TDA8941 [NXP]
1.5 W mono Bridge Tied Load BTL audio amplifier; 1.5瓦单声道桥接负载BTL音频放大器
| 型号： | TDA8941 |
| 厂家： | 
NXP |
| 描述： | 1.5 W mono Bridge Tied Load BTL audio amplifier |
| 文件： | 总21页 (文件大小：358K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TDA8941P
1.5 W mono Bridge Tied Load (BTL) audio amplifier
Rev. 02 — 7 April 2000
Product specification
1. General description
The TDA8941P is a single-channel audio power amplifier with an output power of
1.5 W at an 16 Ω load and a 9 V supply. The circuit contains a Bridge Tied Load
(BTL) amplifier with an all-NPN output stage and standby/mute logic. The TDA8941P
comes in a 8-pin dual in-line (DIP8) package. The TDA8941P is printed-circuit board
(PCB) compatible with all other types in the TDA894x family. One PCB footprint
accommodates both the mono and the stereo products.
2. Features
■ Few external components
■ Fixed gain
■ Standby and mute mode
■ No on/off switching plops
■ Low standby current
■ High supply voltage ripple rejection
■ Outputs short-circuit protected to ground, supply and across the load
■ Thermally protected
c
c
■ Printed-circuit board compatible.
3. Applications
■ Mains fed applications (e.g. TV sound)
■ PC audio
■ Portable audio.
4. Quick reference data
Table 1: Quick reference data
Symbol Parameter
Conditions
Min
Typ
9
Max Unit
VCC
Iq
supply voltage
6
-
18
20
10
V
quiescent supply current VCC = 9 V; RL = ∞
14
-
mA
µA
Istb
standby supply current
-
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
Table 1: Quick reference data…continued
Symbol Parameter
Conditions
Min
Typ
Max Unit
Po
output power
THD = 10%;RL = 16 Ω;
1.2
1.5
-
W
VCC = 9 V
THD
Gv
total harmonic distortion
voltage gain
Po = 0.5 W
-
0.03 0.3
%
31
50
32
65
33
-
dB
dB
SVRR
supply voltage ripple
rejection
5. Ordering information
Table 2: Ordering information
Type number Package
Name
Description
Version
SOT97-1
TDA8941P
DIP8
plastic dual in-line package; 8 leads (300 mil)
6. Block diagram
V
d
CC
1
TDA8941P
7
OUT−
5
3
IN−
IN+
2
OUT+
V
CC
4
6
STANDBY/
MUTE LOGIC 20
MODE
SVR
kΩ
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
20
kΩ
8
MGL579
GND
Fig 1. Block diagram.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
2 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
7. Pinning information
7.1 Pinning
handbook, halfpage
V
GND
OUT−
SVR
IN−
1
2
3
4
8
7
6
5
CC
OUT+
IN+
TDA8941P
MODE
MGR892
Fig 2. Pin configuration.
7.2 Pin description
Table 3: Pin description
Symbol
VCC
Pin
1
Description
supply voltage
OUT+
IN+
2
positive loudspeaker terminal
positive input
3
MODE
IN−
4
mode selection input (standby, mute, operating)
negative input
5
SVR
6
half supply voltage decoupling (ripple rejection)
negative loudspeaker terminal
ground
OUT−
GND
7
8
8. Functional description
The TDA8941P is a mono BTL audio power amplifier capable of delivering 1.5 W
output power to an 16 Ω load at THD = 10%, using a 9 V power supply. The voltage
gain is fixed at 32 dB.
With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’
and to ‘operating’ mode.
The TDA8941P outputs are protected by an internal thermal shutdown protection
mechanism and a short-circuit protection.
8.1 Input configuration
The TDA8941P inputs can be driven symmetrical (floating) as well as asymmetrical.
In the asymmetrical mode one input pin is connected via a capacitor to the signal
ground which should be as close as possible to the SVR (electrolytic) capacitor
ground. Note that the DC level of the input pins is half of the supply voltage VCC, so
coupling capacitors for both pins are necessary.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
3 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
The input cut-off frequency is:
1
f i(cut – off )
=
(1)
(2)
----------------------------
2π(Ri × Ci)
For Ri = 45 kΩ and Ci = 220 nF:
1
f i(cut – off )
=
= 16 Hz
----------------------------------------------------------------
2π(45 × 103 × 220 × 10–9
)
As shown in Equation 1 and 2, large capacitor values for the inputs are not
necessary; so the switch-on delay during charging of the input capacitors, can be
minimized. This results in a good low frequency response and good switch-on
behaviour.
Remark: To prevent HF oscillations do not leave the inputs open, connect a capacitor
of at least 1.5 nF across the input pins close to the device.
8.2 Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output
stage, capable of delivering a peak output current of 2 A.
The BTL principle offers the following advantages:
Lower peak value of the supply current
•
•
•
•
The ripple frequency on the supply voltage is twice the signal frequency
No expensive DC-blocking capacitor
Good low frequency performance.
8.2.1 Output power measurement
The output power as a function of the supply voltage is measured on the output pins
at THD = 10%; see Figure 8. The maximum output power is limited by the maximum
power dissipation in the plastic package.
8.2.2 Headroom
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom –
compared to the average power output – for transferring the loudest parts without
distortion. At VCC = 9 V, RL = 16 Ω and Po = 1 W at THD = 1% (see Figure 6), the
Average Listening Level (ALL) – music power – without any distortion yields:
Po(ALL) = 1 W/15.85 = 63 mW.
The power dissipation can be derived from Figure 11 on page 10 for 0 dB
respectively 12 dB headroom.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
4 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
Table 4: Power rating as function of headroom
Headroom
Power output (THD = 1%)
Po = 1 W
Power dissipation (P)
1.15 W
0 dB
12 dB
Po(ALL) = 63 mW
0.6 W
For the average listening level a power dissipation of 0.6 W can be used for
calculation of the maximum ambient temperature.
8.3 Mode selection
The TDA8941P has three functional modes, which can be selected by applying the
proper DC voltage to pin MODE. See Figure 4 and 5 for the respective DC levels,
which depend on the supply voltage level. The MODE pin can be driven by a 3-state
logic output stage: e.g. a microcontroller with additional components for DC-level
shifting.
Standby — In this mode the current consumption is very low and the outputs are
floating. The device is in standby mode when (VCC − 0.5 V) < VMODE < VCC, or when
the MODE pin is left floating (high impedance). The power consumption of the
TDA8941P will be reduced to <0.18 mW.
Mute — In this mode the amplifier is DC-biased but not operational (no audio output);
the DC level of the input and output pins remain on half the supply voltage. This
allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to
be charged to avoid pop-noise. The device is in mute mode when
3 V < VMODE < (VCC − 1.5 V).
Operating — In this mode the amplifier is operating normally. The operating mode is
activated at VMODE < 0.5 V.
8.3.1 Switch-on and switch-off
To avoid audible plops during supply voltage switch-on or switch-off, the device is set
to standby mode before the supply voltage is applied (switch-on) or removed
(switch-off).
The switch-on and switch-off time can be influenced by an RC-circuit on the MODE
pin. Rapid on/off switching of the device or the MODE pin may cause ‘click- and
pop-noise’. This can be prevented by proper timing of the RC-circuit on the MODE
pin.
8.4 Supply Voltage Ripple Rejection (SVRR)
The SVRR is measured with an electrolytic capacitor of 10 µF on pin SVR at a
bandwidth of 10 Hz to 80 kHz. Figure 12 on page 11 illustrates the SVRR as function
of the frequency. A larger capacitor value on the SVR pin improves the ripple rejection
behaviour at the lower frequencies.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
5 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
8.5 Built-in protection circuits
The TDA8941P contains two types of protection circuits, i.e. short-circuit and thermal
shutdown.
8.5.1 Short-circuit protection
Short-circuit to ground or supply line — This is detected by a so-called ‘missing
current’ detection circuit which measures the current in the positive supply line and
the current in the ground line. A difference between both currents larger than 0.4 A,
switches the power stage to standby mode (high impedance).
Short-circuit across the load — This is detected by an absolute-current
measurement. An absolute-current larger than 2 A, switches the power stage to
standby mode (high impedance).
8.5.2 Thermal shutdown protection
The junction temperature is measured by a temperature sensor; at a junction
temperature of approximately 150 °C this detection circuit switches the power stage
to standby mode (high impedance).
9. Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
no signal
Min
−0.3
−0.3
−0.3
-
Max
+25
+18
Unit
V
VCC
supply voltage
operating
V
VI
input voltage
VCC + 0.3 V
IORM
Tstg
Tamb
repetitive peak output current
storage temperature
2
A
non-operating
−55
−40
+150
+85
°C
°C
operating ambient
temperature
Ptot
total power dissipation
-
-
1.25
12
W
V
VCC(sc)
supply voltage to guarantee
short-circuit protection
10. Thermal characteristics
Table 6: Thermal characteristics
Symbol
Parameter
Conditions
Value Unit
100 K/W
Rth(j-a)
thermal resistance from junction to ambient
in free air
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
6 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
11. Static characteristics
Table 7: Static characteristics
VCC = 9 V; Tamb = 25 °C; RL = 16 Ω; VMODE = 0 V; Vi = 0 V; measured in test circuit Figure 13; unless otherwise specified.
Symbol
VCC
Iq
Parameter
Conditions
operating
RL = ∞
Min
Typ
Max
18
Unit
V
supply voltage
6
-
9
[1]
[2]
quiescent supply current
standby supply current
DC output voltage
14
20
mA
µA
V
Istb
VMODE = VCC
-
-
10
VO
-
4.5
-
[3]
∆VOUT
differential output voltage offset
mode selection input voltage
-
-
-
-
-
-
200
0.5
mV
V
VMODE
operating mode
mute mode
0
3
VCC − 1.5
V
standby mode
0 < VMODE < VCC
V
CC − 0.5
VCC
20
V
IMODE
mode selection input current
-
µA
[1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential
output voltage offset (∆VOUT) divided by the load resistance (RL).
[2] The DC output voltage with respect to ground is approximately 0.5VCC
.
[3] ∆VOUT = | VOUT+ − VOUT− |.
MGU023
MGU022
20
30
handbook, halfpage
handbook, halfpage
I
I
q
q
(mA)
25
(mA)
16
V
= 11 V
9 V
CC
20
15
10
5
12
8
4
0
0
0
0
2
4
6
8
10
12
(V)
4
8
12
16
V
20
(V)
V
MODE
CC
Fig 3. Quiescent supply current as function of supply
voltage.
Fig 4. Quiescent supply current as function of mode
voltage.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
7 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
12. Dynamic characteristics
Table 8: Dynamic characteristics
VCC = 9 V; Tamb = 25 °C; RL = 16 Ω; f = 1 kHz; VMODE = 0 V; measured in test circuit Figure 13; unless otherwise specified.
Symbol
Parameter
Conditions
THD = 10%
THD = 0.5%
Po = 0.5 W
Min
1.2
0.8
-
Typ
1.5
1
Max
-
Unit
W
Po
output power
-
W
THD
Gv
total harmonic distortion
voltage gain
0.03
32
0.3
33
110
120
-
%
31
70
-
dB
kΩ
µV
dB
dB
Zi(dif)
Vn(o)
SVRR
differential input impedance
noise output voltage
90
[1]
[2]
[2]
90
supply voltage ripple rejection
fripple = 1 kHz
50
-
65
fripple = 100 Hz
to 20 kHz
60
-
[3]
Vo(mute)
output voltage
mute mode
-
-
50
µV
[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance
RS = 0 Ω at the input.
[2] Supply voltage ripple rejection is measured at the output, with a source impedance RS = 0 Ω at the input. The ripple voltage is a sine
wave with a frequency fripple and an amplitude of 700 mV (RMS), which is applied to the positive supply rail.
[3] Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.
MGU025
10
V
o
(V)
1
−1
10
−2
10
−3
10
−4
10
V
= 11 V
9 V
CC
−5
10
0
2
4
6
8
10
12
V
(V)
MODE
Fig 5. Output voltage as function of mode voltage.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
8 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
MGU018
MGU019
2
2
10
10
handbook, halfpage
handbook, halfpage
THD
(%)
THD
(%)
10
10
1
1
(1)
(1)
(2)
−1
−1
10
10
(2)
−2
−2
10
10
−2
−1
−2
−1
10
10
1
10
10
10
1
10
P
(W)
P (W)
o
o
a. VCC = 9 V; RL = 16 Ω; f = 1 kHz.
b. VCC = 11 V; RL = 25 Ω; f = 1 kHz.
(1) Measured on the standard printed-circuit board without an additional heatsink (see Figure 14). These curves Influence of
thermal feedback caused by the high power dissipation in combination with the high thermal resistance of the plastic
package.
(2) Measured with a small heatsink on top of the plastic package body; Rth(h-a) = 30 K/W.
Fig 6. Total harmonic distortion as function of output power.
MGU021
MGU020
10
10
handbook, halfpage
handbook, halfpage
THD
(%)
THD
(%)
1
1
(1)
(2)
(1)
(2)
−1
−1
10
10
−2
−2
10
10
2
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
a. VCC = 9 V; RL = 16 Ω; Po = 0.1 W.
b. VCC = 9 V; RL = 16 Ω; Po = 0.5 W.
No bandpass filter applied.
(1) Measured on the standard printed-circuit board without an additional heatsink (see Figure 14). These curves Influence of
thermal feedback caused by the high power dissipation in combination with the high thermal resistance of the plastic
package.
(2) Measured with a small heatsink on top of the plastic package body; Rth(h-a) = 30 K/W.
Fig 7. Total harmonic distortion as function of frequency.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
9 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
MGU026
MGU027
3
2
handbook, halfpage
handbook, halfpage
P
o
P
tot
(W)
(W)
2.5
1.5
R
= 16 Ω
25 Ω
L
2
R
= 16 Ω
25 Ω
L
1
1.5
1
0.5
0
0.5
0
0
0
2
4
6
8
10
12
V
14
(V)
2
4
6
8
10
12
14
(V)
V
CC
CC
THD = 10%; f = 1 kHz.
THD = 1%.
Fig 8. Output power as function of supply voltage.
Fig 9. Total power dissipation as function of supply
voltage.
MGU029
MGU028
100
2
handbookη, halfpage
handbook, halfpage
P
(%)
(W)
80
1.5
(1)
(1)
(2)
60
(2)
1
40
0.5
0
20
0
0
0.5
1
1.5
2
2.5
(W)
0
0.5
1
1.5
2
2.5
P
P (W)
o
o
(1) VCC = 9 V.
(2) VCC = 11 V.
(1) VCC = 9 V; RL = 16 Ω.
(2) VCC = 11 V; RL = 25 V.
Fig 10. Efficiency as function of output power.
Fig 11. Power dissipation as function of output power.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
10 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
MGU024
0
SVRR
(dB)
−20
B
−40
−60
A
−80
2
3
4
5
10
10
10
10
10
f (Hz)
VCC = 9 V; RS = 0 Ω; Vripple = 700 mV (RMS); no bandpass filter applied.
Curve A: inputs short-circuited
Curve B: inputs short-circuited and connected to ground (asymmetrical application)
Fig 12. Supply voltage ripple rejection as function of frequency.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
11 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
13. Internal circuitry
Table 9: Internal circuitry
Pin
Symbol
Equivalent circuit
3 and 5
IN+ and IN−
V
CC
V
V
CC
CC
1.5 kΩ
45 kΩ
1.5 kΩ
45 kΩ
3
5
1/2 V
CC
(SVR)
MGU082
7 and 2
OUT− and OUT+
100 Ω
2, 7
40 Ω
1/2 V
CC
MGU083
4
MODE
V
CC
V
CC
1 kΩ
1 kΩ
20 kΩ
V
CC
4
OFF
MUTE
HIGH
HIGH
MGU073
6
SVR
V
CC
Standby
20 kΩ
20 kΩ
6
MGU084
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
12 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
14. Application information
+V
CC
1000 µF
100 nF
220 nF
R
s
1
Symmetrical
input
30 kΩ
C
i
IN−
5
3
−
+
7
2
OUT−
R
220 nF
220 nF
i
45 kΩ
1/2 V
−
+
R
s
1.5
nF
+
R
L
16 Ω
CC
−
1/2 V
CC
R
Asymmetrical
input
i
+
−
C
i
OUT+
45 kΩ
IN+
220 nF
signal
GND
30 kΩ
V
TDA8941P
CC
V
CC
R
MODE
SVR
STANDBY/
MUTE LOGIC
4
6
20 kΩ
R
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
C1
1/2 V
CC
MICROCONTROLLER
C2
signal
GND
10
µF
20 kΩ
C1 C2
MODE
8
Standby
Mute
On
0
0
1
0
1
0
GND
MGU016
Fig 13. Application diagram.
14.1 Printed-circuit board (PCB)
14.1.1 Layout and grounding
For a high system performance level certain grounding techniques are essential.
The input reference grounds have to be tied with their respective source grounds and
must have separate tracks from the power ground tracks; this will prevent the large
(output) signal currents from interfering with the small AC input signals.
The small-signal ground tracks should be physically located as far as possible from
the power ground tracks. Supply and output tracks should be as wide as possible for
delivering maximum output power.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
13 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
54 mm
i
56 mm
OUT+
ON
MUTE
OUT−
+
−
10 µF
1
IN−
IN+
220 nF
1.5 nF
V
CC
100 nF
1000 µF
GND
MGU017
Fig 14. Printed-circuit board layout (single-sided); components view.
14.1.2 Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor locations should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR – typical 100 nF – has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor – e.g. 1000 µF or greater – must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
14 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
14.2 Thermal behaviour and Tamb(max) calculation
The measured maximum thermal resistance of the IC package, Rth(j-a) is 100 K/W.
A calculation for the maximum ambient temperature can be made, with the following
parameters:
VCC = 9 V and RL = 16 Ω
Tj(max) = 150 °C.
Rth(tot) is the total thermal resistance between the junction and the ambient.
At VCC = 9 V and RL = 16 Ω the measured worst-case sine-wave dissipation is
1.15 W; see Figure 11. For Tj(max) = 150 °C the maximum ambient temperature is:
Tamb(max) = 150 – 1.15 × 100 = 35 °C
The calculation above is for an application at worst-case (stereo) sine-wave output
signals. In practice music signals will be applied, which decreases the maximum
power dissipation to approximately half of the sine-wave power dissipation (see
Section 8.2.2). For Tj(max) = 150 °C the maximum ambient temperature is:
Tamb(max) = 150 – 0.6 × 100 = 90 °C
To increase the lifetime of the IC, Tj(max) should be reduced to 125 °C. This results in:
Tamb(max) = 125 – 0.6 × 100 = 65 °C
15. Test information
15.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611D is
applicable.
15.2 Test conditions
Tamb = 25 °C; VCC = 9 V; f = 1 kHz; RL = 16 Ω; audio pass band 22 Hz to 22 kHz;
unless otherwise specified.
Remark: In the graphs as function of frequency no bandpass filter was applied;
see Figure 7 and 12.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
15 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
16. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
99-12-27
SOT97-1
050G01
MO-001
SC-504-8
Fig 15. DIP8 package outline.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
16 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
17. Soldering
17.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
17.4 Package related soldering information
Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package
Soldering method
Dipping
Wave
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable[1]
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
17 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
18. Revision history
Table 11: Revision history
Rev Date
CPCN Description
02 20000407
-
Product specification; second version; supersedes initial version TDA8941P-01 of
14 April 1999 (9397 750 04876). Modifications:
Table 1 on page 1:THD: Max value 0.1% changed to → 0.3%;
SVRR: Typ value 65 dB → added
•
Ordering options removed
•
Section 8 “Functional description”:
•
– Section 8.1 “Input configuration” on page 3 → added.
– Section 8.2 “Power amplifier” on page 4: ........, capable of delivering a peak output
current of 1.5 A → changed to 2 A.
– Section 8.2.1 “Output power measurement” on page 4 → added
– Section 8.2.2 “Headroom” on page 4 → added
Section 8.3 “Mode selection”:
•
– Standby mode: VMODE > (VCC − 0.5 V) → changed to (VCC − 0.5 V) < VMODE < VCC; The
power consumption of the TDA8941P will be reduced to <0.18 mW → added.
– Mute mode: the DC level of the input and output pins remain on half the supply
voltage → added;
– 2.5 V < VMODE < (VCC − 1.5 V) → changed to 3 V < VMODE < (VCC − 1.5 V)
– Section 8.3.1 “Switch-on and switch-off” on page 5 → added.
Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 5 → added
•
Section 8.5 “Built-in protection circuits” on page 6 → added
•
Table 5 on page 6:
•
– Ptot value added 1.25 W
– VCC(sc) value added 12 V
Table 7 on page 7: VMODE - mute mode - value Min 2.5 → changed to 3 V
•
Table 8 on page 8:
•
– THD: Max value 0.1% changed to → 0.3%
– SVRR; Typ values 65 and 60 dB → added
– Rsource changed to → RS in table and associated table notes
– Table note [2]: .... 100 mV (RMS).... changed to → ... 700 mV (RMS)....
Figure 3 to 12: figures added
•
Section 13 “Internal circuitry” on page 12: → added
•
Figure 13: figure modified
•
Section 14.1 “Printed-circuit board (PCB)” on page 13: → added
•
Figure 14: figure added
•
Section 14.2 “Thermal behaviour and Tamb(max) calculation” on page 15: → added
•
Section 15 “Test information” on page 15: Section 15.1 → updated
•
Section 15.2 “Test conditions” on page 15: → added.
•
01 19990414
-
Preliminary specification; initial version.
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
18 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
19. Data sheet status
[1]
Datasheet status
Product status Definition
Development
Objective specification
This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
20. Definitions
21. Disclaimers
Short-form specification — The data in
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
a
short-form specification is
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
9397 750 06864
© Philips Electronics N.V. 2000 All rights reserved.
Product specification
Rev. 02 — 7 April 2000
19 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
Philips Semiconductors - a worldwide company
Argentina: see South America
Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399
New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811
Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474
Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Tel. +43 160 101, Fax. +43 160 101 1210
Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102
Canada: Tel. +1 800 234 7381
Romania: see Italy
Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700
Colombia: see South America
Czech Republic: see Austria
Slovenia: see Italy
Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044
Finland: Tel. +358 961 5800, Fax. +358 96 158 0920
France: Tel. +33 14 099 6161, Fax. +33 14 099 6427
Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300
Hungary: see Austria
South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107
Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745
Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730
Taiwan: Tel. +886 22 134 2865, Fax. +886 22 134 2874
Thailand: Tel. +66 27 45 4090, Fax. +66 23 98 0793
Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: Tel. +1 800 234 7381
India: Tel. +91 22 493 8541, Fax. +91 22 493 8722
Indonesia: see Singapore
Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200
Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007
Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057
Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415
Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880
Mexico: Tel. +9-5 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553
Middle East: see Italy
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA69)
9397 750 06864
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 02 — 7 April 2000
20 of 21
TDA8941P
1.5 W mono BTL audio amplifier
Philips Semiconductors
Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
8.1
8.2
Functional description . . . . . . . . . . . . . . . . . . . 3
Input configuration . . . . . . . . . . . . . . . . . . . . . . 3
Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 4
Output power measurement . . . . . . . . . . . . . . . 4
Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
Switch-on and switch-off. . . . . . . . . . . . . . . . . . 5
Supply Voltage Ripple Rejection (SVRR). . . . . 5
Built-in protection circuits . . . . . . . . . . . . . . . . . 6
Short-circuit protection . . . . . . . . . . . . . . . . . . . 6
Thermal shutdown protection . . . . . . . . . . . . . . 6
8.2.1
8.2.2
8.3
8.3.1
8.4
8.5
8.5.1
8.5.2
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
10
11
12
13
14
Application information. . . . . . . . . . . . . . . . . . 13
Printed-circuit board (PCB). . . . . . . . . . . . . . . 13
Layout and grounding. . . . . . . . . . . . . . . . . . . 13
Power supply decoupling . . . . . . . . . . . . . . . . 14
Thermal behaviour and Tamb(max) calculation . 15
14.1
14.1.1
14.1.2
14.2
15
15.1
15.2
Test information. . . . . . . . . . . . . . . . . . . . . . . . 15
Quality information . . . . . . . . . . . . . . . . . . . . . 15
Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15
16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
17
17.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . 17
Soldering by dipping or by solder wave . . . . . 17
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
17.2
17.3
17.4
18
19
20
21
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
© Philips Electronics N.V. 2000.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 7 April 2000
Document order number: 9397 750 06864
相关型号：
TDA8942P/N1,112
IC 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDIP16, 0.300 INCH, PLASTIC, SOT-38-1, MO-001, DIP-16, Audio/Video Amplifier
NXP
©2020 ICPDF网 联系我们和版权申明