TDA9880 [NXP]
Alignment-free multistandard vision and FM sound IF-PLL demodulator; 对齐无多标准视力和调频伴音中频锁相环解调器
| 型号： | TDA9880 |
| 厂家： | 
NXP |
| 描述： | Alignment-free multistandard vision and FM sound IF-PLL demodulator |
| 文件： | 总40页 (文件大小：198K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA9880
Alignment-free multistandard vision
and FM sound IF-PLL demodulator
Product specification
1999 Jul 21
Supersedes data of 1998 Aug 12
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
FEATURES
• Precise fully digital Automatic Frequency Control (AFC)
detector with 4-bit digital-to-analog converter
• 5 V supply voltage
• Fully integrated sound carrier trap for 4.5, 5.5,
6.0 and 6.5 MHz, controlled by reference signal
• Gain controlled wide-band Vision Intermediate
Frequency (VIF) amplifier (AC-coupled)
• Alignment-free selective FM-PLL demodulator with high
linearity and low noise
• True synchronous demodulation with active carrier
regeneration (very linear demodulation, good
intermodulation figures, reduced harmonics and
excellent pulse response)
• Digital frequency control, sound carrier frequencies
4.5, 5.5, 6.0 and 6.5 MHz
• Stabilizer circuit for ripple rejection and to achieve
constant output signals
• Fully integrated VIF Voltage Controlled Oscillator
(VCO), alignment-free
• Electrostatic discharge (ESD) protection for all pins.
• Digital acquisition help, VIF frequencies of 38.0, 38.9,
45.75 and 58.75 MHz
• 4 MHz reference frequency input [signal from
Phase-Locked Loop (PLL) tuning system] or operating
as crystal oscillator
GENERAL DESCRIPTION
The TDA9880(T) is an integrated circuit for multistandard
vision IF signal processing and FM demodulation in TV
and VTR sets.
• VIF Automatic Gain Control (AGC) detector for gain
control, operating as peak sync detector, fast reaction
time
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TDA9880
SDIP20
SO20
plastic shrink dual in-line package; 20 leads (300 mil)
SOT325-1
SOT163-1
TDA9880T
plastic small outline package; 20 leads; body width 7.5 mm
1999 Jul 21
2
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
QUICK REFERENCE DATA
SYMBOL
VP
IP
PARAMETER
supply voltage
supply current
CONDITIONS
MIN.
4.5
TYP. MAX. UNIT
note 1
5
5.5
V
85
100
50
115
100
mA
µV
Vi(sens)(VIF)(rms) VIF input voltage sensitivity
(RMS value)
−1 dB video at output
−
GVIF(cr)
fVIF
VIF gain control range
VIF frequencies
see Fig.4
65
−
69
−
−
−
−
−
−
dB
see Table 2
38.0
38.9
45.75
58.75
±2.38
MHz
MHz
MHz
MHz
MHz
−
−
−
∆fVIF
VIF frequency window of digital
acquisition help
referenced to fVIF
−
Vo(v)(p-p)
video output signal voltage
(peak-to-peak value)
sound carrier off; see Fig.10 1.7
2.0
2.3
V
V
trap bypass mode;
see Fig.10
0.95
1.10
1.25
Gdif
differential gain
“NTC-7 Composite”
“NTC-7 Composite”
−
−
2
2
5
4
%
ϕdif
differential phase
deg
Bv(−3dB)(trap)
−3 dB video bandwidth including
CL < 20 pF; RL > 1 kΩ;
sound carrier trap
AC load; note 2
f
trap = 4.5 MHz
(M/N standard)
trap = 5.5 MHz
(B/G standard)
3.95
4.90
4.05
5.00
−
−
MHz
MHz
f
αSC1
trap attenuation at first sound carrier M/N standard
B/G standard
30
30
56
36
36
60
−
−
−
dB
dB
dB
S/NW
weighted signal-to-noise ratio of
video signal
see Fig.6; note 3
PSRR13
Bv(−1dB)
Ich(max)(20)
Idch(max)(20)
Isink(14)
power supply ripple rejection at
pin 13
fripple = 70 Hz; video signal; 25
grey level; see Fig.9
28
6
−
dB
−1 dB video bandwidth
CL < 20 pF; RL > 1 kΩ;
5
−
MHz
µA
AC load; trap bypass mode
AGC maximum charge current at
pin 20
6
8
10
12.5
750
AGC maximum discharge current at
pin 20
7.5
450
10
600
µA
sink current of tuner AGC at pin 14
maximum tuner gain
reduction; V14 = 1 V;
see Fig.4
µA
AFCstps
AFC steepness ∆I19/∆f
0.85
160
160
−
1.05
200
200
49
1.25
240
240
−
µA/kHz
µA
Io(source)(19)
Io(sink)(19)
Vo(intc)(rms)
AFC output source current at pin 19
AFC output sink current at pin 19
µA
intercarrier output voltage
(RMS value)
mV
Vi(SC)
= –24 dB ; note 4
-------------
Vi(PC)
1999 Jul 21
3
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
PARAMETER
CONDITIONS
MIN.
7.5
TYP. MAX. UNIT
Bintc(−3dB)(ul)
upper limit −3 dB intercarrier
9
−
MHz
bandwidth
Vo(AF)(8)(rms)
audio output signal voltage at pin 8 25 kHz FM deviation;
400
500
600
mV
(RMS value)
75 µs de-emphasis
THD8
total harmonic distortion at pin 8
−3 dB audio frequency bandwidth
−
0.15
120
0.5
%
BAF(−3dB)
without de-emphasis;
dependent on loop filter at
pin 4
100
−
kHz
S/NW(AF)
weighted signal-to-noise ratio of
audio signal
black picture
white picture
50
45
40
56
51
46
−
−
−
dB
dB
dB
6 kHz sine wave
(black-to-white modulation)
sound carrier
subharmonics;
f = 2.25 MHz ±3 kHz
35
40
40
46
−
−
dB
dB
αAM(sup)
AM suppression of FM demodulator 75 µs de-emphasis;
AM: f = 1 kHz; m = 0.3
referenced to 25 kHz
FM deviation
PSRR8
power supply ripple rejection at pin 8 fripple = 70 Hz; see Fig.9
14
20
−
−
dB
∆fFM
frequency window of digital
−
±225
kHz
acquisition help for FM demodulator
fref(15)
frequency of reference signal at
pin 15
−
4.0
−
MHz
mV
Vref(15)(rms)
amplitude of reference signal source operation as input terminal 80
at pin 15 (RMS value)
−
400
Notes
1. Values of video and sound parameters can be decreased at VP = 4.5 V.
2. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps
(see Figs 13 to 18); H (s) is the absolute value of transfer function.
3. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13). B = 4.2 MHz
(M/N standard) or B = 5.0 MHz (B/G, I and D/K standard) weighted in accordance with “CCIR 567”.
4. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal
video signal with 1.1 V (p-p) as a reference:
V
i(SC)(dB) + 6 dB ±3 dB
---------------
Vi(PC)
---------------------------------------------------------------
1
20
Vo(intc)(rms) = 1.1 V (p-p) ×
× 10
----------
2 2
where:
1
V
= correction term for RMS value, i(SC)(dB) = sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB,
----------
---------------
Vi(PC)
2 2
6 dB = correction term of internal circuitry and ±3 dB = tolerance of video output and intercarrier output amplitude
Vo(intc)(rms)
.
1999 Jul 21
4
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g
trap disable
switch
external reference
or 4 MHz crystal
C
TR
R
TOP
C
VAGC
TAGC
14
TOP
3
VAGC
20
REF
15
AFC
TR
12
19
AGC
DIGITAL VCO CONTROL
AFC DETECTOR
RC VCO
VIF-PLL
1
2
VIF1
VIF2
SOUND TRAPS
4.5 to 6.5 MHz
CVBS
AUD
13
video output 2 V (p-p)
[1.1 V (p-p) without trap]
TDA9880
8
audio output
LOGIC
NARROW-BAND FM-PLL DETECTOR
SUPPLY
10
S1
7
4
5
6
17
V
16
18
11
9
GND
VPLL SIO
S0
FAGC
FMPLL
DEEM
AFD
P
sound
intercarrier
output
C
C
C
FAGC
AFD
DEEM
VIF-PLL
filter
FM-PLL de-emphasis decoupling
filter
MHB506
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
PINNING
SYMBOL PIN
DESCRIPTION
VIF differential input 1
SYMBOL PIN
DESCRIPTION
VIF1
VIF2
TOP
FMPLL
DEEM
AFD
FAGC
AUD
S0
1
2
SIO
11
12
13
14
15
16
17
18
19
20
sound intercarrier output
trap control
VIF differential input 2
tuner AGC TakeOver Point (TOP)
FM-PLL filter
TR
3
CVBS
TAGC
REF
GND
VP
video output
4
tuner AGC output
4 MHz crystal or reference input
ground supply
5
de-emphasis capacitor
AF decoupling capacitor
FM-PLL AGC capacitor
audio output
6
7
supply voltage (+5 V)
VIF-PLL filter
8
VPLL
AFC
VAGC
9
switch input S0
AFC output
S1
10
switch input S1
VIF-AGC capacitor
handbook, halfpage
handbook, halfpage
VIF1
20 VAGC
19
VIF1
20 VAGC
19
1
2
1
2
VIF2
TOP
AFC
18 VPLL
VIF2
TOP
AFC
18 VPLL
3
3
V
V
P
17
17
FMPLL
DEEM
AFD
FMPLL
DEEM
AFD
4
4
P
16 GND
15 REF
16 GND
15 REF
5
5
TDA9880
TDA9880T
6
6
FAGC
AUD
S0
TAGC
FAGC
AUD
S0
TAGC
7
14
13 CVBS
TR
7
14
13 CVBS
TR
8
8
9
12
11 SIO
9
12
11 SIO
S1
S1
10
10
MHB072
MHB106
Fig.2 Pin configuration for SDIP20.
Fig.3 Pin configuration for SO20.
1999 Jul 21
6
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
FUNCTIONAL DESCRIPTION
After frequency lock-in the phase detector produces a DC
current proportional to the phase difference between the
VCO and the input signal. The DC current of either the
frequency detector or the phase detector is converted into
a DC voltage via the VIF-PLL filter, which controls the VCO
frequency.
Figure 1 shows the simplified block diagram of the
integrated circuit. The integrated circuit comprises the
following functional blocks:
1. VIF amplifier
2. Tuner-AGC and VIF-AGC
3. VIF-AGC detector
VCO and Travelling Wave Divider (TWD)
The Resistor Capacitor (RC) VCO operates as an
integrated relaxation oscillator at double the picture carrier
frequency. The control voltage required to tune the VCO to
actually double the picture carrier frequency is generated
by the FPLL detector and fed via the loop filter to the VCO
control input terminal.
4. Frequency Phase-Locked Loop (FPLL) detector
5. VCO and Travelling Wave Divider (TWD)
6. Digital acquisition help and AFC
7. Video demodulator and amplifier
8. Sound carrier trap
The oscillator signal is divided-by-two with a TWD which
generates two differential output signals with a 90 degrees
phase difference independent of the frequency.
9. Intercarrier mixer
10. FM demodulator and acquisition help
11. Audio amplifier
Digital acquisition help and AFC
12. Internal voltage stabilizer.
The integrated relaxation oscillator has a very wide
frequency range from approximately 30 to 70 MHz (after
the TWD). To prevent false locking of the FPLL and with
respect to the catching range of the frequency detector of
maximum ±2.5 MHz, the Digital Acquisition Help (DAH)
provides current into the loop filter until the VCO is in a
frequency window of ±2.3 MHz around the wanted VIF
frequency. In this case the analog operating FPLL will lock
the VCO to the VIF carrier and the acquisition help does
not provide any current to the loop filter.
VIF amplifier
The VIF amplifier consists of three AC-coupled differential
amplifier stages. Each differential stage comprises a
feedback network controlled by emitter degeneration.
Tuner-AGC and VIF-AGC
The AGC capacitor voltage is converted to an internal VIF
gain control signal, and is fed to the tuner AGC to generate
the tuner AGC output current at pin TAGC (open-collector
output). The tuner AGC takeover point can be adjusted
with RTOP. This allows the tuner to be matched to the SAW
filter in order to achieve the optimum IF input level.
The principle of the digital acquisition help is as follows:
the VCO is connected to a downcounter, which is preset
depending on the required VIF frequency. The counting
time, as well as the counter control, is derived from a
4 MHz reference signal. This signal can be supplied from
the internal 4 MHz crystal oscillator or from the 4 MHz
reference oscillator of an external tuning system.
The counting result after a counting cycle corresponds to
the actual VCO frequency.
VIF-AGC detector
The AGC detector generates the required VIF gain control
voltage for constant video output by charging or
discharging the AGC capacitor. Gain control is performed
by sync level detection. The newly developed AGC circuit
provides fast reaction time to cope with ‘aeroplane
fluttering’. The time constants for decreasing or increasing
gain are nearly equal.
The digital AFC is also derived from the counting result
after a counting cycle by digital-to-analog converting the
last four bits of the counter.
Video demodulator and amplifier
Frequency Phase-Locked Loop (FPLL) detector
The video demodulator is realized by a multiplier which is
designed for low distortion and large bandwidth. The vision
IF input signal is multiplied with the ‘in phase’ signal of the
travelling wave divider output.
The VIF amplifier output signal is fed into a Frequency
Detector (FD) and into a Phase Detector (PD) via a limiting
amplifier. During acquisition the frequency detector
produces a DC current proportional to the frequency
difference between the input and the VCO signal.
1999 Jul 21
7
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
The demodulator output signal is fed via an integrated
low-pass filter for attenuation of the carrier harmonics to
the video amplifier. The video amplifier is realized by an
operational amplifier with internal feedback and high
bandwidth. A low-pass filter is integrated to achieve an
attenuation of the carrier harmonics. The video signal of
1.1 V (p-p) for nominal vision IF modulation is fed
internally to the integrated sound carrier trap as well as to
the VIF-AGC detector. The second stage of the video
amplifier converts and amplifies the differential output
signal from the sound carrier trap to the single-ended
CVBS output signal at pin 13 with a 2 V (p-p) amplitude.
FM demodulator and acquisition help
The FM demodulator is realized as a narrow-band PLL
with external loop filter, which provides the necessary
selectivity. To achieve good selectivity, a linear phase
detector and constant input level are required.
The intercarrier signal from the intercarrier mixer is fed via
a gain controlled amplifier to the phase detector and it’s
output signal controls (via the loop filter) the integrated
relaxation oscillator. The possible frequency range is from
4 to 7 MHz. As a result of locking the oscillator frequency
tracks with the FM modulation of the input signal;
therefore, the oscillator control voltage is superimposed by
the AF voltage. In this way the FM-PLL operates as an
FM demodulator. The AF voltage is present at the loop
filter and is fed via a buffer with 0 dB gain to the audio
amplifier.
Noise clipping is provided. Furthermore the trap can be
bypassed by the implemented input switch of the second
amplifier stage, forced by connecting pin 12 to ground.
Sound carrier trap
The digital acquisition help operates in the same way as
described in Section “Digital acquisition help and AFC”.
The sound carrier trap consists of a reference filter, a
phase detector and the sound trap itself.
Audio amplifier
A sound carrier reference signal is fed into the reference
low-pass filter and is shifted by a nominal 90 degrees.
The phase detector compares the original reference signal
with the signal shifted by the reference filter and produces,
at the external capacitor CTR, a DC voltage by charging or
discharging the capacitor with a current proportional to the
phase difference between both signals, respectively to the
frequency error of the integrated filters. The DC voltage is
converted to currents which control the frequency position
of the reference filter and the sound trap.
The audio amplifier consists of two parts:
1. The AF preamplifier is an operational amplifier with
internal feedback, high gain and high common mode
rejection. The AF voltage from the PLL demodulator,
by principle a small output signal, is amplified by
30 dB. A DC operating point control circuit (pin 6)
decouples the AF amplifier from the DC voltage of the
PLL. The low-pass characteristic of the amplifier
reduces the harmonics of the intercarrier signal at the
sound output terminal. If required, a de-emphasis
network can be realized by the amplifier output
resistance and an external capacitor.
The sound trap itself is constructed of three separate traps
to realize sufficient suppression of the first and second
sound carrier. The right frequency position of the different
standards is set by the sound carrier reference signal.
2. The AF output amplifier (10 dB) provides the required
output level by a rail-to-rail output stage. This amplifier
makes use of an input selector for switching to mute
state, automatically controlled by the mute switching
voltage from the digital acquisition help in order to
avoid lock-in noise. During normal operation the
automatic audio mute function is not active.
Intercarrier mixer
The intercarrier mixer is realized by a multiplier, operating
in quadrature mode for suppression of low frequency video
signals. The VIF amplifier output signal is fed to the
intercarrier mixer and converted to an intercarrier
frequency by the regenerated 90 degree picture carrier
from the VCO. The mixer output signal is fed via a
band-pass filter and amplifier for attenuation of the high
frequency video signal components and carrier harmonics
to the output pin 11. The intercarrier signal is fed also to
the integrated FM demodulator.
Application of a 2.2 kΩ resistor between the
intercarrier output (pin 11) and ground will activate the
automatic audio mute function.
Internal voltage stabilizer
The band gap circuit internally generates a voltage of
approximately 2.4 V, independent of the supply voltage
and the temperature. A voltage regulator circuit, controlled
by this voltage, produces a constant voltage of 3.55 V
which is used as an internal reference voltage.
1999 Jul 21
8
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
5.5
UNIT
VP
IP = 115 mA; Tamb = 70 °C; at
−
V
maximum chip temperature of 125 °C
Vn
voltage at
pins 1 to 4, 6 to 10, 12 and 17 to 20
pin 14
0
0
−
VP
V
13.2
10
V
tsc
short-circuit time to ground or VP
storage temperature
ambient temperature
s
Tstg
Tamb
Ves
−25
+150
+70
+250
°C
°C
V
−20
electrostatic handling voltage for all
pins
note 1
note 2
−250
−3000 +3000
V
Notes
1. Charge device model class A; machine model: discharging a 200 pF capacitor via a 0.75 µH inductance.
2. Charge device model class B; human body model: discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient in free air
TDA9880 (SDIP20)
85
85
K/W
K/W
TDA9880T (SO20)
1999 Jul 21
9
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
CHARACTERISTICS
VP = 5 V; Tamb = 25 °C; see Table 2 for input frequencies; M standard (fPC = 45.75 MHz; fSC = 41.25 MHz;
PC/SC = 10 dB) is used for specification; Vi(VIF)(rms) = 10 mV (sync level); IF input from 50 Ω via broadband transformer
1 : 1; DSB video modulation; 10% residual carrier; video signal in accordance with “NTC-7 Composite”; measurements
taken in test circuit of Fig.19; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin 17)
VP
IP
supply voltage
note 1
4.5
5
5.5
V
supply current
85
100
500
115
633
mA
Ptot
total power dissipation
−
mW
VIF amplifier (pins 1 and 2)
Vi(sens)(VIF)(rms) VIF input voltage sensitivity
(RMS value)
−1 dB video at output
−
50
−
100
−
µV
mV
dB
Vi(max)(rms)
maximum input signal voltage 1 dB video at output;
(RMS value) note 2
internal IF amplitude difference within AGC range;
110
−
∆Vint
0.7
1
between picture and sound
carrier
∆f = 4.5 MHz
GVIF(cr)
VIF gain control range
see Fig.4
65
69
15
−
dB
BVIF(−3dB)(ll)
lower limit −3 dB VIF
−
25
MHz
bandwidth
BVIF(−3dB)(ul)
upper limit −3 dB VIF
70
100
−
MHz
bandwidth
Ri(dif)
Ci(dif)
VI
differential input resistance
differential input capacitance
DC input voltage
note 3
note 3
1.7
1.2
−
2.2
2.7
2.5
−
kΩ
pF
V
1.7
3.35
FPLL and true synchronous video demodulator; note 4
fVCO(max)
maximum oscillator frequency f = 2fPC
for carrier regeneration
120
140
−
MHz
fVIF
vision carrier operating
frequencies
see Table 2
−
−
−
−
−
38.0
−
−
−
−
−
MHz
MHz
MHz
MHz
MHz
38.9
45.75
58.75
±2.38
∆fVIF
VIF frequency window of digital referenced to fVIF
acquisition help
tacq
acquisition time
BL = 70 kHz; note 5
−
−
30
ms
Vi(sens)(VIF)(rms) VIF input voltage sensitivity at
pins 1 and 2 (RMS value)
for PLL to be locked
for C/N = 10 dB
maximum IF gain
notes 6 and 7
−
−
30
70
µV
µV
100
140
SIGNAL AT PIN 18
Io(source)(PD)(max) maximum source current of
phase detector output
−
17
−
µA
1999 Jul 21
10
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
17
MAX.
UNIT
µA
Io(sink)(PD)(max)
maximum sink current of
phase detector output
−
−
−
−
−
−
−
−
Io(source)(DAH)
Io(sink)(DAH)
tW(min)(DAH)
output source current of digital
acquisition help
23
23
64
µA
µA
µs
output sink current of digital
acquisition help
minimum pulse width of digital
acquisition help current
KO(VIF)
KD(VIF)
VCO steepness ∆fVIF/∆V18
−
−
20
23
−
−
MHz/V
phase detector steepness
µA/rad
∆I18/∆ϕVIF
Video output signal and sound carrier trap (pin 13; sound carrier off)
Vo(v)(p-p)
video output signal voltage
(peak-to-peak value)
see Fig.10
1.7
2.0
2.3
V
Vsync
Vzc
sync pulse voltage level
zero carrier voltage level
see Fig.10
see Fig.10
1.15
3.27
1.35
3.57
1.55
3.87
−
V
V
V
Vv(clu)
upper video clipping voltage
level
VP − 1.1 VP − 1
Vv(cll)
lower video clipping voltage
level
−
0.7
1.0
V
Ro
output resistance
note 3
−
−
30
Ω
Ibias(int)
internal DC bias current for
emitter-follower
2.0
2.5
−
mA
Io(source)(max)
Io(sink)(max)
∆Vo
maximum AC and DC output
source current
2.4
1.4
−
−
−
−
mA
mA
maximum AC and DC output
sink current
deviation of CVBS output
signal voltage
50 dB gain control
30 dB gain control
−
−
−
−
−
−
−
−
2
2
0.5
0.1
1
dB
dB
%
∆Vo(bl)
Gdif
black level tilt
differential gain
differential phase
“NTC-7 Composite”
“NTC-7 Composite”
5
%
ϕdif
4
deg
Bv(−3dB)(trap)
−3 dB video bandwidth
CL < 20 pF; RL > 1 kΩ;
including sound carrier trap
AC load; note 8
f
trap = 4.5 MHz
(M/N standard)
trap = 5.5 MHz
3.95
4.90
5.2
4.05
5.00
5.50
5.95
−
−
−
−
MHz
MHz
MHz
MHz
f
(B/G standard)
ftrap = 6.0 MHz
(I standard)
f
trap = 6.5 MHz
5.5
(D/K standard)
1999 Jul 21
11
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
αSC1
PARAMETER
CONDITIONS
M/N standard
MIN.
30
TYP.
36
MAX.
UNIT
dB
trap attenuation at first sound
carrier
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
B/G standard
I standard
30
26
26
21
24
20
20
21
21
12
18
15
15
10
13
110
36
32
32
27
30
26
26
27
27
18
24
21
21
15
18
180
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
D/K standard
M/N standard
B/G standard
I standard
αSC1(60 kHz)
trap attenuation at first sound
carrier fSC1 ±60 kHz
D/K standard
M/N standard
B/G standard
I standard
αSC2
trap attenuation at second
sound carrier
D/K standard
M/N standard
B/G standard
I standard
αSC2(60 kHz)
trap attenuation at second
sound carrier fSC2 ±60 kHz
D/K standard
td(g)(CC)
group delay at chrominance
carrier frequency
3.58 MHz at
M/N standard
250
4.43 MHz at B/G standard 110
4.43 MHz at I standard
4.28 MHz at D/K standard −
180
90
250
160
130
−
ns
ns
ns
dB
−
60
S/NW
weighted signal-to-noise ratio
weighted in accordance
with “CCIR 567”;
56
60
see Fig.6; note 9
S/NUW
unweighted signal-to-noise
ratio
note 9
47
58
58
60
59
−
51
64
64
66
65
2
−
−
−
−
−
5
−
−
−
dB
dB
dB
dB
dB
mV
dB
dB
dB
αdblue
intermodulation attenuation at f = 0.92 MHz; see Fig.7;
‘blue’
note 10
f = 2.76 MHz; see Fig.7;
note 10
αdyellow
intermodulation attenuation at f = 0.92 MHz; see Fig.7;
‘yellow’
note 10
f = 2.76 MHz; see Fig.7;
note 10
∆Vr(vc)(rms)
αH(sup)
residual vision carrier
(RMS value)
fundamental wave and
harmonics
harmonics suppression in
video signal
CL < 20 pF; RL > 1 kΩ;
AC load; note 11a
35
40
25
40
−
αH(spur)
spurious elements suppression note 11b
in video signal
PSRR13
power supply ripple rejection at fripple = 70 Hz; video
28
pin 13
signal; grey level;
see Fig.9
1999 Jul 21
12
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Video output signal (pin 13; trap bypass mode; V12 < 0.8 V; sound carrier off); see Fig.10; note 12
Vo(v)(p-p)
video output signal voltage
(peak-to-peak value)
see Fig.10
0.95
1.10
1.25
V
Vsync
Vzc
sync pulse voltage level
zero carrier voltage level
1.4
1.5
1.6
2.87
−
V
V
V
2.57
3.1
2.72
3.25
Vv(clu)
upper video clipping voltage
level
Vv(cll)
lower video clipping voltage
level
−
1.15
6
1.3
−
V
Bv(−1dB)
Bv(−3dB)
S/NW
−1 dB video bandwidth
−3 dB video bandwidth
weighted signal-to-noise ratio
CL < 20 pF; RL > 1 kΩ;
AC load
5
MHz
MHz
dB
CL < 20 pF; RL > 1 kΩ;
AC load
7
8
−
weighted in accordance
with “CCIR 567”;
56
60
−
see Fig.6; note 9
S/NUW
unweighted signal-to-noise
ratio
note 9
49
5
53
9
−
dB
Trap control (pin 12)
Io(source)(max)
maximum output source
13
µA
current
Io(sink)(max)
KD(trap)
maximum output sink current
9
13
17
µA
frequency detector steepness ftrap = 4.5 MHz
−
−8
−
µA/MHz
∆I12/∆ftrap
(M/N standard)
f
trap = 6.5 MHz
−
−5.5
−
µA/MHz
(D/K standard)
V12
operating voltage range of trap
frequency control at pin 12
1.5
−
3.5
V
IL(12)
leakage current at pin 12
∆ftrap < ±25 kHz
−
−
−
±80
nA
CRstps
control steepness ∆ftrap/∆V12
ftrap = 4.5 MHz
(M/N standard)
4.5
−
MHz/V
ftrap = 6.5 MHz
(D/K standard)
−
9
−
MHz/V
Vsw
switching voltage
source current
trap bypass mode active
trap bypass mode active;
−
−
−
0.8
V
Isource
185
−
µA
V12 ≤ 0.8 V
VIF-AGC detector (pin 20)
Ich(max)(20)
Idch(max)(20)
tres(inc)
maximum charge current
6
8
10
12.5
−
µA
µA
ms
ms
ms
maximum discharge current
7.5
−
10
2.0
2.5
4.0
AGC response time to an
increasing VIF step
6 dB; note 13
20 dB; note 13
40 dB; note 13
−
−
−
−
1999 Jul 21
13
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
tres(dec)
PARAMETER
CONDITIONS
−6 dB; note 13
MIN.
TYP.
1.0
MAX.
UNIT
ms
AGC response time to a
decreasing VIF step
−
−
−
−
−
−
−20 dB; note 13
−40 dB; note 13
1.5
2.5
−
ms
ms
V
V20
gain control voltage range at
pin 20
1.7
3.6
CRstps
control steepness ∆GIF/∆V20
V20 = 2.2 to 3.2 V
−
−40
−
dB/V
mV
Tuner AGC (pin 14); see Figs 4 and 5
Vi(VIF)(min)(rms)
Vi(VIF)(max)(rms)
QVi(VIF)(rms)
VIF input signal voltage for
minimum starting point of tuner I14 = 120 µA
takeover at pins 1 and 2
RTOP = 22 kΩ;
−
2
5
(RMS value)
VIF input signal voltage for
maximum starting point of
tuner takeover at pins 1 and 2
(RMS value)
RTOP = 0 Ω; I14 = 120 µA 45
90
10
−
mV
mV
tuner takeover point accuracy RTOP = 12 kΩ;
5
20
(RMS value)
I14 = 120 µA
Vo
permissible output voltage
saturation voltage
from external source
I14 = 450 µA
−
−
−
−
13.2
0.2
V
Vsat
−
V
Vi(VIF)(rms)/∆T
variation of takeover point with I14 = 120 µA
0.03
0.07
dB/K
temperature
Isink
sink current
no tuner gain reduction;
see Fig.4
V
V
14 = 12 V
14 = 13.2 V
−
−
0.75
1.5
µA
µA
µA
−
−
maximum tuner gain
reduction; V14 = 1 V;
see Fig.4
450
600
750
∆GIF
IF slip by automatic gain
control
tuner gain current from
20% to 80%
−
5
8
dB
AFC circuit (pin 19); notes 14 and 15
AFCstps
QfVIF
AFC steepness ∆I19/∆fVIF
accuracy of AFC circuit
upper limit saturation voltage
lower limit saturation voltage
output source current
0.85
1.05
1.25
+20
−
µA/kHz
kHz
V
Io(19) = 0; f15 = 4.0 MHz
see Fig.8
−20
−
Vsat(ul)
Vsat(ll)
VP − 0.6 VP − 0.3
see Fig.8
−
0.3
0.6
240
240
V
Io(source)
Io(sink)
160
160
200
200
µA
output sink current
µA
1999 Jul 21
14
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Intercarrier mixer (pin 11)
Vo(intc)(rms)
intercarrier output voltage
(RMS value)
−
49
−
mV
Vi(SC)
= –24 dB ; note 16
-------------
Vi(PC)
Bintc(−3dB)(ul)
upper limit −3 dB intercarrier
bandwidth
7.5
9
2
−
−
MHz
mV
∆Vr(SC)(rms)
residual sound carrier
(RMS value)
fundamental wave and
harmonics
−
Ro
output resistance
DC output voltage
note 3
−
−
70
2.35
−
Ω
VO
1.85
0.9
2.05
1.15
V
Ibias(int)
internal DC bias current for
emitter-follower
mA
Io(source)(max)
Io(sink)(max)
IO(source)
maximum AC output source
current
note 17
note 17
0.6
0.8
−
mA
mA
mA
maximum AC output sink
current
0.6
0.8
−
DC output source current
automatic audio mute
function activated;
note 17
0.75
0.93
1.20
FM-PLL demodulator; notes 15 and 18 to 21
fintc
sound intercarrier operating
frequencies
see Table 2
−
−
−
−
−
4.5
−
−
−
−
−
MHz
MHz
MHz
MHz
kHz
5.5
6.0
6.5
∆fFM
frequency window of digital
acquisition help for
±225
FM demodulator
VFM(rms)
IF intercarrier level for gain
corresponding PC/SC
6
−
320
mV
controlled operation of FM-PLL ratio at input pins 1 and 2
(RMS value)
is 7 to 40 dB
VFM(lock)(rms)
GFM
IF intercarrier level for lock-in
of PLL (RMS value)
−
−
3
mV
dB
IF intercarrier gain control
range
30
34
−
SIGNAL AT PIN 7
V7
gain control voltage range at
pin 7
1.5
−
3.5
V
Ich(max)(7)
Idch(max)(7)
CRstps
maximum charge current
maximum discharge current
control steepness ∆GFM/∆V7
1.5
1.5
−
2.2
2.2
−30
2.9
2.9
−
µA
µA
V7 = 2.2 to 2.7 V
dB/V
SIGNAL AT PIN 8
Vo(AF)(rms)
audio output signal voltage
(RMS value)
25 kHz FM deviation
27 kHz FM deviation
400
432
500
540
600
648
mV
mV
1999 Jul 21
15
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
PARAMETER
CONDITIONS
THD < 1.5%
MIN.
1.3
TYP.
1.4
MAX.
UNIT
Vo(AF)(cl)(rms)
audio output clipping signal
voltage level (RMS value)
−
V
THD
total harmonic distortion
−
−
0.15
0.5
%
∆Vo(AF)/∆T
temperature drift of AF output
signal voltage
3 × 10−3 7 × 10−3 dB/K
∆fAF
audio frequency deviation
THD < 1.5%; note 22
−
−
±55
kHz
kHz
BAF(−3dB)
−3 dB audio frequency
bandwidth
without de-emphasis;
dependent on loop filter at
pin 4; measured in
80
100
−
accordance with Fig.19
S/NW
weighted signal-to-noise ratio
of audio signal
black picture
white picture
50
45
40
56
51
46
−
−
−
dB
dB
dB
6 kHz sine wave
(black-to-white
modulation)
sound carrier
subharmonics;
f = 2.25 MHz ±3 kHz
35
−
40
−
−
2
−
dB
mV
dB
∆Vr(SC)(rms)
residual sound carrier
(RMS value)
fundamental wave and
harmonics; without
de-emphasis
αAM(sup)
AM suppression of
FM demodulator
75 µs de-emphasis;
AM: f = 1 kHz; m = 0.3
referenced to 25 kHz
FM deviation
40
46
PSRR8
power supply ripple rejection at fripple = 70 Hz; see Fig.9
pin 8
14
20
−
dB
SIGNAL AT PIN 4
Io(source)(PD)(max) maximum phase detector
output source current
−
−
−
−
−
−
86
−
−
−
−
−
−
µA
µA
µA
µA
µs
Io(sink)(PD)(max)
Io(source)(DAH)
Io(sink)(DAH)
tW(DAH)
maximum phase detector
output sink current
80
output source current of digital
acquisition help
110
110
16
output sink current of digital
acquisition help
pulse width of digital
acquisition help current
Tcy(DAH)
cycle time of digital acquisition
help
64
µs
KO(FM)
KD(FM)
VCO steepness ∆fFM/∆V4
−
−
3.3
9
−
−
MHz/V
phase detector steepness
µA/rad
∆I4/∆ϕFM
1999 Jul 21
16
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Audio amplifier (pins 5, 6 and 8)
Ro(5)
output resistance at pin 5
note 23
4.4
5.0
5.6
kΩ
VAF(5)(rms)
audio signal (RMS value) at
pin 5
−
170
−
mV
VO(5)
Ro(8)
VO(8)
DC output voltage at pin 5
output resistance at pin 8
DC output voltage at pin 8
−
−
−
−
2.37
−
−
V
note 3
200
−
Ω
2.37
−
V
Io(source)(max)(8) maximum AC and DC output
source current at pin 8
0.5
mA
Io(sink)(max)(8)
maximum AC and DC output
sink current at pin 8
−
−
−
0.5
3.3
mA
V
V6
DC decoupling voltage at pin 6 dependent on intercarrier 1.5
frequency fFM
IL(6)
leakage current at pin 6
∆VO(8) < ±50 mV
−
−
±25
nA
Ich(max)(6)
maximum charge current at
pin 6
1.15
1.5
1.85
µA
Idch(max)(6)
BAF(−3dB)
maximum discharge current at
pin 6
1.15
1.5
1.85
µA
−3 dB audio frequency
bandwidth of audio amplifier
upper limit
150
−
−
−
kHz
Hz
lower limit; note 24
note 17
−
20
−
αmute(8)
mute attenuation of AF signal
at pin 8
70
75
dB
∆V8
DC jump voltage at pin 8 for
switching AF output to mute
state and vice versa
activated by digital
acquisition help; note 17
−
±50
±150
mV
V
Standard switch (pins 9 and 10); see Table 2
Vi
input voltage
pin open-circuit;
2.8
3.0
3.6
Ii(9,10) < 0.1 µA
for LOW
0
−
0.8
2.3
VP
V
for MID
1.3
2.8
87
33
1.8
−
V
for HIGH
Vi(9,10) = 0 V
V
Ii(source)
input source current
105
39
122
45
µA
µA
Vi(9,10) = 1.8 V
Reference input (pin 15); note 25
VI
DC input voltage
input resistance
2.3
2.5
−
2.6
3.0
−
2.9
3.5
200
V
Ri
kΩ
Ω
Rxtal
resonance resistance of crystal operation as crystal
oscillator
Cx
pull-up/down capacitance
note 26
−
−
−
−
−
pF
fref
frequency of reference signal
4.0
−
−
MHz
%
∆fref
tolerance of reference
frequency
note 15
±0.1
1999 Jul 21
17
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SYMBOL
Vref(rms)
PARAMETER
CONDITIONS
MIN.
80
TYP.
MAX.
400
UNIT
mV
amplitude of reference signal
source (RMS value)
operation as input
terminal
−
−
Ro(ref)
CK
output resistance of reference
source
−
4.7
kΩ
decoupling capacitance to
external reference source
operation as input
terminal
22
100
−
pF
Notes
1. Values of video and sound parameters can be decreased at VP = 4.5 V.
2. This parameter is tested with 110 mV to ensure maximum input level.
3. This parameter is not tested during production and is only given as application information for designing the television
receiver.
4. Loop bandwidth BL = 70 kHz (damping factor d = 1.9; calculated with sync level within gain control range).
Calculation of the VIF-PLL filter can be done by use of the following formulae:
1
2π
BL–3 dB
=
K K R , valid for d ≥ 1.2
------
O
D
1
2
d = R K K C ,
--
O
D
where:
rad
--------
V
Hz
------
V
µA
--------
rad
KO = VCO steepness
or 2π
; KD = phase detector steepness
;
R = loop resistor; C = loop capacitor; BL−3 dB = loop bandwidth for −3 dB; d = damping factor.
5. Vi(VIF)(rms) = 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video
modulation.
6. Vi(VIF) signal for nominal video signal.
7. Broadband transformer at VIF input. The C/N ratio at VIF input is defined as the VIF input signal (sync level,
RMS value) related to a superimposed 4.2 MHz band-limited white noise signal (RMS value); white picture video
modulation.
8. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps
(see Figs 13 to 18); H (s) is the absolute value of transfer function.
9. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13).
B = 4.2 MHz (M/N standard) or B = 5.0 MHz (B/G, I and D/K standard).
10. The intermodulation figures are defined:
V0at 3.58 MHz
α d0.92 = 20 log
+ 3.6 dB ; αd0.92 value at 0.92 MHz referenced to black or white signal;
--------------------------------------
V0at 0.92 MHz
V0at 3.58 MHz
α d2.76 = 20 log
; αd2.76 value at 2.76 MHz referenced to chrominance carrier.
--------------------------------------
V0at 2.76 MHz
11. Measurements taken with SAW filter M1963M (sound shelf: 20 dB); loop bandwidth BL = 70 kHz.
a) Modulation Vestigial Side-Band (VSB); sound carrier off; fvideo > 0.5 MHz.
b) Sound carrier on; fvideo = 10 kHz to 10 MHz.
12. The sound carrier trap can be disabled by switching pin 12 to ground (<0.8 V). In this way the full composite video
spectrum appears at pin 13. The amplitude is 1.1 V (p-p).
13. Response time valid for a VIF input level range of 200 µV to 70 mV.
1999 Jul 21
18
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is
given in Fig.8. The AFC steepness can be changed by resistors R1 and R2.
15. The tolerance of the reference frequency determines the accuracy of the VIF AFC, FM demodulator centre frequency
and maximum FM deviation.
16. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal
video signal with 1.1 V (p-p) as a reference:
V
i(SC)(dB) + 6 dB ±3 dB
---------------
Vi(PC)
---------------------------------------------------------------
1
20
Vo(intc)(rms) = 1.1 V (p-p) ×
× 10
----------
2 2
where:
1
V
= correction term for RMS value, i(SC)(dB) = sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB,
----------
---------------
Vi(PC)
2 2
6 dB = correction term of internal circuitry and ±3 dB = tolerance of video output and intercarrier output amplitude
Vo(intc)(rms)
.
17. For normal operation no DC load at pin 11 is allowed, so the automatic audio mute function is not active.
By connecting a 2.2 kΩ resistor between pin 11 and ground the automatic audio mute function will be activated.
With this application also the series capacitor CS of the loop filter at pin 4 should be changed from 33 nF to 4.7 nF.
18. Calculation of the FM-PLL filter can be done approximately by use of the following formulae:
K O K D
1
fo
=
---------------
C P
------
2π
1
ϑ =
-----------------------------------
2R KOKDCP
BL–3 dB = fo(1.55 – ϑ 2)
The formulae are only valid under the following conditions:
ϑ ≤ 1 and CS > 5CP
where:
rad
--------
V
Hz
------
V
µA
--------
rad
KO = VCO steepness
or 2π
; KD = phase detector steepness
;
RS = loop resistor; CS = series capacitor; CP = parallel capacitor; fo = natural frequency of PLL;
BL−3 dB = loop bandwidth for −3 dB; ϑ = damping factor. For examples see Table 1.
19. For all S/N measurements the used vision IF modulator requires an incidental phase modulation for black-to-white
jump of less than 0.5 degrees.
20. Measurements taken with SAW filter M1963M (Siemens) for vision and sound IF (sound shelf: 20 dB).
Picture-to-sound carrier ratio of transmitter: PC/SC = 10 dB. Input level (at pins 1 and 2) Vi(VIF)(rms) = 10 mV (sync
level), 25 kHz FM deviation for sound carrier, fAF = 400 Hz. Measurement in accordance with “CCIR 468-4”.
De-emphasis = 75 µs.
21. The PC/SC ratio is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC ratio. This PC/SC
ratio is necessary to achieve the S/NW values as noted. A different PC/SC ratio will change these values.
22. Measured with an FM deviation of 25 kHz, the typical AF output signal is 500 mV (RMS). By using Rx = 20 kΩ the
AF output signal is attenuated by 6 dB, so 250 mV (RMS). For handling an FM deviation of more than 55 kHz the
AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to
100 kHz an attenuation of 6 dB is recommended.
23. CDEEM = 10 nF results in τ = 50 µs and CDEEM = 15 nF results in τ = 75 µs.
1999 Jul 21
19
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
24. The lower limit of audio bandwidth depends on the value of the capacitor at pin 6. A value of CAFD = 470 nF leads to
AF(−3 dB) ≈ 20 Hz and CAFD = 220 nF leads to fAF(−3 dB) ≈ 40 Hz.
f
25. The reference input pin 15 is able to operate as a 1-pin crystal oscillator as well as an input terminal with external
reference signal, e.g. from the tuning system.
26. The value of Cx determines the accuracy of the resonance frequency of the crystal. It depends on the type of crystal
used.
Table 1 Examples to note 18 of Chapter “Characteristics”
BL−3 dB (kHz)
CS (nF)
CP (pF)
R (kΩ)
ϑ
100
160
33
33
820
330
2.7
3.9
0.5
0.5
Table 2 Standard switch settings
S0
S1
fVIF (MHz)
fintc (MHz)
STANDARD
REMARK
LOW
LOW
LOW
MID
LOW
MID
38.9
38.9
38.9
38.0
38.0
38.0
45.75
38.0
58.75
5.5
6.5
6.0
5.5
6.0
6.5
4.5
4.5
4.5
B/G
D/K
I
Europe
HIGH
LOW
MID
United Kingdom
B/G
I
MID
MID
HIGH
LOW
MID
D/K
M/N
M
HIGH
HIGH
HIGH
USA
HIGH
M
Japan
1999 Jul 21
20
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
MHB158
MHB159
120
handbook, halfpage
V
I
handbook, halfpage
20
14
V
i(VIF)
(dB/µV)
(V)
(µA)
4
3
2
1
600
100
500
400
300
200
100
0
90
80
70
(1)
(2)
(3)
(4)
60
0
30
50
70
90
(dB/µV)
110
4
8
12
16
20
24
R
(kΩ)
V
TOP
i(VIF)
(1) VIF AGC voltage.
(3) Ituner; RTOP = 12 kΩ.
(4) Ituner; RTOP = 0 Ω.
(2) Ituner; RTOP = 22 kΩ.
Fig.5 Typical tuner takeover point as a function of
Fig.4 Typical VIF and tuner AGC characteristic.
RTOP
.
MHB160
70
handbook, halfpage
S/N
3.2 dB
handbook, halfpage
(dB)
60
50
40
30
20
10
0
10 dB
13.2 dB
21 dB
13.2 dB
21 dB
SC CC
PC
SC CC
PC
BLUE
YELLOW
MHA739
30
50
70
90
(dB/µV)
110
V
i(VIF)
SC = sound carrier, with respect to sync level.
CC = chrominance carrier, with respect to sync level.
PC = picture carrier, with respect to sync level.
The sound carrier levels are taking into account a sound shelf
attenuation of 20 dB (SAW filter M1963M).
Fig.6 Typical signal-to-noise ratio as a function of
VIF input voltage.
Fig.7 Input signal conditions.
1999 Jul 21
21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
lock range without SAW filter
5
V
19
−200
(V)
I
19
V
4
3
2
1
0
P
(µA)
−100
R1
22 kΩ
I
19
0
19
TDA9880
R2
22 kΩ
100
200
MHB075
43
44
45
46
47
48
f (MHz)
45.56
45.94
45.75
Fig.8 Measurement conditions and typical AFC characteristic.
V
= 5 V
P
100 mV
= 70 Hz)
V
= 5 V
P
(f
ripple
TDA9880
MHB076
t
Fig.9 Ripple rejection condition.
22
1999 Jul 21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
trap bypass mode
normal mode
zero carrier level
white level
2.72 V
2.6 V
3.57 V
3.35 V
black level
1.83 V
1.5 V
1.95 V
1.35 V
sync level
MHB163
Fig.10 Typical video signal levels on output pin 13 (sound carrier off).
MHB164
10
audio
S/N 0
(dB)
(1)
−10
−20
−30
−40
−50
−60
−70
(2)
(3)
49
46
43
40
37
34
31
28
25
22
19
16
13
10
7
4
gain controlled operation of FM-PLL
PC/SC ratio at pins 1 and 2 (dB)
Conditions: 25 kHz FM deviation; 75 µs de-emphasis.
(1) Signal.
(2) Noise at H-picture.
(3) Noise at black picture.
Fig.0 Audio S/N as a function of picture-to-sound carrier ratio.
23
1999 Jul 21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
MHB079
120
1
video 1.1 V (p-p)
antenna input
(dBµV)
(1)
−1
100
10
SAW insertion
loss 14 dB
IF signals
RMS value
(V)
IF slip
6 dB
−2
10 (TOP)
80
tuner gain
control range
70 dB
VIF AGC
−3
10
60
40
−3
0.66 × 10
SAW insertion
loss 14 dB
−4
10
40 dB
RF gain
−5
10
20
10
−5
0.66 × 10
VIF amplifier, demodulator
and video
VHF/UHF tuner
tuner
VIF
SAW filter
TDA9880
(1) Depends on TOP.
Fig.12 Front-end level diagram.
24
1999 Jul 21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
MHB166
10
H (s)
(dB)
0
−10
−20
−30
−40
minimum
requirements
2
2.5
3
3.5
4
4.5
5
f (MHz)
Fig.13 Typical amplitude response for sound trap at M/N standard (including Korea).
MHB167
400
group
delay
(ns)
300
200
ideal characteristic
due to pre-correction
in the transmitter
100
0
minimum
requirements
−100
0
0.5
1
1.5
2
2.5
3
3.5
4
f (MHz)
Remark: overall delay is not shown, here the maximum ripple is specified.
Fig.14 Typical group delay for sound trap at M/N standard.
25
1999 Jul 21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
MHB168
10
H (s)
(dB)
0
−10
−20
−30
−40
minimum
requirements
4
4.5
5
5.5
6
6.5
7
f (MHz)
Fig.15 Typical amplitude response for sound trap at B/G standard.
MHB169
400
group
delay
(ns)
300
200
100
0
ideal characteristic
due to pre-correction
in the transmitter
minimum
requirements
−100
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
f (MHz)
Remark: Overall delay is not shown, here the maximum ripple is specified.
Fig.16 Typical group delay for sound trap at B/G standard.
26
1999 Jul 21
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
MHB170
10
H (s)
(dB)
0
−10
−20
−30
−40
minimum
requirements
4
4.5
5
5.5
6
6.5
7
f (MHz)
Fig.17 Typical amplitude response for sound trap at I standard.
MHB171
10
H (s)
(dB)
0
−10
−20
−30
−40
minimum
requirements
4
4.5
5
5.5
6
6.5
7
f (MHz)
Fig.18 Typical amplitude response for sound trap at D/K standard.
27
1999 Jul 21
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
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(1)
VIF-PLL
filter
sound
intercarrier
output
AFC
output
TAGC
output
CVBS
output
V
P
1.5
kΩ
auto
mute
22
kΩ
100
nF
3.3
MΩ
R
150 Ω
10
nF
C
TR
4 MHz
(3)
470
nF
10 nF
C
2.2
kΩ
220 nF
C
x
C
22 kΩ
VAGC
10 nF
f
bypass
CVBS
ref
V
VAGC
20
AFC
VPLL
GND
16
REF
TAGC
TR
SIO
11
P
19
18
3
17
15
14
13
8
12
TDA9880
1
2
4
5
6
7
9
10
S1
VIF1
VIF2
TOP
FMPLL
DEEM
AFD
FAGC
AUD
S0
H
470 nF
1 : 1
C
IF
S
C
L
M
L
M
FAGC
100 nF
22 kΩ
33 nF
input
H
C
P
820
pF
(4)
R
R
50
Ω
TOP
x
47
kΩ
47
kΩ
R
C
S
DEEM
2.7 kΩ
15 nF
FM-PLL
audio
logic
filter
(2)
output
MHB162
(1) See note 4 of Chapter “Characteristics”.
(2) See notes 17 and 18 of Chapter “Characteristics”.
(3) See note 26 of Chapter “Characteristics”.
(4) See note 22 of Chapter “Characteristics”.
ahdnbok,uflapegwidt
Fig.19 Test circuit.
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
INTERNAL PIN CONFIGURATIONS
handbook, halfpage
+
handbook, halfpage
30 kΩ
20 kΩ
1
1.1 kΩ
1.1 kΩ
5 kΩ
+
3.55 V
+
9 kΩ
3.55 V
2
3
2.65 V
1.9 V
MHB087
MHB088
Fig.20 Pin 1 (VIF1) and pin 2 (VIF2).
Fig.21 Pin 3 (TOP).
maximum 100 µA
handbook, halfpage
240 µA
handbook, halfpage
+
+
5.0 kΩ
5
4
MHB090
maximum 100 µA
MHB089
Fig.22 Pin 4 (FMPLL).
Fig.23 Pin 5 (DEEM).
1999 Jul 21
29
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
+
handbook, halfpage
maximum 2.2 µA
handbook, halfpage
+
+
7
maximum 1.5 µA
2 kΩ
6
maximum 1.5 µA
maximum
2.2 µA
1.5 V
MHB092
MHB091
Fig.24 Pin 6 (AFD).
Fig.25 Pin 7 (FAGC).
+
+
handbook, halfpage
handbook, halfpage
+
600 µA
+
9
15 kΩ
10 pF
27 kΩ
8
3.55 V
MHB094
MHB093
Fig.26 Pin 8 (AUD).
Fig.27 Pin 9 (S0).
handbook, halfpage
+
+
handbook, halfpage
10
14.7 kΩ
11
27 kΩ
3.55 V
MHB096
1.2 mA
MHB095
Fig.28 Pin 10 (S1).
Fig.29 Pin 11 (SIO).
1999 Jul 21
30
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
maximum 150 µA
handbook, halfpage
maximum 9 µA
+
+
handbook, halfpage
+
1 kΩ
12
10 kΩ
7 kΩ
13
maximum 13 µA
500 Ω
2.5 mA
MHB098
1.1 V
MHB165
Fig.30 Pin 12 (TR).
Fig.31 Pin 13 (CVBS).
handbook, halfpage
+
handbook, halfpage
14
3 kΩ
15
maximum
600 µA
MHB099
200 µA
MHB100
Fig.32 Pin 14 (TAGC).
Fig.33 Pin 15 (REF).
handbook, halfpage
+
17
handbook, halfpage
GND 16
MHB101
MHB102
Fig.34 Pin 16 (GND).
Fig.35 Pin 17 (VP).
1999 Jul 21
31
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
+
handbook, halfpage
handbook, halfpage
+
+
VCO
maximum 200 µA
25 kΩ
19
18
maximum
5 µA
maximum
15 µA
1 kΩ
1 kΩ
MHB104
MHB103
Fig.36 Pin 18 (VPLL).
Fig.37 Pin 19 (AFC).
handbook, halfpage
+
maximum 8 µA
maximum 10 µA
20
MHB105
Fig.38 Pin 20 (VAGC).
1999 Jul 21
32
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
PACKAGE OUTLINES
SDIP20: plastic shrink dual in-line package; 20 leads (300 mil)
SOT325-1
D
M
E
A
2
A
A
L
1
c
e
w M
Z
(e )
b
1
1
M
H
b
20
11
pin 1 index
E
1
10
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
A
A
2
max.
(1)
(1)
1
w
UNIT
b
b
c
D
E
e
e
L
M
M
H
1
1
E
min.
1.3
1.0
0.53
0.38
0.32
0.20
19.50
18.55
6.48
6.14
3.2
2.8
8.25
7.80
10.0
8.3
mm
4.2
0.51
3.2
1.778
7.62
0.18
1.9
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-13
95-02-04
SOT325-1
1999 Jul 21
33
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
1999 Jul 21
34
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
SOLDERING
Introduction
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
300 and 400 °C, contact may be up to 5 seconds.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Jul 21
35
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
WAVE
REFLOW(1) DIPPING
suitable(2)
not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(3)
MOUNTING
PACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
−
suitable
Surface mount
BGA, SQFP
suitable
suitable
suitable
suitable
suitable
−
−
−
−
−
PLCC(4), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(4)(5)
not recommended(6)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Jul 21
36
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
NOTES
1999 Jul 21
37
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
NOTES
1999 Jul 21
38
Philips Semiconductors
Product specification
Alignment-free multistandard vision and
FM sound IF-PLL demodulator
TDA9880
NOTES
1999 Jul 21
39
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Pakistan: see Singapore
Belgium: see The Netherlands
Brazil: see South America
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America
Czech Republic: see Austria
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1999
SCA67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/03/pp40
Date of release: 1999 Jul 21
Document order number: 9397 750 05318
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