TDA3616 [NXP]
Multiple voltage regulator with battery detection; 带电池检测多个稳压器
| 型号： | TDA3616 |
| 厂家： | 
NXP |
| 描述： | Multiple voltage regulator with battery detection |
| 文件： | 总20页 (文件大小：98K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA3616
Multiple voltage regulator with
battery detection
Objective specification
2000 Jan 14
Supersedes data of 1998 Jul 22
File under Integrated Circuits, IC01
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
FEATURES
General
GENERAL DESCRIPTION
The TDA3616 is a low power voltage regulator. It contains
the following:
• One VP-state controlled regulator
• Battery detection circuit
• One fixed voltage regulator with a foldback current
protection, intended to supply a microprocessor, that
also operates during load dump
• Regulator, reset and battery outputs operate during load
dump
• A provision for use of a reserve supply capacitor that will
hold enough energy for the regulator to allow a
microcontroller to prepare for loss of supply voltage
• Supply voltage range from −18 to +50 V
• Low quiescent current (battery detection switched off)
• High ripple rejection
• Reset signals which can be used to interface with the
microprocessor
• Dual reset output
• A supply pin that can withstand load dump pulses and
negative supply voltages
• Backup circuit
• Adjustable reset delay timer.
• Defined start-up behaviour; regulator will be switched on
at a supply voltage higher than 7.5 V and off when the
output voltage of the regulator drops below 2.4 V.
Protections
• Reverse polarity safe (down to −18 V without high
reverse current)
• Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
• ESD protected on all pins
• Load dump protection
• Foldback current limit protection for regulator
• The regulator output is DC short-circuited safe to ground
and VP.
QUICK REFERENCE DATA
SYMBOL
Supply
VP
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
supply voltage
operating
regulator on
5.6
14.4
25
V
jump start
t ≤ 10 minutes
−
−
−
−
−
30
V
load dump protection
quiescent supply current
t ≤ 50 ms; tr ≥ 2.5 ms
standby mode
standby mode; Tamb = 25 °C
−
50
V
Iq
95
95
125
120
µA
µA
Regulator
Vo
output voltage
0.5 mA ≤ IREG ≤ 150 mA;
4.8
4.75
4.75
−
5.0
5.0
5.0
0.6
5.2
V
V
V
V
7 V ≤ VP ≤ 18 V; Tamb = 25 °C
0.5 mA ≤ IREG ≤ 150 mA;
7 V ≤ VP ≤ 18 V
5.25
5.25
1.0
IREG = 30 mA;
18 V ≤ VP ≤ 50 V; load dump
Vdrop
drop-out voltage
IREG = 150 mA; VP = 5 V;
Tamb = 25 °C
2000 Jan 14
2
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA3616T
SO20
plastic small outline package; 20 leads; body width 7.5 mm
plastic single in-line medium power package with fin; 9 leads
SOT163-1
SOT110-1
TDA3616SF
SIL9MP
BLOCK DIAGRAM
(14.4 V) 17 (4)
(5) 18
(3) 16
BACKUP SWITCH
V
P
BU
LOAD DUMP
PROTECTION
REG
REGULATOR
REFERENCE
3.1
kΩ
2, 3, 8, 9,
12, 13, 19
(1) 14
(2) 15
7
4
RES2
RES1
n.c.
i.c.
1, 10,
11, 20
&
47 kΩ
6 (8)
3.1
kΩ
V
C
TDA3616T
REG
4 (6)
(7) 5
BATTERY
BUFFER
V
V
O(bat)
I(bat)
7 (9)
GND
MGL933
The pin numbers given in parenthesis refer to the TDA3616SF version.
Fig.1 Block diagram.
3
2000 Jan 14
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
PINNING
PIN
SYMBOL
DESCRIPTION
SOT163-1
SOT110-1
i.c.
1, 10, 11, and 20
−
−
interconnected; heat spreader; note 1
not connected; heat spreader
n.c.
2, 3, 8, 9, 12, 13
and 19
VI(bat)
VO(bat)
VC
4
5
6
7
8
9
1
2
3
4
5
battery input voltage
battery detection output voltage
reset delay capacitor
ground (0 V)
6
GND
RES2
RES1
REG
VP
7
14
15
16
17
18
reset 2 output
reset 1 output
regulator output
supply voltage
BU
backup
Note
1. The i.c. pins are connected to each other by the leadframe and can be kept floating or can be connected to ground.
handbook, halfpage
i.c.
n.c.
n.c.
20 i.c.
19
1
2
handbook, halfpage
RES2
RES1
REG
1
2
3
4
5
6
7
8
9
n.c.
18 BU
3
V
V
P
17
4
I(bat)
V
P
V
16 REG
5
O(bat)
TDA3616T
BU
TDA3616SF
V
C
6
15 RES1
V
I(bat)
RES2
GND
n.c.
n.c.
i.c.
7
14
V
O(bat)
8
13 n.c.
V
C
n.c.
i.c.
9
12
11
GND
10
MGL930
MGR093
The i.c. and n.c. pins can be connected to a heat spreader.
Fig.2 Pin configuration (SOT163-1).
Fig.3 Pin configuration (SOT110-1).
2000 Jan 14
4
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
FUNCTIONAL DESCRIPTION
The charge of the backup capacitor can be used to supply
the regulator and logic circuits for a short period of time
when the supply falls to 0 V (the time depends on the value
of the storage capacitor). The regulator is switched off at a
backup voltage of approximately 2.7 V. From this time
onwards, the backup charge will only be used for
maintaining reset functions. Due to this, the reset outputs
will remain LOW until the output of the regulator is dropped
to 0 V.
The TDA3616 (see Fig.1) is a voltage regulator intended
to supply a microprocessor (e.g. in car radio applications).
Because of low-voltage operation of the application, a
low-voltage drop regulator is used.
This regulator will switch-on when the backup voltage
(see Section “Backup circuit”) exceeds 7.5 V for the first
time and will switch-off again when the output voltage of
the regulator drops below 2.4 V. When the regulator is
switched on, the RES1 and RES2 outputs (RES2 can only
be HIGH when RES1 is HIGH) will go HIGH after a fixed
delay time (fixed by an external delay capacitor) to
generate a reset to the microprocessor.
All output pins are fully protected. The regulator is
protected against load dump and short-circuit (foldback
current protection). At load dump, the battery detection
circuit will remain operating.
Interfacing with the microprocessor can be accomplished
by means of a battery Schmitt trigger and output buffer
(simple full/semi on/off logic applications). The battery
output will go HIGH when the battery input voltage
exceeds the high threshold level.
Pin RES1 will go HIGH via an internal pull-up resistor of
3.1 kΩ, and is used to initialize the microprocessor.
Pin RES2 is used to indicate that the regulator output
voltage is within its voltage range. This start-up feature is
built-in to secure a smooth start-up of the microprocessor
at first connection, without uncontrolled switching of the
regulator during the start-up sequence.
The timing diagrams are shown in Fig.4.
V
P
18 V
V
BU
4.75 V
regulator
2.4 V
reset 2
reset 1
reset delay
capacitor
2 V
2 V
2.05 V
1.95 V
battery input
battery output
MGR095
Fig.4 Timing diagrams.
5
2000 Jan 14
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VP
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
supply voltage
operating
regulator on
−
−
−
−
−
−
25
V
V
V
V
V
V
jump start
t ≤ 10 minutes
30
load dump protection
t ≤ 50 ms; tr ≥ 2.5 ms
non-operating
50
Vrp
reverse polarity voltage
−18
50
VI(bat)p
VI(bat)n
positive pulse voltage at battery input
negative pulse voltage at battery input
VP = 14.4 V; RI = 5 kΩ
VP = 14.4 V; RI = 10 kΩ;
−100
Cl = 1 nF
Ptot
Tstg
Tamb
Tj
total power dissipation
storage temperature
ambient temperature
junction temperature
VP = 12.4 V
non-operating
operating
−
2.5
W
−55
−40
−40
+150
+105
+150
°C
°C
°C
operating
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-p)
thermal resistance from junction to pin/tab
TDA3616T
20
12
K/W
K/W
TDA3616SF
Rth(j-a)
thermal resistance from junction to ambient
TDA3616T
10 cm2 2-sided copper
area connected to pins
50
50
K/W
K/W
TDA3616SF
in free air
QUALITY SPECIFICATION
Quality specification in accordance with “SNW-FQ-611E”.
2000 Jan 14
6
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
CHARACTERISTICS
VP = 14.4 V; IREG = 0.5 mA; −40 °C < Tamb < +105 °C; measurements taken in test circuit of Fig.7; unless otherwise
specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Supply
VP
supply voltage
operating
regulator on; note 1
5.6
14.4
−
25
30
50
120
125
−
V
jump start
t ≤ 10 minutes
−
−
−
−
−
−
V
load dump protection
quiescent supply current
t ≤ 50 ms; tr ≥ 2.5 ms
VP = 12.4 V; Tamb = 25 °C; note 2
VP = 12.4 V; note 2
−
V
Iq
95
95
100
5
µA
µA
µA
mA
VP = 14.4 V; note 2
VP = 50 V; load dump
20
Schmitt trigger for regulator and reset 1
Vth(r)
Vth(f)
rising threshold voltage
falling threshold voltage
RL(REG) = 1 kΩ
IREG = 5 mA
6.2
2.1
−
7.5
2.4
2.25
5.1
8.1
2.7
−
V
V
V
V
IREG = 30 mA
Vhys
hysteresis voltage
−
−
Schmitt trigger for battery detection
Vth(r)
Vth(f)
Vhys
rising threshold voltage
falling threshold voltage
hysteresis voltage
Tamb = 25 °C
Tamb = 25 °C
2.0
2.0
1.9
1.9
−
2.1
2.1
2.0
2.0
0.1
2.2
2.25
2.1
2.15
−
V
V
V
V
V
Schmitt trigger for reset 2
Vth(r)
Vth(f)
Vhys
rising threshold voltage
note 3
note 3
4.55
4.5
−
4.8
4.75
0.05
0
5.05
5.0
−
V
falling threshold voltage
hysteresis voltage
V
V
∆Vtrack
voltage tracking with VREG
Isink = 0 mA; note 4
−65
+65
mV
Reset 1 and reset 2 buffers
Isink(L)
LOW-level sink current
V
RES ≤ 0.5 V; note 3
2
15
−
mA
kΩ
kΩ
Rpu(int)
internal pull-up resistance
Tamb = 25 °C
2.2
1.9
3.1
3.1
4.0
4.6
Reset delay
Rpu(int)
Vth(r)
td
internal pull-up resistance
rising threshold voltage
delay time
Tamb = 25 °C; note 5
−
47
−
kΩ
V
1.4
−
2.0
2.6
2.8
−
Cd = 100 nF; note 6; see Fig.9
ms
Battery buffer
VOL
VOH
IOL
LOW-level output voltage
II = 0 mA
0
0.05
5.0
0.5
12
0.5
5.2
−
V
HIGH-level output voltage
LOW-level output current
HIGH-level output current
Io = 5 µA; note 7
−
V
VOL ≤ 0.5 V
0.2
1
mA
mA
IOH
VOH ≥ 4 V; see Fig.6
−
2000 Jan 14
7
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Regulator (IREG = 5 mA; unless otherwise specified)
Vo
output voltage
0.5 mA ≤ IREG ≤ 150 mA;
7 V ≤ VP ≤ 18 V; Tamb = 25 °C
4.8
5.0
5.0
5.0
5.2
V
V
V
0.5 mA ≤ IREG ≤ 150 mA;
7 V ≤ VP ≤ 18 V
4.75
4.75
5.25
5.25
I
REG = 30 mA; 18 V ≤ VP ≤ 50 V;
load dump
Io
output current
VP > 25 V; load dump
7 V ≤ VP ≤ 18 V
−
−
−
−
3
−
100
50
mA
mV
mV
∆VLN
∆VL
line voltage regulation
load voltage regulation
0.5 mA ≤ IREG ≤ 150 mA;
Tamb = 25 °C
70
0.5 mA ≤ IREG ≤ 150 mA
−
−
85
−
mV
dB
V
SVRR
Vdrop
supply voltage ripple rejection
drop-out voltage
fi = 200 Hz; Vi = 2 V (p-p); Io = 5 mA 55
60
0.6
IREG = 150 mA; VP = 5 V;
−
1.0
Tamb = 25 °C; note 8
IREG = 150 mA; VP = 5.5 V; note 8
VREG > 4.5 V; VP > 10 V; note 9
−
0.9
0.6
80
1.2
1
V
Il
current limit
0.25
40
A
Isc
short-circuit current
RL(REG) ≤ 0.5 Ω; Tamb = 25 °C;
−
mA
note 10
Backup switch
IDC DC continuous current
Ir reverse current
VBU > 5 V; note 11
0.1
0.2
−
A
VP = 0 V; VBU = 12.4 V
−
−
200
µA
Notes
1. Minimum operating voltage, only if VP has exceeded 7.5 V.
2. The quiescent current is measured in standby mode. Therefore, the battery input is connected to a low voltage
source and RL(REG) = ∞.
3. The voltage of the regulator sinks as a result of a supply voltage drop.
4. Only one band gap circuit is used as a reference for both regulator and Schmitt trigger for reset. Due to this a tracking
exists between the reset Schmitt trigger levels and the output voltage of the regulator.
5. The temperature coefficient of the internal resistor is 0.2%/K.
VREG
6. The delay time can be calculated with the following formula: td = Rpu(int) × Cd × ln
-----------------------------------
(VREG – Vthr
)
7. The battery output voltage will be equal or less than the output voltage of the regulator.
8. The drop-out voltage of the regulator is measured between VP and VREG
.
9. At current limit, Il is held constant (behaviour according to dashed line in Fig.5).
10. The foldback current protection limits the dissipated power at short-circuit (see Fig.5).
11. The backup switch can deliver an additional current of 100 mA, guaranteed when the regulator is loaded with nominal
loads (IREG ≤ 150 mA).
2000 Jan 14
8
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
handbook, halfpage
5.0 V
MGL434
V
REG
1 V
I
I
≥50 mA
sc
l
I
REG
Fig.5 Foldback current protection.
MGL932
16
handbook, halfpage
I
O(bat)
(mA)
12
8
4
0
3.25
3.75
4.25
4.75
5.25
(V)
V
O(bat)
Tamb = 27° C.
Fig.6 Battery buffer HIGH-level output current as a function of VO(bat)
.
2000 Jan 14
9
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
TEST AND APPLICATION INFORMATION
Test information
V
P
regulator output
reset 1 output
reset 2 output
16
15
14
17
C
C
L
P
R
V
L(REG)
(2)
P
(1)
10 µF
10 µF
10 kΩ
V
C
6
4
R
L(RES1)
1 kΩ
TDA3616T
R
battery input voltage
I
10 kΩ
C
I
1 nF
V
I(bat)
back-up capacitor
battery output voltage
18
5
C
BU
7
≥150 nF
GND
MGR097
(1) Capacitor not required for stability.
(2) RL(REG) = 0.5 Ω at short-circuit.
Fig.7 Test circuit for TDA3616T.
2000 Jan 14
10
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
Application information
STABILITY
NOISE
The regulator is stabilized by the output capacitor CL.
The value of the output capacitor can be selected using
the diagram shown in Fig.8. The following two examples
show the effects of the stabilization circuit using different
values for the output capacitor.
The noise at the output of the regulator depends on the
bandwidth of the regulator, which can be adjusted by the
output capacitor CL. Table 1 shows the noise figures.
The noise on the supply line depends on the value of the
supply capacitor CP and is caused by a current noise (the
output noise of the regulator is translated into a current
noise by the output capacitor). When a high frequency
capacitor of 220 nF (with an electrolytic capacitor of
100 µF connected in parallel) is connected directly
between pins VP and GND the noise is minimized.
Remark: The behaviour of ESR as a function of the
temperature must be known.
Example 1
The regulator is stabilized using an electrolytic output
capacitor of 68 µF (ESR = 0.5 Ω). At Tamb = −40 °C the
capacitor value is decreased to 22 µF and the ESR is
increased to 3.5 Ω. The regulator will remain stable at a
temperature of Tamb = −40 °C.
Table 1 Noise figures
NOISE FIGURE (µV)(1)
IO (mA)
Example 2
CL = 10 µF CL = 47 µF CL = 100 µF
0.5
50
58
50
45
The regulator is stabilized using an electrolytic output
capacitor of 10 µF (ESR = 3.3 Ω). At Tamb = −40 °C the
capacitor value is decreased to 3 µF and the ESR is
increased to 23.1 Ω. The regulator will be unstable at a
temperature of Tamb = −40 °C. This can be solved by using
a tantalum capacitor of 10 µF.
250
200
180
Note
1. Measured at a bandwidth of 10 Hz to 100 kHz.
8
MBK118
ESR
(1)
(Ω)
6
4
2
0
stable region
(2)
0.68
1
10
100
output capacitor (µF)
1000
(1) Maximum Equivalent Series Resistance (ESR).
(2) Minimum ESR.
Fig.8 Curve for selecting the value of the output capacitor.
2000 Jan 14
11
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
APPLICATION CIRCUIT
It is possible to reduce the total thermal resistance from
120 K/W to 50 K/W).
In Fig.9 the total quiescent current equals Iq + IRdivider
.
The specified quiescent current equals Iq. When the
Backup circuit
supply voltage is connected, the regulator will switch-on
when the supply voltage exceeds 7.5 V. With a timing
capacitor connected to pin VC the reset can be delayed
(the timer starts at the same moment as the regulator is
switched on).
The backup function is used for supplying the regulator
and logic circuits (reset 1 and 2) when the supply voltage
is disconnected. For stability a minimum capacitor value
of 150 nF is needed.
Forced reset can be accomplished by short-circuiting the
timer capacitor by using the push-button switch. When the
push-button is released again, the timer restarts (only
when the regulator is on) causing a second reset on both
RES1 and RES2.
With a supply voltage of 14.4 V the backup capacitor will
be fully charged until approximately 14.2 V. At the moment
the supply voltage is lower than the voltage on pin BU the
backup switch will be opened (this backup switch acts like
an ideal diode) and the charge of the backup capacitor is
used for supplying the regulator and the logic circuits.
The backup capacitor is mainly discharged by the load of
the regulator. After a certain period of time the regulator
output will be disabled and the backup capacitor will only
be discharged by the quiescent current of the IC itself.
The maximum output current of the regulator equals:
150 – Tamb
------------------------------------------------------
th(j-a) × (VP – VREG
150 – Tamb
IO(max)
=
=
[mA]
---------------------------------
R
)
50 × (VP – 5)
When Tamb = 85 °C and VP = 16 V, the maximum output
current equals 118 mA. At lower ambient temperature
(Tamb < 0) the maximum output current equals 250 mA.
In combination with the battery detection Schmitt trigger,
an early warning can be given to the microprocessor to
indicate that the battery voltage has dropped down to an
unacceptable low value, causing the microcontroller to run
on backup charge. The early warning level can be
programmed with resistors R1 and R2; see Fig.9.
For successful operation of the IC (maximum output
current capability), special attention has to be paid to the
copper area required as heatsink (connected to
pins 1, 10, 11 and 20), the thermal capacity of the
heatsink and its ability to transfer heat to the external
environment.
choke
coil
C
on/off
(closed = on)
2200
µF
BU
V
BU
18
1000 µF
(minimum value of 150 nF
needed for stability)
P
17
(4)
8 V detector
R1
(5)
REG
(3) 16
360 kΩ
C
L
V
I(bat)
4 (6)
6 (8)
10 µF
TDA3616T
R2
100 kΩ
RES1
(2) 15
V
d
C
RES2
V
(1) 14
(7) 5
forced reset
C
O(bat)
used for
8 V detector
7 (9)
MGL931
The pin numbers given in parenthesis refer to the TDA3616SF version.
Fig.9 Typical application.
12
2000 Jan 14
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
PACKAGE OUTLINES
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-05-22
99-12-27
SOT163-1
075E04
MS-013
2000 Jan 14
13
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
2000 Jan 14
14
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
SOLDERING
Introduction
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
300 and 400 °C, contact may be up to 5 seconds.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Jan 14
15
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
WAVE
REFLOW(1) DIPPING
suitable(2)
MOUNTING
PACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
−
suitable
Surface mount
BGA, LFBGA, SQFP, TFBGA
not suitable
not suitable(3)
suitable
suitable
−
−
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
PLCC(4), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
−
−
−
not recommended(4)(5) suitable
not recommended(6)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Jan 14
16
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
NOTES
2000 Jan 14
17
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
NOTES
2000 Jan 14
18
Philips Semiconductors
Objective specification
Multiple voltage regulator with battery
detection
TDA3616
NOTES
2000 Jan 14
19
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69
SCA
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545002/25/02/pp20
Date of release: 2000 Jan 14
Document order number: 9397 750 06579
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