TDA4566 [NXP]
Colour transient improvement circuit; 彩色瞬态改善电路
| 型号： | TDA4566 |
| 厂家： | 
NXP |
| 描述： | Colour transient improvement circuit |
| 文件： | 总11页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA4566
Colour transient improvement
circuit
March 1991
Preliminary specification
File under Integrated Circuits, IC02
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
GENERAL DESCRIPTION
The TDA4566 is a monolithic integrated circuit for colour-transient improvement (CTI) and luminance delay line in gyrator
technique in colour television receivers.
Features
• Colour transient improvement for colour difference signals (R-Y) and (B-Y) with transient detecting-, storage- and
switching stages resulting in high transients of colour difference output signals
• A luminance signal path (Y) which substitutes the conventional Y-delay coil with an integrated Y-delay line
• Switchable delay time from 550 ns to 820 ns in steps of 90 ns and additional fine adjustment of 37 ns
• Two Y output signals; one of 180 ns less delay
QUICK REFERENCE DATA
PARAMETER
CONDITIONS
SYMBOL
MIN.
10.8
TYP.
12
MAX. UNIT
Supply voltage (pin 10)
Supply current (pin 10)
Y-signal delay at pin 12
VP
IP
13.2
50
V
−
35
mA
S1 open;
14-18 = 1.2 kΩ;
R
note 1
V
15-18 = 0 to 2.5 V
t17-12
t17-12
t17-12
t17-12
αY
490
580
670
760
0
550
640
730
820
1
610
700
790
880
2
ns
ns
ns
ns
dB
V15-18 = 3.5 to 5.5 V
V
15-18 = 6.5 to 8.5 V
15-18 = 9.5 to12 V
V
Y-signal amplification
(R-Y) and (B-Y) signal
attenuation
0.5 MHz
αcd
−1
0
+1
dB
ns
output transient time
ttr
−
100
200
Note
1. Delay time is proportional to resistor R14-18
.
R14-18 also influences the bandwidth; a value of 1.2 kΩ results in a bandwidth of 5 MHz (typ.).
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 27.
March 1991
2
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
March 1991
3
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
March 1991
4
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
SYMBOL
MIN.
MAX.
13.2
UNIT
Supply voltage range (pin 10)
Voltage ranges to pin 18 (ground)
at pins 1, 2, 12 and 15
at pin 11
VP = V10-18
0
V
Vn-18
0
0
0
VP
V
V
V
V11-18
V17-18
(VP−3 V)
at pin 17
7
Voltage ranges
at pin 7 to pin 6
V7-6
V8-9
0
0
5
5
V
V
at pin 8 to pin 9
Currents
at pins 6, 9
I6, 9
−10
+10
mA
at pins 7, 8, 11 and 12
Total power dissipation
(Tj = 150 °C; Tamb = 70 °C
Storage temperature range
Operating ambient temperature range
I7, 8, 11, 12
internally limited
Ptot
−
1.1
W
Tstg
Tamb
−25
0
+ 150
+ 70
°C
°C
THERMAL RESISTANCE
From junction to ambient (in free air)
Note
Rth j−a
= 70
K/W
1. Pins 3, 4, 5, 6, 9, 13 and 14 DC potential not published.
March 1991
5
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
CHARACTERISTICS
VP = V10-18 = 12 V; Tamb = 25 °C; measured in application circuit Fig.3; unless otherwise specified
PARAMETER CONDITIONS SYMBOL MIN. TYP.
Supply (pin 10)
MAX.
UNIT
Supply voltage
Supply current
VP
IP
10.8
12
13.2
V
−
35
50
mA
Colour difference paths
(R-Y) input voltage
(75% colour bar signal)
(peak-to-peak value)
(B-Y) input voltage
(75% colour bar signal)
(peak-to-peak value)
Input resistance
(R-Y)
V1(p-p)
−
−
0.63
0.8
1.5
1.9
V
V
V2(p-p)
R1-18
R2-18
8
8
12
12
16
16
kΩ
kΩ
(B-Y)
Internal bias voltage
(R-Y)
V1-18
V1-18
3.8
3.8
4.3
4.3
4.8
4.8
V
V
(B-Y)
Signal attenuation
(R-Y)
V8 / V1
V7 / V2
ttr
−1
−1
−
0
+ 1
+ 1
200
dB
dB
ns
(B-Y)
0
Output transient time
Output resistance
(B-Y)
note 1
100
R7-18
R8-18
−
−
100
100
−
−
Ω
Ω
(R-Y)
DC output voltage
(B-Y)
V7-18
V8-18
3.8
3.8
4.3
4.3
4.8
4.8
V
V
(R-Y)
Output current
source
note 2
I7, 8
0.4
1.0
−
−
−
−
mA
mA
sink
−I7, 8
March 1991
6
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
PARAMETER
Y-signal path
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Y-input voltage
(composite signal)
(peak-to-peak value)
Internal bias voltage
Input current
capacitive
coupling
V17(p-p)
−
0.45
0.62
V
V
during clamping
V17-18
2.1
2.4
2.7
during picture content
during sync. pulse
Y-signal delay at pin 12
I17
−
−
8
12
µA
µA
−I17
100
150
S1 open;
R14 = 1.2 kΩ;
notes 3 and 4
at V15−18 = 0 to 2.5 V
at V15-18 = 3.5 to 5.5 V
at V15−18 = 6.5 to 8.5 V
at V15-18 = 9.5 to12 V
Fine adjustment of Y-signal
delay for all 4 steps
t17-18
t17-18
t17-18
t17-18
490
580
670
760
550
640
730
820
610
700
790
880
ns
ns
ns
ns
S1 closed
S1 open
t17-12
−
37
−
ns
Signal delay between pin 11
and pin 12
t11-12
160
−
180
0.001
200
−
ns
Dependency of delay time
on temperature
K−1
∆t17 – 12
------------------------------
17 – 12 • ∆Tj
t
on supply voltage
−
−
−0.03
−
V−1
∆t 17 – 12
-----------------------------
17 – 12 • ∆VP
t
Input switching current
Y-signal attenuation
pin 11 from pin 17
pin 12 from pin 17
Frequency response at
3 MHz referred to 0.5 MHz
pin 11
−I15
15
25
µA
f = 0.5 MHz
note 5
V11/V17
V12/V17
−1
0
+1
+2
dB
dB
0
+1
0
0
−
−
3.0
3.0
dB
dB
V 11 (3 MHz)
-------------------------------------
V11 (0.5 MHz)
pin 12
V 12 (3 MHz)
-------------------------------------
V12 (0.5 MHz)
March 1991
7
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
PARAMETER
Frequency response at
5 MHz referred to 0.5 MHz
pin 11
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
note 5
−3.0
−
−
2.0
dB
V11(5 MHz)
-------------------------------------
V11 (0.5 MHz)
pin 12
−3.0
2.0
dB
V 12 (5 MHz)
-------------------------------------
V12 (0.5 MHz)
DC output voltage
pin 11
V11-18
V12-18
1.8
9.8
2.3
2.6
V
V
pin 12
10.3
10.8
Output current
source
note 2
I11, 12
−
−
−
−
0.4
1.0
mA
mA
sink
−I11, 12
Notes
1. Output signal transient time measured with C6-18 = C9-18 = 220 pF without resistor (see Fig. 3).
2. Output current measured with emitter follower with constant current source of 0.6 mA.
3. R14-18 influences the bandwidth; a value of 1.2 kΩ results in a bandwidth of 5 MHz (typ.).
4. Delay time is proportional to resistor R14-18. Devices with suffix “A” require the value of the resistor to be 1.15 kΩ;
a 27 kΩ; resistor connected in parallel with R14-18 = 1.2 kΩ.;
5. Frequency response measured with V15-18 = 9.5 V and switch S1 open.
March 1991
8
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
APPLICATION INFORMATION
(1) Residual carrier reduced to 20 mV peak-to-peak (R = 1 kΩ, C = 100 pF).
(2) Switching sequence for delay times shown in Table 1.
(3)
R14−18 = 1.2 kΩ for TDA4566.
R14−18 = 1.15 kΩ for TDA4566A (27 kΩ resistor connected in parallel to 1.2 kΩ).
Fig.3 Application diagram and test circuit.
Table 1 Switching sequence for delay times.
CONNECTION (2)
VOLTAGE AT PIN 15
0 to 2.5 V
DELAY TIME (ns) (1)
(a)
(b)
(c)
0
0
0
X
0
0
X
X
0
550
X
X
X
3.5 to 5.5 V
6.5 to 8.5 V
9.5 to 12 V
640
730
820
Notes
1. When switch (S1) is closed the delay time is increased by 37 ns.
2. Where: X = connection closed; 0 = connection open.
March 1991
9
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
18
10
M
H
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
0.85
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
0.15
0.13
0.32
0.31
0.37
0.33
inches
0.19
0.020
0.15
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-10-14
95-01-23
SOT102-1
March 1991
10
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1991
11
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