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TDA1519CTD/N3,112 [NXP]

IC 11 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20, PLASTIC, SOT-397-1, HSOP-20, Audio/Video Amplifier;
TDA1519CTD/N3,112
型号： TDA1519CTD/N3,112
厂家： NXP    NXP
描述：

IC 11 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20, PLASTIC, SOT-397-1, HSOP-20, Audio/Video Amplifier

放大器 光电二极管 商用集成电路
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INTEGRATED CIRCUITS  
DATA SHEET  
TDA1519C  
22 W BTL or 2 11 W  
stereo power amplifier  
Product specification  
2004 Jan 28  
Supersedes data of 2001 Aug 24  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
FEATURES  
GENERAL DESCRIPTION  
Requires very few external components for Bridge-Tied  
Load (BTL) operation  
The TDA1519C is an integrated class-B dual output  
amplifier in a 9-lead plastic single in-line power package or  
20-lead heatsink small outline package.  
Stereo or BTL application  
High output power  
For the TDA1519CTH (SOT418-3), the heatsink is  
positioned on top of the package, which allows an external  
heatsink to be mounted on top. The heatsink of the  
TDA1519CTD (SOT397-1) is facing the PCB, allowing the  
heatsink to be soldered onto the copper area of the PCB.  
Low offset voltage at output (important for BTL  
applications)  
Fixed gain  
Good ripple rejection  
Mute/standby switch  
Load dump protection  
AC and DC short-circuit safe to ground and VP  
Thermally protected  
Reverse polarity safe  
Capability to handle high energy on outputs (VP = 0 V)  
No switch-on/switch-off plops  
Protected against electrostatic discharge  
Low thermal resistance  
Identical inputs (inverting and non-inverting)  
Pin compatible with TDA1519B (TDA1519C and  
TDA1519CSP).  
ORDERING INFORMATION  
PACKAGE  
TYPE NUMBER  
NAME  
DESCRIPTION  
VERSION  
SOT131-2  
SOT354-1  
SOT397-1  
TDA1519C  
SIL9P  
SMS9P  
HSOP20  
HSOP20  
plastic single in-line power package; 9 leads  
TDA1519CSP  
TDA1519CTD  
TDA1519CTH  
plastic surface mounted single in-line power package; 9 leads  
plastic, heatsink small outline package; 20 leads  
plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3  
2004 Jan 28  
2
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
QUICK REFERENCE DATA  
SYMBOL  
Supply  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
VP  
supply voltage  
operating  
6.0  
14.4  
17.5  
30  
V
non-operating  
V
load dump protected  
45  
V
IORM  
Iq(tot)  
Istb  
repetitive peak output current  
total quiescent current  
standby current  
4
A
40  
0.1  
80  
mA  
A  
A  
100  
40  
Isw(on)  
switch-on current  
Inputs  
Zi  
input impedance  
BTL  
25  
50  
k  
k  
stereo  
Stereo application  
Po  
output power  
THD = 10 %  
RL = 4   
6
W
RL = 2   
11  
W
cs  
channel separation  
40  
dB  
V  
Vn(o)(rms)  
noise output voltage (RMS value)  
150  
BTL application  
Po  
output power  
THD = 10 %; RL = 4   
RS = 0   
22  
W
SVRR  
supply voltage ripple rejection  
fi = 100 Hz  
34  
48  
dB  
dB  
mV  
C  
fi = 1 to 10 kHz  
VOO  
DC output offset voltage  
junction temperature  
250  
150  
Tj  
2004 Jan 28  
3
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
BLOCK DIAGRAM  
mute switch  
1
NINV  
C
m
60  
kW  
VA  
4
OUT1  
183  
W
power stage  
18.1 kW  
V
P
8
M/SS  
+
-
standby  
switch  
standby  
reference  
voltage  
VA  
15 kW  
×
1
+
+
-
mute  
switch  
3
RR  
15 kW  
mute  
reference  
voltage  
TDA1519C  
TDA1519CSP  
18.1 kW  
power stage  
183  
W
6
OUT2  
VA  
9
INV  
C
m
60  
kW  
mute switch  
input  
reference  
voltage  
power  
ground  
(substrate)  
signal  
ground  
2
7
5
mgl491  
GND1  
V
GND2  
P
The pin numbers refer to the TDA1519C and TDA1519CSP only, for TDA1519CTD and TDA1519CTH see Figs 3 and 4.  
Fig.1 Block diagram.  
2004 Jan 28  
4
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
PINNING  
PIN  
SYMBOL  
DESCRIPTION  
TDA1519C;  
TDA1519CSP  
TDA1519CTD  
TDA1519CTH  
NINV  
GND1  
RR  
1
2
3
4
5
6
7
8
9
19  
20  
1
19  
20  
1
non-inverting input  
ground 1 (signal)  
supply voltage ripple rejection  
output 1  
OUT1  
GND2  
OUT2  
VP  
3
3
5
5
ground 2 (substrate)  
output 2  
8
8
10  
11  
12  
10  
11  
12  
positive supply voltage  
mute/standby switch input  
inverting input  
M/SS  
INV  
n.c.  
2, 4, 6, 7, 9 and 13 to 18 2, 4, 6, 7, 9 and 13 to 18 not connected  
1
2
3
4
5
6
7
8
9
GND1  
NINV  
n.c.  
NINV  
GND1  
RR  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
RR  
n.c.  
GND1 20  
NINV 19  
n.c. 18  
n.c. 17  
n.c. 16  
n.c. 15  
n.c. 14  
n.c. 13  
INV 12  
M/SS 11  
1
2
RR  
n.c.  
3
OUT1  
n.c.  
3
OUT1  
n.c.  
OUT1  
GND2  
OUT2  
4
n.c.  
4
TDA1519C  
TDA1519CSP  
5
GND2  
n.c.  
n.c.  
GND2  
n.c.  
5
TDA1519CTH  
6
TDA1519CTD  
6
n.c.  
7
n.c.  
8
OUT2  
n.c.  
V
P
n.c.  
n.c.  
7
9
8
n.c.  
M/SS  
INV  
OUT2  
n.c.  
10  
V
P
INV  
9
001aaa348  
mgr561  
10  
11 M/SS  
V
P
mgl937  
Fig.2 Pin configuration  
TDA1519C and  
Fig.3 Pin configuration  
TDA1519CTD.  
Fig.4 Pin configuration  
TDA1519CTH.  
TDA1519CSP.  
2004 Jan 28  
5
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
FUNCTIONAL DESCRIPTION  
Low standby current (<100 A)  
Low mute/standby switching current (allows for low-cost  
supply switch)  
The TDA1519C contains two identical amplifiers with  
differential input stages. The gain of each amplifier is fixed  
at 40 dB. A special feature of this device is the  
Mute condition.  
mute/standby switch which has the following features:  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
operating  
MIN.  
MAX.  
17.5  
UNIT  
VP  
V
V
V
non-operating  
30  
45  
load dump protected;  
during 50 ms; tr 2.5 ms  
Vsc  
Vrp  
AC and DC short-circuit-safe voltage  
reverse polarity voltage  
17.5  
6
V
V
Eo  
energy handling capability at outputs  
non-repetitive peak output current  
repetitive peak output current  
total power dissipation  
VP = 0 V  
see Fig.5  
200  
6
mJ  
A
IOSM  
IORM  
Ptot  
Tj  
4
A
25  
W
C  
C  
junction temperature  
150  
+150  
Tstg  
storage temperature  
55  
mgl492  
30  
(1)  
P
tot  
(W)  
20  
(2)  
(3)  
10  
0
-25  
0
50  
100  
150  
(°C)  
T
amb  
(1) Infinite heatsink.  
(2) Rth(c-a) = 5 K/W.  
(3) Rth(c-a) = 13 K/W.  
Fig.5 Power derating curve for TDA1519C.  
2004 Jan 28  
6
 
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
in free air  
VALUE  
UNIT  
Rth(j-a)  
thermal resistance from junction to ambient;  
TDA1519C, TDA1519CTH and TDA1519CTD  
40  
K/W  
Rth(j-c)  
thermal resistance from junction to case;  
3
K/W  
TDA1519C, TDA1519CTH and TDA1519CTD  
DC CHARACTERISTICS  
VP = 14.4 V; Tamb = 25 C; measured in circuit of Fig.6; unless otherwise specified.  
SYMBOL  
Supply  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
VP  
supply voltage  
note 1  
note 2  
6.0  
14.4  
40  
17.5  
80  
V
Iq(tot)  
VO  
VOO  
total quiescent current  
DC output voltage  
mA  
V
6.95  
DC output offset voltage  
250  
mV  
Mute/standby switch  
Vsw(on)  
Vmute  
Vstb  
switch-on voltage level  
8.5  
3.3  
0
V
V
V
mute voltage level  
6.4  
2
standby voltage level  
Mute/standby condition  
Vo  
output voltage  
mute mode; Vi = 1 V (maximum);  
fi = 20 Hz to 15 kHz  
20  
mV  
VOO  
Istb  
DC output offset voltage  
standby current  
mute mode  
250  
100  
40  
mV  
A  
A  
standby mode  
Isw(on)  
switch-on current  
12  
Notes  
1. The circuit is DC adjusted at VP = 6 to 17.5 V and AC operating at VP = 8.5 to 17.5 V.  
2. At VP = 17.5 to 30 V, the DC output voltage is 0.5VP.  
2004 Jan 28  
7
 
 
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
AC CHARACTERISTICS  
VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Stereo application (see Fig.6)  
Po  
output power  
note 1  
THD = 0.5 %  
THD = 10 %  
RL = 2 ; note 1  
THD = 0.5 %  
THD = 10 %  
Po = 1 W  
4
5
W
5.5  
6.0  
W
7.5  
10  
8.5  
11  
0.1  
45  
W
W
THD  
fro(l)  
total harmonic distortion  
low frequency roll-off  
%
3 dB; note 2  
1 dB  
Hz  
kHz  
dB  
dB  
dB  
dB  
dB  
fro(h)  
high frequency roll-off  
20  
39  
40  
45  
45  
80  
Gv(cl)  
SVRR  
closed-loop voltage gain  
supply voltage ripple rejection  
40  
41  
on; notes 3 and 4  
on; notes 3 and 5  
mute; notes 3 and 6  
standby; notes 3  
and 6  
Zi  
input impedance  
50  
60  
75  
k  
Vn(o)(rms) noise output voltage (RMS value)  
note 7  
on; RS = 0   
on; RS = 10 k  
mute; note 8  
RS = 10 k  
150  
250  
120  
V  
V  
V  
dB  
dB  
500  
cs  
channel separation  
channel unbalance  
40  
Gv(ub)  
0.1  
1
BTL application (see Fig.7)  
Po  
output power  
note 1  
THD = 0.5 %  
THD = 10 %  
VP = 13.2 V; note 1  
THD = 0.5 %  
THD = 10 %  
Po = 1 W  
15  
20  
17  
22  
W
W
13  
W
W
%
17.5  
THD  
Bp  
total harmonic distortion  
power bandwidth  
0.1  
THD = 0.5 %;  
35 to 15000  
Hz  
Po = 1 dB; with  
respect to 15 W  
fro(l)  
low frequency roll-off  
high frequency roll-off  
closed-loop voltage gain  
1 dB; note 2  
1 dB  
45  
Hz  
fro(h)  
Gv(cl)  
20  
45  
kHz  
dB  
46  
47  
2004 Jan 28  
8
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
SYMBOL  
PARAMETER  
CONDITIONS  
on; notes 3 and 4  
on; notes 3 and 5  
mute; notes 3 and 6  
MIN.  
34  
TYP.  
MAX.  
UNIT  
dB  
SVRR  
supply voltage ripple rejection  
48  
48  
80  
dB  
dB  
dB  
standby;  
notes 3 and 6  
Zi  
input impedance  
25  
30  
38  
k  
Vn(o)(rms) noise output voltage (RMS value)  
note 7  
on; RS = 0   
on; RS = 10 k  
mute; note 8  
200  
350  
180  
V  
V  
V  
700  
Notes  
1. Output power is measured directly at the output pins of the device.  
2. Frequency response externally fixed.  
3. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V).  
4. Frequency f = 100 Hz.  
5. Frequency between 1 and 10 kHz.  
6. Frequency between 100 Hz and 10 kHz.  
7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.  
8. Noise output voltage independent of RS (Vi = 0 V).  
2004 Jan 28  
9
 
 
 
 
 
 
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
APPLICATION INFORMATION  
standby switch  
V
P
100 µF  
2200  
µF  
100  
nF  
3
8
7
input  
reference  
voltage  
internal  
1/2 V  
P
TDA1519C  
-
+
40 dB  
-
60 kW  
40 dB  
+
60 kW  
220 nF  
1
220 nF  
9
non-inverting input  
inverting input  
2
5
4
6
mgl493  
signal  
power  
ground ground  
1000  
µF  
Fig.6 Stereo application diagram (TDA1519C).  
standby switch  
V
P
2200  
µF  
100  
nF  
3
8
7
input  
reference  
voltage  
internal  
1/2 V  
P
TDA1519C  
-
+
40 dB  
-
60 kW  
40 dB  
+
60 kW  
220 nF  
1
9
non-inverting input  
to pin 9  
to pin 1  
2
5
4
6
mgl494  
signal  
ground ground  
power  
R
= 4 W  
L
Fig.7 BTL application diagram (TDA1519C).  
10  
2004 Jan 28  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
mgr539  
60  
I
q(tot)  
(mA)  
50  
40  
30  
0
4
8
12  
16  
20  
V
(V)  
P
Fig.8 Total quiescent current as a function of the supply voltage.  
mgr540  
30  
P
o
(W)  
20  
THD = 10%  
10  
0.5%  
0
0
4
8
12  
16  
20  
V
(V)  
P
BTL application.  
RL = 4 .  
fi = 1 kHz.  
Fig.9 Output power as a function of the supply voltage.  
11  
2004 Jan 28  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
mgr541  
12  
THD  
(%)  
8
4
0
-1  
2
10  
1
10  
10  
P
(W)  
o
BTL application.  
RL = 4 .  
fi = 1 kHz.  
Fig.10 Total harmonic distortion as a function of the output power.  
mgu377  
0.6  
THD  
(%)  
0.4  
0.2  
0
2
3
4
10  
10  
10  
10  
f (Hz)  
i
BTL application.  
RL = 4 .  
Po = 1 W.  
Fig.11 Total harmonic distortion as a function of the operating frequency.  
12  
2004 Jan 28  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
PACKAGE OUTLINES  
SIL9P: plastic single in-line power package; 9 leads  
SOT131-2  
non-concave  
x
D
h
D
E
h
view B: mounting base side  
d
A
2
B
E
j
A
1
b
L
c
1
9
e
Q
w
M
Z
b
p
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
max.  
b
max.  
1
(1)  
(1)  
(1)  
UNIT  
A
b
c
D
d
D
E
e
E
h
j
L
Q
w
x
Z
2
p
h
4.6  
4.4  
0.75  
0.60  
0.48  
0.38  
24.0  
23.6  
20.0  
19.6  
12.2  
11.8  
3.4  
3.1  
17.2  
16.5  
2.00  
1.45  
2.1  
1.8  
6
mm  
10  
2.54  
2
1.1  
0.25  
0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-17  
03-03-12  
SOT131-2  
2004 Jan 28  
13  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
SMS9P: plastic surface-mounted single in-line power package; 9 leads  
SOT354-1  
D
y
d
non-concave  
x
heatsink  
A
D
2
h
heatsink  
E
h
j
E
Q
A
1
L
L
p
c
9
1
θ
w
M
e
Z
b
p
(A )  
3
A
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
A
b
c
D
d
D
E
e
E
h
L
L
p
Q
w
x
y
Z
θ
j
1
2
3
p
h
4.9 0.35 4.6  
4.2 0.05 4.4  
0.75 0.48 24.0 20.0  
0.60 0.38 23.6 19.6  
12.2  
11.8  
3.4  
3.1  
7.4  
6.6  
3.4  
2.8  
2.1  
1.9  
2.00  
1.45  
3°  
0°  
6
mm  
10  
2.54  
0.25  
0.25 0.03 0.15  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
03-03-12  
06-03-16  
SOT354-1  
2004 Jan 28  
14  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
HSOP20: plastic, heatsink small outline package; 20 leads  
SOT397-1  
E
A
D
E
2
X
y
H
E
v
A
D
1
D
2
11  
20  
Q
A
E
2
1
A
pin 1 index  
(A )  
3
A
1
A
4
θ
L
p
1
10  
detail X  
Z
w
b
p
e
θ
°
8
0
0
5
10 mm  
°
scale  
Dimensions  
(1)  
(1)  
(1)  
Unit  
A
A
1
A
A
A
b
p
c
D
D
1
D
2
E
E
E
2
e
H
E
L
p
Q
v
w
y
z
2
3
4
1
max  
mm nom 3.6  
min  
0.3 3.5  
0.1 0.53 0.32 16.0 13.0 1.1 11.1 6.2 2.9  
14.5 1.1 1.5  
13.9 0.8 1.4  
2.5  
2.0  
0.35  
1.27  
0.25 0.25 0.1  
0.1 3.2  
0.0 0.40 0.23 15.8 12.6 0.9 10.9 5.8 2.5  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
sot397-1_po  
References  
Outline  
version  
European  
projection  
Issue date  
IEC  
JEDEC  
JEITA  
03-07-23  
10-10-21  
SOT397-1  
2004 Jan 28  
15  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height  
SOT418-3  
E
A
D
x
X
c
y
E
H
2
v
M
A
E
D
1
D
2
10  
1
pin 1 index  
Q
A
A
2
(A )  
3
E
1
A
4
θ
L
p
detail X  
20  
11  
w
M
Z
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
max.  
(1)  
(2)  
(2)  
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT  
2
3
4
p
1
2
2
8°  
0°  
+0.08 0.53 0.32  
−0.04 0.40 0.23  
13.0  
12.6  
6.2  
5.8  
2.9  
2.5  
1.1  
0.8  
1.7  
1.5  
2.5  
2.0  
16.0  
15.8  
1.1 11.1  
0.9 10.9  
14.5  
13.9  
3.5  
3.2  
1.27  
mm  
3.5  
0.35  
0.25 0.25 0.03 0.07  
Notes  
1. Limits per individual lead.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-02-12  
03-07-23  
SOT418-3  
2004 Jan 28  
16  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
SOLDERING  
Introduction  
cooling) vary between 100 and 200 seconds depending  
on heating method.  
Typical reflow peak temperatures range from  
215 to 270 C depending on solder paste material. The  
top-surface temperature of the packages should  
preferably be kept:  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “Data Handbook IC26; Integrated Circuit Packages”  
(document order number 9398 652 90011).  
below 225 C (SnPb process) or below 245 C (Pb-free  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mount components are mixed on  
one printed-circuit board. Wave soldering can still be used  
for certain surface mount ICs, but it is not suitable for fine  
pitch SMDs. In these situations reflow soldering is  
recommended. Driven by legislation and environmental  
forces the worldwide use of lead-free solder pastes is  
increasing.  
process)  
– for all the BGA, HTSSON..T and SSOP-T packages  
– for packages with a thickness Š 2.5 mm  
– for packages with a thickness < 2.5 mm and a volume  
350 mm3 so called thick/large packages.  
below 240 C (SnPb process) or below 260 C (Pb-free  
process) for packages with a thickness < 2.5 mm and a  
volume < 350 mm3 so called small/thin packages.  
Through-hole mount packages  
Moisture sensitivity precautions, as indicated on packing,  
must be respected at all times.  
SOLDERING BY DIPPING OR BY SOLDER WAVE  
Typical dwell time of the leads in the wave ranges from  
3 to 4 seconds at 250 C or 265 C, depending on solder  
material applied, SnPb or Pb-free respectively.  
WAVE SOLDERING  
Conventional single wave soldering is not recommended  
for surface mount devices (SMDs) or printed-circuit boards  
with a high component density, as solder bridging and  
non-wetting can present major problems.  
The total contact time of successive solder waves must not  
exceed 5 seconds.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg(max)). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
To overcome these problems the double-wave soldering  
method was specifically developed.  
If wave soldering is used the following conditions must be  
observed for optimal results:  
Use a double-wave soldering method comprising a  
turbulent wave with high upward pressure followed by a  
smooth laminar wave.  
MANUAL SOLDERING  
For packages with leads on two sides and a pitch (e):  
Apply the soldering iron (24 V or less) to the lead(s) of the  
package, either below the seating plane or not more than  
2 mm above it. If the temperature of the soldering iron bit  
is less than 300 C it may remain in contact for up to  
10 seconds. If the bit temperature is between  
– larger than or equal to 1.27 mm, the footprint  
longitudinal axis is preferred to be parallel to the  
transport direction of the printed-circuit board;  
– smaller than 1.27 mm, the footprint longitudinal axis  
must be parallel to the transport direction of the  
printed-circuit board.  
300 and 400 C, contact may be up to 5 seconds.  
Surface mount packages  
The footprint must incorporate solder thieves at the  
downstream end.  
REFLOW SOLDERING  
For packages with leads on four sides, the footprint must  
be placed at a 45angle to the transport direction of the  
printed-circuit board. The footprint must incorporate  
solder thieves downstream and at the side corners.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
Several methods exist for reflowing; for example,  
convection or convection/infrared heating in a conveyor  
type oven. Throughput times (preheating, soldering and  
2004 Jan 28  
17  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
dispensing. The package can be soldered after the adhesive is cured.  
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material  
applied, SnPb or Pb-free respectively.  
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.  
MANUAL SOLDERING  
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron  
applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated  
tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.  
Suitability of IC packages for wave, reflow and dipping soldering methods  
SOLDERING METHOD  
MOUNTING  
PACKAGE(1)  
WAVE  
REFLOW(2) DIPPING  
Through-hole mount CPGA, HCPGA  
suitable  
suitable  
DBS, DIP, HDIP, RDBS, SDIP, SIL  
PMFP(4)  
suitable(3)  
Through-hole-  
surface mount  
not suitable  
not suitable  
Surface mount  
BGA, HTSSON..T(5), LBGA, LFBGA, SQFP, not suitable  
SSOP-T(5), TFBGA, USON, VFBGA  
suitable  
suitable  
DHVQFN, HBCC, HBGA, HLQFP, HSO,  
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,  
HVQFN, HVSON, SMS  
not suitable(6)  
PLCC(7), SO, SOJ  
suitable  
suitable  
LQFP, QFP, TQFP  
not recommended(7)(8) suitable  
not recommended(9)  
SSOP, TSSOP, VSO, VSSOP  
CWQCCN..L(11), PMFP(10), WQCCN32L(11)  
suitable  
not suitable  
not suitable  
Notes  
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy  
from your NXP Semiconductors sales office.  
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum  
temperature (with respect to time) and body size of the package, there is a risk that internal or external package  
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the  
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.  
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.  
4. Hot bar soldering or manual soldering is suitable for PMFP packages.  
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account  
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature  
exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature  
must be kept as low as possible.  
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder  
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,  
the solder might be deposited on the heatsink surface.  
7. If wave soldering is considered, then the package must be placed at a 45angle to the solder wave direction.  
The package footprint must incorporate solder thieves downstream and at the side corners.  
2004 Jan 28  
18  
 
 
 
 
 
 
 
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not  
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than  
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
10. Hot bar or manual soldering is suitable for PMFP packages.  
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted  
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar  
soldering process. The appropriate soldering profile can be provided on request.  
2004 Jan 28  
19  
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
DATA SHEET STATUS  
DOCUMENT  
STATUS(1)  
PRODUCT  
STATUS(2)  
DEFINITION  
Objective data sheet  
Development  
This document contains data from the objective specification for product  
development.  
Preliminary data sheet  
Product data sheet  
Qualification  
Production  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Notes  
1. Please consult the most recently issued document before initiating or completing a design.  
2. The product status of device(s) described in this document may have changed since this document was published  
and may differ in case of multiple devices. The latest product status information is available on the Internet at  
URL http://www.nxp.com.  
DEFINITIONS  
Right to make changes NXP Semiconductors  
reserves the right to make changes to information  
published in this document, including without limitation  
specifications and product descriptions, at any time and  
without notice. This document supersedes and replaces all  
information supplied prior to the publication hereof.  
Product specification The information and data  
provided in a Product data sheet shall define the  
specification of the product as agreed between NXP  
Semiconductors and its customer, unless NXP  
Semiconductors and customer have explicitly agreed  
otherwise in writing. In no event however, shall an  
agreement be valid in which the NXP Semiconductors  
product is deemed to offer functions and qualities beyond  
those described in the Product data sheet.  
Suitability for use NXP Semiconductors products are  
not designed, authorized or warranted to be suitable for  
use in life support, life-critical or safety-critical systems or  
equipment, nor in applications where failure or malfunction  
of an NXP Semiconductors product can reasonably be  
expected to result in personal injury, death or severe  
property or environmental damage. NXP Semiconductors  
accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at  
the customer’s own risk.  
DISCLAIMERS  
Limited warranty and liability Information in this  
document is believed to be accurate and reliable.  
However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to  
the accuracy or completeness of such information and  
shall have no liability for the consequences of use of such  
information.  
Applications Applications that are described herein for  
any of these products are for illustrative purposes only.  
NXP Semiconductors makes no representation or  
warranty that such applications will be suitable for the  
specified use without further testing or modification.  
In no event shall NXP Semiconductors be liable for any  
indirect, incidental, punitive, special or consequential  
damages (including - without limitation - lost profits, lost  
savings, business interruption, costs related to the  
removal or replacement of any products or rework  
charges) whether or not such damages are based on tort  
(including negligence), warranty, breach of contract or any  
other legal theory.  
Customers are responsible for the design and operation of  
their applications and products using NXP  
Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or  
customer product design. It is customer’s sole  
responsibility to determine whether the NXP  
Notwithstanding any damages that customer might incur  
for any reason whatsoever, NXP Semiconductors’  
aggregate and cumulative liability towards customer for  
the products described herein shall be limited in  
accordance with the Terms and conditions of commercial  
sale of NXP Semiconductors.  
Semiconductors product is suitable and fit for the  
customer’s applications and products planned, as well as  
for the planned application and use of customer’s third  
party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks  
associated with their applications and products.  
2004 Jan 28  
20  
 
 
NXP Semiconductors  
Product specification  
22 W BTL or 2 11 W  
stereo power amplifier  
TDA1519C  
NXP Semiconductors does not accept any liability related  
to any default, damage, costs or problem which is based  
on any weakness or default in the customer’s applications  
or products, or the application or use by customer’s third  
party customer(s). Customer is responsible for doing all  
necessary testing for the customer’s applications and  
products using NXP Semiconductors products in order to  
avoid a default of the applications and the products or of  
the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this  
respect.  
Export control This document as well as the item(s)  
described herein may be subject to export control  
regulations. Export might require a prior authorization from  
national authorities.  
Quick reference data The Quick reference data is an  
extract of the product data given in the Limiting values and  
Characteristics sections of this document, and as such is  
not complete, exhaustive or legally binding.  
Non-automotive qualified products Unless this data  
sheet expressly states that this specific NXP  
Semiconductors product is automotive qualified, the  
product is not suitable for automotive use. It is neither  
qualified nor tested in accordance with automotive testing  
or application requirements. NXP Semiconductors accepts  
no liability for inclusion and/or use of non-automotive  
qualified products in automotive equipment or  
applications.  
Limiting values Stress above one or more limiting  
values (as defined in the Absolute Maximum Ratings  
System of IEC 60134) will cause permanent damage to  
the device. Limiting values are stress ratings only and  
(proper) operation of the device at these or any other  
conditions above those given in the Recommended  
operating conditions section (if present) or the  
Characteristics sections of this document is not warranted.  
Constant or repeated exposure to limiting values will  
permanently and irreversibly affect the quality and  
reliability of the device.  
In the event that customer uses the product for design-in  
and use in automotive applications to automotive  
specifications and standards, customer (a) shall use the  
product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and  
specifications, and (b) whenever customer uses the  
product for automotive applications beyond NXP  
Semiconductors’ specifications such use shall be solely at  
customer’s own risk, and (c) customer fully indemnifies  
NXP Semiconductors for any liability, damages or failed  
product claims resulting from customer design and use of  
the product for automotive applications beyond NXP  
Semiconductors’ standard warranty and NXP  
Terms and conditions of commercial sale NXP  
Semiconductors products are sold subject to the general  
terms and conditions of commercial sale, as published at  
http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an  
individual agreement is concluded only the terms and  
conditions of the respective agreement shall apply. NXP  
Semiconductors hereby expressly objects to applying the  
customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Semiconductors’ product specifications.  
No offer to sell or license Nothing in this document  
may be interpreted or construed as an offer to sell products  
that is open for acceptance or the grant, conveyance or  
implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
2004 Jan 28  
21  
NXP Semiconductors  
provides High Performance Mixed Signal and Standard Product  
solutions that leverage its leading RF, Analog, Power Management,  
Interface, Security and Digital Processing expertise  
Customer notification  
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal  
definitions and disclaimers. No changes were made to the technical content, except for package outline  
drawings which were updated to the latest version.  
Contact information  
For additional information please visit: http://www.nxp.com  
For sales offices addresses send e-mail to: salesaddresses@nxp.com  
© NXP B.V. 2011  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
RA2/04/pp22  
Date of release: 2004 Jan 28  

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