TSA5518M [NXP]

1.3 GHz bidirectional I2C-bus controlled synthesizer; 1.3 GHz的双向I2C总线控制的合成器
TSA5518M
型号: TSA5518M
厂家: NXP    NXP
描述:

1.3 GHz bidirectional I2C-bus controlled synthesizer
1.3 GHz的双向I2C总线控制的合成器

信号电路 锁相环或频率合成电路 光电二极管
文件: 总20页 (文件大小:164K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
TSA5518M  
1.3 GHz bidirectional I2C-bus  
controlled synthesizer  
1997 Mar 07  
Product specification  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
FEATURES  
Complete 1.3 GHz single chip system  
Low power 5 V, 40 mA  
I2C-bus programming  
One pin crystal oscillator  
In-lock flag  
GENERAL DESCRIPTION  
Varicap drive disable  
Low radiation  
The device is a single chip PLL frequency synthesizer  
designed for TV tuning systems. Control data is entered  
via the I2C-bus; five serial bytes are required to address  
the device, select the oscillator frequency, program the  
7 output ports and set the charge-pump current.  
The output port P6 is combined with an A/D converter  
input. Digital information concerning this port can be read  
out of the SDA line (one status byte) during a READ  
operation. A flag is set when the loop is ‘in-lock’ and is read  
during a READ operation. The device has one fixed  
I2C-bus address, programmed by applying a specific  
voltage on AS input. The phase comparator operates at  
7.8125 kHz when a 4 MHz crystal in used. The device  
provides a bandswitch output to select the bands of the  
mixer/oscillator ICs TDA5330, TDA5630A except  
TDA5630/C1 and TDA5730 with the appropriate voltage  
level.  
Address selection for picture in picture (PIP), DBS tuner,  
and so on  
5-level A/D converter  
7 bus-controlled ports (4 open-collector outputs and  
3 emitter follower outputs), 1 bidirectional port  
Power-down flag  
Mixer/oscillator bandswitch output  
Available in SSOP20 package.  
APPLICATIONS  
TV tuners and front-ends  
VCR tuners.  
QUICK REFERENCE DATA  
SYMBOL  
VCC  
ICC  
fi  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
4.5  
TYP.  
MAX. UNIT  
5
5.5  
V
supply current  
frequency  
40  
4
mA  
MHz  
mV  
mV  
mV  
MHz  
mA  
mA  
mA  
°C  
80  
12  
9
1300  
300  
300  
300  
4.48  
5
Vi(rms)  
input voltage level (RMS value) 80 to 150 MHz  
150 MHz to 1.0 GHz  
1 GHz to 1.3 GHz  
40  
3.2  
fxtal  
Io  
crystal oscillator frequency  
output current  
emitter follower on P4, P5 and P7  
open-collector P0, P1 and P2  
open-collector P6  
20  
10  
Tamb  
operating ambient temperature  
10  
+80  
120  
Rth j-a  
thermal resistance from  
junction to ambient  
K/W  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TSA5518M  
SSOP20  
plastic shrink small outline package; 20 leads; body width 4.4 mm  
SOT266-1  
1997 Mar 07  
2
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
BLOCK DIAGRAM  
GM1K5  
a n d b o o k , f u l l p a g e w  
1997 Mar 07  
3
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
drive output (UD)  
UD  
P7  
1
2
P7 output port  
P5  
3
P5 output port  
handbook, halfpage  
P4  
4
P4 output port  
UD  
P7  
1
2
3
4
5
6
7
8
9
20 PD  
BS  
n.c  
RF2  
RF1  
GND  
P1  
5
bandswitch output for M/O drive  
not connected  
19 XTAL  
18 n.c.  
6
P5  
7
UHF/VHF signal input 2  
UHF/VHF signal input 1  
ground  
V
17  
P4  
CC  
8
BS  
16 SCL  
9
TSA5518M  
10  
11  
12  
13  
P1 output port (general purpose)  
P0 output port (general purpose)  
input for Address Selection  
n.c.  
RF2  
RF1  
GND  
SDA  
P2  
15  
14  
P0  
AS  
P6  
13 P6  
P6 port (output/input for general  
purpose ADC)  
12  
11  
AS  
P0  
P1 10  
P2  
14  
P2 output port (fDIV if the test mode  
is active)  
MBH947  
SDA  
SCL  
VCC  
n.c  
15  
16  
17  
18  
19  
20  
I2C-bus serial data input/output  
I2C-bus serial clock  
voltage supply  
not connected  
XTAL  
PD  
crystal oscillator input  
charge-pump output (PD)  
Fig.2 Pin configuration.  
or charge pump and port information (first bit = 1) will  
follow. Until an I2C-bus STOP condition is sent by the  
controller, additional data bytes can be entered without the  
need to re-address the device. This allows a smooth  
frequency sweep for fine tuning or AFC purpose. At  
power-on the ports are set to the high-impedance state  
(open-collector outputs) or at the HIGH level (emitter  
follower outputs). The bandswitch output BS provides a  
voltage output suitable for the band selection input of  
mixer/oscillator ICs TDA5330, TDA5630A and TDA5730.  
It is controlled by B1 and B0 bits or P7, P5 and P4 bits  
depending on the BSC bit (see Tables 1 to 4). The  
7.8125 kHz reference frequency is obtained by dividing  
the output of the 4 MHz crystal oscillator by 512. Because  
the input of UHF/VHF signal is first divided-by-8 the step  
size is 62.5 kHz. A 3.2 MHz crystal can offer step size of  
50 kHz.  
FUNCTIONAL DESCRIPTION  
The device is controlled via the two wire I2C-bus.  
For programming, there is one module address (7 bits)  
and the R/W bit for selecting READ or WRITE mode.  
Write mode  
The write data format is summarized in Table 1. After the  
address transmission (first byte), data bytes can be sent to  
the device. Four data bytes are needed to fully program  
the device. The bus transceiver has an auto increment  
facility which permits the programming of the device within  
one single transmission (address byte + 4 data bytes).  
The device can also be partially programmed on the  
condition that the first data byte following the address is  
byte 2 or 4. The meaning of the bits in the data bytes is  
given in Table 3. The first bit of the first data byte  
transmitted indicates whether frequency data (first bit = 0)  
1997 Mar 07  
4
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
Table 1 Write data format  
MS  
B
BYTE  
DESCRIPTION  
LSB ACKNOWLEDGE  
1
2
3
4
5
address  
1
0
1
0
0
0
MA1 MA0 0  
LOW from device  
LOW from device  
LOW from device  
programmable divider  
N14 N13 N12 N11 N10 N9  
N8  
N0  
programmable divider  
N7 N6 N5 N4 N3  
N2  
N1  
B0  
P1  
charge-pump, bandswitch and test bits 1  
CP T1 T0 BSC B1  
OS LOW from device  
P0 LOW from device  
output ports control bits  
P7 P6 P5 P4  
X
P2  
Table 2 Explanation of Table 1  
BIT  
DESCRIPTION  
MA1, MA0  
N14, .. , N0  
programmable address bits (see Table 7)  
programmable divider bits  
N = N14 × 214 + N13 × 213 +...+ N1 × 21 + N0  
CP  
charge pump current  
CP = 0 to 50 µA; CP = 1 to 220 µA  
T1 = 0, T0 = 0, OS = 0: normal operation  
T1 = 1: P2 = fDIV, P6 = fref  
T1, T0, OS  
T0 = 1: 3-state charge pump  
OS = 1: operational amplifier output is switched off (varicap drive disable)  
bandswitch control bit  
BSC  
BSC = 0: bandswitch output is controlled by B1 and B0 bits according to Table 3  
BSC = 1: bandswitch output is controlled by P7, P5 and P4 bits according to Table 4  
bandswitch control bits  
B1, B0  
P6, P2, P1 and P0  
P6, P2 .. P0 = 1: open-collector outputs are active  
P6, P2 .. P0 = 0: outputs are in high impedance state  
P4, P5 and P7 = 1: outputs are at low level  
P4, P5 and P7  
X
P4, P5 and P7 = 0: emitter follower outputs are active  
don’t care  
Table 3 BS output control (BSC = 0)  
Table 4 BS output control (BSC = 1)  
B1  
B0  
VOLTAGE ON PIN BS  
P7  
P5  
P4  
VOLTAGE ON PIN BS  
0
0
1
1
0
1
0
1
0.25 V  
2 V  
1
1
0
1
0
1
0
1
1
0.25 V  
2 V  
4 V  
4 V  
VCC  
1997 Mar 07  
5
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
in its high-impedance state. The POR flag (Power-on  
reset) is set to logic 1 when VCC goes below 3 V and at  
power-on. It is reset when an end of data is detected by the  
device (end of a READ sequence). Control of the loop is  
made possible with the in-lock flag FL which indicates  
(FL = 1) when the loop is phase-locked. A built-in % level  
A/D converter is available on I/O port P6. This converter  
can be used to feed AFC information to the controller from  
the IF section of the television as illustrated in the typical  
application circuit in Fig.2. The relationship between bit  
A2, A1 and A0 and the input voltage on port P6 is given in  
Table 6.  
Read mode  
The read data format is summarised in Table 5. Data can  
be read out of the device by setting the R/W bit to logic 1.  
After the slave address has been recognized, the device  
generates an acknowledge pulse and the status word is  
transferred on the SDA line (MSB first). Data is valid on the  
SDA line during a HIGH of the SCL clock signal. A second  
data byte can be read out of the device if the processor  
generates an acknowledge on the SDA line. End of  
transmission will occur if no acknowledge from the  
processor occurs.The device will then release the data line  
to allow the processor to generate a STOP condition.  
When the port P6 is used as input, it must be programmed  
Table 5 Read data format  
BYTE DESCRIPTION MSB  
LSB  
1
A0(4)  
ACKNOWLEDGE  
LOW from device  
note 5  
1
address  
1
1
0
0
0
0
0
0
MA1(1) MA0(1)  
A2(4) A1(4)  
2, ..  
status byte(s)  
POR(2) FL(3)  
Notes  
1. See Table 7.  
2. POR: Power-on reset flag. (POR = 1 on power-on).  
3. FL: in lock flag (FL = 1 when the loop is phase-locked).  
4. A2, A1, A0: digital outputs of the 5 level A/D converter (see Table 6). Accuracy is 12 LSB. MSB is transmitted first.  
5. Upon an acknowledge pulse from the controller, the device transfers the status byte again. If no acknowledge pulse  
from the controller is received, data read is terminated.  
Table 6 A/D converter levels  
Address selection  
Accuracy on the switching levels is ±0.02VCC  
.
The module address contains programmable address bits  
(MA1 and MA0) which offer the possibility of having  
several synthesizers (up to 3) in one system by applying a  
specific voltage on AS input. The relationship between  
MA1 and MA0 and the input voltage on AS input is given  
in Table 7.  
VOLTAGE APPLIED ON PIN P6  
A2  
A1  
A0  
0.6VCC to 5.5 V  
0.45VCC to 0.6VCC  
0.3VCC to 0.45VCC  
0.15VCC to 0.3VCC  
0 to 0.15VCC  
1
0
0
0
0
0
1
1
0
0
0
1
0
1
0
Frequency lock flag (FL) definition  
When the FL flag is logic 1, the maximum frequency  
deviation dF from stable frequency can be expressed as:  
Table 7 Address selection  
K
C1 + C2  
C1 × C2  
df = ± VCO × I  
×
with:  
---------------------  
VOLTAGE APPLIED ON PIN AS  
MA1  
MA0  
-------------  
CP  
KO  
0 to 0.1VCC  
always valid  
0.4 to 0.6VCC  
0.9VCC to VCC  
0
0
1
1
0
1
0
1
K
VCO = oscillator slope (Hz/V)  
ICP = charge pump current (A)  
KO = 4 × 106  
C1, C2 = loop filter capacitors.  
1997 Mar 07  
6
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VCC  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
0.3  
MAX.  
+6  
UNIT  
V
Vi(XTAL)  
Vi(SCL)  
VSDA  
Vi(AS)  
Vo(BS)  
Vi(RF)  
Vo  
voltage at pin XTAL  
voltage at pin SCL  
voltage at pin SDA  
voltage at pin AS  
0.3  
0.3  
0.3  
0.3  
0.3  
0.3  
0.3  
+VCC  
+6  
V
V
V
V
V
V
V
+6  
+VCC  
+VCC  
+VCC  
+16  
voltage at pin BS  
voltage at pins RF1 and RF2  
output voltage at ports P0, P2  
and P6  
output voltage at ports P4, P5  
and P7  
0.3  
+VCC  
V
VPD  
VUD  
ISDA  
Io  
output voltage at pin PD  
output voltage at pin UD  
output current at pin SDA  
0.3  
0.3  
1  
+VCC  
+VCC  
+5  
V
V
open collector  
mA  
mA  
output current at pins P0, P1  
and P2  
1  
+20  
output current at pins P4, P5  
and P7  
emitter follower  
open collector  
1  
+10  
mA  
output current at pin P6  
storage temperature  
1  
40  
+10  
+150  
150  
10  
mA  
°C  
°C  
s
Tstg  
Tj(max)  
maximum junction temperature  
tsc(GND)(max) maximum short circuit time to  
GND  
one pin to GND (VCC = 5.5 V;  
GND = 0 V)  
tsc(VCC)(max) maximum short circuit time to  
VCC  
one pin to VCC (VCC = 5.5 V; GND = 0 V)  
10  
s
HANDLING  
Every pin withstands the ESD test in accordance with MIL-STD-833C category B (2000 V).  
Every pin withstands the ESD test in accordance with Philips Semiconductor machine model 0 , 200 pF.  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth j-a  
PARAMETER  
CONDITIONS  
in free air  
VALUE  
UNIT  
thermal resistance from junction to ambient  
120  
K/W  
1997 Mar 07  
7
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
CHARACTERISTICS  
V
CC = 4.5 to 5.5 V; Tamb = 10 to +80 °C; unless otherwise specified.  
SYMBOL PARAMETER CONDITIONS  
Operating characteristics  
MIN.  
TYP.  
MAX.  
UNIT  
VCC  
Tamb  
fi  
supply voltage  
4.5  
5.5  
V
operating ambient temperature  
input frequency  
divider  
10  
80  
+80  
°C  
1300  
32767  
50  
MHz  
N
note 1  
256  
25  
ICC  
supply current  
40  
mA  
Crystal oscillator  
fosc  
oscillator frequency  
3.2  
4
4.48  
450  
MHz  
Zi(XTAL)  
Vo(XTAL)  
Vi(RF)  
input impedance on pin XTAL  
output drive level on pin XTAL  
input level  
40  
mV  
mV  
mV  
mV  
mV  
MHz  
see Fig.3  
12  
9
300  
300  
300  
10  
fi = 80 to 150 MHz  
fi = 150 to 1000 MHz  
fi = 1000 to 1300 MHz  
40  
flatness of the minimum sensitivity  
prescaler input impedance  
150  
1000  
see Fig.4  
Output port P0, P1 and P2 (open collector); note 1  
ILO  
output leakage current  
output sink current  
VPn = 13.5 V  
note 2  
10  
µA  
mA  
V
Io(sink)  
VOL  
20  
LOW-level output voltage  
IPn = 15 mA  
0.5  
100  
CL(max)  
maximum capacitive loading on output VPn = 5.5 V  
pin  
nF  
Output ports P4, P5 and P7 (emitter follower)  
VOH  
IOH  
HIGH-level output voltage  
HIGH-level output current  
Iport = 3 mA  
V
CC 1  
V
3
5
mA  
Output port P6 (open collector)  
ILO  
output leakage current  
output sink current  
VP6 = 13.5 V  
note 2  
1
10  
µA  
mA  
V
Io(sink)  
VOL  
10  
LOW-level output voltage  
IP6 = 5 mA  
0.4  
100  
CL(max)  
maximum capacitive loading on output VP6 = 5.5 V  
pin  
nF  
Input port AS  
IIH  
IIL  
HIGH-level input current  
HIGH-level input current  
VASH = VCC  
VASL = 0 V  
10  
µA  
µA  
10  
Input port P6  
IIH  
IIL  
HIGH-level input current  
LOW-level input current  
VP6H = 5.5 V  
VP6L = 0 V  
10  
µA  
µA  
10  
1997 Mar 07  
8
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Bandswitch output BS  
VO(BSA)  
VO(BSB)  
output voltage for band A  
output voltage for band B  
Isource(BSA) = 20 µA  
0.25  
0.5  
V
Isource(BSB) = 20 µA;  
note 3  
0.36  
VCC  
0.4  
VCC  
0.43  
VCC  
V
VO(BSC)  
output voltage for band C  
Isource(BSC) = 20 µA;  
0.7  
0.8  
0.9  
V
note 3  
VCC  
VCC  
VCC  
I2C-bus inputs SCL, SDA; note 4  
VIH  
VIL  
hysi  
IIH  
HIGH-level input voltage  
LOW-level input voltage  
input hysteresis  
3
5.5  
1.5  
V
V
VCC = 5 V  
250  
mV  
µA  
µA  
µA  
µA  
HIGH-level input current  
VBH = 5.5 V; VCC = 0 V  
VBH = 5.5 V; VCC = 5.5 V  
VBL = 0 V; VCC = 0 V  
VBL = 0 V; VCC = 5.5 V  
10  
10  
IIL  
LOW-level input current  
10  
10  
Output SDA (open collector)  
ILO  
VO  
output leakage current  
output voltage  
VSDAH = VCC  
ISDAL = 3 mA  
10  
µA  
0.4  
V
Charge-pump output PD  
IOH(cp) HIGH level output charge pump  
CP = 1  
CP = 0  
140  
25  
220  
50  
300  
75  
µA  
µA  
current  
IOL(cp)  
LOW level output charge pump  
current  
VO  
ILZ  
output voltage  
in-lock  
T0 = 1  
1.5  
2.5  
+5  
V
OFF-state leakage current  
5  
nA  
Operational amplifier output UD (test mode: T0 = 1)  
Vo(off)  
output voltage when switched-off  
OS = 1; IUD = 1 mA  
200  
1.2  
mV  
V
Vo(loop)  
output voltage when the loop is closed OS = 0; T0 = 0  
Notes  
1. If the dividing number N is set to less than 256, a dividing number of 256 is used.  
2. When a port is active, the collector voltage may not exceed 6 V.  
3. Measured with all other ports active at max. current (10 mA or 20 mA respectively).  
4. See “The I2C-bus and how to use it”, order no. 9398 393 40011.  
1997 Mar 07  
9
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
MGK117  
3
10  
handbook, halfpage  
V
i(rms)  
(mV)  
2
10  
guaranteed operating area  
10  
1
0
500  
1000  
1500  
f (MHz)  
Fig.3 I/O prescaler typical input sensitivity curve: VCC = 4.5 to 5.5 V; Tamb = 10 to +80 °C.  
1
0.5  
2
0.2  
5
10  
+ j  
j  
0.2  
0.5  
1
2
5
10  
0
50 MHz  
10  
100 MHz  
5
0.2  
1.3 GHz  
500 MHz  
2
1 GHz  
0.5  
MGK118  
1
Fig.4 Prescaler Smith-chart of typical input impedance: VCC = 5 V; reference value 50 .  
1997 Mar 07  
10  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
INTERNAL PIN CONFIGURATION  
PIN  
CONFIGURATION  
PIN  
CONFIGURATION  
7 and 8  
1 and 20  
V
V
CC  
to divider  
CC  
V
CC  
7
DOWN  
UP  
V
ref  
V
CC  
V
CC  
20  
8
MGK121  
V
CC  
10, 11, 13  
and 14  
V
CC  
1
10, 11, 13, 14  
MGK127  
2, 3 and 4  
MGK120  
V
CC  
V
CC  
12  
V
CC  
V
CC  
2, 3, 4  
12  
MGK119  
5
V
CC  
MGK123  
V
CC  
15  
V
CC  
5
15  
MGK122  
MGK124  
1997 Mar 07  
11  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
PIN  
CONFIGURATION  
PIN  
CONFIGURATION  
16  
19  
V
CC  
V
CC  
V
CC  
16  
19  
MGK125  
MGK126  
1997 Mar 07  
12  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
APPLICATION INFORMATION  
22 kΩ  
33 V  
V
tune  
filter dependent  
22 kΩ  
15 nF  
PD  
BC847  
35 kΩ  
100 nF  
10 pF  
UD  
P7  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
XTAL  
HIGH  
MID  
LOW  
BS  
5 V  
P5  
n.c.  
V
4 MHz  
P4  
CC  
390 390 390 Ω  
300 Ω  
300 Ω  
BS  
SCL  
SDA  
P2  
SCL  
SDA  
P2  
TSA5518M  
n.c.  
RF2  
RF1  
GND  
P1  
1 nF  
1 nF  
RF2  
RF1  
1 kΩ  
1 kΩ  
P8  
ADC  
AS  
P3  
P0  
P0  
P1  
4.7  
nF  
4.7  
nF  
4.7  
nF  
4.7  
nF  
4.7  
nF  
4.7  
nF  
4.7  
nF  
4.7  
nF  
MGK116  
Fig.5 Typical application.  
Loop filter  
Table 8 Loop filter  
DESCRIPTION  
MIN. MAX. UNIT  
Time span between actual  
1024 1152 µs  
phase lock and FL flag setting  
Time span between the loop  
0
128  
µs  
losing lock and FL flag resetting  
KVCO = 16 MHz/V (UHF band)  
C2  
R
lfpage  
ICP = 220 µA  
C1  
C1 = 100 nF, C2 = 15 nF  
df = ±67.5 kHz  
MBH948  
Fig.6 Loop filter.  
1997 Mar 07  
13  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
PACKAGE OUTLINE  
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm  
SOT266-1  
D
E
A
X
c
y
H
v
M
A
E
Z
11  
20  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
10o  
0o  
0.15  
0
1.4  
1.2  
0.32  
0.20  
0.20  
0.13  
6.6  
6.4  
4.5  
4.3  
6.6  
6.2  
0.75  
0.45  
0.65  
0.45  
0.48  
0.18  
mm  
1.5  
0.65  
1.0  
0.2  
0.25  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
90-04-05  
95-02-25  
SOT266-1  
1997 Mar 07  
14  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
If wave soldering cannot be avoided, the following  
conditions must be observed:  
SOLDERING  
Introduction  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave)  
soldering technique should be used.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
The longitudinal axis of the package footprint must  
be parallel to the solder flow and must incorporate  
solder thieves at the downstream end.  
Even with these conditions, only consider wave  
soldering SSOP packages that have a body width of  
4.4 mm, that is SSOP16 (SOT369-1) or  
SSOP20 (SOT266-1).  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all SSOP  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
Wave soldering  
Wave soldering is not recommended for SSOP packages.  
This is because of the likelihood of solder bridging due to  
closely-spaced leads and the possibility of incomplete  
solder penetration in multi-lead devices.  
1997 Mar 07  
15  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
1997 Mar 07  
16  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
NOTES  
1997 Mar 07  
17  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
NOTES  
1997 Mar 07  
18  
Philips Semiconductors  
Product specification  
1.3 GHz bidirectional I2C-bus controlled  
synthesizer  
TSA5518M  
NOTES  
1997 Mar 07  
19  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,  
Tel. +43 1 60 101, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
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Tel. +852 2319 7888, Fax. +852 2319 7700  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Czech Republic: see Austria  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 1949  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615800, Fax. +358 9 61580/xxx  
South America: Rua do Rocio 220, 5th floor, Suite 51,  
04552-903 São Paulo, SÃO PAULO - SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 829 1849  
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 3 301 6312, Fax. +34 3 301 4107  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2686, Fax. +41 1 481 7730  
Hungary: see Austria  
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.  
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874  
Indonesia: see Singapore  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
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Tel. +66 2 745 4090, Fax. +66 2 398 0793  
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Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,  
Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
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252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,  
Internet: http://www.semiconductors.philips.com  
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1997  
SCA53  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
547047/1200/01/pp20  
Date of release: 1997 Mar 07  
Document order number: 9397 750 01612  

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