TDA2654 [NXP]
Vertical deflection circuit; 垂直挠度电路
| 型号： | TDA2654 |
| 厂家： | 
NXP |
| 描述： | Vertical deflection circuit |
| 文件： | 总12页 (文件大小：111K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA2654
Vertical deflection circuit
November 1982
Product specification
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
DESCRIPTION
The TDA2654 is a monolithic integrated circuit for vertical deflection in monochrome and tiny-vision colour television
receivers.
The circuit incorporates the following functions:
• Oscillator
• Synchronization circuit
• Blanking pulse generator
• Sawtooth generator
• S-correction and linearity circuit
• Comparator and drive circuit
• Output stage
• Flyback dissipation limiting circuit
• Supply for pre-stages via internal voltage divider
• Thermal protection circuit
• Controlled switch-on
QUICK REFERENCE DATA
Supply voltage range (ref. to tab = ground)
Output current (peak-to-peak value)
Total power dissipation
VP
10 to 35
max. 2
max. 5
V
I9(p-p)
Ptot
A
W
Operating junction temperature
Tj
max. 150 °C
= 12 °C/W
Thermal resistance from junction to tab
Rth j-tab
PACKAGE OUTLINE
9-lead SIL; plastic (SOT110B); SOT110-1; 1996 November 20.
November 1982
2
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
November 1982
3
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
All voltages and currents refer to the tab (ground) connection.
Voltages
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
V2
max.
max.
max.
max.
max.
max.
max.
5
V
V
V
V
V
V
V
V3
17
17
6
V4
V5
V6
13
18
35
V7
V8 (VP)
Currents
Pin 1
+I1
−I1
I2
max.
max.
max.
max.
max.
max.
max.
max.
max.
max.
1
mA
mA
mA
mA
mA
mA
mA
A
5
Pin 2
2,5
30
30
1
Pin 3
I3
Pin 4
I4
Pin 5
±I5
±I6
±I9
±I9
Ptot
Tstg
Tj
Pin 6
3
Pin 9 (repetitive)
1
Pin 9 (non-repetitive)
Total power dissipation (see also Fig.2)
Storage temperature
Operating junction temperature
1,5
5
A
W
−25 to + 150 °C
max. 150 °C
November 1982
4
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
Fig.2 Total power dissipation. The graph takes into account an Rth tab-h = 1 °C/W which is to be expected when
the tab is connected to a heatsink with one 3 mm bolt, without using heatsink compound. Rth j-tab = 12 °C/W.
November 1982
5
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified; voltages and currents ref. to tab (ground)
monochrome tiny-vision
(Fig.3)
25
colour (Fig.4)
Supply voltage (pin 8)
VP
typ.
typ.
typ.
typ.
typ.
typ.
typ.
typ.
typ.
typ.
typ.
typ.
typ.
>
31
V
Supply current (pin 8)
IP
165
3,1
150
3,5
mA
W
Total power dissipation
Ptot
V9(p-p)
V1
Output voltage (peak-to-peak value)
Blanking pulse; I1 = 1 mA
Blanking pulse duration
22
28
V
11,5
1,3
14,5
1,4
V
tp
ms
V
D.C. input voltage (pin 6)
Deflection current (peak-to-peak value)
Flyback time
V6
3,4
4,4
I9(p-p)
t
1,1
0,92
1,32
46
A
1,3
ms
Hz
Hz/°C
Hz/V
%
Free running oscillator frequency
Oscillator thermal drift
fosc
46
−0,01
−0,13
18
−0,01
−0,12
18
Oscillator voltage shift
Tracking range oscillator
Synchronization input voltage
Voltage divider ratio
V2
1
1
V
V7/V8
R7
typ.
typ.
0,52
2,8
0,52
2,8
Input resistance pin 7
kΩ
Recommended thermal resistance
of heatsink for Tamb up to 70 °C
Rth h-a
<
13
10
°C/W
PINNING
1. Blanking pulse output
2. Synchronization input
3. Oscillator timing network
4. Sawtooth generator
5. S-correction and linearity control
6. Feedback input
7. Voltage divider
8. Positive supply
9. Output
Tab. Negative supply (ground)
November 1982
6
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
APPLICATION INFORMATION (see also Fig.1)
The function is described against the corresponding pin number
1. Blanking pulse output
When the IC is adjusted on a free running frequency of 46 Hz the internal blanking pulse generator delivers a blanking
pulse with a duration between 1,2 ms and 1,5 ms. The circuit is, however, made such that when the flyback time of
the deflection current is longer, the blanking pulse corresponds to the flyback time. The output voltage is also high
when the voltage at pin 9 is lower than nominal 5 V. An external blanking circuit is recommended when tiny-vision
receivers are operated from a car-battery.
2. Synchronization input
The oscillator has to be synchronized by a positive-going pulse. The circuit is made such that synchronization is
inhibited during the flyback time.
3. Oscillator
The oscillator frequency is set by the potentiometer P1 and resistor R2 between pins 3 and 7 and capacitor C1
between pin 3 and ground. For 50 Hz systems the free running frequency is preferably adjusted to 46 Hz.
4. Sawtooth generator
This pin supplies the charging and discharging currents of the capacitor between pin 4 and ground (C2).
5. S-correction and linearity control
The amount of S-correction can be set by the value of C3. For 110° deflection coils, e.g. AT1040/15, a capacitor of
15 µF will give the right value for S-correction. For 90° deflection systems (e.g. AT1235/00) a nearly linear deflection
current is required, this can be achieved by increasing C3 to 100 µF. The linearity can be adjusted by
potentiometer P2.
6. Output current feedback
To this pin is applied a part of the output current measured across R6 and superimposed on a d.c. voltage derived
from the voltage across the output coupling capacitor. This signal is compared with the internal reference sawtooth.
The internal reference sawtooth has an amplitude of about 0,6 V peak to peak and a d.c. level of about 3,4 V, for a
supply voltage of 25 V at pin 8.
7. Internal voltage divider decoupling
The voltage on this pin is about half the supply voltage at pin 8 and is applied to the bases of emitter followers
supplying the pre-stages of the IC. This voltage controls the amplitude of the internal reference sawtooth. In this way
tracking with the line deflection system is achieved when the supply voltage at pin 8 is derived from the line output
transformer.
8. Positive supply
The value depends on the deflection coil.
9. Output
The deflection coil is connected to ground via coupling capacitor C9 and current sensing resistor R6. The line
frequency superimposed on the output voltage may be too high due to the current feedback system. The line
frequency ripple can be decreased by connecting a resistor across the deflection coil. The flyback time can be
influenced by the resistor divider (R4, R5) for the d.c. feedback to pin 6. It should be noted that the output voltage
shows a negative swing of about 1 V during the first (positive current) part of the flyback.
November 1982
7
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
Tab
The tab is used as negative supply (ground) connection. Therefore, the tab should be well connected to the negative side
of the power supply.
Controlled switch-on
This feature is achieved by charging the a.c. coupling capacitor (C4; connected to pin 6) from an internal current source
of about 2 mA (voltage limited to maximum 15 V) for a short period after switch-on. The charging time can be influenced
by the value of C5 (connected to pin 7). Discharging of C4 results in a slowly increasing deflection current after a delay
of about 1 second. The blanking voltage at pin 1 is high during this delay.
November 1982
8
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
November 1982
9
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
November 1982
10
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
November 1982
11
Philips Semiconductors
Product specification
Vertical deflection circuit
TDA2654
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1982
12
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