TDA3672 [NXP]
Very low dropout voltage/quiescent current 3.0 V voltage regulator with enable; 以实现非常低的压差电压/静态电流为3.0 V稳压器
| 型号： | TDA3672 |
| 厂家： | 
NXP |
| 描述： | Very low dropout voltage/quiescent current 3.0 V voltage regulator with enable |
| 文件： | 总16页 (文件大小：87K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA3672
Very low dropout voltage/quiescent
current 3.0 V voltage regulator with
enable
Preliminary specification
2000 Apr 26
File under Integrated Circuits, IC01
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
FEATURES
– Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
• Fixed 3.0 V, 100 mA regulator with enable function
• Supply voltage range up to 33 V (45 V)
• Very low quiescent current of 15 µA (typical value)
• Very low dropout voltage
– ESD protection on all pins
– DC short-circuit safe to ground and VP of the
regulator output
– Temperature protection (at Tj > 150 °C).
• High ripple rejection
• Very high stability:
GENERAL DESCRIPTION
– Electrolytic capacitors: Equivalent Series Resistance
The TDA3672 is a fixed 3.0 V voltage regulator with very
low dropout voltage and quiescent current, which operates
over a wide supply voltage range.
(ESR) < 30 Ω at IREG ≤ 25 mA (see Fig.6)
– Other capacitors: 100 nF at 200 µA ≤ IREG ≤ 100 mA.
• Pin compatible family TDA3672 to TDA3676
• Protections:
The IC is available as:
TDA3672AT: VP ≤ 45 V; −40 °C ≤ Tamb ≤ +125 °C and
SO8 package (automotive).
– Reverse polarity safe (down to −25 V without high
reverse current)
– Negative transient of 50 V (RS = 10 Ω and
t < 100 ms)
QUICK REFERENCE DATA
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VP
Iq
supply voltage
quiescent supply current
regulator on
VP = 14.4 V; IREG = 0 mA;
I(EN) = 5 V
3
14.4
15
45
30
V
−
µA
V
Voltage regulator
VREG
output voltage
7.5 ≤ VP ≤ 22 V; IREG = 0.5 mA
5.5 V ≤ VP ≤ 45 V; IREG = 0.5 mA
2.84
2.81
3.0
3.0
3.16
3.19
3.19
0.3
V
V
V
V
VP = 14.4 V; 0.5 mA ≤ IREG ≤ 100 mA 2.81
VP = 2.8 V; IREG = 50 mA;
amb ≤ 85 °C
3.0
VREG(drop)
dropout voltage
−
0.18
T
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA3672AT
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
2000 Apr 26
2
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
BLOCK DIAGRAM
handbook, halfpage
8
V
P
1
REGULATOR
REG
5
EN
BAND GAP
THERMAL
PROTECTION
TDA3672
2, 3, 6, 7
MBL122
GND
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
regulator output
REG
GND
n.c.
EN
1
2, 3, 6 and 7 ground; note 1
4
5
8
not connected
enable input
VP
supply voltage
handbook, halfpage
Note
REG
1
2
3
4
8
7
6
5
V
P
1. All pins GND are connected to the lead frame and can
also be used to reduce the total thermal resistance
GND
GND
n.c.
GND
GND
EN
TDA3672
R
th(j-a) by soldering these pins to a ground plane.
The ground plane on the top side of the PCB acts like
a heat spreader.
MBL123
Fig.2 Pin configuration.
2000 Apr 26
3
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
FUNCTIONAL DESCRIPTION
A temperature protection circuit is included, which
switches off the regulator output at a junction temperature
above 150 °C.
The TDA3672 is a fixed 3.0 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
an SO8 package with fused centre pins connected to the
lead frame. The regulator is intended for portable, mains,
telephone and automotive applications. To increase the
lifetime of batteries, a specially built-in clamp circuit keeps
the quiescent current of this regulator very low, also in
dropout and full load conditions.
A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR up
to 20 Ω (see Fig.5). If only a 100 nF capacitor is used, the
regulator is fully stable when IREG > 200 µA. This is very
attractive as the ESR of an electrolytic capacitor increases
strongly at low temperatures (no expensive tantalum
capacitor is required).
The regulator remains operating down to very low supply
voltages and below this voltage it switches off.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS
supply voltage
MIN.
MAX.
45
UNIT
VP
−
−
−
V
VP(rp)
Ptot
reverse polarity supply voltage
total power dissipation
non-operating
−25
V
temperature of copper area
4.1
W
is 25 °C
Tstg
Tamb
Tj
storage temperature
ambient temperature
junction temperature
non-operating
operating
−55
−40
−40
+150
+125
+150
°C
°C
°C
operating
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
125
UNIT
K/W
K/W
Rth(j-a)
Rth(j-c)
thermal resistance from junction to ambient
thermal resistance from junction to case
in free air; soldered in
to centre pins; soldered in
30
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611E”.
2000 Apr 26
4
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in test circuit (see Fig.3); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX.
UNIT
Supply voltage: pin VP
VP
Iq
supply voltage
regulator operating; note 1
3
14.4
4
45
15
V
quiescent current
VP = 14.4 V; IREG = 0 mA;
VI(EN) = 0 V
−
µA
VP = 14.4 V; IREG = 0 mA;
VI(EN) = 5 V
−
15
30
µA
5.5 V ≤ VP ≤ 22 V; IREG = 10 mA
5.5 V ≤ VP ≤ 22 V; IREG = 50 mA
−
−
0.2
1.4
0.5
2.5
mA
mA
Enable input: pin EN
VI(EN) enable input voltage
enable off; VREG ≤ 0.8 V
enable on; VREG ≥ 2.7 V
VI(EN) = 5 V
−1
3.0
−
−
+1.0
18
−
V
−
V
II(EN)
Regulator output: pin REG; note 2
VREG output voltage
enable input current
0.3
µA
7.5 V ≤ VP ≤ 22 V; IREG = 0.5 mA 2.84
0.5 mA ≤ IREG ≤ 100 mA; 2.81
amb ≤ 125 °C
5.5 V ≤ VP ≤ 45 V; IREG = 0.5 mA; 2.81
amb ≤ 125 °C
VP = 2.8 V; IREG = 50 mA;
amb ≤ 85 °C
3.0
3.0
3.16
3.19
V
V
T
3.0
0.18
20
3.19
0.3
−
V
V
T
VREG(drop) dropout voltage
−
−
T
VREG(stab)
long-term output voltage
stability
∆VREG(line) line regulation voltage
mV/1000 h
6.5 V ≤ VP ≤ 22 V; IREG = 0.5 mA
6.5 V ≤ VP ≤ 45 V; IREG = 0.5 mA
−
−
−
1
30
50
50
−
mV
mV
mV
dB
1
∆VREG(load) load output regulation voltage 0.5 mA ≤ IREG ≤ 50 mA
10
60
SVRR
supply voltage ripple rejection fi = 120 Hz; Vi(ripple) = 1 V (RMS); 50
REG = 0.5 mA
I
IREG(crl)
ILO(rp)
current limit
VREG > 2.5 V
0.17
0.25
1
−
A
output leakage current at
reverse polarity input
VP = −15 V; VREG ≤ 0.3 V
−
500
µA
Notes
1. The regulator output will follow VP if VP < VREG + VREG(drop)
.
2. Limiting values as applicable for device type TDA3672AT: VP ≤ 45 V and −40 °C ≤ Tamb ≤ +125 °C.
2000 Apr 26
5
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
TEST AND APPLICATION INFORMATION
MDA961
2
10
handbook, halfpage
ESR
(Ω)
(1)
10
ndbook, halfpage
V
C2
10 µF
= 3.0 V
V
8
1
REG
P
C1
1 µF
stable region
TDA3672
1
V
5
I(EN)
2, 3, 6, 7
MBL125
(2)
−1
10
−1
2
10
1
10
10
C2 (µF)
(1) Maximum ESR at 200 µA ≤ IREG ≤ 100 mA.
(2) Minimum ESR only when IREG ≤ 200 µA.
VI(EN) = 5 V.
C1 is optional (to minimize supply noise only).
Fig.4 Graph for selecting the value of the output
capacitor.
Fig.3 Test circuit.
Noise
The output noise is determined by the value of the output
capacitor. The noise figure is measured at a bandwidth of
10 Hz to 100 kHz (see Table 1).
MDA962
3
10
handbook, halfpage
ESR
(Ω)
Table 1 Noise figures
2
10
OUTPUT
CURRENT
IREG (mA)
NOISE FIGURE (µV)
22
C2 = 10 µF C2 = 47 µF C2 = 100 µF
10
0.5
50
550
650
320
400
300
400
stable region
1
Stability
The regulator is stabilized with an external capacitor
connected to the output. The value of this capacitor can be
selected using the diagrams shown in Figs 4 and 5.
The following four examples show the effects of the
stabilization circuit using different values for the output
capacitor.
−1
10
2
3
1
10
10
10
I
(mA)
REG
Fig.5 ESR as a function of IREG for selecting the
value of the output capacitor.
2000 Apr 26
6
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
EXAMPLE 1
For successful operation of the IC (maximum output
current capability) special attention has to be given to the
copper area required as heatsink (connected to all
GND pins), the thermal capacity of the heatsink and its
ability to transfer heat to the external environment.
It is possible to reduce the total thermal resistance from
120 to 50 K/W.
The regulator is stabilized with an electrolytic capacitor of
68 µF (ESR = 0.5 Ω). At Tamb = −40 °C, the capacitor
value is decreased to 22 µF and the ESR is increased
to 3.5 Ω. The regulator will remain stable at a temperature
of Tamb = −40 °C.
EXAMPLE 2
Application circuit with backup function
The regulator is stabilized with an electrolytic capacitor of
10 µF (ESR = 3.3 Ω). At Tamb = −40 °C, the capacitor
value is decreased to 3 µF and the ESR is increased
to 20 Ω. The regulator will remain stable at a temperature
of Tamb = −40 °C.
Sometimes a backup function is needed to supply, for
example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).
This function can be easily built with the TDA3672 by using
a large output capacitor. When the supply voltage is 0 V
(or −1 V), only a small current will flow into pin REG from
this output capacitor (a few µA).
EXAMPLE 3
The regulator is stabilized with a 100 nF MKT capacitor
connected to the output. Full stability is guaranteed when
the output current is larger then 200 µA.
The application circuit is given in Fig.6.
Because the thermal influence on this capacitor value is
almost zero, the regulator will remain stable at a
temperature of Tamb = −40 °C.
EXAMPLE 4
The regulator is stabilized with a 100 nF capacitor in
parallel with a electrolytic capacitor of 10 µF connected to
the output.
ndbook, halfpage
V
= 3.0 V
V
8
1
REG
P
C1
1 µF
The regulator is now stable under all conditions and
independent of:
C2
TDA3672
• The ESR of the electrolytic capacitor
• The value of the electrolytic capacitor
• The output current.
V
5
I(EN)
2, 3, 6, 7
MBL124
Application circuits
The maximum output current of the regulator equals:
150 – Tamb
IREG(max)
=
=
-----------------------------------------------------------
Rth(j – a) × (VP – VREG
)
VI(EN) = 5 V.
C1 is optional (to minimize supply noise only).
C2 ≤ 4700 µF.
150 – Tamb
------------------------------------------
100 × (VP – 3.0)
(mA)
Fig.6 Application circuit with backup function.
When Tamb = 21 °C and VP = 14 V the maximum output
current equals 117 mA.
2000 Apr 26
7
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
Additional application information
This section gives typical curves for various parameters measured on the TDA3672AT. Standard test conditions are:
VP = 14.4 V; Tamb = 25 °C.
MDA949
MDA947
4
25
handbook, halfpage
handbook, halfpage
I
q
I
q
(µA)
(mA)
20
3
15
10
5
2
1
0
0
0
0
10
20
30
40
50
10
20
30
V
(V)
V
(V)
P
P
IREG = 0 mA.
Fig.7 Quiescent current as a function of the
supply voltage.
Fig.8 Quiescent current as a function of high
supply voltage.
MDA948
MDA951
0.48
2
handbook, halfpage
handbook, halfpage
I
(1)
q
I
q
(mA)
(mA)
1.5
0.44
1
0.5
0
0.40
0.36
(2)
5
10
15
20
25
−40
0
40
80
120
160
T (°C)
V
(V)
P
j
(1) Iq at 50 mA load.
(2) Iq at 10 mA load.
IREG = 10 mA.
Fig.9 Quiescent current as a function of the
junction temperature.
Fig.10 Quiescent current as a function of the
supply voltage.
2000 Apr 26
8
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
MDA952
MDA950
4
2
handbook, halfpage
handbook, halfpage
I
q
I
(mA)
q
(mA)
3
1.8
2
1
1.6
0
0
1.4
5
20
40
60
80
I
100
(mA)
10
15
20
25
V
(V)
P
REG
IREG = 50 mA.
Fig.11 Quiescent current as a function of the
supply voltage.
Fig.12 Quiescent current as a function of the
output current.
MGU155
MGU156
3.10
4
handbook, halfpage
handbook, halfpage
V
REG
(V)
V
REG
(V)
3
3.05
2
1
0
3.00
2.95
−50
0
50
100
150
200
−50
0
50
100
150
200
T (°C)
T (°C)
j
j
IREG = 0 mA.
IREG = 0 mA.
Fig.13 Output voltage as a function of the junction
temperature.
Fig.14 Output voltage thermal protection as a
function of the junction temperature.
2000 Apr 26
9
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
MGU157
MDA957
500
4
handbook, halfpage
handbook, halfpage
V
V
REG(drop)
(mV)
REG
(V)
400
300
200
100
3
2
1
0
0
0
40
80
120
100
200
300
I
(mA)
I
(mA)
REG
REG
VP = 8 V with pulsed load.
Fig.15 Dropout voltage as a function of the output
current.
Fig.16 Foldback protection mode.
MDA956
−30
handbook, halfpage
(1)
SVRR
(dB)
(2)
(3)
−40
−50
−60
−70
(1)
(2)
(3)
2
3
4
5
10
10
10
10
10
f (Hz)
C2 = 10 µF.
(1) SVRR at RL = 10 kΩ.
(2) SVRR at RL = 500 Ω.
(3) SVRR at RL = 100 Ω.
Fig.17 SVRR as a function of the ripple frequency.
2000 Apr 26
10
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
PACKAGE OUTLINE
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-05-22
99-12-27
SOT96-1
076E03
MS-012
2000 Apr 26
11
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Apr 26
12
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Apr 26
13
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS
STATUS
DEFINITIONS (1)
Objective specification
Development This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Apr 26
14
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
NOTES
2000 Apr 26
15
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SCA
© Philips Electronics N.V. 2000
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Printed in The Netherlands
753503/25/01/pp16
Date of release: 2000 Apr 26
Document order number: 9397 750 06704
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