UDA1325 [NXP]

Universal Serial Bus USB CODEC; 通用串行总线USB编解码器
UDA1325
型号: UDA1325
厂家: NXP    NXP
描述:

Universal Serial Bus USB CODEC
通用串行总线USB编解码器

解码器 编解码器
文件: 总52页 (文件大小:313K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
UDA1325  
Universal Serial Bus (USB) CODEC  
1999 May 10  
Preliminary specification  
File under Integrated Circuits, IC01  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
FEATURES  
General  
Audio recording channel  
One isochronous input endpoint  
Supports multiple audio data formats (8, 16 and 24 bits)  
High Quality USB-compliant Audio/HID device  
Supports 12 Mbits/s serial data transmission  
Fully USB Plug and Play operation  
Twelve selectable sample rates (4, 8, 16 or 32 kHz;  
5.5125, 11.025, 22.05 or 44.1 kHz; 6, 12, 24 or 48 kHz)  
via analog PLL (APLL).  
Supports ‘Bus-powered’ and ‘Self-powered’ operation  
3.3 V power supply  
Selectable sample rate between 5 to 55 kHz via a  
second oscillator (optional)  
One slave 20-bit I2S digital stereo recording input,  
I2S and LSB justified serial formats  
Low power consumption with optional efficient power  
control  
On-chip clock oscillator, only an external crystal is  
required.  
Programmable Gain Amplifier for left and right channel  
Low total harmonic distortion (typical 85 dB)  
High signal-to-noise ratio (typical 90 dB)  
One stereo Line/Microphone input.  
Audio playback channel  
One isochronous output endpoint  
Supports multiple audio data formats (8, 16 and 24 bits)  
USB endpoints  
Adaptive sample frequency support from 5 to 55 kHz  
One master 20-bit I2S digital stereo playback output,  
I2S and LSB justified serial formats  
2 control endpoints  
2 interrupt endpoints  
1 isochronous data sink endpoint  
1 isochronous data source endpoint.  
One slave 20-bit I2S digital stereo playback input,  
I2S and LSB justified serial formats  
Selectable volume control for left and right channel  
Soft mute control  
Document references  
“USB Specification”  
Digital bass and treble tone control  
Selectable on-chip digital de-emphasis  
Low total harmonic distortion (typical 90 dB)  
High signal-to-noise ratio (typical 95 dB)  
One stereo Line output.  
“USB Device Class Definition for Audio Devices”  
“Device Class Definition for Human Interface Devices  
(HID)”  
“USB HID Usage Table”.  
“USB Common Class Specification”.  
1999 May 10  
2
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
All I2S inputs and I2S outputs support standard I2S-bus  
format and the LSB justified serial data format with word  
lengths of 16, 18 and 20 bits.  
APPLICATIONS  
USB monitors  
USB speakers  
Via the digital I/O module with its I2S input and output, an  
external DSP can be used for adding extra sound  
processing features for the audio playback channel.  
USB microphones  
USB headsets  
USB telephone/answering machines  
USB links in consumer audio devices.  
The microcontroller is responsible for handling the  
high-level USB protocols, translating the incoming control  
requests and managing the user interface via general  
purpose pins and an I2C-bus.  
GENERAL DESCRIPTION  
The ADAC enables the wide and continuous range of  
playback sampling frequencies. By means of a Sample  
Frequency Generator (SFG), the ADAC is able to  
reconstruct the average sample frequency from the  
incoming audio samples. The ADAC also performs the  
playback sound processing. The ADAC consists of a  
FIFO, an unique audio feature processing DSP, the SFG,  
digital filters, a variable hold register, a Noise Shaper (NS)  
and a Filter Stream DAC (FSDAC) with line output drivers.  
The audio information is applied to the ADAC via the USB  
processor or via the digital I2S input of the digital I/O  
module.  
The UDA1325 is a single chip stereo USB codec  
incorporating bitstream converters designed for  
implementation in USB-compliant audio peripherals and  
multimedia audio applications. It contains a USB interface,  
an embedded microcontroller, an Analog-to-Digital  
Interface (ADIF) and an Asynchronous Digital-to-Analog  
Converter (ADAC).  
The USB interface consists of an analog front-end and a  
USB processor. The analog front-end transforms the  
differential USB data into a digital data stream. The USB  
processor buffers the incoming and outgoing data from the  
analog front-end and handles all low-level USB protocols.  
The USB processor selects the relevant data from the  
universal serial bus, performs an extensive error detection  
and separates control information and audio information.  
The control information is made accessible to the  
microcontroller. At playback, the audio information  
becomes available at the digital I2S output of the digital I/O  
module or is fed directly to the ADAC. At recording, the  
audio information is delivered by the ADIF or by the digital  
I2S input of the I2S-bus interface.  
The ADIF consists of an Programmable Gain Amplifier  
(PGA), an Analog-to-Digital Converter (ADC) and a  
Decimator Filter (DF). An Analog Phase Lock Loop (APLL)  
or oscillator is used for creating the clock signal of the  
ADIF. The clock frequency for the ADIF can be controlled  
via the microcontroller. Several clock frequencies are  
possible for sampling the analog input signal at different  
sampling rates.  
The wide dynamic range of the bitstream conversion  
technique used in the UDA1325 for both the playback and  
recording channel guarantees a high audio sound quality.  
ORDERING INFORMATION  
PACKAGE  
TYPE NUMBER  
NAME  
DESCRIPTION  
VERSION  
UDA1325PS  
UDA1325H  
SDIP42  
QFP64  
plastic shrink dual in-line package; 42 leads (600 mil)  
SOT270-1  
SOT319-2  
plastic quad flat package; 64 leads (lead length 1.95 mm);  
body 14 × 20 × 2.8 mm  
1999 May 10  
3
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
QUICK REFERENCE DATA  
SYMBOL  
Supplies  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VDDE  
supply voltage periphery  
supply voltage core  
total supply current  
4.75  
5.0  
5.25  
3.6  
tbf  
V
VDDI  
3.0  
3.3  
60  
V
IDD(tot)  
IDD(tot)(ps)  
mA  
µA  
total supply current in power-saving note 1  
mode  
360  
Dynamic performance DAC  
(THD + N)/S total harmonic distortion plus  
noise-to-signal ratio  
fs = 44.1 kHz; RL = 5 kΩ  
fi = 1 kHz (0 dB)  
90  
80  
dB  
%
0.0032 0.01  
fi = 1 kHz (60 dB)  
30  
3.2  
95  
20  
10  
dB  
%
S/N  
signal-to-noise ratio at bipolar zero A-weighted at code 0000H 90  
dBA  
V
Vo(FS)(rms)  
full-scale output voltage  
(RMS value)  
VDD = 3.3 V  
0.66  
Dynamic performance PGA and ADC  
(THD + N)/S total harmonic distortion plus  
noise-to-signal ratio  
fs = 44.1 kHz;  
PGA gain = 0 dB  
fi = 1 kHz; (0 dB);  
Vi = 1.0 V (RMS)  
85  
80  
dB  
%
0.0056 0.01  
fi = 1 kHz (60 dB)  
30  
3.2  
95  
20  
10.0  
dB  
%
S/N  
signal-to-noise ratio  
Vi = 0.0 V  
90  
dBA  
General characteristics  
fi(s)  
audio input sample frequency  
operating ambient temperature  
5
0
55  
70  
kHz  
Tamb  
25  
°C  
Note  
1. Exclusive the IDDE current which depends on the components connected to the I/O pins.  
1999 May 10  
4
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
BLOCK DIAGRAM  
P0.7 to P0.0  
P2.0 to P2.7  
CLK  
27  
D+  
D−  
8 (9)  
6 (8)  
7, 5, 3, 64,  
62, 60, 58, 56  
14, 16, 18, 20,  
22, 23, 29, 30  
V
V
V
V
V
V
V
V
V
V
(10) 9  
(11) 10  
(12) 11  
(13) 12  
(23) 32  
(24) 33  
(29) 38  
(30) 39  
(33) 42  
(35) 44  
DDI  
SSI  
V
24 (19)  
SSX  
SSE  
XTAL1b 25 (20)  
XTAL2b 26 (21)  
ANALOG FRONT-END  
USB-PROCESSOR  
OSC  
48 MHz  
DDE  
DDO  
SSO  
DDA1  
SSA1  
DDA2  
SSA2  
TIMING  
V
28 (22)  
52 (39)  
53 (40)  
DDX  
V
DDA3  
XTAL2a  
OSC  
ADC  
ANALOG  
PLL  
XTAL1a 54 (41)  
V
55 (42)  
SSA3  
GP2/DO 63 (4)  
GP3/WSO 1 (5)  
GP4/BCKO 2 (6)  
GP1/DI 13 (14)  
DIGITAL I/O  
(17) 19 SCL  
(18) 21 SDA  
GP0/BCKI 17 (16)  
GP5/WSI 15 (15)  
MICRO-  
CONTROLLER  
PSEN 31  
MUX  
FIFO  
DA 57 (1)  
WS 59 (2)  
BCK 61 (3)  
SAMPLE  
FREQUENCY  
GENERATOR  
AUDIO FEATURE  
PROCESSING DSP  
2
I S-BUS  
INTERFACE  
DECIMATOR  
FILTER  
(7) 4 SHTCB  
(26) 35 TC  
UPSAMPLE FILTERS  
VARIABLE HOLD REGISTER  
3rd-ORDER NOISE SHAPER  
TEST  
CONTROL  
BLOCK  
EA 48  
ALE 50  
(27) 36 RTCB  
VINL 43 (34)  
VINR 47 (36)  
LEFT  
Σ∆ ADC  
PGA  
PGA  
UDA1325  
LEFT  
DAC  
+
(25) 34 VOUTL  
(28) 37 VOUTR  
RIGHT  
Σ∆ ADC  
+
RIGHT  
DAC  
REFERENCE VOLTAGE  
VRN 49 (37)  
VRP 51 (38)  
45, 46  
n.c.  
41 (32)  
40 (31)  
V
V
MGM108  
ref(AD)  
ref(DA)  
The pin numbers given in parenthesis refer to the SDIP42 version.  
Fig.1 Block diagram (QFP64 package).  
5
1999 May 10  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
PINNING  
PIN  
PIN  
SYMBOL  
I/O  
DESCRIPTION  
QFP64 SDIP42  
GP3/WSO  
GP4/BCKO  
P0.5  
1
2
3
4
5
6
5
6
7
8
I/O  
I/O  
I/O  
I
general purpose pin 3 or word select output  
general purpose pin 4 or bit clock output  
Port 0.5 of the microcontroller  
SHTCB  
P0.6  
shift clock of the test control block (active HIGH)  
Port 0.6 of the microcontroller  
I/O  
I/O  
D−  
negative data line of the differential data bus, conforms to the USB  
standard  
P0.7  
D+  
7
8
I/O  
I/O  
Port 0.7 of the microcontroller  
9
positive data line of the differential data bus, conforms to the USB  
standard  
VDDI  
9
10  
11  
12  
13  
14  
digital supply voltage for core  
digital ground for core  
VSSI  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
VSSE  
digital ground for I/O pads  
VDDE  
digital supply voltage for I/O pads  
general purpose pin 1 or data input  
Port 2.0 of the microcontroller  
general purpose pin 5 or word select input  
Port 2.1 of the microcontroller  
general purpose pin 0 or bit clock input  
Port 2.2 of the microcontroller  
serial clock line I2C-bus  
GP1/DI  
P2.0  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
GP5/WSI  
P2.1  
15  
GP0/BCKI  
P2.2  
16  
SCL  
17  
P2.3  
Port 2.3 of the microcontroller  
serial data line I2C-bus  
SDA  
18  
P2.4  
Port 2.4 of the microcontroller  
Port 2.5 of the microcontroller  
crystal oscillator ground (48 MHz)  
crystal input (analog; 48 MHz)  
crystal output (analog; 48 MHz)  
48 MHz clock output signal  
P2.5  
VSSX  
19  
20  
21  
XTAL1b  
XTAL2b  
CLK  
I
O
O
VDDX  
22  
supply crystal oscillator (48 MHz)  
Port 2.6 of the microcontroller  
Port 2.7 of the microcontroller  
program store enable (active LOW)  
supply voltage for operational amplifier  
operational amplifier ground  
P2.6  
I/O  
I/O  
I/O  
P2.7  
PSEN  
VDDO  
VSSO  
23  
24  
25  
26  
27  
28  
VOUTL  
TC  
O
voltage output left channel  
I
test control input (active HIGH)  
asynchronous reset input of the test control block (active HIGH)  
voltage output right channel  
RTCB  
VOUTR  
I
O
1999 May 10  
6
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
PIN  
PIN  
SYMBOL  
VDDA1  
I/O  
DESCRIPTION  
QFP64 SDIP42  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
29  
30  
31  
32  
33  
34  
35  
analog supply voltage 1  
analog ground 1  
VSSA1  
Vref(DA)  
Vref(AD)  
VDDA2  
VINL  
VSSA2  
n.c.  
O
O
reference voltage output DAC  
reference voltage output ADC  
analog supply voltage 2  
I
input signal left channel PGA  
analog ground 2  
not connected  
n.c.  
not connected  
VINR  
EA  
36  
I
input signal right channel PGA  
external access (active LOW)  
negative reference input voltage ADC  
address latch enable (active HIGH)  
positive reference input voltage ADC  
VRN  
37  
I
ALE  
VRP  
38  
39  
40  
41  
42  
I
VDDA3  
XTAL2a  
XTAL1a  
VSSA3  
P0.0  
supply voltage for crystal oscillator and analog PLL  
crystal output (analog; ADC)  
crystal input (analog; ADC)  
O
I
crystal oscillator and analog PLL ground  
Port 0.0 of the microcontroller  
data Input (digital)  
I/O  
I
DA  
1
P0.1  
I/O  
I
Port 0.1 of the microcontroller  
word select Input (digital)  
WS  
2
P0.2  
I/O  
I
Port 0.2 of the microcontroller  
bit clock Input (digital)  
BCK  
3
P0.3  
I/O  
I/O  
I/O  
Port 0.3 of the microcontroller  
general purpose pin 2 or data output  
Port 0.4 of the microcontroller  
GP2/DO  
P0.4  
4
1999 May 10  
7
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
GP3/WSO  
GP4/BCKO  
P0.5  
1
2
51 VRP  
50 ALE  
49 VRN  
48 EA  
3
SHTCB  
P0.6  
4
5
47 VINR  
46 n.c.  
45 n.c.  
44 V  
D  
6
P0.7  
7
D+  
8
SSA2  
V
9
43 VINL  
42 V  
DDI  
V
10  
11  
12  
UDA1325H  
SSI  
DDA2  
V
41 V  
40 V  
39 V  
38 V  
SSE  
ref(AD)  
V
DDE  
ref(DA)  
SSA1  
GP1/DI 13  
P2.0 14  
DDA1  
GP5/WSI 15  
P2.1 16  
37 VOUTR  
36 RTCB  
35 TC  
GP0/BCKI 17  
P2.2 18  
34 VOUTL  
SCL 19  
33 V  
SSO  
MGL349  
Fig.2 Pin configuration (QFP64 package).  
8
1999 May 10  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
FUNCTIONAL DESCRIPTION  
The Universal Serial Bus (USB)  
Data and power is transferred via the USB over a 4-wire  
cable. The signalling occurs over two wires and  
point-to-point segments. The signals on each segment are  
differentially driven into a cable of 90 intrinsic  
impedance. The differential receiver features input  
sensitivity of at least 200 mV and sufficient common mode  
rejection.  
handbook, halfpage  
V
1
2
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
DA  
WS  
SSA3  
The analog front-end  
XTAL1a  
XTAL2a  
The analog front-end is an on-chip generic USB  
3
BCK  
transceiver. It is designed to allow voltage levels up to VDD  
from standard or programmable logic to interface with the  
physical layer of the USB. It is capable of receiving and  
transmitting serial data at full speed (12 Mbits/s).  
V
4
GP2/DO  
GP3/WSO  
GP4/BCKO  
SHTCB  
D−  
DDA3  
5
VRP  
VRN  
VINR  
6
7
The USB processor  
V
8
SSA2  
The USB processor forms the interface between the  
analog front-end, the ADIF, the ADAC and the  
microcontroller. The USB processor consists of:  
9
D+  
VINL  
V
V
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
DDI  
DDA2  
A bit clock recovery circuit  
V
V
UDA1325  
SSI  
ref(AD)  
The Philips Serial Interface Engine (PSIE)  
The Memory Management Unit (MMU)  
The Audio Sample Redistribution (ASR) module.  
V
V
SSE  
ref(DA)  
V
V
DDE  
SSA1  
V
GP1/DI  
GP5/WSI  
GP0/BCKI  
SCL  
DDA1  
Bit clock recovery  
VOUTR  
RTCB  
TC  
The bit clock recovery circuit recovers the clock from the  
incoming USB data stream using four times over-sampling  
principle. It is able to track jitter and frequency drift  
specified by the USB specification.  
SDA  
VOUTL  
V
V
SSX  
SSO  
Philips Serial Interface Engine (PSIE)  
V
XTAL1b  
XTAL2b  
DDO  
The Philips SIE implements the full USB protocol layer.  
It translates the electrical USB signals into data bytes and  
control signals. Depending upon the USB device address  
and the USB endpoint address, the USB data is directed  
to the correct endpoint buffer. The data transfer could be  
of bulk, isochronous, control or interrupt type.  
V
DDX  
MGM106  
The functions of the PSIE include: synchronization pattern  
recognition, parallel/serial conversion, bit  
stuffing/de-stuffing, CRC checking/generation, PID  
verification/generation, address recognition and  
handshake evaluation/generation.  
The amount of bytes/packet on all endpoints is limited by  
the PSIE hardware to 8 bytes/packet, except for both  
isochronous endpoints (336 bytes/packet).  
Fig.3 Pin configuration (SDIP42 package).  
1999 May 10  
9
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Memory Management Unit (MMU) and integrated RAM The Analog-to-Digital Interface (ADIF)  
The MMU and integrated RAM handle the temporary data  
storage of all USB packets that are received or sent over  
the bus.  
The ADIF is used for sampling an analog input signal from  
a microphone or line input and sending the audio samples  
to the USB interface. The ADIF consists of a stereo  
Programmable Gain Amplifier (PGA), a stereo  
Analog-to-Digital Converter (ADC) and Decimation Filters  
(DFs). The sample frequency of the ADC is determined by  
the ADC clock (see Section “The clock source of the  
analog-to-digital interface”). The user can also select a  
digital serial input instead of an analog input. In this event  
the sample frequency is determined by the continuous WS  
The MMU and integrated RAM handle the differences  
between data rate of the USB and the application allowing  
the microcontroller to read and write USB packets at its  
own speed.  
The audio data is transferred via an isochronous data sink  
endpoint or source endpoint and is stored directly into the  
RAM. Consequently, no handshaking mechanism is used. clock with a range between 5 to 55 kHz. Digital serial input  
is possible with four formats (I2S-bus, 16, 18 or 20 bits  
LSB-justified).  
Audio Sample Redistribution (ASR)  
The ASR reads the audio samples from the MMU and  
integrated RAM and distributes these samples equidistant  
over a 1 ms frame period. The distributed audio samples  
are translated by the digital I/O module to standard I2S-bus  
format or 16, 18 or 20 bits LSB-justified I2S-bus format.  
The ASR generates the bit clock output (BCKO) and the  
Word Select Output signal (WSO) of the I2S output.  
Programmable Gain Amplifier circuit (PGA)  
This circuit can be used for a microphone or line input.  
The input audio signals can be amplified by seven different  
gains (3 dB, 0 dB, 3 dB, 9 dB, 15 dB, 21 dB and 27 dB).  
The gain settings are given in Table 17.  
The Analog-to-Digital Converter (ADC)  
The 80C51 microcontroller  
The stereo ADC of the UDA1325 consists of two 3rd-order  
Sigma-Delta modulators. They have a modified  
Ritchie-coder architecture in a differential switched  
capacitor implementation. The oversampling ratio is 128.  
Both ADCs can be switched off in power saving mode (left  
and right separate). The ADC clock is generated by the  
analog PLL or the ADC oscillator.  
The microcontroller receives the control information  
selected from the USB by the USB processor. It can be  
used for handling the high-level USB protocols and the  
user interfaces. The microcontroller does not handle the  
audio stream.  
The major task of the software process that is mapped  
upon the microcontroller, is to control the different modules  
of the UDA1325 in such a way that it behaves as a USB  
device.  
The Decimation Filter (DF)  
The decimator filter converts the audio data from 128fs  
down to 1fs with a word width of 8, 16 or 24 bits. This data  
can be transmitted over the USB as mono or stereo in  
1, 2 or 3 bytes/sample. The decimator filters are clocked  
by the ADC clock.  
The embedded 80C51 microcontroller is compatible with  
the 80C51 family of microcontrollers described in the  
80C51 family single-chip 8-bit microcontrollers of “Data  
Handbook IC20”, which should be read in conjunction with  
this data sheet.  
The internal ROM size is 12 kbyte. The internal RAM size  
is 256 byte. A Watchdog Timer is not integrated.  
1999 May 10  
10  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
The clock source of the analog-to-digital interface  
The clock source of the ADIF is the analog PLL or the ADC oscillator. The preferred clock source can be selected.  
The ADC clock used for the ADC and decimation filters is obtained by dividing the clock signal coming from the analog  
PLL or from the ADC oscillator by a factor Q.  
Using the analog PLL the user can select 3 basic APLL clock frequencies (see Table 1).  
By connecting the appropriate crystal the user can choose any clock signal between 8.192 and 14.08 MHz via the ADC  
oscillator.  
Table 1 The analog PLL clock output frequencies  
APLL CLOCK  
FCODE (1 AND 0)  
FREQUENCY (MHz)  
00  
01  
10  
11  
11.2896  
8.1920  
12.2880  
11.2896  
The dividing factor Q can be selected via the microcontroller. With this dividing factor Q the user can select a range of  
ADC clock signals allowing several different sample frequencies (see Table 2).  
Table 2 ADC clock frequencies and sample frequencies based upon using the APLL as a clock source  
APLL CLOCK  
DIVIDE FACTOR Q ADC CLOCK FREQUENCY (MHz) SAMPLE FREQUENCY (kHz)  
FREQUENCY (MHz)  
8.1920  
11.2896  
12.2880  
1
2
4
8
1
2
4
8
1
2
4
8
4.096  
2.048  
32  
16  
1.024  
8
0.512 (not supported)  
5.6448  
4 (not supported)  
44.1  
22.05  
11.025  
5.5125  
48  
2.8224  
1.4112  
0.7056  
6.144  
3.072  
24  
1.536  
12  
0.768  
6
Table 3 ADC clock frequencies and sample frequencies based upon using the OSCAD as a clock source  
OSCAD CLOCK  
DIVIDE FACTOR Q ADC CLOCK FREQUENCY (MHz) SAMPLE FREQUENCY (kHz)  
FREQUENCY (MHz)  
(1)  
fosc  
Q(2)  
fosc/(2Q)  
fosc/(256Q)(3)  
Notes  
1. The oscillator frequency (and therefore the crystal) of OSCAD must be between 8.192 and 14.08 MHz.  
2. The Q factor can be 1, 2, 4 or 8.  
3. Sample frequencies below 5 kHz and above 55 kHz are not supported.  
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Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
The Asynchronous Digital-to-Analog Converter  
(ADAC)  
Table 4 Frequency domains for audio processing by the  
DSP  
The ADAC receives audio data from the USB processor or  
from the digital I/O-bus. The ADAC is able to reconstruct  
the sample clock from the rate at which the audio samples  
arrive and handles the audio sound processing. After the  
processing, the audio signal is upsampled, noise-shaped  
and converted to analog output voltages capable of driving  
a line output.  
DOMAIN  
SAMPLE FREQUENCY (kHz)  
1
2
3
4
5 to 12  
12 to 25  
25 to 40  
40 to 55  
The upsampling filters and variable hold function  
The ADAC consists of:  
A Sample Frequency Generator (SFG)  
FIFO registers  
After the audio feature processing DSP two upsampling  
filters and a variable hold function increase the  
oversampling rate to 128fs.  
An audio feature processing DSP  
Two digital upsampling filters and a variable hold  
register  
The noise shaper  
A 3rd-order noise shaper converts the oversampled data  
to a noise-shaped bitstream for the FSDAC. The in-band  
quantization noise is shifted to frequencies well above the  
audio band.  
A digital Noise Shaper (NS)  
A Filter Stream DAC (FSDAC) with integrated filter and  
line output drivers.  
The Sample Frequency Generator (SFG)  
The Filter Stream DAC (FSDAC)  
The SFG controls the timing signals for the asynchronous  
digital-to-analog conversion. By means of a digital PLL,  
the SFG automatically recovers the applied sampling  
frequency and generates the accurate timing signals for  
the audio feature processing DSP and the upsampling  
filters.  
The FSDAC is a semi-digital reconstruction filter that  
converts the 1-bit data stream of the noise shaper to an  
analog output voltage. The filter coefficients are  
implemented as current sources and are summed at  
virtual ground of the output operational amplifier. In this  
way very high signal-to-noise performance and low clock  
jitter sensitivity is achieved. A post filter is not needed  
because of the inherent filter function of the DAC.  
On-board amplifiers convert the FSDAC output current to  
an output voltage signal capable of driving a line output.  
The lock time of the digital PLL can be chosen (see  
Table 8). While the digital PLL is not in lock, the ADAC is  
muted. As soon as the digital PLL is in lock, the mute is  
released as described in Section “Soft mute control”.  
First-In First-Out (FIFO) registers  
The FIFO registers are used to store the audio samples  
temporarily coming from the USB processor or from the  
digital I/O input. The use of a FIFO (in conjunction with the  
SFG) is necessary to remove all jitter present on the  
incoming audio signal.  
The sound processing DSP  
A DSP processes the sound features. The control and  
mapping of the sound features is explained in Section  
“Controlling the playback features of the ADAC”.  
Depending on the sampling rate (fs) the DSP knows four  
frequency domains in which the treble and bass are  
regulated. The domain is chosen automatically.  
1999 May 10  
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Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
USB ENDPOINT DESCRIPTION  
The UDA1325 has following six endpoints:  
USB control endpoint 0  
USB control endpoint 1  
USB status interrupt endpoint 1  
USB status interrupt endpoint 2  
Isochronous data sink endpoint  
Isochronous data source endpoint.  
Table 5 Endpoint description  
ENDPOINT  
NUMBER  
ENDPOINT  
INDEX  
MAX. PACKET  
SIZE (BYTES)  
ENDPOINT TYPE  
control (default)  
DIRECTION  
0
1
0
1
2
3
4
5
6
7
out  
in  
8
8
8
8
8
8
control  
out  
in  
2
3
4
5
interrupt  
in  
interrupt  
in  
isochronous out  
isochronous in  
out  
in  
336  
336  
CONTROLLING THE PLAYBACK FEATURES  
Controlling the playback features of the ADAC  
The exchange of control information between the microcontroller and the ADAC is accomplished through a serial  
hardware interface comprising the following pins:  
L3_DATA: microcontroller interface data line  
L3_MODE: microcontroller interface mode line  
L3_CLK: microcontroller interface clock line.  
See also the description of Port 3 of the 80C51 microcontroller.  
Information transfer through the microcontroller bus is organized in accordance with the so-called ‘L3’ format, in which  
two different modes of operation can be distinguished; address mode and data transfer mode.  
The address mode is required to select a device communicating via the L3-bus and to define the destination registers  
for the data transfer mode. Data transfer for the UDA1325 can only be in one direction, from microcontroller to ADAC to  
program its sound processing features and other functional features.  
ADDRESS MODE  
The address mode is used to select a device (in this case the ADAC) for subsequent data transfer and to define the  
destination registers. The address mode is characterized by L3_MODE being LOW and a burst of 8 pulses on L3_CLK,  
accompanied by 8 data bits on L3_DATA. Data bits 0 and 1 indicate the type of the subsequent data transfer as shown  
in Table 6.  
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Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Table 6 Selection of data transfer type  
BIT1  
BIT0  
DATA TRANSFER TYPE  
0
0
1
1
0
1
0
1
audio feature registers (volume left, volume right, bass and treble)  
not used  
control registers  
not used  
Data bits 7 to 2 represent a 6-bit device address, with bit 7 being the MSB and bit 2 the LSB. The address of the ADAC  
is 000101 (bits 7 to 2). In the event that the ADAC receives a different address, it will deselect its microcontroller interface  
logic.  
DATA TRANSFER MODE  
The selection preformed in the address mode remains active during subsequent data transfers, until the ADAC receives  
a new address command. The data transfer mode is characterized by L3_MODE being HIGH and a burst of 8 pulses on  
L3_CLK, accompanied by 8 data bits. All transfers are bitwise, i.e. they are based on groups of 8 bits. Data will be stored  
in the ADAC after the eight bit of a byte has been received. The principle of a multibyte transfer is illustrated in the figure  
below.  
t
halt  
n
L3MODE  
L3CLOCK  
L3DATA  
MGD018  
address  
data byte #1  
data byte #2  
address  
PROGRAMMING THE SOUND PROCESSING AND OTHER FEATURES  
The sound processing and other feature values are stored in independent registers. The first selection of the registers is  
achieved by the choice of data transfer type. This is performed in the address mode, bits 1 and 0 (see Table 6).  
The second selection is performed by bit 7 and/or bit 6 of the data byte depending of the selected data transfer type.  
Data transfer type ‘audio feature registers’  
When the data transfer type ‘audio feature registers’ is selected 4 audio feature registers can be selected depending on  
bits 7 and 6 of the data byte (see Table 7).  
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Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Table 7 ADAC audio feature registers  
BIT7  
BIT6  
BIT5  
BIT4  
BIT3  
BIT2  
BIT1  
BIT0  
REGISTER  
0
0
1
1
0
1
0
1
VR5  
VL5  
X
VR4  
VL4  
BB4  
TR4  
VR3  
VL3  
BB3  
TR3  
VR2  
VL2  
BB2  
TR2  
VR1  
VL1  
BB1  
TR1  
VR0  
VL0  
BB0  
TR0  
volume right  
volume left  
bass  
X
treble  
The sequence for controlling the ADAC audio feature registers via the L3-bus is given in the figure below.  
DATA_TRANSFER_TYPE  
DEVICE ADDRESS = $5  
d
(L3_MODE = LOW)  
L3_DATA  
0
0
1
0
1
0
0
0
bit 0  
bit 7  
LEFT VOLUME; TREBLE  
RIGHT VOLUME; BASS  
REGISTER  
ADDRESS  
(L3_MODE = HIGH)  
L3_DATA  
X
X
X
X
X
X
X
X
bit 0  
bit 7  
L3_CLK  
MGS270  
Data transfer type ‘control registers’  
When the data transfer type ‘control registers’ is selected 2 general control registers can be selected depending on bit 7  
of the data byte (see Table 7).  
The sequence for controlling the ADAC control registers via the L3-bus is given in the figure below.  
DATA_TRANSFER_TYPE  
DEVICE ADDRESS = $5  
d
(L3_MODE = LOW)  
L3_DATA  
0
1
1
0
1
0
0
0
bit 0  
bit 7  
REGISTER  
ADDRESS  
DATA OF THE CONTROL REGISTER  
(L3_MODE = HIGH)  
L3_DATA  
X
X
X
X
X
X
X
X
bit 0  
bit 7  
L3_CLK  
MGS269  
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Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Table 8 ADAC general control registers  
REGISTER  
BIT  
DESCRIPTION  
reset ADAC  
VALUE  
COMMENT  
Control register 0  
0
0 = not reset  
1 = reset  
1
2
3
4
soft mute control  
0 = not muted  
1 = mutes  
synchronous/asynchronous  
channel manipulation  
de-emphasis  
0 = asynchronous  
1 = synchronous  
select 0  
0 = L -> L, R -> R  
1 = L -> R, R -> L  
0 = de-emphasis off  
1 = de-emphasis on  
6 and 5 audio mode  
00 = flat mode  
01 = min. mode  
10 = min. mode  
11 = max. mode  
7
selecting bit  
0
Control register 1  
1 and 0 serial I2S-bus input format  
00 = I2S-bus  
01 = 16-bit LSB justified  
10 = 18-bit LSB justified  
11 = 20-bit LSB justified  
3 and 2 digital PLL mode  
00 = adaptive  
01 = fix state 1  
10 = fix state 2  
11 = fix state 3  
select 00  
4
digital PLL lock mode  
0 = adaptive  
1 = fixed  
select 1  
6 and 5 digital PLL lock speed  
00 = lock after 512 samples  
select 00  
01 = lock after 2048 samples  
10 = lock after 4096 samples  
11 = lock after 16348 samples  
7
selecting bit  
1
Soft mute control  
When the mute (bit 1 of control register 0) is active for the playback channel, the value of the sample is decreased  
smoothly to zero following a raised cosine curve. There are 32 coefficients used to step down the value of the data, each  
one being used 32 times before stepping to the next. This amounts to a mute transition of 23 ms at fs = 44.1 kHz. When  
the mute is released, the samples are returned to the full level again following a raised cosine curve with the same  
coefficients being used in reversed order.  
The mute, on the master channel is synchronized to the sample clock, so that operation always takes place on complete  
samples.  
1999 May 10  
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Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Volume control  
The volume of the UDA1325 can be controlled from 0 dB down to 60 dB (in steps of 1 dB). Below 60 dB the audio  
signal is muted (−∞ dB). The setting of 0 dB is always referenced to the maximum available volume setting. Independant  
volume control of the left and right channel is possible (balance control).  
Table 9 Volume settings right playback channel  
VR5  
VR4  
VR3  
VR2  
VR1  
VR0  
VOLUME (dB)  
0
0
0
0
0
...  
1
1
1
1
0
0
0
0
0
...  
1
1
1
1
0
0
0
0
0
...  
1
1
1
1
0
0
0
0
1
...  
1
1
1
1
0
0
1
1
0
...  
0
0
1
1
0
1
0
1
0
...  
0
1
0
1
0
0
1  
2  
3  
...  
59  
60  
−∞  
−∞  
Table 10 Volume settings left playback channel  
VL5  
VL4  
VL3  
VL2  
VL1  
VL0  
VOLUME (dB)  
0
0
0
0
0
...  
1
1
1
1
0
0
0
0
0
...  
1
1
1
1
0
0
0
0
0
...  
1
1
1
1
0
0
0
0
1
...  
1
1
1
1
0
0
1
1
0
...  
0
0
1
1
0
1
0
1
0
...  
0
1
0
1
0
0
1  
2  
3  
...  
59  
60  
−∞  
−∞  
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Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Treble control  
For the playback channel, treble can be regulated in three audio modes: minimum, flat and maximum mode. In flat mode  
the audio is not influenced. In minimum and maximum mode, the treble range is from 0 to 6 dB in steps of 2 dB.  
The programmable treble filter is implemented digitally and has a fixed corner frequency of 3000 Hz for the minimum  
mode and 1500 Hz for the maximum mode. Because of the exceptional amount of programmable gain, treble should be  
used with adequate prior attenuation, using volume control.  
Table 11 Treble settings  
TREBLE (dB)  
TR4  
TR3  
TR2  
TR1  
TR0  
FLAT SET  
MIN. SET  
MAX. SET  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
...  
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
...  
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
...  
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
...  
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
...  
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
2
2
2
4
4
4
4
6
6
6
6
6
6
0
0
0
0
2
2
2
2
4
4
4
4
6
6
6
6
6
6
Bass control  
For the playback channel, bass can be regulated in three audio modes: minimum, flat and maximum mode. In flat mode  
the audio is not influenced. In minimum mode the bass range is from 0 to approximately 14 dB in steps of 1.5 dB.  
In maximum mode, the bass range is from 0 to approximately 24 dB in steps of 2 dB. The programmable bass filters are  
implemented digitally and have a fixed corner frequency of 100 Hz for the minimum mode and 75 Hz for the maximum  
mode. Because of the exceptional amount of programmable gain, bass should be used with adequate prior attenuation,  
using volume control.  
1999 May 10  
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Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Table 12 Bass boost settings  
BASS (dB)  
BB4  
BB3  
BB2  
BB1  
BB0  
FLAT SET  
MIN. SET  
MAX. SET  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
...  
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
...  
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
...  
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
...  
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
...  
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1.1  
1.7  
1.1  
1.7  
2.4  
3.6  
2.4  
3.6  
3.7  
5.4  
3.7  
5.4  
5.2  
7.4  
5.2  
7.4  
6.8  
9.4  
6.8  
9.4  
8.4  
11.3  
11.3  
13.3  
13.3  
15.2  
15.2  
17.3  
17.3  
19.2  
19.2  
21.2  
21.2  
23.2  
23.2  
23.2  
23.2  
8.4  
10.2  
10.2  
11.9  
11.9  
13.7  
13.7  
13.7  
13.7  
13.7  
13.7  
13.7  
13.7  
13.7  
13.7  
De-emphasis  
De-emphasis is controlled by bit 4 of control register 0. The de-emphasis filter can be switched on or off. The digital  
de-emphasis filter is dimensioned to produce the de-emphasis frequency characteristics for the sample rate 44.1 kHz.  
De-emphasis is synchronized to the sample clock, so that operation always takes place on complete samples.  
1999 May 10  
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Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Filter characteristics playback channel  
The overall filter characteristic of the UDA1325 in flat mode is given in Fig.4 (de-emphasis off). The overall filter  
characteristic of the UDA1325 includes the filter characteristics of the DSP in flat mode plus the filter characteristic of the  
FSDAC (fs = 44.1 kHz)  
MGM110  
0  
20  
volume  
(dB)  
40  
60  
80  
100  
120  
140  
160  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
f (kHz)  
Fig.4 Overall filter characteristics of the UDA1325.  
1999 May 10  
20  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
DSP extension port for enhanced playback audio processing  
An external DSP can be used for adding extra sound processing features via the I2S inputs and outputs of the digital I/O  
module. The UDA1325 supports the standard I2S-bus data protocol and the LSB-justified serial data input format with  
word lengths of 16, 18 and 20 bits. Using the 4-pin digital I/O option the UDA1325 device acts as a master, controlling  
the BCKO and WSO signals. Using the 6-pin digital I/O option GP2, GP3 and GP4 are output pins (master) and GP0,  
GP1 and GP5 are input pins (slave).  
The period of the WSO signal is determined by the number of samples in the 1 ms frame of the USB. This implies that  
the WSO signal does not have a constant time period, but is jittery.  
The characteristic timing of the I2S-bus signals is illustrated in Figs 5 and 6.  
LEFT  
WS  
RIGHT  
t
t
s;WS  
t
h;WS  
t
BCK(H)  
BCK(L)  
t
t
r
f
BCK  
T
t
cy  
s;DAT  
t
h;DAT  
DATA  
LSB  
MSB  
MGK003  
Fig.5 Timing of digital I/O input signals.  
1999 May 10  
21  
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  e
WS  
BCK  
LEFT  
3
RIGHT  
3
1
2
>=8  
1
2
>=8  
DATA  
MSB B2  
LSB MSB B2  
LSB MSB  
2
INPUT FORMAT I S-BUS  
WS  
RIGHT  
LEFT  
16  
15  
2
1
16  
15  
2
1
BCK  
DATA  
MSB B2  
B15 LSB  
LSB-JUSTIFIED FORMAT 16 BITS  
MSB B2  
B15 LSB  
WS  
RIGHT  
17  
LEFT  
18  
17  
16  
15  
2
1
18  
16  
15  
2
1
BCK  
DATA  
LSB  
LSB  
MSB B2  
B3  
B4  
B17  
MSB B2  
B3  
B4  
B17  
LSB-JUSTIFIED FORMAT 18 BITS  
WS  
LEFT  
18  
RIGHT  
17 16  
20  
19  
17  
16  
15  
2
1
20  
19  
18  
15  
2
1
BCK  
LSB  
LSB  
DATA  
MSB B2  
B3  
B4  
B5  
B6  
B19  
MSB B2  
B3  
B4  
B5  
B6  
B19  
MGK002  
LSB-JUSTIFIED FORMAT 20 BITS  
Fig.6 Input formats.  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
PORT DEFINITION 80C51  
Port 1  
Table 13 Port 1 of the 80C51 microcontroller  
8 BIT PORT 1  
LOW  
no error  
BIT  
FUNCTION  
ADAC_error  
HIGH  
COMMENT  
1.0  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
1.7  
error  
GP1  
GP2  
GP3  
GP4  
GP5  
SCL  
SDA  
general purpose pins  
I2C-bus  
Port 3  
Table 14 Port 3 of the 80C51 microcontroller  
8 BIT PORT 3  
BIT  
3.0  
3.1  
FUNCTION  
ASR_error  
LOW  
HIGH  
COMMENT  
no error  
error  
suspend  
PSIE_MMU_SUSPEND  
no suspend  
suspend input from USB interface  
during normal operation or input from  
restart circuit  
3.2  
3.3  
GP0 (INT0_N)  
general purpose pin  
PSIE_MMU_INT (INT1_N)  
interrupt input from USB interface  
during normal operation or input from  
restart circuit  
3.4  
3.5  
3.6  
3.7  
PSIE_MMU_READY  
L3_MODE  
L3_CLK  
L3_DATA  
1999 May 10  
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Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
MEMORY AND REGISTER SPACE 80C51  
Overview registers  
RESET  
VALUE  
ADDRESS  
REGISTER  
Port registers  
Table 15 Register location and recommended values  
after Power-on reset  
80h  
90h  
A0h  
B0h  
P0  
FFh  
FFh  
FFh  
FFh  
P1  
P2  
P3  
RESET  
VALUE  
ADDRESS  
REGISTER  
0800h  
0801h  
1000h  
1001h  
1002h  
1003h  
2000h  
4000h  
4001h  
PGA gain  
09  
5C  
00  
00  
01  
00  
8B  
ADIF control  
I2C registers (SIO1 registers)  
clock shop settings  
reset control and APLL settings  
IO selection register  
power control  
D8h  
D9h  
DAh  
DBh  
S1CON  
S1STA  
S1DAT  
S1ADR  
00h  
ASR settings  
Interrupts  
data register PSIE  
command register PSIE  
The UDA1325 supports up to five (of maximal 7) interrupt  
sources. Each interrupt source corresponds to an interrupt  
vector in the CPU program memory address space:  
Table 16 Special function register location  
Source 0: vector 0003h external interrupt 0 (INT0_N)  
Source 1: vector 000Bh Timer 0 interrupt  
RESET  
VALUE  
ADDRESS  
REGISTER  
Source 2: vector 0013h external interrupt 1 (INT1_N)  
Source 3: vector 001Bh Timer 1 interrupt  
CPU registers  
81h  
82h  
83h  
D0h  
E0h  
F0h  
SP  
Source 4: vector 0023h UART interrupt (not present)  
Source 5: vector 002Bh Timer 2 interrupt (not present)  
Source 6: vector 0033h I2C interrupt.  
DPL  
DPH  
PSW  
ACC  
B
INTERRUPT ENABLE REGISTER (IE)  
Each interrupt source can be individually enabled or  
disabled by setting or clearing a bit in IE. This register also  
contains a global interrupt enable bit (EA) which can be  
cleared to disable all interrupts at once.  
Interrupt registers  
A8h  
B8h  
IE  
IP  
00h  
00h  
Timer 0 and Timer 1 registers  
7
6
5
4
3
2
1
0
Power On Value  
88h  
89h  
8Ah  
8Bh  
8Ch  
8Dh  
T01CON  
T01MOD  
T0L  
00h  
00h  
00h  
00h  
00h  
00h  
0
0
0
0
0
0
0
0
EX0 (vector 0003h))  
ET0 (vector 000Bh))  
EX1 (vector 0013h)  
ET1 (vector 001Bh)  
ES0 (n.a.)  
ET2 (n.a.)  
ES1 (vector 0033h)  
EA  
T1L  
T0h  
T1h  
PCON registers  
87h  
PCON  
00h  
1999 May 10  
24  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Internal registers  
Table 17 PGA gain registers  
ADDRESS  
REGISTER  
COMMENTS  
BIT  
VALUE  
0800h  
PGA gain register  
reserved  
7
6
X
PGA input selection  
0 (do not change it)  
PGA gain right channel  
5, 4 and 3 000 = 3 dB  
001 = 0 dB  
010 = 3 dB  
011 = 9 dB  
100 = 15 dB  
101 = 21 dB  
110 = 27 dB  
111 = 27 dB  
PGA gain left channel  
2, 1 and 0 000 = 3 dB  
001 = 0 dB  
010 = 3 dB  
011 = 9 dB  
100 = 15 dB  
101 = 21 dB  
110 = 27 dB  
111 = 27 dB  
Table 18 ADIF control registers  
ADDRESS  
REGISTER  
COMMENTS  
BIT  
VALUE  
0801h  
ADIF control register  
reserved  
7
X
number of bits per audio sample  
to be transmitted to the host  
6 and 5 00 = reserved  
01 = 8 bits audio samples  
10 = 16 bits audio samples  
11 = 24 bits audio samples  
0 = mono  
mono/stereo selection  
4
3
2
1 = stereo  
selection audio input recording  
channel  
0 = digital serial audio input  
1 = analog input  
selection high-pass filter of  
ADIF (DC-filter)  
0 = high-pass filter off  
1 = high-pass filter on  
I2S-bus input serial input format  
recording channel  
1 and 0 00 = I2S-bus  
01 = 16-bit LSB justified  
10 = 18-bit LSB justified  
11 = 20-bit LSB justified  
1999 May 10  
25  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Table 19 Clock shop register  
ADDRESS  
REGISTER  
COMMENTS  
BIT  
VALUE  
1000h  
clock shop settings  
selection ADC clock source  
7
0 = ADC clock from APLL  
1 = ADC clock from OSCAD  
divide factor Q  
6 and 5 00 = ADC clock divided-by-1  
01 = ADC clock divided-by-2  
10 = ADC clock divided-by-4  
11 = ADC clock divided-by-8  
clock ADAC  
4
3
2
1
0
0 = enable  
1 = disable  
clock 48 MHz internal  
clock recovered by PSIE  
ADC clock  
0 = enable  
1 = disable  
0 = enable  
1 = disable  
0 = enable  
1 = disable  
OSCAD oscillator  
0 = power on  
1 = power off  
Table 20 Reset control and APLL register  
ADDRESS  
REGISTER  
reset control and APLL fcode (1 and 0)  
settings clock frequency selection APLL  
COMMENTS  
BIT  
VALUE  
1001h  
7 and 6 00 = 256 × 44.1 kHz  
01 = 256 × 32 kHz  
10 = 256 × 48 kHz  
11 = 256 × 44.1 kHz  
reserved  
5
4
X
reset ADAC  
0 = reset off  
1 = reset on  
reset MMU  
3
2
1
0
0 = reset off  
1 = reset on  
reset digital I/O-interface  
reset ADIF  
0 = reset off  
1 = reset on  
0 = reset off  
1 = reset on  
reserved  
X
1999 May 10  
26  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Table 21 I/O selection register  
ADDRESS  
REGISTER  
COMMENTS  
BIT  
VALUE  
1002h  
I/O selection register  
microcontroller control on  
48 MHz oscillator  
7
0 = UPC control disabled  
(48 MHz oscillator is enabled)  
1 = UPC control enabled  
audio format  
6 and 5 00 = 4-pins I2S  
01 = 6-pins I2S  
10 = 3-pins I2S (only input)  
11 = 3-pins I2S (only input)  
GP4 I/O if BIT0 = 1  
GP3 I/O if BIT0 = 1  
GP2 I/O if BIT0 = 1  
GP1 I/O if BIT0 = 1  
GP4 to GP1 function  
4
3
2
1
0
0 = output  
1 = input  
0 = output  
1 = input  
0 = output  
1 = input  
0 = output  
1 = input  
0 = I2S usage  
1 = general purpose usage  
Table 22 Power control register  
ADDRESS  
REGISTER  
COMMENTS  
BIT  
VALUE  
1003h  
power control register  
analog modules  
suspend input selection for P3.1  
of the microcontroller  
7
0 = suspend from USB interface  
connected to P3.1 during  
normal operation  
1 = suspend from restart circuit  
connected to P3.1 (e.g. after  
power-down)  
interrupt input selection for  
P3.3 (INT1_N) of the  
microcontroller  
6
0 = interrupt from USB  
interface connected to P3.3  
during normal operation  
1 = interrupt from restart circuit  
connected to P3.3 (e.g. after  
power-down)  
power APLL  
5
4
3
2
1
0
0 = power on  
1 = power off  
power FSDAC  
power ADC left  
power ADC right  
power PGA left  
power PGA right  
0 = power on  
1 = power off  
0 = power on  
1 = power off  
0 = power on  
1 = power off  
0 = power on  
1 = power off  
0 = power on  
1 = power off  
1999 May 10  
27  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Table 23 ASR control register  
ADDRESS  
REGISTER  
COMMENTS  
robust word clock  
BIT  
VALUE  
2000h  
ASR control register  
7
0 = off (not recommended)  
1 = on (recommended)  
6 and 5 00 = I2S-bus  
01 = 16-bit LSB justified  
serial I2S-bus output format  
digital I/O interface  
10 = 18-bit LSB justified  
11 = 20-bit LSB justified  
0 = mono phase inversal off  
1 = mono phase inversal on  
phase inversion (on right mono  
output)  
4
bits per sample modi  
3 and 2 00 = reserved  
01 = 8-bit audio  
10 = 16-bit audio  
11 = 24-bit audio  
mono or stereo operation  
ASR register start-up mode  
1
0
0 = mono  
1 = stereo  
0 = stop (e.g. at alternate  
setting with bandwidth equal to  
zero)  
1 = go  
START-UP BEHAVIOUR AND POWER MANAGEMENT  
Start-up of the UDA1325  
After power-on (of VDDA1), an internal Power-on reset signal becomes HIGH after a certain RC time. This RC time is  
created by using the internal resistor (2 × 50 k) divider for creating the reference voltage for the FSDAC in combination  
with the capacitor connected externally to the VREFDA pin. The FSDAC and the internal resistor divider are supplied by  
VDDA1 and VSSA1. The RC time can be calculated using R = 25000 and C = Cref.  
During 20 ms after Power-on reset becomes HIGH the UDA1325 has to initiate the internal registers. During this  
initialisation, the user should prevent indicating the ‘connected’ status to the USB-host. This can be done by forcing the  
DP-line LOW (i.e. via one of the GP pins).  
Power Management  
The total current drawn from the USB supply (for i.e. bus-powered operation of the UDA1325 application) must be less  
than 500 µA in suspend mode. In order to reach that low current target, the total power dissipation of the UDA1325 can  
be reduced by disabling all internal clocks and switching off all internal analog modules.  
Important note: In order to make use of power reduction (Power-down mode) and be able to restart after power-down, a  
number of precautions must be taken!  
1999 May 10  
28  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
AT INITIALISATION TIME  
Bit 7of the power control register (mux_ctrl_suspend) must be set to ‘1’, in order to connect the CLK_ON of the USB  
processor with P3.1 of the microcontroller  
Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘0’, in order to connect the PSIE_MMU_INT output pin  
of the USB processor with P3.3 (INT1_N) of the microcontroller  
Bit 7of the I/O selection register must be set to ‘1’, in order to enable the power-on control of the 48 MHz crystal  
oscillator automatically by the microcontroller.  
IN NORMAL OPERATION MODE  
In normal operation working mode, a suspend can be initiated by the falling edge of the CLK_ON output signal of the  
USB processor. This falling edge comes about 2 ms after the rising edge of the PSIE_MMU_SUSPEND output signal of  
the USB processor. At this moment, several actions should be taken by the microcontroller:  
All analog modules of the UDA1325 must be switched off; this can be done by setting bits 5 to 0 of the power control  
register to ‘1’ and bit 0 of the clock shop register to ‘1’  
Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘1’, in order to awake from power-down by the  
CLK_ON signal of the USB processor  
Put all GP pins in the high or low state (depending of how they are used in the UDA1325 application)  
Put the microcontroller in Power-down mode. This can be done via the PCON register of the microcontroller. This  
results in an automatically switching off the 48 MHz crystal oscillator and with that all internal clocks (if they are  
enabled).  
On the rising edge of the CLK_ON output signal, the 48 MHz crystal oscillator will be switched on automatically and with  
that all internal clocks (if they are enabled). At the same time, a counter starts counting for 2048 clock cycles (170 µs).  
This time is necessary for stabilising the 48 MHz clock of the 48 MHz crystal oscillator.  
When the counter reaches its end value (after 2048 cycles), a rising edge will be detected on the P3.3 (INT1_N) of the  
microcontroller. At this moment, following actions should be taken by the microcontroller:  
The Power-down mode of the microcontroller must be switched off  
Re-initialise all GP pins  
All analog modules of the UDA1325 must be switched on; this can be done by setting bits 5 to 0 of the power control  
register to ‘0’ and bit 0 of the clock shop register to ‘0’  
Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘0’, in order to connect the PSIE_MMU_INT output pin  
of the USB processor again with P3.3 (INT1_N) of the microcontroller.  
The UDA1325 is now back in its normal operation mode and can be put back in power reduction mode by the falling edge  
of the CLK_ON signal of the USB processor.  
1999 May 10  
29  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
COMMAND SUMMARY  
COMMAND NAME  
RECIPIENT  
CODING  
DATA PHASE  
Initialization commands  
Set address/enable  
Read address/enable  
Set endpoint enable  
Read endpoint enable  
Set mode  
device  
device  
device  
device  
device  
D0h  
D0h  
D8h  
D8h  
F3h  
write 1 byte  
read 1 byte  
write 1 byte  
read 1 byte  
write 1 byte  
Data flow commands  
Read interrupt register  
Select endpoint  
device  
F4h  
00h  
01h  
read 1 byte  
read 1 byte (optional)  
read 1 byte (optional)  
read 1 byte (optional)  
read 1 byte  
read 1 byte  
read 1 byte  
write 1 byte  
write 1 byte  
write 1 byte  
read n bytes  
write n bytes  
none  
control OUT  
control IN  
other endpoints  
control OUT  
00h + endpoint index  
Get endpoint status  
Set endpoint status  
40h  
control IN  
41h  
other endpoints  
control OUT  
40h + endpoint index  
40h  
control IN  
41h  
other endpoints  
selected endpoint  
selected endpoint  
selected endpoint  
selected endpoint  
selected endpoint  
40h + endpoint index  
Read buffer  
F0h  
F0h  
F1h  
F2h  
FAh  
Write buffer  
Acknowledge setup  
Clear buffer  
none  
Validate buffer  
none  
General commands  
Read current frame number  
F5h  
read 1 or 2 bytes  
1999 May 10  
30  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
COMMAND DESCRIPTIONS  
Command procedure  
Table 24  
BIT  
DESCRIPTION  
Address  
Enable  
the value written becomes  
the device address  
This chapter describes the commands that can be used by  
the microcontroller to control the USB processor. There  
are three basic types of commands:  
a ‘1’ enables this function  
Initialization commands  
Data flow commands  
General commands.  
READ ADDRESS/ENABLE  
Command: D0h.  
Data: read 1 byte.  
A command is represented by an 8 bit code. It can be  
followed by one or more data write cycles or one or more  
read cycles or a combination. The PSIE_MMU_READY  
output connected to Port 3.4 of the microcontroller  
indicates that the previous action (command write, data  
read or data write) has completed. A new action can only  
be initiated if PSIE_MMU_READY is TRUE. The data is  
valid from the moment PSIE_MMU_READY becomes  
TRUE.  
The read address/enable command is used to read the  
USB assigned address and the enable bit of the device.  
The format of the data phase is the same as for the set  
address/enable command.  
SET ENDPOINT ENABLE  
Command: D8h.  
Data: write 1 byte.  
The PSIE contains a number of interrupt registers, one for  
each endpoint. Every time a transition occurs, the interrupt  
flag for the involved endpoint is set. The PSIE_MMU_INT  
connected to Port 3.3 is an OR function of all interrupt  
registers.  
The set endpoint enable command is used to set the  
enable bits for the non default endpoints.  
7
6
5
4
3
2
1
0
Power On Value  
X
X
X
X
X
X
X
0
Initialization commands  
Enable  
Initialization commands are used during the enumeration  
process of the USB network. They are used to set the USB  
assigned address, enable endpoints and select the  
configuration of the device.  
Reserved  
If the enable bit is ‘1’, the non default endpoints are  
enabled, if ‘0’, the non default endpoints are disabled.  
The function then only responds to the default control  
endpoint.  
SET ADDRESS/ENABLE  
Command: D0h.  
After bus reset, the enable bit is set to ‘0’.  
Data: write 1 byte.  
READ ENDPOINT ENABLE  
Command: D8h.  
The set address/enable command is used to set the USB  
assigned address and enable the function. The device  
always powers up disabled and should be enabled after a  
bus reset.  
Data: read 1 byte.  
The read endpoint enable command is used to read the  
enable bit for the non default endpoints of the function.  
The format of the data phase is the same as for the set  
endpoint enable command.  
7
6
5
4
3
2
1
0
Power On Value  
0
0
0
0
0
0
0
0
Address  
Enable  
SET MODE  
Command: F3h.  
Data: write 1 byte.  
1999 May 10  
31  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
An interrupt is also generated after a bus reset. When the  
interrupt register consists of all zeros, and an interrupt was  
generated, there was a bus reset. The interrupt is cleared  
when the interrupt register is read.  
7
6
5
4
3
2
1
0
Reset value  
Bus Reset  
0
0
1
1
1
1
1
1
T
T
F
F
T
T
T
T
IsoOut  
7
6
5
4
3
2
1
0
IsoIn  
IntIsoOut  
IntIsoIn  
Power On Value  
0
0
0
0
0
0
0
0
ErrorDebugMode  
AlwaysPLLClock  
Reserved  
Reserved  
Control OUT  
Control IN  
Endpoint 1 OUT  
Endpoint 1 IN  
Endpoint 2 IN  
Endpoint 3 IN  
Endpoint 4 OUT  
Endpoint 5 IN  
Reset value: gives the value of the bits after Power-on  
reset. Bus reset: a ‘F’ indicates that the value of the bit is  
not changed during a bus reset. a ‘T’ indicates that during  
a bus reset, the bit is reset to its reset value.  
SELECT ENDPOINT  
Table 25  
Command: 00h + endpoint index.  
Data: optional read 1 byte.  
BIT  
DESCRIPTION  
IsoOut  
IsoIn  
ISO out endpoint can be  
used  
The select endpoint command initializes an internal  
pointer to the start of the selected buffer. Optionally, this  
command can be followed by a data read. Bit 0 is low if the  
buffer is empty and high if the buffer is full. There is one  
command for every endpoint.  
ISO in endpoint can be  
used  
IntIsoOut  
IntIsoIn  
allow interrupt from ISO  
out endpoint  
7
6
5
4
3
2
1
0
allow interrupt from ISO in  
endpoint  
Power On Value  
X
X
X
X
X
X
X
0
ErrorDebugMode  
AlwaysPLLClock  
Setting chip in debug  
mode  
Full/Empty  
Reserved  
the PLL clock must keep  
on running  
GET ENDPOINT STATUS  
Data flow commands  
Command: 40h + endpoint index.  
Data: read 1 byte.  
Data flow commands are used to manage the data  
transmission between the USB endpoints and the host.  
Much of the data flow is initiated via the interrupt to the  
microcontroller. The microcontroller uses these  
commands to access the endpoint buffers and determine  
whether the endpoint buffers have valid data.  
The get endpoint status command is followed by one data  
read that returns the status of the last transaction of the  
selected endpoint. This command also resets the  
corresponding interrupt flag in the interrupt register, and  
clears the status, indicating that it was read. There is one  
command for every endpoint.  
READ INTERRUPT REGISTER  
Command: F4h.  
7
6
5
4
3
2
1
0
Data: read 1 byte.  
Power On Value  
0
0
0
0
0
0
0
0
The read interrupt register command returns the value of  
the interrupt register. Every time a packet is received or  
transmitted, an interrupt will be generated and a flag  
specific to the physical endpoint will be set in the interrupt  
register. Reading the status of the endpoint will clear the  
flag.  
Data Receive/Transmit  
Error Code  
Setup Packet  
Data 0/1 Packet  
Previous Status not Read  
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Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Table 26 Error codes  
SET ENDPOINT STATUS  
Command: 40h + endpoint index.  
Data: write 1 byte.  
ERROR  
RESULT  
CODE  
0000  
0001  
no error  
This command is used to stall or unstall an endpoint. Only  
the least significant bit has a meaning. When the stalled bit  
is equal to 1, the endpoint is stalled, when equal to 0, the  
endpoint is unstalled. There is one command for every  
endpoint.  
PID encoding error; bits 7 to 4 in the PID  
token are not the inversion of bits 3 to 0  
0010  
0011  
PID unknown; PID encoding is valid, but PID  
does not exist  
unexpected packet; packet is not of the type  
expected (token, data or acknowledge), or  
SETUP token received on non-control  
endpoint  
A stalled control endpoint is automatically unstalled when  
it receives a SETUP token, regardless of the contents of  
the packet. If the endpoint should stay in stalled state, the  
microcontroller should restall it.  
0100  
0101  
0110  
0111  
1000  
1001  
1010  
token CRC error  
data CRC error  
When a stalled endpoint is unstalled, it is also re-initialized.  
This means that its buffer is flushed and the next DATA  
PID that will be sent or expected (depending on the  
direction of the endpoint) is DATA0.  
time out error  
babble error  
unexpected end-of-packet  
sent or received NAK  
7
6
5
4
3
2
1
0
sent stall, a token was received, but the  
endpoint was stalled  
Power On Value  
X
X
X
X
X
X
X
0
Stalled  
Reserved  
1011  
overflow error, the received data packet was  
larger then the buffer size of the selected  
endpoint  
1100  
1101  
1110  
1111  
sent empty packet (ISO only)  
bitstuff error  
READ BUFFER  
Command: F0h.  
Data: read n bytes (max. 10).  
error in sync  
wrong data PID  
The read buffer command is followed by a number of data  
reads, which returns the contents of the selected endpoint  
data buffer. After each read, the internal buffer pointer is  
incremented by 1.  
Table 27  
BIT  
DESCRIPTION  
Data receive/transmit  
a ‘1’ indicates data has  
been received or  
transmitted successfully  
The buffer pointer is not reset to the buffer start by the read  
buffer command. This means that reading a buffer can be  
interrupted by any other command (except for select  
endpoint).  
Error code  
see Table 26  
Setup packet  
a ‘1’ indicates the last  
received packet had a  
SETUP token (this will  
always read ‘0’ for IN  
buffers)  
Data 0/1 packet  
a ‘1’ indicates the last  
received packet had a  
DATA 1 PID  
Previous status not read  
a ‘1’ indicates a second  
event occurred before the  
previous status was read  
1999 May 10  
33  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
The data in the buffer are organized as follows:  
Byte 0: transfer successful, number of data bytes (MSB)  
Byte 1: number of data bytes (LSB)  
Byte 2: data byte 0  
acknowledged explicitly that it has seen the SETUP  
packet.  
If the microcontroller is reading the data from a SETUP  
packet, and a new SETUP packet arrives, the device must  
accept this new SETUP packet. So the data, currently  
being read by the microcontroller, is overwritten with the  
new packet. On the arrival of the new packet, the  
commands validate buffer and clear buffer are disabled.  
If the microcontroller has finished reading the data from  
the buffer, it will try to clear the buffer. The device will  
ignore this command, so the new SETUP packet in the  
buffer is not cleared. The microcontroller will now detect  
the interrupt of the new SETUP packet and will start  
reading the new data in the buffer.  
Byte 3: data byte 1  
Byte 4: data byte 2  
Byte 5: data byte 3  
Byte 6: data byte 4  
Byte 7: data byte 5  
Byte 8: data byte 6  
Byte 9: data byte 7.  
Bytes 0 and 1 indicate the number of bytes in the buffer.  
Byte 0 is the Most Significant Byte (MSB). Byte 1 is the  
Least Significant Byte (LSB). Only bits 1 and 0 of byte 0  
are used in the number of bytes indication.  
A SETUP token can be followed by an IN token. After the  
SETUP token, the microcontroller will start filling the IN  
buffer. A SETUP token will clear the IN buffer. This avoids  
the following problem: after a SETUP token, the  
microcontroller fills the IN buffer. If the SETUP token is  
followed by a SETUP token and shortly followed by an IN  
token, the device will send the contents of the IN buffer to  
the host. The IN buffer was filled after the first SETUP  
token. That is why after a SETUP token the IN buffer is  
cleared.  
Bit 7 of byte 0 indicates if the transaction was successful  
(bit 7 is ‘1’ if the transaction was successful). Bits 6 to 2 of  
byte 0 are reserved.  
WRITE BUFFER  
Command: F0h.  
If the microcontroller is still filling the buffer when the  
second SETUP token arrives, the SETUP token will clear  
the IN buffer. If the microcontroller has filled the IN buffer,  
it will validate the buffer. So clearing the IN buffer on  
receiving a SETUP token is not enough.  
Data: write n bytes (max. 10).  
The write buffer command is followed by a number of data  
writes, which load the endpoint buffer. After each write, the  
internal buffer pointer is incremented by 1.  
If a SETUP token is received, the device will also disable  
the validate buffer command for the IN buffer. If the  
microcontroller needs to fill the buffer after a SETUP token,  
the command acknowledge setup command must be sent  
to enable the validate buffer command.  
The buffer pointer is not reset to the buffer start by the write  
buffer command. This means that writing a buffer can be  
interrupted by any other command (except for select  
endpoint).  
The data must be organized in the same way as described  
in the read buffer command. Bits 7 to 2 of byte 0 are  
reserved and must be filled with zeros.  
CLEAR BUFFER  
Command: F2h.  
Data: none.  
ACKNOWLEDGE SETUP  
Command: F1h.  
Data: none.  
When a packet is received completely, an internal  
endpoint buffer full flag is set. All subsequent packets will  
be refused by returning a NACK to the host. When the  
microcontroller has read the data, it should free the buffer  
by the clear buffer command. When the buffer is cleared,  
new packets will be accepted.  
The arrival of a SETUP packet flushes the IN buffer and  
disables the validate buffer and clear buffer commands for  
both IN and OUT endpoints.  
The microcontroller needs to re-enable these commands  
by the acknowledge setup command. This ensures that  
the last SETUP packet stays in the buffer and no packet  
can be sent back to the host until the microcontroller has  
1999 May 10  
34  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
VALIDATE BUFFER  
Command: FAh.  
Data: none.  
S1CON register  
The CPU can read from and write to this 8-bit SFR.  
Two bits are effected by the SIO1 hardware: the SI bit is  
set when a serial interrupt is requested, and the STO bit is  
cleared when a STOP condition is present on the I2C-bus.  
The STO bit is also cleared when ENS1 = ‘0’. Reset  
initializes S1CON to 00h.  
When the microcontroller has written data into an IN buffer,  
it should set the buffer full flag by the validate buffer  
command. This indicates that the data in the buffer are  
valid and can be sent to the host when the next IN token is  
received.  
7
6
5
4
3
2
1
0
Power On Value  
0
0
0
0
0
0
0
0
General commands  
READ CURRENT FRAME NUMBER  
Command: F5h.  
CR0  
CR1  
AA  
SI  
STO  
STA  
ENS1  
CR2  
Data: read 1 or 2 bytes.  
This command is followed by one or two data reads and  
returns the frame number of the last successfully received  
SOF. The frame number is eleven bits wide. The frame  
number is returned least significant byte first. In case the  
user is only interested in the lower 8 bits of the frame  
number only the first byte needs to be read.  
CR2, 1 AND 0 - THE CLOCK RATE BITS  
These three bits determine the serial clock frequency  
when SIO1 is in a master mode.  
The various serial rates are shown in Table 28.  
I2C MASTER/SLAVE INTERFACE  
Table 28 Serial clock rates (SCL line)  
The I2C module implements a master/slave I2C-bus  
interface with integrated shift register, shift timing  
generation and slave address recognition. It is compliant  
to the I2C-bus specification IC20/Jan92. I2C standard  
mode (100 kHz SCL) and fast mode (400 kHz) are  
supported. Low speed mode and extended 10 bit  
addressing are unsupported.  
I2C BIT FREQUENCY  
CR2  
CR1  
CR0  
(kHz)  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1200  
600  
400  
300  
150  
Characteristics of the I2C-bus  
100  
The I2C-bus is for 2-way, 2-line communication between  
different ICs or modules. The two lines are a serial data  
line (SDA) and a Serial Clock Line (SCL). Both lines must  
be connected to VDDE via a pull-up resistor.  
75  
3.9 ... 501  
The timing definition of the I2C-bus is given in Fig.7.  
When the CR bits are ‘111’, the maximum bit rate for the  
data transfer will be derived from the Timer 1 overflow rate  
divided by 2 (i.e. every time the Timer 1 overflows, the  
SCL signal will toggle).  
Programmer’s view  
For a detailed description of the I2C-bus protocol refer to  
Philips Integrated Circuits Data Handbook IC20, 8XC552.  
The programmer’s view of the I2C library function is -with  
one exception- identical to that of the 8XC552  
microcontroller. Only the bit rate frequency selection in  
S1CON and the handling of the Timer 1 overflow  
information deviates to accommodate 400 kHz operation.  
1999 May 10  
35  
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SDA  
t
t
t
t
t
t
SP  
r
BUF  
LOW  
HD;STA  
f
SCL  
t
t
SU;STO  
HD;STA  
t
t
t
t
SU;DAT  
SU;STA  
HD;DAT  
HIGH  
P
S
P
Sr  
MBC611  
Fig.7 Definition of timing of the I2C-bus.  
ahdnbok,uflapegwidt  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
All digital I/Os  
VI/O  
IO  
DC input/output voltage range  
output current  
0.5  
VDDE  
V
VDDE = 5.0 V  
4
mA  
Temperature values  
Tj  
junction temperature  
0
125  
+150  
70  
°C  
°C  
°C  
Tstg  
Tamb  
storage temperature  
55  
0
operating ambient temperature  
25  
Electrostatic handling  
Ves  
electrostatic handling  
note 1  
note 2  
3000  
300  
+3000  
+300  
V
V
Notes  
1. Equivalent to discharging a 100 pF capacitor through a 1.5 kseries resistor.  
2. Equivalent to discharging a 200 pF capacitor through a 2.5 µH series conductor.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth(j-a)  
thermal resistance from junction to ambient  
UDA1325PS  
UDA1325H  
in free air  
in free air  
48  
48  
K/W  
K/W  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
VDDE  
VDD  
PARAMETER  
supply voltage periphery (I/O)  
MIN.  
TYP.  
MAX.  
UNIT  
4.75  
3.0  
5.0  
3.3  
5.25  
3.6  
V
V
supply voltage (core)  
DC input voltage range  
for D+ and D−  
VI  
0.0  
VDD  
V
V
V
for VINL and VINR  
for digital I/Os  
0.5VDD  
0.0  
VDDE  
1999 May 10  
37  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
DC CHARACTERISTICS  
VDDE = 5.0 V; VDD = 3.3 V; Tamb = 25 °C; fosc = 48 MHz; fs = 44.1 kHz; unless otherwise specified.  
SYMBOL  
Supplies  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VDDE  
VDDI  
VDDA1  
VDDA2  
VDDA3  
VDDO  
VDDX  
IDDE  
digital supply voltage periphery  
digital supply voltage core  
analog supply voltage 1  
4.75  
5.0  
5.25  
V
V
V
V
V
V
V
3.0  
3.0  
3.0  
3.0  
3.0  
3.0  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.7  
39.0  
3.6  
8.0  
0.9  
3.0  
1.2  
200  
1.2  
3.6  
3.6  
3.6  
3.6  
3.6  
3.6  
analog supply voltage 2  
analog supply voltage 3  
operational amplifier supply voltage  
crystal oscillator supply voltage  
digital supply current periphery  
digital supply current core  
analog supply current 1  
note 1  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mW  
mW  
IDDI  
IDDA1  
IDDA2  
IDDA3  
IDDO  
IDDX  
analog supply current 2  
analog supply current 3  
9.0(2)  
operational amplifier supply current  
crystal oscillator supply current  
total power dissipation  
13.0(3)  
Ptot  
Pps  
total power dissipation in power  
saving mode  
note 4  
Inputs/outputs D+ and D−  
VI  
static DC input voltage  
0.5  
VDDI  
3.6  
V
V
VO(H)  
static DC output voltage HIGH  
RL = 15 kΩ  
2.8  
connected to GND  
VO(L)  
ILO  
static DC output voltage LOW  
RL = 1.5 kΩ  
connected to VDD  
0.3  
10  
V
high impedance data line output  
leakage current  
µA  
VI(diff)  
differential input sensitivity  
0.2  
0.8  
0.8  
V
V
V
VCM(diff)  
VSE(R)(th)  
differential common mode range  
2.5  
2.0  
single-ended receiver threshold  
voltage  
CIN  
transceiver input capacitance  
pin to GND  
20  
pF  
Digital input pins  
VIL  
VIH  
ILI  
LOW-level input voltage  
0.3VDDE  
V
HIGH-level input voltage  
input leakage current  
input capacitance  
0.7VDDE  
VDDE  
V
1
5
µA  
pF  
CI  
1999 May 10  
38  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
PGA and ADC  
Vref(AD)  
reference voltage PGA and ADC  
0.5VDDA2  
VDDA2  
V
V
Vref(ADC)(pos) positive reference voltage of the  
ADC  
Vref(ADC)(neg) negative reference voltage of the  
ADC  
0.0  
V
V
VI(PGA)  
DC input voltage VINL and VINR of  
the PGA  
0.5VDDA2  
12.5  
RI(PGA)  
DC input resistance at VINL and  
VINR of the PGA  
kΩ  
Filter stream DAC  
Vref(DA) reference voltage DAC  
VO(CM)  
0.5VDDA1  
0.5VDDA1  
11  
V
V
common mode output voltage  
RO(VOUT)  
output resistance at VOUTL and  
VOUTR  
RO(L)  
CO(L)  
output load resistance  
output load capacitance  
2.0  
kΩ  
50  
pF  
Notes  
1. This value depends strongly on the application. The specified value is the typical value obtained using the application  
diagram as illustrated in Fig.8.  
2. At start-up of the OSCAD oscillator.  
3. At start-up of the OSC48 oscillator.  
4. Exclusive the IDDE current which depends on the components connected to the I/O pins.  
1999 May 10  
39  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
AC CHARACTERISTICS  
VDDE = 5.0 V; VDDI = 3.3 V; Tamb = 25 °C; fosc = 48 MHz; fs = 44.1 kHz; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Driver characteristics D+ and D(full-speed mode)  
fo(s)  
tr  
audio sample output frequency  
rise time  
5
55  
kHz  
CL = 50 pF  
CL = 50 pF  
4
20  
ns  
ns  
%
V
tf  
fall time  
4
20  
trf(m)  
Vcr  
rise/fall time matching (tr/tf)  
output signal crossover voltage  
driver output resistance  
90  
110  
2.0  
43  
1.3  
Ro(drive)  
steady-state drive 28  
5
Data source timings D+ and D(full-speed mode)  
fi(s)  
audio sample input frequency  
full speed data rate  
frame interval  
55  
kHz  
Mbits/s  
ms  
ffs(D)  
tfr(D)  
tJ1(diff)  
11.97  
12.00  
1.0000  
0.0  
12.03  
1.0005  
+3.5  
0.9995  
source differential jitter to next  
transition  
3.5  
ns  
tJ2(diff)  
source differential jitter for paired  
transitions  
4.0  
0.0  
+4.0  
ns  
tW(EOP)  
tEOP(diff)  
source end of packet width  
160  
175  
ns  
ns  
differential to end of packet  
transition skew  
2.0  
+5.0  
tJR1  
receiver data jitter tolerance to next  
transition  
18.5  
9.0  
40  
0.0  
0.0  
+18.5  
+9.0  
ns  
ns  
ns  
ns  
tJR2  
receiver data jitter tolerance for  
paired transitions  
tEOPR1  
tEOPR2  
end of packet width at receiver  
must reject as end of packet  
end of packet width at receiver  
must accept as end of packet  
82  
Serial input/output data timing  
fs  
system clock frequency  
12  
MHz  
kHz  
ns  
fi(WS)  
tr  
word selection input frequency  
rise time  
5
55  
20  
20  
tf  
fall time  
ns  
tBCK(H)  
tBCK(L)  
ts;DAT  
th;DAT  
ts;WS  
th;WS  
bit clock HIGH time  
bit clock LOW time  
data set-up time  
55  
55  
10  
20  
20  
10  
ns  
ns  
ns  
data hold time  
ns  
word selection set-up time  
word selection hold time  
ns  
ns  
1999 May 10  
40  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
SDA and SCL lines for 100 kHz I2C devices  
fSCL  
tBUF  
SCL clock frequency  
0
100  
kHz  
bus free time between a STOP and  
START condition  
4.7  
µs  
tHD;STA  
hold time (repeated) START  
condition  
4.0  
µs  
tLOW  
LOW period of the SCL clock  
HIGH period of the SCL clock  
4.7  
4.0  
4.7  
µs  
µs  
µs  
tHIGH  
tSU;STA  
set-up time for a repeated START  
condition  
tSU;STO  
tHD;DAT  
tSU;DAT  
tr  
set-up time for STOP condition  
data hold time  
4.0  
5.0  
250  
µs  
µs  
ns  
ns  
data set-up time  
rise time of both SDA and SCL  
signals  
1000  
tf  
fall time of both SDA and SCL  
signals  
300  
400  
ns  
CL(bus)  
capacitive load for each bus line  
pF  
Oscillator 1 (system clock)  
fosc  
oscillator frequency  
48  
50  
MHz  
%
δ
duty factor  
gm  
transconductance  
12.8  
0.6  
4.5  
4.1  
3.7  
22.1  
1.1  
4.8  
4.6  
7.6  
30.2  
2.3  
5.2  
5.0  
13.0  
mS  
kΩ  
pF  
Ro  
output resistance  
Ci(XTAL1a)  
Ci(XTAL2a)  
Istart  
parasitic input capacitance XTAL1a  
parasitic input capacitance XTAL2a  
start-up current  
pF  
mA  
Oscillator 2 (for ADC clock)  
fosc  
oscillator frequency  
8.192  
14.08  
MHz  
%
δ
duty cycle  
50  
gm  
transconductance  
8.1  
1.3  
5.0  
4.1  
2.4  
13.6  
2.0  
5.4  
4.6  
5.0  
18.1  
4.0  
5.7  
5.0  
8.4  
mA/V  
kΩ  
Ro  
output resistance  
Ci(XTAL1b)  
Ci(XTAL2b)  
Istart  
parasitic input capacitance XTAL1b  
parasitic input capacitance XTAL2b  
start-up current  
pF  
pF  
mA  
1999 May 10  
41  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
SYMBOL  
Analog PLL (for ADC clock)  
fclk(PLL) PLL clock frequency  
δ
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
8.1920  
11.2896  
12.2880 MHz  
duty factor  
50  
%
tstrt(PO)  
start-up time after power-on  
10  
ms  
Power-on reset  
(2)  
tsu(PO)  
power-on set-up-time  
note 1  
25Cref  
ms  
PGA and ADC  
Vi(FS)(rms)  
full-scale input voltage (RMS value) PGA gain = 3 dB  
PGA gain = 0 dB  
1414(3)  
1000  
708  
355  
178  
89  
mV  
mV  
mV  
mV  
mV  
mV  
mV  
pF  
PGA gain = 3 dB  
PGA gain = 9 dB  
PGA gain = 15 dB  
PGA gain = 21 dB  
PGA gain = 27 dB  
44  
Ci(PGA)  
input capacitance of the PGA  
20  
(THD + N)/S total harmonic distortion plus  
noise-to-signal ratio  
fs = 44.1 kHz at  
input signal of  
1 kHz; PGA  
gain = 0 dB;  
note 4  
Vi (0 dB)  
1.0 V (RMS)  
85  
0.0056  
30  
3.2  
80  
0.01  
20  
10.0  
dB  
%
Vi (60 dB)  
dB  
%
S/N  
αct  
fs  
signal to noise ratio  
Vi = 0.0 V  
90  
95  
dBA  
dB  
crosstalk between channels  
sample frequency (128fs)  
digital output level  
PGA gain = 0 dB  
100  
0.640  
7.04  
MHz  
dBFS  
OL  
PGA gain = 0 dB,  
Vi = 1 V (RMS)  
2.0  
1999 May 10  
42  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Filter stream DAC  
RES  
resolution  
16  
bits  
Vo(FS)(rms)  
full-scale output voltage  
(RMS value)  
VDD = 3.3 V  
0.66  
V
SVRR  
supply voltage ripple rejection at  
fripple = 1 kHz  
60  
dB  
V
DDA and VDDO  
Vripple(p-p) = 0.1 V  
Vo  
channel unbalance  
maximum volume  
0.03  
95  
dB  
dB  
αct  
crosstalk between channels  
RL = 5 kΩ  
(THD + N)/S total harmonic distortion plus  
noise-to-signal ratio  
fs = 44.1 kHz;  
RL = 5 k; note 5  
at input signal of  
1 kHz (0 dB)  
90  
0.0032  
30  
3.2  
80  
0.01  
20  
10  
dB  
%
at input signal of  
1 kHz (60 dB)  
dB  
%
S/N  
signal-to-noise ratio at bipolar zero A-weighting at  
code 0000H  
90  
95  
dB  
Notes  
1. Strongly depends on the external decoupling capacitor connected to Vref(DA)  
.
2. Cref in µF.  
3. Although a level of 1.414 V (RMS) would be required to optimal drive the ADC in this gain setting, this level can not  
be used. Due to the 3.3 V supply voltage input, signals of 1.17 V (RMS) and higher will result in clipping.  
4. Measured with the APLL as ADC clock source.  
5. Measured with I2S-bus input as digital source.  
1999 May 10  
43  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
APPLICATION INFORMATION  
+V  
+V  
A
A
R35  
R27  
1 Ω  
1 Ω  
C34  
C32  
47 µF  
(16 V)  
47 µF  
(16 V)  
C38  
C21  
100 nF  
(63 V)  
100 nF  
(63 V)  
V
V
V
V
DDA2  
SSA1  
DDA1  
44  
SSA2  
39  
38  
42  
GP0/BCKI  
GP5/WSI  
GP1/DI  
BCKI  
17  
15  
13  
digital  
input  
WSI  
playback  
DI  
BCK  
WS  
DA  
BCK  
61  
59  
57  
digital  
input  
recording  
WS  
DA  
+V  
C
R48  
1.5 kΩ  
V
L1  
X4  
USB  
1
2
3
4
8
1
2
3
4
R7  
D−  
D+  
7
6
5
6
8
22 Ω  
R16  
UDA1325H  
22 Ω  
C16  
10 nF  
(50 V)  
C18  
22 pF  
(63 V)  
C17  
22 pF  
(63 V)  
C15  
10 nF  
(50 V)  
C8  
VINR  
VINL  
47  
43  
analog  
input  
recording  
47 µF (16 V)  
C22  
47 µF (16 V)  
L5  
C44  
1
XTAL2b  
26  
1.5 µH  
10 nF (63 V)  
C38  
12 pF (63 V)  
X1  
48 MHz  
XTAL1b  
C37  
25  
12 pF (63 V)  
XTAL2a  
XTAL1a  
53  
54  
ADC XTAL  
C5  
C6  
18 pF  
(50 V)  
18 pF  
(50 V)  
L8  
10  
9
11  
12  
V
V
+V  
A(ext)  
A
C
D
BLM32A07  
L7  
V
V
V
SSE  
SSI  
C25  
DDI  
DDE  
C26  
+V  
+V  
BLM32A07  
L6  
100 nF  
(63 V)  
100 nF  
(63 V)  
L2  
L3  
V
D(ext)  
BLM32A07  
BLM32A07  
BLM32A07  
C24  
C27  
C47  
C46  
C45  
100 µF  
(16 V)  
100 µF  
(16 V)  
100 µF  
(16 V)  
100 nF  
(63 V)  
100 nF  
(63 V)  
R17  
1 Ω  
R25  
1 Ω  
GND  
MGM760  
+V  
+V  
C
D
Fig.8 Application diagram UDA1325H (continued in Fig.9).  
44  
1999 May 10  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
+V  
+V  
A
A
R10  
R8  
1 Ω  
1 Ω  
C7  
C11  
47 µF  
(16 V)  
100 nF  
(63 V)  
C19  
100 nF  
(63 V)  
V
V
VRN  
VRP  
SSA3  
DDA3  
55  
52  
49  
51  
D
D
D
Q
Q
P0.0  
P0.1  
P0.2  
P0.3  
P0.4  
P0.5  
P0.6  
P0.7  
A0  
A1  
A2  
A3  
A4  
A5  
O0  
11  
7
6
5
7
6
56  
18  
17  
14  
13  
8
19  
16  
15  
12  
9
10  
9
O1  
58  
60  
62  
64  
3
12  
O2  
13  
Q
Q
Q
Q
Q
Q
V
5
4
3
2
1
0
8
D
D
D
O3  
4
3
2
7
15  
O4  
16  
6
D1  
O5  
17  
5
7
74HCT373D  
6
D
O6  
18  
A6  
A7  
A8  
1
0
5
4
5
4
D
O7  
19  
7
3
2
3
CC  
D2  
+V  
25  
24  
21  
LE  
OE  
20  
10  
ALE  
D
50  
11  
1
A9  
A10  
A11  
A12  
A13  
EEPM27128  
100 nF  
(50 V)  
C24  
GND  
23  
2
V
CC  
P2.0  
P2.1  
P2.2  
P2.3  
P2.4  
P2.5  
PSEN  
+V  
28  
14  
D
14  
16  
18  
20  
22  
23  
31  
100 nF  
(50 V)  
26  
C25  
GND  
OE  
CE  
22  
20  
27  
1
PGM  
V
PP  
R28  
+V  
EA  
D
48  
4.7 kΩ  
R20  
+V  
+V  
D
D
3
(internal ROM)  
(external ROM)  
1 Ω  
V
A0  
A1  
A2  
SS  
DD  
PTC  
SCL  
SDA  
C36  
100 nF  
(63 V)  
1
8
7
6
5
+V  
2
1
D
2
3
4
D4  
J3  
1
UDA1325H  
PCF85116-3  
R38  
10 kΩ  
R39  
10 kΩ  
V
SDA  
SCL  
V
21  
19  
(I2C-bus)  
2
ref(DA)  
ref(AD)  
40  
41  
V
C29  
100 nF  
(63 V)  
C41  
47 µF  
(16 V)  
C28  
100 nF  
(63 V)  
C31  
47 µF  
(16 V)  
C35  
VOUTR  
VOUTL  
37  
34  
47 µF (16 V)  
analog  
output  
playback  
C48  
47 µF (16 V)  
GP4/BCKO  
GP3/WSO  
GP2/DO  
2
1
BCKO  
WSO  
digital  
output  
playback  
63  
DO  
RTCB  
TC  
36  
35  
4
SHTCB  
33  
32  
24  
28  
V
V
V
V
DDX  
SSO  
C33  
DDO  
SSX  
C28  
100 nF  
(63 V)  
100 nF  
(63 V)  
L13  
BLM32A07  
C39  
C18  
47 µF  
(16 V)  
100 nF  
(63 V)  
R43  
1 Ω  
R26  
1 Ω  
MGM761  
+V  
+V  
A
C
Fig.9 Application diagram UDA1325H (continued from Fig.8).  
45  
1999 May 10  
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  g
+V  
+V  
A
+V  
+V  
A
A
A
R35  
1 Ω  
R27  
1 Ω  
R10  
1 Ω  
R8  
1 Ω  
C34  
C32  
C7  
C11  
+V  
47 µF  
(16 V)  
47 µF  
(16 V)  
47 µF  
(16 V)  
100 nF  
(63 V)  
D
C38  
C21  
C19  
R20 1 Ω  
100 nF  
(63 V)  
100 nF  
(63 V)  
100 nF  
(63 V)  
V
V
V
V
DDA2  
V
V
VRN  
VRP  
SSA1  
DDA1  
35  
SSA2  
SSA3  
DDA3  
V
DD  
A0  
A1  
A2  
SS  
30  
29  
33  
42  
39  
37  
38  
C36  
100 nF  
(63 V)  
1
2
3
4
8
7
6
5
+V  
D
PTC  
SCL  
SDA  
GP0/BCKI  
GP5/WSI  
GP1/DI  
D4  
BCKI  
WSI  
DI  
16  
15  
14  
digital  
input  
playback  
PCF85116-3  
V
R38  
10 kΩ  
R39  
10 kΩ  
SDA  
SCL  
V
1
2
18  
17  
BCK  
WS  
DA  
(I2C-bus)  
BCK  
WS  
DA  
3
2
1
digital  
input  
recording  
ref(DA)  
31  
32  
V
ref(AD)  
C29  
100 nF  
(63 V)  
C41  
47 µF  
(16 V)  
C28  
100 nF  
(63 V)  
C31  
47 µF  
(16 V)  
+V  
C
V
USB  
L1  
X4  
R48  
1.5 kΩ  
1
2
3
4
8
1
2
3
4
R7  
D−  
D+  
7
6
5
8
9
C35  
22 Ω  
VOUTR  
VOUTL  
28  
25  
R16  
47 µF (16 V)  
analog  
output  
playback  
22 Ω  
C16  
10 nF  
(50 V)  
C18  
22 pF  
(63 V)  
C17  
22 pF  
(63 V)  
C15  
C48  
10 nF  
(50 V)  
UDA1325PS  
47 µF (16 V)  
C8  
VINR  
VINL  
36  
34  
analog  
input  
recording  
47 µF (16 V)  
C22  
GP4/BCKO  
GP3/WSO  
GP2/DO  
6
5
4
BCKO  
WSO  
47 µF (16 V)  
digital  
output  
playback  
L5  
1.5 µH  
C44  
DO  
1
XTAL2b  
21  
10 nF (63 V)  
C38  
12 pF (63 V)  
C37  
X1  
48 MHz  
XTAL1b  
RTCB  
TC  
27  
26  
7
20  
12 pF (63 V)  
SHTCB  
XTAL2a  
XTAL1a  
40  
41  
ADC XTAL  
C5  
18 pF  
(50 V)  
C6  
18 pF  
(50 V)  
11  
10  
V
12  
13  
24  
23  
19  
22  
L8  
V
V
V
V
V
V
V
DDX  
V
V
SSI  
C25  
DDI  
SSE  
C26  
DDE  
SSO  
C33  
DDO  
SSX  
C28  
+V  
+V  
+V  
A(ext)  
A
C
D
BLM32A07  
L7  
100 nF  
(63 V)  
100 nF  
(63 V)  
100 nF  
(63 V)  
100 nF  
(63 V)  
BLM32A07  
L6  
L13  
BLM32A07  
L2  
L3  
BLM32A07  
BLM32A07  
C39  
C18  
C24  
C27  
D(ext)  
BLM32A07  
C47  
100 µF  
(16 V)  
C46  
100 µF  
(16 V)  
C45  
47 µF  
(16 V)  
100 nF  
(63 V)  
100 nF  
(63 V)  
100 nF  
(63 V)  
R43  
1 Ω  
R26  
1 Ω  
R17  
1 Ω  
R25  
1 Ω  
100 µF  
(16 V)  
GND  
MGS271  
+V  
+V  
C
+V  
+V  
A
C
D
Fig.10 Application diagram UDA1325PS.  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
PACKAGE OUTLINES  
SDIP42: plastic shrink dual in-line package; 42 leads (600 mil)  
SOT270-1  
D
M
E
A
2
A
L
A
1
c
e
(e )  
1
w M  
Z
b
1
M
H
b
42  
22  
pin 1 index  
E
1
21  
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
max.  
A
A
2
max.  
(1)  
(1)  
Z
1
w
UNIT  
b
b
c
D
E
e
e
L
M
M
H
1
1
E
min.  
max.  
1.3  
0.8  
0.53  
0.40  
0.32  
0.23  
38.9  
38.4  
14.0  
13.7  
3.2  
2.9  
15.80  
15.24  
17.15  
15.90  
mm  
5.08  
0.51  
4.0  
1.778  
15.24  
0.18  
1.73  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
90-02-13  
95-02-04  
SOT270-1  
1999 May 10  
47  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm  
SOT319-2  
y
X
A
51  
33  
52  
32  
Z
E
e
A
2
H
A
E
(A )  
3
E
A
1
θ
w M  
p
pin 1 index  
L
p
b
L
20  
64  
detail X  
1
19  
w M  
Z
D
v
M
A
b
p
e
D
B
H
v
M
B
D
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.  
7o  
0o  
0.25 2.90  
0.05 2.65  
0.50 0.25 20.1 14.1  
0.35 0.14 19.9 13.9  
24.2 18.2  
23.6 17.6  
1.0  
0.6  
1.2  
0.8  
1.2  
0.8  
mm  
3.20  
0.25  
1
1.95  
0.2  
0.2  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-02-04  
97-08-01  
SOT319-2  
1999 May 10  
48  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Typical reflow peak temperatures range from  
215 to 250 °C. The top-surface temperature of the  
packages should preferable be kept below 230 °C.  
SOLDERING  
Introduction  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “Data Handbook IC26; Integrated Circuit Packages”  
(document order number 9398 652 90011).  
WAVE SOLDERING  
Conventional single wave soldering is not recommended  
for surface mount devices (SMDs) or printed-circuit boards  
with a high component density, as solder bridging and  
non-wetting can present major problems.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mount components are mixed on  
one printed-circuit board. However, wave soldering is not  
always suitable for surface mount ICs, or for printed-circuit  
boards with high population densities. In these situations  
reflow soldering is often used.  
To overcome these problems the double-wave soldering  
method was specifically developed.  
If wave soldering is used the following conditions must be  
observed for optimal results:  
Use a double-wave soldering method comprising a  
turbulent wave with high upward pressure followed by a  
smooth laminar wave.  
Through-hole mount packages  
SOLDERING BY DIPPING OR BY SOLDER WAVE  
For packages with leads on two sides and a pitch (e):  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joints for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
– larger than or equal to 1.27 mm, the footprint  
longitudinal axis is preferred to be parallel to the  
transport direction of the printed-circuit board;  
– smaller than 1.27 mm, the footprint longitudinal axis  
must be parallel to the transport direction of the  
printed-circuit board.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg(max)). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
The footprint must incorporate solder thieves at the  
downstream end.  
For packages with leads on four sides, the footprint must  
be placed at a 45° angle to the transport direction of the  
printed-circuit board. The footprint must incorporate  
solder thieves downstream and at the side corners.  
MANUAL SOLDERING  
Apply the soldering iron (24 V or less) to the lead(s) of the  
package, either below the seating plane or not more than  
2 mm above it. If the temperature of the soldering iron bit  
is less than 300 °C it may remain in contact for up to  
10 seconds. If the bit temperature is between  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
300 and 400 °C, contact may be up to 5 seconds.  
Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Surface mount packages  
REFLOW SOLDERING  
MANUAL SOLDERING  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
Fix the component by first soldering two  
diagonally-opposite end leads. Use a low voltage (24 V or  
less) soldering iron applied to the flat part of the lead.  
Contact time must be limited to 10 seconds at up to  
300 °C.  
Several methods exist for reflowing; for example,  
infrared/convection heating in a conveyor type oven.  
Throughput times (preheating, soldering and cooling) vary  
between 100 and 200 seconds depending on heating  
method.  
When using a dedicated tool, all other leads can be  
soldered in one operation within 2 to 5 seconds between  
270 and 320 °C.  
1999 May 10  
49  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
Suitability of IC packages for wave, reflow and dipping soldering methods  
SOLDERING METHOD  
WAVE  
REFLOW(1) DIPPING  
suitable(2)  
not suitable  
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(3)  
MOUNTING  
PACKAGE  
Through-hole mount DBS, DIP, HDIP, SDIP, SIL  
suitable  
Surface mount  
BGA, SQFP  
suitable  
suitable  
suitable  
suitable  
suitable  
PLCC(4), SO, SOJ  
LQFP, QFP, TQFP  
SSOP, TSSOP, VSO  
suitable  
not recommended(4)(5)  
not recommended(6)  
Notes  
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum  
temperature (with respect to time) and body size of the package, there is a risk that internal or external package  
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the  
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.  
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.  
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink  
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).  
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.  
The package footprint must incorporate solder thieves downstream and at the side corners.  
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;  
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is  
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
1999 May 10  
50  
Philips Semiconductors  
Preliminary specification  
Universal Serial Bus (USB) CODEC  
UDA1325  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
1999 May 10  
51  
Philips Semiconductors – a worldwide company  
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India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,  
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 62 5344, Fax.+381 11 63 5777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1999  
SCA64  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
545002/750/01/pp52  
Date of release: 1999 May 10  
Document order number: 9397 750 02805  

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