TDA3843 [NXP]
Sound-IF circuit for TV AM-sound standard L and L’; 声音中频电路，用于电视的AM-音标L和L'
| 型号： | TDA3843 |
| 厂家： | 
NXP |
| 描述： | Sound-IF circuit for TV AM-sound standard L and L’ |
| 文件： | 总10页 (文件大小：67K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA3843
Sound-IF circuit for TV AM-sound
standard L and L’
March 1991
Product specification
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
GENERAL DESCRIPTION
The TDA3843 performs the AM-sound demodulation for the L- and L’-standard.
Features
• 5 to 8 V power supply and an alternative 12 V power supply
• Low power consumption (200 mW) at 5 V supply voltage
• New AC-coupled wideband IF-amplifier (high dynamic ranges, less intermodulation)
• In-phase wideband AM demodulator without external reference circuit
• Reduced THD figures even for low AF frequencies (typical 1%)
• Stabilizer circuit for ripple rejection and constant output signals
• All pins are ESD protected
QUICK REFERENCE DATA
PARAMETER
Supply voltage (pin 14)
SYMBOL
MIN.
4.5
TYP.
MAX.
8.8
UNIT
VP1
VP2
5
V
V
Supply voltage (pin 11)
Supply current
10.8
−
12
40
70
63
13.2
48
100
−
I11, 14-13
V1-16
mA
µV
dB
Minimum IF input (RMS value)
IF control range
−
∆GV
60
−
AF output signal (RMS value)
Signal plus weighted-noise to
V6-13
550
−
mV
weighted-noise ratio
(CCIR 468-3)
S + W/W
50
56
−
dB
PACKAGE OUTLINE
16-lead DIL; plastic (opposite bent leads) (SOT38WBE); SOT38-1; 1996 December 4.
March 1991
2
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
Fig.1 Block diagram.
March 1991
3
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
March 1991
4
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
SYMBOL
MIN.
MAX.
8.8
UNIT
Supply voltage (pin 14)
Supply voltage (pin 11)
VP1
VP2
Tamb
Tstg
Ptot
4.5
V
10.8
0
13.2
+ 70
+ 125
635
V
Operating ambient temperature range
Storage temperature range
°C
°C
−25
−
Total power dissipation at VP2
mW
CHARACTERISTICS
VP1 = 5 V (see note 1); Tamb = 25 °C; unless otherwise specified
PARAMETER CONDITIONS
Current consumption
SYMBOL
MIN.
TYP.
40
MAX. UNIT
I11
−
48
mA
IF amplifier
Input resistance
Input capacitance
Minimum IF input signal
(RMS value)
R1-16
C1-16
−
−
2
−
−
kΩ
2.5
pF
note 2
V1-16
−
70
100
µV
Maximum IF input signal
(RMS value)
note 3
−3 dB
note 4
V1-16
70
60
50
−
100
63
−
−
−
−
mV
dB
Gain control range
IF bandwidth
70
MHz
V
DC potential
V1/16-3
1.7
AM demodulator
AF output signal (RMS value)
AF bandwidth
V6-13
V6-13
THD
440
0.02
−
550
−
660
>100
2
mV
kHz
%
−3 dB, note 5
Total harmonic distortion
Signal plus weighted-noise
to weighted-noise ratio
(CCIR 468-3)
1
note 6
S+W/W
50
56
−
−
dB
V
DC potential
V6-13
−
1.8
Output resistance
emitter follower
with 0.5 mA bias
current
R6
−
200
−
Ω
Allowable AC output current
(peak-to-peak value)
note 7
±I6
−I6
−
−
−
−
0.3
1
mA
mA
Allowable DC output current
March 1991
5
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
PARAMETER
Ripple rejection
CONDITIONS
ripple < 200 mV
(peak-to-peak),
50 to 100 Hz,
SYMBOL
MIN.
TYP.
MAX. UNIT
V
measured at 70 Hz
AF signal output
αRR = Vripple
on VP/Vripple on
VO
αRR
30
40
−
dB
IF filter
Proposal for sound carrier
filter for L-standard
Fig.5
Notes to the characteristics
1. Using the power supply voltage range VP1 = 5 to 8 V, the performance will not essentially change. Using the power
supply voltage range, VP2 = 12 V, the performance will be comparable with the performance at VP1 = 5 to 8 V. The
unused power supply pin must not be connected.
2. Start of gain control (low IF input signal) at −3 dB AF signal reduction at pin 6.
3. End of gain control (high IF input signal) at +1 dB AF signal expansion at pin 6.
4. Sound carrier = 32.4 MHz modulated with f = 1 kHz and a modulation depth m = 80%.
IF input signal V1-16 = 10 mV (RMS value).
5. A maximum value of 100 kHz is guaranteed, but, typically a maximum value of 700 kHz is found.
6. The capacitor at pin 4 may be omitted, but then the S+W/W figure will be degraded by up to 8 dB in the IF voltage
range 1 mV up to 100 mV.
7. If a higher AC output current is required, an external resistor must be connected from the output to ground. This is
to increase the bias current of the emitter follower (note, the maximum allowable DC output current).
March 1991
6
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
Fig.3 Test circuit, 5 V supply.
Fig.4 Test circuit, 12 V supply.
7
March 1991
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
Where SC = sound carrier and PC = picture carrier.
Fig.5 AM IF filter for standard L.
March 1991
8
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
March 1991
9
Philips Semiconductors
Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1991
10
相关型号：
©2020 ICPDF网 联系我们和版权申明