote only) . . 11

ALERT mode register (AM) . . . . . . . . . . . . . . 11

Other registers . . . . . . . . . . . . . . . . . . . . . . . . 11

One-shot register . . . . . . . . . . . . . . . . . . . . . . 11

Interruption logic and functional description . . 12

ALERT output . . . . . . . . . . . . . . . . . . . . . . . . . 12

ALERT output in comparator mode . . . . . . . . 12

ALERT output in interrupt mode . . . . . . . . . . . 12

ALERT output in SMBus ALERT mode . . . . . 13

T_CRIT output . . . . . . . . . . . . . . . . . . . . . . . . 15

Fault Queue . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Remote diode selection . . . . . . . . . . . . . . . . . 17

Diode fault detection. . . . . . . . . . . . . . . . . . . . 17

SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 18

Serial interface reset. . . . . . . . . . . . . . . . . . . . 20

7.8.3

7.8.4

7.8.5

7.8.6

7.8.7

7.8.8

7.8.9

7.8.10

7.9

7.9.1

7.9.1.1

7.9.1.2

7.9.1.3

7.9.2

7.9.3

7.9.4

7.9.5

7.10

7.10.1

8

Simpliﬁed system diagram . . . . . . . . . . . . . . . 20

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 21

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 22

Performance curves . . . . . . . . . . . . . . . . . . . . 25

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 27

Packing information. . . . . . . . . . . . . . . . . . . . . 30

9

10

11

12

13

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 22 May 2008

Document identifier: SA56004X_5


型号：	SA56004FDP-T
厂家：	NXP
描述：	+/-1 deg Cel accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with overtemperature alarms - Accuracy on-chip: 2@+60~1003@0~125C; Accuracy remote: 1@+60~1003@0~125C; Assignable addresses: 8 ; Operating temperature: 0~125 C
文件：	总36页 (文件大小：181K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SA56004FDP-T [NXP]

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