TDA1023T [NXP]
Proportional-control triac triggering circuit; 比例控制双向可控硅触发电路
| 型号： | TDA1023T |
| 厂家： | 
NXP |
| 描述： | Proportional-control triac triggering circuit |
| 文件： | 总19页 (文件大小：270K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1023/T
Proportional-control triac triggering
circuit
May 1991
Product specification
Supersedes data of August 1982
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
FEATURES
APPLICATIONS
• Adjustable width of proportional range
• Adjustable hysteresis
• Panel heaters
• Temperature control
• Adjustable width of trigger pulse
• Adjustable repetition timing of firing burst
• Control range translation facility
• Fail safe operation
GENERAL DESCRIPTION
The TDA1023 is a bipolar integrated circuit for controlling
triacs in a proportional time or burst firing mode. Permitting
precise temperature control of heating equipment it is
especially suited to the control of panel heaters.
It generates positive-going trigger pulses but complies with
regulations regarding mains waveform distortion and RF
interference.
• Supplied from the mains
• Provides supply for external temperature bridge
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
MIN. TYP. MAX. UNIT
supply voltage (derived from mains voltage)
stabilized supply voltage for temperature bridge
supply current (average value)
trigger pulse width
−
13.7
8
−
V
VZ
−
−
V
I16(AV)
tw
−
10
200
41
−
−
mA
µs
s
−
−
Tb
firing burst repetition time at CT = 68 µF
output current
−
−
(1)
-IOH
−
150
+75
mA
°C
Tamb
operating ambient temperature range
−20
−
Note
1. Negative current is defined as conventional current flow out of a device. A negative output current is suited for
positive triac triggering.
ORDERING INFORMATION
PACKAGE
EXTENDED
TYPE NUMBER
PINS
16
PIN POSITION
DIL
MATERIAL
plastic
CODE
SOT38(1)
TDA1023
TDA1023T
16
mini-pack
plastic
SO16; SOT109A(2)
Note
1. TDA1023: 16 DIL; plastic (SOT38); SOT38-1; 1996 November 27.
2. TDA1023T: 16 mini-pack; plastic (SO16; SOT109A); SOT109-1; 1996 November 27.
May 1991
2
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
Rpd
n.c.
Q
1
internal pull-down resistor
not connected
2
handbook, halfpage
R
1
2
3
4
5
6
7
8
16 RX
3
output
pd
HYS
PR
CI
4
hysteresis control input
proportional range control input
control input
15
n.c.
Q
n.c.
5
14
13
12
11
10
9
V
CC
6
V
HYS
PR
CI
EE
TDA1023
UR
QR
BR
PW
VZ
7
unbuffered reference input
output of reference buffer
buffered reference input
pulse width control input
reference supply output
TB
8
V
Z
9
UR
QR
PW
BR
10
11
12
TB
firing burst repetition time control
input
MBA484
VEE
VCC
n.c.
RX
13
14
15
16
ground
positive supply
not connected
Fig.2 Pin configuration.
external resistor connection
May 1991
3
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
FUNCTIONAL DESCRIPTION
Control and reference inputs CI, BR and UR
(pins 6, 9 and 7)
The TDA1023 generates pulses to trigger a triac. These
pulses coincide with the zero excursions of the mains
voltage, thus minimizing RF interference and mains supply
transients. In order to gate the load on and off, the trigger
pulses occur in bursts thus further reducing mains supply
pollution. The average power in the load is varied by
modifying the duration of the trigger pulse burst in
accordance with the voltage difference between the
control input CI and the reference input, either UR or BR.
For the control of room temperature (5 °C to 30 °C)
optimum performance is obtained by using the translation
circuit. The buffered reference input BR (pin 9) is used as
a reference input whilst the output reference buffer QR (pin
8) is connected to the unbuffered reference input UR
(pin 7). This ensures that the range of room temperature is
encompassed in most of the rotation of the potentiometer
to give a linear temperature scale with accurate setting.
Should the translation circuit not be required, the
unbuffered reference input UR (pin 7) is used as a
reference input. The buffered reference input BR (pin 9)
must then be connected to the reference supply output VZ
(pin 11).
Power supply: VCC, RX and Vz (pins 14, 16 and 11)
The TDA1023 is supplied from the AC mains via a resistor
RD to the RX connection (pin 16); the VEE connection (pin
13) is linked to the neutral line (see Fig.4a). A smoothing
capacitor CS should be coupled between the VCC and VEE
connections.
For proportional power control the unbuffered reference
input UR (pin 7) must be connected to the firing burst
repetition time control input TB (pin 12).The buffered
reference input BR (pin 9), which is in this instance
inactive, must then be connected to the reference supply
output VZ (pin 11).
A rectifier diode is included between the RX and VCC
connections whilst the DC supply voltage is limited by a
chain of stabilizer diodes between the RX and VEE
connections (see Fig.3).
A stabilized reference voltage (VZ) is available at pin 11 to
power an external temperature sensing bridge.
Proportional range control input PR (pin 5)
The output duty factor changes from 0% to 100% by a
variation of 80 mV at the control input CI (pin 6) with the
proportional range control input PR open. For temperature
control this corresponds to a temperature difference of 1 K.
Supply operation
During the positive mains half-cycles the current through
the external voltage dropping resistor RD charges the
external smoothing capacitor CS until RX attains the
stabilizing potential of the internal stabilizing diodes. RD
should be selected to be capable of supplying the current
By connecting the proportional range control input PR
(pin 5) to ground the range may be increased to 400 mV,
i.e. 5 K. Intermediate values may be obtained by
connecting the PR input to ground via a resistor R5
(see Table 1).
ICC for the TDA1023, the average output current I3(AV)
recharge the smoothing capacitor CS and provide the
,
supply for an external temperature bridge. (see Figs 9 to
12). Any excess current is by-passed by the internal
stabilizer diodes. The maximum rated supply current,
however, must not be exceeded.
Hysteresis control input HYS (pin 4)
With the hysteresis control input HYS (pin 4) open, the
device has a built-in hysteresis of 20 mV. For temperature
control this corresponds with 0.25 K.
During the negative mains half-cycles external smoothing
capacitor CS supplies the sum of the current demand
described above. Its capacitance must be sufficiently high
to maintain the supply voltage above the specified
minimum.
Hysteresis is increased to 320 mV, corresponding to 4 K,
by grounding HYS (pin 4). Intermediate values are
obtained by connecting pin 4 via resistor R4 to ground.
Table 1 provides a set of values for R4 and R5 giving a
fixed ratio between hysteresis and proportional range.
Dissipation in resistor RD is halved by connecting a diode
in series (see Fig.4b and 9 to 12). A further reduction in
dissipation is possible by using a high quality dropping
capacitor CD in series with a resistor RSD (see Figs 4c and
14). Protection of the TDA1023 and the triac against
mains-borne transients can be provided by connecting a
suitable VDR across the mains input.
May 1991
4
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Trigger pulse width control input PW (pin 10)
The width of the trigger pulse may be adjusted to the value
required for the triac by choosing the value of the external
synchronization resistor RS between the trigger pulse
width control input PW (pin 10) and the AC mains.
The pulse width is inversely proportional to the input
current (see Fig.13).
Output Q (pin 3)
Since the circuit has an open-emitter output it is capable of
sourcing current. It is thus suited for generating
positive-going trigger pulses. The output is current-limited
and short-circuit protected. The maximum output current is
150 mA and the output pulses are stabilized at 10 V for
output currents up to that value.
To minimize the total supply current and power dissipation,
a gate resistor RG must be connected between the output
Q and the triac gate to limit the output current to the
minimum required by the triac (see Figs 5 to 8).
Pull-down resistor Rpd (pin 1)
The TDA1023 includes a 1.75 kΩ pull-down resistor Rpd
between pins 1 and 13 (VEE, ground connection) intended
for use with sensitive triacs.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOL
VCC
PARAMETER
DC supply voltage
MIN.
MAX.
UNIT
−
16
V
Supply current
I16(AV)
I16(RM)
I16(SM)
VI
average
−
−
−
−
−
−
−
30
100
2
mA
mA
A
repetitive peak
non-repetitive peak (tp < 50 µs)
input voltage, all inputs
input current
16
10
16
16
V
I6, 7, 9, 10
V1
mA
V
voltage on Rpd connection
output voltage, Q, QR, VZ
V3, 8, 11
V
Output current
-IOH(AV)
-IOH(M)
Ptot
average
−
30
mA
mA
mW
°C
peak max. 300 µs
−
700
500
total power dissipation
storage temperature range
operating ambient temperature range
−
Tstg
−55
−20
+150
+75
Tamb
°C
May 1991
5
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
CHARACTERISTICS
VCC = 11 to 16 V; Tamb = −20 to +75 °C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Supply
VCC
internally stabilized supply voltage at
12
13.7 15
V
I
16 = 10 mA
∆VCC/∆I16 variation with I16
I16 supply current at V16-13 = 11 to 16 V;
I10 = 1mA; f = 50 Hz; pin 11 open;
6-13 > V7-13
−
−
30
−
mV/mA
mA
pins 4 and 5 open
−
6
V
pins 4 and 5 grounded
−
−
7.1
mA
Reference supply output VZ (pin 11) for external temperature bridge
V11-13
output voltage
output current
−
−
8
−
V
−I11
−
1
mA
Control and reference inputs CI, BR and UR (pins 6, 9 and 7)
V6-13
I6, 7, 9
input voltage to inhibit the output
input current
−
−
7.6
−
V
V1 = 4 V
−
2
µA
Hysteresis control input HYS (pin 4)
∆V6
∆V6
hysteresis
hysteresis
pin 4 open
9
20
40
mV
mV
pin 4 grounded
−
320
−
Proportional control range input PR (pin 5)
∆V6
∆V6
proportional range
proportional range
pin 5 open
50
80
130
mV
mV
pin 5 grounded
−
400
−
Pulse width control input PW (pin 10)
tw pulse width
I10(RMS) = 1mA; f = 50 Hz 100
200
600
300
960
µs
Firing burst repetition time control input TB (pin 12)
firing burst repetition time, ratio to
capacitor CT
TbCT
320
ms/µF
Output of reference buffer QR (pin 8)
output voltage at input voltage:
V8-13
V8-13
V8-13
V9-13 = 1.6 V
V9-13 = 4.8 V
V9-13 = 8 V
−
−
−
3.2
4.8
6.4
−
−
−
V
V
V
Output Q (pin 3)
VOH
output voltage HIGH
output current HIGH
−IOH = 150 mA
10
−
−
−
V
−IOH
−
150
mA
Internal pull-down resistor Rpd (pin 1)
Rpd
resistance to VEE
1
1.75
3
kΩ
May 1991
6
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Table 1 Adjustment of proportional range and hysteresis. Combinations of resistor values giving
hysteresis > 1⁄4 proportional range.
Proportional range
Proportional range resistor
Minimum hysteresis
Maximum hysteresis resistor
R5
R4
mV
80
kΩ
mV
kΩ
open
3.3
1.1
0.43
0
20
40
open
9.1
160
240
320
400
60
4.3
80
2.7
100
1.8
Table 2 Timing capacitor values CT
Effective DC value
Marked AC specification
Catalogue number(1)
µF
µF
V
68
47
33
22
15
10
47
33
22
15
10
6.8
25
40
25
40
25
40
2222 016 90129
- - 90131
- 015 90102
- - 90101
- - 90099
- - 90098
Note
1. Special electrolytic capacitors recommended for use with the TDA1023.
RX
handbook, halfpage
16
14
V
CC
11
V
STABILIZER
13
Z
V
MBA483
EE
Fig.3 Internal supply connections.
May 1991
7
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
load
(heater)
R
SD
AC mains
voltage
V
RX
16
CC
–
U
V
S
14
R
G
Q
C
3
S
TDA1023
13
V
EE
MBA470
a.
D1
D
load
(heater)
R
AC mains
voltage
V
RX
16
CC
–
U
V
S
14
R
G
Q
C
3
TDA1023
S
13
V
EE
MBA482
b.
R
SD
C
D
load
(heater)
BAW62
D2
BAW62
D1
AC mains
voltage
–
U
V
V
S
RX
CC
14
16
R
G
Q
C
3
TDA1023
S
13
V
EE
MBA469
c.
Fig.4 Alternative supply arrangements.
8
May 1991
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Fig.5 VS = 110 V, 50 Hz.
Fig.6 VS = 220 V, 50 Hz.
May 1991
9
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Fig.7 VS = 240 V, 50Hz.
Fig.8 VS = 380 V, 50 Hz.
May 1991
10
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Fig.9 VS = 110 V.
Fig.10 VS = 220 V.
May 1991
11
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Fig.11 VS = 240 V.
Fig.12 VS = 380 V.
May 1991
12
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Fig.14 Nominal value of voltage dropping capacitor
CD and power PRSD dissipated in a voltage
dropping resistor RSD as a function of
Fig.13 Synchronization resistor Rs as a function of
required trigger pulse width tw with a mains
voltage Vs as a parameter.
average supply current I16 (AV) with the
mains supply voltage VS as a parameter.
May 1991
13
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
D1
load
(heater)
line
R
D
R
S
AC mains
voltage
V
triac
RX
CC
PW
10
–
U
R
G
R1
R
V
Z
14
16
Q
R
V
S
11
6
3
1
CI
TDA1023
C
–
S
neutral
pd
BR
9
13
8
7
4
5
12
TB
C1
V
QR
UR
HYS PR
θ
EE
NTC
R
p
C
T
MBA513
Conditions:- Mains supply; VS = 220 V; Temperature range = 5 to 30 °C.
BT139 data at Tj = 25 °C; Vgt < 1.5 V; Igt > 70 mA; IL < 60 mA
Fig.15 The TDA1023/T used in a 1200 to 2000 W heater with triac BT139. For component values see Table 3.
May 1991
14
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Table 3 Temperature controller component values (see Fig.15). Notes 1, 2
SYMBOL
PARAMETER
trigger pulse width
REMARKS
see BT139 data sheet
see Fig.13
VALUE
tw
75 µs
RS
RG
synchronization resistor
gate resistor
180 kΩ
110 Ω
see Fig.6
I3(AV)
R4
max. average gate current
hysteresis resistor
see Fig.8
4.1 mA
n.c.
see Table 1
R5
proportional band resistor
min. required supply current
mains dropping resistor
power dissipated in RD
timing capacitor (eff. value)
voltage dependent resistor
rectifier diode
see Table 1
n.c.
I16(AV)
RD
11.1 mA
6.2 kΩ
4.6 W
see Fig.10
PRD
CT
see Fig.10
see Table 2
68 µF
VDR
D1
cat. no. 2322 593 62512
250 V AC
BYW56
18.7 kΩ
22 kΩ
R1
resistor to pin 11
1% tolerance
RNTC
Rp
NTC thermistor (at 25 °C)
potentiometer
B = 4200 K cat no. 2322 642 12223
22 kΩ
C1
capacitor between pins 6 and 9
smoothing capacitor
47 nF
CS
220 µF; 16 V
If RD and D1 are replaced by CD and RSD
CD
mains dropping capacitor
series dropping resistor
power dissipated in RSD
voltage dependent resistor
470 nF
390 Ω
RSD
PRSD
VDR
see Fig.14
0.6 W
cat. no. 2322 594 62512
250 V AC
Notes
1. ON/OFF control: pin 12 connected to pin 13.
2. If translation circuit is not required: slider of Rp to pin 7; pin 8 open; pin 9 connected to pin 11.
May 1991
15
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
May 1991
16
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-23
97-05-22
SOT109-1
076E07S
MS-012AC
May 1991
17
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
May 1991
18
Philips Semiconductors
Product specification
Proportional-control triac triggering circuit
TDA1023/T
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 1991
19
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