SA58672UK-G [NXP]
IC,AUDIO AMPLIFIER,SINGLE,BGA,9PIN,PLASTIC;
| 型号： | SA58672UK-G |
| 厂家： | 
NXP |
| 描述： | IC,AUDIO AMPLIFIER,SINGLE,BGA,9PIN,PLASTIC 音频放大器 |
| 文件： | 总27页 (文件大小：184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SA58672
3.0 W mono class-D audio amplifier
Rev. 02 — 23 February 2009
Product data sheet
1. General description
The SA58672 is a mono, filter-free class-D audio amplifier which is available in a 9 bump
WLCSP (Wafer Level Chip-Size Package) and 10-terminal HVSON packages.
The SA58672 features shutdown control. Improved immunity to noise and RF rectification
is increased by high PSRR and differential circuit topology. Fast start-up time and very
small WLCSP package makes it an ideal choice for bot cellular handsets and PDAs.
The SA58672 delivers 1.7 W at 5 V and 800 mW at 3.6 V into 8 Ω. It delivers 3.0 W at 5 V
and 1.6 W at 3.6 V into 4 Ω. The maximum power efficiency is excellent at 90 % into 8 Ω
and 84 % to 88 % into 4 Ω. The SA58672 provides thermal and short-circuit shutdown
protection.
2. Features
I Output power
N 3.0 W into 4 Ω at 5 V
N 1.6 W into 4 Ω at 3.6 V
N 1.7 W into 8 Ω at 5 V
N 800 mW into 8 Ω at 3.6 V
I Power supply range: 2.0 V to 5.5 V
I Shutdown control
I High SVRR: −77 dB at 217 Hz
I Fast start-up time: 7.0 ms
I Low supply current
I Low shutdown current
I Short-circuit and thermal protection
I Space savings with 1.66 mm × 1.71 mm × 0.6 mm 9 bump WLCSP package
I Low junction to ambient thermal resistance of 100 K/W with adequate heat sinking of
WLCSP
I Enhanced power dissipation with 3.0 mm × 3.0 mm × 0.85 mm HVSON10 package
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
3. Applications
I Wireless and cellular handsets and PDAs
I Portable DVD player
I USB speakers
I Notebook PC
I Portable radio and gaming
I Educational toys
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
SA58672TK
SA58672UK
HVSON10
plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 × 3 × 0.85 mm
SOT650-1
WLCSP9
wafer level chip-size package; 9 bumps; 1.66 × 1.71 × 0.6 mm
SA58672UK
5. Block diagram
battery
C
S
PVDD, AVDD
R
f
R
i
INP
positive
differential
input
OUTP
OUTM
bypass
V
P
H-BRIDGE
R = 8 Ω
L
bypass
internal biasing
PWM
bypass
R
i
INM
negative
differential
input
R
f
INTERNAL
OSCILLATOR
300 kΩ
SHUTDOWN
CONTROL
002aad820
V
AGND, PGND
IH
V
SD
IL
Fig 1. Block diagram
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
2 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
6. Pinning information
6.1 Pinning
SA58672UK
bump A1
index area
1
2
3
A
B
C
1
2
3
A
B
C
INP
AGND OUTM
AVDD
INM
PVDD
SD
PGND
OUTP
001aai332
002aad854
Transparent top view
Transparent top view
Fig 2. Pin configuration for WLCSP9
Fig 3. Ball mapping for WLCSP9
terminal 1
index area
1
2
3
4
5
10
9
SD
AVDD
INM
OUTP
PVDD
PGND
OUTM
n.c.
8
SA58672TK
7
INP
(1)
AGND
DAP
6
002aad822
Transparent top view
(1) Exposed Die Attach Paddle (DAP).
Fig 4. Pin configuration for HVSON10
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
3 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
6.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
WLCSP9 HVSON10
INP
A1
B1
C1
A2
B2
C2
A3
B3
C3
-
4
channel positive input
AVDD
INM
2
analog supply voltage (level same as PVDD)
channel negative input
3
AGND
PVDD
SD
5
analog ground
9
power supply voltage (level same as AVDD)
channel shutdown input (active LOW)
channel negative output
power ground
1
OUTM
PGND
OUTP
n.c.
7
8
10
channel positive output
6
not connected
DAP
-
(DAP)
exposed die attach paddle; connect to ground plane heat
spreader
7. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Active mode
Shutdown mode
pin SD
Min
Max
Unit
V
VDD
supply voltage
−0.3
−0.3
GND
−0.3
+6.0
+7.0
V
VI
input voltage
VDD
V
other pins
VDD + 0.3
V
P
power dissipation
WLCSP9;
derating factor 10 mW/K
Tamb = 25 °C
Tamb = 75 °C
Tamb = 85 °C
-
-
-
1250
750
mW
mW
mW
650
HVSON10;
derating factor 20 mW/K
Tamb = 25 °C
Tamb = 75 °C
Tamb = 85 °C
operating in free air
operating
-
3.12
1.87
1.62
+85
+150
+150
-
mW
mW
mW
°C
-
-
Tamb
Tj
ambient temperature
junction temperature
storage temperature
−40
−40
−65
±2000
±200
°C
Tstg
Vesd
°C
electrostatic discharge
voltage
human body model
machine model
V
-
V
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
4 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
8. Static characteristics
Table 4.
Static characteristics
Tamb = 25 °C, unless otherwise specified[1].
Symbol
VDD
Parameter
Conditions
Min
2.0
-
Typ
Max
5.5
25
Unit
V
supply voltage
output offset voltage
-
|VO(offset)
|
measured differentially;
inputs AC grounded;
Gv = 6 dB;
5
mV
VDD = 2.0 V to 5.5 V
PSRR
Vi(cm)
power supply rejection ratio
common-mode input voltage
common mode rejection ratio
V
DD = 2.0 V to 5.5 V
-
−93
-
−70
dB
V
VDD = 2.0 V to 5.5 V
0.5
-
VDD − 0.8
CMRR
inputs are shorted together;
VDD = 2.0 V to 5.5 V
−69
−50
dB
IIH
IIL
HIGH-level input current
LOW-level input current
supply current
VDD = 5.5 V; VI = VDD
VDD = 5.5 V; VI = 0 V
VDD = 5.5 V; no load
VDD = 5.0 V; no load
VDD = 3.6 V; no load
VDD = 2.5 V; no load
-
-
-
-
50
5
µA
µA
mA
mA
mA
mA
nA
V
-
IDD
3.4
3.2
2.6
2.2
10
-
4.2
4.0
3.4
3.0
1000
VDD
0.35
340
-
-
-
IDD(sd)
VSD
shutdown mode supply current no input signal; VSD = GND
-
voltage on pin SD
device ON
1.3
device OFF
GND
-
V
Zi
input impedance
VDD = 2.0 V to 5.5 V
static; VDD = 5.5 V
static; VDD = 3.6 V
static; VDD = 2.5 V
VSD = 0.35 V
260
300
430
475
550
2
kΩ
mΩ
mΩ
mΩ
kΩ
RDSon
drain-source on-state
resistance
-
-
-
-
-
-
Zo(sd)
shutdown mode output
impedance
-
fsw
switching frequency
VDD = 2.5 V to 5.5 V
250
300
350
kHz
V/V
Gv(cl)
closed-loop voltage gain
VDD = 2.0 V to 5.5 V; Ri in kΩ
260 kΩ
300 kΩ
340 kΩ
/ Ri
/ Ri
/ Ri
[1] VDD is the supply voltage on pin PVDD and pin AVDD.
GND is the ground supply voltage on pin PGND and pin AGND.
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
5 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
9. Dynamic characteristics
Table 5.
Dynamic characteristics
Tamb = 25 °C; RL = 8 Ω; unless otherwise specified[1].
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Po
output power
f = 1 kHz; THD+N = 10 %
RL = 8 Ω; VDD = 5.0 V
RL = 8 Ω; VDD = 3.6 V
RL = 4 Ω; VDD = 5.0 V
RL = 4 Ω; VDD = 3.6 V
f = 1 kHz; THD+N = 1 %
RL = 8 Ω; VDD = 5.0 V
RL = 8 Ω; VDD = 3.6 V
RL = 4 Ω; VDD = 5.0 V
RL = 4 Ω; VDD = 3.6 V
-
-
-
-
1.7
800
3.0
1.6
-
-
-
-
W
mW
W
W
-
-
-
-
-
1.6
-
-
-
-
-
W
W
W
W
%
0.75
2.4
1.2
THD+N
total harmonic
VDD = 5 V; Gv = 6 dB; RL = 8 Ω;
0.08
distortion-plus-noise
f = 1 kHz; Po = 1 W
VDD = 3 V; RL = 3 Ω; Po = 1 W
Po(RMS) = 2.0 W; RL = 4 Ω
Po(RMS) = 1.3 W; RL = 8 Ω
Gv = 6 dB; f = 217 Hz
VDD = 5.0 V
-
-
-
3
-
-
-
%
%
%
ηpo
output power efficiency
85
90
SVRR
supply voltage ripple rejection
-
-
-
-
−77
−73
−69
7.0
-
-
-
-
dB
dB
dB
ms
VDD = 3.6 V
CMRR
common mode rejection ratio
VDD = 5 V; Gv = 6 dB; f = 217 Hz
VDD = 3.6 V
td(sd-startup)
delay time from shutdown to
start-up
Vn(o)
output noise voltage
VDD = 3.6 V; f = 20 Hz to 20 kHz;
inputs are AC grounded
no weighting
A weighting
-
-
35
27
-
-
µV
µV
[1] VDD is the supply voltage on pins PVDD and pin AVDD.
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
6 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
10. Typical characterization curves
002aad856
(1)
002aad857
100
100
po
(3)
(2)
(1)
η
η
(2)
po
(3)
80
80
60
40
20
0
60
40
20
0
0
0.5
1.0
1.5
2.0
2.5
P
3.0
(W)
0
0.5
1.0
1.5
2.0
P (W)
o
o
a. RL = 2 × 15 µH + 4.11 Ω
b. RL = 2 × 15 µH + 8.03 Ω
(1) VDD = 5.0 V.
(2) VDD = 3.6 V.
(3) VDD = 2.5 V.
Fig 5. Output power efficiency as a function of output power
002aad858
(1)
002aad859
(1)
0.5
P
(W)
0.3
P
0.4
(W)
0.2
0.3
0.2
0.1
0
(2)
(2)
0.1
0
0
1.0
2.0
3.0
0
0.5
1.0
1.5
2.0
P
(W)
P (W)
o
o
a. VDD = 5.0 V
b. VDD = 3.6 V
(1) RL = 2 × 15 µH + 4.11 Ω.
(2) RL = 2 × 15 µH + 8.03 Ω.
Fig 6. Power dissipation as a function of output power
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
7 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
002aad860
(1)
002aad861
(1)
400
800
I
I
DD
DD
(mA)
(mA)
300
600
(2)
(2)
(3)
200
100
0
400
200
0
(3)
0
0.5
1.0
1.5
2.0
0
1
2
3
P
(W)
P (W)
o
o
a. R = 2 × 15 µH + 8.03 Ω
b. R = 2 × 15 µH + 4.11 Ω
L
L
(1) VDD = 5.0 V.
(2) VDD = 3.6 V.
(3) VDD = 2.5 V.
Fig 7. Supply current as a function of output power
002aad862
002aad863
(1)
8
8
I
I
DD(sd)
DD
(mA)
(µA)
(1)
6
4
2
0
6
4
2
0
(2)
(3)
(2)
2.5
3.5
4.5
5.5
0
0.5
1.0
1.5
2.0
V
(V)
V
SD
(V)
DD
(1) With ferrite bead + 1 nF capacitor on outputs;
(1) VDD = 5.0 V.
(2) VDD = 3.6 V.
(3) VDD = 2.5 V.
RL = 2 × 15 µH + 8.03 Ω.
(2) Without ferrite beads + 1 nF capacitor on outputs;
RL = 2 × 15 µH + 8.03 Ω or no load.
Fig 8. Supply current as a function of supply voltage
Fig 9. Shutdown mode supply current as a function
of shutdown voltage
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
8 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
002aad864
(4)
002aad865
2
2
10
10
THD+N
THD+N
(%)
(%)
(1)
(1)
(2) (3) (4)
(2)
(3)
10
10
1
1
−1
−1
10
10
−2
−2
10
10
−1
−2
−1
10
1
10
10
10
1
10
P
(W)
P (W)
o
o
a. R = 2 × 15 µH + 4 Ω; A-weighting THD+N filter
b. R = 2 × 15 µH + 8 Ω; A-weighting THD+N filter
L
L
(1) VDD = 2.5 V.
(2) VDD = 3.6 V.
(3) VDD = 5.0 V.
(4) VDD = 5.5 V.
Fig 10. Total harmonic distortion-plus-noise as a function of output power
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
9 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
002aad869
002aad870
10
10
THD+N
(%)
THD+N
(%)
(1)
(5)
(2)
(1)
(2)
(3)
1
1
(4)
(3)
(4)
−1
−1
10
10
−2
−2
10
10
10
−3
−3
10
2
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
(1) VO = 4 dBV.
(2) VO = 3.5 dBV.
(3) VO = 0 dBV.
(4) VO = −10 dBV.
(1) VO = 8 dBV.
(2) VO = 7 dBV.
(3) VO = 5 dBV.
(4) VO = 0 dBV.
(5) VO = −10 dBV.
a. VDD = 2.5 V
b. VDD = 3.6 V
002aad871
10
THD+N
(%)
(1)
(5)
(2)
1
−1
10
(3)
(4)
−2
10
10
−3
2
3
4
5
10
10
10
10
10
f (Hz)
(1) VO = 11 dBV.
(2) VO = 10 dBV.
(3) VO = 8 dBV.
(4) VO = 0 dBV.
(5) VO = −10 dBV.
c. VDD = 5.0 V
Fig 11. Total harmonic distortion-plus-noise as a function of frequency; RL = 2 × 15 µH + 4 Ω; Gv = 6 dB;
A-weighting THD+N filter
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
10 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
002aad866
002aad867
+20
+20
FFT
(dB)
FFT
(dB)
−40
−100
−160
−40
−100
−160
0
8
16
24
0
8
16
24
f (kHz)
f (kHz)
a. fi = 1 kHz
b. fi = 3 kHz
002aad868
+20
FFT
(dB)
−40
−100
−160
0
8
16
24
f (kHz)
c. fi = 5 kHz
Fig 12. FFT spectrum as a function of frequency; VDD = 3.6 V; VO = 6 dBV; RL = 2 × 15 µH + 4 Ω
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
11 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
002aad873
002aad874
−50
−50
SVRR
(dB)
SVRR
(dB)
−70
−70
(3)
−90
−90 (3)
(2)
(1)
(2)
(1)
−110
−110
2
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
a. RL = 2 × 15 µH + 4.11 Ω; inputs AC grounded;
Ci = 1 µF
b. RL = 2 × 15 µH + 8.03 Ω; inputs AC grounded;
Ci = 1 µF
002aad875
−50
SVRR
(dB)
−70
(3)
−90
(1)
(2)
−110
2
3
4
5
10
10
10
10
10
f (Hz)
c. RL = 2 × 15 µH + 8.03 Ω; inputs floating
(1) VDD = 5.0 V.
(2) VDD = 3.6 V.
(3) VDD = 2.5 V.
Fig 13. Supply voltage ripple rejection as a function of frequency; Gv(cl) = 2 V/V
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
12 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
11. Application information
11.1 Power supply decoupling considerations
The SA58672 is a mono class-D audio amplifier that requires proper power supply
decoupling to ensure the rated performance for THD+N and power efficiency. To decouple
high frequency transients, power supply spikes and digital noise on the power bus line, a
low Equivalent Series Resistance (ESR) capacitor, of typically 1 µF is placed as close as
possible to the PVDD terminals of the device. It is important to place the decoupling
capacitor at the power pins of the device because any resistance or inductance in the
PCB trace between the device and the capacitor can cause a loss in efficiency. Additional
decoupling using a larger capacitor, 4.7 µF or greater may be done on the power supply
connection on the PCB to filter low frequency signals. Usually this is not required due to
high PSRR of the device.
11.2 Voltage gain
The SA58672 is comprised of an analog amplifier stage and a comparator stage. The
output of the analog amplifier stage is compared with the periodic ramp signal from the
sawtooth ramp generator. The resulting output of the comparator is a Pulse Width
Modulated (PWM) signal. The final stage is a power NMOS and PMOS H-bridge that
converts the PWM into a high power output signal capable of driving low-impedance
loads.
The input resistor, Ri sets the gain of the amplifier according to Equation 1:
2(150 kΩ)
Gain =
(1)
--------------------------
Ri
11.3 Input capacitor selection
The SA58672 does not require input coupling capacitors when used with a differential
audio source that is biased from 0.5 V to VDD − 0.8 V. In other words, the input signal must
be biased within the common-mode input voltage range. If high-pass filtering is required
or if it is driven using a single-ended source, input coupling capacitors are required.
The 3 dB cut-off frequency created by the input coupling capacitor and the input resistors
is calculated by Equation 2:
1
f –3dB
=
(2)
-----------------------------
2π × Ri × Ci
Using an input resistor of 150 kΩ, the gain is set to 2 V/V. At this gain setting, for input
capacitor values from 220 nF to 2.2 µF, the 3 dB cut-off frequency may be set between
22 Hz and 220 Hz. Since the values of the input coupling capacitor and the input resistor
affects the low frequency performance of the audio amplifier, it is important to consider in
the system design. Small speakers in wireless and cellular phones usually do not respond
well to low frequency signals. Their low frequency response may be only 600 Hz; typically
1 kHz. Thus, the 3 dB cut-off frequency should be increased to block the low frequency
signals to the speakers.
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
13 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
For a required 3 dB cut-off frequency, Equation 3 is used to determine Ci:
1
Ci =
(3)
-------------------------------------
2π × Ri × f –3dB
The input signal may be DC-coupled, but not using input coupling capacitors may
increase the output offset voltage.
11.4 PCB layout considerations
The component location is very important for performance of the SA58672. Place all
external components very close to the device. Placing decoupling capacitors directly at
the power supply pins increases efficiency because the resistance and inductance in the
trace between the device power supply pins and the decoupling capacitor causes a loss in
power efficiency.
The trace width and routing are also very important for power output and noise
considerations.
For high current terminals (PVDD, PGND and audio output), the trace widths should be
maximized to ensure proper performance and output power. Use at least 500 µm wide
traces.
For the input pins (INP, INM), the traces must be symmetrical and run side-by-side to
maximize common-mode cancellation.
11.5 Evaluation demo board
The SA58672 evaluation demo board schematic is shown in Figure 14. An evaluation
demo board is available and it may be used for either differential or single-ended (SE)
input configuration. A component position on the PCB is provided to AC ground one of the
inputs using a 0 Ω chip resistor. When driving SE, the undriven input must be at the same
DC level as driven input. If the input is driven from an iPOD or MP3 player, the undriven
input is AC grounded; however, if driven from a CODEC, the undriven input is AC
decoupled to the same level as the CODEC output. Usually, a Vref is provided on the
CODEC.
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
14 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
GND
SV1
1
2
3
GND
SD
PVDD
GND
PVDD
GND
C4
C7
10 µF
SA58672
FB1
1 nF
OUTP
OUTP
2 A - 220 Ω
1
2
3
4
5
10
9
C6
1 µF
SD
OUTP
PVDD
PGND
OUTM
n.c.
R4
C3
C1 1 µF
GND
AVDD
INM
GND
1 µF
R2
R1
8
INM
7
INP
INP
OUTM
OUTM
6
FB2
2 A - 220 Ω
C2
C5
1 nF
AGND
1 µF
R3
HVSON10
(3 mm × 3 mm)
GND
GND
GND9 GND6 GND
1
2
3
GND
PVDD
AVDD
GND
EXT_AVDD
EXT_AVDD
C8
10 µF
SV2
002aad872
R3 and R4 are not populated for differential input drive. For single-ended input drive, either R3 or R4 are shorted to ground
using a 0 Ω resistor (i.e., one input is AC grounded and the other is driven with the input signal).
Fig 14. SA58672 evaluation demo board schematic
11.6 Filter-free operation and ferrite bead filters
A ferrite bead low-pass filter can be used to reduce radio frequency emissions in
applications that have circuits sensitive to greater than 1 MHz. A ferrite bead low-pass
filter functions well for amplifiers that must pass FCC unintentional radiation requirements
at greater than 30 MHz. Choose a bead with high-impedance at high frequencies and very
low-impedance at low frequencies. In order to prevent distortion of the output signal,
select a ferrite bead with adequate current rating.
Ferrite bead sources are:
• TDK MPZ1608S221A: 220 Ω at 100 MHz; 3 A peak max current;
0.04 Ω DC resistance.
• KOA CZP2AFTTD221P: 220 Ω at 100 MHz; 2 A peak max current;
0.05 Ω DC resistance.
• Murata BLM21PG221SN1: 220 Ω at 100 MHz; 2 A peak max current;
0.05 Ω DC resistance.
The DC resistance should be as low as possible and the maximum current must exceed at
least 1 A. Impedance of 220 Ω at 100 MHz is common spec, but 600 Ω and 1 kΩ ferrite
beads may be used. Generally, the current rating decreases with increasing impedance at
100 MHz. However, larger impedance at 100 MHz allows for a smaller, shunt capacitor
that will reduce the quiescent load current; this is important for battery operated
applications.
SA58672_2
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Product data sheet
Rev. 02 — 23 February 2009
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SA58672
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3.0 W mono class-D audio amplifier
For applications in which there are circuits that are EMI sensitive to low frequency
(< 1 MHz) and there are long leads from amplifier to speaker, it may be necessary to use
an LC output filter.
11.7 Efficiency and thermal considerations
The maximum ambient operating temperature depends on the heat transferring ability of
the heat spreader on the PCB layout. In Table 3 “Limiting values”, power dissipation, the
power derating factor is given as 10 mW/K. The device thermal resistance, Rth(j-a) is the
reciprocal of the power derating factor. Convert the power derating factor to Rth(j-a) by
Equation 4:
1
1
Rth( j-a)
=
=
= 100 K/W
(4)
-----------------------------------------
derating factor
---------
0.01
For a maximum allowable junction temperature, Tj = 150 °C and Rth(j-a) = 100 K/W and a
maximum device dissipation of 0.84 W (420 mW per channel) and for 1.7 W per channel
output power, 4 Ω load, 5 V supply, the maximum ambient temperature is calculated using
Equation 5:
Tamb(max) = T j(max) – (Rth( j-a) × Pmax) = 150 – (100 × 0.84) = 66 °C
(5)
The maximum ambient temperature is 66 °C at maximum power dissipation for 5 V supply
and 4 Ω load. If the junction temperature of the SA58672 rises above 150 °C, the thermal
protection circuitry turns the device off; this prevents damage to the IC. Using speakers
greater than 4 Ω further enhances thermal performance and battery lifetime by reducing
the output load current and increasing amplifier efficiency.
11.8 Additional thermal information
The SA58672 9 bump WLCSP package ground bumps are soldered directly to the PCB
heat spreader. By the use of thermal vias, the bumps may be soldered directly to a ground
plane or special heat sinking layer designed into the PCB. The thickness and area of the
heat spreader may be maximized to optimize heat transfer and achieve lower package
thermal resistance.
The SA58672 HVSON10 package has an exposed Die Attach Paddle (DAP), which is
soldered directly to the PCB heat spreader to provide enhanced heat transfer and achieve
lowest package thermal resistance.
SA58672_2
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Product data sheet
Rev. 02 — 23 February 2009
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SA58672
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3.0 W mono class-D audio amplifier
12. Test information
12.1 Test setup for typical characterization curves
The SA58672 demo board shown in Figure 14 and the APA (Audio Precision Analyzer)
are used to provide the characterization curves. The test setup diagram in Figure 15
shows the setup details. The output load configuration is comprised of 2 × 15 µH power
inductors and precision power load resistor. This passive load emulates a small, low
power speaker; it facilitates efficiency measurements. A speaker may be substituted for
the passive load to yield similar results.
15 µH
INP
INM
OUTP
OUTM
AP585
AUDIO
ANALYZER
AUX0025
30 kHz
LOW-PASS FILTER
R
L
DUT
15 µH
−
+
AP585
MEASUREMENT
INPUTS
POWER
SUPPLY
002aad855
(1) DUT is the SA58672 evaluation demo board.
Fig 15. SA58672 test setup block diagram
SA58672_2
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Product data sheet
Rev. 02 — 23 February 2009
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SA58672
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3.0 W mono class-D audio amplifier
13. Package outline
HVSON10: plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 x 3 x 0.85 mm
SOT650-1
0
1
2 mm
scale
X
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
e
1
terminal 1
index area
y
y
v
M
e
C
C
A
B
b
C
1
1
5
w
M
L
E
h
6
10
D
h
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
(1)
(1)
UNIT
A
b
E
e
e
y
c
D
D
E
L
v
w
y
1
1
h
1
h
0.05 0.30
0.00 0.18
3.1
2.9
2.55
2.15
3.1
2.9
1.75
1.45
0.55
0.30
mm
0.05
0.1
1
0.2
0.5
2
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-01-22
02-02-08
SOT650-1
- - -
MO-229
- - -
Fig 16. Package outline SOT650-1 (HVSON10)
SA58672_2
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Product data sheet
Rev. 02 — 23 February 2009
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SA58672
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3.0 W mono class-D audio amplifier
WLCSP9: wafer level chip-size package; 9 bumps; 1.66 x 1.71 x 0.6 mm
SA58672UK
D
A
B
E
bump A1
index area
A
2
A
A
1
detail X
e
1
C
M
v
C A
C
B
b
y
M
w
e
C
e
e
2
B
A
bump A1
index area
1
2
3
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
A
2
b
D
E
e
e
1
e
2
v
w
y
max
0.26 0.38 0.34 1.69 1.74
0.22 0.34 1.63 1.68
mm
0.64
0.5
1
1
0.15 0.05 0.08
0.30
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
08-06-12
SA58672UK
Fig 17. Package outline WLCSP9
SA58672_2
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Product data sheet
Rev. 02 — 23 February 2009
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14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
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Product data sheet
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14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 18) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6 and 7
Table 6.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
220
< 2.5
235
220
≥ 2.5
220
Table 7.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 18.
SA58672_2
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Product data sheet
Rev. 02 — 23 February 2009
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SA58672
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Soldering of WLCSP packages
15.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
15.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
15.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a PbSn process, thus
reducing the process window
SA58672_2
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Product data sheet
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SA58672
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3.0 W mono class-D audio amplifier
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 8.
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
260
> 2000
260
< 1.6
1.6 to 2.5
> 2.5
260
250
245
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 19.
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 19. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
15.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
SA58672_2
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Product data sheet
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3.0 W mono class-D audio amplifier
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
15.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
15.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
15.3.4 Cleaning
Cleaning can be done after reflow soldering.
16. Abbreviations
Table 9.
Abbreviations
Description
Acronym
APA
Audio Precision Analyzer
compressor-decompressor
Die Attach Paddle
CODEC
DAP
DUT
DVD
EMI
Device Under Test
Digital Video Disc
ElectroMagnetic Interference
Equivalent Series Resistance
Federal Communications Commission
Fast Fourier Transform
Integrated Circuit
ESR
FCC
FFT
IC
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
24 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
Table 9.
Abbreviations …continued
Description
Acronym
LC
inductor-capacitor filter
Least Significant Bit
LSB
MP3
MSB
PC
MPEG-1 audio layer 3
Most Significant Bit
Personal Computer
PCB
PDA
Printed-Circuit Board
Personal Digital Assistant
Power Supply Rejection Ratio
Pulse Width Modulator
Radio Frequency
PSRR
PWM
RF
USB
WLCSP
Universal Serial Bus
Wafer Level Chip-Size Package
17. Revision history
Table 10. Revision history
Document ID
SA58672_2
Release date
Data sheet status
Change notice
Supersedes
20090223
Product data sheet
-
SA58672_1
Modifications:
• Section 2 “Features”, 2nd bullet item: changed from “Power supply range: 2.5 V to 5.5 V”
to “Power supply range: 2.0 V to 5.5 V”
• Table 4 “Static characteristics”:
–
–
–
–
–
–
–
VDD: Min value changed from “2.5 V” to “2.0 V”
|VO(offset)| conditions: changed from “VDD = 2.5 V to 5.5 V” to “VDD = 2.0 V to 5.5 V”
PSRR conditions: changed from “VDD = 2.5 V to 5.5 V” to “VDD = 2.0 V to 5.5 V”
Vi(cm) conditions: changed from “VDD = 2.5 V to 5.5 V” to “VDD = 2.0 V to 5.5 V”
CMRR conditions: changed from “VDD = 2.5 V to 5.5 V” to “VDD = 2.0 V to 5.5 V”
Zi conditions: changed from “VDD = 2.5 V to 5.5 V” to “VDD = 2.0 V to 5.5 V”
Gv(cl) conditions: changed from “VDD = 2.5 V to 5.5 V” to “VDD = 2.0 V to 5.5 V”
• Table 5 “Dynamic characteristics”, symbol THD+N: added condition “VDD = 3 V; RL = 3 Ω;
Po = 1 W” (Typ value = 3 %)
SA58672_1
20080710
Product data sheet
-
-
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
25 of 27
SA58672
NXP Semiconductors
3.0 W mono class-D audio amplifier
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
18.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SA58672_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 23 February 2009
26 of 27
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NXP Semiconductors
3.0 W mono class-D audio amplifier
20. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
19
20
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Typical characterization curves . . . . . . . . . . . . 7
8
9
10
11
Application information. . . . . . . . . . . . . . . . . . 13
Power supply decoupling considerations . . . . 13
Voltage gain . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Input capacitor selection. . . . . . . . . . . . . . . . . 13
PCB layout considerations . . . . . . . . . . . . . . . 14
Evaluation demo board. . . . . . . . . . . . . . . . . . 14
Filter-free operation and ferrite bead filters. . . 15
Efficiency and thermal considerations . . . . . . 16
Additional thermal information . . . . . . . . . . . . 16
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
12
12.1
13
Test information. . . . . . . . . . . . . . . . . . . . . . . . 17
Test setup for typical characterization curves. 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
14
Soldering of SMD packages . . . . . . . . . . . . . . 20
Introduction to soldering . . . . . . . . . . . . . . . . . 20
Wave and reflow soldering . . . . . . . . . . . . . . . 20
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21
14.1
14.2
14.3
14.4
15
15.1
15.2
15.3
15.3.1
15.3.2
15.3.3
15.3.4
Soldering of WLCSP packages. . . . . . . . . . . . 22
Introduction to soldering WLCSP packages . . 22
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Quality of solder joint . . . . . . . . . . . . . . . . . . . 24
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
16
17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 25
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
18.1
18.2
18.3
18.4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 February 2009
Document identifier: SA58672_2
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