SA56613-47 [NXP]

IC,VOLT REGULATOR,FIXED,+5V,CMOS,SOP,8PIN,PLASTIC;
SA56613-47
型号: SA56613-47
厂家: NXP    NXP
描述:

IC,VOLT REGULATOR,FIXED,+5V,CMOS,SOP,8PIN,PLASTIC

文件: 总11页 (文件大小:114K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
SA56613-XX  
5 V, 150 mA LDO and independent  
delayed RESET  
Product data  
2003 Oct 30  
Supersedes data of 2002 Mar 25  
Philips  
Semiconductors  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
DESCRIPTION  
The SA56613-XX has a precise fixed 5 V output with a typical  
accuracy of ±2% to provide very low dropout and low noise in  
CD-ROM drives, battery-operated systems, and portable computers  
applications. This regulator consists of an internal voltage reference,  
an error amplifier, a driver with current limiter and a thermal  
shutdown.  
An Active-LOW RESET is asserted when the regulator output  
voltage (V ) falls below the reset detection voltage threshold. The  
OUT  
SA56613-XX is available with fixed detection threshold voltages of  
4.2, 4.5, and 4.7 V. The RESET output remains low for 1 ms (typical)  
when a 10 nF capacitor is connected to C pin. The reset time delay  
D
can be adjusted by replacing capacitance values from C pin to  
D
Ground.  
The device is available in the small SO8 package (SOP005).  
FEATURES  
APPLICATIONS  
Very low dropout voltage: 250 mV typ. (I = 30 mA)  
TV and monitors  
out  
High precision output voltage: ±2%  
Output current capacity: 150 mA  
Electronic notebooks, PDAs and Palmtop computers  
Cameras, VCRs and camcorders  
PCMCIA cards and CD-ROM drives  
Modems  
Low Noise: 200 µV  
typ. @ 20 Hz to 80 kHz and for  
rms  
I
= 30 mA  
OUT  
Extremely good line regulation: 10 mV typical  
Very good load regulation: 40 mV typical  
Battery-powered or hand-held instruments  
Low temperature drift co-efficient to V  
: ±100 ppm/°C  
OUT  
Internal current limit and thermal shut-down circuits  
Adjustment-free reset detection voltages: 4.2 V typ., 4.5 V typ.  
and 4.7 V typ.  
Delay time can be adjusted by external capacitor.  
Wide operating temperature range: –40 °C to +85 °C  
SIMPLIFIED SYSTEM DIAGRAM  
V
V
+5 V  
IN  
OUT  
A
4
3
5
2
C
OUT  
0.1 µF  
(Ceramic)  
SA56613-XX  
4.7 µF  
(AL-Electrolytic)  
C
RESET  
D
1
0.1 µF  
GND  
SL01648  
Figure 1. Simplified system diagram.  
2
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
ORDERING INFORMATION  
PACKAGE  
TEMPERATURE  
RANGE  
TYPE NUMBER  
NAME  
DESCRIPTION  
VERSION  
SOP005  
SA56613-XXD  
SO8  
plastic small outline package; 8 leads; body width 3.9 mm  
–40 to +85 °C  
NOTE:  
The device has 3 voltage options, indicated by the XX on the  
‘Type number’.  
XX  
OUTPUT VOLTAGE  
(Typical)  
RESET THRESHOLD  
(Typical)  
42  
45  
47  
5.0 V  
5.0 V  
5.0 V  
4.2 V  
4.5 V  
4.7 V  
PIN CONFIGURATION  
PIN DESCRIPTION  
PIN  
1
SYMBOL  
GND  
DESCRIPTION  
TOP VIEW  
GND  
1
2
3
4
8
7
6
5
n.c.  
Ground  
Active-LOW reset signal output pin.  
The output remains LOW while V  
RESET  
GND  
GND  
2
RESET  
SO8  
is  
OUT  
C
V
D
below V , the reset threshold, and for an  
SH  
V
external set time delay C pin after V  
IN  
OUT  
D
OUT  
rises above reset threshold.  
SL01649  
3
C
Reset delay time capacitor pin.  
D
Figure 2. Pin configuration.  
RESET pin output delay time can be set by  
the capacitance connected to the C pin.  
D
5
t
= 10 × C  
PLH  
where:  
t
= transmission delay time (s)  
PLH  
C = capacitor value (F)  
Supply voltage input pin  
Regulated output voltage pin  
Ground pin and heat sink  
Ground pin and heat sink  
not connected  
4
5
6
7
8
V
V
IN  
OUT  
GND  
GND  
n.c.  
MAXIMUM RATINGS  
SYMBOL  
PARAMETER  
MIN.  
–0.3  
MAX.  
+18  
UNIT  
V
V
IN  
Input supply voltage  
Output current  
I
200  
mA  
°C  
OUT  
T
opr  
Operating ambient temperature  
Storage temperature  
–40  
–40  
+85  
T
stg  
+150  
+125  
650  
°C  
T
j(max)  
Maximum junction temperature  
Power dissipation (Note 1)  
°C  
P
D
Derate 6.5 mW/°C above T  
25 °C  
mW  
amb  
NOTE:  
1. When mounted on a 55 × 20 mm paper phenol board.  
3
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
ELECTRICAL CHARACTERISTICS  
T
amb  
= 25 °C, Figure 13 “Test circuit”, unless otherwise specified.  
SYMBOL  
PARAMETER  
No-load input current 1  
No-load input current 2  
CONDITIONS  
MIN.  
TYP.  
400  
2.5  
MAX.  
800  
UNIT  
µA  
I
I
V
V
= 6 V; I  
= 4 V; I  
= 0 mA  
= 0 mA  
CCq1  
CCq2  
IN  
OUT  
OUT  
µA  
IN  
Regulator  
V
Output voltage  
V
V
V
V
= 6 V; I  
= 30 mA  
4.90  
5.00  
0.25  
10  
5.10  
0.5  
30  
80  
V
V
OUT  
IN  
IN  
IN  
IN  
OUT  
V
i/o(dif)  
Input/output differential voltage  
Line regulation  
= 4.8 V; I  
= 150 mA  
OUT  
V  
V  
V  
= 6 V 10 V; I  
= 30 mA  
OUT  
mV  
1
Load regulation  
= 6 V; I  
= 0 mA 150 mA  
OUT  
40  
mV  
2
/T  
V
OUT  
temperature coefficient (Note 1) T = –20 °C +85 °C;  
100  
ppm/°C  
OUT  
j
V
IN  
= 6 V; I  
= 30 mA  
OUT  
RR  
Ripple rejection (Note 1)  
V
V
= 6 V; f = 120 Hz;  
50  
60  
dB  
IN  
= 1 V ; I  
= 30 mA  
RIPPLE  
p-p OUT  
V
n(o)  
Noise output voltage (Note 1)  
V
IN  
= 6 V; f = 20 80 kHz;  
200  
400  
µV  
rms  
I
= 30 mA  
OUT  
Reset  
V
IN  
= H L  
V
S
Detection voltage  
SA56613–42  
SA56613–45  
SA56613–47  
4.03  
4.31  
4.51  
4.20  
4.50  
4.70  
4.37  
4.69  
4.89  
V
V
V
V /T  
V
temperature coefficient (Note 1)  
T = –20 °C +85 °C  
25  
100  
50  
ppm/°C  
mV  
mV  
ms  
S
S
j
V  
Hysteresis voltage  
V
IN  
V
IN  
V
IN  
V
IN  
V
OL  
= H L H  
100  
200  
15  
S
OL  
V
LOW-level output voltage  
Reset delay time  
= 3.9 V; R = 4.7 kΩ  
100  
10  
L
t
= 4 V 5 V; C = 0.1 µF  
5
PLH1  
PHL  
D
t
‘L’ transmission delay time (Note 1)  
Threshold operating voltage  
= 5 V 4 V; C = 0.1 µF  
30  
90  
µs  
D
V
OPL  
= 0.4 V  
0.65  
0.85  
V
NOTE:  
1. This parameter is guaranteed by design.  
4
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
TYPICAL PERFORMANCE CURVES (SA56613-42D)  
6
3.0  
2.5  
5
V
OUT  
4
3
2
2.0  
1.5  
1.0  
RESET  
1
0
0.5  
0
0
1
2
3
4
5
6
7
0
0
0
2
4
6
8
10  
12  
14  
16  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
SL01658  
SL01657  
Figure 3. Detection voltage (I  
= 0 mA).  
Figure 4. Quiescent current (I  
= 0 mA).  
OUT  
OUT  
30  
20  
60  
40  
10  
0
20  
0
–10  
–20  
–20  
–30  
–40  
–60  
4
6
50  
8
10  
INPUT VOLTAGE (V)  
12  
14  
16  
100  
150  
OUTPUT CURRENT (mA)  
SL01652  
SL01653  
Figure 5. Line regulation.  
Figure 6. Load regulation.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
6
5
4
3
2
1
0
10  
100  
1000  
10000  
100000  
50  
100  
150  
200  
250  
300  
FREQUENCY (Hz)  
OUTPUT CURRENT (mA)  
SL01638  
SL01654  
Figure 7. Ripple rejection.  
Figure 8. Current limit.  
5
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
800  
700  
600  
500  
400  
300  
200  
100  
0
100  
ON BOARD 55 × 22 mm  
6.5 mW/°C  
10  
1
0.01  
0.1  
1
–25  
0
25  
50  
75  
100  
125  
C
CAPACITOR (µF)  
TEMPERATURE (°C)  
D
SL01656  
SL01655  
Figure 9. Reset delay time.  
Figure 10. Power dissipation.  
6
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
TIMING DIAGRAM  
The Timing Diagram in Figure 11 depicts the operation of the device.  
Letters A-I on the Time axis indicates specific events.  
E-F: Between “E” and “F”, V  
rising.  
continues to fall and then starts  
OUT  
A: At “A”, V  
abruptly begins to increase. Also the RESET  
F: At “F”, V  
rises to the V level. Once again, the device  
OUT SH  
OUT  
voltage initially increases but abruptly decreases when V  
reaches the threshold operating level (typically 0.65 V) that activates  
the internal bias circuitry and RESET is asserted.  
initiates the delay timer.  
F-G: rises above V and returns to normal 5 V output. At  
“G”, the delay (t  
OUT  
V
OUT  
SH  
) times out and once again, then it releases the  
PLH  
B: At “B”,V  
reaches the threshold level of V . At this point the  
hold on the RESET and it goes HIGH.  
OUT  
SH  
delay time, t  
is initiated while V  
rises above V to its normal  
OUT SH  
PLH  
G-H: At “G”, V is above the upper threshold and begins to fall,  
OUT  
operating level of 5 V. The RESET voltage remains LOW.  
causing RESET to follow it. As long as V  
remains above the  
OUT  
C: At “C”, V is above V and the delay time, t elapses. At  
V , no reset signal will be generated.  
SL  
OUT  
SL  
PLH  
this instant, the device releases the hold on the RESET. The reset  
output then goes HIGH. In a microprocessor based system these  
events release the reset from the microprocessor, allowing the  
microprocessor to function normally.  
H: At event “H”, V  
threshold is reached. At this level, a RESET signal is generated and  
RESET goes LOW.  
falls until the V undervoltage detection  
SL  
OUT  
I: At event “I”, V  
is unable to maintain a RESET. As a result, V may rise to less  
has decreased until normal internal circuit bias  
OUT  
D-E: At “D”, V falls below 5 V, causing V  
to follow. V  
OUT  
IN  
OUT  
CC  
continues to fall until the V undervoltage detection threshold is  
SL  
than 0.65 V. As V decreases further, the V  
reset also  
CC  
OUT  
reached at “E”. This causes a reset signal to be generated (RESET  
goes LOW).  
decreases to zero.  
10 V  
V
IN  
5 V  
0 V  
5 V  
V
SH  
V
SL  
V
OUT  
V  
S
0 V  
5 V  
RESET  
t
t
PLH  
PLH  
0 V  
A
B
C
D E  
F
G
H
I
SL01651  
Figure 11. Timing diagram.  
7
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
APPLICATION INFORMATION  
PCB layout  
The component placement around the LDO should be done carefully  
to achieve good dynamic line and load response. The input and  
noise capacitors should be kept close to the LDO.  
Input capacitor  
An input capacitor of 1 µF is required to eliminate the AC coupling  
noise. This capacitor must be located as close as possible to V or  
GND pin (not more than 1 cm) and returned to a clean analog ground.  
Any good quality ceramic, tantalum or film capacitor will work.  
IN  
The rise in junction temperature depends on how efficiently the heat  
is carried away from the junction to ambient. The junction to lead  
thermal impedance is a characteristic of the package and fixed. The  
thermal impedance between lead to ambient can be reduced by  
increasing the copper area on the PCB. Increase the input, output  
and ground trace area to reduce the junction-to-ambient impedance.  
Output capacitor  
Phase compensation is made for securing stable operation even if  
the load current varies. For this reason, an output capacitor with  
good frequency characteristics is needed. Set it as close to the  
circuit as possible and make the wiring as short as possible.  
Power dissipation  
The SA56613-XX maximum power dissipation depends on the  
thermal resistance from the die junction to the ambient air. The  
maximum power dissipation shown in Figure 10 is 650 mW at  
ambient temperature of 25 °C. It is derated at 6.5 mW/°C above  
25 °C.  
The value of the output capacitance has to be at least 47 µF  
connected from V  
to GND. When operating from sources other  
OUT  
than batteries, supply-noise rejection and transient response can be  
improved by increasing the value of the input and output capacitors  
and employing passive filtering techniques.  
Power dissipation of the device is P = I  
maximum power dissipation is:  
(V – V  
). The  
OUT  
D
OUT  
IN  
RESET output  
The SA56613-XX has an Active-LOW RESET output. When V  
of  
OUT  
(Tj * Tamb  
)
the regulator rises above V , the upper detection threshold  
SH  
Pmax  
where  
+
Eqn. (3)  
voltage, the reset delay time is initiated. After the programmed delay  
time elapses, RESET is released and goes HIGH. The time delay  
can be set typically from 1 ms to 100 ms by connecting a time delay  
(qJA)  
θ
= θ + θ , the junction-to-ambient thermal resistance, θ  
JB BA JA  
JA  
capacitor from C (pin 3) to ground (see Figure 9: RESET Delay  
D
calculated from Figure 10 is 154 °C/W;  
time versus C , Delay Capacitor).  
D
θ
is the thermal resistance from the die junction to PCB  
JB  
The RESET delay time (t  
equation:  
) can be approximated by the following  
PLH  
material and copper traces;  
θ
is the thermal resistance from the PCB material and copper  
BA  
tPLH + 105   C  
Eqn. (1)  
traces to the surrounding air.  
(Time is expressed in seconds, Capacitance in Farads.)  
The GND pin provides an electrical connection to ground and a path  
for heat transfer from the device to the PCB and to the surrounding  
air. To maximize heat transfer, connect the GND pin to a large  
ground pad or ground plane.  
For example, for a delay capacitor, C of 0.1 µF (100 nF), t  
approximately 10 ms.  
is  
PLH  
D
When the regulator output Voltage falls to or below V , the lower  
SL  
detection threshold voltage, the RESET output is asserted and it  
goes to an Active-LOW state. This “LOW” transmission delay time is  
The following example determines the maximum I  
at  
OUT  
T
amb  
= 25 °C for V = 1 V.  
IN  
typically 30 µs with C at 100 nF.  
D
PD  
650 mW  
(12 * 5)  
IOUT  
+
+
+ 92.8mA  
Eqn. (4)  
Reset hysteresis voltage  
(VIN * VOUT  
)
The reset hysteresis voltage, V is defined in the following  
S
The maximum output current of the SA56613-XX is reduced as the  
equation:  
input voltage, V and the ambient temperature, T  
increase.  
IN  
amb  
Eqn. (2)  
DVS + VSH * VSL  
Hysteresis voltage is typically 50 mV. This small level of hysteresis  
ensures that the reset will not dither when the regulator V  
is noisy.  
OUT  
V
V
OUT  
IN  
4
5
2
V
V
CC  
IN  
C
4.7 µF  
OUT  
0.1 µF  
CERAMIC  
LOGIC SYSTEM  
SA56613-XX  
C
RESET  
D
3
RESET  
GND  
1
0.1 µF  
GND  
SL01729  
Figure 12. Typical application circuit.  
8
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
V
V
OUT  
IN  
A
4
3
5
2
A
0.1 µF  
SA56613-XX  
4.7 µF  
C
RESET  
D
V
1
0.1 µF  
GND  
SL01650  
Figure 13. Test circuit.  
PACKING METHOD  
The SA56613-XX is packed in reels, as shown in Figure 14.  
GUARD  
BAND  
TAPE  
TAPE DETAIL  
REEL  
ASSEMBLY  
COVER TAPE  
CARRIER TAPE  
BARCODE  
LABEL  
BOX  
SL01305  
Figure 14. Tape and reel packing method.  
9
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOP005  
10  
2003 Oct 30  
Philips Semiconductors  
Product data  
5 V, 150 mA LDO and independent delayed RESET  
SA56613-XX  
REVISION HISTORY  
Rev  
Date  
Description  
_1  
20031030  
Product data (9397 750 12214). ECN 853-2331 30323 of 09 September 2003.  
Supersedes data of 2002 Mar 25 (9397 750 10039).  
Modifications:  
Change package outline version to SOP005 in Ordering information table and Package outline sections.  
_1  
20020325  
Product data (9397 750 10039). ECN 853-2331 27919 of 25 March 2002.  
Data sheet status  
Product  
status  
Definitions  
[1]  
Level  
Data sheet status  
[2] [3]  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development.  
Philips Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
Production  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1] Please consult the most recently issued data sheet before initiating or completing a design.  
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL  
http://www.semiconductors.philips.com.  
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
LimitingvaluesdefinitionLimiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given  
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no  
representation or warranty that such applications will be suitable for the specified use without further testing or modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be  
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree  
to fully indemnify Philips Semiconductors for any damages resulting from such application.  
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described  
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated  
viaaCustomerProduct/ProcessChangeNotification(CPCN).PhilipsSemiconductorsassumesnoresponsibilityorliabilityfortheuseofanyoftheseproducts,conveys  
nolicenseortitleunderanypatent, copyright, ormaskworkrighttotheseproducts, andmakesnorepresentationsorwarrantiesthattheseproductsarefreefrompatent,  
copyright, or mask work right infringement, unless otherwise specified.  
Koninklijke Philips Electronics N.V. 2003  
Contact information  
All rights reserved. Printed in U.S.A.  
For additional information please visit  
http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
Date of release: 10-03  
9397 750 12214  
For sales offices addresses send e-mail to:  
sales.addresses@www.semiconductors.philips.com.  
Document order number:  
Philips  
Semiconductors  

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