TZA1048 [NXP]
4-channel BTL driver for CD/DVD drives; 4通道BTL驱动器的CD / DVD驱动器
| 型号： | TZA1048 |
| 厂家： | 
NXP |
| 描述： | 4-channel BTL driver for CD/DVD drives |
| 文件： | 总17页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TZA1048
4-channel BTL driver for
CD/DVD drives
Product specification
2004 Mar 09
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
CONTENTS
12Soldering
12.1Introduction to soldering surface mount packages
12.2Reflow soldering
12.3Wave soldering
1Features
2Applications
3General description
4Ordering information
5Block diagram
12.4Manual soldering
12.5Suitability of surface mount IC packages for wave and
reflow soldering methods
13Data sheet status
6Pinning
7Functional data
7.1General notes
8Limiting values
9Characteristics
10Test and application information
11Package outline
14Definitions
15Disclaimers
2004 Mar 09
2
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
1
FEATURES
2
APPLICATIONS
• Two Bridge-Tied Load (BTL) driver channels for sled
• BTL driver for CD and DVD players.
and spindle motors and actuators
• Pulse Width Modulation (PWM) input
• Integral thermal shut-down circuit
• Integral mute control
3
GENERAL DESCRIPTION
The TZA1048 is a four-channel BTL driver IC for driving
motors and actuators in CD and DVD players.
Two reference voltage outputs are also available for
peripheral ICs such as servo and pick-up head drivers.
The spindle motor control inputs to the IC can be either
differential or single-ended.
• Two regulated reference voltage outputs for other chips
in system; 3.3 V and 1.8 V respectively
• HSOP28 package.
4
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TZA1048TH
HSOP28
plastic, heatsink small outline package; 28 leads
SOP007
2004 Mar 09
3
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
5
BLOCK DIAGRAM
3.3 V
GENERATOR
1.8 V
GENERATOR
28
27
V
1
2
CC
VOUT3.3
x1
x1
VFBIN3.3
VOUT1.8
RADOUTN
FOCOUTP
GND
26
25
24
23
22
3
4
5
VFBIN1.8
MUTE
x1
x1
32.3 kΩ
32.3 kΩ
MUTE
FOCOUTN
RADOUTP
24 kΩ
6
RADIN
FOCIN
24 kΩ
V
CC
7
TZA1048
32.3 kΩ
24 kΩ
21
20
8
9
V
SLIN
VBIASIN
GND
CC
x1
x1
SLOUTP
SLOUTN
GND
32.3 kΩ
10
19
18
VBIASOUT
MOTBIAS
11
12
x0.5
x0.5
17
16
15
32.3 kΩ
MOTOUTP
MOTOUTN
24 kΩ
24 kΩ
13
14
MOTIN1
MOTIN2
V
CC
mce470
Fig.1 Block diagram.
4
2004 Mar 09
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
6
PINNING
SYMBOL
PIN
DESCRIPTION
VCC
1
supply voltage
RADOUTN
FOCOUTP
GND
2
radial coil driver negative output
focus coil driver positive output
ground
3
4
FOCOUTN
RADOUTP
VCC
5
focus coil driver negative output
radial coil driver positive output
supply voltage
6
7
VCC
8
supply voltage
SLOUTP
SLOUTN
GND
9
sled motor driver positive output
sled motor driver negative output
ground
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
MOTOUTP
MOTOUTN
VCC
spindle motor driver positive output
spindle motor driver negative output
supply voltage
MOTIN2
MOTIN1
MOTBIAS
VBIASOUT
GND
spindle motor driver input 2
spindle motor driver input 1
spindle motor bias input
1.65 V bias voltage output
ground
VBIASIN
SLIN
bias voltage input
sled motor driver input
focus coil driver input
radial coil driver input
mute control input
FOCIN
RADIN
MUTE
VFBIN1.8
VOUT1.8
VFBIN3.3
VOUT3.3
1.8 V generator/regulator feedback voltage input
1.8 V generator/regulator output
3.3 V generator/regulator feedback voltage input
3.3 V generator/regulator output
2004 Mar 09
5
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
7
FUNCTIONAL DESCRIPTION
General notes
7.1
1. The integral thermal shut-down circuit mutes the
output current when the chip temperature reaches
175 °C (typical). The hysteresis is set to 25 °C
(typical), so the circuit will restart when the chip
temperature falls to 150 °C (typical).
V
1
2
3
4
5
6
7
28 VOUT3.3
27 VFBIN3.3
26 VOUT1.8
25 VFBIN1.8
24 MUTE
CC
RADOUTN
FOCOUTP
GND
2. Mute mode is activated when the voltage at pin MUTE
is below 0.5 V, and deactivated when the voltage at
pin MUTE is above 1.2 V. In mute mode, both positive
and negative output terminals will be at
FOCOUTN
RADOUTP
23 RADIN
high-impedance state. However, the 3.3 V and 1.8 V
outputs are not affected.
V
22 FOCIN
CC
3. It is recommended that a 220 µF decoupling capacitor
is connected between pins VCC and pin GND and
physically located as close as possible to these supply
pins.
TZA1048TH
4. The positive outputs of the focus, radial and sled driver
channels are in phase with their respective input
signals. The positive output of the spindle driver
channel is in phase with the input signal on
pin MOTIN1.
V
8
9
21 SLIN
CC
SLOUTP
20 VBIASIN
19 GND
SLOUTN 10
GND 11
18 VBIASOUT
17 MOTBIAS
16 MOTIN1
15 MOTIN2
MOTOUTP 12
MOTOUTN 13
5. The values of the resistors connected to each input
channel must be equal to, or larger than, 4.7 kΩ to
ensure that the gain of each input stage is less than, or
equal to 1.
V
14
CC
mce471
6. The GND pins are internally connected to heat
dissipation fins within the package. You must ensure
that these pins are connected to an external ground.
7. The 1.65 V bias voltage output from pin VBIASOUT is
derived from the internal 3.3 V generator/regulator,
and will be affected by any variation in the 3.3 V
generator/regulator voltage.
Fig.2 Pin configuration.
2004 Mar 09
6
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
8
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
MIN. MAX. UNIT
VCC
P
supply voltage
−
13.5
1.7
70
V
power dissipation
operating temperature
storage temperature
−
W
°C
Toper
Tstg
0
−55
+150 °C
9
CHARACTERISTICS
amb = 25 °C; VCC = 9 V; RL = 8 Ω; unless otherwise specified.
T
SYMBOL PARAMETER
CONDITIONS
MIN.
20
TYP. MAX. UNIT
B
bandwidth
25
9
100
13
−
kHz
V
VCC
PSRR
Iq
power supply
6
power supply rejection ratio
quiescent current
at VCC = 5 V
30
−
38
20.3
2.1
dB
mA
mA
unloaded
36
10
Istb
standby current
mute mode active;
unloaded
−
VMUTE(L)
VMUTE(H)
low level voltage on pin MUTE; mute
mode active
0
2
−
−
0.8
5
V
V
high level voltage on pin MUTE; mute
mode inactive
Radial coil driver
VOO(rad) output offset voltage
Icon(rad) maximum constant current
Ip(max)(rad) maximum peak current
Grad gain
−
± 20
300
430
7
± 50
mV
mA
mA
dB
RL = 8 Ω
RL = 8 Ω
250
250
6
−
−
8
VCC = 9 V;
Vi = 700 mV (p-p);
Rext = 4.7 kΩ; note 1
Focus coil driver
VOO(foc)
Icon(foc)
Ip(max)(foc)
Gfoc
output offset voltage
−
± 20
300
430
7
± 50
mV
mA
mA
dB
maximum constant current
maximum peak current
gain
RL = 8 Ω
RL = 8 Ω
250
370
6
−
−
8
VCC = 9 V;
Vi = 700 mV (p-p);
Rext = 4.7 kΩ; note 1
Sled motor driver
VOO(sle)
Icon(sle)
Ip(sle)
output offset voltage
−
± 20
300
430
7
± 50
mV
mA
mA
V/V
maximum constant current
maximum peak current
gain
RL = 8 Ω
RL = 8 Ω
200
370
6
−
−
8
Gsle
VCC = 9 V;
Vi = 700 mV (p-p);
Rext = 4.7 kΩ; note 1
2004 Mar 09
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Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Spindle motor driver
VOO(spin)
Icon(spin)
Ip(spin)
output offset voltage
−
±10
430
600
1.12
±50
−
mV
mA
mA
V/V
maximum constant current
maximum peak current
gain
RL = 4 Ω
400
560
1
RL = 4 Ω
−
Gspin
VCC = 9 V;
1.26
Vi = 700 mV (p-p);
Rext = 4.7 kΩ; note 1
3.3 V generator
Vfb(3.3) feedback voltage
IO(3.3) output current
1.8 V generator
Vfb(1.8) feedback voltage
IO(1.8) output current
3.1
3
3.3
4.4
3.5
5
V
mA
1.7
3
1.8
4.2
1.9
5
V
mA
Note
1. For gain measurements, only the channel being tested is active, the others are inactive; see Fig.4.
2004 Mar 09
8
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
10 TEST AND APPLICATION INFORMATION
MCE472
3
handbook, halfpage
P
(W)
2
1
0
0
50
100
150
200
(˚C)
T
amb
70 × 70 × 1.6 mm glass epoxy board.
At temperatures above Tamb = 25 °C, power dissipation is de-rated at 13.6 mW/°C.
Fig.3 Power dissipation as a function of ambient temperature.
2004 Mar 09
9
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
Q1
V
CC
12 V
VOUT3.3
VFBIN3.3
VOUT1.8
3.3 V
GENERATOR
1.8 V
GENERATOR
28
27
26
1
2
220
µF
3.3 V
x1
x1
RADOUTN
FOCOUTP
47 µF
Q2
3
1.8 V
VFBIN1.8
GND
25
4
5
8 Ω
8 Ω
47 µF
x1
x1
MUTE 24
32.3 kΩ
32.3 kΩ
MUTE
24 kΩ
FOCOUTN
RADOUTP
4.7 kΩ
RADIN
23
6
4.7 kΩ
24 kΩ
FOCIN 22
V
CC
12 V
7
TZA1048
32.3 kΩ
4.7 kΩ
24 kΩ
V
CC
12 V
SLIN
21
8
9
x1
x1
SLOUTP
VBIASIN 20
8 Ω
32.3 kΩ
GND
19
10
SLOUTN
GND
VBIASOUT 18
11
12
x0.5
x0.5
MOTBIAS
MOTOUTP
8 Ω
MOTOUTN
17
32.3 kΩ
24 kΩ
24 kΩ
MOTIN1 16
13
14
4.7 kΩ
4.7 kΩ
Vs
V
CC
MOTIN2
15
mce473
Fig.4 Gain test configuration.
2004 Mar 09
10
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
Q1
Q2
1
28
27
26
25
12 V
3.3 V
220 µF
2
47 µF
47 µF
3
1.8 V
radial focus
4
coil
coil
24
23
5
6
12 V
22
7
TZA1048
12 V
8
9
21
20
19
sled
motor
M
M
10
SLED FOCUS RADIAL
COIL COIL COIL
11
12
13
14
18
17
16
15
SERVO/COIL DRIVER
12 V
spindle
motor
SPINDLE
MOTOR1
SPINDLE
MOTOR2
MUTE
FORWARD
M
MICROCONTROLLER
REVERSE
loading
motor
MCE474
Fig.5 Spindle motor differential control application.
2004 Mar 09
11
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
Q1
Q2
1
28
27
26
25
12 V
3.3 V
220 µF
2
47 µF
47 µF
3
1.8 V
radial focus
4
coil
coil
24
23
5
6
12 V
22
7
TZA1048
12 V
8
9
21
20
19
sled
motor
M
M
10
SLED FOCUS RADIAL
COIL COIL COIL
11
12
13
14
18
17
16
15
SERVO/COIL DRIVER
12 V
spindle
motor
SPINDLE
MOTOR1
MUTE
FORWARD
M
MICROCONTROLLER
REVERSE
loading
motor
MCE475
Fig.6 Spindle motor single-ended application.
2004 Mar 09
12
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
11 PACKAGE OUTLINE
HSOP28: plastic, heatsink small outline package; 28 leads
SOP007
D
E
c
X
y
H
E
28
15
A
A
2
A
1
L
p
detail X
1
14
L
b
b
1
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
A
2
max
(1)
(1)
UNIT
A
b
b
c
D
E
e
H
L
L
y
1
1
E
p
0.20
0.05
5.25 0.45 0.30 18.67 7.75
5.05 0.30 0.23 18.41 7.49
10.02
9.62
1.0
0.4
mm
2.2
2.31
0.8
1.1
0.089
Note
1. Plastic or metal protrusions are not included.
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
03-07-28
SOP007
2004 Mar 09
13
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
12 SOLDERING
To overcome these problems the double-wave soldering
method was specifically developed.
12.1 Introduction to soldering surface mount
packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
12.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all BGA, HTSSON-T and SSOP-T packages
12.4 Manual soldering
– for packages with a thickness ≥ 2.5 mm
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
12.3 Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2004 Mar 09
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Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
12.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
USON, VFBGA
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC(5), SO, SOJ
not suitable(4)
suitable
suitable
suitable
LQFP, QFP, TQFP
not recommended(5)(6) suitable
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not recommended(7)
suitable
not suitable
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar or manual soldering is suitable for PMFP packages.
2004 Mar 09
15
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
13 DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
14 DEFINITIONS
15 DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Mar 09
16
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
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Date of release: 2004 Mar 09
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