TDA2611AU [NXP]
IC 6 W, 1 CHANNEL, AUDIO AMPLIFIER, PSFM9, PLASTIC, SOT-110B, SIP-9, Audio/Video Amplifier;
| 型号： | TDA2611AU |
| 厂家： | 
NXP |
| 描述： | IC 6 W, 1 CHANNEL, AUDIO AMPLIFIER, PSFM9, PLASTIC, SOT-110B, SIP-9, Audio/Video Amplifier 商用集成电路 放大器 功率放大器 |
| 文件： | 总13页 (文件大小：255K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA2611A
5 W audio power amplifier
November 1982
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
The TDA2611A is a monolithic integrated circuit in a 9-lead single in-line (SIL) plastic package with a high supply voltage
audio amplifier. Special features are:
• possibility for increasing the input impedance
• single in-line (SIL) construction for easy mounting
• very suitable for application in mains-fed apparatus
• extremely low number of external components
• thermal protection
• well defined open loop gain circuitry with simple quiescent current setting and fixed integrated closed loop gain.
QUICK REFERENCE DATA
Supply voltage range
V
6 to 35 V
1,5 A
P
Repetitive peak output current
I
<
ORM
Output power at d = 10%
tot
V = 18 V; R = 8 Ω
P
P
typ.
typ.
typ.
typ.
typ.
typ.
4,5 W
5 W
P
L
o
V = 25 V; R = 15 Ω
P
L
o
Total harmonic distortion at P < 2 W; R = 8 Ω
d
0,3 %
45 kΩ
25 mA
55 mV
o
L
tot
Input impedance
Total quiescent current at V = 18 V
|Z |
i
I
P
tot
Sensitivity for P = 2,5 W; R = 8 Ω
V
o
L
i
Operating ambient temperature
Storage temperature
T
T
−25 to + 150 °C
−55 to + 150 °C
amb
stg
PACKAGE OUTLINE
9-lead SIL; plastic (SOT110B); SOT110-1; 1996 July 23.
November 1982
2
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.1 Circuit diagram; pin 3 not connected.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage
V
max.
35 V
3 A
P
Non-repetitive peak output current
Repetitive peak output current
Total power dissipation
I
I
max.
max.
OSM
ORM
1,5 A
see derating curves Fig. 2
Storage temperature
T
T
−55 to + 150 °C
−25 to + 150 °C
stg
Operating ambient temperature
amb
November 1982
3
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.2 Power derating curves.
HEATSINK EXAMPLE
Assume V = 18 V; R = 8 Ω; T
= 60 °C maximum; T = 150 °C (max. for a 4 W application into an 8 Ω load, the
j
P
L
amb
maximum dissipation is about 2,2 W).
The thermal resistance from junction to ambient can be expressed as:
150 – 60
Rth j-a = Rth j-tab + Rth tab-h + Rth h-a
=
= 41 K/W.
----------------------
2, 2
Since R
= 11 K/W and R
= 1 K/W, R = 41 − (11 + 1) = 29 K/W.
th h-a
th j-tab
th tab-h
November 1982
4
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
D.C. CHARACTERISTICS
Supply voltage range
V
6 to 35 V
P
Repetitive peak output current
I
I
<
1,5 A
ORM
tot
Total quiescent current at V = 18 V
typ.
25 mA
P
A.C. CHARACTERISTICS
T
= 25 °C; V = 18 V; R = 8 Ω; f = 1 kHz unless otherwise specified; see also Fig. 3
P L
amb
A.F. output power at d = 10%
tot
>
4 W
4,5 W
1,7 W
0,65 W
6 W
V = 18 V; R = 8 Ω
P
P
L
o
typ.
typ.
typ.
typ.
typ.
typ.
<
V = 12 V; R = 8 Ω
P
P
P
P
P
L
o
o
o
o
V = 8,3 V; R = 8 Ω
P
L
V = 20 V; R = 8 Ω
P
L
V = 25 V; R = 15 Ω
5 W
P
L
0,3 %
1 %
Total harmonic distortion at P = 2 W
d
tot
o
Frequency response
Input impedance
>
15 kHz
(1)
|Z |
typ.
typ.
<
45 kΩ
0,2 mV
0,5 mV
55 mV
i
Noise output voltage at R = 5 kΩ; B = 60 Hz to 15 kHz
V
S
n
i
typ.
Sensitivity for P = 2,5 W
V
o
44 to 66 mV
Note
1. Input impedance can be increased by applying C and R between pins 5 and 9 (see also Figures 6 and 7).
November 1982
5
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.3 Test circuit; pin 3 not connected.
Fig.4 Total harmonic distortion as a function of output power.
November 1982
6
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.5 Output power as a function of supply voltage.
Fig.6 Input impedance as a function of frequency; curve a for C = 1 µF, R = 0 Ω; curve b for
C = 1 µF, R = 1 kΩ; circuit of Fig. 3; C2 = 10 pF; typical values.
November 1982
7
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.7 Input impedance as a function of R in circuit of Fig. 3; C = 1 µF; f = 1 kHz.
Fig.8 Total harmonic distortion as a function of R in the circuit of Fig. 3; P = 3,5 W; f = 1 kHz.
S
o
November 1982
8
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.9 Total power dissipation and efficiency as a function of output power.
November 1982
9
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
APPLICATION INFORMATION
Fig.10 Ceramic pickup amplifier circuit.
Fig.11 Total harmonic distortion as a function of output power;
with tone control;
− − − without tone control; in circuit of Fig. 10; typical values.
November 1982
10
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.12 Frequency characteristics of the circuit of Fig. 10;
tone control max. high;
− − − tone control min. high; P relative to 0 dB = 3 W; typical values.
o
Fig.13 Frequency characteristic of the circuit of Fig. 10; volume control at the top; tone control max. high.
November 1982
11
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
November 1982
12
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
SOLDERING
Introduction
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1982
13
相关型号：
TDA2615U
IC 8 W, 2 CHANNEL, AUDIO AMPLIFIER, PSFM9, POWER, PLASTIC, SOT-110-1, SIP-9, Audio/Video Amplifier
NXP
TDA2616Q/N1
IC 15 W, 2 CHANNEL, AUDIO AMPLIFIER, PSIP9, PLASTIC, SIL-BENT-DIL, 9 PIN, Audio/Video Amplifier
NXP
TDA2616U
IC 15 W, 2 CHANNEL, AUDIO AMPLIFIER, PSIP9, POWER, PLASTIC, SOT-131-2, SIP-9, Audio/Video Amplifier
NXP
©2020 ICPDF网 联系我们和版权申明