TDA8760 [NXP]

10-bit high-speed analog-to-digital converter; 10位高速模拟 - 数字转换器
TDA8760
型号: TDA8760
厂家: NXP    NXP
描述:

10-bit high-speed analog-to-digital converter
10位高速模拟 - 数字转换器

转换器
文件: 总28页 (文件大小:199K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
TDA8760  
10-bit high-speed analog-to-digital  
converter  
1996 Sep 12  
Product specification  
Supersedes data of April 1994  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
FEATURES  
APPLICATIONS  
10-bit resolution  
High-speed analog-to-digital conversion for  
– Video signal digitizing  
Sampling rate up to 40 MHz  
Total Harmonic Distortion (THD): 65 dB at 4.43 MHz  
full-scale and a 40 MHz clock frequency  
– High Definition TV (HDTV)  
– Digital video broadcasting (satellite and cable)  
– Transient signal analysis  
High signal-to-noise ratio over a large analog input  
frequency range (8.8 effective bits at 10 MHz full-scale  
input at a 40 MHz clock frequency)  
– High energy physics research  
– Sigma-delta (SD) modulators  
– Medical imaging  
+5 V power supplies  
Binary or two’s complement 3-state TTL outputs  
In-range 3-state TTL output  
– Radar pulse digitizing.  
TTL compatible digital inputs  
GENERAL DESCRIPTION  
LOW-level AC clock input signal allowed  
Power dissipation 850 mW (typical)  
The TDA8760 is a monolithic bipolar 10-bit  
Analog-to-Digital Converter (ADC) for video or other  
applications. It converts the analog input signal into 10-bit  
binary coded digital words at a maximum sampling rate of  
40 MHz. All digital inputs and outputs are TTL compatible.  
However, a sine wave clock input signal is allowed.  
Low analog input capacitance (typ. 4.5 pF), no buffer  
amplifier required  
No external sample-and-hold circuit required  
Analog Input; single or differential  
External amplitude range control  
Voltage controlled regulator included.  
1996 Sep 12  
2
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
analog supply voltage  
CONDITIONS  
MIN.  
4.75  
TYP.  
5.0  
MAX.  
5.25  
UNIT  
VCCA  
VCCD  
VCCO  
ICCA  
ICCD  
ICCO  
ILE  
V
V
V
digital supply voltage  
output supply voltage  
analog supply current  
digital supply current  
4.75  
5.0  
5.0  
95  
5.25  
5.25  
100  
45  
4.75  
mA  
40  
mA  
output supply current  
DC integral linearity error  
DC differential linearity error  
AC integral linearity error  
35  
40  
mA  
f
f
f
clk = 4 MHz  
±1.0  
±0.6  
±1.2  
±2.0  
±1.0  
±2.0  
LSB  
LSB  
LSB  
DLE  
AILE  
clk = 4 MHz  
clk = 40 MHz;  
fi = 4.43 MHz  
fclk(max)  
maximum clock frequency  
TDA8760K/2  
20  
40  
MHz  
MHz  
mW  
°C  
TDA8760K/4  
Ptot  
total power dissipation  
operating ambient temperature  
850  
970  
+70  
Tamb  
0
ORDERING INFORMATION  
TYPE  
PACKAGE  
SAMPLING  
FREQUENCY  
(MHz)  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TDA8760K/2  
PLCC44  
20  
40  
plastic leaded chip carrier; 44 leads  
SOT187-2  
TDA8760K/4  
1996 Sep 12  
3
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V
V
V
V
V
V
V
refH  
refL  
CCA1  
7
CCA2  
13  
CCA3  
17  
CCD1  
3
CCD2  
21  
CLK  
2
CLK  
1
15 14  
24  
30  
37  
44  
OGND1  
output ground  
AMP  
OGND2  
output ground  
TDA8760  
10  
11  
V
V
I
AMP  
OGND3  
output ground  
I
SAMPLE  
AND  
HOLD  
OGND4  
output ground  
COARSE  
ADC  
FINE  
DAC  
FINE  
ADC  
42  
43  
V
V
CCO3  
CCO4  
data outputs  
27  
29  
31  
32  
33  
34  
35  
36  
40  
41  
D9 (MSB)  
D8  
D7  
D6  
D5  
D4  
ERROR  
CORECTION  
TTL  
OUTPUTS  
D3  
D2  
D1  
D0 (LSB)  
26  
IR  
8
9
12  
16  
4
20  
22 23 28 25  
MBD222 - 2  
V
OTC  
V
CCO1  
CCO2  
AGND1 AGND2 AGND3 AGND4  
analog ground  
DGND1 DGND2  
digital ground  
CS  
Fig.1 Block diagram for SO187 package.  
ahdnbok,uflapegwidt  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
PINNING  
SYMBOL  
CLK  
PIN  
DESCRIPTION  
1
clock input  
CLK  
2
complementary clock input  
digital supply voltage (+5 V)  
digital ground  
VCCD1  
DGND1  
n.c.  
3
4
5
not connected  
n.c.  
6
not connected  
VCCA1  
AGND1  
AGND2  
VI  
7
analog supply voltage (+5 V)  
analog ground  
8
9
analog ground  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
analog input voltage  
VI  
complementary analog input voltage  
analog ground  
AGND3  
VCCA2  
VrefL  
VrefH  
AGND4  
VCCA3  
n.c.  
analog supply voltage (+5 V)  
reference voltage LOW  
reference voltage HIGH  
analog ground  
analog supply voltage (+5 V)  
not connected  
n.c.  
not connected  
DGND2  
VCCD2  
CS  
digital ground  
digital supply voltage (+5 V)  
chip select input (TTL level input; active HIGH)  
output two’s complement  
output ground  
OTC  
OGND1  
VCCO1  
IR  
output supply voltage (+5 V)  
in-range output  
D9  
data output, bit 9 (MSB)  
output supply voltage (+5 V)  
data output, bit 8  
VCCO2  
D8  
OGND2  
D7  
output ground  
data output, bit 7  
D6  
data output, bit 6  
D5  
data output, bit 5  
D4  
data output, bit 4  
D3  
data output, bit 3  
D2  
data output, bit 2  
OGND3  
n.c.  
output ground  
not connected  
n.c.  
not connected  
D1  
data output, bit 1  
1996 Sep 12  
5
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
SYMBOL  
PIN  
DESCRIPTION  
D0  
41  
42  
43  
44  
data output, bit 0 (LSB)  
output supply voltage (+5 V)  
output supply voltage (+5 V)  
output ground  
VCCO3  
VCCO4  
OGND4  
V
n.c.  
7
8
9
39  
CCA1  
38 n.c.  
AGND1  
AGND2  
37 OGND3  
V
I
36  
10  
11  
12  
13  
14  
15  
16  
17  
D2  
V
I
35 D3  
AGND3  
TDA8760  
34  
D4  
V
33 D5  
CCA2  
V
D6  
D7  
32  
31  
30  
refL  
V
refH  
OGND2  
AGND4  
V
29 D8  
CCA3  
MGA928-1  
Fig.2 Pin configuration for SOT187-2.  
1996 Sep 12  
6
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VCCA  
PARAMETER  
analog supply voltage  
CONDITIONS  
MIN.  
0.3  
MAX.  
+7.0  
UNIT  
V
V
V
V
VCCD  
VCCO  
VCC1  
digital supply voltage  
output supply voltage  
0.3  
0.3  
0.5  
+7.0  
+7.0  
+0.5  
supply voltage difference between  
VCCA and VCCD  
VCC2  
VCC3  
supply voltage difference between  
VCCO and VCCD  
0.5  
0.5  
+0.5  
0.5  
V
V
supply voltage difference between  
VCCA and VCCO  
VI  
input voltage  
referenced to AGND  
0.3  
VCCA  
VCCD  
V
V
VI(p-p)  
input voltage for differential clock  
drive (peak-to-peak value)  
IO  
output current  
10  
mA  
°C  
°C  
°C  
Tstg  
Tamb  
Tj  
storage temperature  
operating ambient temperature  
junction temperature  
55  
0
+150  
+70  
+150  
HANDLING  
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is  
desirable to take normal precautions appropriate to handling integrated circuits.  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth j-a  
PARAMETER  
Thermal resistance from junction to ambient in free air  
TDA8760K/4  
THERMAL RESISTANCE  
35 K/W  
46 K/W  
TDA8760K/2  
1996 Sep 12  
7
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
CHARACTERISTICS  
V
CCA = VCCD = VCCO = 4.75 to 5.25 V; AGND and DGND shorted together;  
CCA VCCD = VCCO VCCD = VCCA VCCO = 0.25 to +0.25 V; Tamb = 0 to +70 °C; unless otherwise specified.  
V
Typical values measured at VCCA = VCCD = VCCO = 5 V; Tamb = 25 °C.  
SYMBOL  
Supplies  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VCCA  
VCCD  
VCCO  
ICCA  
analog supply voltage  
digital supply voltage  
output supply voltage  
analog supply current  
digital supply current  
output supply current  
4.75  
5.0  
5.25  
V
V
V
4.75  
4.75  
5.0  
5.0  
95  
5.25  
5.25  
100  
45  
mA  
mA  
mA  
ICCD  
40  
ICCO  
all outputs LOW  
35  
40  
Inputs  
CLK AND CLK (REFERENCED TO DGND); note 1  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
HIGH level input current  
0
0.8  
VCCD  
V
2.0  
400  
V
Vclk or Vclk = 0.4 V  
Vclk or Vclk = 2.0 V  
Vclk or Vclk = VCCD  
fclk = 40 MHz  
mA  
mA  
mA  
kΩ  
pF  
V
IIH  
100  
300  
ZI  
input impedance  
input capacitance  
2
CI  
fclk = 40 MHz  
4.5  
Vclk  
AC input voltage for  
switching (Vclk Vclk)  
DC level = 1.5 V  
DC level = 2.5 V  
0.5  
1.5  
2.0  
5.0  
V
OTC AND CS (REFERENCED TO DGND); see Table 3  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
HIGH level input current  
0
0.8  
VCCD  
V
2.0  
400  
V
VIL = 0.8 V  
VIH = 2.0 V  
µA  
µA  
IIH  
20  
1996 Sep 12  
8
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VI AND VI (REFERENCED TO AGND); see also Tables 1 and 2  
IIL  
LOW level input current  
HIGH level input current  
input impedance  
V
refH VrefL = 1.5 V  
refH VrefL = 1.5 V  
7
µA  
IIH  
V
22  
2
µA  
kΩ  
pF  
ZI  
fi = 4.43 MHz  
fi = 4.43 MHz  
CI  
input capacitance  
4.5  
VIoffset(d)  
input offset voltage  
differential mode; VI = VI;  
output code 511; Table 1  
V
V
CCA = 5 V  
3.3  
3.2  
3.3  
3.4  
3.6  
V
V
V
CCA = 4.75 V  
3.45  
3.8  
VCCA = 5.25 V  
VIoffset(s)  
input offset voltage  
single mode; VI = VIoffset(s)  
;
output code 511; Table 2  
VCCA = 5 V  
3.6  
3.5  
3.6  
3.7  
3.8  
V
V
V
V
CCA = 4.75 V  
3.65  
4.0  
VCCA = 5.25 V  
Voltage controlled regulator inputs VrefH and VrefL (referenced to AGND); differential input  
VrefH  
VrefL  
reference voltage HIGH  
reference voltage LOW  
4.0  
2.5  
1.4  
4.5  
3.0  
1.5  
VCCA  
3.5  
V
V
V
VI(p-p)  
input voltage amplitude  
(peak-to-peak value)  
1.6  
IrefH  
IrefL  
input current at VrefH  
input current at VrefL  
10  
10  
µA  
µA  
Voltage controlled regulator inputs VrefH and VrefL (referenced to AGND); single input  
VrefH  
VrefL  
reference voltage HIGH  
reference voltage LOW  
4.0  
2.5  
1.3  
4.4  
3.0  
1.4  
VCCA  
3.5  
V
V
V
VI(p-p)  
input voltage amplitude  
(peak-to-peak value)  
1.5  
IrefH  
IrefL  
input current at VrefH  
input current at VrefL  
10  
10  
µA  
µA  
Outputs (referenced to DGND)  
DIGITAL OUTPUTS D9 TO D0 AND IR (REFERENCED TO DGND)  
VOL  
VOH  
IO  
LOW level output voltage  
HIGH level output voltage  
IO = 2 mA  
0
0.4  
V
IO = 0.4 mA  
0.4 V < VO < VCCO  
2.4  
20  
VCCD  
+20  
V
output current in 3-state  
mode  
µA  
1996 Sep 12  
9
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Switching characteristics  
CLOCK FREQUENCY fclk (note 1; see Fig.3)  
fclk(min)  
fclk(max)  
minimum clock frequency  
maximum clock frequency  
TDA8760K/4  
1
MHz  
40  
20  
10  
8
MHz  
MHz  
ns  
TDA8760K/2  
tCPH  
tCPL  
clock pulse width HIGH  
clock pulse width LOW  
note 7  
ns  
Analog signal processing in differential input mode; see Table 1; 50% clock duty factor;  
I(p-p) = VrefH VrefL = 1.5 V  
V
LINEARITY  
ILE  
DC integral linearity error  
DC differential linearity error  
AC integral linearity error  
offset error  
fclk = 4 MHz  
clk = 4 MHz  
note 3  
±1.0  
±0.6  
±1.2  
±2.0  
±1.0  
±2.0  
+3  
LSB  
LSB  
LSB  
LSB  
DLE  
AILE  
OFE  
f
VCCA = VCCD = VCCO = 5 V; 3  
VI = VI; Tamb = 25 °C;  
output code = 511  
GE  
gain error; amplitude spread  
between devices  
V
T
V
CCA = VCCD = VCCO = 5 V; 10  
amb = 25 °C;  
refH VrefL = 1.5 V  
+10  
LSB  
BANDWIDTH (fclk = 40 MHZ); note 9  
Analog bandwidth  
B
1 dB  
3 dB  
140  
220  
MHz  
MHz  
HARMONICS (fclk = 40 MHZ); see Figs 6, 8 and 9  
f1  
fundamental harmonics  
(full scale)  
fi = 4.43 MHz  
0
dB  
fall  
harmonics (full scale);  
all components  
fi = 4.43 MHz  
second harmonics  
third harmonics  
70  
70  
65  
63  
63  
60  
dB  
dB  
dB  
THD  
total harmonic distortion  
fi = 4.43 MHz; note 2  
SIGNAL-TO-NOISE RATIO; notes 4 and 5; see Figs 6, 8 and 9  
SNR  
signal-to-noise ratio  
without harmonics;  
clk = 40 MHz;  
54  
56  
dB  
f
fi = 4.43 MHz; Tamb = 25 °C  
1996 Sep 12  
10  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
EFFECTIVE BITS; notes 4 and 5; see Figs 6, 8 and 9  
EB  
effective bits  
TDA8760K/2 (fclk = 20 MHz)  
fi = 4.43 MHz  
8.90  
bits  
fi = 7.5 MHz  
fi = 4.43 MHz  
fi = 10 MHz  
fi = 15 MHz  
8.70  
8.80  
8.80  
8.70  
bits  
bits  
bits  
bits  
effective bits  
TDA8760K/4 (fclk = 40 MHz)  
TWO-TONE  
Two-tone two-tone intermodulation  
rejection  
fclk = 40 MHz; note 8  
65  
dB  
BIT ERROR RATE  
BER  
bit error rate  
fclk = 40 MHz;  
2 × 1012  
times/  
fi = 4.43 MHz; VI = ±16 LSB  
at code 512  
samples  
DIFFERENTIAL GAIN; SEE Fig.5  
Gdiff  
differential gain  
fclk = 20 MHz; fi = 4.43 MHz  
0.5  
1.0  
%
%
f
clk = 40 MHz; fi = 4.43 MHz  
DIFFERENTIAL PHASE  
Φdiff  
differential phase  
fclk = 40 MHz; fi = 4.43 MHz  
0.1  
0.2  
deg  
Analog signal processing in single input mode; see Table 2; 50% clock duty factor; VI(p-p) = VrefH VrefL = 1.4 V  
LINEARITY  
ILE  
DC integral linearity error  
fclk = 4 MHz  
±1.0  
±0.6  
±1.2  
±2.0  
±1.0  
±2.0  
LSB  
LSB  
LSB  
DLE  
AILE  
DC differential linearity error fclk = 4 MHz  
AC integral linearity error  
note 3  
BANDWIDTH (fclk = 40 MHZ); note 9  
Analog bandwidth  
B
1 dB  
3 dB  
140  
220  
MHz  
MHz  
HARMONICS (fclk = 40 MHZ); see Fig.7  
f1  
fundamental harmonics  
(full scale)  
fi = 4.43 MHz  
fi = 4.43 MHz  
0
dB  
fall  
harmonics (full scale);  
all components  
second harmonics  
third harmonics  
61  
62  
59  
dB  
dB  
dB  
THD  
total harmonic distortion  
fi = 4.43 MHz; note 2  
1996 Sep 12  
11  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
SIGNAL-TO-NOISE RATIO; notes 4 and 5; see Fig.7  
SNR  
signal-to-noise ratio  
without harmonics;  
fclk = 40 MHz;  
54  
56  
dB  
fi = 4.43 MHz; Tamb = 25 °C  
EFFECTIVE BITS; notes 4 and 5; see Fig.7  
EB  
effective bits  
TDA8760K/2 (fclk = 20 MHz)  
fi = 4.43 MHz  
fi = 7.5 MHz  
fi = 4.43 MHz  
fi = 10 MHz  
8.70  
8.50  
8.50  
8.20  
bits  
bits  
bits  
bits  
effective bits  
TDA8760K/4 (fclk = 40 MHz)  
TWO-TONE  
Two-tone two-tone intermodulation  
rejection  
fclk = 40 MHz; note 8  
60  
dB  
BIT ERROR RATE  
BER  
bit error rate  
fclk = 40 MHz;  
2 × 1012  
times/  
fi = 4.43 MHz; VI = ±16 LSB  
at code 512  
samples  
DIFFERENTIAL GAIN; see Fig.5  
Gdiff  
differential gain  
fclk = 20 MHz; fi = 4.43 MHz  
0.5  
1.0  
%
%
f
clk = 40 MHz; fi = 4.43 MHz  
DIFFERENTIAL PHASE  
Φdiff  
differential phase  
fclk = 40 MHz; fi = 4.43 MHz  
0.1  
0.2  
deg  
Timing (note 6; see Fig.3; CL = 15 pF)  
tds  
th  
sampling delay time  
output hold time  
8
2
ns  
ns  
ns  
td  
output delay time  
12  
16  
3-state output delay times (see Fig.4)  
tdZH  
tdZL  
tdHZ  
tdLZ  
enable HIGH  
enable LOW  
disable HIGH  
disable LOW  
12  
12  
8
16  
16  
12  
20  
ns  
ns  
ns  
ns  
16  
1996 Sep 12  
12  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
Notes  
1. The circuit has two clock inputs: CLK and CLK. There are three modes of operation:  
a) TTL mode 1:  
CLK input is at TTL level with a threshold voltage of 1.5 V and sampling is taken on the falling edge of the clock  
input signal. CLK decoupled to DGND via a 100 nF capacitor.  
b) TTL mode 2:  
CLK input is at TTL level with threshold voltage of 1.5 V and sampling is taken on the rising edge of the clock  
input signal. CLK decoupled to DGND via a 100 nF capacitor.  
c) TTL mode 3:  
CLK and CLK inputs are at differential TTL levels.  
d) AC driving modes:  
When driving the CLK input directly and with any AC signal of minimum 0.5 V (p-p) and with a DC level of 1.5 V,  
the sampling takes place at the falling edge of the clock signal.  
When driving the CLK input with the same signal, sampling takes place at the rising edge of the clock signal.It is  
recommended to decouple the CLK or CLK input to DGND via a 100 nF capacitor.  
2. THD (total harmonic distortion) is obtained with the addition of the first five harmonics:  
F
a) THD = 20 log---------------------------------------------------------------------------------------------------------------  
2
2
2
2
2
(2nd) + (3rd) + (4th) + (5th) + (6th)  
b) F being the fundamental harmonic referenced at 0 dB for a full-scale sine wave input.  
3. AC linearity: full-scale differential sine wave (fi = 4.43 MHz; fclk = 40 MHz).  
4. Effective bits with differential input and single input are respectively executed with full scale differential input and  
full-scale single sine wave.  
5. Effective bits are obtained via a Fast Fourier Transformer (FFT) treatment taking 8K acquisition points per period.  
The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).  
Conversion to SNR: SNR = EB × 6.02 + 1.76 dB.  
6. Output data acquisition: the output data is available after the maximum delay of td.  
7. tCPH of 9 ns (minimum) can be applied at the penalty of 0.5 effective bit drop compared to typical values.  
8. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two  
input signals have the same amplitude and the total amplitude of both signals provides full-scale to the converter.  
9. The 3 dB (or 1 dB) analog bandwidth is determined by the 3 dB (or 1 dB) reduction in the reconstructed output,  
the input being a full-scale sine wave.  
1996 Sep 12  
13  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
Table 1 Output coding with differential inputs (typical values to AGND); VI(p-p) = VrefH VrefL = 1.5 V  
TWO’S COMPLEMENT  
BINARY OUTPUTS  
D9 TO D0  
OUTPUTS  
CODE  
VI(p-p)  
VI(p-p)  
IR  
D9 TO D0  
underflow  
<3.025  
3.025  
>3.775  
3.775  
0
1
1
0 0 0 0 0 0 0 0 0 0  
0 0 0 0 0 0 0 0 0 0  
0 0 0 0 0 0 0 0 0 1  
• • • • • • • • • •  
1 0 0 0 0 0 0 0 0 0  
1 0 0 0 0 0 0 0 0 0  
1 0 0 0 0 0 0 0 0 1  
• • • • • • • • • •  
0
1
511  
3.40  
3.40  
1
0 1 1 1 1 1 1 1 1 1  
• • • • • • • • • •  
1 1 1 1 1 1 1 1 1 1  
• • • • • • • • • •  
1022  
1023  
overflow  
1
1
0
1 1 1 1 1 1 1 1 1 0  
1 1 1 1 1 1 1 1 1 1  
1 1 1 1 1 1 1 1 1 1  
0 1 1 1 1 1 1 1 1 0  
0 1 1 1 1 1 1 1 1 1  
0 1 1 1 1 1 1 1 1 1  
3.775  
>3.775  
3.025  
<3.025  
Table 2 Output coding with single inputs (typical values to AGND); VI(p-p) = VrefH VrefL = 1.4 V; VI(p-p) = 3.7 V  
TWO’S COMPLEMENT  
BINARY OUTPUTS  
OUTPUTS  
CODE  
VI(p-p)  
IR  
D9 TO D0  
D9 TO D0  
underflow  
<3.0  
3.0  
0
1
1
0 0 0 0 0 0 0 0 0 0  
0 0 0 0 0 0 0 0 0 0  
0 0 0 0 0 0 0 0 0 1  
• • • • • • • • • •  
1 0 0 0 0 0 0 0 0 0  
1 0 0 0 0 0 0 0 0 0  
1 0 0 0 0 0 0 0 0 1  
• • • • • • • • • •  
0
1
511  
3.7  
1
0 1 1 1 1 1 1 1 1 1  
• • • • • • • • • •  
1 1 1 1 1 1 1 1 1 1  
• • • • • • • • • •  
1022  
1023  
overflow  
1
1
0
1 1 1 1 1 1 1 1 1 0  
1 1 1 1 1 1 1 1 1 1  
1 1 1 1 1 1 1 1 1 1  
0 1 1 1 1 1 1 1 1 0  
0 1 1 1 1 1 1 1 1 1  
0 1 1 1 1 1 1 1 1 1  
4.4  
>4.4  
Table 3 Mode selection.  
OTC  
1
CS  
1
D0 TO D9 AND IR  
binary; active  
0
X(1)  
1
two’s complement; active  
high impedance  
0
Note  
1. Where: X = don’t care.  
1996 Sep 12  
14  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
t
CPL  
t
CPH  
1.4 V  
CLK  
sample N  
sample N + 1  
sample N + 2  
V
l
t
t
dS  
HD  
2.4 V  
1.4 V  
0.4 V  
DATA  
D0 to D7  
DATA  
N - 2  
DATA  
N - 1  
DATA  
N
DATA  
N + 1  
t
d
MBD721  
Fig.3 Timing diagram.  
V
CCD  
f
CS  
50 %  
dZH  
t
t
dHZ  
HIGH  
90 %  
output  
data  
50 %  
LOW  
t
t
dZL  
dLZ  
HIGH  
output  
data  
50 %  
LOW  
TEST  
S1  
VCCD  
VCCD  
GND  
GND  
10 %  
tdLZ  
V
tdZL  
tdHZ  
tdZH  
CCD  
3.3 kΩ  
15 pF  
S1  
TDA8760  
CS  
MBD723  
CS = 100 kHz.  
Fig.4 Timing diagram and test conditions of 3-state output delay time.  
15  
1996 Sep 12  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
digital output  
CODE 1023  
V4  
f
= 4.43 MHz  
i
V
i
(1)  
f
= 4.43 MHz  
i
V3  
V2  
V1  
V0  
(1)  
f
= 4.43 MHz  
i
(1)  
f
= 4.43 MHz  
i
(1)  
f
= 4.43 MHz  
i
(1)  
DC offset voltage  
CODE 0  
MBD722  
(1) Full-scale divided-by-5.  
V
n (1 to 4) V0  
Gdiff = maximum of ------------------------------------------ × 100%  
V0  
Fig.5 Differential gain measurement conditions.  
MBD223 - 1  
MGA931 - 2  
9.0  
9.0  
f
= 20 MHz  
effective  
bits  
clk  
effective  
bits  
f
= 20 MHz  
40 MHz  
clk  
40 MHz  
8.8  
8.6  
8.4  
8.2  
8.0  
8.8  
8.6  
8.4  
8.2  
8.0  
0
2
4
6
8
10  
(MHz)  
0
4
8
12  
16  
f
20  
(MHz)  
f
i
i
Fig.6 Typical effective bits under differential input  
mode as a function of input signal  
frequency.  
Fig.7 Typical effective bits under single input  
mode as a function of input signal  
frequency.  
1996 Sep 12  
16  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
MRC299  
0
amplitude  
(dB)  
–20.2  
–40.4  
–60.6  
–80.8  
–101  
–121  
0
1.25  
2.50  
3.75  
5.00  
6.25  
7.50  
8.75  
10.0  
f (MHz)  
Effective bits: 9.1; THD = 65.81 dB;  
Harmonic levels (dB): 2nd = 75.54; 3rd = 76.29; 4th = 74.90; 5th = 67.50; 6th = 90.87.  
Fig.8 Fast Fourier Transformer (fclk = 20 MHz; fi = 4.43 MHz); for differential input mode.  
MBD220  
0
amplitude  
(dB)  
–20  
–40  
–60  
–80  
–100  
–120  
0
2.5  
5
7.5  
10  
12.5  
15  
17.5  
20  
f (MHz)  
Effective bits: 8.92; THD = 65.86 dB;  
Harmonic levels (dB): 2nd = 70.92; 3rd = 68.48; 4th = 75.32; 5th = 81.40; 6th = 72.69.  
Fig.9 Fast Fourier Transformer (fclk = 40 MHz; fi = 4.43 MHz); for differential input mode.  
17  
1996 Sep 12  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
INTERNAL PIN CONFIGURATION  
V
V
V
V
V
CCA1 CCA2 CCA3  
CCD1 CCD2  
CLK  
1
CLK  
2
7
13  
17  
3
21  
V
CCD  
V
CCA  
V
and  
I
10 and 11  
V
I
30  
kΩ  
30  
kΩ  
AGND  
1.5 V  
V
CCA  
DGND  
14  
15  
V
V
refL  
refH  
25 and 43  
V
/
CCO1  
V
CCO4  
AGND  
V
CCO3  
20  
kΩ  
31 to 36,  
40 and 41  
CS  
and  
22 and 23  
1.5 V  
data output  
bit 7 to 0  
OTC  
30 and 37  
OGND2 /  
OGND3  
TDA8760  
DGND  
12  
8
9
16  
4
20  
MGA978  
AGND1 AGND2 AGND3 AGND4 DGND1 DGND2  
analog ground digital ground  
Fig.10 Description of input and output circuitry.  
1996 Sep 12  
18  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
APPLICATION INFORMATION  
100 nF  
100 nF  
(1)  
CLK  
5 V  
5 V  
100 nF  
differential  
analog inputs  
IN  
IN  
D0 (LSB)  
D1  
100 nF  
6
5
4
3
2
1 44 43 42 41 40  
4.7  
µ
F
4.7 µF  
7
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
8
9
IN  
IN  
10  
11  
12  
13  
14  
15  
16  
17  
D2  
D3  
D4  
D5  
D6  
D7  
TDA8760  
100 nF  
100 nF  
(2)  
(2) (2)  
R2 R3  
(2)  
R1  
R4  
D8  
(3)  
(3)  
18 19 20 21 22 23 24 25 26 27 28  
100  
nF  
100  
nF  
D9 (MSB)  
5 V  
100 nF  
3 V 4.5 V  
100 nF  
100 nF  
5 V  
5 V  
output format select  
chip select input  
MGA979  
The analog, digital and output supplies should be separated and decoupled.  
(1) Differential clock signals can be applied if required.  
(2) R1 and R2 must be determined in order to obtain a middle voltage of 3.4 V; see Table 1.  
(3) VrefH and VrefL must be decoupled to AGND.  
Fig.11 Application diagram for differential input mode.  
1996 Sep 12  
19  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
100 nF  
100 nF  
(1)  
single  
analog  
input  
CLK  
5 V  
5 V  
100 nF  
IN  
D0 (LSB)  
D1  
100 nF  
6
5
4
3
2
1 44 43 42 41 40  
7
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
8
9
100  
nF  
IN  
IN  
10  
11  
12  
13  
14  
15  
16  
17  
D2  
D3  
D4  
D5  
D6  
D7  
TDA8760  
100 nF  
100 nF  
(2)  
(2)  
R1  
R2  
D8  
(3)  
(3)  
18 19 20 21 22 23 24 25 26 27 28  
100  
nF  
100  
nF  
D9 (MSB)  
5 V  
100 nF  
3 V 4.5 V  
100 nF  
100 nF  
5 V  
5 V  
output format select  
chip select input  
MGA980  
The analog, digital and output supplies should be separated and decoupled.  
(1) Differential clock signals can be applied if required.  
(2) R1 and R2 must be determined in order to obtain 3.4 V at the transformer; see Table 1.  
Adaptation with the single input signal impedance must be taken care of.  
(3) VrefH and VrefL must be decoupled to AGND.  
Fig.12 Application diagram for differential input mode using an input transformer.  
1996 Sep 12  
20  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
100 nF  
100 nF  
(1)  
single  
analog  
input  
CLK  
5 V  
5 V  
100 nF  
IN  
D0 (LSB)  
D1  
100 nF  
6
5
4
3
2
1 44 43 42 41 40  
4.7  
µ
F
4.7 µF  
7
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
8
9
IN  
IN  
10  
11  
12  
13  
14  
15  
16  
17  
D2  
D3  
D4  
D5  
D6  
D7  
TDA8760  
100 nF  
100 nF  
(2)  
(2) (2)  
R2 R3  
(2)  
R1  
R4  
D8  
(3)  
(3)  
18 19 20 21 22 23 24 25 26 27 28  
100  
nF  
100  
nF  
D9 (MSB)  
5 V  
100 nF  
3 V 4.5 V  
100 nF  
100 nF  
5 V  
5 V  
output format select  
chip select input  
MGA981  
The analog, digital and output supplies should be separated and decoupled.  
(1) Differential clock signals can be applied if required.  
(2) R1 = R3; R2 = R4. R1, R2, R3 and R4 must be determined in order to obtain a middle voltage of 3.7 V; see Table 2.  
(3) VrefH and VrefL must be decoupled to AGND.  
Fig.13 Application diagram for single input mode.  
1996 Sep 12  
21  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
PACKAGE OUTLINE  
PLCC44: plastic leaded chip carrier; 44 leads  
SOT187-2  
e
e
E
D
y
X
A
39  
29  
b
p
Z
E
28  
40  
b
1
w M  
44  
1
H
E
E
pin 1 index  
A
A
1
A
4
e
(A )  
3
6
18  
k
1
β
L
p
k
detail X  
7
17  
v
M
A
e
Z
D
D
B
H
v
M
B
D
0
5
10 mm  
scale  
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)  
(1)  
(1)  
A
min.  
A
max.  
k
1
max.  
Z
Z
E
(1)  
(1)  
1
4
D
UNIT  
mm  
A
A
b
D
E
e
e
e
H
H
k
L
p
v
w
y
β
b
D
E
D
E
3
p
1
max. max.  
4.57  
4.19  
0.81 16.66 16.66  
0.66 16.51 16.51  
16.00 16.00 17.65 17.65 1.22  
14.99 14.99 17.40 17.40 1.07  
1.44  
1.02  
0.53  
0.33  
0.51  
0.51 0.25 3.05  
0.020 0.01 0.12  
1.27  
0.05  
0.18 0.18 0.10 2.16 2.16  
0.007 0.007 0.004 0.085 0.085  
o
45  
0.180  
0.165  
0.032 0.656 0.656  
0.026 0.650 0.650  
0.630 0.630 0.695 0.695 0.048  
0.590 0.590 0.685 0.685 0.042  
0.057  
0.040  
0.021  
0.013  
inches  
0.020  
Note  
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-02-25  
97-12-16  
SOT187-2  
112E10  
MO-047AC  
1996 Sep 12  
22  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
SOLDERING  
Introduction  
Wave soldering  
Wave soldering techniques can be used for all PLCC  
packages if the following conditions are observed:  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The package footprint must incorporate solder thieves at  
the downstream corners.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all PLCC  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
The choice of heating method may be influenced by larger  
PLCC packages (44 leads, or more). If infrared or vapour  
phase heating is used and the large packages are not  
absolutely dry (less than 0.1% moisture content by  
weight), vaporization of the small amount of moisture in  
them can cause cracking of the plastic body. For more  
information, refer to the Drypack chapter in our “Quality  
Reference Handbook” (order code 9397 750 00192).  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
1996 Sep 12  
23  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATION  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Sep 12  
24  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
NOTES  
1996 Sep 12  
25  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
NOTES  
1996 Sep 12  
26  
Philips Semiconductors  
Product specification  
10-bit high-speed analog-to-digital  
converter  
TDA8760  
NOTES  
1996 Sep 12  
27  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,  
Tel. +43 1 60 101, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 926 5361, Fax. +7 095 564 8323  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Czech Republic: see Austria  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 1949  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 615 800, Fax. +358 615 80920  
South America: Rua do Rocio 220, 5th floor, Suite 51,  
04552-903 São Paulo, SÃO PAULO - SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 829 1849  
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 3 301 6312, Fax. +34 3 301 4107  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS,  
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2686, Fax. +41 1 481 7730  
Hungary: see Austria  
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.  
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722  
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,  
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,  
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444  
Indonesia: see Singapore  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,  
Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 825 344, Fax.+381 11 635 777  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,  
Internet: http://www.semiconductors.philips.com  
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1996  
SCA51  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
537021/1200/02/pp28  
Date of release: 1996 Sep 12  
Document order number: 9397 750 01092  

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