TJA1054T [NXP]
Fault-tolerant CAN transceiver; 容错CAN收发器
| 型号： | TJA1054T |
| 厂家： | 
NXP |
| 描述： | Fault-tolerant CAN transceiver |
| 文件： | 总20页 (文件大小：128K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TJA1054
Fault-tolerant CAN transceiver
1999 Feb 11
Preliminary specification
File under Integrated Circuits, IC18
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
FEATURES
GENERAL DESCRIPTION
The TJA1054 is the interface between the protocol
controller and the physical wires of the bus lines in a
Control Area Network (CAN). It is primarily intended for
low-speed applications, up to 125 kBaud, in passenger
cars. The device provides differential transmit capability
but will switch in error conditions to single-wire transmitter
and/or receiver.
Optimized for in-car low-speed communication
• Baud rate up to 125 kBaud
• Up to 32 nodes can be connected
• Supports unshielded bus wires
• Very low Radio Frequency Interference (RFI) due to
built-in slope control function and a very good matching
of the CANL and CANH bus outputs
The TJA1054T is pin and upwards compatible with the
PCA82C252T and the TJA1053T. This means that these
two devices can be replaced by the TJA1054T with
retention of all functions.
• Fully integrated receiver filters
• Permanent dominant monitoring of transmit data input
• Good immunity performance of ElectroMagnetic
Compatibility (EMC) in normal operating mode and in
low power modes.
The most important improvements are:
• Very low RFI due to a very good matching of the CANL
and CANH bus lines outputs
Bus failure management
• Good immunity performance of EMC, especially in low
power modes
• Supports single-wire transmission modes with ground
offset voltages up to 1.5 V
• Fully wake-up capability during failure modes
• Automatic switching to single-wire mode in the event of
bus failures, even when the CANH bus wire is
short-circuited to VCC
• Extended bus failure management including
short-circuit of the CANH bus line to VCC
• Supports easy fault localization
• Automatic reset to differential mode if bus failure is
removed
• Two-edge sensitive wake-up input signal via pin WAKE.
• Fully wake-up capability during failure modes.
Protection
• Short-circuit proof to battery and ground in
12 V powered systems
• Thermally protected
• Bus lines protected against transients in an automotive
environment
• An unpowered node does not disturb the bus lines.
Support for low power modes
• Low current sleep and standby mode with wake-up via
the bus lines
• Power-on reset flag on the output.
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
plastic small outline package; 14 leads; body width 3.9 mm
VERSION
TJA1054T
SO14
SOT108-1
1999 Feb 11
2
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
4.75
TYP.
MAX.
5.25
UNIT
VCC
supply voltage on pin VCC
battery voltage on pin BAT
−
−
−
−
V
V
V
V
VBAT
no time limit
−0.3
5.0
−
+40
27
operating mode
load dump
40
IBAT
battery current on pin BAT
CANH bus line voltage
Sleep mode; VCC = 0 V;
VBAT = 12 V
−
30
50
µA
VCANH
VCC = 0 to 5.5 V;
−40
−40
−
+40
+40
V
VBAT ≥ 0 V;
no time limit
VCANL
CANL bus line voltage
VCC = 0 to 5.5 V;
−
V
VBAT ≥ 0 V;
no time limit
∆VCANH
∆VCANL
tPD
CANH bus line transmitter voltage drop ICANH = −40 mA
−
−
1.4
1.4
−
V
CANH bus line transmitter voltage drop ICANL = 40 mA
−
−
V
propagation delay
TXD to RXD
−
1
µs
µs
µs
°C
tr
bus line output rise time
bus line output fall time
operating ambient temperature
10 to 90%; C1 = 10 nF
90 to 10%; C1 = 1 nF
−
0.6
0.3
−
−
tf
−
−
Tamb
−40
+125
1999 Feb 11
3
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
BLOCK DIAGRAM
V
BAT
14
CC
10
1
INH
TEMPERATURE
PROTECTION
7
5
6
WAKE-UP
STANDBY
CONTROL
WAKE
STB
EN
9
RTL
11
CANH
V
12
CC
CANL
8
RTH
2
DRIVER
TXD
ERR
TIMER
TJA1054
V
V
CC
CC
FAILURE DETECTOR
PLUS WAKE-UP
PLUS TIME-OUT
4
FILTER
FILTER
RECEIVER
3
RXD
13
GND
MGL421
Fig.1 Block diagram.
4
1999 Feb 11
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
PINNING
SYMBOL
INH
PIN
DESCRIPTION
1
2
3
4
inhibit output for switching an external voltage regulator if a wake-up signal occurs
transmit data input for activating the driver to the bus lines
TXD
RXD
ERR
receive data output for reading out the data from the bus lines
error, wake-up and power-on indication output; active LOW in normal operating mode when the
bus has a failure and in low power modes (wake-up signal or in power-on standby)
STB
EN
5
6
standby digital control signal input (active LOW); defines together with input signal on pin EN the
state of the transceiver (in normal and low power modes); see Table 2 and Fig.3
enable digital control signal input; defines together with input signal on pin STB the state of the
transceiver (in normal and low power modes); see Table 2 and Fig.3
WAKE
RTH
7
8
local wake-up signal input; falling and rising edges are both detected
termination resistor connection; in case of a CANH bus wire error the line is terminated with a
selectable impedance
RTL
9
termination resistor connection; in case of a CANL bus wire the line is terminated with a
selectable impedance
VCC
10 supply voltage
CANH
CANL
GND
BAT
11 HIGH-level voltage bus line
12 LOW-level voltage bus line
13 ground
14 battery supply
handbook, halfpage
INH
1
2
3
4
5
6
7
14 BAT
13
TXD
RXD
GND
12 CANL
11
TJA1054T
ERR
STB
CANH
10
9
V
CC
EN
RTL
RTH
WAKE
8
MGL422
Fig.2 Pin configuration.
5
1999 Feb 11
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
The differential receiver threshold voltage is set at
FUNCTIONAL DESCRIPTION
−3.2 V typically (VCC = 5 V). This ensures correct
reception with a noise margin as high as possible in the
normal operating mode and in the event of failures 1, 2,
4 and 6a. These failures, or recovery from them, do not
destroy ongoing transmissions.
The TJA1054 is the interface between the CAN protocol
controller and the physical wires of the CAN bus
(see Fig.7). It is primarily intended for low speed
applications, up to 125 kBaud, in passenger cars.
The device provides differential transmit capability to the
CAN bus and differential receive capability to the CAN
controller.
Failures 3 and 6 are detected by comparators connected
to the CANH and CANL bus lines, respectively. If the
comparator threshold is exceeded for a certain period of
time, the reception is switched to the single-wire mode.
This time is needed to avoid false triggering by external RF
fields. Recovery from these failures is detected
automatically after a certain time-out (filtering) and no
transmission is lost. In the event of failure 3 the CANH
driver and pin RTH are switched off. In the event of
failure 6 the CANL driver and pin RTL are switched off.
The pull-up current on pin RTL and the pull-down current
on pin RTH will not be switched off.
To reduce RFI, the rise and fall slope are limited. This
allows the use of an unshielded twisted pair or a parallel
pair of wires for the bus lines. Moreover, it supports
transmission capability on either bus line if one of the wires
is corrupted. The failure detection logic automatically
selects a suitable transmission mode.
In normal operating mode (no wiring failures) the
differential receiver is output on pin RXD (see Fig.1).
The differential receiver inputs are connected to
pins CANH and CANL through integrated filters.
The filtered input signals are also used for the single-wire
receivers. The receivers connected to pins CANH
and CANL have threshold voltages that ensure a
maximum noise margin in single-wire mode.
Failures 3a, 4 and 7 initially result in a permanent
dominant level on pin RXD. After a time-out, the CANL
driver and pin RTL are switched off (failures 4 and 7) or
the CANH driver and pin RTH are switched off (failure 3a).
Only a weak pull-up on pin RTL or a weak pull-down on
pin RTH remains. Reception continues by switching to the
single-wire mode via pins CANH or CANL. When
failures 3a, 4 or 7 are removed, the recessive bus levels
are restored. If the differential voltage remains below the
recessive threshold level for a certain period of time,
reception and transmission switch back to the differential
mode.
A timer has been integrated at pin TXD. This timer
prevents the TJA1054 from driving the bus lines to a
permanent dominant state.
Failure detector
The failure detector is fully active in the normal operating
mode. After the detection of a single bus failure the
detector switches to the appropriate mode (see Table 1).
If any of the wiring failure occurs, the output signal on
pin ERR will become LOW. On error recovery, the output
signal on pin ERR will become HIGH again.
Table 1 Bus failures
During all single-wire transmissions, the EMC
performance (both immunity and emission) is worse than
in the differential mode. The integrated receiver filters
suppress any HF noise induced into the bus wires.
The cut-off frequency of these filters is a compromise
between propagation delay and HF suppression. In the
single-wire mode, LF noise cannot be distinguished from
the required signal.
FAILURE
DESCRIPTION
CANH wire interrupted
1
2
CANL wire interrupted
3
CANH short-circuited to battery
CANH short-circuited to VCC
CANL short-circuited to ground
CANH short-circuited to ground
CANL short-circuited to battery
CANL short-circuited to VCC
CANL mutually short-circuited to CANH
3a
4
5
6
6a
7
1999 Feb 11
6
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
If VCC is provided the wake-up request can be read on the
ERR or RXD outputs, so the external microcontroller can
wake-up the transceiver (switch to normal operating
mode) via pins STB and EN.
Low power modes
The transceiver provides 3 low power modes which can be
entered and exited via pins STB and EN (see Table 2 and
Fig.3).
To prevent false wake-up due to transients or RF fields,
the wake-up voltage levels have to be maintained for a
certain period of time. In the low power modes the failure
detection circuit remains partly active to prevent an
increased power consumption in the event of
failures 3, 3a, 4 and 7.
The Sleep mode is the mode with the lowest power
consumption. Pin INH is switched to high-impedance for
deactivation of the external voltage regulator. Pin CANL is
biased to the battery voltage via pin RTL. If the supply
voltage is provided pins RXD and ERR will signal the
wake-up interrupt signal.
Pin INH is set to floating only during the goto-sleep
command and stays floating during the Sleep mode. If
pin INH is set to floating, pin INH will not be set to
HIGH-level again just by a mode change to normal
operating mode. Pin INH will be set to HIGH-level by the
following events only:
The standby mode will react the same as the Sleep mode
but with a HIGH-level on pin INH.
The power-on standby mode is the same as the standby
mode with the battery power-on flag instead of the
wake-up interrupt signal on pin ERR. The output on
pin RXD will show the wake-up interrupt. This mode is only
for reading out the power-on flag.
• power-on (VBAT switching-on at cold start)
• rising or falling edge on pin WAKE
Wake-up requests are recognized by the transceiver when
a dominant signal is detected on either bus line or if
pin WAKE detects an edge (rising or falling) which stays
longer HIGH or LOW respectively during a certain period
of time. On a wake-up request the transceiver will set the
output on pin INH which can be used to activate the
external supply voltage regulator.
• a message with 5 consecutive dominant bits during
pin EN or pin STB is at LOW-level.
The signals on pins STB and EN will internally be set to
LOW-level when VCC is below a certain threshold voltage
so providing fail safe functionality.
Table 2 Normal operating and low power modes
ERR
RXD
RTL
SWITCHED
TO
MODE
STB
EN
LOW
HIGH
LOW
HIGH
Goto-sleep
command
0
1
VBAT
wake-up interrupt
signal;
notes 2 and 3
wake-up interrupt
signal;
notes 2 and 3
Sleep
0
0
1
0(1)
0
VBAT
VBAT
Standby
Power-on
standby
0
VBAT power-on flag;
notes 2 and 4
wake-up interrupt
signal;
VBAT
notes 2 and 3
Normal
operating
1
1
error flag
no error
flag
dominant
received data
recessive
received data
VCC
Notes
1. In case the goto-sleep command was used before. When VCC drops pin EN will become LOW, but this does not effect
the internal functions due to the fail safe functionality.
2. If the supply voltage VCC is present.
3. Wake-up interrupts are released when entering the normal operating mode.
4. VBAT power-on flag will be reset when entering the normal operating mode.
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
Power-on
After power-on (VBAT switched on) the signal on pin INH will become HIGH and an internal power-on flag will be set. This
flag can be read in the power-on standby mode via pin ERR (STB = 1; EN = 0) and will be reset by entering the normal
operating mode.
Protections
A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery
voltage.
If the junction temperature exceeds a maximum value, the transmitter output stages are disabled. Because the
transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and
hence a lower chip temperature. All other parts of the IC will remain operating.
The pins CANH and CANL are protected against electrical transients which may occur in an automotive environment.
POWER-ON
STANDBY
10
(5)
GOTO
SLEEP
01
(4)
NORMAL
11
STANDBY
00
SLEEP
00
(1)
(2)
(3)
MBK949
(1) Mode change via input ports STB and EN.
(2) Mode change via input ports STB and EN, but in the sleep mode INH is inactive and possibly there is no VCC
Mode control is only possible if VCC of the transceiver is active.
.
(3) INH is activated after wake-up via bus or input port WAKE.
(4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared.
(5) Transitions to sleep mode: INH is deactivated.
Fig.3 Mode control.
1999 Feb 11
8
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
−0.3
MAX.
UNIT
VCC
supply voltage on pin VCC
battery voltage on pin BAT
DC voltage on pins 2 to 6
DC voltage on pin CANH
DC voltage on pin CANL
+6
V
VBAT
Vn
−0.3
−0.3
−40
+40
V
V
V
V
V
VCC + 0.3
+40
VCANH
VCANL
Vtrt(n)
−40
+40
transient voltage on
see Fig.6
−150
+100
pins CANH and CANL
VWAKE
IWAKE
VINH
VRTH
VRTL
RRTH
RRTL
Tvj
DC input voltage on pin WAKE
DC input current on pin WAKE
DC output voltage on pin INH
DC voltage on pin RTH
−
VBAT + 0.3
−
V
−15
−0.3
−0.3
−0.3
500
500
−40
−55
−2.0
−200
mA
V
VBAT + 0.3
VBAT + 1.2
VBAT + 1.2
16000
16000
+150
V
DC voltage on pin RTL
V
termination resistance on pin RTH
termination resistance on pin RTL
virtual junction temperature
storage temperature
Ω
Ω
note 2
°C
°C
kV
V
Tstg
+150
Vesd
electrostatic discharge voltage
human body model; note 3
machine model; note 4
+2.0
+200
Notes
1. All voltages are defined with respect to pin GND. Positive current flows into the IC.
2. Junction temperature in accordance with “IEC 747-1”. An alternative definition is: Tvj = Tamb + P × Rth(vj-a) where
th(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of
R
power dissipation (P) and operating ambient temperature (Tamb).
3. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
4. Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
Rth(vj-a)
thermal resistance from junction to ambient
120
K/W
QUALITY SPECIFICATION
Quality specification in accordance with “SNW-FQ-611-Part-E”.
1999 Feb 11
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Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
DC CHARACTERISTICS
VCC = 4.75 to 5.25 V; VBAT = 5 to 27 V; VSTB = VCC; Tamb = −40 to +125 °C; unless otherwise specified. All voltages are
defined with respect to ground. Positive currents flow into the IC. All parameters are guaranteed over the temperature
range by design, but only 100% tested at 25 °C.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
ICC
supply current
normal operating mode;
VTXD = VCC (recessive)
4
7
11
mA
mA
µA
normal operating mode;
VTXD = 0 V (dominant); no load
11
0
17
0
27
10
low power modes; VTXD = VCC
IBAT
battery current on pin BAT all modes; in low power modes at
VRTL = VBAT or
VRTL < 2.5 V (>1.5 ms)
V
BAT = VWAKE = VINH = 12 V
10
5
30
30
20
0
50
125
30
µA
µA
µA
µA
µA
VBAT = VWAKE = VINH = 5 to 27 V
BAT =VWAKE = VINH = 3.5 V
BAT = VWAKE = VINH = 1 V
V
V
5
0
10
I
CC + IBAT supply current plus battery low power modes; VCC = 5 V;
current VBAT = VWAKE = VINH = 12 V
battery voltage on pin BAT low power modes
for setting power-on flag
for not setting power-on flag
−
35
60
VBAT
−
−
−
1
V
V
3.5
−
Pins STB, EN and TXD
VIH
VIL
IIH
HIGH-level input voltage
0.7VCC
−
−
VCC + 0.3 V
LOW-level input voltage
HIGH-level input current
pins STB and EN
pin TXD
−0.3
0.3VCC
V
VI = 4 V
−
9
20
µA
µA
−25
−80
−200
IIL
LOW-level input current
pins STB and EN
pin TXD
VI = 1 V
4
8
−
µA
µA
V
−100
−320
−800
4.5
VCC
supply voltage
for forced power-on standby mode 2.75
(fail safe)
−
Pins RXD and ERR
VOH HIGH-level output voltage
on pin ERR
on pin RXD
lO = −100 µA
IO = −1 mA
V
V
0
0
CC − 0.9 −
VCC
VCC
0.4
V
V
V
V
CC − 0.9 −
VOL
LOW-level output voltage IO = 1.6 mA
on pins ERR and RXD
−
−
IO = 7.5 mA
1.5
1999 Feb 11
10
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Pin WAKE
IIL
LOW-level input current
VWAKE = 0 V; VBAT = 27 V
−1
−4
−10
µA
Vth(WAKE) wake-up threshold voltage VSTB = 0 V
2.5
3.2
3.9
V
Pin INH
∆VH
HIGH-level voltage drop
leakage current
IINH = −0.18 mA
−
−
−
−
0.8
5
V
IL
Sleep mode; VINH = 0 V
µA
Pins CANH and CANL
Vdiff
differential receiver
no failures and
threshold voltage
bus failures 1, 2, 5, 6a; see Fig.4
V
CC = 5 V
−3.5
−3.2
−2.9
V
V
VCC = 4.75 to 5.25 V
VTXD = VCC
−0.70VCC −0.64VCC −0.58VCC
VO(reces)
VO(dom)
IO(CANH)
recessive output voltage
on pin CANH
RRTH < 4 kΩ
−
−
0.2
V
V
on pin CANL
RRTL < 4 kΩ
V
CC − 0.2 −
−
dominant output voltage
on pin CANH
VTXD = 0 V; VEN = VCC
ICANH = −40 mA
V
CC − 1.4 −
−
V
on pin CANL
I
CANL = 40 mA
−
−
1.4
−110
V
output current on
pin CANH
normal operating mode;
VCANH = 0 V; VTXD = 0 V
−45
−80
−0.25
70
mA
low power modes;
VCANH = 0 V; VCC = 5 V
−
−
µA
mA
µA
IO(CANL)
output current on
pin CANL
normal operating mode;
CANL = 14 V; VTXD = 0 V
45
−
100
−
V
low power modes;
0
VCANL = 12 V; VBAT = 12 V
Vdet(CANH) detection threshold
voltage for short-circuit to
battery voltage on
normal operating mode
low power modes
1.5
1.1
1.7
1.8
1.85
2.5
V
V
pin CANH
Vdet(CANL) detection threshold
voltage for short-circuit to
battery voltage on
normal operating mode
6.5
7.3
8
V
pin CANL
Vth(wake)
wake-up threshold voltage
on pin CANL
low power modes
low power modes
low power modes
2.5
1.1
0.8
3.2
1.8
1.4
3.9
2.5
−
V
V
V
on pin CANH
∆Vth(wake) difference of wake-up
threshold voltages
Vse(CANH) single-ended receiver
threshold voltage on
pin CANH
normal operating mode and
failures 4, 6 and 7
VCC = 5 V
1.5
1.7
1.85
V
V
VCC = 4.75 to 5.25 V
0.30VCC 0.34VCC 0.37VCC
1999 Feb 11
11
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Vse(CANL) single-ended receiver
threshold voltage on
pin CANL
normal operating mode and
failures 3 and 3a
VCC = 5 V
3.15
3.3
3.45
V
V
VCC = 4.75 to 5.25 V
0.63VCC 0.66VCC 0.69VCC
Pins RTH and RTL
Rsw(RTL)
switch-on resistance
between pin RTL and VCC IO < 10 mA
normal operating mode;
−
−
50
50
100
100
Ω
Ω
Rsw(RTH) switch-on resistance
between pin RTH and
ground
normal operating mode;
IO < 10 mA
VO(RTH)
IO(RTL)
Ipu(RTL)
output voltage on pin RTH low power modes; IO = 1 mA
output current on pin RTL low power modes; VRTL = 0 V
−
0.7
1.0
−0.3
−
V
−1.25
−0.65
75
mA
µA
pull-up current on pin RTL normal operating mode and
failures 4, 6 and 7
−
Ipd(RTH)
pull-down current on
pin RTH
normal operating mode and
failures 3 and 3a
−
75
−
µA
Thermal shutdown
Tj
junction temperature
for shutdown
155
165
180
°C
1999 Feb 11
12
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
TIMING CHARACTERISTICS
VCC = 4.75 to 5.25 V; VBAT = 5 to 27 V; VSTB = VCC; Tamb = −40 to +125 °C; unless otherwise specified. All voltages are
defined with respect to ground. Positive currents flow into the IC. All parameters are guaranteed over the temperature
range by design, but only 100% tested at 25 °C.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
tt(r-d)
CANL and CANH output
transition time for
10 to 90%;
C1 = 10 nF; C2 = 0; R1 = 100 Ω;
0.35
0.60
−
µs
recessive-to-dominant
see Fig.5
tt(d-r)
CANL and CANH output
transition time for
dominant-to-recessive
10 to 90%;
C1 = 1 nF; C2 = 0; R1 = 100 Ω;
see Fig.5
0.2
0.3
−
µs
tPD(L)
propagation delay TXD to
RXD (LOW)
no failures and failures 1, 2, 5, 6a;
see Figs 4 and 5
C1 = 1 nF; C2 = 0; R1 = 100 Ω
C1 = C2 = 3.3 nF; R1 = 100 Ω
−
−
0.75
1
1.35
1.75
µs
µs
failures 3, 3a, 4, 6 and 7;
see Figs 4 and 5
C1 = 1 nF; C2 = 0; R1 = 100 Ω
C1 = C2 = 3.3 nF; R1 = 100 Ω
−
−
0.85
1.1
1.4
1.7
µs
µs
tPD(H)
propagation delay TXD to
RXD (HIGH)
no failures and failures 1, 2, 5, 6a;
see Figs 4 and 5
C1 = 1 nF; C2 = 0; R1 = 100 Ω
C1 = C2 = 3.3 nF; R1 = 100 Ω
−
−
1.2
2.5
1.9
3.3
µs
µs
failures 3, 3a, 4, 6 and 7;
see Figs 4 and 5
C1 = 1 nF; C2 = 0; R1 = 100 Ω
C1 = C2 = 3.3 nF; R1 = 100 Ω
low power modes; VBAT = 12 V
−
−
7
1.1
1.5
−
1.7
2.2
38
µs
µs
µs
tCANH(min) minimum dominant time for
wake-up on pin CANH
tCANL(min) minimum dominant time for
wake-up on pin CANL
low power modes; VBAT = 12 V
7
7
−
−
38
38
µs
µs
tWAKE(min) minimum time on pin WAKE
low power modes; VBAT = 12 V;
for wake-up after receiving a falling
or rising edge
tdet
failure detection time
normal mode
failure 3 and 3a
1.6
0.3
−
−
8.0
1.6
ms
ms
failure 4, 6 and 7
low power modes; VBAT = 12 V
failure 3 and 3a
1.6
0.1
−
−
8.0
1.6
ms
ms
failure 4 and 7
1999 Feb 11
13
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
SYMBOL
PARAMETER
CONDITIONS
normal mode
MIN.
TYP. MAX. UNIT
trec
failure recovery time
failure 3 and 3a
failure 4 and 7
0.3
−
−
−
1.6
38
ms
µs
µs
7
failure 6
125
750
low power modes; VBAT = 12 V
failures 3, 3a, 4 and 7
0.3
5
−
−
1.6
50
ms
th(min)
tdis(TXD)
∆pc
minimum hold time of goto-sleep
command
µs
disable time of TXD permanent normal mode; VTXD = 0 V
dominant timer
0.75
−
4
ms
pulse-count difference between normal mode and
CANH and CANL
failures 1, 2, 5 and 6a
failure detection
(pin ERR becomes LOW)
−
−
4
4
−
−
failure recovery
V
V
CC
TXD
0 V
V
V
5 V
CANL
3.6 V
1.4 V
0 V
CANH
2.2 V
−3.2 V
−5 V
V
diff
V
RXD
0.7V
CC
0.3V
CC
t
t
PD(H)
PD(L)
MGL424
Vdiff = VCANH − VCANL
.
Fig.4 Timing diagram for dynamic characteristics.
1999 Feb 11
14
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
TEST AND APPLICATION INFORMATION
+
5 V
V
INH
BAT
CC
1
14
10
R1
C1
C2
C1
WAKE
TXD
STB
EN
RTH
7
2
5
6
3
8
CANL
12
TJA1054
CANH
RTL
11
9
RXD
R1
13
GND
4
20 pF
ERR
MGL423
For testing, the 100 Ω termination resistors are not connected to RTH or RTL because minimum 500 Ω per transceiver is allowed.
Fig.5 Test circuit for dynamic characteristics.
+
12 V
+
5 V
10 µF
V
INH
BAT
CC
1
14
10
1 nF
1 nF
125 Ω
511 Ω
WAKE
TXD
STB
EN
RTH
7
2
5
6
3
8
CANL
12
GENERATOR
TJA1054
CANH
RTL
11
9
1 nF
1 nF
511 Ω
125 Ω
RXD
13
GND
4
20 pF
ERR
MGL426
The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
1999 Feb 11
15
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
V
BAT
BATTERY
+
5 V
V
DD
P8xC592/P8xCE598
CAN CONTROLLER
+5 V
CTX0
TXD
CRXO
RXD
Px.x
STB
Px.x
ERR
Px.x
EN
INH
2
3
5
4
6
1
BAT
WAKE
7
14
V
CC
TJA1054
CAN TRANSCEIVER
10
13
100 nF
GND
8
11
12
CANL
9
RTH
CANH
RTL
CAN BUS LINE
MGL425
Fig.7 Application diagram.
1999 Feb 11
16
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
PACKAGE OUTLINE
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
v
c
y
H
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.050
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-23
97-05-22
SOT108-1
076E06S
MS-012AB
1999 Feb 11
17
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Feb 11
18
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Feb 11
19
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors,
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5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1999
SCA62
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
285002/00/01/pp20
Date of release: 1999 Feb 11
Document order number: 9397 750 03636
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