TDA7057Q [NXP]
2 x 3 W stereo BTL audio output amplifier; 2× 3 W立体声BTL音频输出放大器器
| 型号： | TDA7057Q |
| 厂家： | 
NXP |
| 描述： | 2 x 3 W stereo BTL audio output amplifier |
| 文件： | 总9页 (文件大小：61K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA7057Q
2 x 3 W stereo BTL audio output
amplifier
May 1992
Objective specification
File under Integrated Circuits, IC01
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output
amplifier
TDA7057Q
FEATURES
GENERAL DESCRIPTION
• No external components
• No switch-on and off clicks
• Good overall stability
• Low power consumption
• Short-circuit proof
The TDA7057Q is a stereo output amplifier in a 13 pin
power package. The device is designed for battery-fed
portable stereo recorders and radios, but also suitable for
mains-fed applications.
• Low HF radiation
• ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOL
VP
PARAMETER
positive supply voltage range
output power
CONDITIONS
MIN.
3.0
TYP.
11
MAX.
18
UNIT
V
PO
GV
IP
VP = 11 V; RL = 16 Ω
−
3
−
W
voltage gain
39
−
40
10
0.25
41
14
1
dB
mA
%
total quiescent current
total harmonic distortion
VP = 11 V; RL = ∞
THD
PO = 0.5 W
−
ORDERING INFORMATION
EXTENDED TYPE
PACKAGE
NUMBER
PIN
PIN POSITION
MATERIAL
CODE
SOT141(1)
TDA7057Q
13
SBD
plastic
Note
1. SOT141-6; 1996 September 9.
May 1992
2
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
TDA7057Q
V
P
3
I + i
13
11
positive output 1
2
input 1
Ι
1
signal ground 1
I – i
negative output 1
TDA7057Q
I – i
10
negative output 2
4
input 2
ΙΙ
5
signal ground 2
I + i
8
positive output 2
7
12
6
9
MCD392
n.c.
n.c.
power
power
ground 1
ground 2
Fig.1 Block diagram.
May 1992
3
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
TDA7057Q
PINNING
SYMBOL
SGND1
PIN
DESCRIPTION
signal ground 1
handbook, halfpage
1
2
SGND1
1
2
3
4
5
6
7
8
9
VI(1)
voltage input 1
V
I (1)
VP
3
positive supply voltage
voltage input 2
V
P
VI(2)
4
V
I (2)
SGND2
n.c.
5
signal ground 2
not connected
SGND2
n.c.
6
n.c.
7
not connected
OUT2+
PGND2
OUT2−
OUT1−
PGND1
OUT1+
8
positive output 2
power ground 2
negative output 2
negative output 1
power ground 1
positive output 1
n.c.
TDA7057Q
9
OUT2
+
PGND2
10
11
12
13
OUT2 – 10
OUT1 – 11
PGND1 12
OUT1 + 13
MCD391
Fig.2 Pin configuration.
May 1992
4
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
TDA7057Q
FUNCTIONAL DESCRIPTION
The TDA7057Q is a stereo output amplifier, designed for battery-fed applications e.g. portable radios, but also suitable
for mains fed applications. The gain is internally fixed at 40 dB.
For space reason there is a trend to decrease the number of battery cells. This means a decrease in supply voltage,
resulting in a reduction of output power at conventional output stages. The latter is not preferred. Using the BTL principle
increases the output power. The TDA7057Q can deliver an output power of 3 W in a speaker load of 16 Ω with 11 V
supply.
The circuit is designed such that no external components are required. Special attention is given to switch-on and off
clicks, low HF radiation and a good overall stability. The load can be short-circuited at all input conditions.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
positive supply voltage range
repetitive peak output current
non repetitive peak output current
total power dissipation
CONDITIONS
MIN.
MAX.
18
UNIT
VP
−
−
−
−
V
A
A
IORM
IOSM
Ptot
Tstg
Tvj
1
1.5
9
Tcase < 60 °C
W
°C
°C
hr
storage temperature range
virtual junction temperature
short-circuit time
−55
−
+150
+150
1
Tsc
see note 1
−
Note to the limiting values
1. The load can be short-circuited at all input conditions.
THERMAL RESISTANCE
SYMBOL
Rth j-a
Rth j-c
PARAMETER
from junction to ambient in free air
from junction to case
THERMAL RESISTANCE
45 K/W
8 K/W
Note to the thermal resistance
VP = 11 V; RL = 16 Ω; The maximum sine-wave dissipation is = 3 W; Tamb (max) = 60 °C; Rth vj-a = (150 − 60)/3 = 30 K/W
Rth vj-a = Rth vj-c + Rth c-HS + Rth HS
Rth c-HS + Rth HS = 30 − 8 = 22 K/W
May 1992
5
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
TDA7057Q
CHARACTERISTICS
VP = 11 V; f = 1 kHz; RL = 16 Ω; Tamb = 25 °C; unless otherwise specified
SYMBOL
VP
IORM
PARAMETER
CONDITIONS
MIN.
3.0
TYP.
MAX.
18
UNIT
positive supply voltage range
repetitive peak output current
11
V
A
−
−
0.6
Operating position
IP
total quiescent current
RL = ∞; note 1
THD = 10%
PO = 0.5 W
−
10
14
−
mA
W
PO
output power
2.5
−
3
THD
GV
total harmonic distortion
voltage gain
0.25
40
1
%
39
−
41
300
−
dB
µV
µV
Vno(rms)
Vno(rms)
B
noise output voltage (RMS value)
noise output voltage (RMS value)
bandwidth
note 2
note 3
180
60
−
−
20 Hz to 20 kHz −
SVRR
Voff
ZI
supply voltage ripple rejection
DC output offset voltage
input impedance
note 4
36
−
60
−
−
dB
mV
kΩ
nA
dB
dB
RS = 5 kΩ
200
−
−
100
100
−
Ibias
α
input bias current
−
300
−
channel separation
channel balance
RS = 5 kΩ
40
−
GV
−
1
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted (20 Hz to 20 kHz).
3. The noise output voltage RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
With a practical load (RL = 16 Ω, L = 200 µH) the noise output current is only 50 nA.
4. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz.
The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail.
May 1992
6
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
TDA7057Q
APPLICATION INFORMATION
(1)
V
P
100 nF
220 µF
3
positive
output 1
I + i
13
11
2
input 1
R
5 kΩ
s
Ι
1
I – i
negative
output 1
TDA7057Q
I – i
10
negative
output 2
4
5
input 2
ΙΙ
R
5 kΩ
s
I + i
8
positive
output 2
7
6
12
9
n.c.
n.c.
MCD393
ground
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 3.
Fig.3 Test and application diagram.
May 1992
7
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
TDA7057Q
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
1
13
e
e
m
v
M
w
M
1
Z
2
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.2 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
3.4
1.7 5.08
0.8
4.3
0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT141-6
May 1992
8
Philips Semiconductors
Objective specification
2 x 3 W stereo BTL audio output amplifier
TDA7057Q
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 1992
9
相关型号：
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