TDA7053AN [NXP]
IC VOLUME CONTROL CIRCUIT, PDIP16, Audio Control IC;
| 型号： | TDA7053AN |
| 厂家： | 
NXP |
| 描述： | IC VOLUME CONTROL CIRCUIT, PDIP16, Audio Control IC 消费电路 商用集成电路 音频放大器 视频放大器 功率放大器 光电二极管 便携式 |
| 文件： | 总12页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA7053
2 x 1 W portable/mains-fed stereo
power amplifier
February 1994
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
GENERAL DESCRIPTION
The TDA7053 is an integrated class-B stereo power amplifier in a 16-lead dual-in-line (DIL) plastic package. The device,
consisting of two BTL amplifiers, is primarily developed for portable audio applications but may also be used in mains-fed
applications.
Features
• No external components
• No switch-ON/OFF clicks
• Good overall stability
• Low power consumption
• Short-circuit-proof.
QUICK REFERENCE DATA
PARAMETER
Supply voltage range
Total quiescent current
Output power
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
18
UNIT
V
3
6
9
V
P
R = ∞
I
−
16
mA
L
tot
R = 8 Ω;
L
V = 6 V
P
−
1.2
39
−
W
dB
%
P
O
Internal voltage gain
G
38
40
1.0
v
Total harmonic distortion
P = 0.1 W
THD
−
0.2
O
PACKAGE OUTLINE
16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 24.
February 1994
2
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
Fig.1 Block diagram.
February 1994
3
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
PINNING
1. SGND1 signal ground 1
9. OUT2A output 2 (positive)
2. IN1
3. n.c.
4. n.c.
input 1
10. GND2
11. n.c.
power ground 2
not connected
not connected
not connected
supply voltage
input 2
12. OUT2B output 2 (negative)
13. OUT1B output 1 (negative)
5.
V
P
6. IN2
14. GND1
15. n.c.
power ground 1
not connected
7. SGND2 signal ground 2
8. n.c.
not connected
16. OUT1A output 1 (positive)
Note
The information contained within the parentheses refer to the polarity of the loudspeaker terminal to which the output
must be connected.
FUNCTIONAL DESCRIPTION
The TDA7053 is a stereo output amplifier, with an internal gain of 39 dB, which is primarily for use in portable audio
applications but may also be used in mains-fed applications. The current trends in portable audio application design is
to reduce the number of batteries which results in a reduction of output power when using conventional output stages.
The TDA7053 overcomes this problem by using the Bridge-Tied-Load (BTL) principle and is capable of delivering 1.2 W
into an 8 Ω load (V = 6 V). The load can be short-circuited under all input conditions.
P
February 1994
4
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
Supply voltage
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
V
−
−
18
1.5
see Fig.2
+ 150
+ 150
V
A
P
Non-repetitive peak output current
Total power dissipation
I
OSM
P
tot
c
Crystal temperature
T
T
−
°C
°C
Storage temperature range
−55
stg
THERMAL RESISTANCE
From junction to ambient
R
50
K/W
th j-a
Power dissipation
Assuming: V = 6 V and R = 8 Ω:
P
L
The maximum sinewave dissipation is 1.8 W, therefore T
= 150 − (50 x 1.8) = 60 °C.
amb(max.)
Fig.2 Power derating curve.
February 1994
5
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
CHARACTERISTICS
V = 6 V; R = 8 Ω; T = 25 °C; unless otherwise specified; measured from test circuit, Fig.7.
amb
P
L
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
Total quiescent current
Input bias current
V
3
6
9
18
16
300
−
V
P
R = ∞; note 1
I
I
−
mA
nA
L
tot
−
100
50
100
−
bias
Supply voltage ripple rejection note 2
Input impedance
SVRR
40
−
dB
Z
−
kΩ
mV
mV
I
DC output offset voltage
note 3
∆V
∆V
−
100
100
13-16
12-9
−
−
Noise output voltage
(RMS value)
note 4
V
V
P
−
150
300
−
µV
µV
W
no(rms)
no(rms)
O
note 5
−
60
Output power
THD = 10%
−
1.2
−
Total harmonic distortion
Internal voltage gain
Channel balance
P = 0.1 W
THD
−
0.2
1.0
40
1
%
O
G
38
−
39
dB
dB
dB
kHz
v
∆G
−
v
Channel separation
Frequency response
note 3
α
40
−
−
−
f
0.02 to 20
−
Notes to the characteristics
1. With a practical load the total quiescent current depends on the offset voltage.
2. Ripple rejection measured at the output with R = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage (200 mV) is applied
S
to the positive supply rail.
3. R = 5 kΩ.
S
4. The noise output voltage (RMS value) is measured with R = 5 kΩ, unweighted and a bandwidth of 60 Hz to 15 kHz.
S
5. The noise output voltage (RMS value) is measured with R = 0 Ω and f = 500 kHz with 5 kHz bandwidth. If R = 8 Ω
S
L
and L = 200 µH the noise output current is only 100 nA.
L
February 1994
6
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
APPLICATION INFORMATION
Fig.3 Quiescent current as a function of voltage supply (V ); T
= 60 °C.
amb
P
Fig.4 Output power as a function of voltage supply (V ); THD = 10%; f = 1 kHz; T
= 60 °C.
P
amb
February 1994
7
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
Fig.5 Power dissipation as a function of output power; f = 1 kHz; T
= 60 °C.
amb
Fig.6 Total harmonic distortion as a function of output power; f = 1 kHz; T
8
= 60 °C.
amb
February 1994
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
Fig.7 Test and application circuit diagram.
February 1994
9
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
Fig.8 Printed-circuit board, track side.
Fig.9 Printed-circuit board, component side.
10
February 1994
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
February 1994
11
Philips Semiconductors
Product specification
2 x 1 W portable/mains-fed stereo
power amplifier
TDA7053
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
SOLDERING
Introduction
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
February 1994
12
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