SOT347 [NXP]
SOT347 Package outline; SOT347封装外形型号: | SOT347 |
厂家: | NXP |
描述: | SOT347 Package outline |
文件: | 总1页 (文件大小:15K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PDF: 1999 Apr 16
Philips Semiconductors
Package outline
Ceramic single-ended flat package; heatsink mounted; 2 mounting holes;
12 in-line tin (Sn) plated leads
SOT347
D
y
U
q
A
P
F
S
U
1
G
E
L
1
12
c
e
b
v
A
w
Z
M
Q
A
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
L
min.
Z
max.
A
UNIT
e
P
b
c
D
E
F
G
Q
q
S
U
U
v
w
y
1
6.0 0.51
5.6 0.38
36.2 18.2
35.8 17.8
25.5
24.5
3.5 34.4 22.2
3.4 34.0 21.8
4.15
3.85
mm
0.25
2.54 2.0
6
1.8
19
0.3 0.25 0.1
4.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
97-06-28
SOT347
相关型号:
©2020 ICPDF网 联系我们和版权申明