SSL21101T/1,518 [NXP]
Accurate non-dimmable LED driver IC SOIC 14-Pin;型号: | SSL21101T/1,518 |
厂家: | NXP |
描述: | Accurate non-dimmable LED driver IC SOIC 14-Pin 光电二极管 |
文件: | 总22页 (文件大小:565K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SSL21101T
GreenChip driver for LED lighting
Rev. 3 — 7 June 2012
Product data sheet
1. General description
The SSL21101T is a Switch Mode Power Supply (SMPS) driver IC. It is designed to drive
LED devices typically in flyback configurations. The device includes a high-voltage power
switch and a circuit enabling start-up directly from the rectified mains voltage. It has
accurate control of the output current.
2. Features and benefits
Small Printed-Circuit Board (PCB) footprint and compact solution with a small form
factor
Ease of integration
Low component count (complete application with about 25 components)
AC/DC offline non-dimmable LED driver from 100 V (AC) to 230 V (AC)
Primary side sensing (no optocoupler required)
True current source behavior:
LED current independent of mains voltage, LED voltage, temperature and coil
variation
High LED current accuracy (3 %)
Efficiency up to 90 % depending on the application
Smart Digital Control (SDC) to deal with all kind of applications:
High-Power Factor (PF; > 0.95) and low Total Harmonic Distortion Mode (THD
down to 20 %)
Small form factor (low LED current mode ripple with small electrolytic capacitors) -
compatible with exception clause IEC61000-3-2
Internal protections:
Short-winding protection
Internal OverTemperature Protection (OTP)
LED short protection
LED open protection
UnderVoltage LockOut (UVLO)
External temperature protection with built-in Negative Temperature Coefficient (NTC)
Internal supply voltage generation enabling start-up from the rectified mains voltage
Compatible with wall switches with built-in indication light during standby
SO14 package
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
3. Applications
The SSL21101T is suitable for different power requirements:
SSL, retrofit lamps (for example: small-size light bulbs, LED spots, up to 10 W or
12 W
LED modules, mains AC/DC converter (for example: down-lights, up to 15 W)
LED strings (for example: retail display; up to 15 W)
4. Quick reference data
Table 1.
Symbol
VCC
Quick reference data
Parameter
Conditions
Min
13
-
Typ
22
Max
25.5
-
Unit
V
supply voltage
functional
RDSon
drain-source on-state resistance Tj = 25 C
Tj = 125 C
6.8
9.5
51.2
-
-
[1]
[1]
[1]
[1]
fsw(max)
maximum switching frequency
DCM mode;
main = 50 Hz;
mode = 50 kHz
49.7
52.7
kHz
DCM mode;
main = 60 Hz;
mode = 50 kHz
59.7
99.4
119.4
61.4
63.2
kHz
kHz
kHz
DCM mode;
modemain = 50 Hz;
mode = 100 kHz
102.4
122.9
105.4
126.4
DCM mode;
main = 60 Hz;
mode = 100 kHz
IM(DRAIN)
VDRAIN
peak current on pin DRAIN
voltage on pin DRAIN
0
-
-
1.2
A
V
0.4
+700
[1] For a given VI(ILEDREF) and VNTC > 1.25 V. See Table 5.
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
SSL21101T/1
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
2 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
6. Block diagram
V
V
CC
DD(INTREGD)
LDO
JFET
DRAIN
100 Hz/
120 Hz
DVDT
DIGITAL
PLL
RMAIN
SSL21101T
t
off
f
sw(max)
f
sw(main)
FS
CONTROL
MODE
NTC
DIGITAL
CONTROL
DRIVER
ILEDREF
SOURCE
aaa-001383
GND
Fig 1. Block diagram
7. Pinning information
7.1 Pinning
1
2
3
4
5
6
7
14
13
12
11
10
9
V
DRAIN
GND
CC
RMAIN
GND
GND
V
SSL21101T
GND
DD(INTREGD)
MODE
SOURCE
DNC
NTC
8
ILEDREF
GND
aaa-001384
Fig 2. Pin configuration
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
3 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
7.2 Pin description
Table 3.
Symbol
VCC
Pin description
Pin
1
Description
supply voltage
RMAIN
GND
2
current source proportionally equivalent of Vmain
3
ground
VDD(INTREGD)
MODE
NTC
4
internal regulated supply
5
power factor/THD and maximum switching frequency control input
6
LED temperature protection input
LED current control input
ground
ILEDREF
GND
7
8
DNC
9
do not connect
SOURCE
GND
10
11
12
13
14
source of internal power switch
ground
GND
ground
GND
ground
DRAIN
drain of internal power switch
8. Functional description
The SSL21101T is an integrated circuit intended for retrofit small form factor SSL lamps. It
provides a controller with an internal high-voltage switch to drive LEDs. It operates directly
from the rectified mains.
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
4 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
V
M
V
DRAIN
V + NV
i
out
V
i
δ1t
δ2t
sw
δ3t
sw
sw
primary
stroke
switching
time
secondary
stroke
switching
time
free running
t
sw
aaa-001586
1 + 2 +3 = 1
VDRAIN: voltage on pin DRAIN
1tsw: primary stroke switching time
2tsw: secondary stroke switching time
3tsw: free running time
tsw: switching time
VM: peak voltage
Vi: input voltage
N: transformer turn ratio
Vout: output voltage
Fig 3. Timing
8.1 True current source behavior
The LED current (ILED) of a flyback converter can be calculated with Equation 1:
2tsw
-------------
tsw
1
2
--
ILED
=
N IM
(1)
Where:
• N is the turn ratio of the transformer
• IM is the peak current
• 2tsw is the secondary stroke switching time
• tsw is the switching period
The relationship between the LED current and pin ILEDREF can be calculated with
Equation 2:
0.45 N VIILEDREF
DDINTREGD RSOURCE
ILED
=
(2)
----------------------------------------------------------------
V
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
Where:
• VI(ILEDREF) is the voltage defined at the input of pin ILEDREF
• VDD(INTREGD) is the internal regulated voltage
• RSOURCE is the resistor connected to pin SOURCE of the power MOS transistor.
The true current source behavior and the LED current accuracy are achieved using an
internal digital control. The internal digital control compares the ILEDREF pin reference
with the measurement of the average LED current over a half-main cycle. The primary
peak current (IM) is adjusted at each half-main cycle to achieve the expected LED current.
The expected primary peak current value on the application can be calculated with
Equation 3:
VthdetSOURCE
IM
=
(3)
------------------------------------
RSOURCE
Where:
• Vth(det)SOURCE is the detection threshold voltage on pin SOURCE
• RSOURCE is the resistor connected to pin SOURCE of the power MOS transistor
8.2 Leading-Edge Blanking (LEB)
The controller automatically adjusts LEB to avoid wrong detection of the primary peak
current.
8.3 dV/dt detection
A dV/dt detector block is used on pin DRAIN to detect the end of demagnetization and
possible valleys accurately. A valley switching concept is used for efficiency purposes.
8.4 Secondary stroke switching time (2tsw)
A blanking time (tblank) is applied at the beginning of 2tsw before observing the
demagnetization.
2tsw must have a value that allows the application to run in DCM mode.
For example, for a 100 kHz switching frequency the application design must provide a
typical secondary stroke switching time (2tsw) ranging from 4 s to 6 s.
8.5 Mains sensing
Pin RMAIN senses the mains voltage (Vmain in Equation 4) in real time and transforms it to
mains current (Imain in Equation 4):
Vmain
2
Imain
=
(4)
--------------------------
RRMAIN
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
Table 4.
Mains resistance/mains current dependency
Mains voltage
Mains resistance
1 M
Mains current
300 A
220 V (AC)/230 V (AC)
100 V (AC)/120 V (AC)
470 k
300 A
8.6 Modulation type versus MODE pin input
Pin MODE enables the control of both the THD/LED ripple and the switching frequency
operation mode. This input has a range of 0 V to VDD(INTREGD). Depending on the mains
frequency (50 Hz or 60 Hz), the following modes can be selected to ensure a flexible
application.
• Low THD mode: for example, THD 20 %; Ci = 200 nF for an 8 W application
• LR mode: Ci = 2.2 F for an 8 W application
Selecting a maximum switching frequency (50 kHz/60 kHz or 100 kHz/120 kHz) is also
possible.
Table 5.
MODE description
MODE voltage range
Behavior
Maximum switching
frequency
VDD(INTREGD) VMODE > 5 VDD(INTREGD / 6
5 VDD(INTREGD) / 6 > VMODE > 4 VDD(INTREGD) / 6
4 VDD(INTREGD) / 6 > VMODE > 2 VDD(INTREGD) / 6
2 VDD(INTREGD) / 6 > VMODE > 1 VDD(INTREGD) / 6
1 VDD(INTREGD) / 6 > VMODE 0
low THD
100 kHz/120 kHz
50 kHz/60 kHz
not applicable
low THD
not functional
low ripple
low ripple
50 kHz/60 kHz
100 kHz/120 kHz
The SSL21101T IC can reach a high-power factor in combination with a low THD without
an external PFC. It can also reduce the LED current ripple when the low ripple mode is
selected. Controlling the switching frequency value over a main cycle gives the input
current waveform.
The modulation controller takes into account the information of the Boundary Conduction
Mode (BCM) detection. The chip has optimized performances in Discontinuous
Conduction Mode (DCM). The IC prevents that the application enters Continuous
Conduction Mode (CCM) and forces it to enter Boundary Conduction Mode (BCM).
Remark: Select specific values for external components, such as transformers and
RSOURCE to avoid forced BCM, otherwise THD and the LED current ripple performances
are directly impacted.
8.7 Supply concept: VCC and UnderVoltage LockOut (UVLO)
An integrated Junction gate Field-Effect Transistor (JFET), connected to the drain voltage,
provides the start-up current.
The IC starts switching when the voltage on pin VCC exceeds the VCC(startup) level. After
start-up, an external supply is required, which an auxiliary winding connection can
provide. When the voltage on pin VCC drops below the VCC(UVLO) level, the IC stops
switching and is reset.
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
The IC is compatible with a wall switch with built-in light that is activated when wall switch
is in the off position.
8.8 Peak current detection
The cycle-by-cycle peak drain current limit circuit uses the external source resistor
RSOURCE to measure the primary peak current. The circuit is activated after the leading
edge blanking time. The protection circuit limits the source voltage over resistor RSOURCE
to Vth(det)SOURCE, thus limiting the primary peak current.
8.9 Overheating protection of the LEDs
Input pin NTC ensures the protection of the LEDs against overheating. The target is:
Table 6.
NTC description
Temperature
LED current
VNTC > Vdet(H)(NTC)
LED current is 100 % of the expected LED
current
Vdet(H)(NTC) > VNTC > Vdet(L)(NTC)
Vdet(L)(NTC) > VNTC
Linear reduction of LED current: 25 %
Standby mode (LED current = 0)
Remark: After Standby mode, LED current only flows again when VNTC exceeds
Vdet(H)(NTC)
.
There are two detection levels on pin NTC:
• level 1 = Vdet(H)(NTC)
• level 2 = Vdet(L)(NTC)
These detection levels can be translated to temperature levels using an NTC resistor for
which the levels have been optimized. Figure 4 shows an application using a 100 k NTC
resistor and equivalent temperature detection levels.
l
/I
l
/I
LED LEDexp
LED LEDexp
1
1
l
/I
l
/I
LEDmin LEDexp
LEDmin LEDexp
V
det(L)(NTC)
80
125
V
NTC
(V)
T (˚C)
V
det(H)(NTC)
001aao155
Fig 4. Overheating protection
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
8 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
8.10 Short-winding protection
The short-winding protection circuit is activated after the leading edge blanking time. If the
source voltage exceeds the short-winding protection threshold voltage (Vth(swp)SOURCE),
the IC stops switching. Only a power-on reset restarts normal operation (switching off the
mains voltage).
8.11 Output LED short circuit protection
When during one rectified mains waveform the following conditions are true, the output
short detection is activated and the IC enters Shutdown mode.
• 2tsw > tprot(sc)LED
• 1tsw < ton(high)
8.12 Output LED open circuit protection
If an open circuit occurs on the LEDs, the output voltage increases at each cycle of the
AC/DC converter. Energy is no longer transferred to the LEDs. The energy accumulated
at the primary side is transferred to the supply of the IC via the auxiliary winding. The IC
enters Shutdown mode when VCC reaches the Vprot(VCC) value. Only a power-on reset
restarts normal operation (switching off the mains voltage).
8.13 Limitations
The application must stay in DCM mode for normal functionality. During normal switching,
the primary stroke switching time must stay under ton(high) to keep an accurate LED
current.
When the application is working outside the defined main voltage range, meaning below
the minimum mains voltage, the application can work in BCM mode. Figure 5 shows some
of the effects that can be seen in this case.
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
BCM
DCM
f
sw(max)
I
I
M(DRAIN)max
M
δ2t
sw
(secondary stroke switching time)
t
blank
on(high)
t
less
accurate
regulation
normal
regulation
δ1t
sw
(primary stroke switching time)
V
main
aaa-001747
When 2tsw is lower than tblank, there are wrong ends of demagnetization detections.
on(high) is not linked to the BCM effect; it can be reached sooner if the self-value is not optimized.
The safe operating area is when the peak current (IM) < maximum peak current on pin DRAIN
(IM(DRAIN)max
t
)
Fig 5. SSL21101T limitations as a function of mains voltage and the BCM effect
In BCM mode, the maximum frequency is not reached. The control first increases the
peak current (IM) and then the secondary stroke switching time (2tsw) to maintain the
output power. When the mains voltage decreases, 1tsw increases. When 1tsw reaches
ton(high), the LED current is less accurate.
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
9. Limiting values
Table 7.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
General
Ptot
Parameter
Conditions
Min
Max
Unit
total power dissipation
storage temperature
junction temperature
-
0.8
W
Tstg
55
40
+150
+150
C
C
Tj
[1]
VESD
electrostatic discharge voltage Human Body Model
(HBM)
pins DRAIN and VCC
all other pins
1000
2000
500
+1000
+2000
+500
V
V
V
Charged Device Model
(CDM)
Voltages
VCC
supply voltage
continuous
0.4
0.4
+40
V
V
VDD(INTREGD
)
internal regulated supply
voltage
+5.5
VRMAIN
voltage on pin RMAIN
voltage on pin SOURCE
voltage on pin DRAIN
voltage on pin ILEDREF
voltage on pin MODE
voltage on pin NTC
0.4
0.4
0.4
0.4
0.4
0.4
+1.7
+5.5
+700
+5.5
+5.5
+5.5
V
V
V
V
V
V
VSOURCE
VDRAIN
VILEDREF
VMODE
VNTC
Currents
IM(SOURCE)
IM(DRAIN)
IM(RMAIN)
peak current on pin SOURCE
peak current on pin DRAIN
peak current on pin RMAIN
1.2
0
0
A
1.2
450
A
0
A
[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
10. Thermal characteristics
Table 8.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Typ
Unit
thermal resistance from junction to in free air; SO14 package; PCB: 906 mm2; 70
ambient 2-layer; 35 m Cu/layer
K/W
[1] Rth(j-a) can be lower when the GND pins are connected to an area with sufficient copper on the printed-circuit board.
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
11 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
11. Characteristics
Table 9.
Characteristics
Tamb = 25 C
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply
ICC
supply current
pin VCC
;
0.15
0.8
1.4
mA
VDRAIN > 60 V;
VCC = 22 V;
Tj = 25 C
VCC
supply voltage
functional
13
-
22
-
25.5
1.46
V
ICC(startup)
start-up supply
current
pin VCC
;
mA
VDRAIN > 60 V;
VCC = 15 V;
Tj = 125 C
VCC(startup)
VCC(UVLO)
start-up supply
voltage
15
17
11
19
13
V
V
undervoltage
lockout supply
voltage
9.5
Istartup(DRAIN)
start-up current VDRAIN > 60 V;
870
500
-
1200
700
-
1530
900
A
A
V
on pin DRAIN
VCC = 14 V;
Tj = 125 C
V
DRAIN > 60 V;
VCC = 19 V;
Tj = 125 C
VBR(DRAIN)
breakdown
voltage on pin
DRAIN
700
Output stage
RDSon
drain-source
on-state
resistance
Tj = 25 C
-
-
6.8
9.5
-
-
Tj = 125 C
(dV/dt)r(DRAIN) rise rate of
change voltage
on pin DRAIN
-
6
-
V/ns
V/ns
s
(dV/dt)f(DRAIN) fall rate of
-
3
-
change voltage
on pin DRAIN
ton(high)
high on-time
MOSFET
15.8
16.7
17.6
on-time
limitation;
main = 50 Hz;
mode = 50 kHz
main = 60 Hz;
mode = 50 kHz
13.1
7.9
13.9
8.55
7.1
14.7
9.3
s
s
s
main = 50 Hz;
mode = 100 kHz
main = 60 Hz;
6.5
7.7
mode = 100 kHz
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
Table 9.
Characteristics …continued
Tamb = 25 C
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tprot(sc)LED
LED short-circuit secondary stroke
protection time
switching time;
main = 50 Hz
main = 60 Hz
33.8
28.1
35.8
29.8
37.7
31.5
s
s
Temperature protection
Tth(otp)
overtemperature junction
-
-
140
20
-
C
C
protection
threshold
temperature
temperature
Totp(hys)
overtemperature junction
protection trip
hysteresis
temperature
Regulator
VDD(INTREGD)
internal
4.6
4.9
5.2
V
regulated supply
voltage
VDD(rst)
reset supply
voltage
power-on reset
-
-
4.55
31
V
V
Vprot(VCC)
protection
voltage on pin
VCC
25.5
28
Vth(det)SOURCE detection
threshold
0.65
-
-
0.85
-
V
V
voltage on pin
SOURCE
Vth(swp)SOURCE short-winding
protection
1.5Vth(det)SOURCE
threshold
voltage on pin
SOURCE
Demagnetization
tblank
blanking time
main = 50 Hz
main = 60 Hz
2.56
2.14
2.85
2.37
3.14
2.62
s
s
Frequency switching
[1]
[1]
[1]
[1]
fsw(max)
maximum
switching
frequency
DCM mode;
main = 50 Hz;
mode = 50 kHz
49.7
59.7
99.4
119.4
51.2
52.7
kHz
kHz
kHz
kHz
DCM -mode;
main = 60 Hz;
mode = 50 kHz
61.4
63.2
DCM mode;
main = 50 Hz;
mode = 100 kHz
102.4
122.9
105.4
126.4
DCM mode;
main = 60 Hz;
mode = 100 kHz
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
Table 9.
Characteristics …continued
Tamb = 25 C
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
True current source (current accuracy)
Io
output current
variation
main variation:
+10 % to 15 %
3
3
3
-
-
-
+3
+3
+3
%
%
%
output voltage
variation: 20 %
temperature
variation:
Tj = 140 C
coil variation:
3
-
+3
%
20 %
NTC
Vdet(H)(NTC)
HIGH-level
detectionvoltage
on pin NTC
0.23VDD(INTREGD) 0.25VDD(INTREGD) 0.27VDD(INTREGD)
V
V
Vdet(L)(NTC)
LOW-level
0.115VDD(INTREGD) 0.125VDD(INTREGD) 0.135VDD(INTREGD)
detectionvoltage
on pin NTC
[2]
[2]
I
I
LED/ILEDexp
LED current to
expected LED
current ratio
-
-
1
-
-
LEDmin/ILEDexp minimum LED
current to
0.75
expected LED
current ratio
[1] See Table 5.
[2] See Figure 4.
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
12. Application information
The two different types of application (LTHD mode and LR mode) are shown in Figure 6
and Figure 7. More information can be found in the application note “SSL21101T flexible
focus flyback LED driver application (AN11100)”.
V
CC
DRAIN
V
DD(INTREGD)
RMAIN
SOURCE
SSL21101T
ILEDREF
MODE
NTC
optional NTC
DNC
GND (5)
001aao156
Fig 6. 100 kHz low THD application diagram
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
V
CC
DRAIN
V
DD(INTREGD)
RMAIN
SOURCE
SSL21101T
ILEDREF
MODE
NTC
optional NTC
DNC
GND (5)
001aao157
Fig 7. 100 kHz low ripple application diagram
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
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SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
13. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
v
c
y
H
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
Fig 8. Package outline SOT108-1 (SO14)
SSL21101T
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Product data sheet
Rev. 3 — 7 June 2012
17 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
14. Abbreviations
Table 10. Abbreviations
Acronym
BCM
CCM
CDM
DCM
JFET
LEB
Description
Boundary Conduction Mode
Continuous Conduction Mode
Charged Device Model
Discontinuous Conduction Mode
Junction Field-Effect Transistor
Leading-Edge Blanking
Light-Emitting Diode
LED
LR
Low Ripple
LTHD
NTC
Low Total Harmonic Distortion
Negative Temperature Coefficient
OverTemperature Protection
Switched Mode Power Supply
Smart Digital Control
OTP
SMPS
SDC
SSL
Solid-State Light
THD
Total Harmonic Distortion
UnderVoltage LockOut
UVLO
SSL21101T
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Product data sheet
Rev. 3 — 7 June 2012
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NXP Semiconductors
GreenChip driver for LED lighting
15. Revision history
Table 11. Revision history
Document ID
Release date
20120607
20120504
20110704
Data sheet status
Product data sheet
Objective data sheet
Objective data sheet
Change notice
Supersedes
SSL2110XT v.2
SSL2110XT v.1
-
SSL21101T v.3
-
-
-
SSL21101T v.2
SSL2110XT v.1
SSL21101T
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Product data sheet
Rev. 3 — 7 June 2012
19 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
20 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
non-automotive qualified products in automotive equipment or applications.
GreenChip — is a trademark of NXP B.V.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SSL21101T
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2012
21 of 22
SSL21101T
NXP Semiconductors
GreenChip driver for LED lighting
18. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Functional description . . . . . . . . . . . . . . . . . . . 4
True current source behavior . . . . . . . . . . . . . . 5
Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 6
dV/dt detection . . . . . . . . . . . . . . . . . . . . . . . . . 6
Secondary stroke switching time (d2tsw) . . . . . 6
Mains sensing. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Modulation type versus MODE pin input . . . . . 7
Supply concept: VCC and UnderVoltage
8.1
8.2
8.3
8.4
8.5
8.6
8.7
LockOut (UVLO). . . . . . . . . . . . . . . . . . . . . . . . 7
Peak current detection . . . . . . . . . . . . . . . . . . . 8
Overheating protection of the LEDs . . . . . . . . . 8
Short-winding protection. . . . . . . . . . . . . . . . . . 9
Output LED short circuit protection. . . . . . . . . . 9
Output LED open circuit protection. . . . . . . . . . 9
Limitations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.8
8.9
8.10
8.11
8.12
8.13
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics . . . . . . . . . . . . . . . . . 11
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 7 June 2012
Document identifier: SSL21101T
相关型号:
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