TDA8708B [NXP]

Video analog input interface; 模拟视频输入接口
TDA8708B
型号: TDA8708B
厂家: NXP    NXP
描述:

Video analog input interface
模拟视频输入接口

消费电路 商用集成电路 光电二极管
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INTEGRATED CIRCUITS  
DATA SHEET  
TDA8708B  
Video analog input interface  
1996 Nov 26  
Product specification  
Supersedes data of June 1994  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
FEATURES  
APPLICATIONS  
8-bit resolution  
Video signal decoding  
Sampling rate up to 32 MHz  
Scrambled TV (encoding and decoding)  
Digital picture processing  
Frame grabbing.  
Binary or two’s complement 3-state TTL outputs  
TTL-compatible digital inputs and outputs  
Internal reference voltage regulator  
Power dissipation of 365 mW (typical)  
Input selector circuit (one out of three video inputs)  
GENERAL DESCRIPTION  
The TDA8708B is an analog input interface for video signal  
processing. It includes a video amplifier with clamp and  
gain control, an 8-bit Analog-to-Digital Converter (ADC)  
with a sampling rate of 32 MHz and an input selector.  
Clamp and Automatic Gain Control (AGC) functions for  
CVBS and Y signals  
No sample-and-hold circuit required  
The TDA8708B has no white peak control in mode 2  
whereas the TDA8708A has control in modes 1 and 2  
In-range output (not TTL levels).  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
analog supply voltage  
MIN.  
4.5  
TYP.  
5.0  
MAX.  
5.5  
UNIT  
VCCA  
VCCD  
VCCO  
ICCA  
ICCD  
ICCO  
ILE  
V
V
V
digital supply voltage  
4.5  
4.2  
5.0  
5.0  
37  
24  
12  
5.5  
5.5  
45  
30  
16  
±1  
±0.5  
TTL output supply voltage  
analog supply current  
mA  
digital supply current  
mA  
TTL output supply current  
DC integral linearity error  
DC differential linearity error  
maximum clock frequency  
maximum 3 dB bandwidth (AGC amplifier)  
total power dissipation  
mA  
LSB  
LSB  
MHz  
MHz  
mW  
DLE  
fclk(max)  
B
30  
12  
32  
18  
365  
Ptot  
500  
ORDERING INFORMATION  
TYPE NUMBER  
PACKAGE  
NAME  
DESCRIPTION  
VERSION  
TDA8708BT  
SO28  
plastic small outline package; 28 leads; body width 7.5 mm  
SOT136-1  
1996 Nov 26  
2
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
BLOCK DIAGRAM  
analog  
voltage  
output  
video input video input  
selection bit 0 selection bit 1  
ADC  
input  
clock decoupling  
input input  
TTL outputs V  
7
(+ 5 V)  
CCO  
14  
15  
19 20  
5
21  
VIDEO  
AMPLIFIER  
output format/  
chip enable  
(3-state input)  
D7  
16  
17  
18  
9
video input 0  
video input 1  
video input 2  
8 - bit  
ADC  
INPUT  
SELECTOR  
AMP.  
1
2
3
D6  
D5  
D4  
D3  
D2  
D1  
D0  
24  
25  
clamp capacitor  
connection  
TTL  
OUTPUTS  
4
10  
11  
12  
13  
AGC capacitor  
connection  
TDA8708B  
PEAK LEVEL  
DIGITAL COMPARATOR  
AGC &  
CLAMP  
LOGIC  
&
BLACK LEVEL  
DIGITAL COMPARATOR  
MODE  
SELECTION  
in-range  
output  
28  
SYNC LEVEL  
DIGITAL COMPARATOR  
27  
26  
6
8
22  
23  
MSA672  
sync level  
sync pulse  
black level digital V  
digital  
ground  
analog V  
(+ 5 V)  
analog  
ground  
CCD  
CCA  
sync pulse  
(+ 5 V)  
Fig.1 Block diagram.  
1996 Nov 26  
3
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
PINNING  
SYMBOL PIN  
DESCRIPTION  
D7  
1
2
3
4
5
6
7
8
9
data output; bit 7 (MSB)  
data output; bit 6  
D6  
D5  
data output; bit 5  
D4  
data output; bit 4  
CLK  
VCCD  
VCCO  
DGND  
OF  
clock input  
D7  
1
2
3
4
5
6
7
8
9
IR  
28  
digital supply voltage (+5 V)  
TTL outputs supply voltage (+5 V)  
digital ground  
27 GATE A  
D6  
D5  
GATE B  
AGC  
26  
25  
D4  
output format/chip enable  
(3-state input)  
CLK  
24 CLAMP  
23 AGND  
D3  
10 data output; bit 3  
V
CCD  
D2  
11 data output; bit 2  
V
22  
V
CCA  
CCO  
TDA8708B  
D1  
12 data output; bit 1  
21 DEC  
DGND  
OF  
D0  
13 data output; bit 0 (LSB)  
14 video input selection bit 0  
15 video input selection bit 1  
16 video input 0  
20 ADCIN  
19 ANOUT  
I0  
D3 10  
D2 11  
D1 12  
I1  
VIN2  
VIN1  
VIN0  
18  
17  
16  
VIN0  
VIN1  
VIN2  
ANOUT  
ADCIN  
DEC  
VCCA  
AGND  
CLAMP  
AGC  
GATE B  
GATE A  
IR  
17 video input 1  
18 video input 2  
D0  
I0  
13  
14  
19 analog voltage output  
20 analog-to-digital converter input  
21 decoupling input  
15 I1  
MSA671  
22 analog supply voltage (+5 V)  
23 analog ground  
24 clamp capacitor connection  
25 AGC capacitor connection  
26 black level synchronization pulse  
27 sync level synchronization pulse  
28 in-range output  
Fig.2 Pin configuration.  
1996 Nov 26  
4
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
The voltage across the capacitor connected to the AGC  
pin controls the gain of the video amplifier. This is the gain  
control loop.  
FUNCTIONAL DESCRIPTION  
The TDA8708B provides a simple interface for decoding  
video signals.  
The sync level comparator is active during a positive-going  
pulse at the GATE A input. This means that the sync pulse  
of the composite video signal is used as an amplitude  
reference. The bottom of the sync pulse is adjusted to  
obtain a digital output of logic 0 at the converter output.  
As the black level is at digital level 64, the sync pulse will  
have a digital amplitude of 64 LSBs.  
The TDA8708B operates in configuration mode 1  
(see Fig.4) when the video signals are weak (i.e. when the  
gain of the AGC amplifier has not yet reached its optimum  
value). This enables a fast recovery of the synchronization  
pulses in the decoder circuit. When the pulses at the  
GATE A and GATE B inputs become distinct (GATE A and  
GATE B pulses are synchronization pulses occurring  
during the sync period and rear porch respectively) the  
TDA8708B automatically switches to configuration mode 2  
(see Fig.5).  
The use of nominal signals will prevent the output from  
exceeding a digital code of 213.  
The clamp level control is accomplished by using the same  
techniques as used for the gain control. The black-level  
digital comparator is active during a positive-going pulse at  
the GATE B input. The clamp capacitor will be charged or  
discharged to adjust the digital output to code 64.  
When the TDA8708B is in configuration mode 1, the gain  
of the AGC amplifier will be roughly adjusted (sync level to  
a digital output level of 0 and the peak level to a digital  
output level of 255).  
In configuration mode 2 the digital output of the ADC is  
compared to internal digital reference levels.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL PARAMETER  
VCCA  
MIN.  
0.3  
MAX.  
+7.0  
UNIT  
analog supply voltage  
digital supply voltage  
V
V
V
VCCD  
VCCO  
VCC  
0.3  
0.3  
+7.0  
+7.0  
TTL output supply voltage  
supply voltage differences:  
V
V
V
CCA VCCD  
CCO VCCD  
CCA VCCO  
1.0  
1.0  
1.0  
0.3  
0
+1.0  
+1.0  
+1.0  
VCCA  
+10  
V
V
V
V
VI  
input voltage  
IO  
output current  
mA  
°C  
°C  
°C  
Tstg  
Tamb  
Tj  
storage temperature  
operating ambient temperature  
junction temperature  
55  
0
+150  
+70  
0
+125  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-a  
thermal resistance from junction to ambient in free air  
70  
K/W  
1996 Nov 26  
5
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
CHARACTERISTICS  
VCCA = V22 to V23 = 4.5 to 5.5 V; VCCD = V6 to V8 = 4.5 to 5.5 V; VCCO = V7 to V8 = 4.2 to 5.5 V; AGND and DGND  
shorted together; VCCA to VCCD = 0.5 to +0.5 V; VCCO to VCCD = 0.5 to +0.5 V; VCCA to VCCO = 0.5 to +0.5 V;  
Tamb = 0 to +70 °C; typical readings taken at VCCA = VCCD = VCCO = 5 V and Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
Supplies  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
VCCA  
VCCD  
VCCO  
ICCA  
analog supply voltage  
4.5  
5.0  
5.0  
5.0  
37  
5.5  
V
digital supply voltage  
TTL output supply voltage  
analog supply current  
digital supply current  
4.5  
4.2  
5.5  
5.5  
45  
V
V
mA  
mA  
mA  
ICCD  
24  
30  
ICCO  
TTL output supply current  
TTL load (see Fig.8)  
12  
16  
Video amplifier inputs  
VIN0 TO VIN2 INPUTS  
VI(p-p)  
input voltage (peak-to-peak value)  
AGC load with external  
capacitor; note 1  
0.6  
1.5  
V
Zi  
input impedance  
input capacitance  
fi = 6 MHz  
fi = 6 MHz  
10  
20  
1
kΩ  
Ci  
pF  
I0 AND I1 TTL INPUTS (see Table 1)  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
HIGH level input current  
0
0.8  
VCCD  
V
2.0  
400  
V
VI = 0.4 V  
VI = 2.7 V  
µA  
µA  
IIH  
20  
GATE A AND GATE B TTL INPUTS (see Figs 4 and 5)  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
HIGH level input current  
pulse width  
0
0.8  
VCCD  
V
2.0  
400  
V
VI = 0.4 V  
VI = 2.7 V  
see Fig.5  
µA  
µA  
µs  
IIH  
tW  
20  
2
AGC INPUT (PIN 25)  
V25(min)  
V25(max)  
AGC voltage for minimum gain  
2.8  
4.0  
V
V
AGC voltage for maximum gain  
AGC output current  
see Table 2  
CLAMP INPUT (PIN 24)  
V24  
I24  
clamp voltage for code 128 output  
clamp output current  
3.5  
V
see Table 3  
1996 Nov 26  
6
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Video amplifier outputs  
ANOUT OUTPUT (PIN 19)  
V19(p-p)  
AC output voltage  
(peak-to-peak value)  
VVIN = 1.33 V (p-p);  
V25 = 3.6 V  
1.33  
V
I19  
internal current source  
RL = ∞  
2.0  
2.5  
mA  
mA  
IO(p-p)  
output current driven by the load  
VANOUT = 1.33 V (p-p);  
note 2  
1.0  
V19  
Z19  
DC output voltage for black level  
output impedance  
note 3  
V
CCA 2.24  
V
20  
Video amplifier dynamic characteristics  
αct  
crosstalk between VIN inputs  
differential gain  
VCCA = 4.75 to 5.25 V  
50  
45  
dB  
%
Gdiff  
VVIN = 1.33 V (p-p);  
V25 = 3.6 V  
2
ϕdiff  
differential phase  
VVIN = 1.33 V (p-p);  
V25 = 3.6 V  
0.8  
deg  
B
3 dB bandwidth  
12  
60  
MHz  
dB  
dB  
dB  
%
S/N  
signal-to-noise ratio  
supply voltage ripple rejection  
gain range  
note 4  
SVRR1  
G  
note 5  
45  
see Fig.10  
4.5  
+6.0  
5
Gstab  
gain stability as a function of supply see Fig.10  
voltage and temperature  
Analog-to-digital converter inputs  
CLK INPUT (PIN 5)  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
HIGH level input current  
input impedance  
0
0.8  
VCCD  
V
2.0  
400  
V
Vclk = 0.4 V  
Vclk = 2.7 V  
fclk = 10 MHz  
fclk = 10 MHz  
µA  
µA  
kΩ  
pF  
IIH  
|Zi|  
CI  
100  
4
input capacitance  
4.5  
OF INPUT (3-STATE; see Table 4)  
VIL  
VIH  
V9  
IIL  
LOW level input voltage  
0
0.2  
VCCD  
V
HIGH level input voltage  
input voltage in high impedance state  
LOW level input current  
2.6  
V
1.15  
300  
300  
V
370  
µA  
µA  
IIH  
HIGH level input current  
450  
1996 Nov 26  
7
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
ADCIN INPUT (PIN 20; see Table 5)  
V20  
input voltage  
input voltage  
digital output = 00  
digital output = 255  
V
CCA 2.42 −  
CCA 1.41 −  
V
V
V
V20  
V
V20(p-p)  
input voltage amplitude  
(peak-to-peak value)  
1.0  
I20  
Zi  
input current  
1.0  
50  
1
10  
µA  
MΩ  
pF  
input impedance  
input capacitance  
fi = 6 MHz  
fi = 6 MHz  
Ci  
Analog-to-digital converter outputs  
IR OUTPUT (PIN 28)  
VOL  
VOH  
IO  
LOW level output voltage  
HIGH level output voltage  
output current  
1.7  
V
1.9  
V
500  
µA  
DIGITAL OUTPUTS D0 TO D7  
VOL  
VOH  
IOZ  
LOW level output voltage  
IOL = 2 mA  
0
0.6  
V
HIGH level output voltage  
IOL = 0.4 mA  
0.4 V < VO < VCCD  
2.4  
20  
VCCD  
+20  
V
output current in 3-state mode  
µA  
Switching characteristics  
fclk(max) maximum clock input frequency  
see Fig.6; note 6  
30  
32  
2
MHz  
%
Analog signal processing (fclk = 32 MHz); see Fig.8  
Gdiff  
differential gain  
V20 = 1.0 V (p-p);  
see Fig.7; note 7  
ϕdiff  
f1  
differential phase  
see Fig.7; note 7  
2
0
deg  
dB  
fundamental harmonics (full-scale)  
fi = 4.43 MHz; note 7  
fi = 4.43 MHz; note 7  
fall  
harmonics (full-scale);  
all components  
55  
dB  
SVRR2  
supply voltage ripple rejection  
note 8  
note 9  
1
5
%/V  
Transfer function (see Fig.8)  
ILE  
DLE  
ILE  
DC integral linearity error  
±1  
LSB  
LSB  
LSB  
DC differential linearity error  
AC integral linearity error  
±0.5  
±2  
Timing (fclk = 32 MHz) see Figs 6, 7 and 8  
DIGITAL OUTPUTS (CL = 15 pF; IOL = 2 mA; RL = 2 k)  
tds  
th  
sampling delay time  
6
2
ns  
ns  
ns  
ns  
ns  
output hold time  
8
td  
output delay time  
16  
19  
14  
20  
25  
20  
tdEZ  
tdDZ  
3-state delay time; output enable  
3-state delay time; output disable  
1996 Nov 26  
8
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
Notes  
1. 0 dB is obtained at the AGC amplifier when applying Vi(p-p) = 1.33 V.  
2. The output current at pin 19 should not exceed 1 mA. The load impedance RL should be referenced to VCCA and  
defined as:  
a) AC impedance 1 kand the DC impedance >2.7 k.  
b) The load impedance should be coupled directly to the output of the amplifier so that the DC voltage supplied by  
the clamp is not disturbed.  
3. Control mode 2 is selected.  
VANOUTC (p p)  
S
N
4. Signal-to-noise ratio measured with 5 MHz bandwidth:  
5. The voltage ratio is expressed as:  
= 20 log  
at B = 5 MHz .  
------------------------------------------------  
VANOUTY (RMS noise)  
---  
VCCA  
G
SVRR1 = 20 log  
×
for VI = 1 V (p-p), gain at 100 kHz = 1 and 1 V supply variation.  
----------------- --------  
VCCA G  
6. It is recommended that the rise and fall times of the clock are 2 ns. In addition, a ‘good layout’ for the digital and  
analog grounds is recommended.  
7. These measurements are realized on analog signals after a digital-to-analog conversion (TDA8702 is used).  
8. The supply voltage rejection is the relative variation of the analog signal (full-scale signal at input) for 1 V of supply  
variation:  
(VI (00) VI (FF) ) + (VI (00) VI (FF)  
)
SVRR2 =  
-----------------------------------------------------------------------------------------------------  
VCCA  
9. Full-scale sine wave (fi = 4.4 MHz; fclk = 27 MHz).  
1996 Nov 26  
9
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
Table 1 Video input selection (CVBS)  
Table 3 CLAMP output current  
I1  
I0  
SELECTED INPUT  
DIGITAL  
GATE A GATE B  
OUTPUT  
ICLAMP  
MODE  
0
0
1
1
0
1
0
1
VIN0  
VIN1  
VIN2  
VIN2  
1
1
output < 0  
output > 0  
X
130 µA  
2.5 µA  
0 µA  
1
1
2
2
2
X(1)  
0
0
1
output < 64  
64 < output  
+50 µA  
50 µA  
Table 2 AGC output current  
DIGITAL  
OUTPUT  
Note  
1. X = don't care.  
GATE A GATE B  
IAGC  
MODE(1)  
1
1
output < 255 2.5 µA  
output > 255 130 µA  
1
1
2
2
2
Table 4 OF input coding  
0
1
X(2)  
0
0 µA  
OF  
D0 TO D7  
output < 0  
output > 0  
+2.5 µA  
2.5 µA  
0
active, two’s complement  
high impedance  
1
open circuit(1)  
active, binary  
Notes  
1. Mode 2 can only be initialized with successive pulses  
on GATE A and GATE B (see Fig.5).  
Note  
1. Use C 10 pF to DGND.  
2. X = don’t care.  
Table 5 Output coding and input voltage (typical values)  
BINARY OUTPUTS  
TWO’S COMPLEMENT  
STEP  
VADCIN  
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0  
Underflow  
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
1
1
1
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
0
V
CCA 2.41 V  
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
254  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
255  
V
CCA 1.41 V  
Overflow  
1996 Nov 26  
10  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
0.25 V  
5 MHz sine wave  
1.0 V  
0.25 V  
MBB959  
64 µs  
Fig.3 Test signal on the ADCIN pin for differential gain and phase measurements.  
k
digital  
MBB969  
output  
level  
peak-level gain control  
255  
black-level  
clamping  
sync-level gain control  
0
time  
GATE A  
GATE B  
MODE 1  
Fig.4 Control mode 1.  
11  
1996 Nov 26  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
digital  
MSA674  
output  
level  
255  
black-level  
clamping  
64  
sync-level control  
0
t
W
time  
GATE A  
t
W
GATE B  
MODE 2  
Fig.5 Control mode 2.  
clock input  
reference level  
(1.5 V)  
CLK  
input  
t
ds  
sample  
sample  
N
1
N
2
sample  
N
sample  
N
analog  
input  
1
(ADCIN)  
t
h
2.4 V  
data  
data N  
3
data N  
2
data N  
1
data N  
data N  
1
outputs  
D0 to D7)  
0.4 V  
MBB958  
t
d
Fig.6 Timing diagram for data output.  
12  
1996 Nov 26  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
OF  
open  
input  
2.4 V  
0.4 V  
data  
outputs  
(D0 to D7)  
high impedance  
binary  
two's complement  
t
t
MBB968  
dDZ  
dEZ  
Fig.7 Output format timing diagram.  
V
CCO  
2 kΩ  
handbook, halfpage  
D0 to D7  
15 pF  
IN916  
or  
IN3064  
MBD865  
DGND  
Fig.8 Load circuit for timing measurement; data outputs (OF = LOW or open-circuit).  
13  
1996 Nov 26  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
V
CCO  
handbook, halfpage  
2 k  
S1  
D0 to D7  
C
5
kΩ  
IN916  
or  
IN3064  
S2  
MBB955  
DGND  
Fig.9 Load circuit for timing measurement; 3-state outputs (OF: fi = 1 MHz; VOF = 3 V).  
MSA676  
12  
G
(dB)  
8
5 %  
4
0
(1)  
(2)  
4
8
2.6  
3
3.4  
3.8  
4.2  
4.6  
(V)  
V
25  
(1) Typical value (VCCA = VCCD = 5 V; Tamb = 25 °C).  
(2) Minimum and maximum values (temperature and supply).  
Fig.10 Gain control curve.  
14  
1996 Nov 26  
pin 25  
AGC  
pin 28  
IR  
pins 26 or 27  
GATE A or GATE B  
V
V
V
CCA  
V
CCO  
CCD  
CCD  
V
CCD  
pins 1 to 4  
and 10 to 13  
data outputs  
pin 6  
V
CCD  
DGND  
pin 7  
V
CCO  
DGND  
AGND  
V
pin 22  
V
V
CCD  
CCA  
DGND  
pin 24  
CLAMP  
DGND  
CCA  
pin 5  
clock input  
1.5 V  
DGND  
TDA8708B  
I
1
pin 8  
DGND  
I
I
1
V
2
CCD  
4 V  
BE  
pin 23  
AGND  
chip enable  
AGND  
V
pin 9  
OF  
CCA  
binary/  
two's complement  
V
CCA  
V
REF  
V
V
CCA  
CCA  
V
V
top  
DGND  
V
CCA  
mid  
20  
k  
pins 14 or 15  
I
,I  
0
1
V
REF  
2.5  
mA  
V
bottom  
AGND  
AGND  
AGND  
AGND  
AGND  
MSA675  
pins 16 to 18  
VIN0, VIN1 and VIN2  
pin 19  
ANOUT  
pin 20  
ADCIN  
pin 21  
DEC  
ahdnbok,uflapegwidt  
Fig.11 Internal pin configuration.  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
APPLICATION INFORMATION  
Additional information can be found in the laboratory report of TDA8708A “FBL/AN9308”.  
(2)  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
horizontal sync  
horizontal clamp  
2
data outputs  
3
220 nF  
4
33 pF  
18 nF  
100 Ω  
clock  
5 V  
5
6
22 nF  
22 nF  
1 µF  
10 nF  
1µH  
(1)  
7
5 V  
22 Ω  
TDA8708B  
8
5 V  
1 µF  
9
10 pF  
LOW PASS  
FILTER  
(3)  
10  
11  
12  
13  
14  
4.7 µF  
data outputs  
4.7 µF  
75 Ω  
4.7 µF  
75 Ω  
75 Ω  
MSA673  
(1) It is recommended to decouple VCCO through a 22 resistor especially when the output data of TDA8708B interfaces with a capacitive CMOS load  
device.  
(2) When IR is not used, it must be connected to ground via a 47 pF capacitor.  
(3) See Figs 13 and 15 for examples of the low-pass filters.  
Fig.12 Application diagram.  
1996 Nov 26  
16  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
22 µH  
22 µH  
12 pF  
12 pF  
680 Ω  
ANOUT  
(pin 19)  
ADCIN  
(pin 20)  
2.2 kΩ  
27 pF  
V
V
i
o
27 pF  
68 pF  
MBB966 - 1  
V
CCA  
(pin 22)  
This filter can be adapted to various applications with respect to performance requirements. An input and output impedance of at least 680 and 2.2 kΩ  
must in any event be applied.  
Fig.13 Example of a low-pass filter for CVBS and Y signals.  
Characteristics of Fig.14:  
Order 5; adapted CHEBYSHEV  
MSA682  
Ripple ρ ≤ 0.4 dB  
f = 6.5 MHz at 3 dB  
fnotch = 9.75 MHz.  
0
handbook, halfpage  
α
(dB)  
40  
80  
120  
160  
0
10  
20  
30  
f (MHz)  
Fig.14 Frequency response for filter shown in  
Fig.13.  
1996 Nov 26  
17  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
82 µH  
680 Ω  
ADOUT  
ADCIN  
(pin 20)  
h
(pin 19)  
2.2 kΩ  
15 pF  
V
V
i
o
15 pF  
MSA678  
V
CCA  
(pin 22)  
This filter can be adapted to various applications with respect to performance requirements. An input and output impedance of at least 680 and 2.2 kΩ  
must in any event be applied.  
Fig.15 Example of an economical low-pass filter for CVBS and Y signals.  
Characteristics of Fig.16:  
Order 5; adapted CHEBYSHEV  
MSA681  
Ripple ρ ≤ 0.4 dB  
0
handbook, halfpage  
α
f = 6.5 MHz at 3 dB.  
(dB)  
10  
20  
30  
40  
0
10  
20  
30  
f (MHz)  
Fig.16 Frequency response for filter shown in  
Fig.15.  
1996 Nov 26  
18  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
PACKAGE OUTLINE  
SO28: plastic small outline package; 28 leads; body width 7.5 mm  
SOT136-1  
D
E
A
X
c
y
H
v
M
A
E
Z
28  
15  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
14  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30  
0.10  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
18.1  
17.7  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
mm  
2.65  
1.27  
0.050  
1.4  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.71  
0.014 0.009 0.69  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches 0.10  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-24  
97-05-22  
SOT136-1  
075E06  
MS-013AE  
1996 Nov 26  
19  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
SOLDERING  
Introduction  
Wave soldering  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The package footprint must incorporate solder thieves at  
the downstream end.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all SO  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
1996 Nov 26  
20  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Nov 26  
21  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
NOTES  
1996 Nov 26  
22  
Philips Semiconductors  
Product specification  
Video analog input interface  
TDA8708B  
NOTES  
1996 Nov 26  
23  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,  
Tel. +43 1 60 101, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 247 9145, Fax. +7 095 247 9144  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Czech Republic: see Austria  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 1949  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615800, Fax. +358 9 61580/xxx  
South America: Rua do Rocio 220, 5th floor, Suite 51,  
04552-903 São Paulo, SÃO PAULO - SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 829 1849  
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 3 301 6312, Fax. +34 3 301 4107  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2686, Fax. +41 1 481 7730  
Hungary: see Austria  
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.  
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722  
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,  
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,  
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444  
Indonesia: see Singapore  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,  
Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,  
Internet: http://www.semiconductors.philips.com  
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1996  
SCA52  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
537021/1200/04/pp24  
Date of release: 1996 Nov 26  
Document order number: 9397 750 01456  

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