SA57003 [NXP]
Five-output composite voltage regulator; 五,复合输出电压调节器型号: | SA57003 |
厂家: | NXP |
描述: | Five-output composite voltage regulator |
文件: | 总16页 (文件大小:204K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
SA57003
Five-output composite voltage regulator
Product data
2003 Oct 13
Supersedes data of 2001 Aug 01
Philips
Semiconductors
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
GENERAL DESCRIPTION
The SA57003 is a very low noise, low dropout voltage regulator with
three independent preset outputs from 2.0 V to 5.0 V and two
dependent outputs regulated from 2.82 V up to V
. The output
OUT3
current is the same for all three independent outputs 1, 2, 3 and
each output is capable of supplying 200 mA. The other two
dependent outputs 4, 5 are capable of supplying current up to
185 mA and 195 mA, respectively. Additionally, the SA57003 has an
independent ON/OFF input pin for each output to allow individual
subcircuits to be turned off when not needed, making the device
very useful for applications where power conservation is important.
The independent output voltage regulators V
, V
, and
OUT2
OUT1
V
OUT3
have a common input voltage pin, V . The dependent output
IN
voltage regulators, V
and V
have a common input voltage
OUT5
OUT4
pin, V
.
OUT3
The SA57003 regulator is offered in the TSSOP16 package.
FEATURES
APPLICATIONS
• Mobile phones
• V
tolerance ±3% over temperature range –40 °C to +85 °C
OUT
• ON/OFF input pin (logic-controlled shut-down) for each output
• Video cameras
• Very low dropout voltage (0.15 V typical for Outputs 1, 2, 3 and
0.25 V for Outputs 4, 5)
• Portable battery-powered telemetry equipment.
• No load quiescent current of 170 µA
• Maximum input voltage of 12 V
• Internal current and thermal limit
• Supply voltage rejection: 60 dB (typical) @ f = 1.0 kHz
• Internal trimmed voltage reference
SIMPLIFIED SYSTEM DIAGRAM
ON/OFF
4
5
V
V
OUT1
ON/OFF
ON/OFF
ON/OFF
ON/OFF
1
2
16
15
1
3
2
OUT3
3
4
5
14
13
12
V
V
OUT5
OUT4
SA57003
6
11
10
V
7
IN
8
C
10 µF
V
9
IN
OUT2
C
(optional)
C
OUT1,2,3,4,5
NS1,2,3
0.01 µF CERAMIC
1.0 µF CERAMIC OR TANTALUM
SL01421
Figure 1. Simplified system diagram.
2
2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
ORDERING INFORMATION
PACKAGE
TEMPERATURE
RANGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
SA57003DH
TSSOP16 plastic thin shrink small outline package; 16 leads
SOP001
–40 to +85 °C
Part number marking
PIN CONFIGURATION
Each device is marked with three or four lines of alphanumeric
codes. The first three letters of the top line designate the product.
The fourth letter, represented by “x”, is a date tracking code. The
remaining lines are for manufacturing codes.
V
1
2
3
4
16
15
14
V
OUT3
OUT1
ON/OFF
BYPASS
ON/OFF
5
1
1
V
OUT5
The first three letters, ADM, designate the product. The fourth letter,
represented by ‘x’, is a date tracking code.
V
13 NC
IN
SA57003
V
ON/OFF
BYPASS
5
6
12
OUT4
3
3
11 ON/OFF
10 GND
4
ON/OFF
BYPASS
7
8
2
2
9
V
OUT2
A D M C
SL01423
Figure 2. Pin configuration.
SL01422
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2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
PIN DESCRIPTION
PIN
SYMBOL
ON/OFF
DESCRIPTION
TERMINAL EQUIVALENT CIRCUIT
BIAS CIRCUIT
3, 5, 7, 11, 15
On/Off control pins for the output pins.
Connect to V for always-on outputs.
n
ON/OFF
N
IN
R
300 kΩ
R
400 kΩ
SL01424
2, 8, 6
NS , NS , NS
Noise-decrease bypass capacitor pins.
1
2
3
TO V
OUT
POWER
TRANSISTOR
DRIVE
CIRCUIT
R
NS
n
Cns
R
SL01425
POWER
TRANSISTOR
1, 9, 16
V
OUT1
V
OUT3
, V
OUT2
,
Voltage output.
V
OUT1,2,3
TO
ERROR
AMP
C
OUT1,2,3
POWER
TRANSISTOR
DRIVE
CIRCUIT
SL01426
POWER
TRANSISTOR
12, 14
V
OUT4
, V
OUT5
Voltage output. These two outputs are powered
V
OUT 4,5
by the circuit that produced V
, and will be
V
OUT3
OUT3
turned on an off with the V
output. They
OUT3
may be independently switched ON or OFF
while V is active.
OUT3
C
OUT 4,5
POWER
TRANSISTOR
DRIVE
CIRCUIT
SL01427
4
V
Common input supply voltage for all regulators.
Common circuit ground pin for all regulators.
No connection.
IN
10
13
GND
N/C
4
2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN.
–0.3
–20
–
MAX.
12
UNIT
V
V
Input supply voltage
IN
T
Operating ambient temperature range
Operating junction temperature
Storage temperature
+75
°C
oper
T
j
t.b.d.
+125
200
°C
T
stg
–40
–
°C
I
Output currents; Note 1
mA
mW
°C/W
V
OUT1,2,3
P
D
Power dissipation
–
400
R
Thermal resistance from junction to ambient
ESD damage threshold (Human Body Model); Note 2
ESD damage threshold (Machine Model); Note 3
Soldering temperature; Note 4
–
t.b.d.
2000
200
th(j-a)
ESD1
ESD2
V
V
–
–
V
T
–
230
°C
solder
NOTES:
1. Maximum current capability of one circuit (V
).
OUT1,2,3
2. Performed in accordance with Human Body Model (CZap = 100 pF, RZap = 1500 Ω).
3. Performed in accordance with Machine Model (CZap = 100 pF, RZap = 0 Ω).
4. 60 second maximum exposure for SMD Reflow temperatures above 183 °C.
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2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
ELECTRICAL CHARACTERISTICS
V
= 4.0 V, C = 10 µF, C
= 4.7 µF with 1.0 Ω series resistor, C
= 1.0 µF, C
= 0.01 µF, T
= 25 °C, unless otherwise
IN
IN
OUT1,2,3
OUT4,5
NS1,2,3
amb
noted. See Test Circuit 1 for test configuration for DC parameters.
SYMBOL
PARAMETER
Supply current (OFF)
Supply current 1,2,3
CONDITIONS
= V = V = 0 V
ON/OFF3
MIN.
TYP.
0
MAX.
3
UNIT
µA
I
I
V
–
–
INS
ON/OFF1
ON/OFF2
V
= 3.0 V;
170
350
µA
IN1,2,3
ON/OFF1
V
= V
= V
= 0 V
ON/OFF2
ON/OFF3
ON/OFF4,5
I
I
Standby quiescent current
ON/OFF
= 0 V
= 0 mA
–
–
0
3.0
mA
q(standby)
1,2,3,4,5
I
OUT1,2,3,4,5
1
Operating ground current
ON/OFF = 3.0 V, ON/OFF
= 0 V;
= 0 V;
= 0 V
170
350
µA
GND(operating)
1
2,3,4,5
1,3,4,5
1,2,4,5
ON/OFF = 3.0 V, ON/OFF
2
ON/OFF = 3.0 V, ON/OFF
3
I
Output current limit (I
)
OUT1,2,3
200
240
–
mA
LIM
ON/OFF
V
V
ON/OFF LOW threshold voltage
ON/OFF HIGH threshold voltage
Terminal current
–
1.6
–
–
–
–
0.4
–
V
V
OFF
ON
I
V
– 1.6 V
10
mA
ON/OFF
ON/OFF
V
V
V
OUT1
V
V
Output voltage 1
I
= 30 mA
2.42
1.1
–
2.50
1.5
30
2.58
0.2
60
20
–
V
V
OUT1
OUT1
2
Dropout voltage
I
= 30 mA; V = 2.3 V
OUT1 IN
DMIN1
∆V
∆V
Load regulation
Line regulation
I
= 0 – 100 mA
mV
mV
µV/°C
dB
LO1
OUT1
I
= 30 mA; V = 4.0 – 8.0 V
–
10
LI1
OUT1
IN
∆V /∆T
V
OUT
temperature coefficient
–20 ≤ T
≤ 75 °C; I = 30 mA
OUT1
–
±100
60
O1
amb
RR
Ripple rejection
f = 120 Hz; I
= 30 mA;
OUT1
= 1.0 VP-P
50
–
1
V
RIPPLE
V
N1
Output noise voltage
Output delay time
f = 10 Hz – 10 kHz; I
= 30 mA;
–
–
–
–
µV
RMS
OUT1
= 0.01 µF
C
NS1
t
I
= 30 mA; V = 0 → 4 V
ON/OFF1
0.04
0.8
ms
DH1
OUT1
OUT2
V
V
Output voltage 2
I
= 30 mA
2.42
1.1
–
2.80
1.5
30
2.88
0.2
60
20
–
V
OUT2
OUT2
2
Dropout voltage
I
= 30 mA; V = 2.3 V
V
mV
DMIN2
OUT2
IN
∆V
Load regulation
Line regulation
I
= 0 – 100 mA
LO2
LI2
OUT2
∆V
I
= 30 mA; V = 4.0 – 8.0 V
–
10
mV
OUT2
IN
∆V /∆T
V
OUT
temperature coefficient
–20 ≤ T
≤ 75 °C; I = 30 mA
OUT2
–
±100
60
µV/°C
dB
O2
amb
RR
Ripple rejection
f = 120 Hz; I
= 30 mA;
OUT2
= 1.0 VP-P
50
–
2
V
RIPPLE
V
N2
Output noise voltage
Output delay time
f = 10 Hz – 10 kHz; I
= 30 mA;
–
–
–
–
µV
RMS
OUT2
= 0.01 µF
C
NS2
t
I
= 30 mA; V = 0 → 4 V
ON/OFF2
0.04
0.8
ms
DH2
OUT2
OUT3
V
V
Output voltage 3
I
= 80 mA
2.92
–
3.00
–
3.08
0.3
60
20
–
V
OUT3
OUT3
2
Dropout voltage
I
= 80 mA; V = 2.3 V
V
mV
DMIN3
OUT3
IN
∆V
Load regulation
Line regulation
I
= 0 – 100 mA
–
–
LO3
LI3
OUT3
∆V
I
= 30 mA; V = 4.0 – 8.0 V
–
–
mV
OUT3
IN
∆V /∆T
V
OUT
temperature coefficient
–20 ≤ T
≤ 75 °C; I = 30 mA
OUT3
–
±100
60
µV/°C
dB
O3
amb
RR
Ripple rejection
f = 120 Hz; I
= 30 mA;
OUT3
50
–
3
V
= 1.0 VP-P
RIPPLE
V
Output noise voltage
Output delay time
f = 10 Hz – 10 kHz; I
= 30 mA;
–
–
30
60
µV
RMS
N3
OUT3
C
= 0.01 µF
NS3
t
I
= 30 mA; V
= 0 → 4 V
ON/OFF3
0.04
0.8
ms
DH3
OUT3
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2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
V
OUT4
V
OUT4
Output voltage 4
I
= I
= 20 mA; I
= 40 mA
2.82
50
–
–
–
V
OUT3
V
OUT3
OUT4
OUT5
I
t
Maximum output current
Output delay time
V
= 2.72 V; I
= I = 0 mA
OUT5
185
0.1
mA
ms
O4
OUT4
OUT3
I
= 20 mA; C = 1 µF;
OUT4
0.02
DH4
OUT4
V
= 0 → 4.0 V
ON/OFF4
I
Ground current
I
= 20 mA; V = 3.0 V
OUT3
–
0.5
0.8
mA
GND4
OUT4
OUT5
V
Output voltage 4
I
= I
= 20 mA; I
= 40 mA
2.82
80
–
–
–
V
V
OUT5
OUT3
OUT4
OUT5
OUT3
I
O5
Maximum output current
Output delay time
V
= 2.72 V; I
= I = 0 mA
OUT4
195
mA
ms
OUT5
OUT3
t
I
= 40 mA; C = 1 µF;
OUT4
0.02
0.1
DH5
OUT5
V
= 0 → 4.0 V
ON/OFF5
I
Ground current
I
= 40 mA; V = 3.0 V
OUT3
–
0.5
0.8
mA
GND5
OUT5
NOTES:
1. Individual operating ground currents for regulators 1, 2, and 3 with corresponding ON/OFF pins (ON/OFF
) connected to 3.0 V and
1,2,3
outputs open (I
= 0 mA). Regulators 1, 2, and 3 are the same.
OUT1,2,3
2. Dropout Voltage is a measure of the minimum input/output differential voltage at the specified output current.
V
V
OUT3
OUT4,5
GROUND CURRENT
R
R
R
I
GND4,5
ON/OFF
4,5
SL01434
Figure 3. Ground current for V
and V
.
OUT5
OUT4
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2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
TYPICAL PERFORMANCE CURVES
15
10
250
Typical for V
I
= 30 mA
OUT1,2,3
OUT
T
= 25 °C
Typical for V
OUT1,2,3
T
ON/OFF
amb
= 25 °C
amb
200
150
100
50
= V = V
+ 1.0 V
1,2,3
IN
OUT
5.0
OUT
V
0
–5.0
4.0
0
25
50
75
100
125
150
6.0
8.0
V , INPUT VOLTAGE (V)
IN
10
12
I , OUTPUT CURRENT (mA)
OUT
SL01428
SL01429
Figure 4. Dropout voltage versus output current.
Figure 5. Normalized line regulation versus input voltage.
20
10
+1.0
V
OUT
V
OUT
–10
–20
–30
–40
–1.0
Typical for V
OUT1,2,3
–2.0
–3.0
T
amb
= 25 °C
Typical for V
V
= V
+ 1.0 V
= V
OUT1,2,3
+ 1.0 V
IN
OUT
V
= V
OUT
ON/OFF
IN
1,2,3
IN
ON/OFF
= V
IN
C
= 47 µF
1,2,3
OUT
0
20
40
60
80
100
120
140
0
25
50
75
100
125
150
175
I , OUTPUT VOLTAGE (mV)
OUT
T , JUNCTION TEMPERATURE (°C)
j
SL01430
SL01431
Figure 6. Normalized load regulation.
Figure 7. Thermal shutdown.
1000
100
10
+1.0
T
= 25 °C
amb
UNSTABLE REGION
0 ≤ V ≤ 12 V
C
IN
= 4.7 µF
OUT
V
OUT
–1.0
–2.0
–3.0
STABLE OPERATING REGION
UNMEASURABLE REGION
1.0
0.1
Typical for V
OUT1,2,3
+ 1.0 V
= V
IN
V
= V
OUT
IN
ON/OFF
1,2,3
0.01
0.01
0.1
1.0
10
100
0
50
100
150
200
250
300
I , OUTPUT CURRENT (mA)
OUT
I , OUTPUT CURRENT (mA)
OUT
SL01432
SL01433
Figure 8. Typical output current limit.
Figure 9. ESR stability versus output current.
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2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
proportional to that current delivered to the output. This small
TECHNICAL DESCRIPTION
proportional current is used to generate a second feedback voltage
fed to the second feedback amplifier to fold back the output current
to a safe level in the event of an output short. Both feedback
amplifiers act on the same control node to control the PNP pass
transistor. Dual path output monitoring in this manner maintains a
constant output voltage while adding the feature enhancement of
output current limiting.
The SA57003 is a monolithic composite five-output regulator
developed to power the RF sections of mobile telephones. It
contains three independent full-featured voltage regulator circuits.
Each regulator circuit incorporates individual feedback error
amplifiers for output voltage regulation, output On/Off Control, Noise
Bypass Pin, Current Limiting, and Thermal Shutdown. The Noise
Bypass Pins provide the option of externally bypassing an internal
voltage reference node for enhanced noise reduction.
Operating stability of the SA57003 linear regulator is determined by
start-up delay, transient response to loading, and stability of the
feedback loop. The SA57003 has a fast transient loop response. No
built-in delay is incorporated.
The output of one of the three regulator circuits, in addition to being
pinned out, feeds two dependent switched output regulators. Both
switched output regulators incorporate individual feedback error
amplifiers for output voltage regulation but have no thermal
shutdown or current limiting feature.
Capacitors play an important part in compensating the regulator’s
output. A 4.7 µF aluminum electrolytic capacitor is recommended for
most applications. This consideration is made primarily on a basis of
minimal cost with good performance.
The three full-featured regulators have typical dropout voltages of
200 mV at 30 mA of output current. The two switched outputs have
a minimum current capacity of 80 mA each.
A tantalum capacitor could also be used. Tantalum capacitors have
the advantage of being smaller size than electrolytic capacitors of
the same value of capacitance. Tantalum capacitors are also not
prone to dry-out. The electrolyte used in electrolytic capacitors tends
to dry-out with time causing degradation in capacitance value. Avoid
using low ESR film or ceramic capacitors to avoid instability problems.
Each independent regulator in the SA57003 is a series pass
regulator incorporating a bandgap reference, two feedback
amplifiers, thermal shutdown circuit, and output current limiting.
See the device block diagram shown in Figure 10 and the equivalent
circuit in Figure 11. Both feedback amplifiers are referenced to the
same bandgap reference. A PNP transistor is used in the device’s
output and serves as a series pass element. The output PNP pass
transistor incorporates a dual collector. The first feedback amplifier
monitors the first collector’s output voltage through the use of a
voltage divider network fed from the output. The second collector
monitors the output current and produces a small output current
Keep in mind that the output capacitor tries to supply any
instantaneous increase in load current. Using higher values of
capacitance will enhance transient load performance as well as
stability. Lowering the ESR of the capacitors will also improve the
transient response to load current changes but at the expense of
stability.
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2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
V
IN
4
10 µF
SA57003
CURRENT
LIMIT
ENABLE
ON/OFF
3
2
1
NS
1
VOLTAGE
REFERENCE
TEMP
SENSOR
0.01 µF
R
R
V
OUT1
1
4.7 µF
CURRENT
LIMIT
ON/OFF
ENABLE
2
7
8
NS
2
0.01 µF
TEMP
SENSOR
R
R
V
OUT2
9
4.7 µF
CURRENT
LIMIT
ENABLE
ON/OFF
5
6
3
NS
3
0.01 µF
TEMP
SENSOR
R
R
V
OUT3
16
4.7 µF
V
OUT3
ENABLE
ON/OFF
11
4
R
R
V
OUT4
12
4.7 µF
V
OUT3
ON/OFF
5
ENABLE
15
10
R
R
V
OUT5
14
GND
4.7 µF
SL01435
Figure 10. Simplified block diagram.
10
2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
SA57003
4
1
9
VOUT2
VIN
VOUT1
NS2
2
3
8
7
NS1
ON/OFF
ON/OFF
1
2
VOUT3
16
12
14
VOUT4
VOUT5
6
NS3
5
ON/OFF
3
10
GND
11
ON/OFF
15
ON/OFF
4
5
SL01437
Figure 11. Equivalent circuit.
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2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
APPLICATION INFORMATION
ON/OFF
4
5
V
V
OUT1
OUT3
ON/OFF
ON/OFF
ON/OFF
ON/OFF
1
2
16
15
1
3
2
3
4
5
14
13
12
V
V
OUT5
OUT4
SA57003
6
11
10
V
7
IN
8
C
10 µF
V
9
IN
OUT2
C
(optional)
C
OUT1,2,3,4,5
NS1,2,3
0.01 µF CERAMIC
1.0 µF CERAMIC OR TANTALUM
SL01421
Figure 12. Typical application circuit.
Stability Factors: Capacitance and ESR
The operating stability of linear regulators is determined by start-up
delay, transient response to load currents, and stability of the
feedback loop. The SA57003 has a fast transient loop response,
with no built-in delay.
Power dissipation calculations
A regulator’s maximum power dissipation can be determined by
using the following equation:
P
= V
I
+ [V
– V ] I
OUT(min) OUT(max)
D(max)
IN(max) G
IN(max)
where:
Keep in mind that the output capacitor tries to supply any
instantaneous increase in load current from its stored energy. Using
higher values of capacitance will enhance transient load
performance as well as stability. Lowering the ESR of the capacitors
will also improve the transient response to load current changes, but
it will decrease stability.
V
is the maximum input voltage
IN(max)
I
G
is the maximum Ground Current at maximum output current
V
is the minimum output voltage
is the maximum output current
OUT(min)
OUT(max)
I
(V
IN(max) G
I ) represents heat generated in the device due to internal
circuit biasing, leakage, etc. [V
input-to-output voltage drop across the device due to the I
– V
] is the
OUT(min)
IN(max)
Power dissipation factors
The thermal performance of linear regulators depends on the
following parameters:
OUT(max)
current. When multiplied by I
, this represents heat
OUT(max)
generated in the device due to the output load current.
Maximum junction temperature (T ) in °C
j
Heat dissipation factors
Maximum ambient temperature (T ) in °C
Power dissipation capability of the package in Watts (P )
Junction-to-ambient thermal resistance in °C/W
amb
The SA57003 device should not be operated under conditions that
would cause a junction temperature of 150 °C to be generated
because the thermal shutdown protection circuit will shut down the
device at or near this temperature.
D
The Maximum Junction Temperature and Maximum Power
Dissipation are both determined by the manufacturer’s process and
device’s design. For the most part the ambient temperature is under
the control of the user. The Maximum Ambient Temperature
depends on the process used by the manufacturer. The package
type and manufacturer’s process determines Junction-to-Ambient
Thermal Resistance.
Heat generated within the device is removed to the surrounding
environment by radiation or conduction along several paths. In
general, radiated heat is dissipated directly into the surrounding
ambient from the chip package and leads. Conducted heat flows
through an intermediate material, such as the leads or thermal
grease, to circuit board traces and heat sinks in direct contact with
the device’s package or leads. The circuit board then radiates this
heat to the ambient. For this reason, adequate airflow over the
device and the circuit board is important.
These parameters are related to each other as shown in the
following equation:
T = T
+ (P × R
)
th(j-a)
j
amb
D
The term (P × R
ambient to the internal junction of the device.
) represents the temperature rise from the
th(j-a)
The TSSOP16 package is too small to easily use external heat sinks
to increase the surface area and enhance the dissipation of
D
12
2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
generated heat. Heat dissipation must depend primarily on radiated
heat into the surrounding environment and the heat flow through the
leads into the printed circuit board. Some improvement can be
realized by allowing additional exposed copper on the circuit board
near the device to serve as heat absorbers and dissipaters for the
device.
DEFINITIONS
Line regulation is the change in output voltage caused by a change
in input line voltage. This parameter is measured using pulse
measurement techniques or under conditions of low power
dissipation so as to not significantly upset the thermal dynamics of
the device during test.
The overall thermal resistance from junction to the surrounding
ambient of the package (R
) is made up of three series elements
th(j-a)
Load regulation is the change in output voltage caused by a
and can be thought of as the total resistance of a series electrical
circuit. These elements are:
change in output load current for a constant device temperature.
Quiescent current is that current which flows to the ground pin of
R
R
R
= Thermal resistance from Junction-to-Case
= Thermal resistance from Case-to-heat Sink
= Thermal resistance from heat Sink-to-Ambient
th(j-c)
th(c-s)
th(s-a)
the device when the device is operated with no load.
Ground current is that current which flows to the ground pin of the
device when the device is operated with output current flowing due
to an applied load. It is the measurement difference of input current
minus the output current.
R
is based primarily on the package type and the size of the
th(j-a)
silicon chip used in the device. The composition of package
materials plays an important part. High heat conductivity materials
produce reduced Junction-to-Case resistances.
Dropout voltage is the input/output differential at which the
regulator output no longer maintains regulation against further
reductions in input voltage. Measured when the output drops
100 mV below its nominal value (which is measured at 1.0 V
differential input/output), dropout voltage is affected by junction
temperature, load current and minimum input supply requirements.
R
value is based on the package type, heat sink interface, and
th(c-s)
contact area of the device to the heat sink. The use of thermal
grease or an insulator will increase the transfer of heat from the
case to the heat sink.
R
, which is thermal resistance from heat sink to the ambient, is
th(s-a)
Output noise voltage is the integrated output noise voltage
based on heat sink emissivity and airflow over the heat sink to carry
the heat away. The heat sink to ambient heat flow is dependent on
the ability of the surrounding ambient media to absorb the heat.
(RMS AC) specified over a frequency range and expressed in
nV/kHz or V . It is measured at the output, with a constant load an
rms
no input ripple.
The total R
thermal resistance is expressed as:
th(j-a)
Current limiting is internal device circuitry incorporated to limit the
output current of the device. This feature is incorporated in the
device to protect the device against output over current conditions or
output shorts to ground.
R
= R
+ R
+ R
th(c-s) th(s-a)
th(j-a)
th(j-c)
The maximum power that a given package can handle is given by:
Tj(max) * Tamb
Thermal shutdown is internal device circuitry incorporated in the
device to shut down the device when the chip temperature reaches
a specified temperature. This feature protects the device from
excessive operating temperatures that would otherwise be
catastrophic to the device. Over heating can be created by
accidental output shorts.
PD
+
Rth(j*a)
Maximum power dissipation is the maximum total dissipation for
which the regulator will operate within specifications.
13
2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
TEST CIRCUITS
I
I
O4
ON/OFF
ON/OFF
4
5
I
O1
A
O5
C
VO1
R
L1
I
I
O3
O1
ON/OFF
ON/OFF
1
2
1
3
A
16
15
I
I
O3
C
V
VO3
R
O2
L3
ON/OFF
2
I
O5
3
4
5
A
14
13
12
V
C
VO5
R
L5
SA57003
I
O2
A
A
V
6
C
11
10
VO4
R
L4
7
C
IN
I
O2
V
IN
V
8
A
9
V
R
L2
C
VO2
C
C
C
NS3
NS1
NS2
SL01436
Figure 13. Test circuit 1.
PACKING METHOD
The SA57003 is packed in reels, as shown in Figure 14.
GUARD
BAND
TAPE
TAPE DETAIL
REEL
ASSEMBLY
COVER TAPE
CARRIER TAPE
BARCODE
LABEL
BOX
SL01305
Figure 14. Tape and reel packing method
14
2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOP001
15
2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
REVISION HISTORY
Rev
Date
Description
_2
20031013
Product data (9397 750 12114). ECN 853-2275 30325 of 09 September 2003.
Modifications:
• Change package version to SOP001 in Ordering information and Package outline sections.
_1
20010801
Product data (9397 750 08711). ECN 853-2275 26807 of 01 August 2001.
Data sheet status
Product
status
Definitions
[1]
Level
Data sheet status
[2] [3]
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limitingvaluesdefinition— Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
viaaCustomerProduct/ProcessChangeNotification(CPCN).PhilipsSemiconductorsassumesnoresponsibilityorliabilityfortheuseofanyoftheseproducts,conveys
nolicenseortitleunderanypatent, copyright, ormaskworkrighttotheseproducts, andmakesnorepresentationsorwarrantiesthattheseproductsarefreefrompatent,
copyright, or mask work right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2003
Contact information
All rights reserved. Printed in U.S.A.
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 10-03
9397 750 12114
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Document order number:
Philips
Semiconductors
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