TDA8446 [NXP]
Fast RGB/YC switch for digital decoding; 快RGB / YC开关，数字解码
| 型号： | TDA8446 |
| 厂家： | 
NXP |
| 描述： | Fast RGB/YC switch for digital decoding |
| 文件： | 总16页 (文件大小：106K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8446
Fast RGB/YC switch for digital
decoding
1995 Feb 16
Product specification
Supersedes data of August 1992
File under Integrated Circuits, IC02
Philips Semiconductors
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
FEATURES
DESCRIPTION
• R, G, B clamped inputs
The TDA8446 is a video switch which has been designed
for use in Digital Multistandard System Decoders (DMSD)
in digital video system. The device is intended for matrixing
incoming RGB signals and for switching between
• Luminance and chrominance difference matrix
• Y-clamped inputs
• Fast switching between internal and external Y
• Chrominance input
luminance signals. It generates a SYNC signal and TTL
clamping pulses from any video signal with sync pulses.
• Amplifier with selectable gain
• 3-state switch for chrominance output.
APPLICATIONS
• Digital TV systems
• Desktop video architecture.
QUICK REFERENCE DATA
SYMBOL
VCC
Tamb
PARAMETER
MIN.
10.8
TYP.
MAX.
13.2
+70
UNIT
supply voltage
operating ambient temperature
−
−
V
0
°C
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
SOT146-1
SOT136-1
TDA8446
DIP20
SO28
plastic dual in-line package; 20 leads; (300 mil)
TDA8446T
plastic small outline package; 28 leads; body width 7.5 mm
1995 Feb 16
2
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
BLOCK DIAGRAM
Fig.1 Block diagram (TDA8446).
1995 Feb 16
3
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
PINNING
PIN
SYMBOL
DESCRIPTION
DIP20 SO28
SOUT
1
1
synchronization signal output; this output provides the synchronization information
extracted from the incoming signal at pin 2 (SIN).
SIN
2
3
2
3
synchronization signal input; CSYNC or CVBS signal from the peri-connector
CCL
clamping capacitor connection; the clamping pulse is generated by external circuitry
connected to this pin, the generated pulse clamps the RGB inputs.
n.c.
−
4
−
5
6
7
8
4
5
not connected
clamping pulse output
not connected
B-signal input
CLO
n.c.
6
BIN
GIN
RIN
SW1
7
8
G-signal input
R-signal input
9
10
clamping control signal input; this TTL signal is used to select the clamp signal, a LOW
level at this input forces the circuit to output the generated clamping pulse.
n.c.
CLI
−
11
12
not connected
9
clamping pulse input; this TTL signal indicates the black level clamping period for the
incoming Y signal (active-HIGH).
CIN
COUT
YIN
10
11
12
13
13
14
15
16
chrominance signal input
chrominance signal output
luminance signal input; this input also accepts the CVBS signal
FS
fast switching signal input; this signal is used to control fast switching of the luminance
signals, a HIGH level at this input forces the circuit to output the internal Y signal.
n.c.
−
−
17
18
19
not connected
not connected
n.c.
SW2
14
gain control signal input; this TTL signal is used to set the gain of the chrominance
amplifiers (A), a LOW level at this input forces the gain A to 6 dB (HIGH forces to 0 dB).
n.c.
−
20
21
22
23
24
25
26
27
28
not connected
−(R-Y)
YOUT
−(B−Y)
n.c.
15
16
17
−
−(R−Y) signal output
luminance signal output
−(B−Y) signal output
not connected
n.c.
−
not connected
VCC
18
19
20
positive supply voltage (+12 V)
internal decoupling
ground
VINT
VEE
1995 Feb 16
4
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
Fig.2 Pin configuration (DIP20).
Fig.3 Pin configuration (SO28).
1995 Feb 16
5
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCC
PARAMETER
MIN.
−0.3
MAX.
+14
UNIT
supply voltage
input voltage
V
V
VI
−0.3
−55
+12.3
+125
Tstg
storage temperature
°C
HANDLING
Each pin will withstand the ESD test in accordance with MIL-STD-883C class 2 (2000 V to 2999 V). Method 3015
(Human body model: R = 1500 Ω; C = 100 pF) 3 pulses positive and 3 pulses negative on each pin as a function of
ground. The IC will withstand 500 V in accordance with UZW-BO/FQ-B302 (Machine model: R = 0 Ω; C = 200 pF;
L = 2.5 µH) 3 pulses positive and 3 pulses negative.
OPERATING CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
Supply/temperature
VCC
supply voltage
operating ambient temperature
10.8
−
−
13.2
V
Tamb
0
+70
°C
TTL inputs (SW1, SW2 and CLI)
VIH
VIL
HIGH level input voltage
LOW level input voltage
2
−
−
VCC
V
V
−0.3
+0.8
SYNC signal (SIN)
VS(p-p) sync amplitude (peak-to-peak value)
Fast Switching input (FS)
0.2
−
2.5
V
VIH
VIL
HIGH level input voltage
LOW level input voltage
1
0
−
−
3
V
V
0.4
Video inputs (RIN, GIN, BIN, CIN, YIN)
Vi(p-p) video amplitude on RIN, GIN and BIN inputs
−
−
0.7
1
V
(peak-to-peak value)
CI
input capacitance
100
−
nF
Clamping pulse generator (CCL)
Rclamp
Cclamp
clamping resistance
clamping capacitance
−
−
4.7
1
−
−
kΩ
nF
1995 Feb 16
6
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
CHARACTERISTICS
VCC = 12 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX.
UNIT
Supply
ICC
supply current
supply voltage rejection ratio
−
−
−
75
mA
SVRR
note 1
30
−
dB
Y and R, G, B channels
ICL input clamping current
II
VCC = 6 V; VI = 0 V
VI = 9 V
0.3
−
−
mA
µA
dB
dB
dB
input current
−1.5 +0.5 +1.5
GA
gain of amplifier A
fi = 1 MHz; VSW2 = 2 V
fi = 1 MHz; VSW2 = 0.8 V
fi = 1 MHz
−1
5
0
6
0
+1
7
GB
gain of amplifier B
−1
+1
RGB matrixed according to the
following equations:
Y = 0.30R + 0.59G + 0.11B
R−Y = 0.70R − 0.59G − 0.11B
B−Y = −0.30R − 0.59G + 0.89B
relative gain difference
maximum gain variation
output resistance
∆Gdiff
|∆G|
RO
∆t
note 2
−
−
−
−
−
−
−
−
−
0
10
−
%
100 kHz < fi < 8 MHz
3
dB
Ω
15
−
−
time difference at output
DC output level
fi = 1 MHz; note 3
VCCL = 6 V
see Fig.4
25
−
ns
V
VO
4.2
20
10
0.7
0.5
tfsd
tfs
fast switching delay
−
ns
ns
µA
µA
fast switching time
see Fig.4
−
IIFS
input current on fast switching
control (pin 13)
VI = 0.4 V
−
VI = 1 V
−
Chrominance channel (CIN, COUT)
Ri
internal input resistance
DC output level
−
50
5
−
kΩ
V
VO
GA
II = 0
−
−
gain of amplifier A
fi = 1 MHz; VSW1 = VSW2 = 2 V
fi = 1 MHz; VSW2 = 0.8 V
100 kHz < fi < 8 MHz
fi = 5 MHz; VSW1 = VSW2 = 0.8 V
VSW1 = VSW2 = 0.8 V
−1
5
0
+1
7
dB
dB
dB
dB
kΩ
Ω
6
|∆G|
αoff
Zo
maximum gain variation
isolation (off state)
output impedance
output resistance
−
3
−
−
60
−
−
100
−
−
Ro
7
−
TTL inputs (SW1, SW2, CLI)
IIH
IIL
HIGH level input current
LOW level input current
VIH = 2 V
−
−
−
−
10
µA
µA
VIL = 0.8 V
−600
1995 Feb 16
7
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX.
UNIT
Clamp output (CLO)
VOL
VOH
LOW level output voltage
HIGH level output voltage
IOL = 2 mA
IOH = 10 µA
−
−
−
0.4
V
2.4
−
V
Synchronization channel (SOUT)
Vo(p-p)
output amplitude
0.2
−
1.5
V
(peak-to-peak value)
Notes
VR (CC)
1. Supply voltage rejection ratio = 20log
-------------------
VR (O)
2. The relative gain difference is measured when only one input signal (R, G or B) is present.
3. The inputs RIN, GIN and BIN are interconnected; ∆t is the maximum time coincidence error between the luminance
and the chrominance signals.
Fig.4 Fast switching times.
1995 Feb 16
8
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
APPLICATION INFORMATION
Fig.5 Typical application circuit.
1995 Feb 16
9
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
PACKAGE OUTLINES
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
D
M
E
A
2
A
A
w
1
L
c
e
M
Z
b
1
(e )
1
b
M
H
20
11
pin 1 index
E
1
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
(1)
(1)
Z
1
2
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
2.0
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.078
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-05-24
SOT146-1
SC603
1995 Feb 16
10
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
H
v
M
A
E
Z
28
15
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
14
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.71
0.014 0.009 0.69
0.30
0.29
0.42
0.39
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
91-08-13
95-01-24
SOT136-1
075E06
MS-013AE
1995 Feb 16
11
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
SOLDERING
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Plastic small outline packages
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
BY WAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.59+
1995 Feb 16
12
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Feb 16
13
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
NOTES
1995 Feb 16
14
Philips Semiconductors
Product specification
Fast RGB/YC switch for digital decoding
TDA8446
NOTES
1995 Feb 16
15
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© Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the
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533061/1500/01/pp16
Date of release: 1995 Feb 16
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