SA676DK/01,118 [NXP]
SA676DKSOT266-1;
| 型号： | SA676DK/01,118 |
| 厂家： | 
NXP |
| 描述： | SA676DKSOT266-1 光电二极管 商用集成电路 |
| 文件： | 总22页 (文件大小：519K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SA676
Low-voltage mixer FM IF system
Rev. 3 — 19 July 2012
Product data sheet
1. General description
The SA676 is a low-voltage monolithic FM IF system incorporating a mixer/oscillator, two
limiting intermediate frequency amplifiers, quadrature detector, logarithmic Received
Signal Strength Indicator (RSSI), voltage regulator and audio and RSSI op amps. The
SA676 is available in a 20-pin SSOP (Shrink Small Outline Package).
The SA676 was designed for cordless telephone applications in which efficient and
economic integrated solutions are required and yet high performance is desirable.
Although the product is not targeted to meet the stringent specifications of high
performance cellular equipment, it will exceed the needs for analog cordless phones. The
minimal amount of external components and absence of any external adjustments makes
for a very economical solution.
2. Features and benefits
Low power consumption: 3.5 mA typical at 3 V
Mixer input to > 100 MHz
Mixer conversion power gain of 17 dB at 45 MHz
XTAL oscillator effective to 100 MHz (LC oscillator or external oscillator can be used at
higher frequencies)
102 dB of IF amplifier/limiter gain
2 MHz IF amp/limiter small signal bandwidth
Temperature compensated logarithmic Received Signal Strength Indicator (RSSI) with
a 70 dB dynamic range
Low external component count; suitable for crystal/ceramic/LC filters
Audio output internal op amp
RSSI output internal op amp
Internal op amps with rail-to-rail outputs
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 Class II, Level B
3. Applications
Cordless telephones
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
4. Ordering information
Table 1.
Ordering information
Tamb = 40 C to +85 C
Type number
Topside
mark
Package
Name
Description
Version
SA676DK/01
SA676DK
SSOP20
plastic shrink small outline package; 20 leads;
body width 4.4 mm
SOT266-1
5. Block diagram
20
19
18
17
16
15
14
13
12
11
IF amp
limiter
mixer
RSSI
OSC
quad
VREG
6
audio
E
3
B
4
1
2
5
7
8
9
10
002aag116
Fig 1. Block diagram
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
2 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
6. Pinning information
6.1 Pinning
1
2
20
19
18
17
16
15
14
13
12
11
RF_IN
RF_IN_DECOUPL
OSC_OUT
MIXER_OUT
IF_AMP_DECOUPL
IF_AMP_IN
3
4
OSC_IN
IF_AMP_DECOUPL
IF_AMP_OUT
GND
5
RSSI_OUT
SA676DK/01
6
V
CC
7
AUDIO_FEEDBACK
AUDIO_OUT
LIMITER_IN
8
LIMITER_DECOUPL
LIMITER_DECOUPL
LIMITER_OUT
9
RSSI_FEEDBACK
QUADRATURE_IN
10
002aag115
Fig 2. Pin configuration for SSOP20
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
1
Description
RF_IN
RF input
RF_IN_DECOUPL
OSC_OUT
2
RF input decoupling pin
oscillator output
3
OSC_IN
4
oscillator input
RSSI_OUT
5
RSSI output
VCC
6
positive supply voltage
AUDIO_FEEDBACK
AUDIO_OUT
RSSI_FEEDBACK
QUADRATURE_IN
LIMITER_OUT
LIMITER_DECOUPL
LIMITER_DECOUPL
LIMITER_IN
7
audio amplifier negative feedback terminal
audio amplifier output
8
9
RSSI amplifier negative feedback terminal
quadrature detector input terminal
limiter amplifier output
10
11
12
13
14
15
16
17
18
19
20
limiter amplifier decoupling pin
limiter amplifier decoupling pin
limiter amplifier input
GND
ground; negative supply
IF amplifier output
IF_AMP_OUT
IF_AMP_DECOUPL
IF_AMP_IN
IF amplifier decoupling pin
IF amplifier input
IF_AMP_DECOUPL
MIXER_OUT
IF amplifier decoupling pin
mixer output
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
3 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
7. Functional description
The SA676 is an IF signal processing system suitable for second IF systems with input
frequency as high as 100 MHz. The bandwidth of the IF amplifier and limiter is at least
2 MHz with 90 dB of gain. The gain/bandwidth distribution is optimized for 455 kHz,
1.5 k source applications. The overall system is well-suited to battery operation as well
as high performance and high quality products of all types.
The input stage is a Gilbert cell mixer with oscillator. Typical mixer characteristics include
a noise figure of 7.0 dB, conversion gain of 17 dB, and input third-order intercept of
10 dBm. The oscillator will operate in excess of 100 MHz in L/C tank configurations.
Hartley or Colpitts circuits can be used up to 100 MHz for crystal configurations.
The output impedance of the mixer is a 1.5 k resistor permitting direct connection to a
455 kHz ceramic filter. The input resistance of the limiting IF amplifiers is also 1.5 k. With
most 455 kHz ceramic filters and many crystal filters, no impedance matching network is
necessary. The IF amplifier has 44 dB of gain and 5.5 MHz bandwidth. The IF limiter has
58 dB of gain and 4.5 MHz bandwidth.
To achieve optimum linearity of the log signal strength indicator, there must be a 12 dBV
insertion loss between the first and second IF stages. If the IF filter or interstage network
does not cause 12 dBV insertion loss, a fixed or variable resistor or an L pad for
simultaneous loss and impedance matching can be added between the first IF output
(IF_AMP_OUT) and the interstage network. The overall gain will then be 90 dB with
2 MHz bandwidth.
The signal from the second limiting amplifier goes to a Gilbert cell quadrature detector.
One port of the Gilbert cell is internally driven by the IF. The other output of the IF is
AC-coupled to a tuned quadrature network. This signal, which now has a 90 phase
relationship to the internal signal, drives the other port of the multiplier cell.
The demodulated output of the quadrature drives an internal op amp. This op amp can be
configured as a unity gain buffer, or for simultaneous gain, filtering, and second-order
temperature compensation if needed. It can drive an AC load as low as 10 k with a
rail-to-rail output.
A log signal strength indicator completes the circuitry. The output range is greater than
70 dB and is temperature compensated. This signal drives an internal op amp. The
op amp is capable of rail-to-rail output. It can be used for gain, filtering, or second-order
temperature compensation of the RSSI, if needed.
Remark: dBV = 20log VO/VI.
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
4 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
Min
-
Max
7
Unit
V
supply voltage
Tstg
storage temperature
ambient temperature
65
40
+150
+85
C
C
Tamb
operating
9. Thermal characteristics
Table 4.
Symbol
Zth(j-a)
Thermal characteristics
Parameter
Conditions
Max
117
Unit
transient thermal impedance SA676DK/01 (SSOP20)
from junction to ambient
K/W
10. Static characteristics
Table 5.
Static characteristics
VCC = 3 V; Tamb = 25 C; unless specified otherwise.
Symbol
VCC
Parameter
Conditions
Min
2.7
-
Typ
Max
7.0
Unit
V
supply voltage
supply current
-
ICC
3.5
5.0
mA
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
5 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
11. Dynamic characteristics
Table 6.
Dynamic characteristics
Tamb = 25 C; VCC = 3 V; unless specified otherwise. RF frequency = 45 MHz + 14.5 dBV RF input step-up.
IF frequency = 455 kHz; R17 = 2.4 k and R18 = 3.3 k. RF level = 45 dBm; FM modulation = 1 kHz with 5 kHz peak
deviation. Audio output with de-emphasis filter and C-message weighted filter. Test circuit Figure 9. The parameters listed
below are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent
the ultimate performance limits of the device. Use of an optimized RF layout will improve many of the listed parameters.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Mixer/oscillator section (external LO = 220 mV RMS value)
fi
input frequency
-
-
-
-
100
100
7.0
-
-
-
-
MHz
MHz
dB
fosc
NF
IP3I
oscillator frequency
noise figure
at 45 MHz
input third-order intercept point
50 source;
10
dBm
f1 = 45.0 MHz; f2 = 45.06 MHz;
input RF level = 52 dBm
Gp(conv)
conversion power gain
matched 14.5 dBV step-up
50 source
10
17
2.5
8
-
dB
dB
k
pF
k
-
-
Ri(RF)
RF input resistance
RF input capacitance
mixer output resistance
single-ended input
-
-
Ci(RF)
-
3.0
1.5
4.0
-
Ro(mix)
IF section
Gamp(IF)
Glim
MIXER_OUT pin
1.25
IF amplifier gain
limiter gain
50 source
50 source
30 % AM 1 kHz
gain of two
-
44
-
-
-
-
-
-
-
dB
dB
dB
mV
dB
dB
dB
-
58
AM
AM rejection
-
50
Vo(aud)
SINAD
THD
audio output voltage
60
-
120
17
signal-to-noise-and-distortion ratio IF level 110 dBm
total harmonic distortion
-
55
60
S/N
signal-to-noise ratio
RSSI output voltage
no modulation for noise
IF; R9 = 2 k
-
[1]
Vo(RSSI)
IF level = 110 dBm
IF level = 50 dBm
-
0.5
1.7
70
0.9
V
-
2.2
V
RSSI(range) RSSI range
-
-
-
-
-
-
-
dB
k
k
k
k
mV
Zi(IF)
IF input impedance
IF_AMP_IN pin
1.3
1.5
0.3
1.5
0.3
130
Zo(IF)
IF output impedance
limiter input impedance
limiter output impedance
RMS output voltage
IF_AMP_OUT pin
LIMITER_IN pin
LIMITER_OUT pin
LIMITER_OUT pin
-
Zi(lim)
Zo(lim)
Vo(RMS)
1.3
-
-
RF/IF section (internal LO)
SINAD signal-to-noise-and-distortion ratio system; RF level = 114 dBm
-
12
-
dB
[1] The generator source impedance is 50 , but the SA676 input impedance at IF_AMP_IN (pin 18) is 1500 . As a result, IF level refers
to the actual signal that enters the SA676 input (IF_AMP_IN, pin 18), which is about 21 dB less than the ‘available power’ at the
generator.
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
6 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
12. Performance curves
002aag198
6
V
= 7.0 V
5.0 V
CC
I
CC
(mA)
5
4
3
2
3.0 V
2.7 V
−55
−35
−15
5
25
45
65
85
105
125
(°C)
T
amb
Fig 3. Supply current versus ambient temperature
002aag199
18.0
V
= 2.7 V
3.0 V
7.0 V
G
p(conv)
(dB)
CC
17.5
17.0
16.5
16.0
−40
−20
0
20
40
60
80
90
T
amb
(°C)
Fig 4. Conversion power gain versus ambient temperature
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
7 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
002aaf414
20
IF output power
(dBm)
0
−20
−40
−60
(1)
(2)
−80
−66
−46
−26
−6
14
34
(3)
RF input level (dBm)
RF = 45 MHz; IF = 455 kHz.
(1) Fund product.
(2) Third order product.
(3) 50 input.
Fig 5. Mixer third order intercept and compression
002aaf416
5
audio
relative level
(dB)
−5
−15
−25
−35
−45
−55
−65
AM rejection
THD+N
noise
−125
−105
−85
−65
−45
−25
RF level (dBm)
VCC = 3 V; RF = 45 MHz; deviation = 5 kHz; Vo(aud)RMS = 117.6 mV.
Fig 6. Relative level of audio, AM rejection, THD+N and noise (Tamb = +25 C)
SA676
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Product data sheet
Rev. 3 — 19 July 2012
8 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
002aag200
2.1
V
o(RSSI)
(V)
1.8
1.5
1.2
0.9
0.6
0.3
T
amb
= +85 °C
+27 °C
−40 °C
−125
−105
−85
−65
−45
RF level (dBm)
VCC = 3 V
Fig 7. RSSI output voltage versus RF level
002aag201
300
V
CC
= 7.0 V
5.0 V
V
(mV)
o(aud)
200
3.0 V
2.7 V
100
0
−55
−35
−15
5
25
45
65
85
105
125
(°C)
T
amb
Fig 8. Audio output voltage versus ambient temperature
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
9 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
13. Application information
C26
R18
3.3 kΩ
C15
R17
2.4 kΩ
FL1
20
FL2
C23
C21
C18 C17
13
19
18
17
16
15
14
12
11
IF amp
limiter
mixer
RSSI
OSC
quad
VREG
audio
1
2
3
4
5
6
7
8
9
10
C1
C2
C9
R11
C8
10 kΩ
L1
C12
R10
10 kΩ
C10
C7
L2
C27
2.2 μF
R19
11 kΩ
45 MHz
input
C5
IFT1
C6
C19
390 pF
X1
C14
RSSI_OUT
V
AUDIO_OUT
CC
002aag117
The layout is very critical in the performance of the receiver. We highly recommend our demo
board layout.
All of the inductors, the quad tank, and their shield must be grounded. A 10 F to 15 F or higher
value tantalum capacitor on the supply line is essential. A low frequency ESR screening test on this
capacitor will ensure consistent good sensitivity in production. A 0.1 F bypass capacitor on the
supply pin, and grounded near the 44.545 MHz oscillator improves sensitivity by 2 dB to 3 dB.
Fig 9. SA676 45 MHz application circuit (SA676DK demo board)
SA676
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Product data sheet
Rev. 3 — 19 July 2012
10 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
Table 7.
SA676DK demo board component list
Component
Description
C1
C2
51 pF NPO ceramic
220 pF NPO ceramic
100 nF 10 % monolithic ceramic
C5, C9, C14, C17,
C18, C21, C23, C26
C6
5 pF to 30 pF trim cap
1 nF ceramic
C7
C8, C15
C10
C12
C19
C27
FL1, FL2[2]
IFT1
L1
10.0 pF NPO ceramic
10 F tantalum (minimum)[1]
2.2 F 10 % tantalum
390 pF 10 % monolithic ceramic
2.2 F tantalum
ceramic filter Murata CFUKF455KB4X-R0
330 H Toko 303LN-1130
330 nH Coilcraft UNI-10/142--04J08S
0.8 H nominal Toko 292CNS-T1038Z
44.545 MHz crystal ICM4712701
L2
X1
R5[3]
R10
R11
not used in application board
8.2 k 5 % 1⁄4 W carbon composition
10 k 5 % 1⁄4 W carbon composition
2.4 k 5 % 1⁄4 W carbon composition
3.3 k 5 % 1⁄4 W carbon composition
11 k 5 % 1⁄4 W carbon composition
R17
R18
R19
[1] This value can be reduced when a battery is the power source.
[2] This is a 30 kHz bandwidth 455 kHz ceramic filter. All the characterization and testing are done with this
wideband filter. A more narrowband 15 kHz bandwidth 455 kHz ceramic filter that may be used as an
alternative selection is Murata CFUKG455KE4A-R0.
[3] R5 can be used to bias the oscillator transistor at a higher current for operation above 45 MHz.
Recommended value is 22 k, but should not be below 10 k.
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
11 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
RF IN
45 MHz
IF = 455 kHz
SA6x6DK
SA58640DK
L1
FIL1
C6
C1 C2
C21
C23
TOKO
C5
455 kHz
L2
U1
C7
44.545 MHz
X1
C8
R17
R18
C26
R11
455 kHz
FIL2
C15
C17 C18
C14
R10
R19
C19
RSSI
VCC
C27
C10
C9
AUDIO
GND
C12
FT1
820 Ω
4.7 nF
AUDIO_DC
001aal912
Fig 10. SA6x6DK/SA58640DK top view with components
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
12 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
001aal892
Fig 11. SA6x6DK/SA58640DK bottom view (viewed from top)
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
13 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
14. Test information
(1)
RF GENERATOR
45 MHz
(2)
SA676 DEMOBOARD
RSSI AUDIO
V
(+3 V)
CC
DE-EMPHASIS
FILTER
DC VOLTMETER
(3)
C-MESSAGE
HP339A DISTORTION
SCOPE
(4)
ANALYZER
002aag118
(1) Set RF generator at 45.000 MHz; use a 1 kHz modulation frequency and a 6 kHz deviation if using
16 kHz filters, or 8 kHz if using 30 kHz filters.
(2) The smallest RSSI voltage (i.e., when no RF input is present and the input is terminated) is a
measure of the quality of the layout and design. If the lowest RSSI voltage is 500 mV or higher, it
means the receiver is in regenerative mode. In that case, the receiver sensitivity will be worse than
expected.
(3) The C-message and de-emphasis filter combination has a peak gain of 10 dB for accurate
measurements. Without the gain, the measurements may be affected by the noise of the scope
and HP339A analyzer. The de-emphasis filter has a fixed 6 dB/octave slope between 300 Hz and
3 kHz.
(4) The measured typical sensitivity for 12 dB SINAD should be 0.45 V or 114 dBm at the RF input.
Fig 12. SA676 application circuit test setup
SA676
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Product data sheet
Rev. 3 — 19 July 2012
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SA676
NXP Semiconductors
Low-voltage mixer FM IF system
15. Package outline
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A
X
c
y
H
v
M
A
E
Z
11
20
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
10o
0o
0.15
0
1.4
1.2
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
6.6
6.2
0.75
0.45
0.65
0.45
0.48
0.18
mm
1.5
0.65
1
0.2
0.25
0.13
0.1
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT266-1
MO-152
Fig 13. Package outline SOT266-1 (SSOP20)
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
15 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
SA676
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Product data sheet
Rev. 3 — 19 July 2012
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SA676
NXP Semiconductors
Low-voltage mixer FM IF system
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 14) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
350
220
< 2.5
235
220
2.5
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 14.
SA676
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 14. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
Table 10. Abbreviations
Acronym
AM
Description
Amplitude Modulation
Charged-Device Model
ElectroStatic Discharge
Equivalent Series Resistance
Frequency Modulation
Human Body Model
CDM
ESD
ESR
FM
HBM
IF
Intermediate Frequency
inductor-capacitor filter
Local Oscillator
LC
LO
RF
Radio Frequency
RMS
RSSI
Root Mean Squared
Received Signal Strength Indicator
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Product data sheet
Rev. 3 — 19 July 2012
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NXP Semiconductors
Low-voltage mixer FM IF system
18. Revision history
Table 11. Revision history
Document ID
SA676 v.3
Release date
Data sheet status
Change notice
Supersedes
20120719
Product data sheet
-
SA676 v.2
Modifications:
• Section 2 “Features and benefits”:
–
13th bullet item re-written
–
added (new) 14th bullet item
SA676 v.2
SA676 v.1
20110412
19931215
Product data sheet
-
SA676 v.1
-
Product specification
ECN
853-1726 11659
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
19 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
19.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
SA676
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Product data sheet
Rev. 3 — 19 July 2012
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NXP Semiconductors
Low-voltage mixer FM IF system
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SA676
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 19 July 2012
21 of 22
SA676
NXP Semiconductors
Low-voltage mixer FM IF system
21. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Performance curves . . . . . . . . . . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . 10
Test information. . . . . . . . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
8
9
10
11
12
13
14
15
16
Soldering of SMD packages . . . . . . . . . . . . . . 16
Introduction to soldering . . . . . . . . . . . . . . . . . 16
Wave and reflow soldering . . . . . . . . . . . . . . . 16
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 17
16.1
16.2
16.3
16.4
17
18
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
19.1
19.2
19.3
19.4
20
21
Contact information. . . . . . . . . . . . . . . . . . . . . 21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 July 2012
Document identifier: SA676
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