SL3S1214FTB01_技术文档

SL3S1214

UCODE 7m

Rev. 3.4 — 6 March 2019

307434

Product data sheet

COMPANY PUBLIC

1 General description

UCODE 7m is a derivative of the UCODE 7 and offers on top of the UCODE 7 features a

32-bit User Memory.

NXP’s UCODE 7m IC is the leading-edge EPC Gen2 RFID chip that offers best-in-class

performance and features for use in the most demanding RFID tagging applications.

Particularly well suited for inventory management application, like e.g Retail and Fashion,

with its leading edge RF performance for any given form factor, UCODE 7m enables

long read distance and fast inventory of dense RFID tag population. With its broadband

design, it offers the possibility to manufacture true global RFID label with best-in-class

performance over worldwide regulations.

The device also provides a pre-serialized 96-bit EPC, and a Parallel encoding feature.

For applications where the same 58-bit Stock Keeping Unit (SKU) needs to be encoded

on multiple tags, at the same time, a combination of both features improves and

simplifies the tag initialization process.

On top UCODE 7m offers a Tag Power Indicator for RFID tag initialization optimization

and a Product Status Flag for Electronic Article Surveillance (EAS) application.

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UCODE 7m

2 Features and benefits

2.1 Key features

• Read sensitivity -21 dBm

• Write sensitivity -16 dBm

• Parallel encoding mode: 100 items in 60ms

• Encoding speed: 16 bits per millisecond

• Innovative functionalities

– Tag Power Indicator

– Pre-serialization for 96-bit EPC

– Integrated Product Status Flag (PSF)

• Compatible with single-slit antenna

• Up to 128-bit EPC

• 96-bit Unique Tag Identifier (TID) factory locked,

including 48-bit unique serial number

• 32-bit User Memory

• EPC Gen2 v2.0 ready

2.1.1 Memory

• 32-bit User Memory

• Up to 128-bit of EPC memory

• Pre-serialization for 96-bit EPC

• 96-bit Tag IDentifier (TID) factory locked

• 48-bit unique serial number factory-encoded into TID

• 32-bit access password

• Wide operating temperature range: -40 °C up to +85 °C

• Minimum 100.000 write cycle endurance

2.2 Key benefits

2.2.1 End user benefit

• Long READ and WRITE ranges due to leading edge chip sensitivity

• Very fast bulk encoding

• Product identification through unalterable extended TID range, including a 48-bit serial

number

• Reliable operation in dense reader and noisy environments through high interference

rejection

2.2.2 Antenna design benefits

• High sensitivity enables smaller and cost efficient antenna designs for the same retail

Tags

TAG n

All UCODE 7 tags receive the Command

aaa-006844

Figure 7.ꢀIllustration of Parallel encoding for 16-bit Write command

Use cases and benefits

Parallel encoding feature of UCODE 7m can enable ultra fast bulk encoding.

Taking in addition advantage of the pre-serialization scheme of UCODE 7m, the same

SKU can be encoded in multiple tags as the EPC will be delivered pre-serialized already.

In the case of only one tag answering (like in printer encoding), this feature could be used

to save some overhead in commands to do direct EPC encoding after the handle reply.

Since this is a UCODE 7m specific feature the use of this features requires support on

the reader side.

10.6.5 Tag Power Indicator

Description

Upon a SELECT command on the "Tag Power Indicator", located in the config word

204h, an internal power check on the chip is performed to see if the power level is

sufficient to perform a WRITE command. The decision level is defined as nominal WRITE

sensitivity minus 1dB. In the case there is enough power, the SELECT command is

matching and non-matching if not enough power. The tag can then be singulated by the

standard inventory procedure.

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UCODE 7m

Use cases and benefits

This feature gives the possibility to select only the tag(s) that receive enough power to

be written during e.g. printer encoding in a dense environment of tags even though the

reader may read more than one tag (see Figure 8 for illustration). The power level still

needs to be adjusted to transmit enough writing power to one tag only to do one tag

singulation.

Power level for READ/WRITE

too low/too low

OK/too low

Only this tag will select itself

OK/OK

OK/too low

too low/too low

aaa-005662

Figure 8.ꢀSelection of tags with Tag Power Indicator feature

10.6.6 Product Status Flag (PSF)

Description

The PSF is a general purpose bit located in the Configuration word at address 20Fh with

a value that can be freely changed.

Use cases and benefits

The PSF bit can be used as an EAS (Electronic Article Surveillance) flag, quality checked

flag or similar.

In order to detect the tag with the PSF activated, a EPC SELECT command selecting

the PSF flag of the Configuration word can be used. In the following inventory round only

PSF enabled chips will reply their EPC number.

10.6.7 Single-slit antenna solution

Description

In UCODE 7m the test pads TP1 and TP2 are electrically disconnected meaning they are

not electrically active and can be safely short-circuited to the RF pads RF1 and RF2 (see

Figure 9).

Standard assembly

Single-slit assembly

Supporting pads

aaa-005857

Figure 9.ꢀStandard antenna design versus single-slit antenna

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Uses cases and benefits

Using single-slit antenna enables easier assembly and antenna design. Inlay

manufacturer will only have to take care about one slit of the antenna instead of two in

case all pads need to be disconnected from each other.

Additionally single-slit antenna assembly and the related increased input capacitance

(see Table 11) can be used advantageously over the standard antenna design as

additional room for optimization to different antenna design.

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UCODE 7m

11 Limiting values

Table 10.ꢀLimiting values^[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Voltages are referenced to RFN

Symbol

Parameter

Conditions

Min

Max

Unit

Bare die limitations

T_stg

storage temperature

-55

-40

-

+125

+85

± 2

°C

kV

T_amb

V_ESD

ambient temperature

[3][4]

electrostatic discharge

voltage

Human body model

Pad limitations

P_iinput power

maximum power

-

100

mW

dissipation, RFP pad

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at these or any conditions other than those described in the

Operating Conditions and Electrical Characteristics section of this specification is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of

excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater

than the rated maxima.

[3] ANSI/ESDA/JEDEC JS-001

[4] For ESD measurement, the die chip has been mounted into a CDIP20 package.

CAUTION

This device is sensitive to ElectroStatic Discharge (ESD). Observe

precautions for handling electrostatic sensitive devices.

Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5,

JESD625-A or equivalent standards.

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UCODE 7m

12 Characteristics

12.1 UCODE 7m bare die characteristics

Table 11.ꢀUCODE 7m RF interface characteristics (RF1, RF2)

Symbol

f_i

Parameter

Conditions

Min

Typ

Max

Unit

MHz

dBm

ms

pF

input frequency

840

-

960

[1][2][3]

[4]

P_i(min)

t 16bit

minimum input power

encoding speed

READ sensitivity

WRITE sensitivity

16-bit

-

-21

-

-16

[5]

1

[5]

32-bit (block write)

parallel

1.8

[2][6]

[8]

C_i

Z

chip input capacitance

chip impedance

0.63

866 MHz

14.5-j293

12.5-j277

12.5-j267

18-j245

13.5-j195

Ω

915 MHz

Ω

953 MHz

Ω

Z

typical assembled impedance ^[7]

typical assembled impedance ^[7]in

case of single-slit antenna assembly

915MHz

Ω

[8][9]

915MHz

Ω

Tag Power Indicator mode

P_i(min)minimum input power level to be

[4]

-

-15

-

dBm

able to select the tag

[1] Power to process a QUERY command

[2] Measured with a 50 Ω source impedance directly on the chip

[3] Results in approximately -21,5dBm tag sensitivity with a 2dBi gain antenna

[4] Tag sensitivity on a 2dBi gain antenna

[5] When the memory content is "0000...".

[6] At minimum operating power

[7] Assuming a 80fF additional input capacitance, 250fF in case of single slit antenna

[8] The antenna shall be matched to this impedance

[9] Depending on the specific assembly process, sensitivity losses of few tenths of dB might occur

Table 12.ꢀUCODE 7m memory characteristics

Symbol

Parameter

Conditions

Min

Typ

Max Unit

EEPROM characteristics

t_ret

retention time

T_amb≤ 55 °C

20

-

year

N_endu(W)

write endurance

100k

cycle

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UCODE 7m

12.2 UCODE 7m SOT886 characteristics

Table 13.ꢀUCODE 7m RF interface characteristics (RF1, RF1)

Symbol Parameter

P_i(min)minimum input power

Conditions

Min

Typ

Max Unit

[1][2]

[3]

READ

sensitivity

-

-21

-

dBm

Z

impedance

915 MHz

-

12.8 -j248

-

Ω

[1] Power to process a Query command.

[2] Measured with a 50 Ω source impedance.

[3] At minimum operating power.

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13 Package outline

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

SOT886

b

1

2

3

4x

(2)

L

1

e

6

5

4

e

1

6x

(2)

A

1

D

E

terminal 1

index area

0

1

2 mm

scale

Dimensions (mm are the original dimensions)

(1)

Unit

A

b

D

E

e

L

1

max 0.5 0.04 0.25 1.50 1.05

0.35 0.40

0.30 0.35

0.27 0.32

nom

min

0.20 1.45 1.00 0.6

0.17 1.40 0.95

mm

0.5

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

sot886_po

References

Outline

version

European

projection

Issue date

IEC

JEDEC

MO-252

JEITA

04-07-22

12-01-05

SOT886

Figure 10.ꢀPackage outline SOT886

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14 Packing information

14.1 Wafer

See [2]

14.2 SOT886

See: www.nxp.com/packages/SOT886.html

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15 Abbreviations

Table 14.ꢀAbbreviations

Acronym

CRC

Description

Cyclic Redundancy Check

Continuous Wave

CW

DSB-ASK

DC

Double Side Band-Amplitude Shift Keying

Direct Current

EAS

Electronic Article Surveillance

Electrically Erasable Programmable Read Only Memory

EEPROM

EPC

Electronic Product Code (containing Header, Domain Manager, Object Class

and Serial Number)

FM0

G2

Bi phase space modulation

Generation 2

IC

Integrated Circuit

PIE

PSF

RF

Pulse Interval Encoding

Product Status Flag

Radio Frequency

UHF

SECS

TID

Ultra High Frequency

Semi Equipment Communication Standard

Tag IDentifier

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16 References

[1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF

RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.2.0 (October

23, 2008)

[2] Data sheet - Delivery type description – General specification for 8" wafer on UV-

tape with electronic fail die marking, BU-ID document number: 1093**¹

[3] Application note - AN11274 – FAQ on UCODE 7

1

** ... document version number

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17 Revision history

Table 15.ꢀRevision history

Document ID

SL3S1214 v. 3.4

Modifications:

SL3S1214 v. 3.3

Modifications:

SL3S1214 v. 3.2

Modifications:

Release date

Data sheet status

Change notice Supersedes

20190306

Product data sheet

-

SL3S1214 v. 3.3

SL3S1214 v. 3.2

SL3S1214 v. 3.1

• Section 16: updated

20161212

Product data sheet

• Figure 5: corrected

20160727

Product data sheet

• Update Automatic Pre-serialization functionality

• Figure 5 -change of TID

SL3S1214 v. 3.1

Modifications:

20150727

Product data sheet

-

SL3S1214 v. 3.0

-

• SOT886 package added

20141023

SL3S1214 v. 3.0

Product data sheet

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18 Legal information

18.1 Data sheet status

Document status^[1][2]

Product status^[3]

Definition

Objective [short] data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary [short] data sheet

Product [short] data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

18.2 Definitions

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

no representation or warranty that such applications will be suitable

for the specified use without further testing or modification. Customers

are responsible for the design and operation of their applications and

products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications

and products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with

their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid a

default of the applications and the products or of the application or use by

customer’s third party customer(s). NXP does not accept any liability in this

respect.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product

is deemed to offer functions and qualities beyond those described in the

Product data sheet.

18.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not

give any representations or warranties, expressed or implied, as to the

accuracy or completeness of such information and shall have no liability

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

information source outside of NXP Semiconductors. In no event shall NXP

Semiconductors be liable for any indirect, incidental, punitive, special or

consequential damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the removal or replacement

of any products or rework charges) whether or not such damages are based

on tort (including negligence), warranty, breach of contract or any other

legal theory. Notwithstanding any damages that customer might incur for

any reason whatsoever, NXP Semiconductors’ aggregate and cumulative

liability towards customer for the products described herein shall be limited

in accordance with the Terms and conditions of commercial sale of NXP

Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

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No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

the grant, conveyance or implication of any license under any copyrights,

patents or other industrial or intellectual property rights.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor

tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications. In

the event that customer uses the product for design-in and use in automotive

applications to automotive specifications and standards, customer (a) shall

use the product without NXP Semiconductors’ warranty of the product for

such automotive applications, use and specifications, and (b) whenever

customer uses the product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at customer’s own

risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,

damages or failed product claims resulting from customer design and use

of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Bare die — All die are tested on compliance with their related technical

specifications as stated in this data sheet up to the point of wafer sawing

and are handled in accordance with the NXP Semiconductors storage and

transportation conditions. If there are data sheet limits not guaranteed,

these will be separately indicated in the data sheet. There are no post-

packing tests performed on individual die or wafers. NXP Semiconductors

has no control of third party procedures in the sawing, handling, packing or

assembly of the die. Accordingly, NXP Semiconductors assumes no liability

for device functionality or performance of the die or systems after third party

sawing, handling, packing or assembly of the die. It is the responsibility of

the customer to test and qualify their application in which the die is used.

All die sales are conditioned upon and subject to the customer entering into

a written die sale agreement with NXP Semiconductors through its legal

department.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

18.4 Trademarks

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

UCODE — is a trademark of NXP B.V.

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Tables

Tab. 1.

Tab. 2.

Tab. 3.

Tab. 4.

Tab. 5.

Tab. 6.

Tab. 7.

Tab. 8.

Tab. 9.

Ordering information ..........................................5

Tab. 10. Limiting values ................................................ 22

Tab. 11. UCODE 7m RF interface characteristics

(RF1, RF2) ...................................................... 23

Tab. 12. UCODE 7m memory characteristics ............... 23

Tab. 13. UCODE 7m RF interface characteristics

(RF1, RF1) ...................................................... 24

Marking codes ...................................................6

Pin description bare die .................................... 8

Pin description SOT886 .................................... 8

Specifications .................................................. 10

UCODE 7m memory sections .........................13

UCODE 7m overall memory map ....................13

Configuration word UCODE 7m ...................... 16

Configuration word UCODE 7m ... continued ...16

Tab. 14. Abbreviations ...................................................27

Tab. 15. Revision history ...............................................29

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UCODE 7m

Figures

Fig. 1.

Fig. 2.

Fig. 3.

Fig. 4.

Fig. 5.

Fig. 6.

Block diagram of UCODE 7m IC .......................7

Fig. 7.

Fig. 8.

Fig. 9.

Illustration of Parallel encoding for 16-bit

Write command ............................................... 19

Selection of tags with Tag Power Indicator

feature ............................................................. 20

Standard antenna design versus single-slit

antenna ............................................................20

Pinning bare die ................................................8

Pin configuration for SOT886 ............................8

UCODE 7m wafer layout ...................................9

UCODE 7m TID memory structure ..................15

Example of 16-bit Write command with

standard EPC Gen 2 commands .................... 18

Fig. 10. Package outline SOT886 ................................ 25

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UCODE 7m

Contents

1

General description ............................................ 1

18

Legal information ..............................................30

2

2.1

Features and benefits .........................................2

Key features ...................................................... 2

Memory ..............................................................2

Key benefits .......................................................2

End user benefit ................................................ 2

Antenna design benefits ....................................2

Label manufacturer benefit ................................3

Supported features ............................................ 3

Applications .........................................................4

Markets .............................................................. 4

Applications ........................................................4

Ordering information .......................................... 5

Marking .................................................................6

Block diagram ..................................................... 7

Pinning information ............................................ 8

Pin description ...................................................8

Wafer layout ........................................................ 9

Wafer layout ...................................................... 9

Mechanical specification ..................................10

Wafer specification .......................................... 10

Wafer ............................................................... 10

Fail die identification ........................................11

Map file distribution ......................................... 11

Functional description ......................................12

Air interface standards .....................................12

Power transfer ................................................. 12

Data transfer ....................................................12

Interrogator to tag Link .................................... 12

Tag to interrogator Link ................................... 12

Supported commands ......................................12

UCODE 7m memory ........................................13

UCODE 7m overall memory map .................... 13

UCODE 7m TID memory details ..................... 15

Supported features .......................................... 16

UCODE 7m features control mechanism .........16

Backscatter strength reduction ........................ 17

Pre-serialization of the 96-bit EPC ...................17

Parallel encoding ............................................. 17

Tag Power Indicator ........................................ 19

Product Status Flag (PSF) ...............................20

Single-slit antenna solution ..............................20

Limiting values ..................................................22

Characteristics .................................................. 23

UCODE 7m bare die characteristics ................23

UCODE 7m SOT886 characteristics ................24

Package outline .................................................25

Packing information ..........................................26

Wafer ............................................................... 26

SOT886 ............................................................26

Abbreviations .................................................... 27

References .........................................................28

Revision history ................................................ 29

2.1.1

2.2

2.2.1

2.2.2

2.2.3

2.3

3

3.1

3.2

4

5

6

7

7.1

8

8.1

9

9.1

9.1.1

9.1.2

9.1.3

10

10.1

10.2

10.3

10.3.1

10.3.2

10.4

10.5

10.5.1

10.5.2

10.6

10.6.1

10.6.2

10.6.3

10.6.4

10.6.5

10.6.6

10.6.7

11

12

12.1

12.2

13

14

14.1

14.2

15

16

17

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 March 2019

Document identifier: SL3S1214

Document number: 307434


型号：	SL3S1214FTB01
厂家：	NXP
描述：	UCODE 7m
文件：	总34页 (文件大小：308K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SL3S1214FTB01 [NXP]

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