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TFF1015HN/N1,135 [NXP]

TFF1015HN - Integrated mixer oscillator PLL for satellite LNB QFN 16-Pin;
TFF1015HN/N1,135
型号： TFF1015HN/N1,135
厂家： NXP    NXP
描述：

TFF1015HN - Integrated mixer oscillator PLL for satellite LNB QFN 16-Pin
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TFF1015HN/N1  
Integrated mixer oscillator PLL for satellite LNB  
Rev. 1 — 12 September 2011  
Product data sheet  
1. General description  
The TFF1015HN/N1 is an integrated downconverter for use in Low Noise Block (LNB)  
convertors in a 10.7 GHz to 12.75 GHz Ku band satellite receiver system.  
2. Features and benefits  
Low current consumption integrated pre-amplifier, mixer, buffer amplifier and  
PLL synthesizer  
Flat gain over frequency  
Single 5 V supply pin  
Low cost 25 MHz crystal  
Crystal controlled LO frequency generation  
Switched LO frequency (9.75 GHz and 10.6 GHz)  
Low phase noise  
Low spurious  
Low external component count  
Alignment-free concept  
ESD protection on all pins  
3. Applications  
Ku band LNB converters for digital satellite reception (DVB-S / DVB-S2)  
4. Quick reference data  
Table 1.  
Quick reference data  
VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50 unless otherwise specified.  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
VCC  
supply voltage  
4.5  
5
5.5  
V
ICC  
supply current  
RF input and IF output AC coupled  
-
-
52  
7
-
-
mA  
dB  
NFSSB  
single sideband noise figure  
measured at low band fIF = 1450 MHz and  
high band fIF = 1625 MHz  
fi(RF)  
RF input frequency  
conversion gain  
low band  
high band  
10.7 -  
11.7 -  
11.7 GHz  
12.75 GHz  
Gconv  
measured at low band fIF = 1450 MHz and  
high band fIF = 1625 MHz  
-
39  
-
dB  
 
 
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
Table 1.  
Quick reference data …continued  
VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50 unless otherwise specified.  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
s11  
input reflection coefficient  
output reflection coefficient  
fRF = 10.7 GHz to 12.7 GHz  
fIF_OUT = 950 MHz to 2150 MHz; Z0 = 75  
-
-
-
10 -  
10 -  
dB  
s22  
dB  
IP3O  
output third-order intercept point carrier power is 10 dBm (measured at output)  
15  
-
dBm  
5. Ordering information  
Table 2.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
TFF1015HN/N1 DHVQFN16  
plastic dual in-line compatible thermal enhanced very thin quad flat  
SOT763-1  
package; no leads; 16 terminals; body 2.5 3.5 0.85 mm  
6. Block diagram  
2
RF_GND1  
3
n.c.  
14  
IF  
4
RF  
15  
13  
IF_GND  
5
1
RF_GND2  
RF_GND3  
GND2  
internal  
supplies  
and bias  
16  
ON-CHIP  
REGULATOR  
V
CC  
6
7
9
GND1  
n.c.  
VREG  
8
LF  
12  
XO1  
PFD  
CHARGE  
PUMP  
11  
XO2  
DIVIDER  
10  
HB  
aaa-000007  
Fig 1. TFF1015HN/N1 block diagram  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
2 of 12  
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
7. Functional diagram  
V
CC  
RF  
XO1  
I
PLL  
XO2  
9.75 GHz/10.6 GHz  
HB  
aaa-00000  
Fig 2. Functional diagram  
8. Pinning information  
8.1 Pinning  
terminal 1  
index area  
2
3
4
5
6
7
15  
14  
13  
12  
11  
10  
RF_GND1  
n.c.  
IF_GND  
IF  
RF  
GND2  
XO1  
XO2  
HB  
RF_GND2  
GND1  
n.c.  
aaa-000009  
Transparent top view  
Fig 3. Pin configuration  
8.2 Pin description  
Table 3.  
Symbol  
GND  
Pin description  
Pin Description  
ground (exposed die pad)  
RF ground. Connect this pin to the exposed die pad landing.  
0
RF_GND3 1  
RF_GND1 2  
RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.  
not connected. Connect to RF on PCB. [1]  
n.c.  
RF  
3
4
RF input.  
RF_GND2 5  
RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
3 of 12  
 
 
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
Table 3.  
Symbol  
GND1  
n.c.  
Pin description …continued  
Pin Description  
6
7
8
9
Ground. Connect this pin to the exposed die pad landing and the RF input CPW line.  
not connected. Use this pin to route the ground layer on top of the PCB to the exposed die pad.  
Loop filter PLL. Connect loop filter between this pin and VREG (pin 9).  
LF  
VREG  
Regulated output voltage for PLL loop filter. Connect loop filter to this pin. Decouple against die pad via pin  
7.  
HB  
10 High band / low band selection. Connect this pin to the tone detector or to a logic signal.  
11 Crystal connection 2. Connect crystal between this pin and XO1 (pin 12).  
12 Crystal connection 1. Connect crystal between this pin and XO2 (pin 11).  
13 Ground. Connect this pin to the exposed die pad landing.  
14 IF output  
XO2  
XO1  
GND2  
IF  
IF_GND  
VCC  
15 IF output ground. Connect this pin to the exposed die pad landing and the output transmission line ground.  
16 Supply voltage  
[1] The distance between the outer edges of pin 2 and pin 3 is 740 m. This gives an optimum transition from a 1.1 mm wide, Z0 = 50 line  
on RO4223 Printed-Circuit Board (PCB) material of 0.5 mm height to the TFF1015HN/N1.  
9. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
Parameter  
Conditions  
Min  
0.5  
0.5  
40  
Max  
+6  
Unit  
V
supply voltage  
VI(HB)  
Tstg  
input voltage on pin HB  
storage temperature  
+6  
V
+125  
C  
10. Recommended operating conditions  
Table 5.  
Symbol  
VCC  
Operating conditions  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage  
4.5  
5
5.5  
5.5  
+85  
-
V
VI(HB)  
Tamb  
input voltage on pin HB  
ambient temperature  
characteristic impedance  
RF input frequency  
0
-
V
40  
+25  
C  
Z0  
-
50  
fi(RF)  
low band  
high band  
low band  
high band  
low band  
high band  
10.7  
-
11.7  
12.75  
-
GHz  
GHz  
GHz  
GHz  
GHz  
GHz  
pF  
11.7  
-
fLO  
LO frequency  
-
9.75  
[1]  
-
10.6  
-
fo(IF)  
IF output frequency  
0.95  
-
1.95  
2.15  
-
1.1  
-
CL(xtal)  
ESR  
fxtal  
crystal load capacitance  
equivalent series resistance  
crystal frequency  
-
-
-
10  
-
40  
-
25  
MHz  
[1] For a 10.75 GHz LO frequency, select high band and use a crystal with frequency 10.75 GHz / 424 = 25.353774 MHz.  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
4 of 12  
 
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
11. Thermal characteristics  
Table 6.  
Symbol  
Rth(j-c)  
Thermal characteristics  
Parameter  
Conditions  
Typ  
Unit  
thermal resistance from junction to case  
35  
K/W  
12. Characteristics  
Table 7.  
Characteristics  
VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50 unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min Typ Max Unit  
ICC  
supply current  
RF input and IF output AC coupled  
-
-
52  
-
-
mA  
n(itg)  
integrated phase noise density  
integration offset frequency =  
10 kHz to 13 MHz;  
1.5  
RMS  
loop bandwidth = crossover bandwidth  
NFSSB  
Gconv  
single sideband noise figure  
conversion gain  
measured at low band fIF = 1450 MHz  
and high band fIF = 1625 MHz  
-
-
7
-
-
dB  
dB  
measured at low band fIF = 1450 MHz  
and high band fIF = 1625 MHz  
39  
Gconv  
conversion gain variation  
over whole IF band  
-
-
-
-
2.0  
0.5  
-
-
dB  
dB  
dB  
dB  
in every 36 MHz band  
fRF = 10.7 GHz to 12.7 GHz  
s11  
s22  
input reflection coefficient  
output reflection coefficient  
10 -  
10 -  
fIF_OUT = 950 MHz to 2150 MHz;  
Z0 = 75   
IP3O  
output third-order intercept point  
carrier power is 10 dBm (measured at  
the output)  
-
-
15  
6
-
-
dBm  
dBm  
PL(1dB)  
output power at 1 dB gain  
compression  
VIL(HB)  
VIH(HB)  
Rpd(HB)  
low level input voltage on pin HB  
high level input voltage on pin HB  
pull down resistance on pin HB  
-
-
-
0.8  
-
V
V
2.0  
80 110 140 k  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
5 of 12  
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
13. Application information  
5 V  
9 V ~ 21 V  
5 V LINEAR  
REGULATOR  
pHemt bias  
V/T detector  
DH  
DV  
D2  
LB  
GH  
GV  
G2  
HB  
1 μF  
GH  
DH  
1
16  
RF_GND1  
n.c.  
IF_GND  
IF  
2
3
4
5
6
7
15  
14  
13  
12  
11  
10  
IF  
100 pF  
H
V
RF  
GND2  
XO1  
XO2  
HB  
RF_GND2  
GND1  
n.c.  
25 MHz  
crystal  
G2  
D2  
8
9
GV  
DV  
220 pF  
100 nF  
330 Ω  
1 μF  
aaa-000010  
Fig 4. Application diagram of TFF1015HN/N1  
Table 8. List of netnames  
See Figure 4.  
Netname  
GH  
Description  
Gate voltage of 1st stage LNA. Horizontal polarization  
Drain voltage of 1st stage LNA. Horizontal polarization  
Gate voltage of 1st stage LNA. Vertical polarization  
Drain voltage of 1st stage LNA. Vertical polarization  
Gate voltage of 2nd stage LNA  
DH  
GV  
DV  
G2  
D2  
Drain voltage of 2nd stage LNA  
HB  
High band oscillator supply control  
LB  
Low band oscillator supply control  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
6 of 12  
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
SUPPLY AND  
BAND/POLARIZATION SWITCHING  
5 V  
REGULATOR  
horizontal  
polarization  
V
CC  
HB  
1st STAGE LNA  
image  
reject filter  
RF gain  
lF gain  
mixer  
2nd STAGE LNA  
vertical  
polarization  
PLL  
1st STAGE LNA  
9.75 GHz/10.6 GHz  
aaa-000011  
Fig 5. LNB system block diagram with TFF1015HN/N1  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
7 of 12  
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
14. Package outline  
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;  
16 terminals; body 2.5 x 3.5 x 0.85 mm  
SOT763-1  
B
A
D
A
A
1
E
c
detail X  
terminal 1  
index area  
C
terminal 1  
index area  
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
7
L
1
8
9
E
h
e
16  
15  
10  
D
h
X
0
2.5  
scale  
5 mm  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
1
h
h
max.  
0.05 0.30  
0.00 0.18  
3.6  
3.4  
2.15  
1.85  
2.6  
2.4  
1.15  
0.85  
0.5  
0.3  
mm  
0.05  
0.1  
1
0.2  
0.5  
2.5  
0.1  
0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-10-17  
03-01-27  
SOT763-1  
- - -  
MO-241  
- - -  
Fig 6. Package outline SOT763-1  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
8 of 12  
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
15. Abbreviations  
Table 9.  
Abbreviations  
Description  
Acronym  
CPW  
DVB-S  
DVB-S2  
ESD  
CoPlanar Waveguide  
Digital Video Broadcasting by Satellite  
Digital Video Broadcasting - Satellite - Second generation  
ElectroStatic Discharge  
IF  
Intermediate Frequency  
Ku band  
LO  
K-under band  
Local Oscillator  
PFD  
Phase Frequency Detector  
pseudomorphic High electron mobility transistor  
Phase-Locked Loop  
pHemt  
PLL  
RF  
Radio Frequency  
VCO  
V/T  
Voltage-Controlled Oscillator  
Voltage / Tone  
16. Revision history  
Table 10. Revision history  
Document ID  
Release date  
20110912  
Data sheet status  
Product data sheet  
Change notice  
Supersedes  
TFF1015HN_N1 v.1  
-
-
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
9 of 12  
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
17. Legal information  
17.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
17.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
17.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
10 of 12  
 
 
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
17.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
18. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
TFF1015HN_N1  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 1 — 12 September 2011  
11 of 12  
 
 
TFF1015HN/N1  
NXP Semiconductors  
Integrated mixer oscillator PLL for satellite LNB  
19. Contents  
1
2
3
4
5
6
7
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3  
8
8.1  
8.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 4  
Thermal characteristics . . . . . . . . . . . . . . . . . . 5  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Application information. . . . . . . . . . . . . . . . . . . 6  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9  
10  
11  
12  
13  
14  
15  
16  
17  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
17.1  
17.2  
17.3  
17.4  
18  
19  
Contact information. . . . . . . . . . . . . . . . . . . . . 11  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 12 September 2011  
Document identifier: TFF1015HN_N1  
 

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