TDA3681J/N2C,112 [NXP]
TDA3681 - Multiple voltage regulator with switch and ignition buffer ZIP 17-Pin;
| 型号： | TDA3681J/N2C,112 |
| 厂家： | 
NXP |
| 描述： | TDA3681 - Multiple voltage regulator with switch and ignition buffer ZIP 17-Pin 输出元件 调节器 |
| 文件： | 总29页 (文件大小：178K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA3681
Multiple voltage regulator with
switch and ignition buffer
Product specification
2004 Mar 31
Supersedes data of 2002 Apr 10
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
FEATURES
General
• ESD protection on all pins
• Thermal protections
• Load dump protection
• Extremely low noise behaviour and good stability with
• Foldback current limit protection for regulators 1, 2, 3
very small output capacitors
and 4
• Second supply pin for regulators 3 and 4 to reduce
• Delayed second current limit protection for the power
power dissipation (e.g. via a DC-to-DC converter)
switch (at short-circuit)
• Three VP-state controlled regulators (regulators 1, 3
• The regulator outputs and the power switch are
and 4) and a power switch
DC short-circuit safe to ground and supply (VP).
• Regulator 2, reset and ignition buffer operational during
load dump and thermal shutdown
GENERAL DESCRIPTION
• Combined control pin for switching regulators 1 and 3
• Separate control pins for switching regulator 4 and the
power switch
The TDA3681 is a multiple output voltage regulator with a
power switch and an ignition buffer. It is intended for use in
car radios with or without a microcontroller. The TDA3681
contains the following:
• Supply voltage range from −18 to +50 V
• Low quiescent current in standby mode (when
regulators 1, 3 and 4 and power switch are switched off
and ignition input is low)
• Four fixed voltage regulators with a foldback current
protection (regulators 1, 2, 3 and 4). Regulator 2, which
is intended to supply a microcontroller, also operates
during load dump and thermal shutdown
• Hold output (open-collector output stage) for low VP
(regulators 1, 3 and 4 and power switch off)
• Regulators 3 and 4 have a second supply pin that can
be connected to a lower supply voltage (>6.5 V) to
reduce the power dissipation
• Hold output when one of regulators 1 and 3 and/or 4 is
out of regulation
• Hold output for foldback mode of power switch and
regulators 1, 3 and 4
• A power switch with protection, operated by a control
input
• Hold output for load dump and temperature protection
• Reset (push-pull output stage) for regulator 2
• Adjustable reset delay time
• Reset and hold outputs that can be used to interface
with the microcontroller; the reset signal can be used to
call up the microcontroller
• Both supply pins can withstand load dump pulses and
negative supply voltages
• High supply voltage ripple rejection
• Backup capacitor for regulator 2
• Regulator 2, which is in regulation at a backup voltage
above 6.5 V
• One independent ignition buffer (active HIGH).
• A provision for the use of a reserve supply capacitor that
will hold enough energy for regulator 2 (5 V continuous)
to allow a microcontroller to prepare for loss of voltage
Protections
• Reverse polarity safe (down to −18 V without high
reverse current)
• An ignition input Schmitt trigger with push-pull output
stage.
• Able to withstand voltages up to 18 V at the outputs
(supply line may be short-circuited)
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
SOT243-3
SOT475-1
TDA3681J
DBS17P
DBS17P
plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
TDA3681JR
plastic DIL-bent-SIL (special bent) power package; 17 leads
(lead length 12 mm)
TDA3681TH
2004 Mar 31
HSOP20
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
2
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Supplies
VP1
supply voltage 1
operating
9.5
14.4
−
18
18
50
30
50
V
V
V
V
V
reverse polarity
regulator 2 on
jump start
non-operating
−
4
−
−
14.4
−
t ≤ 10 minutes
load dump protection
supply voltage 2
operating
t ≤ 50 ms; tr ≥ 2.5 ms
−
VP2
6.5
−
14.4
−
18
V
reverse polarity
regulator 2 on
jump start
non-operating
18
V
0
−
50
V
t ≤ 10 minutes
−
−
30
V
load dump protection
t ≤ 50 ms; tr ≥ 2.5 ms
−
−
50
V
Iq(tot)
Tj
total quiescent supply current standby mode
junction temperature
−
110
−
150
150
µA
°C
−
Voltage regulators
Vo(REG1)
Vo(REG2)
Vo(REG3)
Vo(REG4)
output voltage of regulator 1
1 mA ≤ IREG1 ≤ 600 mA; VP = 14.4 V
1 mA ≤ IREG2 ≤ 300 mA; VP = 14.4 V
8.0
8.5
5.0
5.0
3.3
9.0
V
V
V
V
output voltage of regulator 2
output voltage of regulator 3
output voltage of regulator 4
4.75
5.25
5.25
3.46
1 mA ≤ IREG3 ≤ 1400 mA; VP = 14.4 V 4.75
1 mA ≤ IREG4 ≤ 1 A; VP = 14.4 V
3.14
Power switch
Vdrop(SW) drop-out voltage
ISW = 1 A; VP1 = 13.5 V
ISW = 1.8 A; VP1 = 13.5 V
−
−
3
0.45
1.0
−
0.65
1.8
−
V
V
A
IM(SW)
peak current
2004 Mar 31
3
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
BLOCK DIAGRAMS
(14 V/
3 A)
POWER SWITCH
(14.4 V)
17
11
16
V
SW
P1
TEMPERATURE
LOAD DUMP
PROTECTION
ENSW
&
(14 V/
BACKUP SWITCH
100 mA)
14
BU
BACKUP CONTROL
(5 V/
300 mA)
15
REGULATOR 2
REGULATOR 4
REG2
REG4
3
9
V
P2
(3.3 V/
1 A)
4
&
&
&
EN4
(5 V/
1400 mA)
2
REG3
REGULATOR 3
TDA3681J
TDA3681JR
(8.5 V/
600 mA)
1
REGULATOR 1
REG1
HOLD
10
EN1/3
12
+
OR
&
7
RES
8
5
C
RES
6
IGN
IN
IGNITION BUFFER
IGN
OUT
13
mgl902
GND
Fig.1 Block diagram of TDA3681J and TDA3681JR.
4
2004 Mar 31
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
(14 V/
3 A)
POWER SWITCH
(14.4 V)
14
16
V
SW
P1
TEMPERATURE
LOAD DUMP
PROTECTION
8
ENSW
&
(14 V/
100 mA)
BACKUP SWITCH
13
BU
BACKUP CONTROL
(5 V/
300 mA)
12
REGULATOR 2
REGULATOR 4
REG2
REG4
20
6
V
P2
(3.3 V/
1 A)
1
&
&
&
EN4
11
15
18
HEATTAB
n.c.
(5 V/
1400 mA)
19
REG3
REGULATOR 3
TDA3681TH
REGULATOR 1
n.c.
(8.5 V/
600 mA)
17
9
REG1
HOLD
7
EN1/3
+
OR
&
4
RES
5
2
C
RES
3
IGN
IN
IGNITION BUFFER
IGN
OUT
10
mgu353
GND
Fig.2 Block diagram of TDA3681TH.
5
2004 Mar 31
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
PINNING
Pin description of TDA3681J and TDA3681JR
handbook, halfpage
SYMBOL
PIN
DESCRIPTION
regulator 1 output
1
2
REG1
REG3
REG1
REG3
VP2
1
2
3
4
5
6
7
8
9
regulator 3 output
V
3
P2
second supply voltage
regulator 4 output
4
REG4
REG4
IGNIN
IGNOUT
RES
5
IGN
IN
ignition input
6
IGN
ignition output (active HIGH)
reset output (active LOW)
reset delay capacitor
enable input for regulator 4
OUT
RES
7
CRES
EN4
8
C
RES
TDA3681J
TDA3681JR
9
EN4
EN1/3
ENSW
HOLD
GND
BU
10 enable input for regulators 1 and 3
11 enable input for power switch
12 hold output (active LOW)
13 ground; note 1
10
11
12
13
14
15
16
17
EN1/3
ENSW
HOLD
GND
BU
14 backup switch output
15 regulator 2 output
REG2
SW
16 power switch output
17 supply voltage
REG2
SW
VP1
Note
V
P1
1. The heat tab is internally connected to pin GND.
MGL903
Fig.3 Pin configuration for TDA3681J and
TDA3681JR.
2004 Mar 31
6
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
Pin description of TDA3681TH
SYMBOL PIN
DESCRIPTION
regulator 4 output
REG4
IGNIN
IGNOUT
RES
1
2
3
4
5
6
7
8
9
ignition input
handbook, halfpage
ignition output (active HIGH)
reset output (active LOW)
reset delay capacitor
V
20
1
2
3
4
5
6
7
8
9
REG4
P2
REG3 19
n.c. 18
IGN
IN
CRES
IGN
OUT
EN4
enable input for regulator 4
enable input for regulators 1 and 3
enable input for power switch
hold output (active LOW)
REG1 17
SW 16
RES
C
EN1/3
ENSW
HOLD
GND
RES
TDA3681TH
n.c. 15
EN4
V
14
EN1/3
ENSW
HOLD
10 ground
P1
HEATTAB 11 heat tab connection; note 1
BU 13
REG2
BU
12 regulator 2 output
13 backup switch output
14 supply voltage
REG2 12
HEATTAB 11
10 GND
VP1
MGU329
n.c.
15 not connected
SW
16 power switch output
17 regulator 1 output
18 not connected
REG1
n.c.
REG3
VP2
19 regulator 3 output
20 second supply voltage
Fig.4 Pin configuration for TDA3681TH.
Note
1. The pin is used for final test purposes. In the
application it should be connected directly to ground.
2004 Mar 31
7
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
FUNCTIONAL DESCRIPTION
Therefore, regulator 1 is the most critical regulator with
respect to an out of regulation condition caused by a low
battery voltage.
The TDA3681 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. Because of the low voltage operation of
the car radio, low voltage drop regulators are used.
The hold function includes hysteresis to avoid oscillations
when the regulator voltage crosses the hold threshold
level. The hold output also becomes active when the
power switch is in foldback protection mode; see Fig.8.
The block diagram of the hold function is illustrated in
Fig.5.
Regulator 2 is in regulation when the backup voltage
exceeds 6.5 V for the first time. When regulator 2 is
switched on and its output voltage is within its voltage
range, the reset output is disabled to release the
microcontroller. The reset delay time before release can
be extended by an external capacitor (CRES). This start-up
feature is included to secure a smooth start-up of the
microcontroller at first connection, without uncontrolled
switching of regulator 2 during the start-up sequence.
All output pins are fully protected. The regulators are
protected against load dump (regulators 1, 3 and 4 switch
off at supply voltages >18 V) and short-circuit (foldback
current protection).
The power switch contains a current protection. However,
this protection is delayed at short-circuit by the reset delay
capacitor (it should be noted that this is the second
function of the reset delay capacitor CRES). During this
time, the output current is limited to a peak value of at least
3 A (after a delay, the power switch can deliver 1.8 A
continuous if VP ≤ 18 V).
The charge on the backup capacitor can be used to supply
regulator 2 for a short period when the external supply
voltage drops to 0 V (the time depends on the value of the
backup capacitor).
The output stages of all switchable regulators have an
extremely low noise behaviour and good stability, even for
small values of the output capacitors.
In a normal situation, the voltage on the reset delay
capacitor is approximately 3.5 V (depending on the
temperature). The power switch output is approximately
VP − 0.4 V. At operating temperature, the power switch
can deliver at least 3 A. At high temperature, the switch
can deliver approximately 2 A.
When both regulator 2 and the supply voltages (VP1 and
VP2 > 4.5 V) are available, regulators 1 and 3 can be
operated by means of one enable input.
Regulator 4 and the power switch have a separate enable
input.
During an overload condition or a short circuit
Pin HOLD is normally HIGH but is active LOW. Pin HOLD
is connected to an open-collector NPN transistor and must
have an external pull-up resistor to operate. The hold
output is controlled by a low voltage detection circuit
which, when activated, pulls the hold output LOW
(enabled). The hold outputs of the regulators are
connected to an OR gate inside the IC so that the hold
circuit is activated when one or more regulators (1, 3 or 4)
are out of regulation for any reason. Each regulator enable
input controls its own hold triggering circuit, so that if a
regulator is disabled or switched off, the hold circuit for that
regulator is disabled.
(VSW < VP − 3.7 V), the voltage on the reset delay
capacitor rises 0.6 V above the voltage of regulator 2. This
rise time depends on the capacitor connected to pin CRES
.
During this time, the power switch can deliver more than
3 A. When regulator 2 is out of regulation and generates a
reset, the power switch can only deliver 2 A and will
immediately go into foldback protection.
At supply voltages >17 V, the power switch is clamped at
16 V maximum (to avoid externally connected circuits
being damaged by an overvoltage) and the power switch
will switch off at load dump.
Interfacing with the microcontroller (simple full or semi
on/off logic applications) can be realized with an
independent ignition Schmitt trigger and ignition output
buffer (push-pull output).
The hold circuit is also controlled by the temperature and
load dump protection. Activating the temperature or load
dump protection causes a hold (LOW) during the time that
the protection is activated. When all regulators are
switched off, the hold output is controlled by the battery
line VP1, temperature protection and load dump protection.
The timing diagrams are illustrated in Figs 6 and 7.
The second supply voltage VP2 is used for the switchable
regulators 3 and 4. This input can be connected to a lower
supply voltage of ≥6 V to reduce the power dissipation of
the TDA3681. A DC-to-DC converter could be used for this
purpose.
The hold circuit is enabled at low battery voltages. This
indicates that it is not possible to get regulator 1 into
regulation when switching it on: regulator 1 has the highest
output voltage (8.5 V) of all switchable regulators.
2004 Mar 31
8
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
low battery
detector
V
P1
internal
TDA3681
voltage reference 1
internal
voltage
reference 2
output stage
REG1
output of
regulation
detector
enable
EN1/3
REGULATOR 1
output stage
REG3
output of
regulation
detector
enable
OR
&
REGULATOR 3
output stage
REG4
OR
HOLD
buffer
output of
regulation
detector
enable
POWER SWITCH
FOLDBACK
MODE
TEMPERATURE
PROTECTION
LOAD DUMP
EN4
REGULATOR 4
MGL904
Fig.5 Block diagram of the hold circuit.
9
2004 Mar 31
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
load dump
V
V
P1
6.5 V
5.4 V
BU
5.0 V
0 V
regulator 2
reset
delay
capacitor
5.0 V
3.0 V
0 V
5.0 V
reset
Back-up Schmitt trigger and reset behaviour
load dump
V
= V
P2
P1
50 V
0 V
ignition
input
−100 V
5.0 V
ignition
output
0 V
Enable Schmitt trigger ignition
>22 V
V
= V
P2
P1
>1.8 V
<1.3 V
enable
regulator 1/3
>1.8 V
<1.3 V
enable
regulator 4
regulator 1
and 3
regulator 4
temperature
protection
150 °C
active
passive
HIGH
LOW
HOLD
mgl905
Hold behaviour
Fig.6 Timing diagram of ignition Schmitt triggers and hold circuit.
10
2004 Mar 31
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
load dump
18 V
8.9 V
7.0 V
4.0 V
V
= V
P2
P1
≥1.8 V
enable
regulator 1/3
regulator 1
regulator 3
1.3 V
8.5 V
0 V
5.0 V
0 V
>1.8 V
enable
regulator 4
<1.3 V
3.3 V
regulator 4
0 V
V
and enable Schmitt trigger
P
load dump
16.9 V
V
P
7.0 V
4.0 V
enable
power
switch
>1.8 V
<1.3 V
16 V
power
switch
output
0 V
MGL906
Power switch behaviour
Fig.7 Timing diagram of regulators and power switch.
11
2004 Mar 31
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP1
supply voltage 1
operating
−
−
−
−
18
V
V
V
V
reverse polarity
jump start
non-operating
18
30
50
t ≤ 10 minutes
load dump protection
supply voltage 2
operating
t ≤ 50 ms; tr ≥ 2.5 ms
VP2
−
−
−
−
−
18
V
V
V
V
W
reverse polarity
non-operating
18
jump start
t ≤ 10 minutes
30
load dump protection
total power dissipation
storage temperature
ambient temperature
junction temperature
t ≤ 50 ms; tr ≥ 2.5 ms
50
Ptot
Tstg
Tamb
Tj
62
non-operating
operating
−55
−40
−40
+150
+85
+150
°C
°C
°C
operating
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-c)
PARAMETER
CONDITIONS
VALUE
1.3
UNIT
K/W
K/W
thermal resistance from junction to case
thermal resistance from junction to ambient
Rth(j-a)
in free air
50
QUALITY SPECIFICATION
In accordance with “General Quality Specification For Integrated Circuits (SNW-FQ-611D)”.
2004 Mar 31
12
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
CHARACTERISTICS
VP = VP1 = VP2 = 14.4 V; Tamb = 25 °C; measured in test circuits of Figs 10 and 11; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VP1
supply voltage 1
operating
9.5
−
14.4
−
18
18
50
30
50
V
V
V
V
V
reverse polarity
regulator 2 on
jump start
non-operating
note 1
4
14.4
−
t ≤ 10 minutes
t ≤ 50 ms; tr ≥ 2.5 ms
−
load dump protection
supply voltage 2
operating
−
−
VP2
6.5
−
14.4
−
18
18
50
30
50
22
V
V
V
V
V
V
reverse polarity
regulator 2 on
jump start
non-operating
0
−
t ≤ 10 minutes
−
−
load dump protection
t ≤ 50 ms; tr ≥ 2.5 ms
VP1 and/or VP2
−
−
Vbat(loaddump) battery overvoltage
shutdown
18
20
Iq(tot)
total quiescent supply
current
VP = 12.4 V; note 2
VP = 14.4 V; note 2
−
−
105
110
145
150
µA
µA
Schmitt trigger for power supply (regulators 1, 3 and 4)
Vth(r)
Vth(f)
Vhys
rising threshold voltage
VP1 rising
6.5
4.0
−
7.0
4.5
2.5
7.5
5.0
−
V
V
V
falling threshold voltage VP1 falling
hysteresis voltage
Schmitt trigger for enable input (regulators 1, 3, 4 and power switch)
Vth(r)
Vth(f)
Vhys
ILI
rising threshold voltage
falling threshold voltage
hysteresis voltage
1.4
0.9
−
1.8
1.3
0.5
5
2.4
1.9
−
V
V
IREG = ISW = 1 mA
VEN = 5 V
V
input leakage current
1
20
µA
Reset trigger level of regulator 2
Vth(r) rising threshold voltage
VP1 rising; IREG2 = 50 mA;
note 3
4.43
4.4
V
REG2 − 0.15 VREG2 − 0.1
REG2 − 0.25 VREG2 − 0.13
V
V
Vth(f)
falling threshold voltage VP1 falling; IREG2 = 50 mA;
note 3
V
Schmitt triggers for hold circuit output
Vth(r)(REG1)
Vth(f)(REG1)
Vhys(REG1)
rising threshold voltage
of regulator 1
VP1 rising; note 3
−
V
REG1 − 0.15 VREG1 − 0.075 V
falling threshold voltage VP1 falling; note 3
of regulator 1
7.67
−
VREG1 − 0.35 −
V
V
hysteresis voltage due to
regulator 1
0.2
−
2004 Mar 31
13
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
SYMBOL
PARAMETER
CONDITIONS
VP2 rising; note 3
MIN.
TYP.
MAX.
UNIT
Vth(r)(REG3)
rising threshold voltage
of regulator 3
−
V
V
REG3 − 0.15 VREG3 − 0.075 V
Vth(f)(REG3)
Vhys(REG3)
Vth(r)(REG4)
Vth(f)(REG4)
Vhys(REG4)
Vth(r)(VP)
falling threshold voltage VP2 falling; note 3
of regulator 3
4.3
−
REG3 − 0.35 −
V
V
hysteresis voltage due to
regulator 3
0.2
−
rising threshold voltage
of regulator 4
VP2 rising; note 3
−
V
REG4 − 0.15 VREG4 − 0.075 V
falling threshold voltage VP2 falling; note 3
of regulator 4
2.7
−
V
REG4 − 0.3
−
V
V
V
V
V
hysteresis voltage due to
regulator 4
0.15
9.7
−
rising threshold voltage
of supply voltage
VEN = 0 V
9.1
9.0
−
10.3
9.8
−
Vth(f)(VP)
falling threshold voltage VEN = 0 V
of supply voltage
9.4
Vhys(VP)
hysteresis voltage of
supply voltage
VEN = 0 V
0.3
Reset and hold buffer
Isink(L) LOW-level sink current
ILO
V
RES ≤ 0.8 V; VHOLD ≤ 0.8 V
2
−
−
mA
µA
µA
output leakage current
VP2 = 14.4 V; VHOLD = 5 V
−
0.1
400
5
Isource(H)
HIGH-level source
current
VP2 = 14.4 V; VRES ≥ 4.5 V
240
900
tr
tf
rise time
fall time
note 4
note 4
−
−
7
1
50
50
µs
µs
Reset delay
Ich
reset delay capacitor
charge current
VCRES = 0 V
VCRES = 3 V;
2
4
8
µA
mA
V
Idch
reset delay capacitor
discharge current
1.0
2.5
1.0
1.6
3.0
1.2
−
VP1 = VP2 = 4.3 V
Vth(r)(RES)
Vth(f)(RES)
rising voltage threshold
reset signal
3.5
1.4
falling voltage threshold
reset signal
V
td(RES)
td(SW)
delay reset signal
CRES = 47 nF; note 5
CRES = 47 nF; note 6
20
8
35
70
40
ms
ms
delay power switch
foldback protection
17.6
Regulator 1 (IREG1 = 5 mA; unless otherwise specified)
Vo(off)
output voltage off
output voltage
−
1
400
9.0
9.0
75
mV
V
Vo(REG1)
1 mA ≤ IREG1 ≤ 600 mA
9.5 V ≤ VP1 ≤ 18 V
8.0
8.0
−
8.5
8.5
2
V
∆Vline
line regulation
load regulation
9.5 V ≤ VP1 ≤ 18 V
mV
mV
∆Vload
1 mA ≤ IREG1 ≤ 600 mA
−
20
85
2004 Mar 31
14
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
SYMBOL
Iq
PARAMETER
CONDITIONS
IREG1 = 600 mA
MIN.
TYP.
MAX.
UNIT
quiescent current
−
25
70
60
mA
dB
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
60
−
Vdrop(REG1)
drop-out voltage
IREG1 = 550 mA; VP1 = 8.55 V;
note 7
−
0.4
0.7
V
Im(REG1)
Isc(REG1)
current limit
VREG1 > 7 V; note 8
0.65 1.2
250 800
−
−
A
short-circuit current
RL ≤ 0.5 Ω; note 9
mA
Regulator 2 (IREG2 = 5 mA; unless otherwise specified)
Vo(REG2)
output voltage
0.5 mA ≤ IREG2 ≤ 300 mA
7 V ≤ VP1 ≤ 18 V
4.75 5.0
4.75 5.0
4.75 5.0
5.25
5.25
5.25
V
V
V
18 V ≤ VP1 ≤ 50 V;
IREG2 ≤ 150 mA
∆Vline
line regulation
load regulation
6 V ≤ VP1 ≤ 18 V
−
2
50
75
50
100
−
mV
mV
mV
mV
dB
6 V ≤ VP1 ≤ 50 V
−
15
20
−
∆Vload
1 mA ≤ IREG2 ≤ 150 mA
1 mA ≤ IREG2 ≤ 300 mA
fi = 3 kHz; Vi = 2 V (p-p)
−
−
SVRR
supply voltage ripple
rejection
50
55
Vdrop(REG2)
drop-out voltage
IREG2 = 100 mA; VP1 = 4.75 V;
note 7
−
−
−
−
0.4
0.8
0.2
0.8
0.6
1.2
0.5
1.0
V
V
V
V
IREG2 = 200 mA; VP1 = 5.75 V;
note 7
IREG2 = 100 mA;VBU = 4.75 V;
note 10
IREG2 = 200 mA;VBU = 5.75 V;
note 10
Im(REG2)
Isc(REG2)
current limit
VREG2 > 4.5 V; note 8
0.32 0.37
−
−
A
short-circuit current
RL ≤ 0.5 Ω; note 9
95
120
mA
Regulator 3 (IREG3 = 5 mA; unless otherwise specified)
Vo(off)
output voltage off
output voltage
−
1
400
5.25
5.25
50
mV
V
Vo(REG3)
1 mA ≤ IREG3 ≤ 1400 mA
7 V ≤ VP1 and/or VP2 ≤ 18 V
7 V ≤ VP1 and/or VP2 ≤ 18 V
1 mA ≤ IREG3 ≤ 1400 mA
IREG3 = 1400 mA
4.75 5.0
4.75 5.0
V
∆Vline
∆Vload
Iq
line regulation
load regulation
quiescent current
−
2
mV
mV
mA
dB
−
20
19
70
150
45
−
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
60
−
Vdrop(REG3)
drop-out voltage
IREG3 = 1400 mA ; VP2 = 6 V;
note 7
−
1
1.5
V
Im(REG3)
Isc(REG3)
current limit
VREG3 > 4.5 V; note 8
1.5
1.7
−
−
A
short-circuit current
RL ≤ 0.5 Ω; note 9
430
750
mA
2004 Mar 31
15
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Regulator 4 (IREG4 = 5 mA; unless otherwise specified)
Vo(off)
output voltage off
output voltage
−
1
400
3.46
3.46
50
mV
V
Vo(REG4)
1 mA ≤ IREG4 ≤ 1 A
3.14 3.3
6.5 V ≤ VP1 and/or VP2 ≤ 18 V 3.14 3.3
V
∆Vline
∆Vload
Iq
line regulation
load regulation
quiescent current
6.5 V ≤ VP1 and/or VP2 ≤ 18 V
1 mA ≤ IREG4 ≤ 1 A
−
2
mV
mV
mA
dB
−
20
15
70
50
IREG4 = 1 A
−
40
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
60
−
Vdrop(REG4)
Im(REG4)
drop-out voltage
current limit
IREG4 = 1 A; VP2 = 5 V; note 7
VREG4 > 3.0 V; note 8
RL ≤ 0.5 Ω; note 9
−
1.7
1.5
750
2.4
−
V
1.1
470
A
Isc(REG4)
short-circuit current
−
mA
Power switch
Vdrop(SW)
drop-out voltage
ISW = 1 A; VP1 = 13.5 V;
note 11
−
0.45
1.0
0.65
1.8
V
V
ISW = 1.8 A; VP1 = 13.5 V;
note 11
−
IDC(SW)
continuous current
clamping voltage
VP1 = 16 V; VSW = 13.5 V
1.8
2.0
−
A
V
Vclamp(SW)
VP1 ≥ 17 V;
13.5 15.0
16.0
1 mA < ISW < 1.8 A
IM(SW)
Vfb(SW)
Isc(SW)
peak current
VP1 < 17 V;
notes 6, 12 and 13
3
−
−
A
V
A
flyback voltage
behaviour
ISW = −100 mA
−
VP1 + 3
1.7
22
−
short-circuit current
VP1 = 14.4 V; VSW < 1.2 V;
note 13
0.5
Backup switch
IDC(BU)
Vclamp(BU)
Ir(BU)
continuous current
VBU > 5 V
0.3
−
0.35
−
−
A
clamping voltage
reverse current
VP1 ≥ 16.7 V; IREG2 = 100 mA
16
900
V
VP1 = 0 V; VBU = 12.4 V
−
−
µA
Schmitt trigger for enable ignition input
Vth(r)(IGNIN)
rising threshold voltage
of ignition input
VP1 > 3.5 V
1.9
1.7
2.2
2.0
2.5
2.3
V
V
Vth(f)(IGNIN)
falling threshold voltage VP1 > 3.5 V
of ignition input
Vhys(IGNIN)
ILI
Ii(clamp)
VIH(clamp)
hysteresis voltage
input leakage current
input clamp current
VP > 3.5 V
0.1
−
0.2
−
0.5
1.0
50
V
VIGNIN = 5 V
µA
mA
V
VIGNIN ≤ 50 V
−
−
HIGH-level input
clamping voltage
VP1
−
50
VIL(clamp)
LOW-level input
clamping voltage
VIGNIN ≥ −100 V
−0.6
−
0
V
2004 Mar 31
16
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Ignition buffer
VOL
VOH
LOW-level output voltage IIGNOUT = 0 mA
0
0.2
5.0
0.8
V
V
HIGH-level output
voltage
IIGNOUT = 0 mA
4.5
5.25
IOL
IOH
LOW-level sink current
V
IGNOUT ≤ 0.8 V
IGNOUT ≥ 4.5 V
0.45 0.8
0.45 2.0
−
−
mA
mA
HIGH-level source
current
V
tPLH
tPHL
LOW-to-HIGH
propagation time
VIGNIN rising from 1.7 to 2.5 V
VIGNIN falling from 2.5 to 1.7 V
−
−
−
−
500
500
µs
µs
HIGH-to-LOW
propagation time
Temperature protection
Tj(sd)
junction temperature for
shutdown
150
150
160
160
170
170
°C
°C
Tj(hold)
junction temperature for
hold trigger
Notes
1. Minimum operating voltage, only if VP1 has exceeded 6.5 V.
2. The total quiescent current is measured in the standby mode. Therefore, the enable inputs of regulators 1, 3, 4 and
the power switch are grounded and RL(REG2) = ∞ ; see Figs 10 and 11.
3. The voltage of the regulator drops as a result of a VP1 drop for regulators 1 and 2. Regulators 3 and 4 drop as a result
of VP2 drop.
4. The rise and fall times are measured with a 10 kΩ pull-up resistor and a 50 pF load capacitor.
C
5. The delay time depends on the value of the reset delay capacitor: td(RES)
6. The delay time depends on the value of the reset delay capacitor: td(SW)
=
× V
= C × (750 × 103)[s]
------
Ich
C(th)
C
=
× V
= C × (375 × 103)[s]
------
C(th)
Ich
7. The drop-out voltage of regulators 1 and 2 is measured between pins VP1 and REGn. The drop-out voltage of
regulators 3 and 4 is measured between pins VP2 and REGn.
8. At current limit, Im(REGn) is held constant (see Fig.8).
9. The foldback current protection limits the dissipated power at short-circuit (see Fig.8).
10. The drop-out voltage is measured between pins BU and REG2.
11. The drop-out voltage of the power switch is measured between pins VP1 and SW.
12. The maximum output current of the power switch is limited to 1.8 A when the supply voltage exceeds 18 V.
13. At short-circuit, Isc(SW) of the power switch is held constant to a lower value than the continuous current after a delay
of at least 10 ms.
2004 Mar 31
17
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
handbook, halfpage
8.5 V
handbook, halfpage
MGL907
V
o(REG2)
5.0 V
MGL908
V
o(REG1)
I
I
m(REG2)
sc(REG2)
I
REG2
I
I
sc(REG1)
m(REG1)
I
REG1
a. Regulator 1.
b. Regulator 2.
handbook, halfpage
handbook, halfpage
V
V
o(REG4)
o(REG3)
MGL909
MGL910
5.0 V
3.3 V
I
I
m(REG3)
I
I
sc(REG3)
m(REG4)
sc(REG4)
I
I
REG3
REG4
c. Regulator 3.
d. Regulator 4.
Fig.8 Foldback current protection of the regulators.
MGR931
V
SW
V
− 3.3 V
P
not
delayed
delayed
generates
hold
2V
BE
1 A
>1.8 A
>3 A
I
SW
Fig.9 Current protection of the power switch.
18
2004 Mar 31
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
TEST AND APPLICATION INFORMATION
Test information
power switch output
supply voltage 1
16
15
1
17
11
10
9
C15
100 nF
C2
10 µF
C13
1000 µF
C1
220 nF
V
P1
R
(1)
L(SW)
12 kΩ
regulator 2
output
enable input power switch
enable input regulator 1/3
enable input regulator 4
5 V
8.5 V
5 V
C16
100 nF
C3
10 µF
R
V
L(REG2)
ENSW
5 kΩ
regulator 1
output
C17
100 nF
C4
10 µF
R
V
L(REG1)
EN1/3
10 kΩ
regulator 3
output
2
C18
C5
10 µF
R
V
L(REG3)
EN4
100 nF
5 kΩ
regulator 4
output
TDA3681J
TDA3681JR
3.3 V
4
supply voltage 2
C19
C6
3
8
R
L(REG4)
100 nF
10 µF
C14
1000 µF
C7
220 nF
V
5 kΩ
(1)
P2
reset delay
capacitor
reset
output
C8
47 nF
7
C9
50 pF
(3)
R3
10 kΩ
backup
hold output
14
5
12
6
C12
50 pF
C10
(2)
(3)
V
BU
100 µF
R6
ignition input
ignition output
10 kΩ
mgl911
C11
1 nF
13
V
IGNIN
ground
(1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability.
(2) A minimum capacitor of 1 µF for backup supply is required for stability.
(3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs.
Fig.10 Test circuit of TDA3681J and TDA3681JR.
2004 Mar 31
19
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
power switch output
supply voltage 1
16
12
17
19
14
8
C2
10 µF
C15
100 nF
C1
220 nF
C13
1000 µF
V
P1
R
(1)
L(SW)
12 kΩ
regulator 2
output
enable input power switch
enable input regulator 1/3
enable input regulator 4
5 V
8.5 V
5 V
C16
100 nF
C3
10 µF
R
V
L(REG2)
ENSW
5 kΩ
regulator 1
output
7
C17
100 nF
C4
10 µF
R
V
L(REG1)
EN1/3
10 kΩ
regulator 3
output
6
C18
100 nF
C5
10 µF
R
V
L(REG3)
EN4
5 kΩ
regulator 4
output
TDA3681TH
3.3 V
1
supply voltage 2
C19
100 nF
C6
10 µF
20
R
L(REG4)
C7
220 nF
C14
(1)
V
5 kΩ
P2
1000 µF
reset delay
capacitor
reset
output
5
C8
47 nF
4
C9
(3)
50 pF
R3
10 kΩ
backup
hold output
13
2
9
3
C12
50 pF
C10
(2)
(3)
V
BU
100 µF
R6
ignition input
ignition output
10 kΩ
mgu355
C11
1 nF
11
10
V
IGNIN
heat tab
ground
(1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability.
(2) A minimum capacitor of 1 µF for backup supply is required for stability.
(3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs.
Fig.11 Test circuit of TDA3681TH.
2004 Mar 31
20
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
Application information
NOISE
The output capacitors can be selected by using the graphs
given in Figs 12 and 13. When an electrolytic capacitor is
used, its temperature behaviour can cause oscillations at
a low temperature. The two examples below show how an
output capacitor value is selected.
Table 1 Noise figures
NOISE FIGURE (µV)(1)
Co = 10 µF Co = 47 µF Co = 100 µF
REGULATOR
Example 1
1
2
3
4
170
440
120
85
110
240
100
70
110
190
80
Regulators 1, 3 and 4 are stabilized with an electrolytic
output capacitor of 220 µF (ESR = 0.15 Ω).
At Tamb = −30 °C, the capacitor value is decreased to
73 µF and the ESR is increased to 1.1 Ω. The regulator
remains stable at Tamb = −30 °C; see Fig.12.
55
Note
1. Measured at a bandwidth of 30 kHz.
Example 2
Regulator 2 is stabilized with a 10 µF electrolytic capacitor
(ESR = 3 Ω). At Tamb = −30 °C, the capacitor value is
decreased to 3 µF and the ESR is increased to 23.1 Ω.
As can be seen from Fig.13, the regulator will be unstable
at Tamb = −30 °C.
The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (the
output noise of the regulators is translated to a current
noise by the output capacitors). The noise is minimal when
a high frequency capacitor of 220 nF in parallel with an
electrolytic capacitor of 100 µF is connected directly to the
supply pins VP1, VP2 and GND.
Solution
To avoid problems with stability at low temperatures, the
use of tantalum capacitors is recommended. Use a
tantalum capacitor of 10 µF or a larger electrolytic
capacitor.
STABILITY
The regulators are stabilized by the externally connected
output capacitors.
handbook, halfpage
MGL913
MGL912
handbook, halfpage
14
20
ESR
(Ω)
maximum ESR
ESR
(Ω)
12
10
8
15
maximum ESR
10
stable region
6
4
5
0
stable region
2
minimum ESR
10
0
−2
10
0.1
1
100
0.22
1
100
C (µF)
C (µF)
Fig.12 Curve for selecting the value of the output
capacitor for regulators 1, 3 and 4.
Fig.13 Curve for selecting the value of the output
capacitor for regulator 2.
2004 Mar 31
21
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
PACKAGE OUTLINES
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
SOT243-3
non-concave
x
D
h
D
E
h
view B: mounting base side
A
2
d
B
j
E
A
L
3
L
c
2
v
M
Q
1
17
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.4 0.60 0.38 23.6 19.6
12.2
11.8
3.4
3.1
8.4
7.0
2.4
1.6
2.00
1.45
2.1
1.8
6
mm
10
2.54 1.27 5.08
0.6
4.3
0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-17
03-03-12
SOT243-3
2004 Mar 31
22
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
DBS17P: plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm)
SOT475-1
non-concave
D
h
x
D
E
h
view B: mounting base side
A
2
d
B
j
E
A
L
3
L
Q
1
17
c
v
M
e
w
M
1
Z
b
p
e
m
2
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.4 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
2.54 1.27 5.08
0.8
4.3
0.4 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-17
03-03-12
SOT475-1
2004 Mar 31
23
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
E
A
D
x
X
c
y
E
H
2
v
M
A
E
D
1
D
2
10
1
pin 1 index
Q
A
A
2
(A )
3
E
1
A
4
θ
L
p
detail X
20
11
w
M
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
(1)
(2)
(2)
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT
2
3
4
p
1
2
2
8°
0°
+0.08 0.53 0.32
−0.04 0.40 0.23
16.0 13.0 1.1 11.1 6.2
15.8 12.6 0.9 10.9 5.8
2.9
2.5
14.5 1.1
13.9 0.8
1.7
1.5
2.5
2.0
3.5
3.2
mm
1.27
3.5
0.35
0.25 0.25 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-02-12
03-07-23
SOT418-3
2004 Mar 31
24
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
SOLDERING
Introduction
Surface mount packages
REFLOW SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Through-hole mount packages
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
SOLDERING BY DIPPING OR BY SOLDER WAVE
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
– for all the BGA, HTSSON..T and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
The total contact time of successive solder waves must not
exceed 5 seconds.
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
WAVE SOLDERING
MANUAL SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
To overcome these problems the double-wave soldering
method was specifically developed.
300 and 400 °C, contact may be up to 5 seconds.
2004 Mar 31
25
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
If wave soldering is used the following conditions must be
observed for optimal results:
The adhesive can be applied by screen printing, pin
transfer or syringe dispensing. The package can be
soldered after the adhesive is cured.
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
MANUAL SOLDERING
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive.
2004 Mar 31
26
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
WAVE
REFLOW(2) DIPPING
MOUNTING
PACKAGE(1)
Through-hole mount CPGA, HCPGA
suitable
−
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP(4)
suitable(3)
−
−
−
Through-hole-
surface mount
not suitable
not suitable
Surface mount
BGA, HTSSON..T(5), LBGA, LFBGA, SQFP,
SSOP-T(5), TFBGA, USON, VFBGA
not suitable
suitable
suitable
−
−
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable(6)
PLCC(7), SO, SOJ
suitable
suitable
−
−
−
−
LQFP, QFP, TQFP
not recommended(7)(8) suitable
not recommended(9)
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L(11), PMFP(10), WQCCN32L(11)
suitable
not suitable
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
7. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
2004 Mar 31
27
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and
ignition buffer
TDA3681
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Mar 31
28
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R32/06/pp29
Date of release: 2004 Mar 31
Document order number: 9397 750 12427
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