SL3S1204FUD/BG [NXP]
IC SPECIALTY MICROPROCESSOR CIRCUIT, Microprocessor IC:Other;
| 型号： | SL3S1204FUD/BG |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY MICROPROCESSOR CIRCUIT, Microprocessor IC:Other 外围集成电路 |
| 文件： | 总20页 (文件大小：272K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SL3S1204
UCODE 7
Rev. 3.0 — 22 May 2013
263630
Product short data sheet
COMPANY PUBLIC
1. General description
NXP’s UCODE 7 IC is the leading-edge EPC Gen2 RFID chip that offers best-in-class
performance and features for use in the most demanding RFID tagging applications.
Particularly well suited for inventory management application, like e.g Retail and Fashion,
with its leading edge RF performance for any given form factor, UCODE 7 enables long
read distance and fast inventory of dense RFID tag population. With its broadband design,
it offers the possibility to manufacture true global RFID label with best-in-class
performance over worldwide regulations.
The device also provides an automatic self pre-serialization feature for 96-bit EPC,
following the industry aligned Multi Vendor Chip-based serialization scheme, and a
Parallel encoding feature. For applications where the same 58-bit Stock Keeping Unit
(SKU) needs to be encoded on multiple tags, at the same time, a combination of both
features improves and simplifies the tag initialization process.
On top UCODE 7 offers a Tag Power Indicator for RFID tag initialization optimization and
a Product Status Flag for Electronic Article Surveillance (EAS) application.
2. Features and benefits
2.1 Key features
Read sensitivity 21 dBm
Write sensitivity 16 dBm
Parallel encoding mode: 100 items in 60ms
Encoding speed: 16 bits per millisecond
Innovative functionalities
Tag Power Indicator
Automatic self pre-serialization for 96-bit EPC
Integrated Product Status Flag (PSF)
Compatible with single-slit antenna
Up to 128-bit EPC
96-bit Unique Tag Identifier (TID) factory locked,
including 48-bit unique serial number
EPC Gen2 v2.0 ready
SL3S1204
NXP Semiconductors
UCODE 7
2.1.1 Memory
Up to 128-bit of EPC memory
Supports self pre-serialization for 96-bit EPC
96-bit Tag IDentifier (TID) factory locked
48-bit unique serial number factory-encoded into TID
No User Memory
32-bit kill password to permanently disable the tag
32-bit access password
Wide operating temperature range: 40 C up to +85 C
Minimum 100.000 write cycle endurance
2.2 Key benefits
2.2.1 End user benefit
Long READ and WRITE ranges due to leading edge chip sensitivity
Very fast bulk encoding
Product identification through unalterable extended TID range, including a 48-bit serial
number
Reliable operation in dense reader and noisy environments through high interference
rejection
2.2.2 Antenna design benefits
High sensitivity enables smaller and cost efficient antenna designs for the same retail
category
Tag Power Indicator features enables very high density of inlay on rolls without cross-
talk issues during writing/encoding
The different input capacitance for the single slit antenna solution provides an
additional possibility in tuning of the impedance for the antenna design
2.2.3 Label manufacturer benefit
Large RF pad-to-pad distance to ease antenna design
Symmetric RF inputs are less sensitive to process variation
Single slit antenna for a more mechanically stable antenna connection
Automatic self pre-serialization of the 96-bit EPC
Extremely fast encoding of the EPC content
SL3S1204
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UCODE 7
2.3 Supported features
All mandatory commands of EPC global specification V.1.2.0 are implemented
including:
(Perma)LOCK
Kill Command
The following optional commands are implemented in conformance with the EPC
specification:
Access
BlockWrite (2 words, 32-bit)
Product Status Flag bit: enables the UHF RFID tag to be used as EAS
(Electronic Article Surveillance) tag without the need for a back-end data base.
Tag Power Indicator: enables the reader to select only ICs/tags that have enough
power to be written to.
Parallel encoding: allows for the ability to bring (multiple) tag(s) quickly to the OPEN
state and hence allowing single tags to be identified simply, without timing restrictions,
or multiple tags to be e.g. written to at the same time, considerably reducing the
encoding process
All supported features of UCODE 7 can be activated using standard EPCglobal READ /
WRITE / ACCESS / SELECT commands. No custom commands are needed to take
advantage of all the features in case of unlocked EPC memory. The parallel encoding
feature may however require a firmware upgrade of the reader to use its full potential.
3. Applications
3.1 Markets
Retail/Fashion (apparel, footwear, jewelry, cosmetics)
Fast Moving Consumer Goods
3.2 Applications
Retail Inventory management
Supply chain management
Loss prevention
Asset management
Outside the applications mentioned above, please contact NXP Semiconductors for
support.
SL3S1204
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UCODE 7
4. Quick reference data
Table 1.
Symbol
fi
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
input frequency
840
-
960
MHz
[1][3][8]
[2]
Pi(min)
Pi(min)
t 16bit
minimum input power
minimum input power
Encoding speed
READ sensitivity
WRITE sensitivity
16-bit
-
-
-
-
-
-
-
-
-
-
21
-
-
-
-
-
-
-
-
dBm
dBm
ms
ms
pF
16
[5]
1
[5]
32-bit (block write)
parallel
1.8
[3][4]
[3][4]
[3][4]
[3][4]
[6]
Ci
Z
Chip input capacitance
Chip impedance
0.63
866 MHz
14.5-j293
12.5-j277
12.5-j267
18-j245
13.5-j195
915 MHz
953 MHz
Z
Z
Typical assembled impedance [9] 915MHz
[6][7]
Typical assembled impedance [9] 915MHz
in case of single-slit antenna
assembly
-
Tag Power Indicator mode
Pi(min) minimum input power level to be
able to select the tag
[2]
-
15
-
dBm
[1] Power to process a QUERY command
[2] Tag sensitivity on a 2dBi gain antenna
[3] Measured with a 50 source impedance directly on the chip
[4] At minimum operating power
[5] When the memory content is “0000...”.
[6] The antenna shall be matched to this impedance
[7] Depending on the specific assembly process, sensitivity losses of few tenths of dB might occur
[8] Results in approximately -21,5dBm tag sensitivity with a 2dBi gain antenna
[9] Assuming a 80fF additional input capacitance, 250fF in case of single slit antenna
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
IC type
Description
Version
SL3S1204FUD/BG
Wafer
UCODE 7 bumped die on sawn 8” 120 m wafer 7 m Polyimide not applicable
spacer
SL3S1204
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UCODE 7
6. Block diagram
The SL3S1204 IC consists of three major blocks:
- Analog Interface
- Digital Control
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader which is then processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
ANALOG
RF INTERFACE
DIGITAL CONTROL
ANTICOLLISION
EEPROM
VREG
VDD
RF1
READWRITE
CONTROL
data
in
RECT
RF2
DEMOD
MOD
MEMORY
antenna
ACCESS CONTROL
data
out
R/W
EEPROM INTERFACE
CONTROL
RF INTERFACE
CONTROL
SEQUENCER
CHARGE PUMP
aaa-005856
Fig 1. Block diagram of UCODE 7 IC
SL3S1204
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UCODE 7
7. Pinning information
TP1
RF2
SL3S1204 trademark
TP2
RF1
aaa-005611
Fig 2. Pinning bare die
7.1 Pin description
Table 3.
Symbol
TP1
Pin description bare die
Description
test pad 1
RF1
antenna connector 1
test pad 2
TP2
RF2
antenna connector 2
SL3S1204
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8. Wafer layout
8.1 Wafer layout
(1)
TP1
RF2
(5)
Y
(4)
(6)
X
(7)
TP2
RF1
(8)
(2)
(3)
not to scale!
aaa-005606
(1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m)
(2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m)
(3) Chip step, x-length: 460 m
(4) Chip step, y-length: 505 m
(5) Bump to bump distance X (TP1 - RF2): 358 m
(6) Bump to bump distance Y (RF1 - RF2): 403 m
(7) Distance bump to metal sealring X: 40,3m (outer edge - top metal)
(8) Distance bump to metal sealring Y: 40,3 m
Bump size X x Y: 60 m x 60 m
Remark: TP1 and TP2 are electrically disconnected after dicing
Fig 3. UCODE 7 wafer layout
SL3S1204
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9. Mechanical specification
The UCODE 7 wafers are available in 120 m thickness. The 120 m thick wafer is
enhanced with 7m Polyimide spacer resulting in less coupling between the antenna and
the active circuit, leaving more room for process control (like pressure).
9.1 Wafer specification
See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”.
9.1.1 Wafer
Table 4. Specifications
Wafer
Designation
each wafer is scribed with batch number and
wafer number
Diameter
200 mm (8”) unsawn - 205 mm typical sawn
on foil
Thickness
SL3S1204FUD
Number of pads
Pad location
120 m 15 m
4
non diagonal / placed in chip corners
Distance pad to pad RF1-RF2
Distance pad to pad TP1-RF2
Process
403.0 m
358.0 m
CMOS 0.14 m
25 wafers
126.524
Batch size
Potential good dies per wafer
Wafer backside
Material
Si
Treatment
ground and stress release
Ra max. 0.5 m, Rt max. 5 m
Roughness
Chip dimensions
Die size excluding scribe
Scribe line width:
0.490 mm 0.445 mm = 0.218 mm2
x-dimension = 15 m
y-dimension = 15 m
Passivation on front
Type
Sandwich structure
Material
PE-Nitride (on top)
Thickness
1.75 m total thickness of passivation
7 m 1 m
Polyimide spacer
Au bump
Bump material
Bump hardness
Bump shear strength
> 99.9 % pure Au
35 – 80 HV 0.005
> 70 MPa
SL3S1204
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UCODE 7
Table 4. Specifications
Bump height
SL3S1204FUD/BG
Bump height uniformity
within a die
25 m[1]
2 m
3 m
4 m
1.5 m
– within a wafer
– wafer to wafer
Bump flatness
Bump size
60 60 m
60 60 m
5 m
– RF1, RF2
– TP1, TP2
Bump size variation
[1] Because of the 7 m spacer, the bump will measure 18 m relative height protruding the spacer.
9.1.2 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
9.1.3 Map file distribution
See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
SL3S1204
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UCODE 7
10. Functional description
10.1 Air interface standards
The UCODE 7 fully supports all parts of the "Specification for RFID Air Interface
EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID,
Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0".
10.2 Power transfer
The interrogator provides an RF field that powers the tag, equipped with a UCODE 7. The
antenna transforms the impedance of free space to the chip input impedance in order to
get the maximum possible power for the UCODE 7 on the tag.
The RF field, which is oscillating on the operating frequency provided by the interrogator,
is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.
The antenna that is attached to the chip may use a DC connection between the two
antenna pads. Therefore the UCODE 7 also enables loop antenna design.
10.3 Data transfer
10.3.1 Interrogator to tag Link
An interrogator transmits information to the UCODE 7 by modulating an UHF RF signal.
The UCODE 7 receives both information and operating energy from this RF signal. Tags
are passive, meaning that they receive all of their operating energy from the interrogator's
RF waveform.
An interrogator is using a fixed modulation and data rate for the duration of at least one
inventory round. It communicates to the UCODE 7 by modulating an RF carrier.
For further details refer to Ref. 1. Interrogator-to-tag (R=>T) communications.
10.3.2 Tag to interrogator Link
Upon transmitting a valid command an interrogator receives information from a UCODE 7
tag by transmitting an unmodulated RF carrier and listening for a backscattered reply. The
UCODE 7 backscatters by switching the reflection coefficient of its antenna between two
states in accordance with the data being sent. For further details refer to Ref. 1, chapter
6.3.1.3.
The UCODE 7 communicates information by backscatter-modulating the amplitude and/or
phase of the RF carrier. Interrogators shall be capable of demodulating either
demodulation type.
The encoding format, selected in response to interrogator commands, is either FM0
baseband or Miller-modulated subcarrier.
SL3S1204
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UCODE 7
10.4 Supported commands
The UCODE 7 supports all mandatory EPCglobal V1.2.0 commands including
• Kill command
• (perma) LOCK command
In addition the G2iL supports the following optional commands:
• ACCESS
• Block Write (32 bit)
10.5 UCODE 7 memory
The UCODE 7 memory is implemented according EPCglobal Class1Gen2 and organized
in three banks:
Table 5.
Name
UCODE 7 memory sections
Size
Bank
00b
01b
01b
10b
Reserved memory (32 bit ACCESS and 32 bit KILL password)
EPC (excluding 16 bit CRC-16 and 16 bit PC)
UCODE 7 Configuration Word
64 bit
128 bit
16 bit
96 bit
TID (including permalocked unique 48 bit serial number)
The logical address of all memory banks begin at zero (00h).
In addition to the three memory banks one configuration word to handle the UCODE 7
specific features is available at EPC bank 01 address bit-200h. The configuration word is
described in detail in 9.6.
The TID complies to the extended tag Identification scheme according GS1 EPC Tag Data
Standard 1.6.
The EPC content will follow a self pre-serialization scheme following the Multi Vendor
Chip-based serialization scheme (Ref. 23).
SL3S1204
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11. Limiting values
Table 6.
Limiting values[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to RFN
Symbol
Parameter
Conditions
Min
Max
Unit
Bare die limitations
Tstg
storage temperature
55
40
-
+125
+85
2
C
C
kV
Tamb
VESD
ambient temperature
[3]
electrostatic discharge
voltage
Human body model
Pad limitations
Pi input power
maximum power
-
100
mW
dissipation, RFP pad
[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any conditions other
than those described in the Operating Conditions and Electrical Characteristics section of this specification
is not implied.
[2] This product includes circuitry specifically designed for the protection of its internal devices from the
damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be
taken to avoid applying greater than the rated maxima.
[3] For ESD measurement, the die chip has been mounted into a CDIP20 package.
SL3S1204
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UCODE 7
12. Characteristics
12.1 UCODE 7 bare die characteristics
Table 7.
Symbol
fi
UCODE 7 RF interface characteristics (RF1, RF2)
Parameter
Conditions
Min
Typ
Max
Unit
input frequency
840
-
960
MHz
[1][3][8]
[2]
Pi(min)
Pi(min)
t 16bit
minimum input power
minimum input power
Encoding speed
READ sensitivity
WRITE sensitivity
16-bit
-
-
-
-
-
-
-
-
-
-
21
16
1
-
-
-
-
-
dBm
dBm
ms
ms
pF
[5]
[5]
32-bit (block write)
parallel
1.8
0.63
[3][4]
[3][4]
[3][4]
[3][4]
[6]
Ci
Z
Chip input capacitance
Chip impedance
866 MHz
14.5-j293 -
12.5-j277 -
12.5-j267 -
18-j245
915 MHz
953 MHz
Z
Z
Typical assembled impedance [9]
Typical assembled impedance [9] in 915MHz
case of single-slit antenna assembly
915MHz
[6][7]
13.5-j195 -
Tag Power Indicator mode
Pi(min) minimum input power level to be
able to select the tag
[2]
-
15
-
dBm
[1] Power to process a QUERY command
[2] Tag sensitivity on a 2dBi gain antenna
[3] Measured with a 50 source impedance directly on the chip
[4] At minimum operating power
[5] When the memory content is “0000...”.
[6] The antenna shall be matched to this impedance
[7] Depending on the specific assembly process, sensitivity losses of few tenths of dB might occur
[8] Results in approximately -21,5dBm tag sensitivity with a 2dBi gain antenna
[9] Assuming a 80fF additional input capacitance, 250fF in case of single slit antenna
SL3S1204
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13. Packing information
13.1 Wafer
See Ref. 21 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
14. Abbreviations
Table 8.
Abbreviations
Description
Acronym
CRC
Cyclic Redundancy Check
CW
Continuous Wave
DSB-ASK
DC
Double Side Band-Amplitude Shift Keying
Direct Current
EAS
Electronic Article Surveillance
Electrically Erasable Programmable Read Only Memory
EEPROM
EPC
Electronic Product Code (containing Header, Domain Manager, Object Class
and Serial Number)
FM0
G2
Bi phase space modulation
Generation 2
IC
Integrated Circuit
PIE
PSF
RF
Pulse Interval Encoding
Product Status Flag
Radio Frequency
UHF
SECS
TID
Ultra High Frequency
Semi Equipment Communication Standard
Tag IDentifier
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15. References
[1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF
RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0
(December 17, 2005)
[2] EPCglobal: EPC Tag Data Standards
[3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft)
[4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference
(draft)
[5] European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 1 – Technical characteristics and test methods
[6] European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive
[7] [CEPT1]: CEPT REC 70-03 Annex 1
[8] [ETSI1]: ETSI EN 330 220-1, 2
[9] RTCal is the Interrogator-to-Tag calibration symbol length defined in the EPCglobal
specification
[10] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility
And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment
operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:
Technical characteristics and test methods.
[11] [FCC1]: FCC 47 Part 15 Section 247
[12] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International
Standards
[13] ISO/IEC 3309: Information technology – Telecommunications and information
exchange between systems – High-level data link control (HDLC) procedures –
Frame structure
[14] ISO/IEC 15961: Information technology, Automatic identification and data capture –
Radio frequency identification (RFID) for item management – Data protocol:
application interface
[15] ISO/IEC 15962: Information technology, Automatic identification and data capture
techniques – Radio frequency identification (RFID) for item management – Data
protocol: data encoding rules and logical memory functions
[16] ISO/IEC 15963: Information technology — Radio frequency identification for item
management — Unique identification for RF tags
[17] ISO/IEC 18000-1: Information technology — Radio frequency identification for item
management — Part 1: Reference architecture and definition of parameters to be
standardized
[18] ISO/IEC 18000-6: Information technology automatic identification and data capture
techniques — Radio frequency identification for item management air interface —
Part 6: Parameters for air interface communications at 860–960 MHz
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[19] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary
– Part 3: radio-frequency identification (RFID)
[20] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:
Radio-frequency devices, U.S. Federal Communications Commission.
[21] Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**1
[22] Application note - AN11274 – FAQ on UCODE 7
[23] Release Note - Formulas for Multi-Vendor Chip-Based Serialization (MCS) and
FastEPC, BU-ID document number: 2498**
1. ** ... document version number
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16. Revision history
Table 9.
Revision history
Document ID
Release date
20130522
Data sheet status
Change notice Supersedes
SL3S1204_SDS v.1.0
SL3S1204_SDS v.3.0
Modifications
Product short data sheet
• Editorial changes
• Table 1 “Quick reference data”: updated
• Figure 3 “UCODE 7 wafer layout”: updated
• Table 7 “UCODE 7 RF interface characteristics (RF1, RF2)”: updated
SL3S1204_SDS v.1.0
20130422 Objective short data sheet
-
-
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17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
17.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
SL3S1204
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 22 May 2013
263630
18 of 20
SL3S1204
NXP Semiconductors
UCODE 7
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
17.4 Trademarks
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
UCODE — is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SL3S1204
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 22 May 2013
263630
19 of 20
SL3S1204
NXP Semiconductors
UCODE 7
19. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
17.4
18
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information . . . . . . . . . . . . . . . . . . . . 19
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2
2.1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2
Antenna design benefits . . . . . . . . . . . . . . . . . . 2
Label manufacturer benefit. . . . . . . . . . . . . . . . 2
Supported features. . . . . . . . . . . . . . . . . . . . . . 3
19
2.1.1
2.2
2.2.1
2.2.2
2.2.3
2.3
3
3.1
3.2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Markets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 4
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information. . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
6
7
7.1
8
8.1
9
9.1
9.1.1
9.1.2
9.1.3
Mechanical specification . . . . . . . . . . . . . . . . . 8
Wafer specification . . . . . . . . . . . . . . . . . . . . . . 8
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Fail die identification . . . . . . . . . . . . . . . . . . . . 9
Map file distribution. . . . . . . . . . . . . . . . . . . . . . 9
10
Functional description . . . . . . . . . . . . . . . . . . 10
Air interface standards . . . . . . . . . . . . . . . . . . 10
Power transfer . . . . . . . . . . . . . . . . . . . . . . . . 10
Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 10
Interrogator to tag Link . . . . . . . . . . . . . . . . . . 10
Tag to interrogator Link. . . . . . . . . . . . . . . . . . 10
Supported commands . . . . . . . . . . . . . . . . . . 11
UCODE 7 memory . . . . . . . . . . . . . . . . . . . . . 11
10.1
10.2
10.3
10.3.1
10.3.2
10.4
10.5
11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13
UCODE 7 bare die characteristics . . . . . . . . . 13
Packing information . . . . . . . . . . . . . . . . . . . . 14
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
12
12.1
13
13.1
14
15
16
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
17.1
17.2
17.3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 22 May 2013
263630
相关型号：
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