TEF6730HW_技术文档

TEF6730

Front-end for digital-IF car radio

Rev. 01 — 10 July 2006

Product data sheet

1. General description

The TEF6730 is a car radio tuner front-end for digital-IF reception, especially designed for

co-operation with digital-IF DSP back-ends of the SAF773x and SAF778x families.

The FM tuner features single conversion to IF = 10.7 MHz and integrated image rejection;

capable for FM 65 MHz to 108 MHz and weather band reception. The AM tuner features

single conversion to IF = 10.7 MHz with an integrated AM front-end, capable for LW, MW

and full SW reception. A combined AM/FM IF AGC ampliﬁer provides a suitable IF signal

to the ADC in IF DSP.

The device can be controlled via the fast-mode I²C-bus (400 kHz) and includes

autonomous tuning functions for easy control. No manual alignments are required.

2. Features

I FM mixer for conversion of FM RF to IF 10.7 MHz with large dynamic range, high

image rejection and selectable mixer gain

I Selectable high or low injection of LO

I AGC PIN diode drive circuit for FM RF AGC with detection at RF and IF, including

keyed AGC function

I RF input for weather band applications

I Integrated AM front-end LNA

I Integrated AM RF AGC for low desensitization and AGC PIN diode drive circuit with

detection at RF and IF

I AM mixer for conversion of AM RF to IF 10.7 MHz

I AM/FM IF AGC ampliﬁer with large dynamic range, gain controlled from IF DSP

I AM and FM front-end AGC information is available via the I²C-bus

I Low phase noise local oscillator with reliable start-up behavior

I In-lock detection for optimized adaptive PLL tuning speed

I Programmable divider and mixer dividers for reception of FM (65 MHz to 108 MHz),

weather band, AM LW, MW and full SW

I Two antenna DAAs

I Sequential state machine supporting all tuning actions including AFU for RDS

I Interfacing signals for IF AGC, FM keyed AGC, AFU and reference frequency to

IF DSP for optimum system performance

I Software controlled ﬂag outputs

I Selection of four I²C-bus addresses

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

3. Quick reference data

Table 1.

Quick reference data

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol Parameter

Supply voltage

Conditions

Min

Typ

Max

Unit

V_CCA

analog supply voltage

on pins V_CC, V_CC(PLL), V_CC(VCO), V_CC(RF)

,

8

8.5

9

V

V_CC(IF), FMMIXOUT1, FMMIXOUT2,

AMMIXOUT1 and AMMIXOUT2

Current in FM mode

I_CC(tot)

total supply current

-

85.3

-

mA

Current in AM mode

I_CC(tot)

total supply current

114.7

Antenna Digital Auto Alignment (DAA)

DAA1: pin DAAOUT1^[1]

G_conv(DAA)DAA conversion gain

DAA2: pin DAAOUT2^[2]

0.1

0.7

-

2

G_conv(DAA)DAA conversion gain

Reference frequency

1.35

External reference frequency, circuit inputs: pins FREF1 and FREF2

f_extexternal frequency

-

100

-

kHz

Tuning system; see Table 28, Table 29, Table 30 and Table 31

Voltage controlled oscillator

[3]

f_VCO(min)

minimum VCO frequency

-

130

MHz

application according to Figure 25

f_VCO= 200 MHz; ∆f = 10 kHz; Q = 30

Europe FM/US FM band; f_ref= 100 kHz;

-

159.9 MHz

f_VCO(max)maximum VCO frequency

256

94

-

MHz

C/N

carrier-to-noise ratio

98

dBc/√Hz

Timings

t_tune

tuning time

-

0.75

1

ms

f

_RF= 87.5 MHz to 108 MHz

AM MW band; f_ref= 20 kHz;

_RF= 0.53 MHz to 1.7 MHz

cycle time for inaudible AF update

-

10

6.5

f

t_upd(AF)

AF update time

6

including 1 ms mute start and 1 ms mute

release time

AM overall system parameters^[4]

f_i(RF)

RF input frequency

LW

144

522

2.3

-

288

1710

26.1

-

kHz

MHz

µV

MW

SW

-

f_IF

IF frequency

10.7

50

V_sens

sensitivity voltage

(S+N)/N = 26 dB

-

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 1.

Quick reference data …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min

Typ

Max

Unit

V_i(RF)

RF input voltage

start level of wideband AGC

data byte AGC bits WBAGC[1:0] = 00

data byte AGC bits WBAGC[1:0] = 01

data byte AGC bits WBAGC[1:0] = 10

data byte AGC bits WBAGC[1:0] = 11

start level of narrow-band AGC; m = 0

data byte AGC bits NBAGC[1:0] = 00

data byte AGC bits NBAGC[1:0] = 01

data byte AGC bits NBAGC[1:0] = 10

data byte AGC bits NBAGC[1:0] = 11

-

125

100

75

-

mV

35

V_i(RF)M

peak RF input voltage

-

200

170

140

115

152

-

mV

IP2

IP3

second-order intercept point referenced to receiver input

dBµV

third-order intercept point

referenced to receiver input

∆f = 40 kHz

-

130

133

40

-

dBµV

dB

∆f = 100 kHz

α_ripple

ripple rejection

V_CC(ripple)/V_audio; f_ripple= 100 Hz;

V

_CC(ripple)= 10 mV (RMS);

_i(RF)= 1 mV to 1 V

FM overall system parameters^[5]

f_i(RF)

RF input frequency

FM standard

weather band

65

-

108

MHz

162.4

-

162.55 MHz

f_IF

IF frequency

-

10.7

2

-

MHz

µV

V_sens

sensitivity voltage

B_IF= 170 kHz

threshold extension enabled; weak signal

handling enabled (SAF7730 N231)

1.1

µV

V_i(RF)

RF input voltage

start level of wideband AGC

data byte AGC bits WBAGC[1:0] = 00

data byte AGC bits WBAGC[1:0] = 01

data byte AGC bits WBAGC[1:0] = 10

data byte AGC bits WBAGC[1:0] = 11

start level of narrow-band AGC; m = 0

data byte AGC bits NBAGC[1:0] = 00

data byte AGC bits NBAGC[1:0] = 01

data byte AGC bits NBAGC[1:0] = 10

data byte AGC bits NBAGC[1:0] = 11

∆f = 400 kHz

-

19

14

10

7

-

mV

V_i(RF)M

peak RF input voltage

-

17

14

11

9

-

mV

dBµV

dB

IP3

third-order intercept point

ripple rejection

123

64

α_ripple

V_CC(ripple)/V_audio; f_ripple= 100 Hz;

V_CC(ripple)= 10 mV (RMS);

V_i(RF)= 500 µV

n

128

[1] Conversion gain formula of DAA1: V_{DAAOUT 1}

=

1.915 ×

+ 0.1 × V

where n = 0 to 127.

--------

tune

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

n

[2] Conversion gain formula of DAA2: V_{DAAOUT 2}

=

0.693 ×

+ 0.7 × V

where n = 0 to 15.

DAAOUT 1

-----

16

[3] The VCO frequency is determined by the external circuit at pins OSCFDB and OSCTNK.

[4] Based on 15 pF/60 pF dummy aerial, voltages at dummy aerial input, f_mod= 400 Hz, 2.5 kHz audio bandwidth, f_i(RF)= 990 kHz, m = 0.3

and nominal maximum IF AGC gain, unless otherwise speciﬁed.

[5] Based on 75 Ω dummy aerial, voltages at dummy aerial input, f_mod= 400 Hz, de-emphasis = 50 µs, f_i(RF)= 97.1 MHz, ∆f = 22.5 kHz,

nominal mixer gain and nominal maximum IF AGC gain, unless otherwise speciﬁed.

4. Ordering information

Table 2.

Ordering information

Type number Package

Name

Description

Version

TEF6730HW HTQFP64 plastic thermal enhanced thin quad ﬂat package; 64 leads; body 10 x 10 x 1 mm; SOT855-1

exposed die pad

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

4 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

6. Pinning information

6.1 Pinning

1

2

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

AMIFAGCIN

i.c.

FMIFAGCIN1

FMIFAGCIN2

IFAGCDEC

SWDEC

ADDR1

ADDR2

FGND

3

4

5

AFHOLD

AFSAMPLE

SWPORT

6

CFSW1

7

CFSW2

8

FMMIXOUT1

AMMIXOUT2

FMMIXOUT2

AMMIXOUT1

V

CC(VCO)

TEF6730HW

9

OSCTNK

OSCFDB

VCOGND

10

11

12

13

14

15

16

V

CC(PLL)

CC(RF)

V50LNA

LNAIN

CPOUT

VTUNE

KAGC

AGCCNTRL

i.c.

DAAOUT2

001aae089

Fig 2. Pin conﬁguration for HTQFP64

6.2 Pin description

Table 3.

Pin description

Symbol

1

Description

AMIFAGCIN

FMIFAGCIN1

FMIFAGCIN2

IFAGCDEC

SWDEC

IF AGC ampliﬁer AM input (10.7 MHz)

IF AGC ampliﬁer FM input 1 (10.7 MHz)

IF AGC ampliﬁer FM input 2 (10.7 MHz)

IF AGC ampliﬁer AM and FM decoupling

ceramic ﬁlter switch decoupling

ceramic ﬁlter switch 1

2

3

4

5

CFSW1

6

CFSW2

7

ceramic ﬁlter switch 2

FMMIXOUT1

AMMIXOUT2

8

FM mixer IF output 1 (10.7 MHz)

AM mixer IF output 2 (10.7 MHz)

9

TEF6730_1

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 3.

Symbol

Pin description …continued

Description

FM mixer IF output 2 (10.7 MHz)

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

FMMIXOUT2

AMMIXOUT1

V_CC(RF)

AM mixer IF output 1 (10.7 MHz)

AM/FM RF supply voltage

AM LNA supply voltage decoupling

AM LNA input

V50LNA

LNAIN

AGCCNTRL

i.c.

AM LNA AGC pin

internally connected; leave open

AM LNA output

LNAOUT

i.c.

internally connected; leave open

AM LNA AGC decoupling

AM mixer decoupling

LNAAGCDEC

AMMIXDEC

AMMIXIN

TAMAGC

PINAGCDEC

IAMAGC

RFGND

FMMIXIN1

FMMIXIN2

WXMIXIN

WXMIXDEC

IFMAGC

TFMAGC

DAAOUT1

DAAOUT2

KAGC

AM mixer input

AM RF AGC time constant

AM PIN diode AGC decoupling

AGC current for AM PIN diode

RF ground

FM mixer input 1

FM mixer input 2

weather band mixer input

weather band mixer decoupling

AGC current for FM PIN diode

FM RF AGC time constant

antenna DAA output 1

antenna DAA output 2

level input for FM keyed AGC function

tuning voltage input antenna DAA

charge pump output

VTUNE

CPOUT

V_CC(PLL)

VCOGND

OSCFDB

OSCTNK

V_CC(VCO)

SWPORT

AFSAMPLE

AFHOLD

FGND

tuning PLL supply voltage

VCO ground

VCO feedback

VCO tank circuit

VCO supply voltage

software controllable port output

AF sample ﬂag output

AF hold ﬂag output and input

reference frequency ground

address select input 2

ADDR2

ADDR1

address select input 1

i.c.

internally connected; leave open

I²C-bus data line input and output

i.c.

SDA

TEF6730_1

Product data sheet

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 3.

Symbol

SCL

Pin description …continued

Description

51

52

53

54

55

56

57

58

59

60

61

62

63

64

I²C-bus clock line input

DGND

digital ground

FREF1

FREF2

VREF

reference frequency input 1

reference frequency input 2

reference voltage noise decoupling

ground

GND

V_CC

supply voltage (8.5 V)

IFOUT1

IFOUT2

IFAGCMSB

IFAGCLSB

V_CC(IF)

IF AGC ampliﬁer output 1

IF AGC ampliﬁer output 2

MSB input for IF AGC ampliﬁer gain setting

LSB input for IF AGC ampliﬁer gain setting

IF AGC ampliﬁer supply voltage

IF AGC ampliﬁer ground

IFGND

IFAGCBIAS

bias voltage decoupling for IF AGC ampliﬁer

7. Functional description

7.1 FM mixer 1

The FM quadrature mixer converts FM RF (65 MHz to 108 MHz) to an IF frequency of

10.7 MHz. The FM mixer provides high image rejection, a large dynamic range and

selectable mixer gain. The image rejection can be selected between low injection of LO

and high injection of LO via the I²C-bus independently of the band selection. A separate

RF input for weather band is available.

7.2 FM RF AGC

AGC detection at the FM front-end mixer input and the AM/FM IF AGC ampliﬁer input,

both with programmable AGC thresholds. When the threshold is exceeded, the PIN diode

drive circuit sources a current to an external PIN diode circuit, keeping the RF signal level

constant.

Keyed AGC function is selectable via the I²C-bus and uses the in-band level information

from the IF DSP.

The AGC PIN diode drive circuit can optionally deliver a ﬁxed current as a local function.

In AM mode, the AGC PIN diode drive circuit can be set to generate a ﬁxed source current

into the external FM PIN diode circuitry.

7.3 Antenna DAA1 and DAA2

The antenna DAA1 measures the VCO tuning voltage and multiplies it with a factor

deﬁned by the 7-bit DAA1 setting to generate a tuning voltage for the FM antenna tank

circuit. If a second FM tank circuit is applied, the tuning voltage can be derived from the

antenna DAA2 output. The antenna DAA2 measures the output voltage of the antenna

DAA1 and multiplies it with a factor deﬁned by the 4-bit DAA2 setting.

TEF6730_1

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TEF6730

Philips Semiconductors

7.4 AM LNA

Front-end for digital-IF car radio

The AM low noise ampliﬁer is fully integrated.

7.5 AM RF AGC

The AM RF AGC is partially integrated. Detection is at the output of the AM LNA and at

the input of the AM/FM IF AGC ampliﬁer, both with programmable thresholds. First the

integrated AGC reduces the gain of the LNA. After the LNA AGC, the PIN diode AGC

takes over by sinking a current via an external PIN diode.

In FM mode, the AM AGC can be set to a ﬁxed attenuation.

7.6 AM mixer

The large dynamic range AM mixer converts AM RF (144 kHz to 26.1 MHz) to an IF

frequency of 10.7 MHz.

7.7 VCO and dividers

The varactor tuned LC oscillator together with the dividers provides the LO signal for both

AM and FM front-end mixers. The VCO has an operating frequency of approximately

160 MHz to 256 MHz. In FM mode the LO frequency is divided by 2 or 3. These dividers

generate in-phase and quadrature-phase output signals used in the FM front-end mixer

for image rejection. In weather band mode the LO signal is directly phase shifted to

generate the in-phase and quadrature-phase signals. In AM mode the LO frequency is

divided by 6, 8, 10, 16 or 20 depending on the selected AM band.

7.8 Tuning PLL

The tuning PLL locks the VCO frequency divided by the programmable divider ratio to the

reference frequency. Due to the combination of different charge pump signals in the

PLL loop ﬁlter, the loop parameters are adapted dynamically. Tuning to different

RF frequencies is done by changing the programmable divider ratio. The tuning step size

is selected with the reference frequency divider setting.

7.9 AM/FM IF AGC ampliﬁer

The combined AM/FM IF AGC ampliﬁer delivers a suitable IF signal for the ADC in the

IF DSP. The maximum gain of the IF AGC ampliﬁer can be selected via the I²C-bus. The

gain of this ampliﬁer is automatically adapted via interfacing signals from the IF DSP. The

IF AGC ampliﬁer has three signal inputs, two for FM and one for AM. This allows the

application of multiple external ﬁlters, e.g. with different bandwidths.

8. I²C-bus protocol

S

ACK-s

P

SLAVE ADDRESS W

MSA

DATA

data transferred

(n bytes + acknowledge)

001aad051

Fig 3. Write mode

TEF6730_1

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

S

SLAVE ADDRESS R

ACK-s

DATA

ACK-m

DATA

NA

P

data transferred

001aad049

(n − 1 bytes + acknowledge)

Fig 4. Read mode

Table 4.

Description of I²C-bus format

Description

START condition

Code

S

Slave address W

1100 0000b for pin ADDR2 and pin ADDR1 grounded

1100 0010b for pin ADDR2 grounded and pin ADDR1 ﬂoating

1100 0100b for pin ADDR2 ﬂoating and pin ADDR1 grounded

1100 0110b for pin ADDR2 and pin ADDR1 ﬂoating

1100 0001b for pin ADDR2 and pin ADDR1 grounded

1100 0011b for pin ADDR2 grounded and pin ADDR1 ﬂoating

1100 0101b for pin ADDR2 ﬂoating and pin ADDR1 grounded

1100 0111b for pin ADDR2 and pin ADDR1 ﬂoating

acknowledge generated by the slave

Slave address R

ACK-s

ACK-m

NA

acknowledge generated by the master

not acknowledge

MSA

Data

P

mode and subaddress byte

data byte

STOP condition

8.1 Read mode

Read data is loaded into the I²C-bus register at the preceding acknowledge clock pulse.

Table 5.

Data byte

0h

Read register overview

Name

TUNER

ID

Reference

Section 8.1.1

Section 8.1.2

1h

8.1.1 Read mode: data byte TUNER

Table 6.

7

TUNER - data byte 0h bit allocation

6

5

4

3

2

1

0

RAGC1

RAGC0

TAS1

TAS0

-

POR

TEF6730_1

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 7.

Bit

TUNER - data byte 0h bit description

Symbol

Description

7 and 6

RAGC[1:0]

RF AGC attenuation indicator, PIN diode current on pin IFMAGC

AM mode:

00 = no AGC

01 = LNA AGC

10 = I_AGC< 1 mA

11 = I_AGC> 1 mA

FM mode:

00 = < 0.1 mA

01 = 0.1 mA to 0.5 mA

10 = 0.5 mA to 2.5 mA

11 = > 2.5 mA

5 and 4

TAS[1:0]

tuning action state; the signal TAS informs about internal control

functions of the tuner action state machine; this way the progress of

tuner actions can be monitored by the microcontroller;

see Figure 8 to Figure 18

00 = no current action

01 = mute started and in progress at DSP

10 = PLL tuning in progress and mute activated at DSP

11 = PLL tuning ready and mute activated at DSP

not used

3 to 1

0

-

POR

power-on reset

0 = normal operation

1 = I²C-bus data is reset to default POR state; POR is reset to

logic 0 after the TEF6730 has been read out and written to via

I²C-bus at least once

8.1.2 Read mode: data byte ID

Table 8.

ID - data byte 1h bit allocation

7

6

5

4

3

2

1

0

-

ID2

ID1

ID0

Table 9.

Bit

ID - data byte 1h bit description

Symbol

-

Description

7 to 3

2 to 0

not used

ID[2:0]

device type identiﬁcation 110 = TEF6730

8.2 Write mode

The tuner is controlled by the I²C-bus. After the IC address the MSA byte contains the

control of the tuning action via the bits MODE[2:0] and REGC and subaddressing via bits

SA[3:0] (see Figure 5).

TEF6730_1

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

The tuner circuit is controlled by the CONTROL register. Any data change in the

CONTROL register has immediate effect and will change the operation of the tuner circuit

accordingly. Transmitted I²C-bus data is not loaded into the CONTROL register directly

but loaded into a BUFFER register instead. This allows the IC to take care of tuning

actions freeing the microcontroller from cumbersome controls and timings.

Controlled by a state machine, the BUFFER data will be loaded into the CONTROL

register for new settings. However, at the same time the CONTROL data is loaded into the

BUFFER register. This register swap action allows a fast return to the previous setting

because the previous data remains available in the BUFFER register (see Figure 6 and

Figure 7).

Via MODE several operational modes can be selected for the state machine. MODE offers

all standard tuning actions as well as generic control for ﬂexibility. The state machine

controls the tuner by controlling the internal I²C-bus data. Action progress is monitored by

the accompanying IF DSP via the AFSAMPLE and AFHOLD lines. This way, functions like

tuning mute and weak signal processing can be controlled complementary to the tuner

action.

The state machine operation starts at the end of transmission (P = STOP). In case a

previous action is still active, this is ignored and the new action deﬁned by MODE is

started immediately. When only the address byte is transmitted, no action is started at all

(device presence test).

To minimize the I²C-bus transmission time, only bytes that include data changes need to

be written. Following the MSA byte the transmission can start at any given data byte

deﬁned by the subaddress (SA) bits.

Furthermore, when writing the buffered range either the current BUFFER data or the

current CONTROL data can be used as default, controlled by the REGC bit:

• With REGC = 0, any BUFFER data that is not newly written via I²C-bus remains

unchanged. In general, the BUFFER register will contain the previous tuner setting, so

this becomes default for the new setting. When only the MSA byte is transmitted

deﬁning a tuning MODE with REGC = 0, the tuner will return to its previous settings

(see Figure 6).

• With REGC = 1, the BUFFER register is loaded with data from the CONTROL register

ﬁrst. This way, not written BUFFER data equals the CONTROL data. Since the

CONTROL register contains the current tuner setting with REGC = 1, the current

tuner setting is default for the new setting. When a tuning MODE action is deﬁned with

REGC = 1, the tuner will keep its current settings (CONTROL = current) for all data

that is not newly written during the transmission (see Figure 7).

After power-on reset, all registers are in their default settings. The control signals for the

IF DSP are set to AFSAMPLE = HIGH and AFHOLD = HIGH (i.e. mute state). Any action

of the state machine will change this setting to a new one as deﬁned by the bits

MODE[2:0].

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 10. Write mode subaddress overview

Subaddress

Name

CONTROL

PLLM

PLLL

Default

Reference

0h

1h

2h

3h

4h

5h

Fh

0000 0100b

0000 1000b

0111 1110b

0100 0000b

1000 0000b

0010 0000b

0000 0000b

Section 8.2.2

Section 8.2.3

Section 8.2.4

Section 8.2.5

Section 8.2.6

Section 8.2.7

Section 8.2.8

DAA

AGC

BAND

TEST

2

I C-BUS

MODE

SA = 00h to 05h

BUFFER REGISTER

SA = 00h to 05h

MODE DECODER

load

AFSAMPLE

AFHOLD

STATE MACHINE

REGC = 1

swap

CONTROL REGISTER

SA = 00h to 05h

TUNER CIRCUIT

001aae094

Fig 5. I²C-bus control

TEF6730_1

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

MODE = load, REGC = 0, SA = 2

MSA byte 2 byte 3

address

byte 4

byte 5

P

BUFFER byte 0

current

byte 1

byte 2

byte 3

byte 4

byte 5

new

swap

CONTROL byte 0

byte 1

current

new

byte 2

byte 3

new

byte 4

new

byte 5

new

001aae095

Fig 6. Write to CONTROL register with swap, REGC = 0

TEF6730_1

Product data sheet

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

MODE = load, REGC = 1, SA = 3

address

MSA

byte 3

current

byte 4

byte 5

P

BUFFER byte 0

current

byte 1

byte 2

byte 3

byte 4

byte 5

new

current

load

swap

CONTROL byte 0

byte 1

current

new

current

byte 2

byte 3

byte 4

new

byte 5

new

001aae096

Fig 7. Write to CONTROL register with swap, REGC = 1

TEF6730_1

Product data sheet

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

8.2.1 Mode and subaddress byte for write

Table 11. MSA - mode and subaddress byte bit allocation

7

6

5

4

3

2

1

0

MODE2

MODE1

MODE0

REGC

SA3

SA2

SA1

SA0

Table 12. MSA - mode and subaddress byte bit description

Bit

7 to 5

4

Symbol

MODE[2:0]

REGC

Description

mode; see Table 13

register mode

0 = buffer mode or back mode: previous tuning data is default for

new I²C-bus write (data of the BUFFER register is not changed

before I²C-bus write); see Figure 6

1 = control mode or current mode: current tuning data is default for

new I²C-bus write (the BUFFER register is loaded with CONTROL

register data before I²C-bus write); see Figure 7

3 to 0

SA[3:0]

subaddress; write data byte subaddress 0 to 15. The subaddress

value is auto-incremented and will revert from SA = 15 to SA = 0. The

auto-increment function cannot be switched off.

Table 13. Tuning action modes^[1]

MODE2 MODE1 MODE0 Symbol

Description^[2]

0

1

0

1

0

1

buffer

write BUFFER register, no state machine action, no

swap

tune to new program with 60 ms mute control; swap^[3]

see Figure 8 and Figure 9

preset

search

;

tune to new program and stay muted (for release use

end mode); swap^[3]; see Figure 10 and Figure 11

AF update tune to AF program; check AF quality and tune back

to main program; two swap operations^[4];

see Figure 12 and Figure 13

1

0

1

0

1

0

jump

check

load

tune to AF program in minimum time; swap;

see Figure 14 and Figure 15

tune to AF program and stay muted (for release use

end mode); swap; see Figure 16 and Figure 17

write CONTROL register via BUFFER; no state

machine action; immediate swap; see Figure 6 and

Figure 7

1

end

end action; release mute; no swap; see Figure 18

[1] When the write transmission of a state machine command starts during a mute state of the state machine,

the sequences of the state machine start immediately with the actions which follow the mute period in the

standard sequence (see Figure 9, Figure 11, Figure 13, Figure 15 and Figure 17).

[2] References to mute are only used for better understanding. Muting is performed in the IF DSP controlled by

the tuner AFHOLD and AFSAMPLE lines.

[3] In the modes preset and search the AM AGC time constant is set to fast during the period of complete

mute.

[4] The AF update sequence can also be started by pulling the AFHOLD pin LOW. In this case the AF

information should be loaded into the BUFFER before. LOW period for a correct AF update timing:

t_LOW> 20 µs. Between the end of the I²C-bus transmission and the falling edge of the AFHOLD pulse a

delay of ≥ 20 µs is necessary.

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

16 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

2

I C-bus

P

time

1 ms

PLL

60 ms

tuning

f1

f2

register SWAP

TAS read

'11'

'10'

'01'

'00'

AFHOLD

50 µs

AFSAMPLE

suggested IF DSP signal control

quality detectors

tuning mute

reset

WS processing

FAST

001aae097

Fig 8. Preset mode

2

I C-bus

P

time

tuning

PLL

60 ms

f1

f2

register SWAP

'11'

'10'

TAS read

AFHOLD

'00'

50 µs

AFSAMPLE

001aae098

Fig 9. Preset mode, started during mute

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

17 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

2

I C-bus

P

time

1 ms

PLL

tuning

f1

f2

register SWAP

TAS read

'11'

'10'

'01'

'00'

AFHOLD

AFSAMPLE

suggested IF DSP signal control

quality detectors

tuning mute

reset

WS processing

FAST

001aae099

Fig 10. Search mode

2

I C-bus

P

time

tuning

PLL

f1

f2

register SWAP

'11'

'10'

TAS read

AFHOLD

AFSAMPLE

001aae100

Fig 11. Search mode, started during mute

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

2

I C-bus

P

0.5 ms

PLL

time

1 ms

PLL

2 ms

tuning

f1

f2

f1

register SWAP

TAS read

'11'

'10'

'01'

'00'

AFHOLD

AFSAMPLE

suggested IF DSP signal control

reset store AFU result reset

quality detectors

tuning mute

WS processing

HOLD

001aae101

Fig 12. AF update mode

2

I C-bus

P

0.5 ms

time

tuning

PLL

f2

f1

register SWAP

'11'

'10'

TAS read

'00'

AFHOLD

AFSAMPLE

001aae102

Fig 13. AF update mode, started during mute

TEF6730_1

Product data sheet

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19 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

2

I C-bus

P

0.5 ms

time

1 ms

PLL

tuning

f1

f2

register SWAP

TAS read

'11'

'10'

'01'

'00'

AFHOLD

AFSAMPLE

suggested IF DSP signal control

quality detectors

tuning mute

reset

WS processing

HOLD

001aae103

Fig 14. Jump mode

2

I C-bus

P

0.5 ms

time

tuning

PLL

f1

f2

register SWAP

TAS read

'11'

'10'

'00'

AFHOLD

AFSAMPLE

001aae104

Fig 15. Jump mode, started during mute

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

20 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

2

I C-bus

P

time

1 ms

PLL

tuning

f1

f2

register SWAP

TAS read

'11'

'10'

'01'

'00'

AFHOLD

AFSAMPLE

suggested IF DSP signal control

quality detectors

tuning mute

reset

WS processing

HOLD

001aae105

Fig 16. Check mode

2

I C-bus

P

time

tuning

PLL

f1

f2

register SWAP

'11'

'10'

TAS read

AFHOLD

AFSAMPLE

001aae106

Fig 17. Check mode, started during mute

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

21 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

2

I C-bus

P

time

TAS read

'11'

'00'

AFHOLD

AFSAMPLE

suggested IF DSP signal control

quality detectors

tuning mute

WS processing

001aae107

Fig 18. End mode

8.2.2 Write mode: data byte CONTROL

Table 14. CONTROL - data byte 0h bit allocation with default setting

7

RFGAIN

0

6

5

FLAG

0

4

IFGAIN

0

3

2

1

DAASW

0

NBAGC1 NBAGC0

CFSW

0

1

Table 15. CONTROL - data byte 0h bit description

Bit

Symbol

Description

7

RFGAIN

FM RF gain

0 = standard gain

1 = +6 dB added gain

6

5

-

not used, must be set to logic 0

FLAG

software port output open-collector

0 = SWPORT pin inactive (high-impedance)

1 = SWPORT pin active (pull-down to ground)

4

IFGAIN

IF gain

0 = standard IF gain

1 = increased IF gain (6 dB)

3 and 2

NBAGC[1:0]

RF AGC start level; setting of narrow band (IF) detection

00 = 700 mV (peak value)

01 = 560 mV (peak value)

10 = 450 mV (peak value)

11 = 350 mV (peak value)

TEF6730_1

Product data sheet

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 15. CONTROL - data byte 0h bit description …continued

Bit

Symbol

Description

1

DAASW

antenna DAA mode in FM

0 = standard; DAA output voltage is controlled by V_tune

1 = DAA output voltage is a ﬁxed temperature stable voltage

controlled by the DAA setting (independent of V_tune

)

0

CFSW

ceramic ﬁlter switch

0 = CFSW1 pin active (low-impedance) and CFSW2 pin inactive

(high-impedance)

1 = CFSW2 pin active (low-impedance) and CFSW1 pin inactive

(high-impedance)

8.2.3 Write mode: data byte PLLM

Table 16. PLLM - data byte 1h bit allocation with default setting

7

CPOFF

0

6

PLL14

0

5

PLL13

0

4

PLL12

0

3

PLL11

1

2

PLL10

0

1

PLL9

0

PLL8

0

Table 17. PLLM - data byte 1h bit description

Bit

Symbol

Description

7

CPOFF

charge pump off

0 = standard operation

1 = charge pump deactivated

upper byte of PLL divider word

6 to 0

PLL[14:8]

8.2.4 Write mode: data byte PLLL

Table 18. PLLL - data byte 2h bit allocation with default setting

7

PLL7

0

6

PLL6

1

5

PLL5

1

4

PLL4

1

3

PLL3

1

2

PLL2

1

PLL1

1

0

PLL0

0

Table 19. PLLL - data byte 2h bit description

Bit

Symbol

Description

7 to 0

PLL[7:0]

lower byte of PLL divider word; PLL[14:0] is the divider ratio N of the

VCO programmable divider; N = 1024 to 32767

8.2.5 Write mode: data byte DAA

Table 20. DAA - data byte 3h bit allocation with default setting

7

AGCSW

0

6

DAA6

1

5

DAA5

0

4

DAA4

0

3

DAA3

0

2

DAA2

0

1

DAA1

0

DAA0

0

TEF6730_1

Product data sheet

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 21. DAA - data byte 3h bit description

Bit

Symbol

Description

7

AGCSW

RF AGC switch

0 = no drive of unused RF AGC PIN diode (FM PIN diode in

AM mode or AM PIN diode in FM mode)

1 = unused PIN diode supplied with constant current

6 to 0

DAA[6:0]

alignment of antenna circuit tuning voltage in FM mode

(0.1V_tuneto 2.0V_tune

)

8.2.6 Write mode: data byte AGC

Table 22. AGC - data byte 4h bit allocation with default setting

7

SDAA3

1

6

SDAA2

0

5

SDAA1

0

4

SDAA0

0

3

2

1

KAGC

0

LODX

0

WBAGC1 WBAGC0

0

Table 23. AGC - data byte 4h bit description

Bit

Symbol

Description

alignment of second antenna circuit tuning voltage in FM mode

(0.7V_DAAOUT1to 1.35V_DAAOUT1

7 to 4

SDAA[3:0]

)

3 and 2

1

WBAGC[1:0]

KAGC

RF AGC start level; setting of wideband (RF) detection; for AM,

see Table 24 and for FM, see Table 25

FM keyed AGC

0 = keyed AGC off

1 = keyed AGC on

0

LODX

local switch

0 = standard operation (DX)

1 = forced FM RF AGC attenuation (LOCAL)

Table 24. Setting of RF AGC threshold voltage for AM

WBAGC1

WBAGC0

AM output (RMS value) at LNAOUT

0

1

0

1

0

1

250 mV

200 mV

150 mV

70 mV

Table 25. Setting of RF AGC threshold voltage for FM

WBAGC1

WBAGC0

FM mixer input voltage (RMS value) at FMMIXIN

0

1

0

1

0

1

24 mV

17 mV

12 mV

9 mV

TEF6730_1

Product data sheet

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TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

8.2.7 Write mode: data byte BAND

Table 26. BAND - data byte 5h bit allocation with default setting

7

BAND2

0

6

BAND1

0

5

BAND0

1

4

FREF2

0

3

FREF1

0

2

FREF0

0

1

LOINJ

0

FMIFIN

0

Table 27. BAND - data byte 5h bit description

Bit

Symbol

BAND[2:0]

FREF[2:0]

LOINJ

Description

7 to 5

4 to 2

1

see Table 28

PLL reference frequency; see Table 29

0 = high injection image suppression

1 = low injection image suppression

0 = FMIFAGCIN1 input is selected

1 = FMIFAGCIN2 input is selected

0

FMIFIN

Table 28. Decoding of BAND bits

BAND2

BAND1

BAND0

Divider ratio M

Receiver band

0

1

0

1

0

1

0

1

0

1

0

1

0

1

WB

FM

AM

2

3

6

8

10

16

20

Table 29. Reference frequencies

FREF2

FREF1

FREF0

f_ref

0

1

0

1

0

1

0

1

0

1

0

1

0

1

100 kHz

50 kHz

25 kHz

20 kHz

10 kHz

reserved

The correct charge pump current for each reference frequency is selected automatically,

see Table 30.

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

25 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 30. Charge pump source^[1]

FREF2

FREF1

FREF0

LOINJ

Charge pump

current

f_ref

0

1

0

1

0

1

0

1

0

X

1

CP1

CP2

CP3

CP4

CP5

100 kHz

50 kHz

25 kHz

20 kHz

10 kHz

0

X

[1] X = don’t care.

8.2.7.1 Tuning overview

( f _RF+ 10.7 MHz) × M

If LOINJ = 0: N =

.

---------------------------------------------------------

f _ref

( f _RF– 10.7 MHz) × M

If LOINJ = 1: N =

--------------------------------------------------------

f _ref

f

tuning step = ^ref; where M is the divider ratio of the VCO frequency for AM mixer and

---------

M

f _VCO

FM mixer M =

.

--------------

f _mixer

Table 31. Standard tuner settings

Broadcast band

BAND2 BAND1 BAND0 M FREF2 FREF1 FREF0 f_ref

LOINJ Tuning step

Europe FM and US FM

Japan FM

0

1

0

1

0

1

0

1

0

1

0

1

0

1

2

3

1

0

1

0

1

0

1

0

100 kHz

20 kHz

25 kHz

20 kHz

10 kHz

0

1

0

50 kHz

33.3 kHz

6.67 kHz

25 kHz

East Europe FM (OIRT FM)

WB FM

AM MW and LW

20 0

16 1

10 1

1 kHz

AM SW 120 m to 60 m

AM SW 49 m to 22 m

AM SW 25 m to 15 m

AM SW 16 m to 11 m

0.625 kHz

1 kHz

8

6

1

1.25 kHz

1.67 kHz

8.2.8 Write mode: data byte TEST

Table 32. TEST - data byte Fh bit allocation with default setting (not buffered)^[1]

7

6

5

4

3

TEST3

0

2

TEST2

0

1

0

TEST0

0

TEST1

0

[1] The test control byte is for internal use only.

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

26 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

9. Limiting values

Table 33. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

V_CCA

analog supply voltage

on pins V_CC, V_CC(PLL), V_CC(VCO), V_CC(RF)

,

−0.3

+10

V

V_CC(IF), FMMIXOUT1, FMMIXOUT2,

AMMIXOUT1 and AMMIXOUT2

∆V_CCAn

voltage difference between

any analog supply pins

−0.3

+0.3

V

V_SCL

V_SDA

V_i

voltage on pin SCL

voltage on pin SDA

input voltage

−0.3

-

+5.5

+10

V

[1]

on pins ADDR1 and ADDR2

on pins AFHOLD and AFSAMPLE

on pin SWPORT

V_o

output voltage

V_n

voltage on any other pin

total power dissipation

storage temperature

ambient temperature

V_CCA+ 0.3 V

P_tot

T_stg

T_amb

1100

+150

mW

−55

°C

soldered exposed die pad

subjective functionality

full functionality

−40

+105

+85

°C

V

−40

[2]

[3]

[4]

[3]

V_esd

electrostatic discharge

voltage

on all pins except pin V_CC(VCO)

−2000

−200

−1000

−200

+2000

+200

+2000

+200

V

on pin V_CC(VCO)

V

[1] The maximum voltage must be less than V_CCA

.

[2] Human body model: Class 2 according to JESD22-A114C.01.

[3] Machine model: Class B according to EIA/JESD22-A115-A.

[4] Human body model: Class 1C according to JESD22-A114C.01.

10. Thermal characteristics

Table 34. Thermal characteristics

Symbol

R_th(j-a)

Parameter

Conditions

Typ

Unit

thermal resistance from junction to ambient in free air

thermal resistance from junction to case

29.6

17.5

K/W

R_th(j-c)

TEF6730_1

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27 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

11. Static characteristics

Table 35. Static characteristics

V_CCA= 8.5 V; T_amb= 25 °C; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supply voltage

V_CCA

analog supply voltage on pins V_CC, V_CC(PLL)

_CC(VCO), V_CC(RF), V_CC(IF)

FMMIXOUT1,

,

8

8.5

9

V

,

FMMIXOUT2, AMMIXOUT1

and AMMIXOUT2

Current in FM mode

I_CC(RF)

RF supply current

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

-

14

-

mA

15

16

I_CC(PLL)

I_CC(VCO)

I_CC

PLL supply current

VCO supply current

supply current

7.9

7.6

7.2

3.8

3.6

3.5

23

21.5

19

I_CC(IFAGC)

I_FMMIXOUT1

I_FMMIXOUT2

I_CC(tot)

IF AGC supply current T_amb= −40 °C

T_amb= 25 °C

26

T_amb= 85 °C

26

current on

pin FMMIXOUT1

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

5.3

5.8

6.1

5.3

5.8

6.1

85.3

current on

pin FMMIXOUT2

total supply current

Current in AM mode

I_CC(RF)

RF supply current

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

-

39.5

39

-

mA

38

I_CC(PLL)

PLL supply current

VCO supply current

7.9

7.6

7.2

3.8

3.6

3.5

I_CC(VCO)

TEF6730_1

Product data sheet

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28 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 35. Static characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

Min

Typ

21.5

21

Max

Unit

mA

I_CC

supply current

-

20

I_CC(IFAGC)

I_AMMIXOUT1

I_AMMIXOUT2

I_CC(tot)

IF AGC supply current T_amb= −40 °C

T_amb= 25 °C

33

32.5

32

T_amb= 85 °C

current on

pin AMMIXOUT1

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

T_amb= −40 °C

T_amb= 25 °C

T_amb= 85 °C

6

5.5

5

current on

pin AMMIXOUT2

6

5.5

5

total supply current

114.7

12. Dynamic characteristics

Table 36. Dynamic characteristics

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Reference frequency

External reference frequency, circuit inputs: pins FREF1 and FREF2

Parameter

Conditions

Min

Typ

Max

Unit

f_ext

external frequency

carrier-to-noise ratio

-

100

-

kHz

C/N

required from reference

source; f_ext= 100 kHz;

∆f = 10 kHz

115

dBc/√Hz

[1]

I_{i(ext)(min)(M)}

I_{i(ext)(max)(M)}

I_cm(ext)

peak minimum

external input current

square wave signal

from each pin to GND

-

200

-

µA

peak maximum

external input current

750

−50

external

+50

common-mode current

R_i

input resistance

-

5

10

Ω

V_cm

common-mode

voltage

measured between each pin to

GND

1.0

1.2

1.4

V

Tuning system; see Table 28, Table 29, Table 30 and Table 31

Voltage controlled oscillator

[2]

f_VCO(min)

minimum VCO

frequency

-

130

MHz

application according to

Figure 25

159.9

[2]

f_VCO(max)

C/N

maximum VCO

frequency

256

94

-

MHz

carrier-to-noise ratio

f_VCO= 200 MHz; ∆f = 10 kHz;

98

dBc/√Hz

Q = 30

TEF6730_1

Product data sheet

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29 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

∆f

frequency deviation

caused by ripple on supply

voltage; f_ripple= 100 Hz;

-

2

-

Hz

V_CC(ripple)= 50 mV (RMS);

f_VCO= 200 MHz; standard FM

Charge pump: pin CPOUT; see Table 30

I_sink(CP1)

CP1 sink current

CP1 source current

CP2 sink current

CP2 source current

CP3 sink current

CP3 source current

CP4 sink current

CP4 source current

CP5 sink current

CP5 source current

V_CPOUT= 0.5 V to

_CC(PLL)− 1.3 V

130

180

240

µA

V

I_source(CP1)

I_sink(CP2)

I_source(CP2)

I_sink(CP3)

I_source(CP3)

I_sink(CP4)

I_source(CP4)

I_sink(CP5)

V_CPOUT= 0.5 V to

_CC(PLL)− 1.3 V

−240

270

−180

360

−130

480

V

V_CPOUT= 0.7 V to

_CC(PLL)− 1.5 V

V

V_CPOUT= 0.7 V to

_CC(PLL)− 1.5 V

−480

580

−360

780

−270

1050

−580

1900

V

V_CPOUT= 0.7 V to

_CC(PLL)− 0.7 V

V

V_CPOUT= 0.7 V to

_CC(PLL)− 0.7 V

−1050

1040

−1900

1630

−2970

−780

1400

V

V_CPOUT= 0.7 V to

_CC(PLL)− 0.7 V

V

V_CPOUT= 0.7 V to

_CC(PLL)− 0.7 V

−1400 −1040

2200 2970

−2200 −1630

V

V_CPOUT= 0.7 V to

_CC(PLL)− 0.7 V

V

I_source(CP5)

V_CPOUT= 0.7 V to

_CC(PLL)− 0.7 V

V

Charge pump: pin VTUNE

I_o(sink)

output sink current

V_tune= 0.9 V to

_CC(PLL)− 0.7 V

2070

2800

3780

µA

V

I_o(source)

output source current V_tune= 0.9 V to

_CC(PLL)− 0.7 V

−3780

−2800 −2070

V

Timings

t_tune

tuning time

Europe FM and US FM band;

_ref= 100 kHz; f_RF= 87.5 MHz

-

0.75

1

ms

f

to 108 MHz

AM MW band; f_ref= 20 kHz;

-

10

ms

f_RF= 0.53 MHz to 1.7 MHz

t_upd(AF)

AF update time

cycle time for inaudible AF

update including 1 ms mute

start and 1 ms mute release

time

6

6.5

Antenna Digital Auto Alignment (DAA)

DAA1: pin DAAOUT1^[3]

G_conv(DAA)

DAA conversion gain

0.1

-

2

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

30 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_o

output voltage

FM mode; DAASW = 0

minimum value

maximum value

-

0.6

-

V

_CC(PLL)− 0.6 -

FM mode; DAASW = 1;

independent of tuning voltage

minimum value; data byte

DAA bits

DAA[6:0] = 000 0000

-

0.6

-

V

maximum value; data byte

DAA bits

V

_CC(PLL)− 0.6 -

DAA[6:0] = 111 1111

AM mode; independent of

tuning voltage

minimum value; data byte

DAA bits

DAA[6:0] = 000 0000

-

0.6

-

V

maximum value; data byte

DAA bits

V

_CC(PLL)− 0.6 -

V

DAA[6:0] = 111 1111

V_n(o)

output noise voltage

data byte DAA bits

-

30

100

µV

DAA[6:0] = 100 0000;

FM mode; V_tune= 4 V with

frequency range from

300 Hz to 22 kHz

∆V_o(T)

output voltage

deviation over

temperature

T

_amb= −40 °C to +85 °C; data

−30

-

+30

mV

byte DAA bits

DAA[6:0] = 100 0000

∆V_o(step)

∆V_o

step output voltage

tolerance

n = 0 to 127; FM mode;

−0.5V_LSB

0

+0.5V_LSB

V_tune= 4 V

output voltage

deviation

V_tune= 4 V; I_load= 50 µA

V_tune= 4 V; I_load= −50 µA

−V_LSB

-

+V_LSB

60

-

t_s(o)

output settling time

ripple rejection

V_DAAOUT1= 0.2 V to 8.25 V;

C_L= 270 pF

30

µs

α_ripple

V_CC(ripple)/V_o; data byte DAA

bits DAA[6:0] = 101 0101;

FM mode; V_tune= 4 V;

-

40

-

dB

f_ripple= 100 Hz;

V_CC(ripple)= 100 mV

DAA2: pin DAAOUT2^[4]

G_conv(DAA)DAA conversion gain

V_o

0.7

-

1.35

output voltage

AM mode and FM mode

minimum value

0.6

-

V

maximum value

V

-

_CC(PLL)− 0.8 -

30

V

V_n(o)

output noise voltage

data byte AGC bits

100

µV

SDAA[3:0] = 1000; FM mode;

V_DAAOUT1= 4 V with frequency

range from 300 Hz to 22 kHz

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

31 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

∆V_o(T)

output voltage

deviation over

temperature

T_amb= −40 °C to +85 °C; data

byte AGC bits

SDAA[3:0] = 1000

−30

-

+30

mV

∆V_o(step)

∆V_o

step output voltage

tolerance

n = 0 to 15; FM mode;

−0.5V_LSB

0

+0.5V_LSB

V_DAAOUT1= 4 V

output voltage

deviation

V_DAAOUT1= 4 V; I_load= 50 µA

V_DAAOUT1= 4 V; I_load= −50 µA

V_DAAOUT1= 4 V;

−V_LSB

-

+V_LSB

30

-

t_s(o)

output settling time

20

µs

V_DAAOUT2= 2.8 V to 5.4 V;

C_L= 270 pF

α_ripple

ripple rejection

V_CC(ripple)/V_DAAOUT1; data byte

AGC bits SDAA[3:0] = 1010;

FM mode; V_DAAOUT1= 4 V;

-

50

-

dB

f_ripple= 100 Hz;

V_CC(ripple)= 100 mV

AM channel

AM RF AGC wideband detector (average detector): pin LNAOUT

V_LNAOUT(RMS)RMS voltage on

pin LNAOUT

start level of wideband AGC;

R_L= 430 Ω (load at

pin LNAOUT); m = 0.3;

see Table 24 and Table 25

data byte AGC bits

WBAGC[1:0] = 00

175

140

105

49

250

200

150

70

350

280

210

98

mV

data byte AGC bits

WBAGC[1:0] = 01

data byte AGC bits

WBAGC[1:0] = 10

data byte AGC bits

WBAGC[1:0] = 11

AM RF AGC narrow-band detector: pins IFOUT1 and IFOUT2

V_o(IFOUT)(M)

peak output voltage

between pin IFOUT1

and pin IFOUT2

start level of narrow-band

AGC; data byte CONTROL bit

IFGAIN = 0;

V

_IFAGCMSB= HIGH;

_IFAGCLSB= LOW;

see Table 15

data byte CONTROL bits

NBAGC[1:0] = 00

490

390

315

245

700

560

450

350

980

780

630

490

mV

data byte CONTROL bits

NBAGC[1:0] = 01

data byte CONTROL bits

NBAGC[1:0] = 10

data byte CONTROL bits

NBAGC[1:0] = 11

AM LNA and AGC

Input: pin LNAIN; output: pin LNAOUT

R_i

input resistance

0.9

1.3

1.8

MΩ

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

32 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

C_i

Parameter

Conditions

Min

Typ

46

57

-

Max

69

81

-

Unit

pF

input capacitance

-

G_m

transconductance gain I_o/V_i

40

-

mA/V

dB

∆G_m(T)

transconductance gain T_amb= −40 °C to +85 °C;

deviation over

temperature

see Figure 19

IP3

third-order intercept

point

R_L= 430 Ω (load at

pin LNAOUT)

111

120

114

129

-

dBµV

IP2

second-order intercept R_L= 430 Ω (load at

point pin LNAOUT)

V_n(i)(eq)

equivalent input noise C_source= 110 pF; R_L= 430 Ω

voltage

(load at pin LNAOUT)

f_RF= 1 MHz

-

1.0

2.3

115

22

1.4

3.2

165

33

-

nV/√Hz

f_RF= 144 kHz

-

nV/√Hz

R_o

output resistance

80

-

Ω

C_o

output capacitance

in series with output resistance

pF

V

V_o(p-p)(max)

maximum

-

2.2

peak-to-peak output

voltage

∆G_AGC

AGC gain range

8

11

14

dB

RF PIN diode AGC current generator output: pin IAMAGC

∆G_AGC

AGC gain range

f_RF= 1 MHz; dummy aerial

15 pF/60 pF

-

50

-

dB

V

V_IAMAGC

voltage on

PIN diode drive DC voltage

2.2

V_CCA

pin IAMAGC

[5]

I_sink(max)

I_sink

maximum sink current V_IAMAGC= 2.2 V

sink current FM mode; data byte DAA bit

10

-

mA

0.6

0.9

1.4

AGCSW = 1

FM mode; data byte DAA bit

AGCSW = 0

-

100

nA

AM mixer (IF = 10.7 MHz)

Mixer input: pins AMMIXIN and AMMIXDEC

[6]

R_i

input resistance

40

-

kΩ

pF

C_i

input capacitance

3

-

4.5

-

V_i(max)

maximum input

voltage

on pin AMMIXIN; 1 dB

compression point of

500

mV

V_{MIXOUT1-MIXOUT2}; m = 0

Mixer output: pins AMMIXOUT1 and AMMIXOUT2

[7]

R_o

output resistance

100

-

kΩ

pF

V

C_o

output capacitance

4

7

-

V_o(p-p)(max)

maximum

12

15

peak-to-peak output

voltage

G_m(conv)

conversion

I_o/V_i

1.8

2.4

3.2

mA/V

transconductance gain

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

33 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

∆G_m(conv)(T)

conversion

T

_amb= −40 °C to +85 °C;

-

dB

transconductance gain see Figure 20

deviation over

temperature

IP3

third-order intercept

point

R_L= 2.6 kΩ (AC load between

output pins); ∆f = 300 kHz

135

138

170

7.2

-

dBµV

IP2

second-order intercept R_L= 2.6 kΩ (AC load between

point output pins)

-

dBµV

V_n(i)(eq)

equivalent input noise band limited noise;

10

nV/√Hz

voltage

R

_source= 750 Ω; noise of

_sourceincluded; R_L= 2.6 kΩ

(AC load between output pins)

NF

noise ﬁgure

-

6.2

9

dB

FM channel

FM RF AGC (FM distance mode; data byte AGC bit LODX = 0)

Input: pins FMMIXIN1 and FMMIXIN2^[8]

V_{i(FMMIXIN)(RMS)}RMS input voltage

between

start level of wideband AGC;

keyed AGC off; data byte AGC

bit KAGC = 0; see Table 24

and Table 25

pin FMMIXIN1 and

pin FMMIXIN2

data byte AGC bits

WBAGC[1:0] = 11

5

9

15

19

27

38

mV

data byte AGC bits

WBAGC[1:0] = 10

7

12

17

24

data byte AGC bits

WBAGC[1:0] = 01

10

14

data byte AGC bits

WBAGC[1:0] = 00

start level of wideband AGC;

keyed AGC on; data byte AGC

bit KAGC = 1;

V_KAGC> V_th(KAGC)

data byte AGC bits

WBAGC[1:0] = 11

19

21

24

28

30

33

38

45

48

52

60

71

mV

data byte AGC bits

WBAGC[1:0] = 10

data byte AGC bits

WBAGC[1:0] = 01

data byte AGC bits

WBAGC[1:0] = 00

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

34 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

FM RF AGC narrow-band detector: pins IFOUT1 and IFOUT2

V_o(IFOUT)(M)

peak output voltage

between pin IFOUT1

and pin IFOUT2

start level of narrow-band

AGC; data byte CONTROL bit

IFGAIN = 0;

V

_IFAGCMSB= HIGH;

_IFAGCLSB= LOW;

see Table 15

data byte CONTROL bits

NBAGC[1:0] = 00

490

390

315

245

700

560

450

350

980

780

630

490

mV

data byte CONTROL bits

NBAGC[1:0] = 01

data byte CONTROL bits

NBAGC[1:0] = 10

data byte CONTROL bits

NBAGC[1:0] = 11

PIN diode drive output: pin IFMAGC

I_source(max)

maximum source

current

V_TFMAGC= V_IFMAGC+ 1.4 V;

data byte AGC bit KAGC = 0

−16

−10

−7

mA

I_sink(max)

maximum sink current at AGC decay;

7

10

16

V_TFMAGC= V_IFMAGC; data byte

AGC bit KAGC = 0

I_source

source current

AM mode; data byte DAA bit

AGCSW = 1

-

−1.2

0

-

mA

mV

AM mode; data byte DAA bit

AGCSW = 0

-

data byte AGC bit LODX = 1

(FM local)

−0.75

-

−0.5

100

950

−0.35

300

1400

V_IFMAGC

V_th(KAGC)

voltage on

pin IFMAGC

voltage at PIN diode drive

output; V_FMMIXIN1< V_th

threshold voltage on

pin KAGC

threshold level voltage for

narrow-band AGC (keyed

AGC); data byte AGC bit

KAGC = 1; see Table 15 and

Table 23

500

FM mixer (IF = 10.7 MHz)

FM RF input: pins FMMIXIN1 and FMMIXIN2^[8]

V_i(RF)(max)

maximum RF input

voltage

1 dB compression point of

FM mixer output voltage

75

100

-

mV

V_n(i)(eq)

equivalent input noise R_source= 500 Ω; noise of

voltage

R_sourceincluded; R_L= 2.6 kΩ

(on output pins FMMIXOUT1

and FMMIXOUT2)

RFGAIN = 0

RFGAIN = 1

RFGAIN = 0

RFGAIN = 1

-

3.7

3

5.2

-

nV/√Hz

kΩ

-

R_i

input resistance

3

3.8

2.0

4.7

2.5

1.6

kΩ

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

35 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

C_i

Parameter

Conditions

Min

-

Typ

2

Max

4

Unit

pF

input capacitance

G_m(conv)

conversion

I_o/V_i; RF gain 1; data byte

12

18

25

mA/V

transconductance gain PLLM bit RFGAIN = 0

I_o/V_i; RF gain 2; data byte

PLLM bit RFGAIN = 1

24

-

36

-

50

-

mA/V

dB

∆G_m(conv)(T)

conversion

T_amb= −40 °C to +85 °C;

transconductance gain see Figure 21

deviation over

temperature

NF

noise ﬁgure

R

_source= 500 Ω; T_amb= 25 °C

RFGAIN = 0

-

3.5

3

5

dB

RFGAIN = 1

-

4.5

dB

IP3

third-order intercept

point

RFGAIN = 0

117

108

25

123

114

40

-

dBµV

dB

RFGAIN = 1

IRR

image rejection ratio

V_o(wanted)/V_o(image);

f

_RF(wanted)= 87.5 MHz;

_RF(image)= 108.9 MHz

Output: pins FMMIXOUT1 and FMMIXOUT2^[9]

R_o

output resistance

100

-

kΩ

pF

V

C_o

output capacitance

4

6

-

V_o(p-p)(max)

maximum

4.5

5.6

peak-to-peak output

voltage

FM weather band input: pins WXMIXIN and WXMIXDEC

G_m(conv)

conversion

transconductance gain

I_o/V_i

10

-

15

-

21

-

mA/V

dB

∆G_m(conv)(T)

conversion

T_amb= −40 °C to +85 °C;

transconductance gain see Figure 22

deviation over

temperature

R_i

input resistance

-

5.1

2

-

kΩ

C_i

input capacitance

4

5

-

pF

NF

IP3

noise ﬁgure

R_source= 300 Ω

3.5

116

dB

third-order intercept

point

dBµV

IRR

image rejection ratio

V_o(wanted)/V_o(image)

;

20

33

-

dB

f

_RF(wanted)= 162.475 MHz;

_RF(image)= 183.875 MHz

IF AGC ampliﬁer

AM mode; inputs: pins AMIFAGCIN and IFAGCDEC^[10]; outputs: pins IFOUT1 and IFOUT2^[11]

R_i

C_i

R_o

input resistance

input capacitance

output resistance

-

100

5

-

kΩ

pF

Ω

-

7

120

210

290

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

36 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

G

gain

data byte CONTROL bit

IFGAIN = 0

V_IFAGCMSB= LOW;

21.2

15.2

9.2

24.2

18.2

12.2

6.2

27.2

21.2

15.2

9.2

dB

V

_IFAGCLSB= LOW

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

V

3.2

V

data byte CONTROL bit

IFGAIN = 1

V_IFAGCMSB= LOW;

27.2

21.2

15.2

9.2

-

30.2

24.2

18.2

12.2

12.9

33.2

27.2

21.2

15.2

16

dB

V

_IFAGCLSB= LOW

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

V

NF

noise ﬁgure

R_source= 300 Ω; data byte

CONTROL bit IFGAIN = 0;

V

_IFAGCMSB= LOW;

_IFAGCLSB= LOW

∆IM3

third-order

intermodulation

distance

two output signals at 35 kHz

frequency distance; differential

output level of 200 mV; data

byte CONTROL bit IFGAIN = 0

V

_IFAGCMSB= LOW;

_IFAGCLSB= LOW

77

74

83

80

-

dB

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

V

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

V

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

V

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

37 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_i(max)(M)

peak maximum input

voltage

1 dB compression point of

IF AGC ampliﬁer output

voltage; data byte CONTROL

bit IFGAIN = 0

V

_IFAGCMSB= LOW;

_IFAGCLSB= LOW

45

-

mV

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

90

V

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

180

360

V

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

V

FM mode; inputs: pins FMIFAGCIN1 and IFAGCDEC^[12]; outputs: pins IFOUT1 and IFOUT2^[11]

R_i

C_i

R_o

G

input resistance

input capacitance

output resistance

gain

-

330

5

-

Ω

-

7

pF

Ω

120

210

290

data byte CONTROL bit

IFGAIN = 0

V_IFAGCMSB= LOW;

28

22

16

10

31

25

19

13

34

28

22

16

dB

V

_IFAGCLSB= LOW

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

V

data byte CONTROL bit

IFGAIN = 1

V_IFAGCMSB= LOW;

34

28

22

16

-

37

31

25

19

6.9

40

34

28

22

8.5

dB

V

_IFAGCLSB= LOW

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

V

NF

noise ﬁgure

R_source= 300 Ω; data byte

CONTROL bit IFGAIN = 0;

V

_IFAGCMSB= LOW;

_IFAGCLSB= LOW

IP3

third-order intercept

point

data byte CONTROL bit

IFGAIN = 0

110

115

-

dBµV

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

38 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_i(max)(M)

peak maximum input

voltage

1 dB compression point of

IF AGC ampliﬁer output

voltage; data byte CONTROL

bit IFGAIN = 0

V

_IFAGCMSB= LOW;

_IFAGCLSB= LOW

20

-

mV

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

40

V

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

80

V

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

160

V

FM mode; inputs: pins FMIFAGCIN2 and IFAGCDEC^[13]; outputs: pins IFOUT1 and IFOUT2^[11]

R_i

C_i

G

input resistance

input capacitance

gain

-

330

5

-

Ω

7

pF

data byte CONTROL bit

IFGAIN = 0

V_IFAGCMSB= LOW;

28

22

16

10

31

25

19

13

34

28

22

16

dB

V

_IFAGCLSB= LOW

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

V

data byte CONTROL bit

IFGAIN = 1

V_IFAGCMSB= LOW;

34

28

22

16

-

37

31

25

19

6.9

40

34

28

22

8.5

dB

V

_IFAGCLSB= LOW

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

V

NF

noise ﬁgure

R_source= 300 Ω; data byte

CONTROL bit IFGAIN = 0;

V

_IFAGCMSB= LOW;

_IFAGCLSB= LOW

IP3

third-order intercept

point

data byte CONTROL bit

IFGAIN = 0

110

115

-

dBµV

TEF6730_1

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Table 36. Dynamic characteristics …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_i(max)(M)

peak maximum input

voltage

1 dB compression point of

IF AGC ampliﬁer output

voltage; data byte CONTROL

bit IFGAIN = 0

V

_IFAGCMSB= LOW;

_IFAGCLSB= LOW

20

-

mV

V_IFAGCMSB= LOW;

_IFAGCLSB= HIGH

40

V

V_IFAGCMSB= HIGH;

_IFAGCLSB= HIGH

80

V

V_IFAGCMSB= HIGH;

_IFAGCLSB= LOW

160

V

Digital inputs and outputs

Input: pins IFAGCMSB and IFAGCLSB

V_IL

LOW-level input

voltage

-

0.9

-

V

V_IH

HIGH-level input

voltage

1.5

Output: pin AFHOLD

I_sink(max)maximum sink current AFHOLD = LOW; V_o= 0.4 V

Output: pin AFSAMPLE

1.0

-

mA

I_sink(max)

maximum sink current AFSAMPLE = LOW;

V_o= 0.4 V

Output: pin SWPORT

I_sink(max)

maximum sink current data byte CONTROL bit

FLAG = 1; V_o= 0.4 V

1.0

-

mA

[1] Differential current on pins FREF1 and FREF2.

[2] The VCO frequency is determined by the external circuit at pins OSCFDB and OSCTNK.

n

128

[3] Conversion gain formula of DAA1: V_{DAAOUT 1}

[4] Conversion gain formula of DAA2: V_{DAAOUT 2}

=

1.915 ×

0.693 ×

+ 0.1 × V

where n = 0 to 127.

tune

--------

n

+ 0.7 × V

where n = 0 to 15.

-----

DAAOUT 1

16

[5] The sink current must be limited to 18 mA by the external circuit.

[6] Input parameters of AM mixer measured between pins AMMIXIN and AMMIXDEC.

[7] Output parameters of AM mixer measured between pins AMMIXOUT1 and AMMIXOUT2.

[8] Input parameters of FM mixer measured between pins FMMIXIN1 and FMMIXIN2.

[9] Output parameters of FM mixer measured between pins FMMIXOUT1 and FMMIXOUT2.

[10] Input parameters of AM IF ampliﬁer measured between pins AMIFAGCIN and IFAGCDEC.

[11] Output parameters of IF AGC ampliﬁer measured between pins IFOUT1 and IFOUT2.

[12] Input parameters of FM IF ampliﬁer measured between pins FMIFAGCIN1 and IFAGCDEC.

[13] Input parameters of FM IF ampliﬁer measured between pins FMIFAGCIN2 and IFAGCDEC.

TEF6730_1

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001aae090

001aae091

2

1.0

∆G

(dB)

∆G

m(T)

m(conv)(T)

(dB)

1

0

0.5

0

−1

−2

−0.5

−1.0

−40

0

40

80

100

(°C)

0

40

80

100

(°C)

T

amb

Fig 19. AM LNA transconductance gain deviation over

temperature (including application)

Fig 20. AM mixer conversion transconductance gain

deviation over temperature (including

application)

001aae092

001aae093

0.5

10

∆G

m(conv)(T)

(dB)

m(conv)(T)

(dB)

0

−0.5

−1.0

5

0

−5

−1.5

−40

−10

−40

0

40

80

100

(°C)

0

40

80

100

(°C)

T

amb

Fig 21. FM mixer conversion transconductance gain

deviation over temperature (including

application)

Fig 22. Weather band mixer conversion

transconductance gain deviation over

temperature (including application)

13. I²C-bus characteristics

The TEF6730HW complies with the fast-mode I²C-bus protocol. The maximum I²C-bus

communication speed is 400 kbit/s.

SDA and SCL HIGH and LOW internal thresholds are speciﬁed according to an I²C-bus

voltage range from 2.5 V to 3.3 V including I²C-bus voltage tolerances of ±10 %. The

I²C-bus interface tolerates also SDA and SCL signals from a 5 V bus. Restrictions for V_IL

in a 5 V application can be derived from Table 37.

TEF6730_1

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Table 37. I²C-bus parameters

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_IL

LOW-level input

voltage

-

1.09

V

V_IH

C_i

HIGH-level input

voltage

1.56

-

V

capacitance for each pin SDA

I/O pin

-

4

3

6

5

pF

pin SCL

t_resp(Q)HL

HIGH-to-LOW data

acknowledge and read data;

output response time see Figure 23

V_DD= 5 V; I = 3 mA;

C_b= 400 pF

-

700

570

520

450

863

668

593

488

-

ns

V_DD= 3.3 V; R_p= 1.8 kΩ;

C_b= 400 pF

V_DD= 2.5 V; R_p= 35 kΩ;

C_b= 10 pF

t_resp(Q)LH

t_of

LOW-to-HIGH data

output response time

read data; see Figure 23

[1]

output fall time from

C_b= 10 pF to 120 pF;

see Figure 24

20 + 0.1C_b10 × V_DD

V_IHminto V_ILmax

[1][2]

C_b≥ 120 pF; see Figure 24

20 + 0.1C_b

-

250

[1] Minimum value of t_of; C_b= total capacitance of one I²C-bus line [pF].

[2] Typical value of t_of; the output fall time t_of[ns] depends on the total load capacitance C_b[pF] and the I²C-bus voltage V_DD[V]:

t_of= ¹⁄₁₂× V_DD× C_b.

0.7V

DD

SDA

SCL

V

IL(max)

t

resp(Q)LH

resp(Q)HL

001aaf002

001aaf001

a. Data change from LOW to HIGH

b. Data change from HIGH to LOW

Fig 23. Data output response time of the IC

TEF6730_1

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V

DD

0.7V

DD

0.3V

DD

t

of

001aab803

Fig 24. Deﬁnition of the fall time of the output signal

14. Overall system parameters

Table 38. Overall system parameters

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

AM overall system parameters^[1]

f_i(RF)

RF input frequency

LW

144

522

2.3

-

288

1710

26.1

-

kHz

MHz

µV

MW

SW

-

f_IF

IF frequency

10.7

50

V_sens

V_i(RF)

sensitivity voltage

RF input voltage

(S+N)/N = 26 dB

-

start level of wideband AGC

data byte AGC bits WBAGC[1:0] = 00

data byte AGC bits WBAGC[1:0] = 01

data byte AGC bits WBAGC[1:0] = 10

data byte AGC bits WBAGC[1:0] = 11

start level of narrow-band AGC; m = 0

data byte AGC bits NBAGC[1:0] = 00

data byte AGC bits NBAGC[1:0] = 01

data byte AGC bits NBAGC[1:0] = 10

data byte AGC bits NBAGC[1:0] = 11

-

125

100

75

-

mV

35

V_i(RF)M

peak RF input voltage

-

200

170

140

115

152

-

mV

IP2

IP3

second-order intercept point referenced to receiver input

dBµV

third-order intercept point

referenced to receiver input

∆f = 40 kHz

-

130

133

40

-

dBµV

dB

∆f = 100 kHz

α_ripple

ripple rejection

V_CC(ripple)/V_audio; f_ripple= 100 Hz;

V

_CC(ripple)= 10 mV (RMS);

_i(RF)= 1 mV to 1 V

FM overall system parameters^[2]

f_i(RF)

RF input frequency

FM standard

weather band

65

-

108

MHz

162.4 -

10.7

162.55 MHz

- MHz

f_IF

IF frequency

-

TEF6730_1

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Table 38. Overall system parameters …continued

V_CCA= 8.5 V; T_amb= 25 °C; see Figure 25; all AC values are given in RMS; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

2

Max

Unit

µV

V_sens

sensitivity voltage

B_IF= 170 kHz

-

threshold extension enabled; weak signal

handling enabled (SAF7730 N231)

1.1

µV

V_i(RF)

RF input voltage

start level of wideband AGC

data byte AGC bits WBAGC[1:0] = 00

data byte AGC bits WBAGC[1:0] = 01

data byte AGC bits WBAGC[1:0] = 10

data byte AGC bits WBAGC[1:0] = 11

start level of narrow-band AGC; m = 0

data byte AGC bits NBAGC[1:0] = 00

data byte AGC bits NBAGC[1:0] = 01

data byte AGC bits NBAGC[1:0] = 10

data byte AGC bits NBAGC[1:0] = 11

∆f = 400 kHz

-

19

14

10

7

-

mV

V_i(RF)M

peak RF input voltage

-

17

14

11

9

-

mV

dBµV

dB

IP3

third-order intercept point

ripple rejection

123

64

α_ripple

V_CC(ripple)/V_audio; f_ripple= 100 Hz;

V_CC(ripple)= 10 mV (RMS); V_i(RF)= 500 µV

[1] Based on 15 pF/60 pF dummy aerial, voltages at dummy aerial input, f_mod= 400 Hz, 2.5 kHz audio bandwidth, f_i(RF)= 990 kHz, m = 0.3

and nominal maximum IF AGC gain, unless otherwise speciﬁed.

[2] Based on 75 Ω dummy aerial, voltages at dummy aerial input, f_mod= 400 Hz, de-emphasis = 50 µs, f_i(RF)= 97.1 MHz, ∆f = 22.5 kHz,

nominal mixer gain and nominal maximum IF AGC gain, unless otherwise speciﬁed.

TEF6730_1

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10 pF

RF input

28

L7

47 nH

12 pF

TEF6730HW

29

10 pF

001aae109

Fig 26. Weather band application

Table 39. List of components of Figure 25 and Figure 26

Symbol Component Type

capacitor for VCO tuning 270 pF; type NP0

Manufacturer

C1

L1

L2

L3

L4

L5

L6

L7

D1

D2

D3

D4

D5

F1

-

VCO coil

50 nH; E558CNA-100035 TOKO

FM input coil

100 nH; C2520C-R10

470 nH; C2520C-R47

220 nH; C2520C-R22

47 mH; 388BN-1211Z

PF670CCS-A065DX

47 nH; LQW31H

Sagami

TOKO

FM antenna coil

AM mains suppression coil

10.7 MHz IF coil

TOKO

weather band input coil

VCO variable capacitance diode

MURATA

Philips

MURATA

BB208

FM RF selectivity variable capacitance diode BB207

FM PIN diode

BAP70-02

FM PIN diode

BAP70-02

AM PIN diode

BAP70AM

10.7 MHz IF ceramic ﬁlter

SFELA10M7HAA0-B0

TEF6730HW

IF AGC

FM

AM

330 Ω

11 10

9

8

7

6

5

4

3

2

1

64

22 nF

001aae110

Fig 27. FM and AM mode

TEF6730_1

Product data sheet

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Philips Semiconductors

Front-end for digital-IF car radio

TEF6730HW

IF AGC

FM

330 Ω

AM

11 10

9

8

7

6

5

4

3

2

1

64

10

nF

22

nF

22 nF

FM/AM

FM HD

001aae111

Fig 28. FM/AM and FM HD mode

TEF6730HW

IF AGC

FM

AM

330 Ω

11 10

9

8

7

6

5

4

3

2

1

64

330 Ω

10

nF

22 nF

FM

AM

001aae112

Fig 29. FM and AM (narrow band) mode

TEF6730_1

Product data sheet

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47 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

TEF6730HW

IF AGC

FM

330 Ω

AM

11 10

9

8

7

6

5

4

3

2

1

64

330 Ω

10

nF

22

nF

22 nF

FM

FM HD

AM and AM HD

001aae113

Fig 30. FM, AM, AM HD and FM HD mode

TEF6730_1

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16. Package outline

HTQFP64: plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad

SOT855-1

c

y

exposed die pad

X

D

h

A

48

33

Z

E

49

32

e

(A )

3

A

2

E

H

E

h

M

w

θ

A

1

L

b

p

L

detail X

pin 1

index

64

17

1

16

M

v

A

M

w

Z

D

b

p

e

D

B

M

B

H

D

v

0

5

10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

1

A

2

A

3

b

c

D

E

e

H

D

H

E

L

v

w

y

Z

θ

p

h

p

D

E

max

°

0.12 1.05

0.05 0.95

0.27 0.18 10.1 4.7 10.1 4.7

0.17 0.12 9.9 4.5 9.9 4.5

12.15 12.15

11.85 11.85

0.75

0.45

1.45 1.45

1.05 1.05

7

0

mm

1.2

0.25

0.5

1

0.2 0.08 0.1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included

REFERENCES

JEDEC JEITA

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

04-05-18

05-05-11

SOT855-1

MS-026

Fig 31. Package outline SOT855-1 (HTQFP64)

TEF6730_1

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17. Soldering

17.1 Introduction to soldering surface mount packages

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

17.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow temperatures range from 215 °C to 260 °C depending on solder paste

material. The peak top-surface temperature of the packages should be kept below:

Table 40. SnPb eutectic process - package peak reﬂow temperatures (from J-STD-020C

July 2004)

Package thickness

< 2.5 mm

Volume mm³< 350

240 °C + 0/−5 °C

225 °C + 0/−5 °C

Volume mm³≥ 350

225 °C + 0/−5 °C

≥ 2.5 mm

Table 41. Pb-free process - package peak reﬂow temperatures (from J-STD-020C July

2004)

Package thickness

Volume mm³< 350

Volume mm³350 to

2000

Volume mm³> 2000

< 1.6 mm

260 °C + 0 °C

250 °C + 0 °C

260 °C + 0 °C

250 °C + 0 °C

245 °C + 0 °C

260 °C + 0 °C

245 °C + 0 °C

1.6 mm to 2.5 mm

≥ 2.5 mm

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

17.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

TEF6730_1

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– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

17.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

17.5 Package related soldering information

Table 42. Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package^[1]

Soldering method

Wave

Reﬂow^[2]

BGA, HTSSON..T^[3], LBGA, LFBGA, SQFP,

SSOP..T^[3], TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable^[4]

suitable

PLCC^[5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended^[5][6]

not recommended^[7]

not suitable

suitable

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L^[8], PMFP^[9], WQCCN..L^[8]

suitable

not suitable

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

TEF6730_1

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[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

TEF6730_1

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Front-end for digital-IF car radio

18. Footprint for soldering

13.650 (2 ×)

12.200 (2 ×)

10.400 (4 ×)

9.035 (4 ×)

7.900 (4 ×)

0.1425

(8 ×)

0.400 (3 ×)

0.285

(8 ×)

4.700

(2 ×)

4.800

(2 ×)

0.400

(3 ×)

0.500

0.285

(56 ×)

10.250 (2 ×)

12.400 (2 ×)

solder land

solder paste deposit

solder land plus solder paste

placement area

occupied area

Dimensions in mm

SOT855-1

Fig 32. Footprint

TEF6730_1

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Front-end for digital-IF car radio

19. Abbreviations

Table 43. Abbreviations

Acronym

ADC

AF

Description

Analog-to-Digital Converter

Alternative Frequency

Alternative Frequency Updating

Automatic Gain Control

Digital Auto Alignment

Digital Signal Processor

Distance

AFU

AGC

DAA

DSP

DX

HD

High Deﬁnition

IF

Intermediate Frequency

Low Noise Ampliﬁer

Local Oscillator

LNA

LO

LSB

LW

Least Signiﬁcant Bit

Long Wave

MSB

MW

PLL

RF

Most Signiﬁcant Bit

Medium Wave

Phase-Locked Loop

Radio Frequency

Serial Clock

SCL

SDA

SW

Serial Data

Short Wave

VCO

WB

Voltage-Controlled Oscillator

Weather Band

20. Revision history

Table 44. Revision history

Document ID

Release date

20060710

Data sheet status

Change notice

Supersedes

TEF6730_1

Product data sheet

-

TEF6730_1

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21. Legal information

21.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.semiconductors.philips.com.

to result in personal injury, death or severe property or environmental

21.2 Deﬁnitions

damage. Philips Semiconductors accepts no liability for inclusion and/or use

of Philips Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. Philips Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Philips Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local Philips Semiconductors

sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet,

the full data sheet shall prevail.

Terms and conditions of sale — Philips Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.semiconductors.philips.com/proﬁle/terms, including those

pertaining to warranty, intellectual property rights infringement and limitation

of liability, unless explicitly otherwise agreed to in writing by Philips

21.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representations

or warranties, expressed or implied, as to the accuracy or completeness of

such information and shall have no liability for the consequences of use of

such information.

Semiconductors. In case of any inconsistency or conﬂict between information

in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — Philips Semiconductors reserves the right to

make changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

21.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

Suitability for use — Philips Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of a Philips Semiconductors product can reasonably be expected

I²C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.

22. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

TEF6730_1

Product data sheet

Rev. 01 — 10 July 2006

55 of 56

TEF6730

Philips Semiconductors

Front-end for digital-IF car radio

23. Contents

1

2

3

4

5

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 4

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

17.4

17.5

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 51

Package related soldering information. . . . . . 51

18

19

20

Footprint for soldering . . . . . . . . . . . . . . . . . . 53

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 54

Revision history . . . . . . . . . . . . . . . . . . . . . . . 54

21

Legal information . . . . . . . . . . . . . . . . . . . . . . 55

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 55

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 55

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 6

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

21.1

21.2

21.3

21.4

7

Functional description . . . . . . . . . . . . . . . . . . . 8

FM mixer 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

FM RF AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Antenna DAA1 and DAA2. . . . . . . . . . . . . . . . . 8

AM LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

AM RF AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

AM mixer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

VCO and dividers . . . . . . . . . . . . . . . . . . . . . . . 9

Tuning PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

AM/FM IF AGC ampliﬁer. . . . . . . . . . . . . . . . . . 9

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

7.9

22

23

Contact information . . . . . . . . . . . . . . . . . . . . 55

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

8

8.1

8.1.1

8.1.2

8.2

8.2.1

8.2.2

8.2.3

8.2.4

8.2.5

8.2.6

8.2.7

8.2.7.1

8.2.8

I²C-bus protocol. . . . . . . . . . . . . . . . . . . . . . . . . 9

Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Read mode: data byte TUNER. . . . . . . . . . . . 10

Read mode: data byte ID . . . . . . . . . . . . . . . . 11

Write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Mode and subaddress byte for write. . . . . . . . 16

Write mode: data byte CONTROL . . . . . . . . . 22

Write mode: data byte PLLM . . . . . . . . . . . . . 23

Write mode: data byte PLLL . . . . . . . . . . . . . . 23

Write mode: data byte DAA . . . . . . . . . . . . . . 23

Write mode: data byte AGC . . . . . . . . . . . . . . 24

Write mode: data byte BAND . . . . . . . . . . . . . 25

Tuning overview . . . . . . . . . . . . . . . . . . . . . . . 26

Write mode: data byte TEST . . . . . . . . . . . . . 26

9

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 27

Thermal characteristics. . . . . . . . . . . . . . . . . . 27

Static characteristics. . . . . . . . . . . . . . . . . . . . 28

Dynamic characteristics . . . . . . . . . . . . . . . . . 29

I²C-bus characteristics . . . . . . . . . . . . . . . . . . 41

Overall system parameters. . . . . . . . . . . . . . . 43

Application information. . . . . . . . . . . . . . . . . . 45

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 49

10

11

12

13

14

15

16

17

17.1

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 50

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 50

17.2

17.3

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.semiconductors.philips.com.

For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.

Date of release: 10 July 2006

Document identifier: TEF6730_1


型号：	TEF6730HW
厂家：	NXP
描述：	Front-end for digital-IF car radio 前端为数字中频汽车收音机
文件：	总56页 (文件大小：260K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TEF6730HW [NXP]

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