TEA0677 [NXP]
Dual pre-amplifier and equalizer for reverse tape decks; 双前置放大器和均衡器反向磁带机
| 型号： | TEA0677 |
| 厂家： | 
NXP |
| 描述： | Dual pre-amplifier and equalizer for reverse tape decks |
| 文件： | 总13页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TEA0677T
Dual pre-amplifier and equalizer for
reverse tape decks
August 1993
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
FEATURES
GENERAL DESCRIPTION
• Head pre-amplifiers
The TEA0677T is a monolithic bipolar integrated circuit
intended for applications in car radios. It includes head and
equalization amplifiers with electronically switchable time
constants. Furthermore it includes electronically
switchable inputs for tape drives with reverse heads. The
device is intended to replace the regular TEA0675T in
low-cost car radios using the same PCB. External
components that are necessary for Dolby B and music
search features can be omitted.
• Reverse head switching
• Equalization with electronically switched time constants
• 0 dB = 387.5 mV
• Pin compatible to TEA0675 Dolby B, music search IC.
The device will operate with power supplies in the range of
7.6 V to 12.0 V, output overload level increasing with
increase in supply voltage. Current drain varies with
supply voltage, so it is advisable to use a regulated power
supply or a supply with a long time constant.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
MIN.
TYP.
MAX.
UNIT
supply voltage
supply current
7.6
−
10
23
74
12
26
−
V
ICC
mA
dB
(S + N)/N
signal-plus-noise to noise ratio
68
ORDERING INFORMATION
PACKAGE
MATERIAL
plastic
EXTENDED TYPE
NUMBER
PINS
24
PIN POSITION
CODE
SOT137A(1)
TEA0677T
SO
Note
1. SOT137-1; 1996 August 27.
August 1993
2
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Instead of potentiometers at EQ AMP
fixed resistors may be used. The value
depends on applied heads.
Fig.1 Block and application diagram.
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
PINNING
SYMBOL PIN
DESCRIPTION
output channel A
OUTA
n.c.
1
2
not connected
n.c.
3
not connected
n.c.
4
not connected
n.c.
5
not connected
n.c.
6
not connected
EQA
EQFA
VCC
7
equalizing output channel A
equalizing input channel A
supply voltage
8
9
INA1
10
input channel A1 (forward or
reverse)
VREF
INA2
11
12
reference voltage
input channel A2 (reverse or
forward)
INB2
13
input channel B2 (reverse or
forward)
HS
14
15
head switch input
INB1
input channel B1 (forward or
reverse)
GND
EQFB
EQB
EQS
n.c.
16
17
18
19
20
21
22
23
24
ground
equalizing input channel B
equalizing output channel B
equalizing switch input
not connected
ACUR
n.c.
auxiliary current
not connected
n.c.
not connected
Fig.2 Pin configuration.
OUTB
output channel B
Time constant switching for equalization
(70 µs/120 µs) is achieved when pin 19 (EQS) is
connected to ground via an 18 kΩ resistor (120µs) or left
open-circuit (70 µs).
FUNCTIONAL DESCRIPTION
Head switching is achieved when pin 14 (HS) is
connected to GND via a 27 kΩ resistor (inputs INA2, INB2
active), or left open-circuit (inputs INA1, INB1 active).
The 10 µF capacitor at pin 14 sets the time constant for
smooth switching.
August 1993
4
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL
VCC
PARAMETER
MIN.
MAX.
16
UNIT
DC supply voltage
0
V
VI
input voltage (pin 1 to 24) except pin 11 (VREF) to VCC
pin 11 (VREF) to VCC short-circuiting duration
operating ambient temperature
−0.3
−
VCC
5
V
tshort
Tamb
Tstg
Ts
s
−40
−65
−
+85
+150
260
−
°C
°C
°C
−
storage temperature
soldering temperature (wave solder for 10 s at lead)
electrostatic handling (note 1)
Ves
−
Note to the Limiting values
1. Classification A: human body model; C = 100 pF, R = 1.5 kΩ, V ≥ 2 kV; charge device model; C = 200 pF, R = 0 Ω,
V ≥ 500 V.
CHARACTERISTICS
VCC = 10 V; f = 20 Hz to 20 kHz; Tamb = +25 °C; all levels are referenced to 387.5 mV (RMS; 0 dB) at output; see Fig.1;
EQ switch in the 70 µs position; unless otherwise specified.
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
7.6
TYP.
MAX.
12
UNIT
VCC
ICC
10
23
V
supply current
pins 10, 12, 13 and 15
connected to VREF
f = 1 kHz; VO = 0 dB
f = 1 kHz; VO = 0 dB
f = 10 kHz; VO = 6 dB
VCC = 7.6 V;
−
26
mA
channel matching
−0.5
−
−
+0.5
0.1
0.15
−
dB
%
THD
total harmonic distortion 2nd and 3rd
harmonic
0.04
0.08
14
−
%
head room at output
12
dB
THD = 1%; f = 1 kHz
0.25 V (RMS);
PSRR
power supply ripple rejection
channel separation
45
50
70
−
−
dB
dB
f = 1 kHz; see Fig.3
αCS
f = 1 kHz; VO = +10 dB; 64
see Fig.4
αCC
crosstalk between active and inactive
input
f = 1 kHz; VO = +10 dB 70
77
−
−
dB
RLmin
minimum load resistance at output
f = 1 kHz; VO = 12 dB; 10
THD = 1%
−
kΩ
Gv
voltage gain (pre-amplifier) from input
pins 10, 12, 13 and 15 to pin EQF
f = 1 kHz
29
30
31
dB
Voff
IB
input offset voltage
input bias current
−
2
−
mV
µA
kΩ
kΩ
−
0.1
5.8
100
0.4
6.9
−
REQ
RI
equalizing resistor
4.7
60
input resistance head inputs
August 1993
5
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
SYMBOL
PARAMETER
open-loop gain
CONDITIONS
MIN.
TYP.
MAX.
UNIT
AV
pins INA1/INA2 to pin OUTA
pins INB1/INB2 to pin OUTB
equivalent noise voltage input
(RMS value)
f = 10 kHz
80
86
−
−
dB
dB
µV
f = 400 Hz
104
110
0.7
N
unweighted;
20 Hz to 20 kHz;
−
1.4
Rsource = 0 Ω
(S+N)/N signal-plus-noise to noise ratio
internal gain 40 dB
linear;
68
74
−
dB
CCIR/ARM weighted;
see Fig.4
DC output voltage; pins 1 (OUTA)
and 16 (OUTB)
reference to VREF;
tape head DC coupled
to ground
−
−
±0.15
V
IOGND
IOVCC
ZO
DC output current capability
DC output current capability
output impedance
−2
300
−
−
−
mA
µA
Ω
to VCC
−
−
80
100
Switching thresholds
Equalization (pin 19)
VEQS
IEQ70
IEQ120
voltage at pin EQS
−
−
−
−
5
V
70 µs input current
120 µs input current
−
−150
−1000
µA
µA
−250
Head switch (pin 14)
VIN1
IIN1
inputs INA1 and INB1 active
note 1
0.65VCC 0.775VCC 1.0VCC
−150 90 150
0.1VCC 0.225VCC 0.35VCC
−50 −90 −150
V
maximum input current
inputs INA2 and INB2 active
maximum input current
µA
V
VIN2
IIN2
µA
Note to the characteristics
1. For an application with a fixed EQ time constant of 120 µs the equalizing network may be applied completely
external. In this application the 8.2 kΩ resistor has to be changed to 14 kΩ and the internal resistor REQ = 5.8 kΩ
must be short-circuited by fixing the EQ-switch input at the 70 µs position (pin 19; EQS left open-circuit). To activate
the inputs INA1 and INB1 pin 10 (HS) may be left open-circuit. In this event the DC level at pin 10 (HS) is 0.775 VCC
.
General note
It is recommended to switch off VCC with a gradient of 400 V/s at maximum to avoid plops on tape in the event of contact
between tape and tape head while switching off.
August 1993
6
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Fig.3 Test circuit for power supply ripple rejection.
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Fig.4 Test circuit for channel separation and signal-to-noise ratio.
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
Fig.5 PCB layout example.
August 1993
9
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
Table 1 Component list pcb layout example.
COMPONENT
R1, R11
VALUE
270 kΩ
180 kΩ
1.5 kΩ
24 kΩ
R2, R12
R3, R13, R20
R4, R14
R5, R15
R6, R16
R7, R17
R8, R18
R9
8.2 kΩ
330 kΩ
1 kΩ
0.18 kΩ
68 kΩ to 1000 kΩ
27 kΩ
R10
R19
18 kΩ
R21, R22
C1, C11, C7, C17, C20
C2, C12
C3, C13
C4, C14
C5, C15
C6, C16
C8, C9, C18, C19
C10
0 kΩ
10 µF
330 nF
100 nF
15 nF
4.7 nF
10 nF
0.47 nF
100 µF
August 1993
10
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
PACKAGE OUTLINE
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
H
v
M
A
E
y
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.61
0.014 0.009 0.60
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT137-1
075E05
MS-013AD
August 1993
11
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
SOLDERING
Introduction
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
August 1993
12
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 1993
13
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