TDA8945S [NXP]
15 W mono Bridge Tied Load BTL audio amplifier; 15瓦单声道桥接负载BTL音频放大器
| 型号： | TDA8945S |
| 厂家： | 
NXP |
| 描述： | 15 W mono Bridge Tied Load BTL audio amplifier |
| 文件： | 总21页 (文件大小：351K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TDA8945S
15 W mono Bridge Tied Load (BTL) audio amplifier
Rev. 02 — 7 April 2000
Product specification
1. General description
The TDA8945S is a single-channel audio power amplifier with an output power of
15 W at an 8 Ω load and an 18 V supply. The circuit contains a Bridge Tied Load
(BTL) amplifier with an all-NPN output stage and standby/mute logic. The TDA8945S
comes in a 9-lead single in-line (SIL) power package. The TDA8945S is
printed-circuit board (PCB) compatible with all other types in the TDA894x family.
One PCB footprint accommodates both the mono and the stereo products.
2. Features
■ Few external components
■ Fixed gain
■ Standby and mute mode
■ No on/off switching plops
■ Low standby current
■ High supply voltage ripple rejection
■ Outputs short-circuit protected to ground, supply and across the load
■ Thermally protected
c
c
■ Printed-circuit board compatible.
3. Applications
■ Mains fed applications (e.g. TV sound)
■ PC audio
■ Portable audio.
4. Quick reference data
Table 1: Quick reference data
Symbol Parameter
Conditions
Min
Typ
18
18
-
Max Unit
VCC
Iq
supply voltage
6
-
25
28
10
V
quiescent supply current VCC = 18 V; RL = ∞
mA
µA
Istb
standby supply current
-
TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
Table 1: Quick reference data…continued
Symbol Parameter
Conditions
Min
Typ
Max Unit
Po
output power
THD = 10%; RL = 8 Ω;
13
15
-
W
VCC = 18 V
THD
Gv
total harmonic distortion
voltage gain
Po = 1 W
-
0.03 0.1
%
31
50
32
65
33
-
dB
dB
SVRR
supply voltage ripple
rejection
5. Ordering information
Table 2: Ordering information
Type number Package
Name
Description
Version
SOT131-2
TDA8945S
SIL9P
plastic single in-line power package; 9 leads
6. Block diagram
V
d
CC
2
TDA8945S
1
OUT−
OUT+
5
4
IN−
IN+
3
V
CC
7
6
STANDBY/
MUTE LOGIC 20
MODE
SVR
kΩ
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
20
kΩ
8
GND
MBK938
Fig 1. Block diagram.
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Product specification
Rev. 02 — 7 April 2000
2 of 21
TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
7. Pinning information
7.1 Pinning
handbook, halfpage
OUT−
1
2
3
4
5
6
7
8
9
V
CC
OUT+
IN+
IN−
TDA8945S
SVR
MODE
GND
n.c.
MBK937
Fig 2. Pin configuration.
7.2 Pin description
Table 3: Pin description
Symbol
OUT−
VCC
Pin
1
Description
negative loudspeaker terminal
supply voltage
2
OUT+
IN+
3
positive loudspeaker terminal
positive input
4
IN−
5
negative input
SVR
6
half supply voltage decoupling (ripple rejection)
mode selection input (standby, mute, operating)
ground
MODE
GND
n.c.
7
8
9
not connected
8. Functional description
The TDA8945S is a mono BTL audio power amplifier capable of delivering 15 W
output power to an 8 Ω load at THD = 10%, using an 18 V power supply and an
external heatsink. The voltage gain is fixed at 32 dB.
With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’
and to ‘operating’ mode.
The TDA8945S outputs are protected by an internal thermal shutdown protection
mechanism and a short-circuit protection.
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
8.1 Input configuration
The TDA8945S inputs can be driven symmetrical (floating) as well as asymmetrical.
In the asymmetrical mode one input pin is connected via a capacitor to the signal
ground which should be as close as possible to the SVR (electrolytic) capacitor
ground. Note that the DC level of the input pins is half of the supply voltage VCC, so
coupling capacitors for both pins are necessary.
The input cut-off frequency is:
1
f i(cut – off )
=
(1)
(2)
----------------------------
2π(Ri × Ci)
For Ri = 45 kΩ and Ci = 220 nF:
1
f i(cut – off )
=
= 16 Hz
----------------------------------------------------------------
2π(45 × 103 × 220 × 10–9
)
As shown in Equation 1 and 2, large capacitor values for the inputs are not
necessary; so the switch-on delay during charging of the input capacitors, can be
minimized. This results in a good low frequency response and good switch-on
behaviour.
Remark: To prevent HF oscillations do not leave the inputs open, connect a capacitor
of at least 1.5 nF across the input pins close to the device.
8.2 Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output
stage, capable of delivering a peak output current of 2 A.
The BTL principle offers the following advantages:
Lower peak value of the supply current
•
•
•
•
The ripple frequency on the supply voltage is twice the signal frequency
No expensive DC-blocking capacitor
Good low frequency performance.
8.2.1 Output power measurement
The output power as a function of the supply voltage is measured on the output pins
at THD = 10%; see Figure 8. The maximum output power is limited by the maximum
supply voltage of 18 V and the maximum available output current: 2 A repetitive peak
current.
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Product specification
Rev. 02 — 7 April 2000
4 of 21
TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
8.2.2 Headroom
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom –
compared to the average power output – for transferring the loudest parts without
distortion. At VCC = 18 V, RL = 8 Ω and Po = 10 W at THD = 0.1% (see Figure 6), the
Average Listening Level (ALL) – music power – without any distortion yields:
Po(ALL) = 10 W/15.85 = 631 mW.
The power dissipation can be derived from Figure 11 on page 10 for 0 dB
respectively 12 dB headroom.
Table 4: Power rating as function of headroom
Headroom
0 dB
Power output (THD = 0.1%)
Po = 10 W
Power dissipation (P)
8.5 W
4 W
12 dB
Po(ALL) = 631 mW
For the average listening level a power dissipation of 4 W can be used for a heatsink
calculation.
8.3 Mode selection
The TDA8945S has three functional modes, which can be selected by applying the
proper DC voltage to pin MODE. See Figure 4 and 5 for the respective DC levels,
which depend on the supply voltage level. The MODE pin can be driven by a 3-state
logic output stage: e.g. a microcontroller with additional components for DC-level
shifting.
Standby — In this mode the current consumption is very low and the outputs are
floating. The device is in standby mode when (VCC − 0.5 V) < VMODE < VCC, or when
the MODE pin is left floating (high impedance). The power consumption of the
TDA8945S will be reduced to <0.18 mW.
Mute — In this mode the amplifier is DC-biased but not operational (no audio output);
the DC level of the input and output pins remain on half the supply voltage. This
allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to
be charged to avoid pop-noise. The device is in mute mode when
3 V < VMODE < (VCC − 1.5 V).
Operating — In this mode the amplifier is operating normally. The operating mode is
activated at VMODE < 0.5 V.
8.3.1 Switch-on and switch-off
To avoid audible plops during supply voltage switch-on or switch-off, the device is set
to standby mode before the supply voltage is applied (switch-on) or removed
(switch-off).
The switch-on and switch-off time can be influenced by an RC-circuit on the MODE
pin. Rapid on/off switching of the device or the MODE pin may cause ‘click- and
pop-noise’. This can be prevented by proper timing of the RC-circuit on the MODE
pin.
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Product specification
Rev. 02 — 7 April 2000
5 of 21
TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
8.4 Supply Voltage Ripple Rejection (SVRR)
The SVRR is measured with an electrolytic capacitor of 10 µF on pin SVR at a
bandwidth of 10 Hz to 80 kHz. Figure 12 on page 11 illustrates the SVRR as function
of the frequency. A larger capacitor value on the SVR pin improves the ripple rejection
behaviour at the lower frequencies.
8.5 Built-in protection circuits
The TDA8945S contains two types of protection circuits, i.e. short-circuit and thermal
shutdown.
8.5.1 Short-circuit protection
Short-circuit to ground or supply line — This is detected by a so-called ‘missing
current’ detection circuit which measures the current in the positive supply line and
the current in the ground line. A difference between both currents larger than 0.7 A,
switches the power stage to standby mode (high impedance).
Short-circuit across the load — This is detected by an absolute-current
measurement. An absolute-current larger than 3 A, switches the power stage to
standby mode (high impedance).
8.5.2 Thermal shutdown protection
The junction temperature is measured by a temperature sensor; at a junction
temperature of approximately 150 °C this detection circuit switches the power stage
to standby mode (high impedance).
9. Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
no signal
Min
−0.3
−0.3
−0.3
-
Max
+25
+18
Unit
V
VCC
supply voltage
operating
V
VI
input voltage
VCC + 0.3 V
IORM
Tstg
repetitive peak output current
storage temperature
2
A
non-operating
−55
−40
-
+150
+70
14
°C
°C
W
V
Tcase
Ptot
operating case temperature
total power dissipation
VCC(sc)
supply voltage to guarantee
short-circuit protection
-
18
10. Thermal characteristics
Table 6: Thermal characteristics
Symbol Parameter
Conditions
Value Unit
Rth(j-mb) thermal resistance from junction to mounting base in free air
9
K/W
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
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11. Static characteristics
Table 7: Static characteristics
VCC = 18 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; Vi = 0 V; measured in test circuit Figure 13; unless otherwise specified.
Symbol
VCC
Iq
Parameter
Conditions
operating
RL = ∞
Min
Typ
Max
25
Unit
V
supply voltage
6
-
18
18
-
[1]
[2]
quiescent supply current
standby supply current
DC output voltage
28
mA
µA
V
Istb
VMODE = VCC
-
10
VO
-
9
-
-
[3]
∆VOUT
differential output voltage offset
mode selection input voltage
-
200
0.5
mV
V
VMODE
operating mode
mute mode
0
3
-
-
VCC − 1.5
V
standby mode
0 < VMODE < VCC
V
CC − 0.5
-
VCC
20
V
IMODE
mode selection input current
-
-
µA
[1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential
output voltage offset (∆VOUT) divided by the load resistance (RL).
[2] The DC output voltage with respect to ground is approximately 0.5VCC
.
[3] ∆VOUT = | VOUT+ − VOUT− |.
MGU053
MGU052
24
30
handbook, halfpage
I
handbook, halfpage
I
q
q
(mA)
(mA)
20
16
12
8
25
V
= 18 V
12 V
CC
20
15
10
5
4
0
0
0
0
4
8
12
16
V
20
(V)
4
8
12
16
V
20
(V)
MODE
CC
Fig 3. Quiescent supply current as function of supply
voltage.
Fig 4. Quiescent supply current as function of mode
voltage.
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
12. Dynamic characteristics
Table 8: Dynamic characteristics
VCC = 18 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE = 0 V; measured in test circuit Figure 13; unless otherwise specified.
Symbol
Parameter
Conditions
THD = 10%
THD = 0.5%
Po = 1 W
Min
13
10
-
Typ
15
Max
-
Unit
W
Po
output power
11.5
0.03
32
-
W
THD
Gv
total harmonic distortion
voltage gain
0.1
33
110
120
-
%
31
70
-
dB
kΩ
µV
dB
dB
Zi(dif)
Vn(o)
SVRR
differential input impedance
noise output voltage
90
[1]
[2]
[2]
90
supply voltage ripple rejection
fripple = 1 kHz
50
-
65
fripple = 100 Hz
to 20 kHz
60
-
[3]
Vo(mute)
output voltage
mute mode
-
-
50
µV
[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance
RS = 0 Ω at the input.
[2] Supply voltage ripple rejection is measured at the output, with a source impedance RS = 0 Ω at the input. The ripple voltage is a sine
wave with a frequency fripple and an amplitude of 700 mV (RMS), which is applied to the positive supply rail.
[3] Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.
MGU055
10
V
o
(V)
1
−1
10
−2
10
−3
10
−4
10
V
= 18 V
12 V
CC
−5
−6
10
10
0
4
8
12
16
20
V
(V)
MODE
Fig 5. Output voltage as function of mode voltage.
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
MGU050
2
10
handbook, halfpage
THD
(%)
10
1
18 V
V
= 12 V
CC
−1
10
−2
10
−2
−1
2
10
10
1
10
10
P
(W)
o
Fig 6. Total harmonic distortion as function of output power.
MGU051
10
THD
(%)
1
V
= 12 V
= 18 V
CC
P
P
= 0.1 W
= 1 W
o
V
CC
V
V
= 12 V
= 18 V
CC
CC
o
−1
10
−2
10
2
3
4
5
6
10
10
10
10
10
10
f (Hz)
No bandpass filter applied.
Fig 7. Total harmonic distortion as function of frequency.
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
MGU056
MGU057
20
10
handbook, halfpage
handbook, halfpage
P
P
o
tot
(W)
16
(W)
8
R
= 8 Ω
16 Ω
L
12
6
4
2
R
= 8 Ω
16 Ω
L
8
4
0
0
0
0
4
8
12
16
V
20
(V)
5
10
15
20
V
(V)
CC
CC
THD = 10%.
Fig 8. Output power as function of supply voltage.
Fig 9. Total power dissipation as function of supply
voltage.
MGU059
MGU058
100
12
handbook, halfpage
P
handbookη, halfpage
(W)
(%)
10
80
R
= 8 Ω
L
8
6
4
R
= 16 Ω
8 Ω
L
60
40
16 Ω
20
0
2
0
0
5
10
15
0
5
10
15
P
(W)
P
(W)
o
o
VCC = 18 V.
VCC = 18 V.
Fig 10. Efficiency as function of output power.
Fig 11. Power dissipation as function of output power.
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Product specification
Rev. 02 — 7 April 2000
10 of 21
TDA8945S
15 W mono BTL audio amplifier
Philips Semiconductors
MGU054
0
SVRR
(dB)
−20
B
−40
−60
A
−80
2
3
4
5
10
10
10
10
10
f (Hz)
VCC = 18 V; RS = 0 Ω; Vripple = 707 mV (RMS); no bandpass filter applied.
Curve A: inputs short-circuited
Curve B: inputs short-circuited and connected to ground (asymmetrical application)
Fig 12. Supply voltage ripple rejection as function of frequency.
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
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13. Internal circuitry
Table 9: Internal circuitry
Pin
Symbol
Equivalent circuit
4 and 5
IN+ and IN−
V
CC
V
V
CC
CC
1.5 kΩ
45 kΩ
1.5 kΩ
45 kΩ
4
5
1/2 V
CC
(SVR)
MGU078
1 and 3
OUT− and OUT+
100 Ω
1, 3
40 Ω
1/2 V
CC
MGU080
7
MODE
V
CC
V
CC
1 kΩ
1 kΩ
20 kΩ
V
CC
7
OFF
MUTE
HIGH
HIGH
MGU079
6
SVR
V
CC
Standby
20 kΩ
20 kΩ
6
MGU081
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
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14. Application information
+V
CC
1000 µF
100 nF
220 nF
R
s
2
Symmetrical
input
30 kΩ
C
i
IN−
5
4
−
+
1
3
OUT−
R
220 nF
220 nF
i
45 kΩ
1/2 V
−
+
R
s
1.5
nF
+
R
L
8 Ω
CC
−
1/2 V
CC
R
Asymmetrical
input
i
+
−
C
i
OUT+
45 kΩ
IN+
220 nF
signal
GND
30 kΩ
V
TDA8945S
CC
V
CC
R
MODE
SVR
STANDBY/
MUTE LOGIC
7
6
20 kΩ
R
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
C1
1/2 V
CC
MICROCONTROLLER
C2
signal
GND
10
µF
20 kΩ
C1 C2
MODE
8
Standby
Mute
On
0
0
1
0
1
0
GND
MGU048
Fig 13. Application diagram.
14.1 Printed-circuit board (PCB)
14.1.1 Layout and grounding
For a high system performance level certain grounding techniques are essential.
The input reference grounds have to be tied with their respective source grounds and
must have separate tracks from the power ground tracks; this will prevent the large
(output) signal currents from interfering with the small AC input signals.
The small-signal ground tracks should be physically located as far as possible from
the power ground tracks. Supply and output tracks should be as wide as possible for
delivering maximum output power.
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
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54 mm
i
56 mm
ON
MUTE
+
−
10 µF
9
IN−
IN+
220 nF
1.5 nF
220 nF
V
CC
1
OUT−
100 nF
1000 µF
GND
OUT+
MGU049
Fig 14. Printed-circuit board layout (single-sided); components view.
14.1.2 Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor locations should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR – typical 100 nF – has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor – e.g. 1000 µF or greater – must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
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Product specification
Rev. 02 — 7 April 2000
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TDA8945S
15 W mono BTL audio amplifier
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14.2 Thermal behaviour and heatsink calculation
The measured maximum thermal resistance of the IC package, Rth(j-mb) is 9 K/W.
A calculation for the heatsink can be made, with the following parameters:
Tamb(max) = 50 °C
VCC = 18 V and RL = 8 Ω
Tj(max) = 150 °C.
Rth(tot) is the total thermal resistance between the junction and the ambient
including the heatsink. In the heatsink calculations the value of Rth(mb-h) is ignored.
At VCC = 18 V and RL = 8 Ω the measured worst-case sine-wave dissipation is 8.5 W;
see Figure 11. For Tj(max) = 150 °C the temperature raise – caused by the power
dissipation – is: 150 − 50 = 100 °C.
P × Rth(tot) = 100 °C
Rth(tot) = 100/8.5 = 11.8 K/W
Rth(h-a) = Rth(tot) − Rth(j-mb) = 11.8 − 9 = 2.8 K/W.
The calculation above is for an application at worst-case sine-wave output signals. In
practice music signals will be applied, which decreases the maximum power
dissipation to approximately half of the sine-wave power dissipation (see
Section 8.2.2). This allows for the use of a smaller heatsink:
P × Rth(tot) = 100 °C
Rth(tot) = 100/4 = 25 K/W
Rth(h-a) = Rth(tot) − Rth(j-mb) = 25 − 9 = 16 K/W.
To increase the lifetime of the IC, Tj(max) should be reduced to 125 °C. This requires a
heatsink of approximately 10 K/W for music signals.
15. Test information
15.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611D is
applicable.
15.2 Test conditions
Tamb = 25 °C; VCC = 18 V; f = 1 kHz; RL = 8 Ω; audio pass band 22 Hz to 22 kHz;
unless otherwise specified.
Remark: In the graphs as function of frequency no bandpass filter was applied;
see Figure 7 and 12.
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Product specification
Rev. 02 — 7 April 2000
15 of 21
TDA8945S
15 W mono BTL audio amplifier
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16. Package outline
SIL9P: plastic single in-line power package; 9 leads
SOT131-2
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
E
j
A
1
b
L
c
1
9
e
Q
w
M
Z
b
p
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
b
max.
1
(1)
(1)
(1)
UNIT
A
b
c
D
d
D
E
e
E
h
j
L
Q
w
x
Z
2
p
h
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
12.2
11.8
3.4
3.1
17.2
16.5
2.00
1.45
2.1
1.8
6
mm
10
2.54
2.0
1.1
0.25
0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-03-11
99-12-17
SOT131-2
Fig 15. SIL9P package outline.
9397 750 06866
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Product specification
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15 W mono BTL audio amplifier
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17. Soldering
17.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
17.4 Package related soldering information
Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package
Soldering method
Dipping
Wave
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable[1]
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
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Product specification
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15 W mono BTL audio amplifier
Philips Semiconductors
18. Revision history
Table 11: Revision history
Rev Date
CPCN Description
02 20000407
-
Product specification; second version; supersedes initial version TDA8945S-01 of
14 April 1999 (9397 750 04878). Modifications:
Table 1 on page 1: SVRR: Typ value 65 dB → added
•
Ordering options removed
•
Section 8 “Functional description”:
•
– Section 8.1 “Input configuration” on page 4 → added.
– Section 8.2 “Power amplifier” on page 4: ........, capable of delivering a peak output
current of 1.5 A → changed to 2 A.
– Section 8.2.1 “Output power measurement” on page 4 → added
– Section 8.2.2 “Headroom” on page 5 → added
Section 8.3 “Mode selection”:
•
– Standby mode: VMODE > (VCC − 0.5 V) → changed to (VCC − 0.5 V) < VMODE < VCC; The
power consumption of the TDA8945S will be reduced to <0.18 mW → added.
– Mute mode: the DC level of the input and output pins remain on half the supply
voltage → added;
– 2.5 V < VMODE < (VCC − 1.5 V) → changed to 3 V < VMODE < (VCC − 1.5 V)
– Section 8.3.1 “Switch-on and switch-off” on page 5 → added.
Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 6 → added
•
Section 8.5 “Built-in protection circuits” on page 6 → added
•
Table 5 on page 6:
•
– Ptot value added 14 W
– VCC(sc) value added 18 V
Table 6 on page 6: Rth(j-a) removed; Rth(j-c) value 10 K/W changed to → Rth(j-mb) value 9 K/W
•
Table 7 on page 7: VMODE – mute mode – value Min 2.5 → changed to 3 V
•
Table 8 on page 8:
•
– SVRR; Typ values 65 and 60 dB → added
– Rsource changed to → RS in table and associated table notes
– Table note [2]: .... 100 mV (RMS).... changed to → ... 700 mV (RMS)....
Figure 3 to 12: figures added
•
Section 13 “Internal circuitry” on page 12: → added
•
Figure 14: figure modified
•
Section 14.1 “Printed-circuit board (PCB)” on page 13: → added
•
Figure 14: figure added
•
Section 14.2 “Thermal behaviour and heatsink calculation” on page 15: → added
•
Section 15 “Test information” on page 15: Section 15.1 → updated
•
Section 15.2 “Test conditions” on page 15: → added.
•
01 19990414
-
Preliminary specification; initial version.
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Product specification
Rev. 02 — 7 April 2000
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Philips Semiconductors
19. Data sheet status
[1]
Datasheet status
Product status Definition
Development
Objective specification
This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
20. Definitions
21. Disclaimers
Short-form specification — The data in
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
a
short-form specification is
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
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Rev. 02 — 7 April 2000
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15 W mono BTL audio amplifier
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For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA69)
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Product specification
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Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
8.1
8.2
Functional description . . . . . . . . . . . . . . . . . . . 3
Input configuration . . . . . . . . . . . . . . . . . . . . . . 4
Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 4
Output power measurement . . . . . . . . . . . . . . . 4
Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
Switch-on and switch-off. . . . . . . . . . . . . . . . . . 5
Supply Voltage Ripple Rejection (SVRR). . . . . 6
Built-in protection circuits . . . . . . . . . . . . . . . . . 6
Short-circuit protection . . . . . . . . . . . . . . . . . . . 6
Thermal shutdown protection . . . . . . . . . . . . . . 6
8.2.1
8.2.2
8.3
8.3.1
8.4
8.5
8.5.1
8.5.2
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
10
11
12
13
14
Application information. . . . . . . . . . . . . . . . . . 13
Printed-circuit board (PCB). . . . . . . . . . . . . . . 13
Layout and grounding. . . . . . . . . . . . . . . . . . . 13
Power supply decoupling . . . . . . . . . . . . . . . . 14
Thermal behaviour and heatsink calculation . 15
14.1
14.1.1
14.1.2
14.2
15
15.1
15.2
Test information. . . . . . . . . . . . . . . . . . . . . . . . 15
Quality information . . . . . . . . . . . . . . . . . . . . . 15
Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15
16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
17
17.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . 17
Soldering by dipping or by solder wave . . . . . 17
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
17.2
17.3
17.4
18
19
20
21
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
© Philips Electronics N.V. 2000.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 7 April 2000
Document order number: 9397 750 06866
相关型号：
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