SOT263 [NXP]
Package outline; 包装外形
| 型号： | SOT263 |
| 厂家： | 
NXP |
| 描述： | Package outline |
| 文件： | 总1页 (文件大小：14K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PDF: 1999 Apr 16
Philips Semiconductors
Package outline
Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220
SOT263
E
P
A
A
1
q
D
1
mounting
base
D
L
1
L
3
Q
L
m
2
L
1
5
e
c
b
w
M
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
b
(3)
(1)
(2)
L
e
A
D
E
L
D
L
1
A
c
UNIT
mm
3
m
P
q
Q
w
L
1
1
2
max.
4.5
4.1
1.39
1.27
0.9
0.7
0.7
0.4
15.8
15.2
6.4
5.9
10.3
9.7
15.0
13.5
2.4
1.6
0.8
0.6
3.8
3.6
3.0
2.7
2.6
2.2
0.5
3.5
0.4
1.7
Notes
1. Terminal dimensions are uncontrolled in this zone.
2. Positional accuracy of the terminals is controlled in this zone.
3. Terminals in this zone are not tinned.
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
97-06-11
SOT263
5-lead TO-220
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