TDA6509ATT [NXP]
3-band mixer/oscillator and PLL for terrestrial tuners; 3频段混频器/振荡器和PLL为地面调谐器
| 型号： | TDA6509ATT |
| 厂家： | 
NXP |
| 描述： | 3-band mixer/oscillator and PLL for terrestrial tuners |
| 文件： | 总42页 (文件大小：266K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA6508; TDA6508A; TDA6509;
TDA6509A
3-band mixer/oscillator and PLL for
terrestrial tuners
Product specification
2005 Mar 25
Supersedes data of 2005 Feb 23
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
CONTENTS
13
TEST AND APPLICATION INFORMATION
Measurement circuit
13.1
14
1
2
3
4
5
6
7
8
FEATURES
INTERNAL PIN CONFIGURATION
PACKAGE OUTLINES
APPLICATIONS
15
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
16
SOLDERING
16.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
16.2
16.3
16.4
16.5
PINNING
I2C-BUS DATA FORMAT
Suitability of surface mount IC packages for
wave and reflow soldering methods
8.1
8.2
8.3
8.4
I2C-bus address selection
Write mode
Read mode
17
18
19
DATA SHEET STATUS
DEFINITIONS
Power-on reset
DISCLAIMERS
9
LIMITING VALUES
10
11
12
HANDLING
THERMAL CHARACTERISTICS
CHARACTERISTICS
2005 Mar 25
2
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
1
FEATURES
• Single-chip 5 V mixer / oscillator and synthesizer for TV,
VCR tuners, DVD-R and PC TV.
• I2C bus protocol compatible with 3.3 V and 5 V
microcontrollers
– Address with 4 data bytes transmission (I2C-bus
‘write’ mode)
– Address with 1 status byte (I2C-bus ‘read’ mode)
– 4 independent I2C-bus addresses.
2
APPLICATIONS
• 3-band tuner for terrestrial TV, DVD-R, VCR and PC TV.
• 5 Positive-channel Metal Oxide Semiconductor (PMOS)
output ports
3
GENERAL DESCRIPTION
This device is a programmable 3-band mixer oscillator and
synthesizer intended for LOW, MID and HIGH band TV
and VCR tuners. It has three double balanced mixers and
three oscillators for the LOW, MID and HIGH band
respectively, a PLL synthesizer, and an IF amplifier. There
are four package variants: TDA6508, TDA6509,
TDA6508A and TDA6509A. Versions TDA6508; TDA6509
have a symmetrical IF amplifier; versions TDA6508A;
TDA6509A have an asymmetrical IF amplifier, (see Fig.1).
– 3 buffers for band selection (20 mA)
– 2 buffers for general purpose, e.g. FM sound trap
(5 mA).
• 33 V tuning voltage output
• In-lock flag
• 5-step analog-to-digital converter (3 bits in I2C-bus
mode)
• 15-bit programmable divider
The common output of all three mixers can be connected,
via two output pins, to an external IF filter to enable
shunted IF bandpass and/or serial filtering for improved
signal handling. Two input pins are available for
connecting the output of the external filter to the input of
the IF amplifier. The mixer output has an impedance
of 300 Ω. The IF amplifier input has an impedance
of 2.5 kΩ (5 pF).
• Programmable reference divider ratio (64, 80 or 128)
• Programmable charge-pump current (20 or 100 µA)
• Balanced mixer with a common emitter input for LOW
band (single input)
• Balanced mixer with a common emitter input for MID
band (balanced input)
• Balanced mixer with a common base input for HIGH
band (balanced input)
The overall gain of the tuner can be increased at low signal
amplitude conditions to improve TV reception by activating
a weak signal booster via the I2C-bus.
• 2-pin asymmetrical oscillator for LOW band
• 2-pin symmetrical oscillator for MID band
• 2-pin symmetrical oscillator for HIGH band
There are five open-drain PMOS output ports; each port
has a different drive capability. I2C-bus bit P0 enables
port P0 (20 mA drain current) and the LOW band mixer
oscillator. Bit P1 enables port P1 (20 mA drain current)
and the MID band mixer oscillator. When ports P0 and P1
are both disabled, the HIGH band mixer oscillator is
enabled. Bit P2 enables port P2 (20 mA drain current).
Bit P3 enables port P3 (5 mA drain current) for general
use, and bit P4 enables port P4 (5 mA drain current) for
general use, and is also combined with the ADC input.
When the ports are used, the sum of the drain currents
must be limited to 30 mA.
• External 4-pin IF filter between mixer output (medium
impedance) and IF amplifier input (high impedance)
• Weak signal booster (I2C controlled switchable gain
amplifier)
• Low power
• Low radiation
• Small size
• TDA6508; TDA6509: symmetrical IF amplifier output to
drive a SAW filter (1.25 kΩ)
The PLL synthesizer comprises a 15-bit programmable
divider, a crystal oscillator, programmable reference
divider, phase comparator (phase/frequency detector)
combined with a charge-pump which drives an internal
tuning amplifier and an output at pin CP. The CP signal
current can be integrated by connecting an external RC
• TDA6508A; TDA6509A: single-ended IF amplifier to
drive low ohmic load (75 Ω).
2005 Mar 25
3
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
loop filter between pin CP and pin VTUNE as shown in
Fig.27. The tuning amplifier can supply up to 33 V (max.)
at pin VT for controlling any of the internal oscillators via
external tank circuits. The phase comparator can operate
at 62.5, 50 or 31.25 kHz with a 4 MHz crystal, depending
on the reference divider ratio of either 64, 80 or 128; see
Table 4. An externally sourced signal having a frequency
between 3.58 MHz and 4.43 MHz can be used as a
reference frequency for the internal crystal oscillator at any
of the reference divider ratios.
Automatic frequency control is provided using an internal
Analog-to-Digital Converter controlled by the voltage on
pin ADC. The ADC code is read during a READ operation;
see Table 8.
The device requires to be addressed by five sequential
serial bytes (including the address byte) via the I2C-bus to
set the crystal oscillator frequency, program the five ports
and to set the charge-pump current; see Table 1. The
address byte can have one of four possible device
addresses which are selected by applying a specific
voltage to pin AS; see Table 3.
In test mode, port P3 will output either half the crystal
reference frequency (1⁄2fref) or half the reference divider
frequency (1⁄2fdiv); see Table 5.
The device can be controlled according to the I2C-bus
format; see Table 1. The in-lock flag bit FL is set to logic 1
when the PLL is locked. This flag is read from the status
byte on pin SDA during a READ operation; see Table 6
and Table 7.
4
QUICK REFERENCE DATA
Measured over full voltage and temperature ranges.
SYMBOL PARAMETER
VCC supply voltage
CONDITIONS
MIN.
4.5
TYP. MAX. UNIT
5
5.5
V
ICC
supply current
VCC = 5 V; all ports off
43
58
4.0
290
−
74
mA
MHz
mW
°C
fxtal
crystal oscillator frequency
total power dissipation
IC storage temperature
ambient temperature
Rxtal = 25 Ω to 300 Ω
3.58
−
4.43
385
+150
+85
Ptot
Tstg
Tamb
−40
−20
−
°C
5
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
DESCRIPTION
VERSION
TDA6508TT
TDA6508ATT
TDA6509TT
TDA6509ATT
TDA6509HN
TDA6509AHN
TSSOP32
plastic thin shrink small outline package; 32 leads body width 6.1 mm
SOT487-1
TSSOP32
HVQFN32
plastic thin shrink small outline package; 32 leads body width 6.1 mm
SOT487-1
SOT617-1
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 × 5 × 0.85 mm
2005 Mar 25
4
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
6
BLOCK DIAGRAM
V
CC
25 (8)
31 (2)
LOW_OSCOUT
VHF
VHF
LOW BAND
MIXER
RF INPUT
VHF
LOW BAND
5 (28)
LOW_RFIN
LOW BAND
32 (1)
LOW_OSCIN
OSCILLATOR
TDA6508
TDA6508A
(TDA6509)
(TDA6509A)
30 (3)
6 (27)
RF_GND
OSC_GND
3 (30)
28 (5)
RF INPUT
VHF
HIGH BAND
VHF
HIGH BAND
MIXER
VHF
HIGH BAND
OSCILLATOR
MID_OSCIN1
MID_OSCIN2
MID_RFIN1
4 (29)
29 (4)
MID_RFIN2
1 (32)
26 (7)
27 (6)
RF INPUT
UHF
BAND
HIGH_OSCIN1
HIGH_OSCIN2
HIGH_RFIN1
UHF
OSCILLATOR
UHF
MIXER
2 (31)
HIGH_RFIN2
SYMMETRICAL/ASYMMETRICAL IFAMPLIFIER
FILTER BUFFER
WEAK SIGNAL BOOSTER SAW DRIVER
23 (10)
24 (9)
IFAMP_OUT1
IFAMP_OUT2/
IF_GND
9 (24)
10 (23)
7 (26)
IFAMP_IN1
IFAMP_IN2
MIX_OUT1
MIX_OUT2
WSB
8 (25)
19 (14)
20 (13)
CP
VT
PLL SYNTHESIZER
f
ref
17
CRYSTAL
OSCILLATOR
4 MHz
REFERENCE
PHASE
COMPARATOR
(16)
CHARGE
PUMP
TUNE
AMP
XTAL_REF
DIVIDER
64, 80, 128
f
div
RSA
RSB
T0
T1
T2
CP
IN-LOCK
DETECTOR
15-BIT
PROGRAMMABLE
DIVIDER
15-BIT
FREQUENCY
REGISTER
CONTROL
REGISTER
FL
FL
2
16 (17)
SCL
CP T2 T1 T0 RSA RSB WSB
I C-BUS / 3-WIRE BUS
TRANSCEIVER
15 (18)
SDA
FL
f
1/2f
ref
div
PORT
REGISTER
21 (12)
AS
GATE
3-BIT ADC
22 (11)
PLL_GND
mdb250
T0, T1, T2
18 (15)
14 (19) 11 (22) 12 (21) 13 (20)
ADC/P4
P3
P2
P1
P0
(1) ‘A’ versions only.
The pin numbers in parenthesis refer to versions TDA6509 and TDA6509A.
Fig.1 Block diagram.
5
2005 Mar 25
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
7
PINNING
PIN
TDA6508; TDA6509;
SYMBOL
DESCRIPTION
TDA6508A TDA6509A
HIGH_RFIN1
HIGH_RFIN2
MID_RFIN1
MID_RFIN2
LOW_RFIN
RF_GND
MIX_OUT1
MIX_OUT2
IFAMP_IN1
IFAMP_IN2
P2
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
HIGH band RF input 1
HIGH band RF input 2
MID band RF input 1
MID band RF input 2
LOW band RF input
RF ground
2
3
4
5
6
7
mixer output 1 (to external IF filter)
mixer IF output 2 (to external IF filter)
IF amplifier input 1 (from external IF filter)
IF amplifier input 2 (from external IF filter)
HIGH band port output
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
24
25
26
27
28
29
30
31
32
P1
MID band port output
P0
LOW band port output
P3
general purpose port - test mode output
serial data input/output
SDA
SCL
serial clock input
XTAL_REF
ADC/P4
crystal oscillator reference signal input
ADC input/general purpose port output
charge-pump output
CP
VT
tuning voltage output
AS
address selection input
PLL_GND
IFAMP_OUT1
IFAMP_OUT2
IF_GND
PLL ground
IF amplifier output 1
IF amplifier output 2 (TDA6508 and TDA6509 only)
IF ground (TDA6508A and TDA6509A only)
supply voltage
9
VCC
8
HIGH_OSCIN1
HIGH_OSCIN2
MID_OSCIN1
MID_OSCIN2
OSC_GND
LOW_OSCOUT
LOW_OSCIN
7
HIGH band oscillator input 1
HIGH band oscillator input 2
MID band oscillator input 1
MID band oscillator input 2
oscillator ground
6
5
4
3
2
LOW band oscillator output
LOW band oscillator input
1
2005 Mar 25
6
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
handbook, halfpage
handbook, halfpage
HIGH_RFIN1
HIGH_RFIN2
MID_RFIN1
MID_RFIN2
LOW_RFIN
RF_GND
1
2
3
4
5
6
7
8
9
32 LOW_OSCIN
31 LOW_OSCOUT
30 OSC_GND
LOW_OSCIN
1
2
3
4
5
6
7
8
9
32 HIGH_RFIN1
31 HIGH_RFIN2
30 MID_RFIN1
29 MID_RFIN2
28 LOW_RFIN
27 RF_GND
LOW_OSCOUT
OSC_GND
29 MID_OSCIN2
28 MID_OSCIN1
27 HIGH_OSCIN2
26 HIGH_OSCIN1
MID_OSCIN2
MID_OSCIN1
HIGH_OSCIN2
HIGH_OSCIN1
MIX_OUT1
MIX_OUT2
IFAMP_IN1
26 MIX_OUT1
25
V
CC
V
25 MIX_OUT2
CC
TDA6508
TDA6508A
TDA6509
TDA6509A
24 IFAMP_OUT2/IF_GND
23 IFAMP_OUT1
22 PLL_GND
21 AS
IF_GND/IFAMP_OUT2
24 IFAMP_IN1
IFAMP_IN2 10
P2 11
IFAMP_OUT1 10
PLL_GND 11
AS 12
23 IFAMP_IN2
22 P2
P1 12
21 P1
P0 13
20 VT
VT 13
20 P0
P3 14
19 CP
CP 14
19 P3
SDA 15
SCL 16
18 ADC/P4
ADC/P4 15
XTAL_REF 16
18 SDA
17 SCL
MDB227
17 XTAL_REF
MDB226
Fig.2 Pin configuration for TDA6508 and
TDA6508A (TSSOP32).
Fig.3 Pin configuration for TDA6509 and TDA6509A
(TSSOP32).
2005 Mar 25
7
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
handbook, halfpage
8
7
6
5
4
3
2
1
17
18
19
20
21
22
V
SCL
SDA
P3
CC
HIGH_OSCIN1
HIGH_OSCIN2
MID_OSCIN1
MID_OSCIN2
OSC_GND
P0
TDA6509
TDA6509A
P1
P2
23 IFAMP_IN2
IFAMP_IN1
LOW_OSCOUT
LOW_OSCIN
24
MDB225
Fig.4 Pin configuration for TDA6509 and TDA6509A (HVQFN32).
I2C-BUS DATA FORMAT
I2C-bus address selection
The MSB of the first data byte DB1 indicates whether
8
frequency data (MSB = 0) or control and band switch data
will follow. Additional data bytes can be entered without the
need to re-address the device until an I2C-bus STOP
command is sent by the controller.
8.1
The address byte ADB contains programmable module
address bits MA1 and MA0 which allow up to four
synthesizers to be used in the same system, and are
configured by applying one of four possible voltages on
pin AS; see Tables 1 and 2. For each voltage on pin AS,
the resultant values of bits MA1 and MA0 are shown in
Table 3.
The frequency divider register is loaded after the 8th clock
pulse of byte DB2. The control register is loaded after the
8th clock pulse of byte CB, and the band switch register is
loaded after the 8th clock pulse of byte BB.
8.2
Write mode
The write mode is defined by setting bit R/W to logic 0 in
address byte ADB; see Table 1.
Data bytes can be sent to the device after sending the first
address byte. Four data bytes are required to fully program
the device.
The bus transceiver has an auto-increment facility which
allows the device to be programmed by one transmission
(address byte with 4 data bytes). The device can be
partially programmed provided that the first data byte
following the address byte is divider byte DB1 or control
byte CB.
2005 Mar 25
8
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
Table 1 I2C-bus data format for write mode
BITS(1)
NAME
BYTE
ADB
MSB
LSB
Address byte
Divider byte 1
Divider byte 2
Control byte
1
0
1
0
0
0
MA1
N10
N2
MA0
N9
R/W = 0
N8
DB1
DB2
CB
N14
N6
CP
X
N13
N5
T2
X
N12
N4
T1
P4
N11
N7
1
N3
T0
P3
N1
N0
RSA
P2
RSB
P1
WSB
P0
Band switch byte
BB
X
Note
1. X = don’t care.
Table 2 Function of write mode bits used in Table 1
BIT
FUNCTION
MA1 and MA0
R/W
module address; see Table 3
read/write mode; 0 = write mode
N14 to N0
CP
programmable divider bits: N = N14 × 214 + N13 × 213 + ... + N1 × 21 + N0
charge-pump current control:
0: charge-pump current is 20 µA
1: charge-pump current is 100 µA
T2, T1 and T0
RSA and RSB
WSB
test mode; see Table 5
reference divider ratio; see Table 4
Weak Signal Booster control:
0: normal mode - no gain increase: external IF filter used
1: Weak Signal Booster activated: IF filter by-passed
port P0 to P4 control:
P0, P1, P2, P3, P4
0: corresponding port is off; high impedance state (default)
1: corresponding port is on.
Table 3 Module address selection bits
MA1 MA0
VOLTAGE APPLIED TO PIN AS
0
0
1
1
0
1
0
1
0 V to 0.1VCC
0.2VCC to 0.3VCC or open-circuit
0.4VCC to 0.6VCC
0.9VCC to 1.0VCC
2005 Mar 25
9
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
Table 4 Reference divider ratio selection bits
RSA
RSB
REFERENCE DIVIDER RATIO
FREQUENCY STEP (kHz)(1)
X
0
1
0
1
1
80
50
128
64
31.25
62.5
Note
1. Crystal oscillator frequency or externally sourced reference frequency of 4 MHz at pin XTAL_REF.
Table 5 Test mode selection bits
T2
T1
T0
TEST MODE
0
0
0
0
1
1
1
1
0
0
1
1
1
1
0
0
0
1
0
1
0
1
0
1
normal mode (read and write mode bytes allowed)
normal mode (read and write mode bytes allowed)(1)
charge-pump is off(2)
byte BB ignored
charge-pump sinks current
charge-pump sources current
1⁄2fref is output from port P3(3)
1⁄2fdiv is output from port P3(3)
Notes
1. This is the default mode at power-on reset.
1
2. ⁄2fdiv is output from port P3 when the charge-pump is off.
3. Port P3 cannot be used when these test modes are active.
8.3
Read mode
The internal ADC can be used to apply AFC information to
a microcontroller in the IF section of the television via
status byte bits A0, A1 and A2. Up to five voltage levels
can be applied to the ADC input pin ADC; the resultant
values of bits A2, A1 and A0 are shown in Table 8.
The read mode is defined by setting bit R/W to logic 1 in
address byte ADB; see Table 6.
After the slave address has been recognized, the device
generates an acknowledge pulse, and status byte SB is
transferred on the SDA line (MSB first). Data is valid on the
SDA line when pin SCL is HIGH. A second data byte can
be read from the device if the microcontroller generates an
acknowledge on the SDA line (master acknowledge).
End of transmission will occur if no master acknowledge is
asserted. The device will then release the data line to allow
the microcontroller to generate a STOP condition.
Bit POR is set to logic 1 at power-on. This bit is reset when
an end-of-data is detected by the device at the end of a
read sequence. Bit FL controls the PLL by indicating when
the loop is locked (bit FL = 1).
2005 Mar 25
10
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
Table 6 Read data format
BIT
NAME
BYTE
MSB(1)
LSB
Address byte
Status byte
ADB
SB
1
1
0
1
0
1
0
1
MA1
A2
MA0
A1
R/W = 1
A0
POR
FL
Note
1. MSB is transmitted first.
Table 7 Description of the bits used in Table 6
BIT
DESCRIPTION
MA1 and MA0
R/W
programmable address bits; see Table 3
read/write mode selection; 1 = read mode
Power-on reset flag:
POR
0: after end of the first read sequence
1: at Power-on
FL
in-lock flag:
0: loop is not locked
1: loop is locked
A2, A1 and A0
digital outputs of the 5-level ADC; see Table 8
Table 8 Digital outputs for analog to digital converter (note 1)
A2 A1 A0
VOLTAGE APPLIED TO PIN ADC
0 VCC to 0.15 VCC
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
0.15 VCC to 0.3 VCC
0.3 VCC to 0.45 VCC
0.45 VCC to 0.6 VCC
0.6 VCC to 1 VCC
Note
1. Accuracy is ±0.03 × VCC
.
8.4 Power-on reset
The threshold level for the power-on reset supply voltage VPOR is set to 3.2 V at room temperature. Below this threshold,
the device is reset to the power-on state.
The following actions take place In the power-on state:
• The charge-pump current is set to 100 µA
• Test bits T2, T1 and T0 are set to logic 001; the charge-pump can either sink or source current
• The Weak signal booster is disabled
• All ports are off and the HIGH band is selected by default.
2005 Mar 25
11
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
Table 9 Default setting of the bits at power-on reset
BITS(1)
NAME
BYTE
ADB
MSB
LSB
Address byte
Divider byte 1
Divider byte 2
Control byte
1
0
X
1
X
1
0
0
X
X
0
0
0
X
X
1
0
MA1
X
MA0
X
X
X
X
0
DB1
DB2
CB
X
X
1
X
X
0
X
X
X
X
Band switch byte BB
X
X
0
0
0
Note
1. X = don’t care.
9
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
PIN
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
TDA6508;
TDA6508A
TDA6509;
TDA6509A
VCC
25
8
DC supply voltage
operating supply
11, 12, 13, 14, 18 22, 21, 20, 19, 15 PMOS port output voltage
−0.3 +6
V
4.5
−0.3
−20
−5
5.5
V
VPn
IPn
V
0
0
CC + 0.3
V
11, 12, 13
22, 21, 20
PMOS port output current
mA
mA
V
14, 18
20
19, 15
13
VVT
tuning voltage output
−0.3 +35
−0.3 +6
−0.3 +6
VSCL
VSDA
ISDA
16
17
serial clock input voltage
serial data input or output voltage
serial data output current
address selection input voltage
crystal input voltage
V
15
18
V
15
18
0
+10
mA
V
VAS
21
12
−0.3 +6
Vxtal
17
16
−0.3 VCC + 0.3
V
tsc(max)
−
−
maximum short-circuit time (all pins to
CC and all pins to all grounds)
−
10
s
V
Tstg
Tamb
Tj
−
−
−
−
−
−
storage temperature
ambient temperature
junction temperature
−40 +150
−20 +85
°C
°C
°C
−
+150
Note
1. Maximum ratings can not be exceeded, not even momentarily without causing irreversible IC damage. Maximum
ratings can not be accumulated.
10 HANDLING
Human Body Model: C = 100 pF and R = 1500 Ω. All pins withstand 2000 V in accordance with specification
EIA/JESD22-A114-A.
Machine model: C = 200 pF and R = 0 Ω. All pins withstand 200 V in accordance with specification EIA/JESD22-A115-A.
2005 Mar 25
12
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
11 THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
TYP.
UNIT
Rth(j-a)
thermal resistance from junction to ambient in free air - SOT487-5(1)
in free air - SOT487-4(1)
115
125
31
K/W
K/W
K/W
in free air - SOT617-1
Note
1. JEDEC conditions apply to single layer PCB.
12 CHARACTERISTICS
VCC = 5 V, Tamb = 25 °C; TDA6508 and TDA6509 values measured with RL = 1.25 kΩ and TDA6508A and TDA6509A
values measured with RL = 75 Ω; Weak signal booster off; measured using the PAL application circuit shown in
Figure 27; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCC
ICC
supply voltage
supply current
4.5
5.0
5.5
V
at VCC = 5 V; all ports off
43
58
74
mA
FUNCTIONAL RANGE
VPOR
power-on reset supply
voltage
power-on reset activates below this
voltage
−
3.2
−
V
N
divider ratio
15-bit frequency word
Rxtal = 25 Ω to 300 Ω
fxtal = 4 MHz
64
−
32767
4.43
−
−
fxtal
Zxtal
crystal oscillator frequency
3.58
1000
4.0
1200
MHz
Ω
input impedance
(absolute value)
PMOS PORTS: PINS P0, P1, P2, P3, P4
IL(Pn)
leakage current
VCC = 5.5 V; VPn = 0 V or 5.5 V
−10
−
+120
µA
VPn(sat)
output saturation voltage
VPn(sat) = VCC − VPn
one buffer output is on and
sourcing 5 mA
−
−
0.25
0.25
0.4
0.4
V
V
one buffer output is on and
sourcing 20 mA
ADC INPUT: PIN ADC (IN I2C BUS MODE)
VADC
ADC input voltage
see Table 8
VADC = VCC
VADC = 0 V
0
−
−
−
VCC
100
−
V
IADC(H)
IADC(L)
HIGH level input current
LOW level input current
−
µA
µA
−10
ADDRESS SELECTION INPUT: PIN AS
IAS(H)
IAS(L)
HIGH level input current
LOW level input current
VAS = 5 V
VAS = 0 V
−
−
−
10
µA
µA
−10
−
2005 Mar 25
13
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
CLOCK AND DATA INPUTS: PINS SCL AND SDA
VSCL(L)
VSDA(L)
VSCL(H)
VSDA(H)
ISCL(H)
ISDA(H)
,
LOW level input voltage
HIGH level input voltage
HIGH level input current
0
−
−
1.5
V
,
2.3
5.5
V
,
Vbus = 5.5 V; VCC = 0 V
Vbus = 5.5 V; VCC = 5.5 V
Vbus = 1.5 V; VCC = 0 V
Vbus = 0 V; VCC = 5.5 V
−
−
−
−
−
10
10
10
−
µA
µA
µA
µA
−
ISCL(L)
,
LOW level input current
−
ISDA(L)
−10
DATA OUTPUT: PIN SDA
IL(SDA)
leakage current
HIGH level output voltage
VSDA = 5.5 V
−
−
−
−
10
µA
VSDA(H)
ISDA = 3 mA (sink current)
0.4
V
CLOCK FREQUENCY (I2C-BUS MODE)
fclk
clock frequency
−
−
400
kHz
CHARGE-PUMP OUTPUT: PIN CP
|ICP(H)
|
HIGH level input current
(absolute value)
CP = 1
−
100
20
0
115
−
µA
µA
nA
|ICP(L)
|
LOW level input current
(absolute value)
CP = 0
15
−15
IL(CP)
off-state leakage current
T2 = 0; T1 = 1; T0 = 0
+15
TUNING VOLTAGE OUTPUT: PIN VT
Itune(off)
leakage current when
switched-off
T2 = 1; T1 = 1; T0 = 0; tuning
supply is 33 V
−
−
−
10
µA
Vo(tune)
output voltage when loop is T2 = 0; T1 = 0; T0 = 1; RL = 33 kΩ; 0.3
32.7
V
closed
tuning supply is 33 V
LOW MIXER (INCLUDING IF PREAMPLIFIER)
fRF(o)
fRF
RF operational frequency
RF frequency
40
−
−
800
MHz
fpc; note 1
43.25
161.25 MHz
Gv
voltage gain
TDA6508; TDA6509; IF output
loaded with 1.25 kΩ
fRF = 46 MHz; see Fig.10
fRF = 164 MHz; see Fig.10
22
22
25
25
28
28
dB
dB
TDA6508A; TDA6509A; IF output
loaded with 75 Ω
fRF = 46 MHz; see Fig.11
fRF = 164 MHz; see Fig.11
fRF = 50 MHz; see Figs 12 and 13
fRF = 150 MHz; see Fig.13
18
18
−
21
21
8
24
24
10
10
dB
dB
dB
dB
NF
noise figure
−
8
2005 Mar 25
14
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
SYMBOL
Vo
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
output voltage (causing 1% TDA6508; TDA6509
cross-modulation in channel)
fRF = 43.25 MHz; see Fig.15
114
117
−
dBµV
dBµV
fRF = 161.25 MHz; see Fig.15
TDA6508A; TDA6509A
114
117
−
fRF = 43.25 MHz; see Fig.16
fRF = 161.25 MHz; see Fig.16
fRF = 161.25 MHz; note 2
106
106
−
109
109
90
−
−
−
dBµV
dBµV
dBµV
Vi
input voltage (causing
pulling in channel at 750 Hz)
gos
gi
optimum source
conductance for noise figure
fRF = 50 MHz
−
0.7
−
mS
input conductance
input capacitance
fRF = 43.25 MHz; see Fig.5
fRF = 161.25 MHz; see Fig.5
−
−
−
0.3
0.3
1
−
−
−
mS
mS
pF
Ci
fRF = 43.25 to 161.25 MHz;
see Fig.5
LOW OSCILLATOR
fosc(o)
oscillator operational
60
−
600
MHz
frequency
fosc
oscillator frequency
note 3
82.15
−
200.15 MHz
∆fosc(V)
oscillator frequency variation ∆VCC = 5%; note 4
−
−
−
20
50
900
−
−
−
kHz
kHz
kHz
with supply voltage
∆VCC = 10%; note 4
∆fosc(T)
oscillator frequency variation ∆T = ±25 °C; with compensation;
with temperature
note 5
∆T = 35 °C; without compensation;
−
1700
−
kHz
note 5
Φosc
phase noise, carrier-to-noise worst case in the frequency range
sideband
±100 kHz frequency offset
−
−
−110
−90
90
−107
−87
−
dBc/Hz
dBc/Hz
mV
±10 kHz frequency offset
RSC(p-p)
FMmod
ripple susceptibility of VCC
(peak-to-peak value)
4.75 V <VCC <5.25 V; worst case in 15
the frequency range; ripple
frequency 500 kHz; note 6
FM modulation caused by
I2C communication
worst case; note 7
−
−
2.12
kHz
MID MIXER (INCLUDING IF PREAMPLIFIER)
fO(RF)
fRF
RF operational frequency
RF frequency
40
−
−
800
MHz
fpc; note 1
154.25
447.25 MHz
2005 Mar 25
15
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
SYMBOL
Gv
PARAMETER
voltage gain
CONDITIONS
MIN.
TYP.
MAX.
UNIT
TDA6508; TDA6509; IF output
loaded with 1.25 kΩ
fRF = 157 MHz; see Fig.17
fRF = 450 MHz; see Fig.17
22
25
28
dB
22
25
28
dB
TDA6508A; TDA6509A; IF output
loaded with 75 Ω
f
RF = 157 MHz; see Fig.18
18
18
−
21
21
8
24
24
10
10
dB
dB
dB
dB
fRF = 450 MHz; see Fig.18
NF
Vo
noise figure
fRF = 150 MHz; see Figs 12 and 13
fRF = 300 MHz; see Figs 12 and 13
−
8
output voltage (causing 1% TDA6508; TDA6509
cross-modulation in channel)
fRF = 154.25 MHz; see Fig.19
114
114
117
117
−
−
dBµV
dBµV
fRF = 447.25 MHz; see Fig.19
TDA6508; TDA6509A
fRF = 154.25 MHz; see Fig.20
fRF = 447.25 MHz; see Fig.20
fRF = 447.25 MHz; note 2
106
106
−
109
109
90
−
−
−
dBµV
dBµV
dBµV
Vi
input voltage (causing
pulling in channel at 750 Hz)
gos
optimum source
conductance for noise figure
fRF = 150 MHz
−
−
−
−
−
0.9
1.5
0.21
1.8
0.6
−
−
−
−
−
mS
mS
mS
mS
pF
fRF = 300 MHz
gi
input conductance
fRF = 154.25 MHz
fRF = 447.25 MHz
fRF = 154.25 to 447.25 MHz
Ci
input capacitance
MID OSCILLATOR
fosc(o)
oscillator operational
60
600
MHz
frequency
fosc
oscillator frequency
note 3
193.15
−
486.15 MHz
∆fosc(V)
oscillator frequency variation ∆VCC = 5%; note 4
−
−
−
15
−
−
−
kHz
kHz
kHz
with supply voltage
∆VCC = 10%; note 4
40
∆fosc(T)
oscillator frequency variation ∆T = ±25 °C; with compensation;
1200
with temperature
note 5
∆T = 35 °C; without compensation;
−
2000
−
kHz
note 5
Φosc
phase noise, carrier-to-noise worst case in the frequency range
sideband
±100 kHz frequency offset
−
−
−109
−87
70
−106
−86
−
dBc/Hz
dBc/Hz
mV
±10 kHz frequency offset
RSC(p-p)
FMmod
ripple susceptibility of VCC
(peak-to-peak value)
4.75 V <VCC <5.25 V; worst case in 15
the frequency range; ripple
frequency 500 kHz; note 6
FM modulation caused by
I2C communication
worst case; note 7
−
−
2.12
kHz
2005 Mar 25
16
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
HIGH MIXER (INCLUDING IF PREAMPLIFIER)
fO(RF)
fRF
RF operational frequency
RF frequency
200
900
MHz
fpc; note 1
439.25
−
863.25 MHz
Gv
voltage gain
TDA6508; TDA6509; IF output
loaded with 1.25 kΩ
fRF = 442 MHz; see Fig.21
fRF = 866 MHz; see Fig.21
33
33
36
36
39
39
dB
dB
TDA6508A; TDA6509A; IF output
loaded with 75 Ω
fRF = 442 MHz; see Fig.22
fRF = 866 MHz; see Fig.22
fRF = 439.25 MHz; see Fig.23
fRF = 863.25 MHz; see Fig.23
29
29
−
32
32
7
35
35
9
dB
dB
dB
dB
NF
Vo
noise figure (not corrected
for image)
−
7
9
output voltage (causing 1% TDA6508; TDA6509
cross-modulation in channel)
fRF = 439.25 MHz; Fig.25
114
114
117
117
−
−
dBµV
dBµV
fRF = 863.25 MHz; Fig.25
TDA6508A; TDA6509A
fRF = 439.25 MHz; Fig.26
fRF = 863.25 MHz; Fig.26
fRF = 863.25 MHz; note 2
106
106
−
109
109
75
−
−
−
dBµV
dBµV
dBµV
Vi
Zi
input voltage (causing
pulling in channel at 750 Hz)
input impedance (RS + jωLS) RS at fRF = 439.25 MHz
RS at fRF = 863.25 MHz
−
−
−
−
28
34
8
−
−
−
−
Ω
Ω
LS at fRF = 439.25 MHz
nH
nH
LS at fRF = 863.25 MHz
8
HIGH OSCILLATOR
fosc(o)
oscillator operational
300
1000
MHz
frequency
fosc
oscillator frequency
note 3
478.15
−
902.15 MHz
∆fosc(V)
oscillator frequency variation ∆VCC = 5%; note 4
−
−
−
40
−
−
−
kHz
kHz
kHz
with supply voltage
∆VCC = 10%; note 4
80
∆fosc(T)
oscillator frequency variation ∆T = ±25 °C; with compensation;
2700
with temperature
note 5
∆T = 35 °C; without compensation;
−
4100
−
kHz
note 5
Φosc
phase noise, carrier-to-noise worst case in the frequency range
sideband
±100 kHz frequency offset
−
−
−105
−85
50
−102
−82
−
dBc/Hz
dBc/Hz
mV
±10 kHz frequency offset
RSC(p-p)
ripple susceptibility of VCC
(peak-to-peak value)
4.75 V <VCC <5.25 V; worst case in 15
the frequency range; ripple
frequency 500 kHz; note 6
2005 Mar 25
17
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
SYMBOL
PARAMETER
CONDITIONS
worst case; note 7
MIN.
TYP.
MAX.
3.0
UNIT
kHz
FMmod
FM modulation caused by
I2C communication
−
−
WEAK SIGNAL BOOSTER
∆Gv(WSB)
gain increase when the
weak signal booster mode is IF = 36.15 MHz
activated
TDA6508; TDA6509;
13
7
16
10
−
−
dB
dB
TDA6508A; TDA6509A;
IF = 36.15 MHz
IF PREAMPLIFIER
fO(IF)
Zo
IF operational frequency
5
60
MHz
output impedance
(RS + jωLS)
TDA6508; TDA6509
RS at 36.15 MHz
LS at 36.15 MHz
−
−
100
52
−
−
Ω
nH
TDA6508A; TDA6509A
RS at 36.15 MHz
LS at 36.15 MHz
−
−
40
12
−
−
Ω
nH
REJECTION AT THE IF OUTPUT
INTdiv
IRxtal
Rref
level of divider interferences worst case; note 8
in the IF signal
−
24
80
66
66
−
−
−
−
dBµV
dBc
crystal oscillator
interferences rejection
worst case in the frequency range; 60
note 9
reference frequency
rejection
worst case in the frequency range; 60
fref = 62.5 kHz; note 10
dBc
INTSO2
channel SO2 beat
Vpc = 80 dBµV; note 11
60
dBc
Notes
1. The range of fRF is defined by the range of fosc and I; fpc = picture carrier frequency.
2. Vi is the level of fRF (100% amplitude modulated with 11.89 kHz) that causes the frequency of the oscillator signal to
deviate by 750 Hz; it produces sidebands 30 dB below the level of the oscillator signal.
3. Limits are related to the tank circuits used in Fig.27; frequency bands may be adjusted by the choice of external
components.
4. The oscillator frequency shift is defined as a change in oscillator frequency when the supply voltage varies from
VCC = 5 V to 4.75 V (or 5 V to 4.5 V) or from VCC = 5 V to 5.25 V (or 5 V to 5.5 V). The oscillator is free running
during this measurement.
5. The oscillator frequency drift is defined as a change in oscillator frequency when the ambient temperature varies from
Tamb = 25 °C to 50 °C (60 °C max.) or from Tamb = 25 °C to 0 °C. The oscillator is free running during this
measurement. For ∆T = ±25 °C measurements, the tank circuit has temperature compensated values;
for ∆T = 35 °C measurements, the tank circuit has non-temperature compensated values.
6. The ripple susceptibility is measured with a 500 kHz ripple signal applied to the supply voltage. The level of the ripple
signal is increased until a difference of 53.5 dB occurs between the level of the IF carrier, fixed at 110 dBµV for
TDA6508; TDA6509 or 100 dBµV for TDA6508A; TDA6509A, and the sideband components.
7. FM modulation of the local oscillator resulting from I2C-bus communication is measured at the IF output using a
modulation analyzer with a peak-to-peak detector and a post detection filter of 20 Hz to 100 kHz. I2C-bus messages
sent to the tuner address the tuner without changing the contents of the PLL registers. The maximum I2C-bus clock
rate is 400 kHz. The I2C-bus pull-up resistor values are 1.5 kΩ.
2005 Mar 25
18
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
8. This is the level of signals close to the IF frequency which can interfere with the dividers. Typical interference signals
are channel S3: fosc = 256.15 MHz, 5⁄32 fosc = 40.02 MHz. The LOW and MID RF inputs must not be connected to
any load or cable; the HIGH RF inputs are connected to a hybrid (balun).
9. Crystal oscillator interference is the 4 MHz sidebands produced by the crystal oscillator. The rejection must be
greater than 60 dB for an IF output signal of 110 dBµV for versions TDA6508; TDA6509 or 100 dBµV for versions
TDA6508A; TDA6509A.
10. Reference frequency rejection measures the level of reference frequency sidebands with respect to the sound
sub-carrier fssc
.
11. Channel SO2 beat is the interfering product of the picture carrier frequency fpc, fIF and fOSC in channel SO2:
fBEAT = fosc − 2 × fIF = 37.35 MHz. Another possible mechanism is: 2 × fpc − fosc. For the measurement,
VRF = 80 dBµV.
1
2
0.5
− j
+ j
2
1
0.5
43.25 MHz
0
∞
161.25 MHz
0.5
2
MDB220
1
Fig.5 Input admittance (S11) of the LOW band mixer (43.25 to 161.25 MHz); YO = 20 mS.
2005 Mar 25
19
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
1
2
0.5
− j
2
1
0.5
0
∞
154.25 MHz
+ j
447.25 MHz
0.5
2
MDB221
1
Fig.6 Input admittance (S11) of the MID band mixer (154.25 to 447.25 MHz); YO = 10 mS.
1
2
0.5
863.25 MHz
439.25 MHz
+ j
− j
0.5
1
2
0
∞
0.5
2
MDB222
1
Fig.7 Input impedance (S11) of the HIGH band mixer (439.25 to 863.25 MHz); ZO = 100 Ω.
2005 Mar 25
20
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
1
2
0.5
+ j
36.15 MHz
1
0.5
2
0
∞
− j
0.5
2
MDB223
1
Fig.8 Output impedance of TDA6508; TDA6509; ZO = 100 Ω.
1
2
0.5
+ j
− j
36.15 MHz
1
0.5
2
0
∞
0.5
2
MDB224
1
Fig.9 Output impedance of TDA6508A; TDA6509A; ZO = 50 Ω.
2005 Mar 25
21
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
13 TEST AND APPLICATION INFORMATION
signal
source
50 Ω
LOW_RFIN
IFAMP_OUT1
spectrum
analyzer
V
o
V
o(meas)
V
i
V
e
50 Ω
i(meas)
V
50 Ω
D.U.T.
2 x 5
turns
2
turns
IFAMP_OUT2
N1/N2 = 5
GND
RMS
voltmeter
mdb265
Zi >> 50 Ω
Vi = 2 × Vi(meas) = 80 dBµV.
Vi = Vi(meas) + 6 dB = 80 dBµV.
Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss).
Vo
Gv = 20 log
------
Vi
PAL fIF = 36.15 MHz.
Fig.10 Gain measurement in the LOW-band of the TDA6508; TDA6509.
signal
source
50 Ω
LOW_RFIN
27 Ω
IFAMP_OUT1
spectrum
analyzer
e
V
V
i
V
50 Ω
i(meas)
D.U.T.
V
V
o(meas)
50 Ω
o
RMS
voltmeter
MDB266
Zi >> 50 Ω
Vi = 2 × Vi(meas) = 80 dBµV.
Vi = Vi(meas) + 6 dB = 80 dBµV.
Vo = Vo(meas) + 3.75 dB.
Vo
Gv = 20 log
------
Vi
PAL fIF = 36.15 MHz.
Fig.11 Gain measurement in the LOW-band of the TDA6508A; TDA6509A.
22
2005 Mar 25
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
I1
I3
PCB
PCB
C1
C3
BNC
BNC
plug
plug
I2
L1
C2
RIM-RIM
RIM-RIM
C4
(a)
(b)
FCE578
(a) fRF = 50 MHz:
(b) For fRF = 150 MHz:
LOW band mixer frequency response measured = 57 MHz, loss = 0 dB.
MID band mixer frequency response measured = 150.3 MHz,
loss = 0 dB.
image suppression = 16 dB.
C1 = 9 pF.
image suppression = 13 dB.
C3 = 5 pF.
C2 = 15 pF.
C4 = 25 pF.
L1 = 7 turns ( 5.5 mm, wire = 0.5 mm).
l2 = semi-rigid (RIM) cable, length = 30 cm.
l1 = semi-rigid (RIM) cable, length = 5 cm (33 dB/100 m,
50 Ω and 96 pF/m).
l3 = semi-rigid (RIM) cable, length = 5 cm (33 dB/100 m,
50 Ω and 96 pF/m).
Fig.12 Input circuit for optimum noise figure in LOW and MID-bands.
BNC
RIM
LOW_RFIN or
MID_RFIN
NOISE
SOURCE
NOISE
METER
IFAMP_OUT1
INPUT
CIRCUIT
D.U.T.
2 x 5
turns
2
turns
IFAMP_OUT2
N1/N2 = 5
GND
mdb263
NF = NFmeas − input circuit loss (dB).
Fig.13 Noise figure measurement in the LOW and MID-bands of the TDA6508; TDA6509.
2005 Mar 25
23
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
NOISE
LOW_RFIN or
MID_RFIN
BNC
RIM
SOURCE
NOISE
FIGURE
METER
27 Ω
IFAMP_OUT1
INPUT
CIRCUIT
D.U.T.
MDB264
NF = fmeas − input circuit loss (dB).
Fig.14 Noise figure measurement in the LOW and MID-bands of the TDA6508A; TDA6509A.
unwanted
signal
source
FILTER
50 Ω
18 dB
attenuator
LOW_RFIN
A
C
AM = 30%
e
IFAMP_OUT1
u
modulation
analyzer
38.9 MHz
V
o
HYBRID
V
D.U.T.
i
50 Ω
V
V
2 x 5
turns
2
turns
o(meas)
50 Ω
B
D
IFAMP_OUT2
N1/N2 = 5
wanted
signal
RMS
voltmeter
e
50 Ω
w
source
MDB261
Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss).
Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 110 dBµV.
Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz.
Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.
fRF(w) = 43.25 MHz (min); 161.25 MHz (max).
fRF(u) = 48.75 MHz (min); 166.75 MHz (max).
fosc = 82.15 MHz (min); 200.15 MHz (max.).
Fig.15 Cross-modulation measurement in the LOW-band of the TDA6508; TDA6509.
2005 Mar 25
24
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
unwanted
signal
source
FILTER
50 Ω
50 Ω
18 dB
attenuator
A
C
LOW_RFIN
27 Ω
AM = 30%
IFAMP_OUT1
e
modulation
analyzer
u
38.9 MHz
V
HYBRID
D.U.T.
i
50 Ω
V
V
V
o(meas)
o
B
D
wanted
signal
source
e
50
Ω
w
RMS
voltmeter
MDB262
Vo = Vo(meas) + 3.75 dB (transformer ratio N1/N2 and transformer loss).
Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 100 dBµV.
Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz.
Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.
fRF(w) = 43.25 MHz (min.); 161.25 MHz (max.).
fRF(u) = 48.75 MHz (min.); 166.75 MHz (max.).
fosc = 82.15 MHz (min.); 200.15 MHz (max.).
Fig.16 Cross-modulation measurement in the LOW-band of the TDA6508A; TDA6509A.
signal
source
50 Ω
MID_RFIN1
A
C
IFAMP_OUT1
spectrum
analyzer
V
V
o
V
i(meas)
o(meas)
e
V
50 Ω
V
i
HYBRID
50 Ω
D.U.T.
2 x 5
turns
2
turns
IFAMP_OUT2
MID_RFIN2
B
D
N1/N2 = 5
RMS
voltmeter
50 Ω
mdb259
Zi >> 50 Ω, symmetrical input.
Hybrid loss = 1 dB.
Vi = Vi(meas) − loss + 6 + 3 = 80 dBµV.
Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss).
Vo
Gv = 20 log
------
Vi
PAL fIF = 36.15 MHz.
Fig.17 Gain measurement in the MID-band of the TDA6508; TDA6509.
2005 Mar 25
25
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
signal
source
50 Ω
A
MID_RFIN1
C
27 Ω
IFAMP_OUT1
spectrum
analyzer
V
e
i(meas)
V
50 Ω
V
HYBRID
D.U.T.
i
50 Ω
V
V
o
o(meas)
B
D
MID_RFIN2
RMS
voltmeter
50 Ω
MDB260
Zi >> 50 Ω symmetrical input.
Hybrid loss = 1 dB.
Vi = Vi(meas) − loss + 6 + 3 = 80 dBµV.
Vo = Vo(meas) + 3.75 dB.
Vo
Gv = 20 log
------
Vi
PAL fIF = 36.15 MHz.
Fig.18 Gain measurement in the MID-band of the TDA6508A; TDA6509A.
unwanted
signal
source
FILTER
50 Ω
18 dB
attenuator
MID_RFIN1
A
C
A
C
AM = 30%
IFAMP_OUT1
e
u
modulation
analyzer
38.9 MHz
V
o
V
i
HYBRID
HYBRID
D.U.T.
V
50 Ω
V
2 x 5
turns
2
turns
o(meas)
IFAMP_OUT2
MID_RFIN2
50 Ω
N1/N2 = 5
RMS
voltmeter
B
D
B
D
wanted
signal
source
50
Ω
50
Ω
e
w
MDB253
Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss).
Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 110 dBµV.
Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz.
Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.
fRF(w) = 154.25 MHz (min.); 447.25 MHz (max.).
fRF(u) = 159.75 MHz (min.); 452.75 MHz (max.).
fosc = 193.15 MHz (min.); 486.15 MHz (max.).
Fig.19 Cross-modulation measurement in the MID-band of the TDA6508; TDA6509.
2005 Mar 25
26
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
unwanted
signal
source
FILTER
18 dB
attenuator
50 Ω
A
A
C
C
MID_RFIN1
27 Ω
AM = 30%
IFAMP_OUT1
e
u
modulation
analyzer
38.9 MHz
V
HYBRID
HYBRID
D.U.T.
i
50 Ω
V
V
V
o(meas)
o
50 Ω
B
D
B
D
MID_RFIN2
wanted
signal
e
w
RMS
voltmeter
source
50 Ω
50 Ω
MDB254
Vo = Vo(meas) + 3.75 dB.
Wanted output signal at fpix; Vo(w) = 100 dBµV.
Unwanted output signal at fsnd; AM = 30%; AF = 2 kHz.
Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.
fRF(w) = 154.25 MHz (min.); 447.25 MHz (max.).
fRF(u) = 159.75 MHz (min.); 452.75 MHz (max.).
fosc = 193.15 MHz (min.); 486.15 MHz (max.).
Fig.20 Cross-modulation measurement in the MID-band of the TDA6508A; TDA6509A.
signal
source
50 Ω
HIGH_RFIN1
IFAMP_OUT1
A
C
spectrum
analyzer
V
V
o
V
i(meas)
o(meas)
e
V
50 Ω
V
i
HYBRID
50 Ω
D.U.T.
2 x 5
turns
2
turns
IFAMP_OUT2
HIGH_RFIN2
N1/N2 = 5
B
D
RMS
voltmeter
50 Ω
mdb257
Hybrid loss = 1 dB.
Vi = Vi(meas) − loss = 70 dBµV.
Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss).
Vo
Gv = 20 log
------
Vi
PAL fIF = 36.15 MHz.
Fig.21 Gain measurement in the HIGH-band of the TDA6508; TDA6509.
2005 Mar 25
27
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
signal
source
50 Ω
A
HIGH_RFIN1
IFAMP_OUT1
C
27 Ω
spectrum
analyzer
V
V
i
e
i(meas)
V
50 Ω
HYBRID
D.U.T.
50 Ω
V
V
o
o(meas)
B
D
HIGH_RFIN2
RMS
voltmeter
50 Ω
MDB258
Hybrid loss = 1 dB.
Vi = Vi(meas) − loss = 70 dBµV.
Vo = Vo(meas) + 3.75 dB.
Vo
Gv = 20 log
------
Vi
PAL fIF = 36.15 MHz.
Fig.22 Gain measurement in the HIGH-band of the TDA6508A; TDA6509A.
A
C
HIGH_RFIN1
IFAMP_OUT1
NOISE
SOURCE
NOISE
METER
2 x 5
turns
2
turns
HYBRID
D.U.T.
IFAMP_OUT2
HIGH_RFIN2
N1/N2 = 5
B
D
mdb255
50 Ω
Hybrid loss = 1 dB.
NF = NFmeas − hybrid loss.
Fig.23 Noise figure measurement in the HIGH-band of the TDA6508; TDA6509.
2005 Mar 25
28
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
A
C
HIGH_RFIN1
IFAMP_OUT1
NOISE
SOURCE
NOISE
FIGURE
METER
27 Ω
HYBRID
D.U.T.
B
D
HIGH_RFIN2
MDB256
50 Ω
Hybrid loss = 1 dB.
NF = NFmeas − hybrid loss.
Fig.24 Noise figure measurement in the HIGH-band of the TDA6508A; 6509A.
unwanted
signal
source
FILTER
50 Ω
18 dB
attenuator
HIGH_RFIN1
IFAMP_OUT1
A
C
A
C
AM = 30%
e
u
modulation
analyzer
38.9 MHz
o(meas)
V
o
V
i
HYBRID
HYBRID
D.U.T.
V
50 Ω
V
2 x 5
turns
2
turns
IFAMP_OUT2
HIGH_RFIN2
50 Ω
N1/N2 = 5
RMS
voltmeter
B
D
B
D
wanted
signal
source
50
Ω
50
Ω
e
w
MDB251
Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss).
Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 110 dBµV.
Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz.
Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.
fRF(w) = 439.25 MHz (min.); 863.25 MHz (max.).
fRF(u) = 444.75 MHz (min.); 868.75 MHz (max.).
fosc = 478.15 MHz (min.); 902.15 MHz (max.).
Fig.25 Cross-modulation measurement in the HIGH-band of the TDA6508; TDA6509.
2005 Mar 25
29
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
unwanted
signal
source
FILTER
18 dB
attenuator
50 Ω
A
A
C
C
HIGH_RFIN1
IFAMP_OUT1
27 Ω
AM = 30%
e
u
modulation
analyzer
38.9 MHz
V
HYBRID
HYBRID
D.U.T.
i
50 Ω
V
V
V
o(meas)
o
50 Ω
B
D
B
D
HIGH_RFIN2
wanted
signal
e
w
RMS
voltmeter
source
50 Ω
50 Ω
MDB252
Vo = Vo(meas) + 3.75 dB.
Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 100 dBµV.
Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz.
We measure the level of unwanted signal causing 0.3% AM modulation in the wanted signal
fRF(w) = 439.25 MHz (min.); 863.25 MHz (max.).
fRF(u) = 444.75 MHz (min.); 868.75 MHz (max.).
fosc = 478.15 MHz (min.); 902.15 MHz (max.).
Fig.26 Cross-modulation measurement in the HIGH-band of the TDA6508A; TDA6509A.
2005 Mar 25
30
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L2
R20
MID_RFIN1
HIGH_RFIN1
10 Ω
D6
D8
LOW_RFIN
J3
MID_RFIN2
J4
HIGH_RFIN2
BB187
C4
R5
5.6 kΩ
R3
J7 J5
J6
V
V
tune
tune
82 pF
C6
1 pF
C12
18 pF
C11
18 pF
C5
1.8 pF
C32
100 pF
C33
5.6 kΩ
BB187
R27
33 Ω
HIGH_RFIN1
HIGH_RFIN2
MID_RFIN1
MID_RFIN2
LOW_RFIN
RF_GND
MIX_OUT1
MIX_OUT2
IFAMP_IN1
IFAMP_IN2
P2
LOW_OSCIN
LOW_OSCOUT
OSC_GND
L3
1 (32)
2 (31)
3 (30)
(1) 32
(2) 31
(3) 30
R4
5.6 kΩ
R6
C15
4.7 nF
C27
C13
4.7 nF
4.7 nF
100 pF
C34
MID_OSCIN2
MID_OSCIN1
HIGH_OSCIN2
HIGH_OSCIN1
5.6 kΩ
39 pF D7
C35
4 (29)
5 (28)
6 (27)
7 (26)
8 (25)
9 (24)
10 (23)
(4) 29
(5) 28
(6) 27
(7) 26
(8) 25
(9) 24
(10) 23
R26
12 Ω
L4
BB179
R7
V
V
tune
CC
C29
100 pF
5.6 kΩ
39 pF
C21
4.7 nF
TDA6508
TDA6508A
(TDA6509)
(TDA6509A)
C10
4.7 nF
V
CC
L1
C22
4.7 nF
IFAMP_OUT2/IF_GND
IFAMP_OUT1
C16
C28
100 pF
1
4
6
4.7 nF
C17
PLL_GND
C26
12 pF
2
3
11 (22)
12 (21)
(11) 22
(12) 21
J8
J9
IFAMP_OUT
for test purposes only
P1
AS
AS
P0
VT
C31
R19
27 Ω
13 (20)
14 (19)
15 (18)
16 (17)
(13) 20
(14) 19
(15) 18
(16) 17
C7
CP
R2
IFAMP_OUT1
P3
4.7 nF
R11
39 kΩ
C18
68 nF
SDA
ADC/P4
V
tune
SCL
XTAL_REF
R16
1 kΩ 1 kΩ
R13
R14
1 kΩ
R15
1 kΩ
C9
4.7 nF
2.2 nF
R18
330 Ω
1 kΩ
C8
6.8 nF
ADC
R1
33 kΩ
R17
330 Ω
R12
1 kΩ
R8
V
30 V
CC
J2
+5 V
4.7 kΩ
C23
18 pF
J1
D5
D2
D3
D4
1
2
3
4
R9
D1
+5 V
1
4.7 kΩ
2
3
4
5
6
C2
10 uF
(50 V)
C3
10 uF
(50 V)
J12
Y1
4 MHz
XTAL_REF
C1
10 uF
(50 V)
J11
TEST
mdb249
The pin numbers in parenthesis refer to the TDA6509 and TDA6509A.
Fig.27 Measurement circuit for TDA6508; TDA6509; TDA6508A; TDA6509A: PAL application.
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
14 INTERNAL PIN CONFIGURATION
PIN
AVERAGE DC VOLTAGE (V)
SYMBOL
DESCRIPTION(1)
TDA6508 TDA6509
1, 2 32, 31
LOW
MID
HIGH
1.0
HIGH_RFIN1,
HIGH_RFIN2
−
−
1
2
(31)
(32)
MDB228
MID_RFIN1,
MID_RFIN2
3, 4
30, 29
−
1.0
−
3
4
(30)
(29)
MDB229
LOW_RFIN
5
28
1.8
−
−
5
(28)
MDB230
RF_GND
6
27
−
−
−
6
(27)
MDB231
MIX_OUT1,
MIX_OUT2
7, 8
26, 25
2.9
2.9
2.9
7
8
(26)
(25)
MDB232
2005 Mar 25
32
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
PIN
AVERAGE DC VOLTAGE (V)
SYMBOL
DESCRIPTION(1)
TDA6508 TDA6509
LOW
3.0
MID
HIGH
3.0
IFAMP_IN1,
IFAMP_IN2
9, 10
24, 23
3.0
9
(24)
10
(23)
MDB241
P0, P1, P2, P3
13, 12,
11, 14
20, 21,
22, 19
high-Z
or
high-Z
or
high-Z
or
V
CC − VDS
V
CC − VDS
VCC − VDS
11
12
13
14
(22)
(21) (20)
(19)
MDB242
SDA
15
18
high-Z
high-Z
high-Z
15
(18)
MDB244
SCL
16
17
high-Z
high-Z
high-Z
16
(17)
MDB243
XTAL_REF
17
16
1.6
1.6
1.6
17
(16)
MDB245
2005 Mar 25
33
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
PIN
AVERAGE DC VOLTAGE (V)
SYMBOL
ADC/P4
DESCRIPTION(1)
TDA6508 TDA6509
LOW
MID
HIGH
18
15
high-Z or
high-Z or
high-Z or
V
CC − VDS
V
CC − VDS
VCC − VDS
18
(15)
MDB246
CP
19
14
1.0
1.0
1.0
19
(14)
MDB247
VT
20
13
VVT
VVT
VVT
20
(13)
MDB248
AS
21
12
1.25
1.25
1.25
21
(12)
MDB236
PLL_GND
22
11
0
0
0
22
(11)
MDB237
2005 Mar 25
34
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
PIN
AVERAGE DC VOLTAGE (V)
SYMBOL
DESCRIPTION(1)
TDA6508 TDA6509
LOW
2.0
MID
HIGH
2.0
IFAMP_OUT1,
IFAMP_OUT2
23, 24
10, 9
2.0
23
24
(9)
(10)
MDB233
IF_GND
24
25
9
0
0
0
24
(9)
MDB238
VCC
8
supply voltage
5
5
5
HIGH_OSCIN1 26, 27
7, 6
2.3
2.3
1.3
26
(7)
27
(6)
MDB239
2005 Mar 25
35
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
PIN
AVERAGE DC VOLTAGE (V)
SYMBOL
DESCRIPTION(1)
TDA6508 TDA6509
LOW
2.3
MID
HIGH
2.3
MID_OSCIN1
28, 29
5, 4
1.3
28
(5)
29
(4)
MDB240
OSC_GND
30
3
0
0
0
30
(3)
MDB234
LOW_OSCOUT, 31, 32
LOW_OSCIN
2, 1
1.7, 2.9
1.4, 3.5
1.4, 3.5
31
(2)
32
(1)
MDB235
Note
1. The pin numbers in parenthesis apply to the TDA6508TT.
2005 Mar 25
36
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
15 PACKAGE OUTLINES
TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm
SOT487-1
D
E
A
X
c
y
H
v
M
A
E
Z
17
32
A
(A )
3
A
2
A
1
pin 1 index
θ
L
p
L
detail X
1
16
w
M
b
e
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
0.95
0.85
0.30
0.19
0.20
0.09
11.1
10.9
6.2
6.0
8.3
7.9
0.75
0.50
0.78
0.48
mm
1.1
0.65
0.25
1
0.2
0.1
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT487-1
MO-153
2005 Mar 25
37
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
SOT617-1
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
C
e
1
y
y
e
1/2 e
b
v
M
M
C
C
A B
C
1
w
9
16
L
17
8
e
e
E
h
2
1/2
e
1
24
terminal 1
index area
32
25
X
D
h
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
1
b
c
E
e
e
1
e
2
y
D
D
E
L
v
w
y
1
h
h
max.
0.05 0.30
0.00 0.18
5.1
4.9
3.25
2.95
5.1
4.9
3.25
2.95
0.5
0.3
mm
0.05 0.1
1
0.2
0.5
3.5
3.5
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-08-08
02-10-18
SOT617-1
- - -
MO-220
- - -
2005 Mar 25
38
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
16 SOLDERING
To overcome these problems the double-wave soldering
method was specifically developed.
16.1 Introduction to soldering surface mount
packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 seconds and 200 seconds
depending on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 °C to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending
on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all BGA, HTSSON..T and SSOP..T packages
16.4 Manual soldering
– for packages with a thickness ≥ 2.5 mm
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 seconds to 5 seconds
between 270 °C and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
16.3 Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2005 Mar 25
39
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
16.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
WAVE
REFLOW(2)
not suitable suitable
PACKAGE(1)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended(5)(6) suitable
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not recommended(7)
suitable
not suitable
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2005 Mar 25
40
Philips Semiconductors
Product specification
3-band mixer/oscillator and PLL for
terrestrial tuners
TDA6508; TDA6508A;
TDA6509; TDA6509A
17 DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
18 DEFINITIONS
19 DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2005 Mar 25
41
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2005
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R25/03/pp42
Date of release: 2005 Mar 25
Document order number: 9397 750 14909
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