SSL5031CTS/1X [NXP]
SSL5031CTS - Compact high power factor/low-THD buck LED driver IC TSOP 6-Pin;
| 型号： | SSL5031CTS/1X |
| 厂家： | 
NXP |
| 描述： | SSL5031CTS - Compact high power factor/low-THD buck LED driver IC TSOP 6-Pin 光电二极管 |
| 文件： | 总18页 (文件大小：166K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SSL5031CTS
Compact high power factor/low-THD buck LED driver IC
Rev. 2 — 11 March 2015
Product data sheet
1. General description
The SSL5031CTS is a highly integrated, high-precision, non-isolated buck controller with
external MOSFET. It is intended to drive LED lamps in universal mains non-dimmable
lighting applications up to 25 W. The SSL5031CTS is designed for high power
factor/low-THD applications.
The SSL5031CTS operates in Boundary Conduction Mode (BCM) with on-time regulation.
Operating in BCM provides a constant output current control with high accuracy. Adaptive
switching frequency gives freedom to choose the inductor, which enables the optimization
of inductor size, efficiency and EMI.
The SSL5031CTS starts up and operates in switching mode directly from an external
resistor without dV/dt supply or auxiliary supply. This feature simplifies the VCC supply. It
allows a low-cost off-the-shelf inductor to be used, providing flexibility in application
design.
The SSL5031CTS comes in a compact TSOP6 package.
The SSL5031BTS is best suited for high power factor/low THD applications with a
high-temperature foldback function. The SSL5021BTS is suitable for low-ripple
applications.
2. Features and benefits
Driving LED strings from a rectified mains supply, high power factor/low-THD
Small electronic Bill of Materials (BOM) enabling a compact solution and a small,
single layer Printed-Circuit Board (PCB) footprint
Excellent line and load regulation and LED output current accuracy
Efficient BCM operation with:
Minimal reverse recovery losses in freewheel diode
Zero Current Switching (ZCS) and valley switching for switch turn-on
Minimal inductance value and size required
High efficiency (up to 91 %)
Ultra low IC current during operation (< 150 A)
Auto-recovery protections:
UnderVoltage LockOut (UVLO)
Cycle-by-cycle OverCurrent Protection (OCP)
Internal OverTemperature Protection (OTP)
Output OverVoltage Protection (OVP)
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
Output Short Protection (OSP)
Compatible with wall switches with built-in standby indicator lights (Hotaru switch)
Extended IC lifetime
3. Applications
The SSL5031CTS is intended for low-cost, non-isolated LED lighting applications with
accurate fixed current output up to 25 W for single mains or universal mains voltage
(90 V (AC) to 277 V (AC)).
4. Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
[1]
VCC
supply voltage
operating range
of internal switch
Tj = 25 C
9.5
-
16
V
RDSon
on-state resistance
-
0.75
1.20
-
0.90
-
A
Tj = 125 C
-
II(SW)
input current in pin SW triangle wave;
duty cycle < 20 %
2
+2
VI(SW)
input voltage on pin
SW
current limited at
8.8 mA;
0.4
-
+22
V
internal switch off
[1] An internal clamp sets the supply voltage. The current into the VCC pin must not exceed the maximum IVCC
value (see Table 4).
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
SSL5031CTS
TSOP6
plastic surface-mounted package; 6 leads
SOT457
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
2 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
6. Block diagram
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Fig 1. Block diagram
7. Pinning information
7.1 Pinning
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Fig 2. SSL5031CTS pin configuration (TSOP6)
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
3 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
7.2 Pin description
Table 3.
Symbol
ISNS
Pin description
Pin
1
Description
current sense input
supply voltage
VCC
2
SW
3
internal switch drain
DEMOVP
4
input from LED output for demagnetization timing, valley detection,
and OVP
GND
5
6
ground
COMP
loop compensation to provide a stable response
8. Functional description
8.1 Converter operation
The SSL5031CTS is a power MOSFET controller. The converter in the SSL5031CTS is a
source-switch, Boundary Conduction Mode (BCM), on-time controlled system. Figure 3
shows the basic application diagram.
The integrated switch is used to save IC supply current. It enables the use a single
external resistor as supply even in switching mode. This converter operates at the
boundary between Continuous Conduction Mode (CCM) and Discontinuous Conduction
Mode (DCM). Figure 4 shows the waveforms.
When the internal switch is switched on at t0, the inductor current IL builds up from zero in
proportion with VIN - VOUT during the switch-on time (t0 to t1). Energy is stored in the
inductor.
When the internal switch switches off at t1, IL drops proportionally to the value of VOUT
.
The current flows through the freewheeling diode and the output capacitor (t2 to t3). When
IL reaches zero, after a short delay (t3 to t00), a new switching cycle starts.
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Fig 3. SSL5031CTS basic application diagram
8.2 On-time control
When measuring the inductor current IL using sense resistor R4, the on-time is regulated
so that the average regulated voltage on pin ISNS (Vintregd(AV)ISNS) equals an internal
reference voltage. IL can be calculated with Equation 1:
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
4 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
VintregdAVISNS
--------------------------------------
R4 + 0.09
IL
=
(1)
Where:
• 0.09 = ISNS bond wire resistance.
• is the buck topology duty cycle.
8.3 Valley detection
After IL has decreased to zero at t3, the LEDP voltage starts to oscillate around the bus
voltage (VIN) minus output voltage level (VOUT), with amplitude output voltage (VOUT) and
frequency (fring). Valley detection is a special circuit that is integrated in the SSL5031CTS.
It senses when the LEDP voltage reaches its lowest level (valley) through DEMOVP pin
connection. If a valley is detected, the internal switch is switched on again. As a result, the
switch-on switching losses are reduced.
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Fig 4. Buck waveforms and valley detection
8.4 Start-up current
The supply current for the IC is supplied by resistors R3. the IC draws an additional
start-up current (ICC(startup)) just before VCC reaches the start-up voltage level (Vstartup). So
the supply current in operating mode is lower than during start-up conditions, preventing
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
5 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
lamp flicker when the mains voltage is increased or decreased slowly. Figure 5 shows the
basic behavior.
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Fig 5. Start-up current waveform
8.5 Leading-Edge Blanking (LEB)
To prevent false detection of overcurrent, a blanking time following switch-on is
implemented. When the internal switch turns on, a short current spike can occur because
of the discharge capacitance of the MOSFET (Q1) drain node.
8.6 Magnetization switching
When the mains voltage is very low around the zero crossing of the mains, the system
hardly delivers any energy to the LED. To improve efficiency, the maximum off-time
(Toff(max)) switching limits the switching frequency to < 25 kHz. A peak voltage on the ISNS
pin below the VI(min)ISNS voltage indicates a low mains voltage.
8.7 Protections
The IC incorporates the following protections:
• UnderVoltage LockOut (UVLO)
• Cycle-by-cycle OverCurrent Protection (OCP)
• Internal OverTemperature Protection (OTP)
• Cycle-by-cycle maximum on-time protection
• Output OverVoltage Protection
• Output Short Protection (OSP)
8.7.1 UnderVoltage LockOut (UVLO)
When voltage on VCC pin drops to below Vth(UVLO), the IC stops switching. An attempt is
made to restart IC when the voltage on the VCC pin > Vstartup
.
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
6 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
8.7.2 Cycle-by-cycle OverCurrent Protection (OCP)
The SSL5031CTS incorporates a built-in peak current detector. It triggers when the
voltage at the ISNS pin reaches the peak level VI(max)ISNS. A resistor connected to ISNS
pin senses the current through inductor IL. The maximum current in inductor, IL(max)
equals:
VImaxISNS
R4 + 0.09
---------------------------
ILmax
=
(2)
The sense circuit is activated after the leading-edge blanking time (tleb). Because the LED
current is half the peak current by design, the sense circuit automatically provides
protection for the maximum LED current during operation. A propagation delay exists
between the overcurrent detection and the actual switch switch-off. Due to this delay, the
actual peak current is slightly higher than the OCP level set by the resistor connected in
series with the ISNS pin.
8.7.3 OverTemperature Protection (OTP)
The converter stops switching when the internal OTP function is triggered at the IC
junction temperature Tpl(IC). The safe-restart protection is triggered and the IC resumes
switching when the IC temperature drops to below Trst(IC)
.
8.7.4 Cycle-by-cycle maximum on-time protection
Measuring the inductor current IL using sense resistor R4 regulates the on-time. The
on-time is limited to a fixed value (ton(max)). It protects the system and the IC when the
ISNS pin is shorted or when the system works at very low mains voltage.
8.7.5 Output OverVoltage Protection (OVP)
An accurate output OVP is implemented by measuring the voltage at the DEMOVP pin
during the secondary stroke. The resistive divider connected between the LEDP node and
the DEMOVP pin sets the maximum LED voltage.
An internal counter prevents false OVP detection because of noise on the DEMOVP pin.
After three continuous cycles with a DEMOVP pin voltage above the OVP level, the OVP
protection is triggered.
The over voltage protection triggers a restart sequence: A discharge current (ICC(dch)) is
enabled and discharges the voltage on the VCC pin to below Vrst(latch). When Vrst(latch) is
reached, the system restarts.
8.7.6 Output Short Protection (OSP)
The converter operates in Discontinuous Conduction Mode (DCM). A new cycle is only
started after the previous cycle has ended. The end of the cycle is detected by measuring
the voltage on the DEMOVP pin. When the DEMOVP pin voltage drops to below the
demagnetization level (Vth(comp)DEMOVP) and a valley is detected, a new cycle starts.
When output is shorted, the demagnetization is not finalized within the 40 s. The
converter still regulates the adjusted output current and the on-time is reduced to a safe
value by this feedback. The reduced on-time in combination with very long
demagnetization time prevents that the converter is damaged or excessive dissipation
occurs.
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
7 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
A blanking time (tsup(xfmr_ring)) is implemented at the start of the secondary stroke to
prevent false demagnetization detection.
8.8 Supply management
The IC starts up when the voltage on the VCC pin increases to exceed Vstartup. The IC
locks out (stops switching) when the voltage on the VCC pin drops to below Vth(UVLO). The
hysteresis between the start and stop levels allows the VCC capacitor to supply the IC
during zero-crossings of the mains.
The SSL5031CTS incorporates an internal clamping circuit to limit the voltage on the VCC
pin. The clamp limits the voltage on the VCC pin to the maximum value, Vclamp(VCC). If the
maximum current of the external resistor minus the current consumption of the IC is lower
than the limiting value of IVCC in Table 4, no external Zener diode is required.
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
8 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Voltages
VCC
Parameter
Conditions
Min
Max
Unit
[1][2]
[2]
supply voltage
current limited
0.4
0.4
+18
+22
V
V
VI(SW)
input voltage on pin SW
current limited to
8.8 mA;
internal switch off
VI(ISNS)
input voltage on pin ISNS
0.4
0.4
+5
V
V
VIO(COMP) input/output voltage on pin
COMP
+5.3
VI(DEMOVP) input voltage on pin
DEMOVP
6
+6
V
Currents
II(VCC)
II(SW)
input current on pin VCC
input current on pin SW
-
8.8
380
+2
mA
mA
A
RMS current
-
triangle wave;
2
duty cycle < 20 %
II(ISNS)
input current on pin ISNS
triangle wave;
2
+2
A
duty cycle < 20 %
General
Ptot
total power dissipation
storage temperature
junction temperature
Tamb < 75 C
-
0.28
W
Tstg
55
40
+150
+160
C
C
Tj
ESD
ESD
electrostatic discharge
class 1
[3]
[4]
human body
model
2000
500
+2000
+500
V
V
charged device
model
[1] The current into the VCC pin must not exceed the maximum I(VCC) value.
[2] An internal clamp sets the supply voltage and current limits.
[3] Equivalent to discharge a 100 pF capacitor through a 1.5 k series resistor.
[4] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 resistor.
10. Thermal characteristics
Table 5.
Thermal characteristics
Parameter
thermal resistance from junction In free air;
Symbol
Conditions
Typ
Unit
Rth(j-a)
259
K/W
to ambient
JEDEC test board
Rth(j-c)
thermal resistance from junction In free air;
152
K/W
to case
JEDEC test board
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
9 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
11. Characteristics
Table 6.
amb = 25 C; VCC = 15 V; all voltages are measured with respect to ground pin (pin 5); currents are positive when flowing into
the IC; unless otherwise specified.
Characteristics
T
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply (pin VCC)
Vstartup
start-up voltage
12.25
9.6
12.65
9.9
13.05
10.2
V
V
Vth(UVLO)
undervoltage lockout threshold
voltage
VVCC
voltage difference on pin VCC
clamp voltage on pin VCC
latched reset voltage
0.17
15.2
6.0
0.30
15.8
6.2
0.43
16.4
6.4
V
[1]
Vclamp(VCC)
Vrst(latch)
ICC(oper)
ICC(startup)
ICC(dch)
II(VCC) = 2.6 mA
switching at 100 kHz
VCC = Vrst(latch)
V
V
operating supply current
start-up supply current
100
120
3.7
125
145
4.8
150
170
5.5
A
A
mA
discharge supply current
Loop compensation (pin COMP)
Vton(zero)COMP zero on-time voltage on pin
1.96
3.8
2.04
4.0
2.12
4.2
V
V
COMP
Vton(max)COMP
maximum on-time voltage on pin
COMP
Vclamp(COMP)
ton(max)
clamp voltage on pin COMP
maximum on-time
4.3
4.7
5.1
V
VIO(COMP) = 4 V
VI(ISNS) = 0 V
12.3
3.2
15.5
4.0
18.7
4.8
s
A
IO(COMP)
output current on pin COMP
Valley detection and overvoltage detection (pin DEMOVP)
Iprot(DEMOVP)
protection current on pin
DEMOVP
open current;
VI(DEMOVP) = 0 V
250
1.74
-
180
1.81
3
50
1.88
-
nA
V
Vth(ovp)
overvoltage protection threshold
voltage
Ncy(ovp)
number of overvoltage protection
cycles
-
gmDEMOVP
Vth(comp)DEMOVP
(dV/dt)vrec
tsup(xmfr_ring)
transconductance on pin
DEMOVP
VI(DEMOVP) to IO(COMP)
24
4
29
34
A/V
mV
V/s
s
comparator threshold voltage on
pin DEMOVP
18
32
[2]
valley recognition voltage
change with time
-
3.8
1.5
transformer ringing suppression
time
1.2
1.8
Current sensing (pin ISNS)
VI(min)ISNS minimum input voltage on pin
75
100
1.8
125
1.9
mV
V
ISNS
VI(max)ISNS
maximum input voltage on pin
ISNS
1.7
[3]
ton(min)
td
minimum on-time
delay time
310
-
410
100
510
-
ns
ns
[2][4]
SSL5031CTS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
10 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
Table 6.
Characteristics …continued
Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground pin (pin 5); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
8.4
Typ
9.7
Max
11.0
Unit
A/V
V
gmISNS
transconductance on pin ISNS
VI(ISNS) to IO(COMP)
Vintregd(AV)ISNS
average internal regulated
voltage on pin ISNS
0.396
0.410
0.424
Driver (pin SW)
RDSon
on-state resistance
Tj = 25 C
-
0.75
1.20
40
0.90
-
Tj = 125 C
-
toff(max)
maximum turn-off time
30
50
s
Temperature protection
Tpl(IC)
IC protection level temperature
IC reset level temperature
140
106
150
118
165
130
C
C
Trst(IC)
[1] The start-up voltage and the clamp voltage are correlated.
[2] Guaranteed by design.
[3] The minimum on-time is only effective when OCP is triggered.
[4] tleb = tonmin – td
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
11 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
12. Application information
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(1) R3b, R6b, C1 and C2 are the parts for the 230 V (AC) mains application. Short R3b and R6b out; reduce C1 and C2 voltage
rating for the 120 V (AC) mains application.
Fig 6. SSL5031CTS application diagram
SSL5031CTS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
12 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
13. Package outline
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Fig 7. Package outline SOT457 (TSOP6)
SSL5031CTS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
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SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
14. Abbreviations
Table 7.
Abbreviations
Description
Acronym
BCM
BOM
LEB
Boundary Conduction Mode
Bill Of Materials
Leading-Edge Blanking
OverCurrent Protection
Output Short Protection
OverTemperature Protection
OverVoltage Protection
Printed-Circuit Board
OCP
OSP
OTP
OVP
PCB
UVLO
ZCS
UnderVoltage LockOut
Zero Current Switching
SSL5031CTS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
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SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
15. Revision history
Table 8.
Revision history
Document ID
SSL5031CTS v.2
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20150311
Product data sheet
-
SSL5031CTS v.1
• The data sheet status has changed from Preliminary to Product.
• Text and graphics have been updated throughout the data sheet.
SSL5031CTS v.1
20141015
Preliminary data sheet
-
-
SSL5031CTS
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Product data sheet
Rev. 2 — 11 March 2015
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SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
16 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
16.4 Trademarks
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP Semiconductors N.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SSL5031CTS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 2 — 11 March 2015
17 of 18
SSL5031CTS
NXP Semiconductors
Compact high power factor/low-THD buck LED driver IC
18. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.7.1
8.7.2
8.7.3
8.7.4
8.7.5
8.7.6
8.8
Functional description . . . . . . . . . . . . . . . . . . . 4
Converter operation . . . . . . . . . . . . . . . . . . . . . 4
On-time control. . . . . . . . . . . . . . . . . . . . . . . . . 4
Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 5
Start-up current. . . . . . . . . . . . . . . . . . . . . . . . . 6
Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 6
Magnetization switching . . . . . . . . . . . . . . . . . . 6
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 7
Cycle-by-cycle OverCurrent Protection (OCP) . 7
OverTemperature Protection (OTP) . . . . . . . . . 7
Cycle-by-cycle maximum on-time protection . . 7
Output OverVoltage Protection (OVP) . . . . . . . 7
Output Short Protection (OSP). . . . . . . . . . . . . 7
Supply management. . . . . . . . . . . . . . . . . . . . . 8
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics . . . . . . . . . . . . . . . . . . 9
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 March 2015
Document identifier: SSL5031CTS
相关型号：
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