TJA1050U [NXP]
High speed CAN transceiver; 高速CAN收发器
| 型号： | TJA1050U |
| 厂家： | 
NXP |
| 描述： | High speed CAN transceiver |
| 文件： | 总16页 (文件大小：80K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TJA1050
High speed CAN transceiver
Preliminary specification
1999 Sep 27
File under Integrated Circuits, IC18
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
FEATURES
GENERAL DESCRIPTION
• Fully compatible with the “ISO 11898” standard
• High speed (up to 1 Mbaud)
The TJA1050 is the interface between the CAN protocol
controller and the physical bus. The device provides
differential transmit capability to the bus and differential
receive capability to the CAN controller.
• Transmit Data (TXD) dominant time-out function
• Bus lines protected against transients in an automotive
environment
The TJA1050 is the successor to the PCA82C250 high
speed CAN transceiver. The most important
improvements are:
• Silent mode in which the transmitter is disabled
• Differential receiver with wide common-mode range for
high ElectroMagnetic Immunity (EMI)
• Much lower ElectroMagnetic Emission (EME) due to
optimal matching of the CANH and CANL output signals
• Input levels compatible with 3.3 V devices
• Thermally protected
• Improved behaviour in case of an unpowered node.
• Short-circuit proof to battery and ground
• An unpowered node does not disturb the bus lines
• At least 110 nodes can be connected.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN. MAX. UNIT
4.75
5.25
+40
V
V
VCANH
DC voltage at CANH
0 < VCC < 5.25 V; no time limit
−27
VCANL
DC voltage at CANL
Vi(dif)(bus)
tPD(TXD-RXD)
differential bus input voltage
dominant
VS = 0 V
1.5
3
V
propagation delay TXD to RXD;
see Fig.4
−
250
ns
Tamb
operating ambient temperature
−40
+125 °C
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TJA1050T
TJA1050U
SO8
plastic small outline package; 8 leads; body width 3.9 mm
bare die
SOT96-1
−
−
1999 Sep 27
2
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
BLOCK DIAGRAM
V
CC
3
8
S
60 µA
V
CC
GND
TEMPERATURE
PROTECTION
200
µA
TXD
1
DOMINANT
TIME-OUT
TIMER
DRIVER
TXD
RXD
7
V
CC
CANH
25
kΩ
4
5
0.5V
CC
25
RECEIVER
kΩ
GND
GND
CANL
6
REFERENCE
VOLTAGE
TJA1050
V
ref
2
GND
MGS374
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
TXD
1
transmit data input; reads in data
from the CAN controller to the bus
line drivers
handbook, halfpage
TXD
1
2
3
4
8
7
6
5
S
GND
VCC
2
3
4
ground
GND
CANH
CANL
supply voltage
TJA1050T
V
RXD
receive data output; reads out
data from the bus lines to the
CAN controller
CC
V
RXD
ref
MGS375
Vref
5
6
7
8
reference voltage output
LOW-level CAN bus line
HIGH-level CAN bus line
CANL
CANH
S
select input for
Fig.2 Pin configuration.
high speed mode/silent mode
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
FUNCTIONAL DESCRIPTION
Control line S (pin 8) allows two operating modes to be
selected; high speed mode or silent mode.
The TJA1050 is the interface between the CAN protocol
controller and the physical bus. It is primarily intended for
high speed automotive applications using baud rates from
40 kbaud up to 1 Mbaud. It provides differential transmit
capability to the bus and differential receiver capability to
the CAN protocol controller. It is fully compatible to the
“ISO 11898” standard.
High speed mode is the normal operating mode and is
selected by connecting pin S to ground. It is the default
mode if pin S is unconnected.
In the silent mode, the transmitter is disabled. All other IC
functions continue to operate. The silent mode is selected
by connecting pin S to VCC
.
A current-limiting circuit protects the transmitter output
stage from damage caused by accidental short-circuit to
either positive or negative battery voltage, although power
dissipation increases during this fault condition.
A ‘TXD Dominant Time-out’ timer circuit prevents the bus
lines being driven to a permanent dominant state (blocking
all network communication) if TXD is forced permanently
LOW by a hardware and/or software application failure.
The timer is triggered by a negative edge on TXD. If the
duration of the LOW-level on TXD exceeds the internal
timer value, the transmitter is disabled, driving the bus into
a recessive state. The timer is reset by a positive edge on
TXD.
A thermal protection circuit protects the IC from damage by
switching off the transmitter if the junction temperature
exceeds a value of approximately 165 °C. Because the
transmitter dissipates most of the power, the power
dissipation and temperature of the IC is reduced. All other
IC functions continue to operate. The transmitter off-state
resets when TXD goes HIGH. The thermal protection
circuit is particularly needed when a bus line short-circuits.
The CANH and CANL lines are protected from automotive
electrical transients (according to “ISO 7637”; see Fig.6)
and are also protected from Electro-Static-Discharge
(ESD) of up to 4 kV from the human body.
Table 1 Function table of the CAN transceiver
(X = don’t care)
VCC
TXD
S
CANH
CANL
LOW
BUS STATE RXD
4.75 to 5.25 V
4.75 to 5.25 V
0
0 (or floating)
HIGH
dominant
recessive
recessive
recessive
recessive
0
1
1
X
X
X
1 (or floating)
X
1
X
X
X
0.5 × VCC
0.5 × VCC
0.5 × VCC
0.5 × VCC
4.75 to 5.25 V
<2 V (not powered)
2 V < VCC < 4.75 V
0 V <CANH< VCC 0 V <CANL< VCC
0 V <CANH< VCC 0 V <CANL< VCC
>2 V
1999 Sep 27
4
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). All voltages are referenced to GND (pin 2).
Positive currents flow into the IC.
SYMBOL
PARAMETER
supply voltage
CANL, VCANH DC voltage at CANL and CANH
CONDITIONS
MIN.
−0.3
MAX.
+5.25
UNIT
VCC
V
V
V
0 < VCC < 5.25 V;
no time limit
−27
+40
V
TXD, VRXD
,
DC voltage at TXD, RXD, Vref and S
transient voltage at CANH and CANL
−0.3
VCC + 0.3
V
Vref and VS
Vtrt(CANH)
Vtrt(CANL)
,
time limit is 1 µs
−55
−200
−4
+55
+200
+4
V
V
note 1
Vesd
electrostatic discharge at CANH; CANL note 3
kV
kV
electrostatic discharge at TXD; VCC
;
note 3
−2
+2
RXD; Vref and S
electrostatic discharge at all pins
storage temperature
note 4
−200
−55
−40
−40
+200
+150
+125
+150
V
Tstg
Tamb
Tj
°C
°C
°C
operating ambient temperature
junction temperature
note 2
Notes
1. The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b,
(see Fig.6).
2. In accordance with “IEC 747-1”. An alternative definition of Tj is: Tj = Tamb + P × Rth(j-a), where Rth(j-a) is a fixed value
to be used for the calculation of Tj. The rating for Tj limits the allowable combinations of power dissipation (P) and
ambient temperature (Tamb).
3. Human body model; C = 100 pF R = 1.5 kΩ.
4. Machine model; C = 200 pF R = 25 Ω.
THERMAL CHARACTERISTICS
According to IEC 747-1.
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
thermal resistance from junction to
ambient; TJA1050T(SO8)
160
K/W
QUALITY SPECIFICATION
Quality specification “SNW-FQ-611 part D” is applicable.
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
CHARACTERISTICS
VCC = 4.75 to 5.25 V; Tamb = −40 to +125 °C; RL = 60 Ω unless specified otherwise; all voltages are referenced to GND
(pin 2); positive currents flow into the IC; all parameters are guaranteed over the ambient temperature range by design,
but only 100% tested at Tamb = 25 °C unless specified otherwise.
SYMBOL
Supply (VCC
ICC
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
)
supply current
dominant; VTXD = 0 V
tbf
−
−
75
mA
recessive; VTXD = VCC tbf
13
mA
Transmitter data input (TXD)
VIH
VIL
HIGH-level input voltage
output recessive
output dominant
VTXD = VCC
2.0
−
−
0
VCC + 0.3
+0.8
V
LOW-level input voltage
HIGH-level input current
LOW-level input current
TXD input capacitance
−0.3
−30
−100
−
V
IIH
+30
µA
µA
pF
IIL
VTXD = 0 V
−200
−300
tbf
Ci(TXD)
not tested
−
Mode select input (S)
VIH
VIL
IIH
HIGH-level input voltage
silent mode
high speed mode
VS = VCC
2.0
−0.3
30
−
VCC + 0.3
+0.8
V
LOW-level input voltage
HIGH-level input current
LOW-level input current
−
V
60
0
100
µA
µA
IIL
VS = 0 V
−30
+30
Receiver data output (RXD)
IOH HIGH-level output current
IOL
VRXD = 0.7 VCC
VRXD = 0.45 V
tbf
2
tbf
tbf
20
mA
mA
LOW-level output current
8.5
Vref
Vref
reference output voltage
−50 µA < IVref < 50 µA
0.45VCC
0.5VCC
0.55VCC
V
Bus lines (CANH; CANL)
VCANH(reces) recessive bus voltage
VCANL(reces)
;
VTXD = VCC; no load
2.0
−
−
3.0
V
Io(CANH)(reces); recessive output current
Io(CANL)(reces)
−27 V < VCANH
,
−2.5
+2.5
mA
VCANL < 32 V;
0 V < VCC < 5.25 V
Vo(CANH)
Vo(CANL)
Vi(dif)(bus)
CANH dominant output
voltage
VTXD = 0 V
2.8
0.5
1.5
−
−
−
4.5
2.0
3.0
V
V
V
CANL dominant output
voltage
differential bus input voltage VTXD = 0 V;
(VCANH − VCANL
)
42.5 < RL < 60 Ω
(dominant)
V
TXD = VCC; no load
−500
−35
35
−
−
−
+50
−95
150
mV
mA
mA
(recessive)
Io(sc)(CANH)
Io(sc)(CANL)
CANH short-circuit output
current
VCANH = 0 V;
VTXD = 0 V
CANL short-circuit output
current
VCANL = 36 V;
VTXD = 0 V
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
SYMBOL
Vdif(th)
PARAMETER
CONDITIONS
MIN.
0.5
TYP.
0.7
MAX.
0.9
UNIT
differential receiver threshold −12 V < VCANH,
V
voltage
VCANL < 12 V; see Fig.5
Vi(dif)(hys)
differential receiver input
voltage hysteresis
see Fig.5
100
10
−
200
50
mV
kΩ
%
Ri(cm)(CANH)
Ri(cm)(CANL)
Ri(cm)(m)
;
CANH; CANL common
mode input resistance
25
−
matching between CANH
and CANL common mode
input resistance
VCANH = VCANL
−3
+3
Ri(dif)
Ci(CANH)
Ci(CANL)
differential input resistance
20
50
100
20
kΩ
;
CANH; CANL input
capacitance
VTXD = VCC; not tested
−
−
pF
Ci(dif)
differential input capacitance
−
−
−
−
10
pF
ILI(CANH)
ILI(CANL)
;
CANH; CANL input leakage VCC = 0 V;
current VCANH = VCANL = 5 V
500
µA
Thermal shutdown
Tj(sd) shutdown junction
temperature
155
165
180
°C
Timing characteristics (see Figs 3 and 4)
td(TXD-BUSon) delay TXD to bus active
td(TXD-BUSoff) delay TXD to bus inactive
td(BUSon-RXD) delay bus active to RXD
td(BUSoff-RXD) delay bus inactive to RXD
VS = 0 V
tbf
tbf
tbf
tbf
150
100
ns
ns
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
TEST AND APPLICATION INFORMATION
+
5 V
handbook, halfpage
47
µF
100
nF
V
CC
3
TXD
CANH
CANL
1
5
4
7
6
V
ref
R
C
L
L
TJA1050
60 Ω
100 pF
RXD
2
8
GND
S
15 pF
MGS376
Fig.3 Test circuit for timing characteristics.
HIGH
LOW
TXD
CANH
CANL
dominant
(BUS on)
0.9 V
(1)
V
i(dif)(bus)
RXD
0.5 V
recessive
(BUS off)
HIGH
0.7V
CC
0.3V
CC
LOW
t
t
d(TXD-BUSon)
t
d(TXD-BUSoff)
t
d(BUSon − RXD)
d(BUSoff − RXD)
t
t
PD TXD − RXD
(
)
(
)
PD TXD − RXD
MGS377
(1) Vi(dif)(bus) = VCANH − VCANL
Fig.4 Timing diagram for AC characteristics.
8
1999 Sep 27
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
MGS378
V
RXD
HIGH
LOW
hysteresis
0.5
0.9
V
i(dif)(bus)
Fig.5 Hysteresis of the receiver.
+
5 V
47
µF
100
nF
V
CC
3
TXD
1 nF
CANH
1
5
4
7
V
ref
TRANSIENT
GENERATOR
TJA1050
1 nF
CANL
6
RXD
MGS379
2
8
GND
S
15 pF
The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
+
5 V
120 Ω
47
µF
100
nF
V
CC
3
TXD
1
5
4
TX0
CANH
CANL
7
6
SJA1000
V
ref
CAN
BUS LINE
CAN
TJA1050
CONTROLLER
RXD
RX0
2
8
GND
S
120 Ω
MGS380
Fig.7 Application information.
BONDING PAD LOCATIONS FOR TJA1050U
Table 2 Bonding pad locations
All x/y coordinates represent the position of the centre of
each pad (in µm) with respect to x/y = 0 of the die (see
Fig.8).
COORDINATES
SYMBOL
PAD
x
y
8
7
6
5
handbook, halfpage
TXD
GND
VCC
1
2
3
4
5
6
7
8
103
740.5
886.5
1371.5
1394
1006
542.5
103
103
85
111
RXD
Vref
111
TJA1050U
1094
1111
1111
1097
test pad
CANL
CANH
S
x
0
1
2
3
4
0
MGS381
y
Fig.8 Bonding pad locations.
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
PACKAGE OUTLINE
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
97-05-22
SOT96-1
076E03S
MS-012AA
1999 Sep 27
11
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern
processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no
control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors
assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of
the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
1999 Sep 27
14
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
NOTES
1999 Sep 27
15
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Pakistan: see Singapore
Belgium: see The Netherlands
Brazil: see South America
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America
Czech Republic: see Austria
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
285002/01/pp16
Date of release: 1999 Sep 27
Document order number: 9397 750 05732
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