TEA1620P [NXP]

STARplug; STARplug
TEA1620P
型号: TEA1620P
厂家: NXP    NXP
描述:

STARplug
STARplug

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中文:  中文翻译
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TEA1620P  
STARplugTM  
Rev. 01 — 17 March 2004  
Product data sheet  
1. General description  
The TEA1620P is a Switched Mode Power Supply (SMPS) controller IC that operates  
directly from the rectified universal mains. It is implemented in the high voltage EZ-HV™  
SOI process, combined with a low voltage BICMOS process.  
The device includes a high voltage power switch and a circuit for start-up directly from the  
rectified mains voltage. A dedicated circuit for valley switching is built in, which makes a  
very efficient slim-line electronic power-plug concept possible.  
In its most basic version of application, the TEA1620P acts as a voltage source. Here, no  
additional secondary electronics are required. A combined voltage and current source can  
be realized with minimum costs for external components. Implementation of the  
TEA1620P renders an efficient and low cost power supply system.  
2. Features  
Designed for general purpose supplies  
Integrated power switch: 48 and 650 V  
Operates from universal AC mains supplies: 80 V to 276 V  
Adjustable frequency for flexible design  
RC oscillator for load insensitive regulation loop constant  
Valley switching for minimum switch-on loss  
Frequency reduction at low power output for low standby power: <100 mW  
Adjustable overcurrent protection  
Undervoltage protection  
Temperature protection  
Short winding protection  
Safe restart mode for system fault conditions  
Simple application with both primary and secondary (opto) feedback  
Available in 8-pin DIP package.  
3. Applications  
Chargers  
Adapters  
TV and monitor standby supplies  
PC peripherals.  
TEA1620P  
Philips Semiconductors  
STARplugTM  
4. Quick reference data  
Table 1:  
Symbol  
VCC(max)  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
maximum supply voltage  
-
-
-
-
40  
V
V
VDRAIN(max) maximum voltage at pin  
DRAIN  
Tj > 0 °C  
650  
IDRAIN  
supply current drawn from no auxiliary supply  
pin DRAIN  
-
0.5  
-
mA  
RDSon  
drain-source on-state  
resistance  
ISOURCE = 0.06 A  
Tj = 25 °C  
-
48  
68  
-
55.2  
78.2  
200  
+85  
Tj = 100 °C  
-
fosc  
oscillator frequency range  
ambient temperature  
10  
20  
kHz  
°C  
Tamb  
-
5. Ordering information  
Table 2:  
Ordering information  
Type number Package  
Name  
Description  
plastic dual in-line package; 8 leads (300 mil)  
Version  
SOT97-1  
TEA1620P  
DIP8  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
2 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
6. Block diagram  
1
8
V
CC  
SUPPLY  
DRAIN  
VALLEY  
TEA1620P  
LOGIC  
2
7
n.c.  
GND  
100 mV  
PWM  
stop  
3
6
OSCILLATOR  
THERMAL  
SOURCE  
RC  
SHUTDOWN  
low frequency  
f
PROTECTION  
LOGIC  
POWER-UP  
RESET  
blank  
1.8  
U
overcurrent  
2.5 V  
0.5 V  
4
5
10x  
REG  
AUX  
short winding  
0.75 V  
col006  
Fig 1. Block diagram.  
7. Pinning information  
7.1 Pinning  
V
1
2
3
4
8
7
6
5
DRAIN  
n.c.  
CC  
GND  
RC  
TEA1620P  
SOURCE  
AUX  
REG  
001aaa308  
Fig 2. Pin configuration.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
3 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
7.2 Pin description  
Table 3:  
Symbol  
VCC  
Pin description  
Pin  
1
Description  
supply voltage  
ground  
GND  
2
RC  
3
frequency setting  
regulation input  
REG  
4
AUX  
5
input for voltage from auxiliary winding for timing (demagnetization)  
source of internal MOS switch  
SOURCE  
n.c.  
6
7
not connected  
DRAIN  
8
drain of internal MOS switch; input for start-up current and valley sensing  
8. Functional description  
The TEA1620P is the heart of a compact flyback converter, with the IC placed at the  
primary side. The auxiliary winding of the transformer can be used for indirect feedback to  
control the isolated output. This additional winding also powers the IC. A more accurate  
control of the output voltage and/or current can be implemented with an additional  
secondary sensing circuit and optocoupler feedback.  
The TEA1620P uses voltage mode control. The frequency is determined by the maximum  
transformer demagnetizing time and the time of the oscillator. In the first case, the  
converter operates in the Self Oscillating Power Supply (SOPS) mode. In the latter case, it  
operates at a constant frequency, which can be adjusted with external components RRC  
and CRC. This mode is called Pulse Width Modulation (PWM). Furthermore, a primary  
stroke is started only in a valley of the secondary ringing. This valley switching principle  
minimizes capacitive switch-on losses.  
8.1 Start-up and undervoltage lock-out  
Initially, the IC is self supplying from the rectified mains voltage. The IC starts switching as  
soon as the voltage on pin VCC passes the VCC(start) level. The supply is taken over by the  
auxiliary winding of the transformer as soon as VCC is high enough and the supply from  
the line is stopped for high efficiency operation.  
As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC stops switching  
and restarts from the rectified mains voltage.  
8.2 Oscillator  
The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The  
external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary  
stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the  
relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost  
equal to the sensitivity at high duty factors. This results in a more constant gain over the  
duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable  
operation at low duty factors is easily realized. For high efficiency, the frequency is  
reduced as soon as the duty factor drops below a certain value. This is accomplished by  
increasing the oscillator charge time.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
4 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
To ensure that the capacitor can be charged within the charge time, the value of the  
oscillator capacitor should be limited to approximately 1 nF.  
8.3 Duty factor control  
The duty factor is controlled by the internal regulation voltage and the oscillator signal on  
pin RC. The internal regulation voltage is equal to the external regulation voltage (minus  
2.5 V) multiplied by the gain of the error amplifier (typical 20 dB or 10 ×).  
The minimum duty factor of the switched mode power supply is 0 %. The maximum duty  
factor is set to 75 % (typical value at 100 kHz oscillation frequency).  
8.4 Valley switching  
A new cycle is started at the primary stroke when the switch is switched on (see Figure 3).  
After a certain time (determined by the RC oscillator voltage and the internal regulation  
level), the switch is turned off and the secondary stroke starts. The internal regulation  
level is determined by the voltage on pin REG. After the secondary stroke, the drain  
1
voltage shows an oscillation with a frequency of approximately  
------------------------------  
2π × LpCp  
Where:  
Lp is the primary self inductance on the drain node  
Cp is the parasitic capacitance on the drain node.  
As soon as the oscillator voltage is high again and the secondary stroke has ended, the  
circuit waits for a low drain voltage before starting a new primary stroke.  
The primary stroke starts some time before the actual valley at low ringing frequencies,  
and some time after the actual valley at high ringing frequencies. Figure 4 shows a typical  
curve for a reflected voltage N × Vo of 80 V. This voltage is the output voltage Vo (see  
Figure 5) transferred to the primary side of the transformer with the factor N (determined  
by the turns ratio of the transformer). Figure 4 shows that the system switches exactly at  
minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on  
losses to a minimum. At 200 kHz, the next primary stroke is started at 33° before the  
valley. The switch-on losses are still reduced significantly.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
5 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
primary  
stroke  
secondary  
stroke  
secondary  
ringing  
drain  
valley  
secondary  
stroke  
A
B
regulation level  
RC  
oscillator  
col007  
A: Start of new cycle with valley switching.  
B: Start of new cycle in a classical PWM system.  
Fig 3. Signals for valley switching.  
001aaa311  
40  
phase  
(°)  
20  
0
20  
40  
0
200  
400  
600  
800  
f (kHz)  
Reflected voltage at N × Vo = 80 V.  
Fig 4. Typical phase of drain ringing at switch-on.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
6 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
8.5 Demagnetization  
The system operates in discontinuous conduction mode all the time. As long as the  
secondary stroke has not ended, the oscillator will not start a new primary stroke. During  
the suppression time tsuppr, demagnetization recognition is suppressed. This suppression  
may be necessary in applications where the transformer has a large leakage inductance  
and at low output voltages.  
8.6 Protections  
8.6.1 Overcurrent protection  
The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI (see  
Figure 5) to measure the current. The circuit is activated after the leading edge blanking  
time tleb. The protection circuit limits the source voltage to Vsource(max), and thus limits the  
primary peak current.  
8.6.2 Short winding protection  
The short winding protection circuit is also activated after the leading edge blanking time.  
If the source voltage exceeds the short winding protection voltage Vswp, the TEA1620P  
stops switching. Only a power-on reset will restart normal operation. The short winding  
protection also protects in case of a secondary diode short circuit.  
8.6.3 Overtemperature protection  
An accurate temperature protection is provided in the TEA1620P. When the junction  
temperature exceeds the thermal shutdown temperature, the IC stops switching. During  
thermal protection, the IC current is lowered to the start-up current. The IC continues  
normal operation as soon as the overtemperature situation has disappeared.  
8.6.4 Overvoltage protection  
Overvoltage protection can be achieved in the application by pulling pin REG above its  
normal operation level, or by keeping the level of pin AUX above Vdemag. The current  
primary stroke is terminated immediately, and no new primary stroke is started until the  
voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp.  
The current feed into pin REG must be limited.  
8.7 Characteristics of the complete power-plug  
8.7.1 Input  
The input voltage range comprises the universal AC mains from 80 V to 276 V.  
8.7.2 Accuracy  
The accuracy of the complete converter, functioning as a voltage source with primary  
sensing, is approximately 8 % (mainly dependent on the transformer coupling). The  
accuracy with secondary sensing is defined by the accuracy of the external components.  
For safety requirements in case of optocoupler feedback loss, the primary sensing  
remains active when an overvoltage circuit is connected.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
7 of 16  
TEA1620P  
Philips Semiconductors  
8.7.3 Efficiency  
STARplugTM  
An efficiency of 75 % at maximum output power can be achieved for a complete converter  
designed for universal mains.  
8.7.4 Ripple  
A minimum ripple is obtained in a system designed for a maximum duty factor of 50 %  
under normal operating conditions, and a minimized dead time. The magnitude of the  
ripple in the output voltage is determined by the frequency and duty factor of the  
converter, the output current level, and the value and ESR of the output capacitor.  
9. Limiting values  
Table 4:  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Voltages  
Conditions  
Min  
Max  
Unit  
[1]  
[1]  
VCC  
VRC  
supply voltage  
continuous  
0.4  
0.4  
0.4  
+40  
+3  
V
V
V
oscillator input voltage  
VSOURCE DMOS power transistor source  
voltage  
+5  
VDRAIN  
DMOS power transistor drain  
voltage  
0.4  
+650  
V
Currents  
IREG  
[2]  
[2]  
regulation input current  
-
6
mA  
mA  
mA  
IAUX  
auxiliary winding input current  
10  
3  
+5  
-
IRC  
oscillator capacitor charge  
current  
ISOURCE  
IDRAIN  
General  
Ptot  
source current  
drain current  
0.25 +0.25  
0.25 +0.25  
A
A
total power dissipation  
storage temperature  
Tamb < 45 °C  
-
1.0  
W
Tstg  
55  
20  
20  
+150  
+85  
°C  
°C  
°C  
Tamb  
Tj  
ambient temperature  
junction temperature  
+145  
[3]  
[4]  
Vesd  
electrostatic discharge voltage  
human body model  
pin DRAIN  
1500 +1500  
2000 +2000  
V
V
all other pins  
machine model  
all pins  
200  
+200  
V
[1] Pins VCC and RC are not allowed to be current driven.  
[2] Pins REG and AUX are not allowed to be voltage driven.  
[3] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kseries resistor.  
[4] Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 series  
resistor.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
8 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
10. Thermal characteristics  
Table 5:  
Symbol  
Rth(j-a)  
Thermal characteristics  
Parameter  
Conditions  
Typ  
Unit  
[1]  
thermal resistance from junction in free air  
to ambient  
100  
K/W  
[1] Thermal resistance Rth(j-a) can be lower when pin GND is connected to sufficient copper area on the  
printed-circuit board. See the TEA152x application notes for details.  
11. Characteristics  
Table 6:  
Characteristics  
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into  
the IC; unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Supplies  
Supply on pin VCC  
VCC(start)  
VCC(stop)  
ICC(operate)  
ICC(startup)  
ICC(ch)  
start voltage  
9
9.5  
7.5  
1.3  
180  
10  
V
stop voltage  
undervoltage lock-out  
normal operation  
start-up  
7.0  
8.0  
1.9  
400  
V
operating supply current  
start-up supply current  
charging current  
-
-
mA  
µA  
VDRAIN > 60 V  
VCC = 0 V  
650  
375  
520  
275  
390  
175  
µA  
µA  
VCC = 8.5 V  
Supply on pin DRAIN  
IDRAIN  
supply current drawn from pin DRAIN  
no auxiliary supply  
-
-
0.5  
30  
-
mA  
with auxiliary supply;  
VDRAIN > 60 V  
125  
µA  
Pulse width modulator mode  
δmin  
minimum duty factor  
maximum duty factor  
-
-
0
-
-
%
%
δmax  
fosc = 100 kHz  
75  
Self oscillating power supply mode  
Vdemag demagnetization recognition voltage  
50  
100  
1.5  
150  
2.0  
mV  
level  
tsuppr  
time of suppression of transformer  
ringing at start of secondary stroke  
1.0  
µs  
Oscillator: pin RC  
VRC(min) minimum voltage of RC oscillator  
60  
75  
90  
mV  
V
setting  
VRC(max)  
maximum voltage of RC oscillator  
setting  
2.4  
2.5  
2.6  
tRC(ch)  
fosc  
RC charging time  
-
1
-
-
µs  
oscillator frequency range  
10  
200  
kHz  
Duty factor regulator: pin REG  
VREG  
input voltage on pin REG  
2.4  
2.5  
2.6  
V
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
9 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
Table 6:  
Characteristics …continued  
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into  
the IC; unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
20  
-
Max  
-
Unit  
dB  
V
GV(erroramp)  
VREG(clamp)  
voltage gain of error amplifier  
clamping voltage on pin REG  
-
-
IREG = 6 mA  
7.5  
Valley switching recognition  
dV/dtvalley  
fvalley  
valley recognition  
102  
200  
-
-
+102  
800  
-
V/µs  
kHz  
ns  
ringing frequency for valley switching  
N × Vo = 100 V  
550  
150  
td(valley-on)  
delay from valley recognition to  
switch-on  
Output stage (FET)  
IL(drain)  
VBR(drain)  
RDSon  
drain leakage current  
VDRAIN = 650 V  
Tj > 0 °C  
-
-
-
125  
-
µA  
drain breakdown voltage  
650  
V
drain-source on-state resistance  
ISOURCE = 0.06 A  
Tj = 25 °C  
-
-
-
48  
68  
75  
55.2  
78.2  
-
Tj = 100 °C  
tdrain(f)  
drain fall time  
VDRAIN(switch_on) = 300 V;  
no external capacitor at pin  
DRAIN  
ns  
Temperature protection  
Tprot(max) maximum threshold temperature  
Tprot(hys) threshold temperature hysteresis  
Overcurrent and short winding protection: pin SOURCE  
Vsource(max) overcurrent protection voltage dV/dt = 0.1 V/µs  
Vswp short winding protection voltage  
150  
-
160  
2
170  
-
°C  
°C  
0.47  
0.7  
-
0.50  
0.75  
160  
0.53  
0.8  
V
dV/dt = 0.5 V/µs  
dV/dt = 0.5 V/µs  
V
td(propagation) delay from detecting Vsource(max) to  
switch-off  
185  
ns  
tleb  
leading edge blanking time  
both overcurrent and short  
winding protection  
250  
350  
450  
ns  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
10 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
12. Application information  
LF  
D5  
C5  
V
Z1  
D1  
o
CF1  
CF2  
mains  
D2  
R1  
R2  
C
VCC  
V
CC  
DRAIN  
1
2
8
7
C6 - Ycap  
GND  
RC  
n.c.  
R
RC  
TEA1620P  
3
R
I
SOURCE  
6
R4  
R3  
R
AUX  
C
RC  
REG  
AUX  
4
5
col008  
Further application information can be found in the TEA152x application notes.  
Fig 5. Application with primary sensing.  
13. Test information  
13.1 Quality information  
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
11 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
14. Package outline  
DIP8: plastic dual in-line package; 8 leads (300 mil)  
SOT97-1  
D
M
E
A
2
A
A
1
L
c
w M  
Z
b
1
e
(e )  
1
M
H
b
b
2
8
5
pin 1 index  
E
1
4
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
2
(1)  
(1)  
1
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.14  
0.53  
0.38  
1.07  
0.89  
0.36  
0.23  
9.8  
9.2  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
1.15  
0.068 0.021 0.042 0.014  
0.045 0.015 0.035 0.009  
0.39  
0.36  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.045  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT97-1  
050G01  
MO-001  
SC-504-8  
Fig 6. Package outline.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
12 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
15. Soldering  
15.1 Introduction to soldering through-hole mount packages  
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account  
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages  
(document order number 9398 652 90011).  
Wave soldering is the preferred method for mounting of through-hole mount IC packages  
on a printed-circuit board.  
15.2 Soldering by dipping or by solder wave  
Driven by legislation and environmental forces the worldwide use of lead-free solder  
pastes is increasing. Typical dwell time of the leads in the wave ranges from  
3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or  
Pb-free respectively.  
The total contact time of successive solder waves must not exceed 5 seconds.  
The device may be mounted up to the seating plane, but the temperature of the plastic  
body must not exceed the specified maximum storage temperature (Tstg(max)). If the  
printed-circuit board has been pre-heated, forced cooling may be necessary immediately  
after soldering to keep the temperature within the permissible limit.  
15.3 Manual soldering  
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the  
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is  
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
15.4 Package related soldering information  
Table 7:  
Suitability of through-hole mount IC packages for dipping and wave soldering  
methods  
Package  
Soldering method  
Dipping  
suitable  
Wave  
suitable[1]  
DBS, DIP, HDIP, RDBS, SDIP, SIL  
PMFP[2]  
not suitable  
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit  
board.  
[2] For PMFP packages hot bar soldering or manual soldering is suitable.  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
13 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
16. Revision history  
Table 8:  
Revision history  
Document ID  
Release date Data sheet status  
20040317 Product data  
Change notice Order number  
9397 750 12577  
Supersedes  
TEA1620P_1  
-
-
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
14 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
17. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
performance. When the product is in full production (status ‘Production’),  
18. Definitions  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
20. Trademarks  
STARplug — is a trademark of Koninklijke Philips Electronics N.V.  
EZ-HV — is a trademark of Koninklijke Philips Electronics N.V.  
19. Disclaimers  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
21. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
9397 750 12577  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 17 March 2004  
15 of 16  
TEA1620P  
Philips Semiconductors  
STARplugTM  
22. Contents  
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
8
8.1  
8.2  
8.3  
8.4  
8.5  
8.6  
8.6.1  
8.6.2  
8.6.3  
8.6.4  
8.7  
8.7.1  
8.7.2  
8.7.3  
8.7.4  
Functional description . . . . . . . . . . . . . . . . . . . 4  
Start-up and undervoltage lock-out . . . . . . . . . 4  
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Duty factor control. . . . . . . . . . . . . . . . . . . . . . . 5  
Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 5  
Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7  
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Overcurrent protection . . . . . . . . . . . . . . . . . . . 7  
Short winding protection. . . . . . . . . . . . . . . . . . 7  
Overtemperature protection . . . . . . . . . . . . . . . 7  
Overvoltage protection . . . . . . . . . . . . . . . . . . . 7  
Characteristics of the complete power-plug . . . 7  
Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 9  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Application information. . . . . . . . . . . . . . . . . . 11  
Test information. . . . . . . . . . . . . . . . . . . . . . . . 11  
Quality information . . . . . . . . . . . . . . . . . . . . . 11  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12  
10  
11  
12  
13  
13.1  
14  
15  
15.1  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Introduction to soldering through-hole mount  
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Soldering by dipping or by solder wave . . . . . 13  
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13  
Package related soldering information . . . . . . 13  
15.2  
15.3  
15.4  
16  
17  
18  
19  
20  
21  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Contact information . . . . . . . . . . . . . . . . . . . . 15  
© Koninklijke Philips Electronics N.V. 2004  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 17 March 2004  
Document order number: 9397 750 12577  
Published in The Netherlands  

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