TDA8714T/4 [NXP]
8-bit high-speed analog-to-digital converter; 8位高速模拟数字转换器型号: | TDA8714T/4 |
厂家: | NXP |
描述: | 8-bit high-speed analog-to-digital converter |
文件: | 总24页 (文件大小:158K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8714
8-bit high-speed analog-to-digital
converter
1997 Oct 29
Product specification
Supersedes data of 1996 Jan 31
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
FEATURES
APPLICATIONS
High-speed analog-to-digital conversion for:
• 8-bit resolution
• Sampling rate up to 80 MHz
• No missing codes guaranteed
• video data digitizing
• radar pulse analysis
• transient signal analysis
• high energy physics research
• Σ∆ modulators
• High signal-to-noise ratio over a large analog input
frequency range (7.7 effective bits at 4.43 MHz
full-scale input at fclk = 80 MHz)
• Overflow/underflow 3-state TTL output
• TTL compatible digital inputs
• medical imaging.
• Low-level AC clock input signal allowed
• External reference voltage regulator
• Power dissipation only 340 mW (typical)
GENERAL DESCRIPTION
The TDA8714 is an 8-bit high-speed Analog-to-Digital
Converter (ADC) for professional video and other
applications. It converts the analog input signal into 8-bit
binary-coded digital words at a maximum sampling rate of
80 MHz. All digital inputs and outputs are TTL compatible,
although a low-level sine wave clock input signal is
allowed.
• Low analog input capacitance, no buffer amplifier
required
• No sample-and-hold circuit required.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
analog supply voltage
CONDITIONS
MIN.
4.75
TYP.
5.0
MAX.
5.25
UNIT
VCCA
VCCD
VCCO
ICCA
V
V
V
digital supply voltage
output stages supply voltage
analog supply current
digital supply current
output stages supply current
DC integral non-linearity
DC differential non-linearity
AC integral non-linearity
maximum clock frequency
TDA8714/7
4.75
5.0
5.0
25
5.25
5.25
30
4.75
−
mA
ICCD
−
27
33
mA
ICCO
−
16
20
mA
INL
−
±0.4
±0.2
±0.5
±0.5
±0.35
±1.0
LSB
LSB
LSB
DNL
AINL
fclk(max)
−
note 1
−
80
60
40
−
−
−
MHz
MHz
MHz
mW
TDA8714/6
−
−
TDA8714/4
−
−
Ptot
total power dissipation
340
435
Note
1. Full-scale sine wave (fi = 4.43 MHz; fclk = 80 MHz).
1997 Oct 29
2
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
ORDERING INFORMATION
PACKAGE
TYPE
SAMPLING
NUMBER
FREQUENCY (MHz)
NAME
DESCRIPTION
VERSION
TDA8714T/4
TDA8714T/6
TDA8714T/7
SO24
SO24
SO24
plastic small outline package; 24 leads;
body width 7.5 mm
SOT137-1
SOT137-1
SOT137-1
SOT340-1
SOT340-1
SOT340-1
40
60
80
40
60
80
TDA8714M/4 SSOP24 plastic shrink small outline package; 24 leads;
body width 5.3 mm
TDA8714M/6 SSOP24
TDA8714M/7 SSOP24
BLOCK DIAGRAM
V
7
CLK
16
V
CCD
CE
22
CCA
18
CLOCK DRIVER
V
RT
9
TDA8714
12 D7
13 D6
MSB
14 D5
15 D4
23 D3
24 D2
V
I
8
ANALOG -TO-DIGITAL
CONVERTER
analog
voltage input
LATCHES
TTL OUTPUTS
data outputs
1
2
D1
D0
V
LSB
CCO1
19
V
RB
4
21
11
V
CCO2
overflow / underflow
output
OVERFLOW / UNDERFLOW
LATCH
TTL OUTPUT
OGND 20
output ground
17
6
AGND
DGND
MSA669
analog ground
digital ground
Fig.1 Block diagram.
3
1997 Oct 29
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
PINNING
SYMBOL PIN
DESCRIPTION
data output; bit 1
D1
1
2
3
4
5
6
7
8
9
D0
data output; bit 0 (LSB)
not connected
n.c.
VRB
n.c.
reference voltage BOTTOM input
not connected
handbook, halfpage
1
2
3
4
5
6
7
8
9
D1
D0
24 D2
23 D3
AGND
VCCA
VI
analog ground
analog supply voltage (+5 V)
analog input voltage
reference voltage TOP input
n.c.
22
21
CE
V
V
VRT
n.c.
CCO2
RB
10 not connected
n.c.
20 OGND
O/UF
D7
11 overflow/underflow data output
12 data output; bit 7 (MSB)
13 data output; bit 6
14 data output; bit 5
15 data output; bit 4
16 clock input
V
AGND
19
18
CCO1
TDA8714
V
V
CCD
CCA
D6
V
I
17 DGND
16 CLK
15 D4
D5
V
RT
D4
n.c. 10
CLK
DGND
VCCD
VCCO1
17 digital ground
O/UF 11
14 D5
18 digital supply voltage (+5 V)
12
D7
13 D6
19 supply voltage for output stages 1
(+5 V)
MSA667
OGND
VCCO2
20 output ground
21 supply voltage for output stages 2
(+5 V)
CE
22 chip enable input (TTL level input,
active LOW)
D3
D2
23 data output; bit 3
24 data output; bit 2
Fig.2 Pin configuration.
1997 Oct 29
4
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCCA
PARAMETER
analog supply voltage
CONDITIONS
note 1
MIN.
−0.3
MAX.
+7.0
UNIT
V
V
V
V
VCCD
VCCO
∆VCC
digital supply voltage
note 1
note 1
−0.3
−0.3
−1.0
+7.0
+7.0
+1.0
output stages supply voltage
supply voltage differences between
VCCA and VCCD
∆VCC
∆VCC
supply voltage differences between
VCCO and VCCD
−1.0
−1.0
+1.0
+1.0
V
V
supply voltage differences between
VCCA and VCCO
VI
input voltage
referenced to AGND
referenced to DGND
−0.3
+7.0
V
V
Vclk(p-p)
AC input voltage for switching
(peak-to-peak value)
−
VCCD
IO
output current
−
10
mA
°C
°C
°C
Tstg
Tamb
Tj
storage temperature
operating ambient temperature
junction temperature
−55
0
+150
+70
+150
−
Note
1. The supply voltages VCCA and VCCD may have any value between −0.3 V and +7.0 V provided the difference
between VCCA and VCCD is between −1 V and +1 V.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
thermal resistance from junction to ambient in free air
SOT137-1
SOT340-1
75
K/W
K/W
119
1997 Oct 29
5
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
CHARACTERISTICS
V
CCA = V7 to V6 = 4.75 to 5.25 V; VCCD = V18 to V17 = 4.75 to 5.25 V; VCCO = V19 and V21 to V20 = 4.75 to 5.25 V;
AGND and DGND shorted together; VCCA to VCCD = −0.25 to +0.25 V; VCCO to VCCD = −0.25 to +0.25 V;
CCA to VCCO = −0.25 to +0.25 V; Vi(p-p) = 1.75 V; Tamb = 0 to +70 °C; typical values measured at
VCCA = VCCD = VCCO = 5 V and Tamb = 25 °C; unless otherwise specified.
V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VCCA
VCCD
VCCO
ICCA
analog supply voltage
4.75
4.75
4.75
−
5.0
5.25
5.25
5.25
30
V
V
V
digital supply voltage
5.0
5.0
25
output stages supply voltage
analog supply current
mA
mA
mA
ICCD
digital supply current
−
27
33
ICCO
output stages supply current
−
16
20
Inputs
CLOCK INPUT CLK (REFERENCED TO DGND); note 1
VIL
VIH
IIL
LOW level input voltage
HIGH level input voltage
LOW level input current
HIGH level input current
input impedance
0
−
0.8
VCCD
−
V
2.0
−400
−
−
V
Vclk = 0.4 V
−
µA
µA
kΩ
pF
IIH
ZI
Vclk = 2.7 V
fclk = 80 MHz
fclk = 80 MHz
−
300
−
−
18
1
CI
input capacitance
−
−
INPUT CE (REFERENCED TO DGND); see Table 2
VIL
VIH
IIL
LOW level input voltage
HIGH level input voltage
LOW level input current
HIGH level input current
0
−
−
−
−
0.8
VCCD
−
V
2.0
−400
−
V
VIL = 0.4 V
VIH = 2.7 V
µA
µA
IIH
20
VI (ANALOG INPUT VOLTAGE REFERENCED TO AGND)
IIL
IIH
ZI
LOW level input current
HIGH level input current
input impedance
VI = 1.2 V
−
0
−
µA
µA
kΩ
pF
VI = 3.5 V
60
−
130
10
14
280
−
fi = 4.43 MHz
fi = 4.43 MHz
CI
input capacitance
−
−
Reference voltages for the resistor ladder; see Table 1
VRB
reference voltage BOTTOM
reference voltage TOP
1.2
3.5
1.9
−
1.3
1.6
3.9
2.7
−
V
VRT
3.6
V
Vdiff
differential reference voltage VRT − VRB
reference current
2.3
V
Iref
11.5
200
0.24
285
315
1.75
mA
Ω
RLAD
TCRLAD
VosB
VosT
Vi(p-p)
resistor ladder
−
−
temperature coefficient of the resistor ladder
offset voltage BOTTOM
−
−
ppm
mV
mV
V
note 2
note 2
275
305
1.45
295
325
2.15
offset voltage TOP
analog input voltage (peak-to-peak value)
1997 Oct 29
6
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
SYMBOL
Outputs
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DIGITAL OUTPUTS D7 to D0 (REFERENCED TO DGND)
VOL
VOH
LOW level output voltage
HIGH level output voltage
IO = 1 mA
0
−
0.4
V
V
V
IO = −0.4 mA
IO = −1 mA
2.7
2.4
−20
−
−
−
VCCD
VCCD
+20
IOZ
output current in 3-state mode
0.4 V < VO < VCCD
µA
Switching characteristics
CLOCK INPUT CLK (note 1; see Fig.3)
fclk(max)
maximum clock frequency
TDA8714/4
40
60
80
6
−
−
−
−
−
−
−
−
−
−
MHz
MHz
MHz
ns
TDA8714/6
TDA8714/7
tCPH
tCPL
clock pulse width HIGH
clock pulse width LOW
6
ns
Analog signal processing
LINEARITY
INL
DC integral non-linearity
−
−
−
±0.4
±0.2
±0.5
±0.5
LSB
DNL
AINL
DC differential non-linearity
AC integral non-linearity
±0.35 LSB
note 3
±1.0
LSB
BANDWIDTH (fclk = 40 MHz); note 4
B
analog bandwidth
full-scale sine wave
−
−
13
20
−
−
MHz
MHz
75% full-scale sine
wave; small signal at
Vi = ±5 LSB, code 128
tSTLH
tSTHL
analog input settling time LOW-to-HIGH
analog input settling time HIGH-to-LOW
full-scale square
wave; Fig.6; note 5
−
−
2.5
3.0
3.5
4.0
ns
ns
full-scale square
wave; Fig.6; note 5
HARMONICS (fclk = 40 MHz)
h1
fundamental harmonics (full scale)
fi = 4.43 MHz
fi = 4.43 MHz
−
−
0
dB
hall
harmonics (full scale);
all components
second harmonics
third harmonics
−
−
−
−64
−58
−56
−60
−55
−
dB
dB
dB
THD
total harmonic distortion
fi = 4.43 MHz
SIGNAL-TO-NOISE RATIO (note 6; see Figs 7 and 13)
S/N
signal-to-noise ratio (full scale)
without harmonics;
fclk = 40 MHz;
46
48
−
dB
fi = 4.43 MHz
1997 Oct 29
7
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
EFFECTIVE BITS (note 6; see Figs 7 and 13)
EB
effective bits
TDA8714/4
fclk = 40 MHz
fi = 4.43 MHz
fi = 7.5 MHz
−
7.75
−
bits
−
7.6
−
bits
effective bits
TDA8714/6
f
clk = 60 MHz
fi = 4.43 MHz
fi = 7.5 MHz
fi = 10 MHz
−
−
−
7.7
−
−
−
bits
bits
bits
7.55
7.4
effective bits
TDA8714/7
fclk = 80 MHz
fi = 4.43 MHz
fi = 7.5 MHz
fi = 10 MHz
fi = 15 MHz
−
−
−
−
7.7
7.5
7.2
6.3
−
−
−
−
bits
bits
bits
bits
TWO-TONE (note 7)
TTIR
two-tone intermodulation rejection
f
clk = 40 MHz
−
−
−56
−
−
dB
BIT ERROR RATE
BER
bit error rate
fclk = 40 MHz;
fi = 4.43 MHz;
VI = ±16 LSB at
code 128
10−11
times/
samples
DIFFERENTIAL GAIN (note 8)
Gdiff
differential gain
fclk = 40 MHz;
fi = 4.43 MHz
−
−
0.6
0.8
−
−
%
DIFFERENTIAL PHASE (note 8)
ϕdiff
differential phase
fclk = 40 MHz;
fi = 4.43 MHz
deg
Timing (note 9; see Figs 3 and 5; fclk = 80 MHz)
tds
th
sampling delay time
output hold time
−
5
−
−
2
ns
ns
ns
−
−
td
output delay time
10
11
3-state output delay times (see Fig.4)
tdZH
tdZL
tdHZ
tdLZ
enable HIGH
enable LOW
disable HIGH
disable LOW
−
−
−
−
40
12
50
10
44
16
54
14
ns
ns
ns
ns
1997 Oct 29
8
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
Notes to the characteristics
1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock
must not be less than 1 ns.
2. Analog input voltages producing code 00 up to and including FF:
a) VosB (voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and
the reference voltage BOTTOM (VRB) at Tamb = 25 °C.
b) VosT (voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which
produces data outputs equal to FF at Tamb = 25 °C.
3. Full-scale sine wave (fi = 4.43 MHz; fclk = 80 MHz).
4. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device.
No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.
5. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square-wave signal) in order to sample the signal and obtain correct output data.
6. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
7. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two
input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.
8. Measurement carried out using video analyser VM700A where the video analog signal is reconstructed through a
digital-to-analog converter.
9. Output data acquisition: the output data is available after the maximum delay time of td; in the event of 80 MHz clock
operation, the hardware design must take into account the td and th limits with respect to the input characteristics of
the acquisition circuit.
1997 Oct 29
9
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
Table 1 Output coding and input voltage (typical values; referenced to AGND)
BINARY OUTPUT BITS
STEP
VI(p-p)
O/UF
D7
D6
D5
D4
D3
D2
D1
D0
Underflow
<1.585
1
0
0
.
0
0
0
.
0
0
0
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
0
1.585
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
254
.
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
255
3.28
>3.28
Overflow
Table 2 Mode selection
CE
D7 to D0
O/UF
1
0
high impedance
active; binary
high impedance
active
t
CPL
t
CPH
50 %
CLK
sample N
sample N + 1
sample N + 2
V
l
t
t
ds
h
V
DDO
DATA
D0 to D7
DATA
N - 2
DATA
N - 1
DATA
N
DATA
50 %
N + 1
0 V
t
d
MSA670
Fig.3 Timing diagram.
10
1997 Oct 29
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
V
CCD
d
CE
50 %
dZH
t
t
dHZ
HIGH
90 %
output
data
50 %
LOW
t
t
dZL
dLZ
HIGH
output
data
50 %
TEST
tdLZ
S1
LOW
10 %
VCCD
tdZL
tdHZ
tdZH
VCCD
V
CCD
DGND
DGND
3.3 kΩ
15 pF
S1
TDA8714
MBD876
CE
fCE = 100 kHz.
Fig.4 Timing diagram and test conditions of 3-state output delay time.
handbook, halfpage
D0 to D7
15 pF
MBB956 - 1
Fig.5 Load circuit for timing measurement.
1997 Oct 29
11
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
t
t
STLH
STHL
50 %
code 255
V
I
50 %
code 0
2 ns
2 ns
CLK
50 %
50 %
MGD184
0.5 ns
0.5 ns
Fig.6 Analog input settling-time diagram.
1997 Oct 29
12
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
MBD877
0
amplitude
(dB)
20
40
60
80
100
120
0
2.50
5.00
7.50
10.0
12.5
15.0
17.5
20.0
f (MHz)
Effective bits: 7.80; THD = −57.82 dB.
Harmonic levels (dB): 2nd = −68.00; 3rd = −61.54; 4th = −72.46; 5th = −65.80; 6th = −68.88.
Fig.7 Fast Fourier Transform (fclk = 40 MHz; fi = 4.43 MHz).
MBD878
0
amplitude
(dB)
20
40
60
80
100
120
0
4.69
9.39
14.1
18.8
23.5
28.2
32.9
37.5
f (MHz)
Effective bits: 7.27; THD = −49.23 dB.
Harmonic levels (dB): 2nd = −56.16; 3rd = −51.01; 4th = −69.84; 5th = −59.10; 6th = −65.34.
Fig.8 Fast Fourier Transform (fclk = 80 MHz; fi = 10 MHz).
1997 Oct 29
13
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
INTERNAL PIN CONFIGURATIONS
V
CCO1
handbook, halfpage
handbook, halfpage
V
V
CCO2
CCA
(x 90)
D7 to D0
O/UF
V
I
DGND
AGND
MLB036
MLB037
Fig.9 TTL data and overflow/underflow outputs.
Fig.10 Analog inputs.
book, halfpage
V
CCO1
handbook, halfpage
V
CCA
V
V
RT
RM
CE
R
LAD
V
RB
AGND
MEA050 - 1
DGND
MLB038
Fig.11 CE (3-state) input.
Fig.12 VRB and VRT.
1997 Oct 29
14
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
V
CCD
V
CLK
ref
30 kΩ
30 kΩ
DGND
MCD189 - 1
Fig.13 CLK input.
1997 Oct 29
15
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
APPLICATION INFORMATION
handbook, halfpage
D1
D2
D3
1
2
24
23
22
21
20
19
18
17
16
15
14
D0
(2)
n.c.
CE
V
3
(1)
RB
V
CCO2
4
100 nF
AGND
(2)
n.c.
OGND
5
V
AGND
CCO1
6
TDA8714
V
V
CCA
CCD
7
V
I
DGND
CLK
D4
8
(1)
V
RT
9
100 nF
(2)
n.c.
10
11
12
AGND
O/UF
D7
D5
D6
13
MSA668
The analog and digital supplies should be separated and decoupled.
The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value.
(1) VRB and VRT are decoupled to AGND.
(2) Pin 5 should be connected to AGND; pins 3 and 10 to DGND in order to prevent noise influence.
Fig.14 Application diagram.
1997 Oct 29
16
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
PACKAGE OUTLINES
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
H
v
M
A
E
y
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.61
0.014 0.009 0.60
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT137-1
075E05
MS-013AD
1997 Oct 29
17
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A
X
v
c
H
M
A
y
E
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
0.8
0.4
mm
2.0
0.65
1.25
0.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-09-08
95-02-04
SOT340-1
MO-150AG
1997 Oct 29
18
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
SOLDERING
Introduction
SSOP
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Reflow soldering
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
Reflow soldering techniques are suitable for all SO and
SSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
METHOD (SO AND SSOP)
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
SO
Repairing soldered joints
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
1997 Oct 29
19
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Oct 29
20
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
NOTES
1997 Oct 29
21
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
NOTES
1997 Oct 29
22
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
NOTES
1997 Oct 29
23
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/06/pp24
Date of release: 1997 Oct 29
Document order number: 9397 750 02956
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