TDA1517PN [NXP]
IC 6 W, 2 CHANNEL, AUDIO AMPLIFIER, PQFP44, LQFP-44, Audio/Video Amplifier;
| 型号： | TDA1517PN |
| 厂家： | 
NXP |
| 描述： | IC 6 W, 2 CHANNEL, AUDIO AMPLIFIER, PQFP44, LQFP-44, Audio/Video Amplifier 消费电路 商用集成电路 音频放大器 视频放大器 功率放大器 局域网 |
| 文件： | 总12页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1517; TDA1517P
2 × 6 W stereo power amplifier
1998 Apr 28
Product specification
Supersedes data of 1995 Dec 15
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
FEATURES
GENERAL DESCRIPTION
• Requires very few external components
• High output power
The TDA1517 is an integrated class-B dual output
amplifier in a plastic single in-line medium power package
with fin (SIL9MPF) and a plastic heat-dissipating dual
in-line package (HDIP18). The device is primarily
developed for multi-media applications.
• Fixed gain
• Good ripple rejection
• Mute/standby switch
• AC and DC short-circuit safe to ground and VP
• Thermally protected
• Reverse polarity safe
• Capability to handle high energy on outputs (VP = 0 V)
• No switch-on/switch-off plop
• Electrostatic discharge protection.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
6.0
TYP.
14.4
MAX.
18.0
UNIT
VP
V
A
IORM
Iq(tot)
Isb
repetitive peak output current
total quiescent current
standby current
−
−
2.5
80
100
40
−
−
40
0.1
−
mA
µA
µA
kΩ
W
−
Isw
switch-on current
−
|ZI|
input impedance
50
−
−
Po
output power
RL = 4 Ω; THD = 0.5%
RL = 4 Ω; THD = 10%
fi = 100 Hz to 10 kHz
5
−
−
6
−
W
SVRR
αcs
supply voltage ripple rejection
channel separation
48
40
19
−
−
−
dB
dB
dB
µV
°C
−
−
Gv
closed loop voltage gain
noise output voltage (RMS value)
crystal temperature
20
50
−
21
−
Vno(rms)
Tc
−
150
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
SOT110-1
SOT398-1
TDA1517
SIL9MPF plastic single in-line medium power package with fin; 9 leads
HDIP18 plastic heat-dissipating dual in-line package; 18 leads
TDA1517P
1998 Apr 28
2
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
BLOCK DIAGRAM
non-inverting
input 1
1
mute switch
C
m
60
kΩ
4
output 1
VA
2
kΩ
power stage
18 kΩ
V
P
8
mute/stand-by
switch input
stand-by
switch
stand-by
reference
voltage
VA
15 kΩ
x 1
mute
supply voltage
ripple rejection
output
switch
3
15 kΩ
mute
reference
voltage
TDA1517
18 kΩ
2
kΩ
6
VA
output 2
non-inverting
input 2
9
60
kΩ
C
7
m
mute switch
input
reference
voltage
power stage
signal
ground
power
ground
(substrate)
2
5
MLC351
V
SGND
PGND
P
Fig.1 Block diagram.
3
1998 Apr 28
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
PINNING
SYMBOL
PIN
DESCRIPTION
−INV1
SGND
SVRR
OUT1
PGND
OUT2
VP
1
2
3
4
5
6
7
8
9
non-inverting input 1
signal ground
supply voltage ripple rejection output
output 1
power ground
output 2
supply voltage
M/SS
−INV2
mute/standby switch input
non-inverting input 2
ndbook, halfpage
ndbook, halfpage
INV1
SGND
SVRR
OUT1
PGND
OUT2
1
2
3
4
5
6
7
8
9
INV1
SGND
SVRR
OUT1
PGND
OUT2
1
2
3
4
5
6
7
8
9
18
17
16
15
TDA1517
TDA1517P 14
13
12
11
V
P
V
P
M/SS
INV2
M/SS
INV2
10
MLC352
MLC353
Pins 10 to 18 should be connected to GND or floating.
Fig.2 Pin configuration for SOT110-1.
Fig.3 Pin configuration for SOT398-1.
FUNCTIONAL DESCRIPTION
The TDA1517 contains two identical amplifiers with
differential input stages. The gain of each amplifier is fixed
at 20 dB. A special feature of the device is the
mute/standby switch which has the following features:
• Low standby current (<100 µA)
• Low mute/standby switching current
(low cost supply switch)
• Mute condition.
1998 Apr 28
4
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
18
UNIT
VP
−
−
−
−
−
−
−
V
V
V
VP(sc)
VP(r)
ERGO
IOSM
IORM
Ptot
AC and DC short-circuit safe voltage
reverse polarity
18
6
energy handling capability at outputs
non-repetitive peak output current
repetitive peak output current
total power dissipation
VP = 0 V
200
4
mJ
A
2.5
15
A
see Fig.4
W
°C
°C
°C
Tstg
storage temperature
−55
−40
−
+150
+85
150
Tamb
Tc
operating ambient temperature
crystal temperature
THERMAL RESISTANCE
SYMBOL
Rth j-c
TYPE NUMBER
PARAMETER
VALUE
UNIT
K/W
K/W
K/W
TDA1517
thermal resistance from junction to case
thermal resistance from junction to pins
8
Rth j-p
Rth j-a
TDA1517P
15
TDA1517; TDA1517P thermal resistance from junction to ambient 50
MLC354
18
handbook, halfpage
P
(W)
12
(1)
(2)
6
0
25
0
50
100
150
o
T
( C)
amb
(1) Rth j-c = 8 K/W.
(2) Rth j-p = 15 K/W.
Fig.4 Power derating curve.
1998 Apr 28
5
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VP
supply voltage
note 1
6.0
−
14.4
40
18.0
80
−
V
Iq(tot)
VO
total quiescent current
DC output voltage
mA
V
−
6.95
Mute/standby switch
V8
switch-on voltage level
see Fig.5
8.5
−
−
−
V
Mute condition
VO
output signal in mute position
VI(max) = 1 V; fi = 20 Hz to 15 kHz
−
2
mV
Standby condition
Isb
DC current in standby condition
switch-on current
−
−
−
100
40
µA
µA
Vsw
12
Note
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.
1998 Apr 28
6
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
AC CHARACTERISTICS
VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
SYMBOL
PARAMETER
output power
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Po
THD = 0.5%; note 1
THD = 10%; note 1
Po = 1 W
4
5
−
−
−
−
−
W
5.5
−
6.0
0.1
45
−
W
THD
flr
total harmonic distortion
low frequency roll-off
high frequency roll-off
closed loop voltage gain
supply voltage ripple rejection
on
%
at −3 dB; note 2
at −1 dB
−
Hz
kHz
dB
fhr
20
19
Gv
20
21
SVRR
note 3
48
48
80
50
−
−
dB
dB
dB
kΩ
mute
−
−
standby
−
−
|Zi|
input impedance
noise output voltage
on
60
75
Vno
Rs = 0 Ω; note 4
Rs = 10 Ω; note 4
note 5
−
50
70
50
−
−
µV
µV
µV
dB
dB
on
−
100
−
mute
−
αcs
channel separation
channel unbalance
Rs = 10 Ω
40
−
−
|∆Gv|
0.1
1
Notes
1. Output power is measured directly at the output pins of the IC.
2. Frequency response externally fixed.
3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and
a frequency between 100 Hz and 10 kHz.
4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
5. Noise output voltage independent of Rs (VI = 0 V).
1998 Apr 28
7
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
MLC355
handbook, halfpage
18
V
11
(V)
ON (I = 40 mA)
P
8.5
6.4
mute (I = 40 mA)
P
3.3
2
standby (I
100 µA)
P
0
Fig.5 Standby, mute and on conditions.
APPLICATION INFORMATION
standby switch
V
P
100
2200
µF
µF
100 nF
3
8
7
input
reference
voltage
internal
1/2 V
P
TDA1517
20 dB
20 dB
60 kΩ
60 kΩ
220 nF
220 nF
1
9
input 1
input 2
2
5
6
4
MLC356
1000 µF
1000 µF
signal
ground
power
ground
Fig.6 Application circuit diagram.
8
1998 Apr 28
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
PACKAGE OUTLINES
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
1998 Apr 28
9
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
HDIP18: plastic heat-dissipating dual in-line package; 18 leads
SOT398-1
D
M
E
A
2
A
A
1
L
e
c
w
M
Z
b
1
(e )
1
b
b
2
10
M
H
18
pin 1 index
E
9
1
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
1
2
1
E
H
max.
min.
max.
max.
1.40
1.14
0.67
0.50
1.05
0.75
0.47
0.38
21.85
21.35
6.5
6.2
3.9
3.1
8.32
8.02
8.7
7.7
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.25
0.01
1.0
0.06
0.04
0.03
0.02
0.04
0.03
0.02
0.01
0.87
0.84
0.26
0.24
0.15
0.12
0.33
0.32
0.34
0.30
inches
0.19
0.02
0.15
0.04
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
94-04-13
95-01-25
SOT398-1
1998 Apr 28
10
Philips Semiconductors
Product specification
2 × 6 W stereo power amplifier
TDA1517; TDA1517P
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Apr 28
11
Philips Semiconductors – a worldwide company
Argentina: see South America
Middle East: see Italy
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Fax. +43 160 101 1210
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
Norway: Box 1, Manglerud 0612, OSLO,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belgium: see The Netherlands
Brazil: see South America
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Portugal: see Spain
Romania: see Italy
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Colombia: see South America
Czech Republic: see Austria
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Slovakia: see Austria
Slovenia: see Italy
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Spain: Balmes 22, 08007 BARCELONA,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1998
SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/25/03/pp12
Date of release: 1998 Apr 28
Document order number: 9397 750 03772
相关型号：
TDA1518BQU
IC 12 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP13, POWER, PLASTIC, SOT-141C, SIL-BENT-DIL, 13 PIN, Audio/Video Amplifier
NXP
TDA1519A/N2
IC 11 W, 2 CHANNEL, AUDIO AMPLIFIER, PSFM9, POWER, PLASTIC, SIL-9, Audio/Video Amplifier
NXP
©2020 ICPDF网 联系我们和版权申明