TEA6101T/N2,112 [NXP]
IC SPECIALTY CONSUMER CIRCUIT, PDSO20, Consumer IC:Other;
| 型号： | TEA6101T/N2,112 |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY CONSUMER CIRCUIT, PDSO20, Consumer IC:Other 光电二极管 商用集成电路 |
| 文件： | 总13页 (文件大小：70K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TEA6101/T
Antenna diversity circuit
May 1992
Objective specification
File under Integrated circuits, IC01
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
FEATURES
GENERAL DESCRIPTION
• Ability to switch between up to four antennae
Intended for multi-antenna FM car radio reception
(antenna diversity system), the TEA6101/T selects the
most favourable signal from one of up to four antennae.
Founded upon audible signal disturbance the criteria are
derived from two signals: high frequency components (e.g.
spikes due to noise and multipath reception) and
variations in signal level as a result of multipath reception
or fluctuations in field strength.
• Switching signal derived from two signals: the audio and
the level signals
• Floating switching threshold adjusts switching rate to
prevailing circumstances:
– increasing threshold due to excessive noise
– increasing threshold due to numerous level variations
• Memory for the most favourable antenna signal to
overcome unnecessary switching
• Signal-dependent `soft` muting circuit
• Mode selection to the first antenna receiving an AM
signal whilst the diversity system is reset.
APPLICATIONS
• Car radio receivers
• Mobile radio communications equipment
QUICK REFERENCE DATA
SYMBOL
VP
PARAMETER
MIN.
TYP.
8.5
MAX.
UNIT
positive supply voltage
positive supply current
−
−
−
−
−
−
−
3
7
−
V
IP
14
−
mA
V
VI(p-p)
Ios
audio input voltage (peak-to-peak value)
antenna switch output current (source/sink)
−3 dB audio attenuation (soft mute)
−
mA
V
VL
1.45
−
Tamb
operating ambient temperature range
−30
+85
°C
ORDERING INFORMATION
EXTENDED TYPE NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
SOT102(1)
SOT163A(2)
TEA6101
18
20
DIL
SO
plastic
plastic
TEA6101T
Notes
1. SOT102-1; 1996 September 10.
2. SOT163-1; 1996 September 10.
May 1992
2
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supply
reference
voltage
0.1 µF
not connected
noise
averaging
modulus output
8
audio output
ground
20
11
10
ADDER
13
9
1
4
3.6 V
20
kΩ
MEMORY
LOAD
V
audio input
U
HIGH - PASS
FILTER
STABILIZER
OFFSET
12
kΩ
V
V
1.5
kΩ
ref
I
3
R1
V
(min)
0.47
µF
VOLTAGE
REFERENCE
ADDER
ADDER
offset
voltage
COMPARATOR
LOW - PASS
FILTER
delay soft mute
MUTE
7
33
nF
ADDER
19
18
17
16
to
4 - STAGE
JOHNSON
COUNTER
level input direct
5
antenna
switch
&
level input
via
capacitor
3.3
kΩ
6
MONOSTABLE
MULTIVIBRATOR
ADDER
&
&
&
1
µF
1
3.3
nF
20
kΩ
offset
complete
stop
reset
offset
voltage
ADDER
MODE SELECT
TIMING
100 Ω
VOLTAGE
REFERENCE
R3
TEA6101T
&
kΩ
1.5 kΩ
33
reset
R2
14
12
15
2
MBA543 - 1
level
averaging
memory
timing
1 µF
47 nF
test pin
control
Fig.1 Block diagram.
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Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
PINNING
The pin numbers given in parenthesis refer to the
TEA6101
SYMBOL
VP
PIN
(1)
DESCRIPTION
positive supply
handbook, halfpage
1
V
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
11
GND
OUT1
OUT2
OUT3
OUT4
MT
P
CTRL
AUDIN
AUDOUT
LID
2
(2)
control input
audio input
CTRL
3
(3)
AUDIN
4
(4)
audio output
level input direct
level input via capacitor
delay soft mute
modulus output
reference voltage
not connected
not connected
test pin
AUDOUT
LID
5
(5)
LIC
6
(6)
TEA6101T
DSM
7
(7)
LIC
MODOUT
Vref
8
(8)
DSM
LEAV
9
(9)
MODOUT
NOAV
TEST
n.c.
n.c.
10
11
12
13
14
15
16
17
18
19
20
−
V
REF
n.c.
−
n.c. 10
TEST
NOAV
LEAV
MT
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
(18)
MBA542 - 1
noise averaging
level averaging
memory timing
output 4
Fig.2 Pin configuration (TEA6101T).
OUT4
OUT3
OUT2
OUT1
GND
output 3
output 2
output 1
ground
handbook, halfpage
V
1
2
3
4
5
6
7
8
9
18 GND
17
P
CTRL
AUDIN
AUDOUT
LID
OUT1
16 OUT2
15 OUT3
14 OUT4
13 MT
TEA6101
LIC
DSM
LEAV
12
11 NOAV
TEST
MODOUT
V
10
REF
MBA541 - 1
Fig.3 Pin configuration (TEA6101).
May 1992
4
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
This will result in more frequent switching to an alternative
antenna whilst the result of the switching operation will be
less audible.
FUNCTIONAL DESCRIPTION
Various forms of disturbance can affect signal reception in
car radio receivers:
• ignition interference produces spikes on the audio
signal. Switching to another antenna will be ineffective.
Strong ignition interference, however, will modulate the
antenna field strength. In this instance another antenna
possessing a directional pattern will suffer less
Detection of voltage level variation
A 1 µF input capacitor and 20 kΩ resistor remove the
absolute level voltage to leave only variations to be
detected. The level comparator output is HIGH when the
variations in level voltage are greater than the offset.
Similarly to the audio comparator; the feedback diode,
resistor R2, the 1 µF capacitor and the 33 kΩ resistor
cause the threshold level to float. During periods of high
activity the comparator thus switches only on the largest
variations.
disturbance and switching would be appropriate.
• variation of antenna field strength due to travelling
through a zone of variable signal strength will result in a
variation in the signal level. Greater noise will be
apparent on the audio signal whilst the IF limiter is not
limiting. Switching to an alternative antenna input would
increase the signal strength.
Switching to an alternative antenna
• multipath reception occurs when a signal reaches the
antenna from two or more directions. Often the signals
will be of different phase. In certain circumstances the
sum of the reflected signals results in zero and a large
spike will be evident on the audio signal. It will then be
necessary to switch to an alternative antenna from
which the sum of the received signals will be different.
When both the level and the audio comparator outputs are
HIGH, another output of the Johnson counter will be
selected. Since switching to an alternative antenna would
cause a disturbance of the audio and level signals the
monostable multivibrator will prohibit the counter from
selecting another antenna input for 21 µs.
The criteria for an antenna diversity system are high
frequency components (spikes and noise) on the audio
signal in combination with variations in signal level.
Memory and timing
Approximately similar qualities of signal originating from
different antennae could result in unnecessary antenna
switching. This is prevented by appointing a priority
antenna. The selection of an antenna without priority
results in the audio offset being decreased by 1.2 V such
that the audio comparator will have a HIGH output voltage.
During the period of memory timing the offset increases
towards the normal offset value. Should level alterations
occur during this period another antenna will be selected.
If, however, the memory is timed-out without the
Detection of spikes on the audio signal
A rectifier, high pass filter, low pass filter and a comparator
are used to detect spikes and noise on the audio signal
(see Fig.1). The negative spikes are detected by the
rectifier whilst a high pass filter removes the audio signal
to leave the high frequency signal components at the
negative input to the comparator. The signal at the positive
input to the comparator consists of an offset together with
an audio signal attenuated by the low pass filter. If the
amplitude of the spikes exceed that of the attenuated
audio plus offset, the output of the comparator is HIGH.
occurrence of signal variation, priority will be appointed to
the selected antenna. Thus a priority antenna will be
selected for the majority of the time during reception of
almost all similarly weak antenna signals.
When the switching rate of the comparator is HIGH,
feedback increases the offset via the diode, the resistor
R1, and the 100 nF capacitor. The offset is decreased by
the 12 kΩ resistor and the 100 nF capacitor (pin 11 or 13).
The result is an offset based upon the comparator
switching rate, rapid to increase but slow to decrease,
therefore permitting only the largest spikes to trigger the
comparator (floating threshold).
Mute
A mute function should not precede the circuit. This
function is therefore assumed by the TEA6101. When
used in combination with the TEA6100 the 20 kΩ input of
the IF IC together with the 6 kΩ output resistor of the
TEA6101 cause an attenuation of 3 dB. The mute circuit
therefore has 3 dB amplification of level voltages in excess
of 2.75 V.
Should high noise be apparent on the audio signal, the
offset is decreased by means of the rectifier and high pass
filter.
May 1992
5
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
Mode selection
Test pin
The diversity system is intended for FM reception. To
avoid an audible disturbance if it is used with an AM
system, the circuit can be reset. In the reset mode antenna
1 (pin 17 (19)) is selected and both comparators are
switched off to prevent pulses reaching the output.
Although intended for test purposes the test pin can be
used to increase the audio offset (resistor from pin 10 (12)
to ground) or to change the compensation factor (resistor
between pin 8 (8) and 10 (12)). These modifications permit
the behaviour of the antenna switch to be adapted to
alternative IF amplifier IC's.
For FM search tuning the diversity system may be similarly
disabled. The selected antenna will again be retained with
the comparators being inhibited.
LIMITING VALUES
In accordance with the absolute maximum system (IEC 134)
SYMBOL
PARAMETER
positive supply voltage
MIN.
MAX.
UNIT
VP
0
12
V
Ptot
total power dissipation
−
see Fig.3
+85
Tamb
Tstg
operating ambient temperature range
storage temperature range
−30
−55
°C
°C
+150
THERMAL RESISTANCE
SYMBOL
PARAMETER
THERMAL RESISTANCE
75 K/W
150 K/W
Rth c-a
Rth c-a
from crystal to ambient (SOT102)
from crystal to ambient (SOT163A)
May 1992
6
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
DC CHARACTERISTICS
Measurements using application circuit (Fig 1) at Tamb = 25 °C and VP = 8.5 V. Voltages with respect to pin 18 (20); pin
numbers in parenthesis refer to TEA6101T; all currents positive into the IC unless otherwise specified.
SYMBOL
VP
PARAMETER
positive supply voltage
positive supply current
total power dissipation
voltage at pin:
CONDITION
MIN.
7.5
TYP.
8.5
MAX.
12
UNIT
V
IP
ISO = 0 mA
−
−
14
−
−
mA
Ptot
Vpins
119
mW
1
(1)
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
8.5
7.8
3.6
5.4
0
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
V
V
V
V
V
V
V
V
V
2
(2)
3
(3)
4
(4)
5
(5)
6
(6)
5.3
0.6
5.2
5.4
n.c.
n.c.
5.1
5.4
5.3
0
7
(7)
8
(8)
9
(9)
−
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
(18)
(19)
(20)
−
10
11
12
13
14
15
16
17
18
V
V
V
V
V
V
V
V
V
0
0
0
7.5
0
May 1992
7
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
AC CHARACTERISTICS
VP = 8.5 V; Tamb = 25 °C; unless otherwise specified
SYMBOL
Mute
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
SOFT MUTE (VL)
ZI
input impedance (pin 3 (3))
mute range
−
20
−
−
−
2
kΩ
MR
note 1
17
−
19.3
2.7
V
Vaud/VI
mute gain
VL = 2.75 V
VL = 1.45 V
dB
dB
−1
0.6
HARD MUTE (VMUTE
)
Vmute
+Im
−60 dB output attenuation
mute ON sink current
mute `OFF` source current
total harmonic distortion
audio input voltage
−
−
3
−
−
455
370
−
−
−
−
−
−
mV
µA
µA
%
Vmute = 1 V, VL = 0 V
Vmute = 0 V
−Im
THD
VI(p-p)
Vi = 200 mV; VL = 2.5 V
THD > 10%
0.09
3
V
(peak-to-peak value)
(S+N)/N
Vaud/Vp
signal-to-noise ratio; measured with
dB(A) curve
V
aud = 600 mV; 1 kHz;
−
95
32
5.3
−
−
−
dB
dB
V
VL = 3 V
ripple rejection
note 2; 300 Hz; 100 mV;
VL = 2.5 V
28
−
Vref
output reference voltage
Voff1
audio comparator offset voltage
Voff1 = Vmin − Vap
with priority
with no priority
Vt = 0 V
−
+250
−
mV
−
−
−1100
−348
−
−
mV
mV
Vt = 3 V
Level comparator
V
ref−Vil
voltage for high comparator output
−
56
21
−
mV
t
monostable multivibrator time
period
started with both
comparator outputs HIGH
16
28
µs
Timing/memory
−It
Ct
Tt
source current
−
−
−
−
−
30
−
−
µA
nF
ms
mA
V
value delay capacitor
timing duration
50
−
Ct = 47 nF
Vt = 3 V
6
+It
Vt
reset current
17.7
3.7
−
change of priority antenna
−
Antenna switch outputs
−Ios
output source current
output sink current
−
−
−
−
7
7
mA
mA
+Ios
May 1992
8
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VSO
selected output voltage
I
SO = −10 mA
VP−2 V
VP−1 V
−
−
−
−
V
I
SO = 0.5 mA
V
VNSO
not selected output voltage
I
SO = +10 mA
SO = 0 mA
−
−
−
−
0.7
0.1
V
V
I
Mode selection
ENABLE
Vr
all functions active
input current
−
−
−
−
1
V
−Ir
Vr = 1 V
12
µA
RESET (ACTIVE AT OPEN INPUT)
Vr
voltage at first antenna
(pin 17 (19))
4.2
1.6
−
−
VP
V
V
STOP
Vr
keep selected antenna voltage
3.5
Notes to the AC characteristics
V
aud (aVL = 2.75V)
-----------------------------------------------------
aud (aVL = 0.1V)
1.
V
2. When VP (pin 1 (1)) is filtered with R = 25 Ω and C = 100 µF the ripple rejection becomes 46 dB
MBA540 - 1
2.0
handbook, halfpage
P
tot
(W)
1.5
(1)
1.0
(2)
0.5
0
25
25
75
125
175
( C)
0
o
T
amb
(1) SOT102
(2) SOT163A
Fig.4 Derating curve.
May 1992
9
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
PACKAGE OUTLINES
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
18
10
M
H
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
0.85
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
0.15
0.13
0.32
0.31
0.37
0.33
inches
0.19
0.020
0.15
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-10-14
95-01-23
SOT102-1
May 1992
10
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
May 1992
11
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
May 1992
12
Philips Semiconductors
Objective specification
Antenna diversity circuit
TEA6101/T
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 1992
13
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