TDA8566TH [NXP]
2 x 40 W/2 ohm stereo BTL car radio power amplifier with differential inputs and diagnostic outputs; 2× 40瓦/ 2欧姆立体声BTL汽车收音机功率放大器具有差动输入和输出诊断
| 型号： | TDA8566TH |
| 厂家： | 
NXP |
| 描述： | 2 x 40 W/2 ohm stereo BTL car radio power amplifier with differential inputs and diagnostic outputs |
| 文件： | 总16页 (文件大小：95K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8566TH
2 × 40 W/2 Ω stereo BTL car radio
power amplifier with differential
inputs and diagnostic outputs
Objective specification
2001 Apr 24
File under Integrated Circuits, IC01
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
FEATURES
• Low power dissipation in any short-circuit condition
• Thermally protected
• Differential inputs
• Reverse polarity safe
• Very high Common Mode Rejection Ratio (CMRR)
• High common mode input signal handling
• Requires very few external components
• High output power
• Protected against electrostatic discharge
• No switch-on/switch-off plops
• Low thermal resistance.
• 4 and 2 Ω load driving capability
• Low offset voltage at output
• Fixed gain
GENERAL DESCRIPTION
The TDA8566TH is an integrated class-B output amplifier
contained in a 20-lead small outline plastic package. The
device contains 2 amplifiers in a Bridge-Tied Load (BTL)
configuration. The output power is 2 × 25 W in a 4 Ω load
or 2 × 40 W in a 2 Ω load. It has a differential input stage
and 2 diagnostic outputs. The device is primarily
developed for car radio applications.
• Diagnostic facility (distortion, short-circuit and
temperature pre-warning)
• Good ripple rejection
• Mode select switch (operating, mute and standby)
• Load dump protection
• Short-circuit proof to ground, to VP and across the load
QUICK REFERENCE DATA
SYMBOL
PARAMETER
operating supply voltage
repetitive peak output current
total quiescent current
standby current
CONDITIONS
MIN.
TYP. MAX. UNIT
VP
6
14.4
−
18
7.5
−
V
IORM
Iq(tot)
Istb
−
A
−
115
0.1
−
mA
µA
µA
kΩ
W
−
10
40
−
Isw
switch-on current
−
Zi
input impedance
100
−
120
25
40
60
50
75
26
−
Pout
output power
RL = 4 Ω; THD = 10%
RL = 2 Ω; THD = 10%
Rs = 0 Ω
−
−
−
W
SVRR
αcs
supply voltage ripple rejection
channel separation
−
−
dB
dB
dB
dB
µV
Rs = 10 kΩ
−
−
CMRR
Gv
common mode rejection ratio
closed loop voltage gain
noise output voltage
−
−
25
−
27
120
Vn(o)
Rs = 0 Ω
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA8566TH
HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-2
2001 Apr 24
2
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
BLOCK DIAGRAM
V
V
P1
12
P2
19
8
9
mute
switch
IN1+
IN1−
C
+
−
M
13
OUT1+
V
A
+
−
2.3
kΩ
2.3 kΩ
(9×)
mute
switch
C
+
−
M
15
OUT1−
V
A
+
−
60
kΩ
60
kΩ
2.3
kΩ
2.3 kΩ
(9×)
4, 5,
6, 7
n.c.
20
11
standby
switch
MODE
TDA8566TH
standby
reference
voltage
V
A
V
ref
mute
switch
10
CLIP
CLIP
DIAG
SGND
1×
1
DIAG
mute
reference
voltage
60
kΩ
60
kΩ
2
3
mute
switch
IN2+
IN2−
C
+
−
M
16
OUT2+
V
A
+
−
2.3
kΩ
2.3 kΩ
(9×)
mute
switch
C
+
−
M
18
OUT2−
V
A
+
−
2.3
kΩ
2.3 kΩ
(9×)
17
14
MGU358
PGND2
PGND1
Fig.1 Block diagram.
3
2001 Apr 24
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
PINNING
SYMBOL
PIN
DESCRIPTION
DIAG
1
short-circuit and temperature
pre-warning diagnostic output
IN2+
2
3
channel 2 input positive
channel 2 input negative
not connected
IN2−
n.c.
4
handbook, halfpage
MODE 20
1
2
DIAG
IN2+
IN2−
n.c.
n.c.
5
not connected
19
V
P2
n.c.
6
not connected
OUT2− 18
3
n.c.
7
not connected
17
PGND2
IN1+
8
channel 1 input positive
channel 1 input negative
signal ground
4
IN1−
9
OUT2+ 16
OUT1− 15
n.c.
5
TDA8566TH
SGND
CLIP
VP1
10
11
12
13
14
15
16
17
18
19
20
6
n.c.
clip detection output
supply voltage 1
PGND1
n.c.
14
7
OUT1+ 13
8
IN1+
IN1−
SGND
OUT1+
PGND1
OUT1−
OUT2+
PGND2
OUT2−
VP2
channel 1 output positive
power ground 1
V
12
9
P1
CLIP 11
10
channel 1 output negative
channel 2 output positive
power ground 2
MGU356
channel 2 output negative
supply voltage 2
MODE
mode select switch input
(standby/mute/operating)
Fig.2 Pin configuration.
2001 Apr 24
4
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
FUNCTIONAL DESCRIPTION
Short-circuit diagnostic (pin DIAG)
The TDA8566TH contains 2 identical amplifiers and can
be used for BTL applications. The gain of each amplifier is
fixed at 26 dB. Special features of this device are:
When a short-circuit occurs at one or more outputs to
ground or to the supply voltage, the output stages are
switched off until the short-circuit is removed and the
device is switched on again (with a delay of approximately
20 ms after the removal of the short-circuit). During this
short-circuit condition, pin DIAG is continuously LOW.
1. Mode select switch
2. Clip detection
3. Short-circuit diagnostic
4. Temperature pre-warning
5. Open-collector diagnostic outputs
6. Differential inputs.
When a short-circuit occurs across the load of one or both
channels, the output stages are switched off for
approximately 20 ms. After that time the load condition is
checked during approximately 50 µs to see whether the
short-circuit is still present. Due to this duty cycle of
50 µs/20 ms the average current consumption during the
short-circuit condition is very low (approximately 40 mA).
During this condition, pin DIAG is LOW for 20 ms and
HIGH for 50 µs; see Fig.4. The power dissipation in any
short-circuit condition is very low.
Mode select switch (pin MODE)
• Standby: low supply current
• Mute: input signal suppressed
• Operating: normal on condition.
Since this pin has a very low input current (<40 µA), a low
cost supply switch can be applied. To avoid switch-on
plops, it is advisable to keep the amplifier in the mute mode
for a period of ≥150 ms (charging the input capacitors at
pins IN1+, IN1−, IN2+ and IN2−). This can be realized by
using a microcontroller or by using an external timing
circuit as illustrated in Fig.7.
Temperature pre-warning (pin DIAG)
When the junction temperature (Tvj) reaches 145 °C,
pin DIAG will become continuously LOW.
Open-collector diagnostic outputs
Pins DIAG and CLIP are open-collector outputs, therefore
more devices can be tied together. Pins DIAG and CLIP
can also be tied together. An external pull-up resistor is
required.
Clip detection (pin CLIP)
When clipping occurs at one or more output stages, the
dynamic distortion detector becomes active and pin CLIP
goes LOW. This information can be used to drive a sound
processor or a DC volume control to attenuate the input
signal and so limit the level of distortion. The output level
of pin CLIP is independent of the number of channels that
are being clipped. The clip detection circuit is disabled in a
short-circuit condition, so if a fault condition occurs at the
outputs, pin CLIP will remain at a HIGH level. The clip
detection waveforms are illustrated in Fig.3.
Differential inputs
The input stage is a high-impedance fully differential
balanced input stage that is also capable of operating in
a single-ended mode with one of the inputs capacitively
coupled to an audio ground. It should be noted that if a
source resistance is added (input voltage dividers) the
CMRR degrades to lower values.
MGU357
V
handbook, halfpage
O
(V)
0
V
CLIP
(V)
0
t (s)
Fig.3 Clip detection waveforms.
2001 Apr 24
5
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
current
in
MGU360
output
stage
t (s)
short-circuit over the load
V
DIAG
(V)
20 ms
t (s)
50 µs
Fig.4 Short-circuit diagnostic timing diagram.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS
supply voltage operating
MIN.
MAX.
18
UNIT
VP
−
−
−
V
V
V
non-operating
30
45
load dump protection;
during 50 ms; tr ≥ 2.5 ms
IOSM
IORM
Tstg
Tvj
non-repetitive peak output current
repetitive peak output current
storage temperature
−
−
10
A
A
7.5
+150
150
+85
18
−55
−
°C
°C
°C
V
virtual junction temperature
ambient temperature
Tamb
Vpsc
Vrp
−40
−
short-circuit safe voltage
reverse polarity voltage
total power dissipation
−
6.0
60
V
Ptot
−
W
QUALITY SPECIFICATION
Quality specification in accordance with “SNW-FQ-611D”, if this type is used as an audio amplifier.
THERMAL CHARACTERISTICS
Thermal characteristics in accordance with IEC 60747-1.
SYMBOL
Rth(j-c)
PARAMETER
CONDITIONS
see Fig.5
VALUE
1.9
UNIT
K/W
K/W
thermal resistance from junction to case
thermal resistance from junction to ambient
Rth(j-a)
in free air
40
2001 Apr 24
6
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
output 1
output 2
handbook, halfpage
virtual junction
3.2 K/W
3.2 K/W
0.3 K/W
case
MGU361
Fig.5 Equivalent thermal resistance network.
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Fig.6; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
Iq
supply voltage
quiescent current
note 1
6
14.4
18
V
RL = ∞
−
115
180
mA
Operating condition
VMODE
IMODE
VO
mode select switch level
8.5
−
−
VP
40
−
V
mode select switch current
output voltage
VMODE = 14.4 V
note 2
15
7.0
−
µA
V
−
VOO
output offset voltage
−
100
mV
Mute condition
VMODE mode select switch level
VO
3.3
−
−
6.4
−
V
output voltage
note 2
7.0
−
V
VOO
output offset voltage
−
60
60
mV
mV
∆VOO
output offset voltage difference with respect to operating
condition
−
−
Standby condition
VMODE mode select switch level
Istb
0
−
2
V
standby current
−
0.1
10
µA
Diagnostic
VDIAG
diagnostic output voltage
during any fault condition
−
−
0.6
V
Notes
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.
2. At VP = 18 to 30 V the DC output voltage is ≤0.5VP.
2001 Apr 24
7
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
AC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; RL = 2 Ω; fi = 1 kHz; measured in test circuit of Fig.6; unless otherwise specified.
SYMBOL
PARAMETER
output power
CONDITIONS
THD = 0.5%
MIN.
25
TYP.
MAX.
UNIT
Po
30
40
55
25
35
19
25
35
14
−
−
−
−
−
−
−
−
−
W
W
W
W
W
W
W
W
W
THD = 10%
33
45
−
THD = 30%
VP = 13.5 V; THD = 0.5%
VP = 13.5 V; THD = 10%
THD = 0.5%; RL = 4 Ω
THD = 10%; RL = 4 Ω
THD = 30%; RL = 4 Ω
−
16
21
28
−
VP = 13.5 V; THD = 0.5%;
RL = 4 Ω
VP = 13.5 V; THD = 10%;
−
22
−
W
RL = 4 Ω
THD
B
total harmonic distortion
power bandwidth
Po = 1 W
−
−
−
−
0.1
8
−
−
−
−
%
%
%
VCLIP = 0.6 V; note 1
Po = 1 W; RL = 4 Ω
0.05
THD = 0.5%; Po = −1 dB
20 to 20000
Hz
with respect to 25 W
fro(l)
low frequency roll off
high frequency roll off
closed loop voltage gain
−1 dB; note 2
−1 dB
−
25
−
−
−
Hz
kHz
dB
dB
dB
dB
kΩ
kΩ
%
fro(h)
Gv
20
25
50
50
80
100
50
−
26
−
27
−
SVRR
supply voltage ripple
rejection
operating; note 3
mute; note 3
standby; note 3
differential
−
−
−
−
Zi
input impedance
120
60
2
150
75
−
single-ended
∆Zi
input impedance mismatch
noise output voltage
Vn(o)
operating; Rs = 0 Ω; note 4
−
85
100
120
−
µV
µV
operating; Rs = 10 kΩ;
−
note 4
mute; independent of Rs;
note 4
−
60
−
µV
αcs
channel separation
channel unbalance
Po = 25 W; Rs = 10 kΩ
45
−
−
−
dB
dB
∆Gv
−
1
2001 Apr 24
8
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
mV
Vo(mute)
CMRR
output signal voltage in mute Vin = Vin(max) = 1 V (RMS)
−
−
2
−
−
common mode rejection
ratio
Rs = 0 Ω; note 5
60
40
75
−
dB
dB
Rs = 45 kΩ; note 6
Notes
1. Dynamic distortion detector active; pin CLIP is LOW.
2. Frequency response externally fixed.
3. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω.
4. Noise measured in a bandwidth of 20 Hz to 20 kHz.
5. Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
common ≤ 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 Ω.
6. Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
common ≤ 3.5 V (RMS); fi = 1 kHz; Rs = 45 kΩ. The mismatch of the input coupling capacitors is excluded.
V
V
2001 Apr 24
9
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
TEST AND APPLICATION INFORMATION
+
+
V
P =
2200
µF/16V
100
nF
V
mode
14.4 V
_
_
20
12
19
8
9
+
_
+
−
13
+
_
R /2
s
220 nF
60
kΩ
TDA8566TH
R
V
L1
in1
60
kΩ
−
+
V
V
P
P
15
11
220 nF
R /2
s
10
kΩ
10
kΩ
CLIP
DETECTOR
CLIP
V
ref
+
−
10
2
DIAGNOSTIC
INTERFACE
1
DIAG
+
_
+
−
16 +
R /2
s
220 nF
220 nF
60
kΩ
R
V
L2
in2
60
kΩ
−
+
_
18
R /2
s
3
14
17
MGU359
Fig.6 Stereo BTL test diagram.
Application information
DIAGNOSTIC OUTPUT
+V
supply
S
handbook, halfpage
Special care must be taken in the PCB layout to separate
pin CLIP from pins IN1+, IN1−, IN2+ and IN2− to minimize
the crosstalk between the CLIP output and the inputs.
10 kΩ
47 µF
100 Ω
MODE SELECT SWITCH
mode
select
switch
To avoid switch-on plops, it is advisable to keep the
amplifier in the mute mode during ≥150 ms (charging of
the input capacitors at pins IN1+, IN1−, IN2+ and IN2−).
The circuit in Fig.7 slowly ramps-up the voltage at the
mode select switch pin when switching on and results in
fast muting when switching off.
100 kΩ
MGD102
Fig.7 Mode select switch circuit.
2001 Apr 24
10
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
PACKAGE OUTLINE
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-2
E
A
D
x
X
c
E
H
y
2
v
M
A
E
D
1
D
2
10
1
pin 1 index
Q
A
A
2
(A )
3
E
1
A
4
θ
L
p
detail X
20
11
w M
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
(1)
(2)
(2)
A
A
A
b
c
D
D
D
E
E
1
E
e
H
L
p
Q
v
w
x
y
Z
θ
UNIT
2
3
4
p
1
2
2
E
8°
0°
+0.12 0.53 0.32
−0.02 0.40 0.23
16.0 13.0 1.1 11.1 6.2
15.8 12.6 0.9 10.9 5.8
2.9
2.5
14.5 1.1
13.9 0.8
1.7
1.5
2.5
2.0
3.5
3.2
mm
1.27
3.5
0.35
0.25 0.25 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
98-02-25
99-11-12
SOT418-2
2001 Apr 24
11
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Apr 24
12
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
not suitable
REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC(3), SO, SOJ
suitable
suitable
suitable
not suitable(2)
suitable
LQFP, QFP, TQFP
not recommended(3)(4) suitable
not recommended(5)
suitable
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Apr 24
13
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS(1)
DEFINITIONS
STATUS(2)
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Product data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Apr 24
14
Philips Semiconductors
Objective specification
2 × 40 W/2 Ω stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
NOTES
2001 Apr 24
15
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Internet: http://www.semiconductors.philips.com
72
SCA
© Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/01/pp16
Date of release: 2001 Apr 24
Document order number: 9397 750 08125
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