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TDA1308AT/N2,112 [NXP]

TDA1308AT;
TDA1308AT/N2,112
型号： TDA1308AT/N2,112
厂家： NXP    NXP
描述：

TDA1308AT

放大器 光电二极管 商用集成电路
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TDA1308; TDA1308A  
Class-AB stereo headphone driver  
Rev. 04 — 25 January 2007  
Product data sheet  
1. General description  
The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in  
an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump  
wafer level chip-size package (WLCSP8). The device is fabricated in a 1 µm  
Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily  
developed for portable digital audio applications.  
The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be  
used at low supply voltages.  
2. Features  
I Wide temperature range  
I No switch ON/OFF clicks  
I Excellent power supply ripple rejection  
I Low power consumption  
I Short-circuit resistant  
I High performance  
N High signal-to-noise ratio  
N High slew rate  
N Low distortion  
I Large output voltage swing  
3. Quick reference data  
Table 1.  
Quick reference data  
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
VDD  
supply voltage  
TDA1308  
single supply  
dual supply  
3.0  
1.5  
5.0  
2.5  
7.0  
3.5  
V
V
TDA1308A  
single supply  
dual supply  
2.4  
1.2  
5.0  
2.5  
7.0  
3.5  
V
V
VSS  
negative supply  
voltage  
TDA1308; dual supply  
TDA1308A; dual supply  
no load  
−1.5 −2.5 −3.5  
−1.2 −2.5 −3.5  
V
V
IDD  
supply current  
-
3
5
mA  
 
 
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
Table 1.  
Quick reference data …continued  
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
Ptot  
total power  
dissipation  
no load  
-
15  
25  
mW  
[1]  
Po  
maximum output  
power  
(THD + N)/S < 0.1 %  
-
40  
80  
mW  
[1]  
[1]  
[2]  
[3]  
(THD + N)/S total harmonic  
distortion plus  
-
0.03 0.06  
%
-
−70  
−92  
−52  
−101  
110  
−65  
−89  
−40  
-
dB  
dB  
dB  
dB  
dB  
noise-to-signal  
ratio  
RL = 5 kΩ  
RL = 5 kΩ  
RL = 5 kΩ  
-
-
-
S/N  
signal-to-noise  
ratio  
100  
-
αcs  
channel  
separation  
-
-
-
70  
-
-
-
dB  
dB  
dB  
[1]  
RL = 5 kΩ  
105  
90  
PSRR  
Tamb  
power supply  
ripple rejection  
fi = 100 Hz;  
Vripple(p-p) = 100 mV  
ambient  
−40  
-
+85  
°C  
temperature  
[1] VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).  
[2] VDD = 2.4 V; VO(p-p) = 1.62 V (at −4.8 dBV); for TDA1308A only.  
[3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only.  
4. Ordering information  
Table 2.  
Ordering information  
Type number Package  
Name  
Description  
plastic dual in-line package; 8 leads (300 mil)  
Version  
TDA1308  
DIP8  
SO8  
SOT97-1  
SOT96-1  
TDA1308T  
plastic small outline package; 8 leads; body width  
3.9 mm  
TDA1308AT  
SO8  
plastic small outline package; 8 leads; body width  
3.9 mm  
SOT96-1  
TDA1308AUK WLCSP8  
TDA1308TT TSSOP8  
wafer level chip-size package; 8 bumps;  
0.61 × 0.84 × 0.38 mm  
TDA1308AUK  
SOT505-1  
plastic thin shrink small outline package; 8 leads;  
body width 3 mm  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
2 of 19  
 
 
 
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
5. Block diagram  
TDA1308(A)  
1
8
7
OUTA  
V
DD  
2
3
INA(neg)  
INA(pos)  
OUTB  
6
5
INB(neg)  
INB(pos)  
4
V
SS  
mka779  
Fig 1. Block diagram  
6. Pinning information  
6.1 Pinning  
bump A1  
index area  
TDA1308AUK  
1
2
3
A
B
C
D
E
TDA1308(A)  
1
2
3
4
8
7
6
5
OUTA  
INA(neg)  
INA(pos)  
V
DD  
OUTB  
INB(neg)  
INB(pos)  
V
SS  
001aaf800  
Transparent top view  
001aaf782  
Fig 2. Pin configuration TDA1308(A)  
Fig 3. Pin configuration TDA1308AUK  
6.2 Pin description  
Table 3.  
Symbol  
OUTA  
Pin description TDA1308(A)  
Pin  
1
Description  
output A  
INA(neg)  
INA(pos)  
VSS  
2
inverting input A  
non-inverting input A  
negative supply  
non-inverting input B  
3
4
INB(pos)  
5
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
3 of 19  
 
 
 
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
Table 3.  
Pin description TDA1308(A) …continued  
Symbol  
INB(neg)  
OUTB  
VDD  
Pin  
6
Description  
inverting input B  
output B  
7
8
positive supply  
Table 4.  
Symbol  
OUTA  
Pin description TDA1308AUK  
Pin  
A1  
A3  
B2  
C1  
C3  
D2  
E1  
E3  
Description  
output A  
VSS  
negative supply  
non-inverting input A  
output B  
INA(pos)  
OUTB  
INA(neg)  
INB(neg)  
VDD  
inverting input A  
inverting input B  
positive supply  
non-inverting input B  
INB(pos)  
7. Internal circuitry  
V
DD  
I
1
INA/B(pos)  
INA/B(neg)  
M1  
M2  
A1  
M3  
OUTA/B  
C
m
M5  
M4  
D1  
D2  
D3  
D4  
A2  
M6  
V
SS  
mka781  
Fig 4. Equivalent schematic diagram  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
4 of 19  
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
8. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
Min  
0
Max  
8.0  
-
Unit  
V
VDD  
supply voltage  
output short-circuit duration Tamb = 25 °C;  
tot = 1 W  
tSC(O)  
20  
s
P
Tstg  
storage temperature  
ambient temperature  
−65  
−40  
−2  
+150  
+85  
+2  
°C  
°C  
kV  
V
Tamb  
Vesd  
[1]  
[2]  
electrostatic discharge  
voltage  
HBM  
MM  
−200  
+200  
[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.  
[2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.  
9. Thermal characteristics  
Table 6.  
Thermal characteristics  
Symbol  
Parameter  
Conditions  
Typ  
Unit  
Rth(j-a)  
thermal resistance from junction  
to ambient  
DIP8  
109  
210  
220  
1000  
K/W  
K/W  
K/W  
K/W  
SO8  
TSSOP8  
WLCSP8  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
5 of 19  
 
 
 
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
10. Characteristics  
Table 7.  
Characteristics  
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.  
Symbol  
Supplies  
VDD  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage  
TDA1308  
single supply  
dual supply  
3.0  
1.5  
5.0  
2.5  
7.0  
3.5  
V
V
TDA1308A  
single supply  
dual supply  
2.4  
1.2  
−1.5  
−1.2  
-
5.0  
2.5  
−2.5  
−2.5  
3
7.0  
3.5  
−3.5  
−3.5  
5
V
V
VSS  
negative supply voltage  
TDA1308; dual supply  
TDA1308A; dual supply  
no load  
V
V
IDD  
supply current  
mA  
mW  
Ptot  
total power dissipation  
no load  
-
15  
25  
Static characteristics  
VI(os)  
Ibias  
VCM  
GV  
input offset voltage  
-
10  
10  
-
-
mV  
pA  
pA  
dB  
mA  
Ω
input bias current  
-
-
common mode voltage  
open-loop voltage gain  
maximum output current  
output resistance  
0
3.5  
RL = 5 kΩ  
-
70  
60  
0.25  
-
-
IO  
-
-
RO  
(THD + N)/S < 0.1 %  
-
-
[1]  
[1]  
[1]  
VO  
output voltage swing  
0.75  
4.25  
3.5  
4.9  
-
V
RL = 16 Ω  
RL = 5 kΩ  
1.5  
-
V
0.1  
-
V
αcs  
channel separation  
-
-
-
-
70  
105  
90  
-
dB  
dB  
dB  
pF  
[1]  
RL = 5 kΩ  
-
PSRR  
CL  
power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV  
load capacitance  
-
200  
Dynamic characteristics  
[2]  
[2]  
[3]  
[3]  
[3]  
[2]  
[2]  
(THD + N)/S total harmonic distortion  
plus noise-to-signal ratio  
-
0.03  
−70  
0.06  
−65  
−89  
−40  
1.0  
-
%
-
dB  
dB  
dB  
%
RL = 5 kΩ  
RL = 5 kΩ  
RL = 5 kΩ  
RL = 5 kΩ  
RL = 5 kΩ  
-
−92  
-
−52  
-
0.25  
−101  
0.0009  
110  
5.5  
-
dB  
%
-
-
S/N  
fG  
signal-to-noise ratio  
unity gain frequency  
maximum output power  
100  
-
dB  
MHz  
mW  
open-loop; RL = 5 kΩ  
-
-
-
Po  
(THD + N)/S < 0.1 %  
40  
80  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
6 of 19  
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
Table 7.  
Characteristics …continued  
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.  
Symbol  
Parameter  
input capacitance  
slew rate  
Conditions  
Min  
Typ  
3
Max  
Unit  
pF  
Ci  
-
-
-
-
-
-
SR  
B
unity gain inverting  
unity gain inverting  
5
V/µs  
kHz  
bandwidth  
20  
[1] Values are proportional to VDD; (THD + N)/S < 0.1 %.  
[2] VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).  
[3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only.  
11. Application information  
V
DD  
C5  
C2  
10 µF  
C1  
100 nF  
C7  
1 nF  
R3  
R1  
22 kΩ  
100 µF  
R5  
10 kΩ  
3.9 kΩ  
1
8
5
2
3
8
1
2
3
BCK  
WS  
V
R2  
ref  
C6  
100 µF  
TDA1545A  
TDA1308(A)  
7
6
33 kΩ  
5
6
DATA  
7
4
4
C3  
1 µF  
R4  
C8  
3.9 kΩ  
C4  
100 µF  
R6  
10 kΩ  
1 nF  
mka783  
Fig 5. Example of application with TDA1545A (stereo continuous calibration DAC)  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
7 of 19  
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
12. Test information  
V
DD  
100 µF  
3.9 kΩ  
V
OUTA  
R
L
1
8
3.9 kΩ  
3.9 kΩ  
2
3
V
INA  
C6  
100 µF  
V
ref  
TDA1308(A)  
(typ. 2.5 V)  
5
6
V
INB  
7
4
100 µF  
3.9 kΩ  
V
OUTB  
R
L
mka782  
Fig 6. Measurement circuit for inverting application  
mka784  
mka785  
−70  
G
(dB)  
v
80  
G
(dB)  
v
−90  
R
L
= 32 Ω  
40  
R
L
= 16 Ω  
no load  
−110  
−130  
32 Ω  
0
5 kΩ  
−1  
−2  
−3  
−4  
−5  
−2  
−3  
−4  
−5  
−6  
−7  
−8  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
f (Hz)  
f (Hz)  
i
i
Fig 7. Open-loop gain as a function of input frequency Fig 8. Crosstalk as a function of input frequency  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
8 of 19  
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
mka786  
mka787  
100  
−50  
P
(mW)  
o
R
L
= 16 Ω  
(THD+N)/S  
(dB)  
R
R
= 16 Ω; P = 50 mW  
o
L
60  
32 Ω  
8 Ω  
−70  
−90  
= 32 Ω; P = 50 mW  
L
o
40  
20  
10  
R
= 5 kΩ; V  
= 3.5 V  
O(p−p)  
L
−110  
−1  
−2  
−3  
−4  
−5  
3
4
5
DD  
10  
10  
10  
10  
10  
f (Hz)  
i
V
(V)  
Fig 9. Output power as a function of supply voltage  
Fig 10. Total harmonic distortion plus noise-to-signal  
ratio as a function of input frequency  
mka788  
−40  
(THD+N)/S  
(dB)  
R
= 8 Ω  
16 Ω  
L
−60  
32 Ω  
−80  
5 kΩ  
f = 1 kHz  
i
−100  
−2  
−1  
10  
10  
1
10  
V
(V)  
O(p−p)  
Fig 11. Total harmonic distortion plus noise-to-signal ratio as a function of output voltage  
level  
12.1 Quality information  
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
9 of 19  
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
13. Package outline  
DIP8: plastic dual in-line package; 8 leads (300 mil)  
SOT97-1  
D
M
E
A
2
A
A
1
L
c
w M  
Z
b
1
e
(e )  
1
M
H
b
b
2
8
5
pin 1 index  
E
1
4
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.14  
0.53  
0.38  
1.07  
0.89  
0.36  
0.23  
9.8  
9.2  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
1.15  
0.068 0.021 0.042 0.014  
0.045 0.015 0.035 0.009  
0.39  
0.36  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.045  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT97-1  
050G01  
MO-001  
SC-504-8  
Fig 12. Package outline SOT97-1 (DIP8)  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
10 of 19  
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT96-1  
076E03  
MS-012  
Fig 13. Package outline SOT96-1 (SO8)  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
11 of 19  
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm  
SOT505-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
A
(A )  
2
A
3
A
1
pin 1 index  
θ
L
p
L
1
4
detail X  
e
w M  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT  
v
w
y
Z
θ
1
2
3
p
max.  
0.15  
0.05  
0.95  
0.80  
0.45  
0.25  
0.28  
0.15  
3.1  
2.9  
3.1  
2.9  
5.1  
4.7  
0.7  
0.4  
0.70  
0.35  
6°  
0°  
mm  
1.1  
0.65  
0.25  
0.94  
0.1  
0.1  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-04-09  
03-02-18  
SOT505-1  
Fig 14. Package outline SOT505-1 (TSSOP8)  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
12 of 19  
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
WLCSP8: wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm  
TDA1308AUK  
D
B
A
bump A1  
index area  
A
2
E
A
A
1
detail X  
e
1
1/2 e  
1
C
M
v
C
C
A
B
b
y
M
w
E
1/4 e  
2
D
C
B
A
1/2 e  
2
e
2
1
2
3
0
0.25  
0.5 mm  
X
scale  
DIMENSIONS (mm are the original dimensions)  
A
UNIT  
A
1
A
2
b
D
E
e
e
2
v
w
y
1
max  
0.10 0.39 0.123 0.65 0.88  
0.07 0.37 0.57 0.80  
mm  
0.49  
0.396 0.588 0.15 0.05 0.08  
0.091  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
06-11-20  
06-12-15  
TDA1308AUK  
Fig 15. Package outline TDA1308AUK (WLCSP8)  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
13 of 19  
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
14. Soldering  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
14.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached to  
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both  
the mechanical and the electrical connection. There is no single soldering method that is  
ideal for all IC packages. Wave soldering is often preferred when through-hole and  
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
14.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from  
a standing wave of liquid solder. The wave soldering process is suitable for the following:  
• Through-hole components  
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
• Board specifications, including the board finish, solder masks and vias  
• Package footprints, including solder thieves and orientation  
• The moisture sensitivity level of the packages  
• Package placement  
• Inspection and repair  
• Lead-free soldering versus PbSn soldering  
14.3 Wave soldering  
Key characteristics in wave soldering are:  
• Process issues, such as application of adhesive and flux, clinching of leads, board  
transport, the solder wave parameters, and the time during which components are  
exposed to the wave  
• Solder bath specifications, including temperature and impurities  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
14 of 19  
 
 
 
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
14.4 Reflow soldering  
Key characteristics in reflow soldering are:  
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 16) than a PbSn process, thus  
reducing the process window  
• Solder paste printing issues including smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is  
heated to the peak temperature) and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder paste  
characteristic). In addition, the peak temperature must be low enough that the  
packages and/or boards are not damaged. The peak temperature of the package  
depends on package thickness and volume and is classified in accordance with  
Table 8 and 9  
Table 8.  
SnPb eutectic process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
≥ 350  
220  
< 2.5  
235  
220  
≥ 2.5  
220  
Table 9.  
Lead-free process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
> 2000  
260  
< 1.6  
260  
250  
245  
1.6 to 2.5  
> 2.5  
260  
245  
250  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 16.  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
15 of 19  
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Fig 16. Temperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note AN10365  
“Surface mount reflow soldering description”.  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
16 of 19  
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
15. Revision history  
Table 10. Revision history  
Document ID  
TDA1308_A_4  
Modifications:  
Release date  
20070125  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
TDA1308_A_3  
• The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors  
• Legal texts have been adapted to the new company name where appropriate  
• Type number TDA1308AUK has been added  
TDA1308_A_3  
TDA1308_A_2  
TDA1308_1  
20020719  
20020227  
19940905  
Product specification  
Product specification  
Product specification  
-
-
-
TDA1308_A_2  
TDA1308_1  
-
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
17 of 19  
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
16. Legal information  
16.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of a NXP Semiconductors product can reasonably be expected to  
16.2 Definitions  
result in personal injury, death or severe property or environmental damage.  
NXP Semiconductors accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or applications and therefore  
such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
16.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
16.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
17. Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: salesaddresses@nxp.com  
TDA1308_A_4  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 04 — 25 January 2007  
18 of 19  
 
 
 
 
 
 
TDA1308; TDA1308A  
NXP Semiconductors  
Class-AB stereo headphone driver  
18. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
7
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Application information. . . . . . . . . . . . . . . . . . . 7  
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8  
Quality information . . . . . . . . . . . . . . . . . . . . . . 9  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
8
9
10  
11  
12  
12.1  
13  
14  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Introduction to soldering . . . . . . . . . . . . . . . . . 14  
Wave and reflow soldering . . . . . . . . . . . . . . . 14  
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14  
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15  
14.1  
14.2  
14.3  
14.4  
15  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17  
16  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
16.1  
16.2  
16.3  
16.4  
17  
18  
Contact information. . . . . . . . . . . . . . . . . . . . . 18  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2007.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 25 January 2007  
Document identifier: TDA1308_A_4  
 

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