TEA6810V [NXP]
Front-end and PLL synthesizers for car radios; 前端和PLL合成器的汽车收音机
| 型号： | TEA6810V |
| 厂家： | 
NXP |
| 描述： | Front-end and PLL synthesizers for car radios |
| 文件： | 总24页 (文件大小：196K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TEA6810V; TEA6811V
Front-end and PLL synthesizers for
car radios
1996 Jun 18
Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
FEATURES
• Synthesizer function which includes a Voltage
Controlled Oscillator (VCO), dividers, phase detector,
charge-pump and in-lock detector
• FM mixer with AGC
• AM RF amplifier with AGC
• AM mixer.
Minimum alignments are required due to wideband RF
inputs and the common AM/FM VCO.
High dynamic behaviour and minimum distortion is
obtained by a special RF input design combined with AGC.
High sensitivity is possible in combination with RF input
FETs.
APPLICATIONS
• Car radios.
GENERAL DESCRIPTION
Minimum interference is experienced due a to special
synthesizer loop design and ensuring that the I2C-bus is
inoperative in the locked-tuned condition.
The TEA6810V and TEA6811V, together with TEA6821V
forms an AM/FM receiving concept for electronically tuned
car radios.
The reference frequency for the synthesizer and the
I2C-bus information is delivered by the TEA6821V.
The TEA681xV is an FM/AM front-end with one local
synthesized oscillator for both AM and FM which is used
together with the TEA6821T in a double-conversion
concept. It delivers a first FM-IF of 72.2 MHz and, for
MW/LW, a first AM-IF of 10.7 MHz.
The programmable local/dx switch enables switching the
gain of the FM mixer from normal AGC control (FM dx) to
the forced 4th level of AGC (FM local).
QUICK REFERENCE DATA
SYMBOL
VCCA1
PARAMETER
CONDITIONS
MIN.
4.75
TYP.
5.0
MAX.
5.25
UNIT
analog supply voltage (pin 2)
analog supply voltage (pin 13)
AM AGC range
V
V
V
VCCA2
VAMant
VFMant
fAMant
fFMant
Tamb
8.1
0.3
10
8.5
−
8.9
6.0
600
22
see Fig.4
see Fig.5
FM AGC range
−
mV
AM input frequency
0.144
60
−
MHz
MHz
°C
FM input frequency
−
108
+85
operating ambient temperature
−40
−
ORDERING INFORMATION
PACKAGE
DESCRIPTION
plastic very small outline package; 40 leads
plastic very small outline package; 40 leads; face down
TYPE
NUMBER
NAME
VERSION
SOT158-1
SOT158-2
TEA6810V
TEA6811V
VSO40
VSO40
1996 Jun 18
2
a
V
OSCFDB
OSCGND
FMRFIN
IPIDIO FMRFIP
FMIFOP
AMAGCC
AMSB2
AMPREI
26
CCOSC
38
OSCTNK
35 37
FMAGC
ref
FMIFON
11
FMAGCC
AMPREC
AMSB1
24
36
34
32
30
31
12
33
27
28
25
FM
22
AM/FM
OSCILLATOR
PIN DIODE
DRIVER
AMPREO
AM
RF
AM/FM
N2
AM/FM
BUFFER
BUFFER
39
V
AM/FM
AM
TUNE
CHARGE
PUMP
TEA6810V
TEA6811V
40
CHPOUT
18
19
AMMIN
3
LOCK
DETECTOR
LCKDET
AM/FM
13
14
V
BAND
GAP
PROGRAMME
DIVIDER N1
CCA2
2
PHASE DETECTOR
I C-BUS CONTROL
V
ref
AGND2
1
6
7
2
17
n.c.
23
n.c.
10
n.c.
20
n.c.
5
4
8
9
15 16
AMMON
21
29
f
f
V
refP CCA1
SCL
SDA
V
CCD
refN
DGND
AGND1
MGE727
AMMGND RFGND
AMMOP
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
PINNING
PIN(1)
SYMBOL
DESCRIPTION
TEA6810
TEA6811
AGND1
VCCA1
1
1
analog ground 1
2
2
analog supply voltage 1 (+5 V)
LCKDET
SDA
3
3
lock detector flag
4
4
serial data input/output; I2C-bus
serial clock input; I2C-bus
reference frequency input from TEA6821 N-terminal
reference frequency input from TEA6821 P-terminal
digital ground
SCL
5
5
frefN
6
6
frefP
7
7
DGND
VCCD
8
8
9
9
digital supply voltage (+5 V)
not connected
n.c.
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
FMIFON
FMIFOP
VCCA2
FM mixer negative output (72.2 MHz)
FM mixer positive output (72.2 MHz)
analog supply voltage 2 (+8.5 V)
analog ground 2
AGND2
AMMOP
AMMON
n.c.
AM mixer positive output (10.7 MHz)
AM mixer negative output (10.7 MHz)
not connected
AMMIN
Vref
AM mixer RF input
reference voltage output from AM band gap
not connected
n.c.
AMMGND
AMPREO
n.c.
AM mixer ground
AM preamplifier output
not connected
AMSB1
AMSB2
AMPREI
AMAGCC
AMPREC
RFGND
FMRFIP
FMRFIN
IPIDIO
FMAGCC
FMAGCref
OSCFDB
OSCGND
OSCTNK
AM feedback switch SB1
AM feedback switch SB2
AM preamplifier input
AM AGC capacitor
AM preamplifier decoupling capacitor
RF ground
RF positive input for FM mixer
RF negative input for FM mixer
pin diode drive
FM AGC integrating capacitor
FM AGC reference voltage
oscillator feedback input
oscillator ground
oscillator tank output
1996 Jun 18
4
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
PIN(1)
SYMBOL
DESCRIPTION
TEA6810
TEA6811
VCCOSC
VTUNE
38
39
40
38
39
40
oscillator supply voltage (+8.5 V)
tuning voltage
CHPOUT
charge pump output
Note
1. Pins 10, 17, 20 and 23 should be connected to a common ground.
1996 Jun 18
5
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
handbook, halfpage
handbook, halfpage
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
1
2
CHPOUT
AGND1
1
2
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
AGND1
CHPOUT
V
V
V
V
TUNE
CCA1
CCA1
TUNE
3
V
LCKDET
SDA
3
LCKDET
SDA
V
CCOSC
CCOSC
4
OSCTNK
OSCGND
OSCFDB
4
OSCTNK
OSCGND
5
SCL
5
SCL
f
6
f
6
OSCFDB
FMAGC
refN
refN
FMAGC
ref
f
7
f
7
refP
ref
refP
8
FMAGCC
IPIDIO
DGND
8
DGND
FMAGCC
IPIDIO
V
V
9
9
CCD
CCD
10
11
12
13
14
15
16
17
18
19
20
FMRFIN
FMRFIP
RFGND
AMPREC
AMAGCC
AMPREI
AMSB2
AMSB1
n.c.
n.c.
10
11
12
13
14
15
16
17
18
19
20
n.c.
FMIFON
FMIFOP
FMRFIN
FMRFIP
RFGND
AMPREC
AMAGCC
AMPREI
AMSB2
AMSB1
n.c.
TEA6811V
TEA6810V
FMIFON
FMIFOP
V
V
CCA2
CCA2
AGND2
AMMOP
AMMON
n.c.
AGND2
AMMOP
AMMON
n.c.
AMMIN
AMMIN
V
V
AMPREO
AMMGND
AMPREO
AMMGND
ref
ref
n.c.
n.c.
MGE726
MGE725
Fig.2 Pin configuration (TEA6810).
Fig.3 Pin configuration (TEA6811).
1996 Jun 18
6
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
I2C-BUS ORGANIZATION
The TEA6810V; TEA6811V is controlled via the I2C-bus which is driven from the TEA6821V. For programming purposes
a module address and four data bytes are required. When used partially, the transmission must be ended by a stop
condition.
Table 1 Bit organization
MODULE
ADDRESS
PROGRAMMABLE
DIVIDER DATA
SWITCH
CONTROL
START
TEST
STOP
S
byte 0
A
byte 1
A
byte 2
A
byte 3
A
byte 4
A
P
Table 2 I2C-bus address and received bytes
BUS ADDRESS
BYTES TO
BE
RECEIVED
MSB
LSB
(4 BYTES)
1
1
0
0
0
1
0
0
Byte 1(1)
S7
S6
S5
S4
S3
S2
S1
S0
program
divider N1
(Low byte)
Byte 2(1)
S15
S14
S13
S12
S11
S10
S9
S8
program
divider N1
(High byte)
Byte 3
switching
MSB in-lock
counter
LSB in-lock
counter
1 = HIGH 1 = HIGH
1 = FM
local
0 = FM dx
MSB
divider
N2
LSB divider 1 = FM
0 = LOW
current
0 = LOW
current
charge
pump
N2
0 = AM
tuning
oscillator
Byte 4
testing
1 = 3-state
0 = normal
1 = fdiv
0 = LCKDET 0 = normal
1 = test
X(2)
X
X
X
X
charge pump
in-lock
counter
Notes
1. N1 divider ratio is (N + 2); where N is the programmed binary number composed of bytes 1 and 2. For the minimum
ratio; if N < 2048 then N1 divider ratio is {2048 + (N − 2)}.
2. X = don’t care.
Table 3 N2 divider
Table 4 In-lock
N2 DIVIDER
MSB
LSB
IN-LOCK
MSB
LSB
AM/FM
3
5
0
0
1
1
0
1
0
1
8
0
1
1
0
0
0
0
1
0
1
FM
AM or FM
AM or FM
AM
16
32
48
64
10
15
AM
1996 Jun 18
7
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCCA1
PARAMETER
CONDITIONS
MIN.
−0.3
MAX.
12
UNIT
analog supply voltage (pin 2)
analog supply voltage (pin 13)
digital supply voltage (pin 9)
oscillator supply voltage (pin 38)
maximum power dissipation
storage temperature
V
VCCA2
VCCD
VCCOSC
Ptot
−0.3
−0.3
−0.3
−
12
V
12
V
12
V
0.55
+150
+300
W
°C
V
Tstg
−65
−300
Ves
electrostatic handling
note 1
Note
1. Machine model: equivalent to discharging a 200 pF capacitor through 0 Ω.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
thermal resistance from junction to ambient in free air
90
K/W
DC CHARACTERISTICS
V13 = V38 = 8.5 V; V9 = V2 = 5.0 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
ICCA1
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
analog input current (pin 2)
AM mode
FM mode
AM mode
FM mode
AM mode
FM mode
AM mode
FM mode
7
9
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
6
8
ICCA2
ICCOSC
ICCD
analog input current (pin 13)
oscillator input current (pin 38)
digital input current (pin 9)
17
15
4
22
18
6
6
8
32
27
35
30
−
IAMMO
AM mixer output current (pins 15 and 16) AM mode
8.5
0
FM mode
FM mixer output current (pins 11 and 12) AM mode
FM mode
−
IFMIFO
0
−
10
−
1996 Jun 18
8
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
AC CHARACTERISTICS
All voltage and current values are RMS values; noise values are unweighted within the bandwidth 0.03 to 20 kHz;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
AM signal channel; (note 1; see Fig.4)
RF PREAMPLIFIER STAGE
Z21
transimpedance
40
65
−
kΩ
AGC STAGE; FI2 = 1 MHZ
Vi2
HF input voltage
AGC start level 1
−
−
−
−
−
−
750
850
145
170
1
−
−
−
−
−
−
mV
mV
mV
mV
µA
AGC start level 2
AGC stop level 1
AGC stop level 2
IAGCsink
AGC sink current
V18 = V19 + 0.5 V; V27 = V19
V18 = V19 - 0.5 V; V27 = V19
IAGCsource AGC source current
MIXER (fO = 10.7 MHZ)
2
mA
Ri
input resistance between pins
18 and 21
15(2)
−
20
−
kΩ
Ci
input capacitance between
pins 18 and 21
5
−
pF
Co
output capacitance between
pins 15 and 16
−
−
5(2)
3.1
−
pF
GmC
∆GmC
conversion transconductance
(I15 to I16/V18 to V19
2.4
−
2.75
−0.005
mS
mS/K
variation in conversion
transconductance
IP3
third-order intermodulation
−1 dB compression point
equivalent input noise voltage
130(2)
114(2)
−
137
120
9
−
−
−
dBmV
dBmV
nV/√Hz
CP
Vn(eq)
OSCILLATOR/N2 DIVIDER
RN2
internal divider ratio (N2)
set by I2C-bus; see Table 3
−
−
−
−
15
10
5
−
−
−
−
3
REFERENCE VOLTAGE (PIN 19)
Vo
output reference voltage
−
−
−
2.75
40
−
−
V
Zo
output impedance
−
Ω
Io(max)
maximum output current
0.1
mA
1996 Jun 18
9
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
FM signal channel (note 3; see Fig.5)
MIXER
Ri
input resistance between
pins 30 and 31
1.65(2)
3.4(2)
10
2
4
−
8
−
kΩ
Ci
input capacitance between
pins 30 and 31
4.5(2)
−
pF
kΩ
pF
Ro
Co
Gm
output resistance between
pins 11 and 12
output capacitance between
pins 11 and 12
6.5(2)
9(2)
transconductance
I11 to I12/V30 to V31 < VAGC1
5.5
−
6.3
6.9
−
mS
I11 to I12/V30 to V31 < VAGC2
I11 to I12/V30 to V31 < VAGC3
I11 to I12/V30 to V31 > VAGC3
4.7
mS
−
2.3
−
mS
−
1.0
−
mS
∆GmT
variation in transconductance <VAGC1
with temperature
−
−0.015
−
mS/K
F
noise figure
fi = 72.2 MHz; PLL tuned
−
7(2)
−
dB
(both sidebands)
IP3
third-order intermodulation
−1 dB compression point
1st IF rejection
135(2)
120(2)
25(2)
4.8
−
139
127
30
6.2
15
39
1
−
dBmV
dBmV
dB
CP
−
αIF1
−
VAGC(S)
AGC start voltage between
pins 30 and 31
start level 1
7.8
−
mV
start level 2
mV
start level 3
−
−
mV
VAGC(H)
AGC hysteresis voltage
hysteresis level 1
hysteresis level 2
hysteresis level 3
−
−
mV
−
2
−
mV
−
3
−
mV
R33
Ipin
FM AGC output resistance
pin diode current
−
5
−
kΩ
V32 = 1.4 V
Io = 1 mA
4
−
−
mA
Vpin
start level pin diode voltage
between pins 30 and 31
−
57
−
mV
OSCILLATOR
fosc
oscillator frequency
116.8
−
207
MHz
∆fosc/∆T
oscillator temperature
dependence
−
−90
−
10−6/K
1996 Jun 18
10
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
SYNTHESIZER (see Fig.6)
Reference frequency input (pins 6 and 7)
Vref(p-p)
reference frequency input
voltage (V6 to V7)
(peak-to-peak value)
−
−
0.4
−
V
ttrans
fref
reference frequency transition
time
−
50
ns
input reference frequency for: tuning step (kHz) N2
FM
50
5
−
10
5
−
−
−
−
−
−
−
−
−
−
−
−
−
50
50
50
25
25
15
15
15
10
10
5
−
−
−
−
−
−
−
−
−
−
−
−
−
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
AM standard SW1
AM full-band MW (USA)
FM
10
25
5
−
AM full-band SW1
AM standard MW/LW
AM full-band MW/LW
AM full-band SW2
FM
5
1
15
5
3
5
3
10
1
−
AM standard SW1
AM full-band MW/LW
AM full-band SW1
AM full-band SW2
10
5
1
1
5
5
1
3
5
Phase detector/charge pump
IOL
LOW level output charge
pump current
V40 = 4 V
V40 = 4 V
120
0.85
0.2
175
1
215
1.2
µA
mA
V
IOH
VOL
VOH
HIGH level output charge
pump current
LOW level tuning voltage at
charge pump LOW
IO = 0.5Icharge; V13 = 8.5 V
IO = 0.5Icharge; V13 = 8.5 V
V40 = 4 V
−
8.25
8.0
HIGH level tuning voltage at
charge pump HIGH
0.4
−
V
Ioz
3-state output current
−5
−
+5
16(2)
nA
Hz
∆fr(p-p)
residual FM frequency
(peak-to-peak value)
B = 300 Hz to 20 kHz;
Icharge = IOL; fi = 100 MHz
−
9
tlock
lock time
FM = 88 to 108 MHz
FM = 108 to 88 MHz
AM = 510 to 1710 kHz
AM = 1710 to 510 kHz
−
−
−
−
2
2
2
2
−
−
−
−
ms
ms
ms
ms
1996 Jun 18
11
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Programmable divider
Nmin
Nmax
DR
minimum programmable ratio
−
−
2 050
−
maximum programmable ratio
divider ratio for:
FM
65537
−
tuning step (kHz) N2
50
25
10
5
−
−
2050
−
−
−
−
−
−
−
−
−
−
−
−
−
−
3604
FM
6388
7208
FM
−
15970
31940
10844
3320
18020
36040
12420
4140
FM
−
AM standard MW/LW
AM standard SW1
AM standard SW1
AM full-band MW/LW
AM full-band MW/LW
AM full-band SW1
AM full-band SW1
AM full-band SW2
AM full-band SW2
AM full-band MW (USA)
1
15
10
10
5
5
1
16600
10448
31344
6700
20700
10973
32920
8240
3
1
5
5
5
1
5
33500
8240
41200
10640
53200
3292
5
3
1
3
41200
3172
10
5
In-lock detector (reset by any start condition on I2C-bus)
VOH
in-lock HIGH level output
voltage (pin 3)
4.0
0
−
5.0
0.4
−
V
V
VOL
in-lock LOW level output
voltage (pin 3)
−
td
in-lock delay
counter length = N
−
N × 1⁄fref
ms
Notes
1. fi1 = 1053 kHz; fmod = 400 Hz; m = 0.3; Vi1 = Vi2 = 1 mV; N2 divider switched to divide-by-15.
2. Not measured 100% in production.
3. Vi1 = 1 mV; fi1 = 98 MHz; fmod = 1 kHz; ∆f = ±22.5 kHz.
1996 Jun 18
12
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
10 nF
1 mH
50 Ω
20
kΩ
50
Ω
33 µF
V
V
o1
i2
V
ref
19
18
22
26
24
25
AM/FM
21
BAND
GAP
4.7 nF
50 Ω
50
20 kΩ
10 kΩ
1:1
Ω
16
15
AM
N2
V
i1
10 kΩ
33 µF
200
AM
RF
Ω
V
o2
22
nF
28
TEA6810V
TEA6811V
1.5 µF
27
29
AGC
33 µH
33
V
13 CCA2
8.5 V
100
nF
µF
V
12
CCOSC 38
AM/
FM
8.5 V
1.8 pF
2.7 pF
37
35
36
AM/FM
OSCILLATOR
1 nF
BB515
50
nH
2
AM/
FM
I C BUS
CONTROL
10
kΩ
9
8
4
5
V
MLB828
TUNE
V
CCD
10 kΩ
100 nF
10 kΩ
5 V
SDA SCL
Fig.4 AM test circuit.
13
1996 Jun 18
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
100 nF
75
33
29
TEA6810V
TEA6811V
Ω
V
o3
AGC
FM
11
12
31
30
50 Ω
56
pF
1 kΩ
50
Ω
V
f
V
i1
i1
o1
50 Ω
34
32
PIN
DIODE
DRIVE
1 mH
V
CCA2
100
nF
13
14
8.5 V
33
µF
BUFFER
V
CCOSC
38
37
8.5 V
1.6 pF
1 nF
BB515
50
nH
AM/FM
2.7 pF
35 OSCILLATOR
36
10
kΩ
V
1 Ω
o2
AM/FM
V
TUNE
2
I C BUS
CONTROL
9
8
4
5
MLB829
V
CCD
10 kΩ
100 nF
10 kΩ
5 V
SDA SCL
Fig.5 FM test circuit.
14
1996 Jun 18
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
TEA6810V
TEA6811V
V
CCOSC
38
37
8.5 V
BUFFER
1.8 pF
1 nF
BB515
50
nH
AM/FM
35 OSCILLATOR
2.7 pF
PROGRAM
DIVIDER
N1
2.2
kΩ
V
1 Ω
o1
V
2
CCA1
36
5 V
1.2 kΩ
39
13
V
iref
0.4 V (p p)
10
kΩ
CHARGE
PUMP
PHASE
DETECTOR
120 nF
8 pF
1.2 kΩ
14
1
40
3.6
kΩ
12
nF
3.3
nF
2
LOCK
I C BUS
DETECTOR
CONTROL
9
8
4
5
3
MLB830
V
CCD
10 kΩ
100 nF
10 kΩ
5 V
SDA SCL
Fig.6 Synthesizer test circuit.
15
1996 Jun 18
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
INTERNAL PIN CONFIGURATION
1
AGND1
40
CHPOUT
2
V
CCA1
39
V
TUNE
3
LCKDET
38
V
CCOSC
4
37
TEA6810V
TEA6811V
OSCTNK
SDA
36
OSCGND
35
OSCFDB
5
6
SCL
f
refN
34
FMAGC
ref
7
8
f
refP
33
DGND
FMAGCC
9
V
CCD
10
11
n.c.
32
IPIDIO
FMIFON
12
31
FMIFOP
FMRFIN
13
14
V
CCA2
AGND2
30
FMRFIP
15
16
29
AMMOP
AMMON
RFGND
28
AMPREC
17
18
n.c.
27
AMAGCC
26
AMPREI
25
AMMIN
AMSB2
24
AMSB1
23
n.c.
22
AMPREO
19
20
V
21
ref
AMMGND
n.c.
MGE728
Fig.7 Internal pin configuration.
16
1996 Jun 18
g
V
V
DGND
V
CCA2
CCA1
CCD
LCKDET
SDA
1 mH
1 mH
100 Ω
SCL
47
µF
47
µF
47
µF
47 µF
V
CTC
RTC
RS
SS
9
8
12 nF
1 kΩ
O3
1 kΩ
1 kΩ
10
11
12
7
6
5
4
3
2
1
6.4
470 kΩ
50
kHz
3.3 nF
10 kΩ
100 nF
3.6 kΩ
MHz
O6
1
40
120 nF
1 kΩ
100 kΩ
O4
MR
O8
V
220 nF
2
3
4
5
6
7
8
9
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
TUNE
47 pF
HEF4060B
1 pF
22 kΩ
O5
TR4
13
14
15
16
OSCTNK
12 pF
10 kΩ
10 kΩ
1.8 pF
50 nH
2.2 kΩ
O13
O12
O11
O7
1 kΩ
47 kΩ
1 nF
O9
1 kΩ
1 kΩ
150 nF
V
DD
TR2
TR1
2.7 pF
TR3
FMAGC
ref
120 nF
FMAGCC
IPIDIO
FMIN
12.5 kHz
120 nF
100 nF
4.7
nF
1 nF
1 nF
10
11
12
13
14
15
16
17
18
19
20
TEA6810V
TEA6811V
FMOUT
100 Ω
100 Ω
ANZAC
TP101
50 Ω
ANZAC
TP103
4.7
nF
47 µF
1 kΩ
1 kΩ
100 nF
2.2 µF
AMAGCC
AMPREI
100 Ω
100 Ω
20 kΩ
4.7
nF
50 kΩ
10 µF
ANZAC
TP103
4.7
nF
AMSB2
AMSB1
10 kΩ
10 kΩ
AMOUT
AMMIN
AMPREO
10 nF
1 mH
5 kΩ
47 µF
50 Ω
MGE729
Fig.8 Test board diagram.
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
PACKAGE OUTLINES
VSO40: plastic very small outline package; 40 leads
SOT158-1
D
E
A
X
c
y
H
v
M
A
E
Z
40
21
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
20
w
M
b
p
e
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(2)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
0.3
0.1
2.45
2.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
12.3
11.8
1.7
1.5
1.15
1.05
0.6
0.3
2.70
0.11
0.25
0.762
0.03
2.25
0.089
0.2
0.1
0.1
7o
0o
0.012 0.096
0.004 0.089
0.017 0.0087 0.61
0.012 0.0055 0.60
0.30
0.29
0.48
0.46
0.067 0.045
0.059 0.041
0.024
0.012
inches
0.010
0.008 0.004 0.004
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-24
SOT158-1
1996 Jun 18
18
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
VSO40: plastic very small outline package; 40 leads; face down
SOT158-2
D
E
A
y
X
c
H
v
M
A
E
Z
40
21
L
L
p
θ
Q
A
1
(A )
3
A
A
2
pin 1 index
detail X
1
20
5
w
M
b
p
e
0
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(2)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
0.3
0.1
2.45
2.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
12.3
11.8
1.7
1.5
1.15
1.05
0.6
0.3
2.70
0.11
0.25
0.762
0.03
2.25
0.089
0.2
0.1
0.1
7o
0o
0.012 0.096
0.004 0.089
0.017 0.0087 0.61
0.012 0.0055 0.60
0.30
0.29
0.48
0.46
0.067 0.045
0.059 0.041
0.024
0.012
inches
0.010
0.008 0.004 0.004
Note
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-24
SOT158-2
1996 Jun 18
19
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
SOLDERING
Introduction
Wave soldering
Wave soldering techniques can be used for all VSO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all VSO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1996 Jun 18
20
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Jun 18
21
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
NOTES
1996 Jun 18
22
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
NOTES
1996 Jun 18
23
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 83749, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 805 4455, Fax. +61 2 805 4466
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 926 5361, Fax. +7 095 564 8323
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 615 800, Fax. +358 615 80920
South America: Rua do Rocio 220 - 5th floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970),
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 52 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 648 1007
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com/ps/
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996
SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
517021/02/pp24
Date of release: 1996 Jun 18
Document order number: 9397 750 00916
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