TDA8444AT/N4,112 [NXP]
TDA8444AT;
NXP 
INTEGRATED CIRCUITS
DATA SHEET
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
1999 Apr 29
Product specification
Supersedes data of March 1991
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
FEATURES
• Eight DACs with 6-bit resolution
• Adjustable common output swing
• Push-pull outputs
• Outputs short-circuit protected
• Three programmable slave address bits
• Large supply voltage range
• Low temperature coefficient.
The TDA8444 contains eight programmable 6-bit DAC
outputs, an I2C-bus slave receiver with three (two for
SO16) programmable address bits and one input (VMAX) to
set the maximum output voltage. Each DAC can be
programmed separately by a 6-bit word to 64 values, but
V
MAX determines the maximum output voltage for all
GENERAL DESCRIPTION
DACs. The resolution will be approximately 1⁄64VMAX
.
The interface circuit is a bipolar IC in a DIP16, SO16, or
SO20 package made in an I2L-compatible 18 V process.
At power-on all DACs are set to their lowest value.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
TYP.
MAX.
13.2
UNIT
4.5
−
12
14
V
ICC
supply current
VCC = 12 V
−
−
V
V
mA
mW
V
P
power dissipation
input effective voltage
DAC output voltage
−
170
−
VVMAX
Vo(DACn)
1
CC − 2.0
CC − 0.5
VMAX = VCC
0.1
−
−
V
Vo(DACn)(max) maximum DAC output voltage 1 < VMAX < VCC − 2.0
Isource(min) minimum DAC source current data = 1FH
Isink(min) minimum DAC sink current data = 1FH
VMAX + 0.3 −
V
2
−
−
−
−
mA
mA
2
ORDERING INFORMATION
TYPE
PACKAGE
DESCRIPTION
NUMBER
NAME
VERSION
TDA8444
DIP16
SO16
SO20
plastic dual in-line package; 16 leads (300 mil); long body
plastic small outline package; 16 leads; body width 7.5 mm
plastic small outline package; 20 leads; body width 7.5 mm
SOT38-1
SOT162-1
SOT163-1
TDA8444T
TDA8444AT
1999 Apr 29
2
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
BLOCK DIAGRAM
V
V
A0
A1
A2
CC
1
EE
8
5
6
7
3
SDA
2
4
I C BUS
SLAVE RECEIVER
SCL
TDA8444
REFERENCE
2
V
VOLTAGE
MAX
GENERATOR
DAC0
DAC1
DAC2
DAC3
DAC4
DAC5
DAC6
DAC7
9
10
11
12
13
14
15
16
DAC0
DAC1
DAC2
DAC3
DAC4
DAC5
DAC6
DAC7
MGH513
Fig.1 Block diagram.
1999 Apr 29
3
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
PINNING
PIN
SYMBOL
DESCRIPTION
TDA8444
(DIP16)
TDA8444T
(SO16)
TDA8444AT
(SO20)
VCC
1
2
1
2
1
2
supply voltage
VMAX
SDA
SCL
A0
control input for DAC maximum output voltage
I2C-bus serial data input/output
I2C-bus serial clock
programmable address bit 0 for I2C-bus slave receiver
programmable address bit 1 for I2C-bus slave receiver
programmable address bit 2 for I2C-bus slave receiver
ground
3
3
3
4
4
4
5
6
7
A1
6
7
8
A2
7
−
9
VEE
8
8
10
11
13
14
15
16
17
18
20
DAC0
DAC1
DAC2
DAC3
DAC4
DAC5
DAC6
DAC7
n.c.
9
9
analog voltage output 0
10
11
12
13
14
15
16
−
10
11
12
13
14
15
16
5
analog voltage output 1
analog voltage output 2
analog voltage output 3
analog voltage output 4
analog voltage output 5
analog voltage output 6
analog voltage output 7
5, 6, 12, 19 not connected
handbook, halfpage
handbook, halfpage
V
V
1
16 DAC7
1
2
3
4
5
6
7
8
16 DAC7
15
CC
CC
V
V
2
3
4
5
6
7
8
15
DAC6
DAC6
14 DAC5
MAX
SDA
SCL
A0
MAX
SDA
SCL
n.c.
A0
14 DAC5
13
12
11
10
9
DAC4
DAC3
DAC2
DAC1
DAC0
13
12
11
10
9
DAC4
DAC3
DAC2
DAC1
DAC0
TDA8444
TDA8444T
A1
A2
A1
V
V
EE
EE
MGH512
MGL531
Fig.2 Pin configuration (TDA8444; DIP16).
Fig.3 Pin configuration (TDA8444T; SO16).
1999 Apr 29
4
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
handbook, halfpage
V
1
2
20 DAC7
19 n.c.
CC
V
MAX
SDA
3
18 DAC6
17 DAC5
16 DAC4
15 DAC3
14 DAC2
13 DAC1
12 n.c.
SCL
n.c.
n.c.
A0
4
5
TDA8444AT
6
7
A1
8
A2
9
V
10
11 DAC0
EE
MGL532
Fig.4 Pin configuration (TDA8444AT; SO20).
FUNCTIONAL DESCRIPTION
I2C-bus interface
The I2C-bus interface is a receive-only slave, which accepts data according the format shown in Table 1.
Table 1 I2C-bus format (see note 1)
S
0 1 0 0 A2 A1 A0 0
A
I3 I2 I1 I0 SD SC SB SA
A
X X D5 D4 D3 D2 D1 D0
A
P
Note
1. S = START condition; A2 to A0 = programmable address bits; A = Acknowledge; I3 to I0 = Instruction bits;
SD to SA = subaddress bits; X = don’t care; D5 to D0 = data bits; P = STOP condition.
Valid addresses are:
TDA8444 and TDA8444AT: 40H, 42H, 44H, 46H, 48H, 4AH, 4CH and 4EH
TDA8444T: 48H, 4AH, 4CH and 4EH (A2 is always logic 1).
All other addresses cannot be acknowledged by the circuit. The actual slave address depends on the programmable
address bits A2, A1 and A0. This way up to eight circuits can be used on one I2C-bus.
Valid instructions are: 00H to 0FH; F0H to FFH.
1999 Apr 29
5
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
The circuit will not react to other combinations of the
4 instruction bits I3 to I0 than 0 or F, but will still generate
an acknowledge. The difference between
connected between these pins and VEE. This means that
normal bus line voltage should not exceed 5.5 V.
The address inputs A0, A1 and A2 can be easily
programmed by either a connection to VEE (An = 0) or VCC
(An = 1). If the inputs are left floating the result will be
An = 1.
instruction 0 and F is only important when more than one
data byte is sent within one transmission. Instruction 0
causes the data bytes to be written into the DAC-latches
with consecutive subaddresses starting with the
subaddress given in the instruction byte (auto-increment of
subaddress), while instruction F will cause a consecutive
writing of the data bytes into the same DAC-latch whose
subaddress was given in the instruction byte. In case of
only one data byte the DAC-latch with the subaddress
equal to the subaddress in the instruction byte will receive
the data.
VMAX
The VMAX input gives a means of compressing the DAC
output voltage swing. The maximum DAC output voltage
will be equal to VMAX + VDAC(min), while the 6-bit resolution
is maintained. This enables a higher voltage resolution for
smaller output swings.
Valid subaddresses are: 0H to 7H.
DACs
The subaddresses correspond to DAC0 to DAC7.
The Auto-Increment (AI) function of instruction 0,
however, works on all possible subaddresses 0 to F in
such a way that next to subaddress F, subaddress 0 will
follow, and so on.
The DACs consist of a 6-bit data-latch, current switches
and an opamp. The current sources connected to the
switches have values with weights 20 to 25. The sum of the
switched on currents is converted by the opamp into a
voltage between approximately 0.5 and 10.5 V if
The data will be latched into the DAC-latch on the
positive-going edge of the acknowledge related clock
pulse.
V
MAX = VCC = 12 V. The DAC outputs are short-circuit
protected against VCC and VEE. Capacitive load on the
DAC outputs should not exceed 2 nF in order to prevent
possible oscillations at certain levels. The temperature
coefficient for each of the outputs remains in all possible
conditions well below 0.1 LSB per Kelvin.
The specification of the SCL and SDA I/O meets the
I2C-bus specification. For protection against positive
voltage pulses on pins 3 and 4, zener diodes are
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER
VCC
MIN.
MAX.
UNIT
supply voltage
supply current
−0.5
−10
−
+18
+40
500
V
ICC
mA
mW
V
P(max)
Vi(n)
maximum power dissipation
input voltage
−0.5
−0.5
−0.5
−
+5.9
pins SDA and SCL
+5.9
V
pins VMAX, A0 to A2 and DAC0 to DAC7
current in all pins except VCC and VEE
storage temperature
VCC + 0.5
±10
V
In
mA
°C
°C
Tstg
Tamb
−65
−20
+150
+70
operating ambient temperature
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”.
1999 Apr 29
6
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
TDA8444
75
100
85
K/W
K/W
K/W
TDA8444T
TDA8444AT
note 1
note 1
Note
1. When mounted on a Printed-Circuit Board (PCB).
CHARACTERISTICS
VCC = 12 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCC
ICC
supply voltage
4.5
12
14
13.2
V
supply current
VMAX = VCC = 12 V;
data = 00H
12
19
mA
P
power dissipation
−
170
250
4
mW
V
Vrst
power reset voltage
1
−
Pin VMAX
Vi(VMAX)
Ii
input effective voltage
input current
1
−
−
−
−
−
V
CC − 2.0
V
VMAX = VCC
10
10
µA
µA
VMAX = 1 V
Pins SDA and SCL
VI
input voltage
0
−
−
−
−
−
5.5
1.0
−
V
VIL
VIH
IIL
LOW-level input voltage
HIGH-level input voltage
LOW-level input current
HIGH-level input current
−
V
3.0
V
VSDA = VSCL = −0.3 V −
−10
±10
µA
µA
IIH
VSDA = VSCL = 6 V
−
PIN SDA
VOL
LOW-level output voltage
output sink current
IL = 3 mA
−
−
0.4
V
Io(sink)
3
8
−
mA
Address bits (A0 to A2)
VI
input voltage
0
−
VCC
1.0
−
V
VIL
VIH
IIL
LOW-level input voltage
HIGH-level input voltage
LOW-level input current
HIGH-level input current
−
−
V
2.2
−10
−
−
V
VAn = VEE
VAn = VCC
−15
−
−
µA
µA
IIH
1
1999 Apr 29
7
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DACs (DAC0 to DAC7)
Vo
DAC output voltage
VMAX = VCC
0.1
0.1
−
V
CC − 0.5
V
V
Vo(min)
minimum output voltage
data = 00H;
0.28
0.5
IL = −2 mA
Vo(max)
maximum output voltage
data = 3FH;
IL = −2 mA
V
MAX = VCC
10.0
−
10.5
note 1
8
11.5
−
V
V
1 < VMAX < 10 V
Io(sink)
Io(source)
Zo
output sink current
VDAC = VCC
data = 1FH
;
2
15
mA
mA
Ω
output source current
output impedance
VDAC = VEE
data = 1FH
;
−2
−
−
−6
50
±0.5
±0.5
5
−2 ≤ IL ≤ +2 mA;
data = 1FH
4
DNL
differential non-linearity
integral non-linearity
DC gain match at full-scale
V
MAX = VCC
IL = −2 mA
;
;
−
−
LSB
LSB
%
INL
VMAX = VCC
IL = −2 mA
−
−
∆GFS
∆G/∆data
TC
data = 3FH;
−
−
IL = −2 mA
DC gain versus other DAC
data change
data = 3FH;
IL = −2 mA
−
<±0.5
<±0.1
−
LSB
LSB/K
temperature coefficient
data = 3FH;
−
−
IL = −2 mA
Note
Vswing
1. The output voltage is typically:
× V MAX + Vo (00H) with Vswing = Vo(3FH) − Vo(00H) for VMAX = VCC.
-------------------------------
(VCC – 2.0)
1999 Apr 29
8
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
TEST AND APPLICATION INFORMATION
MGH514
MGL533
12
12
handbook, halfpage
handbook, halfpage
V
V
= 12 V
V
MAX
V
O(DAC)
(V)
O(DAC)
(V)
V
= 12 V
CC
= 10 V
= 6 V
8
MAX
8
V
V
= 8 V
= 5 V
CC
V
MAX
4
0
4
0
CC
V
= 1 V
MAX
00 05 0A 0F 14 19 1E 23 28 2D 32 37 3C 3F
00 05 0A 0F 14 19 1E 23 28 2D 32 37 3C 3F
data (hex)
data (hex)
VMAX = VCC
.
VCC = 12 V.
Fig.6 DAC output voltage as a function of
programmed value.
Fig.5 DAC output voltage as a function of
programmed value.
1999 Apr 29
9
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
1999 Apr 29
10
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
H
v
M
A
E
y
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
detail X
e
w
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.41
0.014 0.009 0.40
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT162-1
075E03
MS-013AA
1999 Apr 29
11
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
1999 Apr 29
12
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1999 Apr 29
13
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Apr 29
14
Philips Semiconductors
Product specification
TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
NOTES
1999 Apr 29
15
Philips Semiconductors – a worldwide company
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© Philips Electronics N.V. 1999
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545002/750/03/pp16
Date of release: 1999 Apr 29
Document order number: 9397 750 04699
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