TDA2555 [NXP]
Dual TV sound demodulator circuits; 双通道电视伴音解调器电路
| 型号： | TDA2555 |
| 厂家： | 
NXP |
| 描述： | Dual TV sound demodulator circuits |
| 文件： | 总10页 (文件大小：66K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA2555
TDA2557
Dual TV sound demodulator circuits
March 1986
Product specification
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
GENERAL DESCRIPTION
The circuits incorporate two FM demodulator systems to perform the demodulator functions required in a dual sound
carrier TV system for demodulating the sound carriers.
The difference between TDA2555 and TDA2557 is the number of stages of the limiting amplifier.
• Eight (TDA2555) or five (TDA2557) stage limiting amplifier
• Quadrature demodulator for FM detection
• De-emphasis stage
• Output amplifier
• Mute function for each FM demodulator
QUICK REFERENCE DATA
Supply voltage (pins 13 and 15)
Supply current (pins 13 and 15)
AF output voltage (pins 2 and 8)
Total harmonic distortion (note 1)
Signal to weighted noise ratio
VP
typ.
typ.
typ.
<
12
V
IP
24,5
600
0,1
70
mA
mV
%
Vo(rms)
THD
(S + N)/N
typ.
dB
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 19.
March 1986
2
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
Fig.1 Block diagram.
TDA2555 with 8-stage limiting amplifier;
TDA2557 with 5-stage limiting amplifier.
March 1986
3
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pins 13 and 15)
Total power dissipation
VP
max. 13,2
max. 400
V
Ptot
Tstg
Tamb
mW
Storage temperature range
Operating ambient temperature
−40 to + 150 °C
0 to + 70 °C
March 1986
4
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
CHARACTERISTICS
VP = V13, 15-14 = 12 V; Tamb = 25 °C; fIF1 = 5,5 MHz; fIF2 = 5,74 MHz; fm1 = 1 kHz; ∆f =± 30 kHz;
Vi(rms) = 5 mV for TDA2555;
Vi(rms) = 10 mV for TDA2557;
see test circuit Fig.3, voltages with respect to ground (pin 14), unless otherwise specified.
PARAMETER
Total current consumption
LIMITING AMPLIFIER
Maximum input voltage
SYMBOL
I13, 15
MIN.
TYP.
MAX.
UNIT
18
24,5
200
30
mA
V11-12(rms)
V16-17(rms)
−
−
mV
Input voltage for start of limiting
(3 dB AF signal reduction)
TDA2555
TDA2557
DC voltage
V11-12(rms)
V16-17(rms)
V11-12(rms)
V16-17(rms)
−
−
50
100
500
µV
µV
250
(input limiting amplifier) pins
11, 12, 16, 17 to 14
Vi
−
2,0
−
V
DC voltage
(feedback loop)
V10,18-14
−
−
2,0
−
−
V
FM DEMODULATOR
IF reference signal voltage
V3-4(rms)
V6-7(rms)
V3,4,6,7-14
V2-14(rms)
200
mV
DC voltage
−
3,1
−
V
AF output voltage
Difference of output signals
450
−
600
750
± 0,5
mV
dB
± 0,1
V2 – 14
---------------
V8 – 14
Total harmonic distortion
at outputs AF1 and AF2 (note 1)
A.M. suppression
THD
−
−
−
0,5
%
at outputs AF1 and AF2, fFM = 70 Hz; AMS
50
−
dB
∆f = ± 50 kHz; fAM = 1 kHz; m = 0,3
Signal to noise ratio
at outputs AF1 and AF2
(S + N)/N
65
70
−
dB
(CCIR weighted, quasi peak)
Residual IF-signal
without de-emphasis
Ripple rejection
V2,8-14(rms)
−
−
30
40
−
−
mV
dB
at outputs AF1 and AF2
RR
f = 50 Hz to 20 kHz; Vi(rms) = 200 mV
March 1986
5
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
AUDIO OUTPUT STAGE
emitter follower with 1,0 mA bias current
DC output voltage
V2,8-14
3,0
2
4,0
−
5,0
−
V
External DC load resistance
AC output current (note 2)
De-emphasis input resistance (note 3)
DC voltage (de-emphasis)
Crosstalk attenuation
R2,8-14
kΩ
mA
kΩ
V
−I2,8-14(p-p)
R1,9-14
−
−
0,5
1,2
5,7
0,8
3,7
1,0
4,7
V1,9-14
f = 1 kHz (note 4)
α12,21
60
−
−
dB
Crosstalk attenuation
f = 10 kHz (note 4)
α12,21
60
−
−
−
dB
Output impedance
R2,8-14
−
25
Ω
AF output level (Fig.2, note 5)
MUTE function
Vi(rms) < 60 mV
α
60
−
−
dB
Switching input current
V5-14 = 0 V
−I5
−
−
−
−
500
500
µA
µA
V5-14 = VP
I5
Internal d.c. voltage
no mute (pin 5 not connected)
V5-14
−
6,2
−
V
Notes to the characteristics
1. THD < 0,1% requires a double tuned demodulator circuit (QL = 20). With a single tuned circuit a THD of < 0,5% is
possible (see Fig.1 and Fig.3).
2. If higher a.c. output current is required an external resistor must be applied from output (pins 2 and 8) to ground
(min. 2 kΩ) in order to improve the THD performance (−I2,8 < 4 mA).
3. The de-emphasis time constant is 50 µs.
V2 – 14unmodulated
V8 – 14unmodulated
.
4. Crosstalk attenuation is defined as: o12
=
o 21 =
------------------------------------------------------
V8 – 14
------------------------------------------------------
V2 – 14
5. In the MUTE state the a.f. output level attenuation is more than 60 dB. The MUTE function is only guaranteed for an
r.m.s. value of the input voltage lower than 60 mV. See also Fig.2.
March 1986
6
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
Fig.2 Mute function.
March 1986
7
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
Fig.3 Test and application circuit.
March 1986
8
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
18
10
M
H
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
0.85
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
0.15
0.13
0.32
0.31
0.37
0.33
inches
0.19
0.020
0.15
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-10-14
95-01-23
SOT102-1
March 1986
9
Philips Semiconductors
Product specification
TDA2555
TDA2557
Dual TV sound demodulator circuits
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1986
10
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