UJA1065TW/3V3,512 [NXP]

UJA1065 - High-speed CAN/LIN fail-safe system basis chip TSSOP 32-Pin;
UJA1065TW/3V3,512
型号: UJA1065TW/3V3,512
厂家: NXP    NXP
描述:

UJA1065 - High-speed CAN/LIN fail-safe system basis chip TSSOP 32-Pin

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UJA1065  
High-speed CAN/LIN fail-safe system basis chip  
Rev. 07 — 25 February 2010  
Product data sheet  
1. General description  
The UJA1065 fail-safe System Basis Chip (SBC) replaces basic discrete components that  
are common in every Electronic Control Unit (ECU) with a Controller Area Network (CAN)  
and a Local Interconnect Network (LIN) interface. The fail-safe SBC supports all  
networking applications that control various power and sensor peripherals by using  
high-speed CAN as the main network interface and LIN as a local sub-bus. The fail-safe  
SBC contains the following integrated devices:  
High-speed CAN transceiver, interoperable and downward compatible with CAN  
transceivers TJA1041 and TJA1041A, and compatible with the ISO 11898-2 standard  
and the ISO 11898-5 standard (in preparation)  
LIN transceiver compliant with LIN 2.0 and SAE J2602, and compatible with LIN 1.3  
Advanced independent watchdog  
Dedicated voltage regulators for microcontroller and CAN transceiver  
Serial peripheral interface (full duplex)  
Local wake-up input port  
Inhibit/limp-home output port  
In addition to the advantages of integrating these common ECU functions in a single  
package, the fail-safe SBC offers an intelligent combination of system-specific functions  
such as:  
Advanced low-power concept  
Safe and controlled system start-up behavior  
Advanced fail-safe system behavior that prevents any conceivable deadlock  
Detailed status reporting on system and subsystem levels  
The UJA1065 is designed to be used in combination with a microcontroller that  
incorporates a CAN controller. The fail-safe SBC ensures that the microcontroller is  
always started up in a defined manner. In failure situations, the fail-safe SBC will maintain  
microcontroller functionality for as long as possible to provide full monitoring and a  
software-driven fall-back operation.  
The UJA1065 is designed for 14 V single power supply architectures and for 14 V and  
42 V dual power supply architectures.  
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
2. Features  
2.1 General  
„ Contains a full set of CAN and LIN ECU functions:  
‹ CAN transceiver and LIN transceiver  
‹ Voltage regulator for the microcontroller (3.3 V or 5.0 V)  
‹ Separate voltage regulator for the CAN transceiver (5 V)  
‹ Enhanced window watchdog with on-chip oscillator  
‹ Serial Peripheral Interface (SPI) for the microcontroller  
‹ ECU power management system  
‹ Fully integrated autonomous fail-safe system  
„ Designed for automotive applications:  
‹ Supports 14 V and 42 V architectures  
‹ Excellent ElectroMagnetic Compatibility (EMC) performance  
‹ ±8 kV ElectroStatic Discharge (ESD) protection Human Body Model (HBM) for  
off-board pins  
‹ ±4 kV ElectroStatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins  
‹ ±60 V short-circuit proof CAN/LIN-bus pins  
‹ Battery and CAN/LIN-bus pins are protected against transients in accordance with  
ISO 7637-3  
‹ Very low sleep current  
„ Supports remote flash programming via the CAN-bus  
„ Small 6.1 mm × 11 mm HTSSOP32 package with low thermal resistance  
2.2 CAN transceiver  
„ ISO 11898-2 and ISO 11898-5 compliant high-speed CAN transceiver  
„ Enhanced error signalling and reporting  
„ Dedicated low dropout voltage regulator for the CAN-bus:  
‹ Independent from microcontroller supply  
‹ Guarded by CAN-bus failure management  
‹ Significantly improves EMC performance  
„ Partial networking option with global wake-up feature, allows selective CAN-bus  
communication without waking up sleeping nodes  
„ Bus connections are truly floating when power is off  
„ SPLIT output pin for stabilizing the recessive bus level  
2.3 LIN transceiver  
„ LIN 2.0 compliant LIN transceiver  
„ Enhanced error signalling and reporting  
„ Downward compatible with LIN 1.3 and the TJA1020  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
2 of 76  
 
 
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
2.4 Power management  
„ Smart operating modes and power management modes  
„ Cyclic wake-up capability in Standby and Sleep mode  
„ Local wake-up input with cyclic supply feature  
„ Remote wake-up capability via the CAN-bus and LIN-bus  
„ External voltage regulators can easily be incorporated in the power supply system  
(flexible and fail-safe)  
„ 42 V battery-related high-side switch for driving external loads such as relays and  
wake-up switches  
„ Intelligent maskable interrupt output  
2.5 Fail-safe features  
„ Safe and predictable behavior under all conditions  
„ Programmable fail-safe coded window and time-out watchdog with on-chip oscillator,  
guaranteeing autonomous fail-safe system supervision  
„ Fail-safe coded 16-bit SPI interface for the microcontroller  
„ Global enable pin for the control of safety-critical hardware  
„ Detection and detailed reporting of failures:  
‹ On-chip oscillator failure and watchdog alerts  
‹ Battery and voltage regulator undervoltages  
‹ CAN and LIN-bus failures (short-circuits and open-circuit bus wires)  
‹ TXD and RXD clamping situations and short-circuits  
‹ Clamped or open reset line  
‹ SPI message errors  
‹ Overtemperature warning  
‹ ECU ground shift (two selectable thresholds)  
„ Rigorous error handling based on diagnostics  
„ Supply failure early warning allows critical data to be stored  
„ 23 bits of access-protected RAM is available e.g. for logging of cyclic problems  
„ Reporting in a single SPI message; no assembly of multiple SPI frames needed  
„ Limp-home output signal for activating application hardware in case system enters  
Fail-safe mode (e.g. for switching on warning lights)  
„ Fail-safe coded activation of Software development mode and Flash mode  
„ Unique SPI readable device type identification  
„ Software-initiated system reset  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
3 of 76  
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
3. Ordering information  
Table 1.  
Ordering information  
Type number[1]  
Package  
Name  
Description  
Version  
UJA1065TW  
HTSSOP32  
plastic thermal enhanced thin shrink small outline package; 32 leads; SOT549-1  
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad  
[1] UJA1065TW/5V0 is for the 5 V version; UJA1065TW/3V3 is for the 3.3 V version.  
4. Block diagram  
31  
SENSE  
BAT  
MONITOR  
UJA1065  
32  
BAT42  
BAT14  
27  
4
V1  
V1  
V2  
20  
V2  
29  
30  
SYSINH  
V3  
17  
INH/LIMP  
INH  
V1 MONITOR  
RESET/EN  
7
INTN  
WAKE  
TEST  
18  
16  
6
8
WAKE  
RSTN  
EN  
SBC  
FAIL-SAFE  
SYSTEM  
CHIP  
TEMPERATURE  
WATCHDOG  
OSCILLATOR  
11  
9
SCK  
SDI  
SPI  
10  
12  
SDO  
SCS  
GND SHIFT  
DETECTOR  
26  
25  
3
RTLIN  
LIN  
24  
21  
22  
13  
14  
SPLIT  
CANH  
CANL  
TXDC  
RXDC  
LIN  
TXDL  
RXDL  
HIGH  
SPEED  
CAN  
5
23  
GND  
BAT42 BAT42  
V2  
001aac305  
Fig 1. Block diagram  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
4 of 76  
 
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
5. Pinning information  
5.1 Pinning  
1
2
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
n.c.  
n.c.  
BAT42  
SENSE  
V3  
3
TXDL  
V1  
4
SYSINH  
n.c.  
5
RXDL  
RSTN  
INTN  
EN  
6
BAT14  
RTLIN  
LIN  
7
8
UJA1065TW  
9
SDI  
SPLIT  
GND  
10  
11  
12  
13  
14  
15  
16  
SDO  
SCK  
SCS  
TXDC  
RXDC  
n.c.  
CANL  
CANH  
V2  
n.c.  
WAKE  
INH/LIMP  
TEST  
001aac306  
Fig 2. Pin configuration  
5.2 Pin description  
Table 2.  
Pin description  
Pin Description  
Symbol  
n.c.  
1
2
3
4
not connected  
not connected  
n.c.  
TXDL  
V1  
LIN transmit data input (LOW for dominant, HIGH for recessive)  
voltage regulator output for the microcontroller (3.3 V or 5 V depending on the  
SBC version)  
RXDL  
RSTN  
INTN  
5
6
7
LIN receive data output (LOW when dominant, HIGH when recessive)  
reset output to microcontroller (active LOW; will detect clamping situations)  
interrupt output to microcontroller (active LOW; open-drain, wire-AND this pin to  
other ECU interrupt outputs)  
EN  
8
enable output (active HIGH; push-pull, LOW with every reset/watchdog  
overflow)  
SDI  
9
SPI data input  
SDO  
SCK  
SCS  
TXDC  
RXDC  
n.c.  
10  
11  
12  
13  
14  
15  
16  
SPI data output (floating when pin SCS is HIGH)  
SPI clock input  
SPI chip select input (active LOW)  
CAN transmit data input (LOW for dominant; HIGH for recessive)  
CAN receive data output (LOW when dominant; HIGH when recessive)  
not connected  
TEST  
test pin (should be connected to ground in application)  
© NXP B.V. 2010. All rights reserved.  
UJA1065_7  
Product data sheet  
Rev. 07 — 25 February 2010  
5 of 76  
 
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 2.  
Pin description …continued  
Symbol  
Pin Description  
INH/LIMP 17  
inhibit/limp-home output (BAT14 related, push-pull, default floating)  
local wake-up input (BAT42 related, continuous or cyclic sampling)  
not connected  
WAKE  
n.c.  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
V2  
5 V voltage regulator output for CAN; connect a buffer capacitor to this pin  
CANH bus line (HIGH in dominant state)  
CANL bus line (LOW in dominant state)  
ground  
CANH  
CANL  
GND  
SPLIT  
LIN  
CAN-bus common mode stabilization output  
LIN-bus line (LOW in dominant state)  
LIN-bus termination resistor connection  
14 V battery supply input  
RTLIN  
BAT14  
n.c.  
not connected  
SYSINH  
system inhibit output (BAT42 related; e.g. for controlling external DC-to-DC  
converter)  
V3  
30  
unregulated 42 V output (BAT42 related; continuous output, or Cyclic mode  
synchronized with local wake-up input)  
SENSE  
BAT42  
31  
32  
fast battery interrupt / chatter detector input  
42 V battery supply input (connect this pin to BAT14 in 14 V applications)  
The exposed die pad at the bottom of the package allows better dissipation of heat from  
the SBC via the printed-circuit board. The exposed die pad is not connected to any active  
part of the IC and can be left floating, or can be connected to GND for the best EMC  
performance.  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
6 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
6. Functional description  
6.1 Introduction  
The UJA1065 combines all peripheral functions around a microcontroller within typical  
automotive networking applications into one dedicated chip. The functions are as follows:  
Power supply for the microcontroller  
Power supply for the CAN transceiver  
Switched BAT42 output  
System reset  
Watchdog with Window mode and Time-out mode  
On-chip oscillator  
High-speed CAN and LIN transceivers for serial communication; suitable for 14 V and  
42 V applications  
SPI control interface  
Local wake-up input  
Inhibit or limp-home output  
System inhibit output port  
Compatibility with 42 V power supply systems  
Fail-safe behavior  
6.2 Fail-safe system controller  
The fail-safe system controller is the core of the UJA1065 and is supervised by a  
watchdog timer that is clocked directly by the dedicated on-chip oscillator. The system  
controller manages the register configuration and controls all internal functions of the  
SBC. Detailed device status information is collected and presented to the microcontroller.  
The system controller also provides the reset and interrupt signals.  
The fail-safe system controller is a state machine. The different operating modes and the  
transitions between these modes are illustrated in Figure 3. The following sections give  
further details about the SBC operating modes.  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
7 of 76  
 
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
mode change via SPI  
watchdog  
trigger  
Standby mode  
V1: ON  
SYSINH: HIGH  
CAN: on-line/on-line listen/off-line  
LIN: off-line  
watchdog: time-out/OFF  
INH/LIMP: HIGH/LOW/float  
EN: HIGH/LOW  
mode change via SPI  
mode change via SPI  
watchdog  
trigger  
wake-up detected with its wake-up interrupt disabled  
OR mode change to Sleep with pending wake-up  
mode change via SPI  
OR watchdog time-out with watchdog timeout interrupt disabled  
Sleep mode  
Normal mode  
OR watchdog OFF and I > I  
with reset option  
V1  
thH(V1)  
OR interrupt ignored > t  
RSTN(INT)  
V1: OFF  
SYSINH: HIGH/float  
CAN: on-line/on-line listen/off-line  
LIN: off-line  
watchdog: time-out/OFF  
INH/LIMP: LOW/float  
RSTN: LOW  
V1: ON  
SYSINH: HIGH  
OR RSTN falling edge detected  
OR V1 undervoltage detected  
OR illegal Mode register code  
CAN: all modes available  
LIN: all modes available  
watchdog: window  
INH/LIMP: HIGH/LOW/float  
EN: HIGH/LOW  
flash entry enabled (111/001/111 mode sequence)  
OR mode change to Sleep with pending wake-up  
OR watchdog not properly served  
OR interrupt ignored > t  
RSTN(INT)  
OR RSTN falling edge detected  
OR V1 undervoltage detected  
OR illegal Mode register code  
EN: LOW  
wake-up detected  
OR watchdog time-out  
OR V3 overload detected  
init Normal mode  
via SPI successful  
Start-up mode  
V1: ON  
SYSINH: HIGH  
CAN: on-line/on-line listen/off-line  
LIN: off-line  
init Normal mode  
via SPI successful  
supply connected  
for the first time  
watchdog: start-up  
INH/LIMP: HIGH/LOW/float  
EN: LOW  
init Flash mode via SPI  
AND flash entry enabled  
t > t  
WD(init)  
OR SPI clock count <> 16  
OR RSTN falling edge detected  
OR RSTN released and V1 undervoltage detected  
OR illegal Mode register code  
watchdog  
trigger  
leave Flash mode code  
OR watchdog time-out  
OR interrupt ignored > t  
RSTN(INT)  
OR RSTN falling edge detected  
OR V1 undervoltage detected  
OR illegal Mode register code  
Restart mode  
Flash mode  
V1: ON  
SYSINH: HIGH  
CAN: on-line/on-line listen/off-line  
LIN: off-line  
V1: ON  
SYSINH: HIGH  
wake-up detected  
AND oscillator ok  
CAN: all modes available  
LIN: all modes available  
watchdog: time-out  
INH/LIMP: HIGH/LOW/float  
EN: HIGH/LOW  
AND t > t  
ret  
watchdog: start-up  
INH/LIMP: LOW/float  
EN: LOW  
t > t  
WD(init)  
OR SPI clock count <> 16  
OR RSTN falling edge detected  
OR RSTN released and V1 undervoltage detected  
OR illegal Mode register code  
Fail-safe mode  
V1: OFF  
SYSINH: HIGH/float  
CAN: on-line/on-line listen/off-line  
LIN: off-line  
oscillator fail  
OR RSTN externally clamped HIGH detected > t  
OR RSTN externally clamped LOW detected > t  
RSTN(CHT)  
RSTN(CLT)  
from any  
mode  
OR V1 undervoltage detected > t  
V1(CLT)  
watchdog: OFF  
INH/LIMP: LOW  
RSTN: LOW  
EN: LOW  
001aad180  
Fig 3. Main state diagram  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
8 of 76  
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
6.2.1 Start-up mode  
Start-up mode is the ‘home page’ of the SBC. This mode is entered when battery and  
ground are connected for the first time. Start-up mode is also entered after any event that  
results in a system reset. The reset source information is provided by the SBC to support  
different software initialization cycles that depend on the reset event.  
It is also possible to enter Start-up mode via a wake-up from Standby mode, Sleep mode  
or Fail-safe mode. Such a wake-up can originate either from the CAN-bus, the LIN-bus or  
from the local WAKE pin.  
On entering Start-up mode a lengthened reset time tRSTNL is observed. This reset time is  
either user-defined (via the RLC bit in the System Configuration register) or defaults to the  
value as given in Section 6.13.12. During the reset lengthening time pin RSTN is held  
LOW by the SBC.  
When the reset time is completed (pin RSTN is released and goes HIGH) the watchdog  
timer will wait for initialization. If the watchdog initialization is successful, the selected  
operating mode (Normal mode or Flash mode) will be entered. Otherwise the Restart  
mode will be entered.  
6.2.2 Restart mode  
The purpose of the Restart mode is to give the application a second chance to start up,  
should the first attempt from Start-up mode fail. Entering Restart mode will always set the  
reset lengthening time tRSTNL to the higher value to guarantee the maximum reset length,  
regardless of previous events.  
If start-up from Restart mode is successful (the previous problems do not reoccur and  
watchdog initialization is successful), then the selected operating mode will be entered.  
From Restart mode this must be Normal mode. If problems persist or if V1 fails to start up,  
then Fail-safe mode will be entered.  
6.2.3 Fail-safe mode  
Severe fault situations will cause the SBC to enter Fail-safe mode. Fail-safe mode is also  
entered if start-up from Restart mode fails. Fail-safe mode offers the lowest possible  
system power consumption from the SBC and from the external components controlled by  
the SBC.  
A wake-up (via the CAN-bus, the LIN-bus or the WAKE pin) is needed to leave Fail-safe  
mode. This is only possible if the on-chip oscillator is running correctly. The SBC restarts  
from Fail-safe mode with a defined delay tret, to guarantee a discharged V1 before  
entering Start-up mode. Regulator V1 will restart and the reset lengthening time tRSTNL is  
set to the higher value; see Section 6.5.1.  
6.2.4 Normal mode  
Normal mode gives access to all SBC system resources, including CAN, LIN, INH/LIMP  
and EN. Therefore in Normal mode the SBC watchdog runs in (programmable) Window  
mode, for strictest software supervision. Whenever the watchdog is not properly served a  
system reset is performed.  
Interrupts from SBC to the host microcontroller are also monitored. A system reset is  
performed if the host microcontroller does not respond within tRSTN(INT)  
.
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
9 of 76  
 
 
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Entering Normal mode does not activate the CAN or LIN transceiver automatically. The  
CAN Mode Control (CMC) bit must be used to activate the CAN medium if required,  
allowing local cyclic wake-up scenarios to be implemented without affecting the CAN-bus.  
The LIN Mode Control (LMC) bit must be used to activate the LIN medium if required,  
allowing local cyclic wake-up scenarios to be implemented without affecting the LIN-bus.  
6.2.5 Standby mode  
In Standby mode the system is set into a state with reduced current consumption.  
Entering Standby mode overrides the CMC bit, allowing the CAN transceiver to enter the  
low-power mode autonomously. The watchdog will, however, continue to monitor the  
microcontroller (Time-out mode) since it is powered via pin V1.  
In the event that the host microcontroller can provide a low-power mode with reduced  
current consumption in its Standby mode or Stop mode, the watchdog can be switched off  
entirely in Standby mode of the SBC. The SBC monitors the microcontroller supply current  
to ensure that there is no unobserved phase with disabled watchdog and running  
microcontroller. The watchdog will remain active until the supply current drops below  
IthL(V1). Below this current limit the watchdog is disabled.  
Should the current increase to IthH(V1), e.g. as result of a microcontroller wake-up from  
application specific hardware, the watchdog will start operating again with the previously  
used time-out period. If the watchdog is not triggered correctly, a system reset will occur  
and the SBC will enter Start-up mode.  
If Standby mode is entered from Normal mode with the selected watchdog OFF option,  
the watchdog will use the maximum time-out as defined for Standby mode until the supply  
current drops below the current detection threshold; the watchdog is now OFF. If the  
current increases again, the watchdog is immediately activated, again using the maximum  
watchdog time-out period. If the watchdog OFF option is selected during Standby mode,  
the last used watchdog period will define the time for the supply current to fall below the  
current detection threshold. This allows the user to align the current supervisor function to  
the application needs.  
Generally, the microcontroller can be activated from Standby mode via a system reset or  
via an interrupt without reset. This allows implementation of differentiated start-up  
behavior from Standby mode, depending on the application needs:  
If the watchdog is still running during Standby mode, the watchdog can be used for  
cyclic wake-up behavior of the system. A dedicated Watchdog Time-out Interrupt  
Enable (WTIE) bit enables the microcontroller to decide whether to receive an  
interrupt or a hardware reset upon overflow. The interrupt option will be cleared in  
hardware automatically with each watchdog overflow to ensure that a failing main  
routine is detected while the interrupt service still operates. So the application  
software must set the interrupt behavior each time before a standby cycle is entered.  
Any wake-up via the CAN-bus or the LIN-bus together with a local wake-up event will  
force a system reset event or an interrupt to the microcontroller. So it is possible to  
exit Standby mode without any system reset if required.  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
10 of 76  
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
When an interrupt event occurs the application software has to read the Interrupt register  
within tRSTN(INT). Otherwise a fail-safe system reset is forced and Start-up mode will be  
entered. If the application has read out the Interrupt register within the specified time, it  
can decide whether to switch into Normal mode via an SPI access or to stay in Standby  
mode.  
The following operations are possible from Standby mode:  
Cyclic wake-up by the watchdog via an interrupt signal to the microcontroller (the  
microcontroller is triggered periodically and checked for the correct response)  
Cyclic wake-up by the watchdog via a reset signal (a reset is performed periodically;  
the SBC provides information about the reset source to allow different start  
sequences after reset)  
Wake-up by activity on the CAN-bus or LIN-bus via an interrupt signal to the  
microcontroller  
Wake-up by bus activity on the CAN-bus or LIN-bus via a reset signal  
Wake-up by increasing the microcontroller supply current without a reset signal  
(where a stable supply is needed for the microcontroller RAM contents to remain valid  
and wake-up from an external application not connected to the SBC)  
Wake-up by increasing the microcontroller supply current with a reset signal  
Wake-up due to a falling edge at pin WAKE forcing an interrupt to the microcontroller  
Wake-up due to a falling edge at pin WAKE forcing a reset signal  
6.2.6 Sleep mode  
In Sleep mode the microcontroller power supply (V1) and the INH/LIMP controlled  
external supplies are switched off entirely, resulting in minimum system power  
consumption. In this mode, the watchdog runs in Time-out mode or is completely off.  
Entering Sleep mode results in an immediate LOW level on pin RSTN, thus stopping any  
operation of the microcontroller. The INH/LIMP output is floating in parallel and pin V1 is  
disabled. Only pin SYSINH can remain active to support the V2 voltage supply; this  
depends on the V2C bit. It is also possible for V3 to be ON, OFF or in Cyclic mode to  
supply external wake-up switches.  
If the watchdog is not disabled in software, it will continue to run and force a system reset  
upon overflow of the programmed period time. The SBC enters Start-up mode and pin V1  
becomes active again. This behavior can be used for a cyclic wake-up from Sleep mode.  
Depending on the application, the following operations can be selected from Sleep mode:  
Cyclic wake-up by the watchdog (only in Time-out mode); a reset is performed  
periodically, the SBC provides information about the reset source to allow different  
start sequences after reset  
Wake-up by activity on the CAN-bus, LIN-bus or falling edge at pin WAKE  
An overload on V3, only if V3 is in a cyclic or in continuously on mode  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
6.2.7 Flash mode  
Flash mode can only be entered from Normal mode by entering a specific Flash mode  
entry sequence. This fail-safe control sequence comprises three consecutive write  
accesses to the Mode register, within the legal windows of the watchdog, using the  
operating mode codes 111, 001 and 111 respectively. As a result of this sequence, the  
SBC will enter Start-up mode and perform a system reset with the related reset source  
information (bits RSS[3:0] = 0110).  
From Start-up mode the application software now has to enter Flash mode within tWD(init)  
by writing Operating Mode code 011 to the Mode register. This feeds back a successfully  
received hardware reset (handshake between the SBC and the microcontroller). The  
transition from Start-up mode to Flash mode is possible only once after completing the  
Flash entry sequence.  
The application can also decide not to enter Flash mode but to return to Normal mode by  
using the Operating Mode code 101 for handshaking. This erases the Flash mode entry  
sequence.  
The watchdog behavior in Flash mode is similar to its time-out behavior in Standby mode,  
but Operating Mode code 111 must be used for serving the watchdog. If this code is not  
used or if the watchdog overflows, the SBC immediately forces a reset and enters Start-up  
mode. Flash mode is properly exited using the Operating Mode code 110 (leave Flash  
mode), which results in a system reset with the corresponding reset source information.  
Other Mode register codes will cause a forced reset with reset source code ‘illegal Mode  
register code’.  
6.3 On-chip oscillator  
The on-chip oscillator provides the clock signal for all digital functions and is the timing  
reference for the on-chip watchdog and the internal timers.  
If the on-chip oscillator frequency is too low or the oscillator is not running at all, there is  
an immediate transition to Fail-safe mode. The SBC will stay in Fail-safe mode until the  
oscillator has recovered to its normal frequency and the system receives a wake-up  
event.  
6.4 Watchdog  
The watchdog provides the following timing functions:  
Start-up mode; needed to give the software the opportunity to initialize the system  
Window mode; detects too early and too late accesses in Normal mode  
Time-out mode; detects a too late access, can also be used to restart or interrupt the  
microcontroller from time to time (cyclic wake-up function)  
Off mode; fail-safe shut-down during operation thus preventing any blind spots in the  
system supervision  
The watchdog is clocked directly by the on-chip oscillator.  
To guarantee fail-safe control of the watchdog via the SPI, all watchdog accesses are  
coded with redundant bits. Therefore, only certain codes are allowed for a proper  
watchdog service.  
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Product data sheet  
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UJA1065  
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High-speed CAN/LIN fail-safe system basis chip  
The following corrupted watchdog accesses result in an immediate system reset:  
Illegal watchdog period coding; only ten different codes are valid  
Illegal operating mode coding; only six different codes are valid  
Any microcontroller driven mode change is synchronized with a watchdog access by  
reading the mode information and the watchdog period information from the same  
register. This enables an easy software flow control with defined watchdog behavior when  
switching between different software modules.  
6.4.1 Watchdog start-up behavior  
Following any reset event the watchdog is used to monitor the ECU start-up procedure. It  
observes the behavior of the RSTN pin for any clamping condition or interrupted reset  
wire. In case the watchdog is not properly served within tWD(init), another reset is forced  
and the monitoring procedure is restarted. In case the watchdog is again not properly  
served, the system enters Fail-safe mode (see also Figure 3, Start-up and Restart  
modes).  
6.4.2 Watchdog window behavior  
Whenever the SBC enters Normal mode, the Window mode of the watchdog is activated.  
This ensures that the microcontroller operates within the required speed; a too fast as well  
as a too slow operation will be detected. Watchdog triggering using the Window mode is  
illustrated in Figure 4.  
period  
too early  
trigger window  
50 %  
100 %  
trigger  
restarts  
period  
trigger  
via SPI  
last  
trigger point  
earliest possible  
trigger point  
latest possible  
trigger point  
trigger restarts period  
(with different duration if  
desired)  
50 %  
100 %  
trigger  
window  
too early  
new period  
trigger  
via SPI  
earliest  
possible  
trigger  
point  
latest  
possible  
trigger  
point  
mce626  
Fig 4. Watchdog triggering using Window mode  
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Product data sheet  
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UJA1065  
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High-speed CAN/LIN fail-safe system basis chip  
The SBC provides 10 different period timings, scalable with a 4-factor watchdog prescaler.  
The period can be changed within any valid trigger window. Whenever the watchdog is  
triggered within the window time, the timer will be reset to start a new period.  
The watchdog window is defined to be between 50 % and 100 % of the nominal  
programmed watchdog period. Any too early or too late watchdog access or wrong Mode  
register code access will result in an immediate system reset, entering Start-up mode.  
6.4.3 Watchdog time-out behavior  
Whenever the SBC operates in Standby mode, in Sleep mode or in Flash mode, the  
active watchdog operates in Time-out mode. The watchdog has to be triggered within the  
actual programmed period time; see Figure 5. The Time-out mode can be used to provide  
cyclic wake-up events to the host microcontroller from Standby and Sleep modes.  
period  
trigger range  
time-out  
trigger  
via SPI  
earliest  
possible  
trigger  
point  
latest  
possible  
trigger  
point  
trigger restarts period  
(with different duration if  
desired)  
trigger range  
new period  
time-out  
mce627  
Fig 5. Watchdog triggering using Time-out mode  
In Standby and in Flash mode the nominal periods can be changed with any SPI access to  
the Mode register.  
Any illegal watchdog trigger code results in an immediate system reset, entering Start-up  
mode.  
6.4.4 Watchdog OFF behavior  
The watchdog can be switched off completely in Standby and Sleep modes. For fail-safe  
reasons this is only possible if the microcontroller has stopped program execution. To  
ensure that there is no program execution, the V1 supply current is monitored by the SBC  
while the watchdog is switched off.  
When selecting the watchdog OFF code, the watchdog remains active until the  
microcontroller supply current has dropped below the current monitoring threshold IthL(V1)  
.
After the supply current has dropped below the threshold, the watchdog stops at the end  
of the watchdog period. In case the supply current does not drop below the monitoring  
threshold, the watchdog stays active.  
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Product data sheet  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
If the microcontroller supply current increases above IthH(V1) while the watchdog is OFF,  
the watchdog is restarted with the last used watchdog period time and a watchdog restart  
interrupt is forced, if enabled.  
In case of a direct mode change towards Standby mode with watchdog OFF selected, the  
longest possible watchdog period is used. It should be noted that in Sleep mode V1  
current monitoring is not active.  
6.5 System reset  
The reset function of the UJA1065 offers two signals to deal with reset events:  
RSTN; the global ECU system reset  
EN; a fail-safe global enable signal  
6.5.1 RSTN pin  
The system reset pin (RSTN) is a bidirectional input/output. Pin RSTN is active LOW with  
selectable pulse length upon the following events; see Figure 3:  
Power-on (first battery connection) or VBAT42 below power-on reset threshold voltage  
Low V1 supply  
V1 current above threshold during Standby mode while watchdog OFF behavior is  
selected  
V3 is down due to short-circuit condition during Sleep mode  
RSTN externally forced LOW, falling edge event  
Successful preparation for Flash mode completed  
Successful exit from Flash mode  
Wake-up from Standby mode via pins CAN, LIN or WAKE if programmed accordingly,  
or any wake-up event from Sleep mode  
Wake-up event from Fail-safe mode  
Watchdog trigger failures (too early, overflow, wrong code)  
Illegal mode code via SPI applied  
Interrupt not served within tRSTN(INT)  
All of these reset events have a dedicated reset source in the System Status register to  
allow distinction between the different events.  
The SBC will lengthen any reset event to 1 ms or 20 ms to ensure that external hardware  
is properly reset. After the first battery connection, a short power-on reset of 1 ms is  
provided after voltage V1 is present. Once started, the microcontroller can set the Reset  
Length Control (RLC) bit within the System Configuration register; this allows the reset  
pulse to be adjusted for future reset events. With this bit set, all reset events are  
lengthened to 20 ms. Due to fail-safe behavior, this bit will be set automatically (to 20 ms)  
in Restart mode or Fail-safe mode. With this mechanism it is guaranteed that an  
erroneously shortened reset pulse will restart any microcontroller, at least within the  
second trial by using the long reset pulse.  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
The behavior of pin RSTN is illustrated in Figure 6. The duration of tRSTNL depends on the  
setting of the RLC bit (defines the reset length). Once an external reset event is detected  
the system controller enters the Start-up mode. The watchdog now starts to monitor pin  
RSTN as illustrated in Figure 7. If the RSTN pin is not released in time then Fail-safe  
mode is entered as shown in Figure 3.  
V1  
V
V
rel(UV)(V1)  
det(UV)(V1)  
time  
power-up  
under-  
voltage  
missing  
watchdog voltage  
access spike  
under-  
power-  
down  
V
RSTN  
time  
t
t
t
RSTNL  
RSTNL  
RSTNL  
coa054  
Fig 6. Reset pin behavior  
V
RSTN  
time  
t
RSTNL  
t
WD(init)  
RSTN  
externally  
forced LOW  
V
RSTN  
time  
t
RSTNL  
t
RSTN externally forced LOW  
WD(init)  
001aad181  
Fig 7. Reset timing diagram  
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Product data sheet  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Pin RSTN is monitored for a continuously clamped LOW situation. Once the SBC pulls pin  
RSTN HIGH but pin RSTN level remains LOW for longer than tRSTN(CLT), the SBC  
immediately enters Fail-safe mode since this indicates an application failure.  
The SBC also detects if pin RSTN is clamped HIGH. If the HIGH-level remains on the pin  
for longer than tRSTN(CHT) while pin RSTN is driven internally to a LOW-level by the SBC,  
the SBC falls back immediately to Fail-safe mode since the microcontroller cannot be  
reset any more. By entering Fail-safe mode, the V1 voltage regulator shuts down and the  
microcontroller stops.  
Additionally, chattering reset signals are handled by the SBC in such a way that the  
system safely falls back to Fail-safe mode with the lowest possible power consumption.  
6.5.2 EN output  
Pin EN can be used to control external hardware such as power components or as a  
general purpose output if the system is running properly. During all reset events, when pin  
RSTN is pulled LOW, the EN control bit will be cleared, pin EN will be pulled LOW and will  
stay LOW after pin RSTN is released. In Normal mode and Flash mode of the SBC, the  
microcontroller can set the EN control bit via the SPI. This results in releasing pin EN  
which then returns to a HIGH-level.  
6.6 Power supplies  
6.6.1 BAT14, BAT42 and SYSINH  
The SBC has two supply pins, pin BAT42 and pin BAT14. Pin BAT42 supplies most of the  
SBC where pin BAT14 only supplies the linear voltage regulators and the INH/LIMP output  
pin. This supply architecture allows different supply strategies including the use of  
external DC-to-DC converters controlled by the pin SYSINH.  
6.6.1.1 SYSINH output  
The SYSINH output is a high-side switch from BAT42. It is activated whenever the SBC  
requires supply voltage to pin BAT14, e.g. when V1 or V2 is on (see Figure 3 and  
Figure 8). Otherwise pin SYSINH is floating. Pin SYSINH can be used to control e.g. an  
external step-down voltage regulator to BAT14, to reduce power consumption in  
low-power modes.  
6.6.2 SENSE input  
The SBC has a dedicated SENSE pin for dynamic monitoring of the battery contact of an  
electronic control unit. Connecting this pin in front of the polarity protection diode of the  
ECU provides an early warning if the battery becomes disconnected.  
6.6.3 Voltage regulators V1 and V2  
The UJA1065 has two independent voltage regulators supplied out of the BAT14 pin.  
Regulator V1 is intended to supply the microcontroller. Regulator V2 is reserved for the  
high-speed CAN transceiver.  
6.6.3.1 Voltage regulator V1  
The V1 voltage is continuously monitored to provide the system reset signal when  
undervoltage situations occur. Whenever the V1 voltage falls below one of the three  
programmable thresholds, a hardware reset is forced.  
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Product data sheet  
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High-speed CAN/LIN fail-safe system basis chip  
A dedicated V1 supply comparator (V1 Monitor) observes V1 for undervoltage events  
lower than VUV(VFI). This allows the application to receive a supply warning interrupt in  
case one of the lower V1 undervoltage reset thresholds is selected.  
The V1 regulator is overload protected. The maximum output current available from pin  
V1 depends on the voltage applied to pin BAT14 according to the characteristics section.  
For thermal reasons, the total power dissipation should be taken into account.  
6.6.3.2 Voltage regulator V2  
Voltage regulator V2 provides a 5 V supply for the CAN transmitter. The pin V2 is intended  
for the connection of external buffering capacitors.  
V2 is controlled autonomously by the CAN transceiver control system and is activated on  
any detected CAN-bus activity, or if the CAN transceiver is enabled by the application  
microcontroller. V2 is short-circuit protected and will be disabled in case of an overload  
situation. Dedicated bits in the System Diagnosis register and the Interrupt register  
provide V2 status feedback to the application.  
Besides the autonomous control of V2 there is a software accessible bit which allows  
activation of V2 manually (V2C). This allows V2 to be used for other application purposes  
when CAN is not actively used (e.g. while CAN is off-line). Generally, V2 should not be  
used for other application hardware while CAN is in use.  
If the regulator V2 is not able to start within the V2 clamped LOW time (> tV2(CLT)), or if a  
short-circuit has been detected during an already activated V2, then V2 is disabled and  
the V2D bit in the System Diagnosis register is cleared. Additionally the CTC bit in the  
Physical Layer Control register is set and the V2C bit is cleared.  
Reactivation of voltage regulator V2 can be done by:  
Clearing the CTC bit while CAN is in Active mode  
Wake-up via CAN while CAN is not in Active mode  
Setting the V2C bit  
When entering CAN Active mode  
6.6.4 Switched battery output V3  
V3 is a high-side switched BAT42-related output which is used to drive external loads  
such as wake-up switches or relays. The features of V3 are as follows:  
Three application-controlled operating modes; On, Off and Cyclic.  
Two different cyclic modes allow the supply of external wake-up switches; these  
switches are powered intermittently, thus reducing the system’s power consumption in  
case a switch is continuously active; the wake-up input of the SBC is synchronized  
with the V3 cycle time.  
The switch is protected against current overloads. If V3 is overloaded, pin V3 is  
automatically disabled. The corresponding System Diagnosis register bit is reset and  
an interrupt is forced (if enabled). During Sleep mode, a wake-up is forced and the  
corresponding reset source code becomes available in the RSS bits of the System  
Status register. This signals that the wake-up source via V3 supplied wake-up  
switches has been lost.  
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High-speed CAN/LIN fail-safe system basis chip  
6.7 CAN transceiver  
The integrated high-speed CAN transceiver of the UJA1065 is an advanced ISO 11898-2  
and ISO 11898-5 compliant transceiver. In addition to standard high-speed CAN  
transceivers the UJA1065 transceiver provides the following features:  
Enhanced error handling and reporting of bus and RXD/TXD failures; these failures  
are separately identified in the System Diagnosis register  
Integrated autonomous control system for determining the mode of the CAN  
transceiver  
Ground shift detection with two selectable warning levels, to detect possible local  
ground problems before the CAN communication is affected  
On-line Listen mode with global wake-up message filter allows partial networking  
Bus connections are truly floating when power is off  
6.7.1 Mode control  
The controller of the CAN transceiver provides four modes of operation: Active mode,  
On-line mode, On-line Listen mode and Off-line mode; see Figure 8.  
In the Diagnosis register two dedicated CAN status bits (CANMD) are available to signal  
the mode of the transceiver.  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Active mode  
V2: ON/OFF (V2D)  
transmitter: ON/OFF (CTC)  
RXDC: bit stream/HIGH (V2D)  
SPLIT: ON/OFF (CSC/V2D)  
CPNC = 0 or 1  
Normal mode OR Flash mode  
AND CMC = 0 AND CPNC = 1  
Normal mode OR Flash mode  
AND CMC = 1  
Normal mode OR Flash mode  
AND CMC = 0 AND CPNC = 0  
Normal mode OR Flash mode  
AND CMC = 1  
CPNC = 1  
On-line mode  
On-line Listen mode  
V2: ON/OFF (V2C/V2D)  
transmitter: OFF  
RXDC: wake-up (active LOW)  
SPLIT: ON/OFF (CSC/V2D)  
CPNC = 0  
Normal mode  
OR Flash mode  
AND CMC = 1  
V2: ON/OFF (V2C/V2D)  
transmitter: OFF  
RXDC: V1  
SPLIT: ON/OFF (CSC/V2D)  
CPNC = 1  
global wake-up message detected  
OR CPNC = 0  
CAN wake-up filter passed  
AND CPNC = 1  
no activity for t > t  
off-line  
CAN wake-up filter passed  
AND CPNC = 0  
no activity for t > t  
off-line  
Off-line mode  
V2: ON/OFF (V2C/V2D)  
transmitter: OFF  
RXDC: V1  
power-on  
SPLIT: OFF  
CPNC = 0 or 1  
001aad182  
Fig 8. States of the CAN transceiver  
6.7.1.1 Active mode  
In Active mode the CAN transceiver can transmit data to and receive data from the  
CAN-bus. To enter Active mode the CMC bit must be set in the Physical Layer register  
and the SBC must be in Normal mode or Flash mode. In Active mode voltage regulator V2  
is activated automatically.  
The CTC bit can be used to set the CAN transceiver to a Listen-only mode. The  
transmitter output stage is disabled in this mode.  
After an overload condition on voltage regulator V2, the CTC bit must be cleared for  
reactivating the CAN transmitter.  
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High-speed CAN/LIN fail-safe system basis chip  
When leaving Active mode the CAN transmitter is disabled and the CAN receiver is  
monitoring the CAN-bus for a valid wake-up. The CAN termination is then working  
autonomously.  
6.7.1.2 On-line mode  
In On-line mode the CAN-bus pins and pin SPLIT (if enabled) are biased to the normal  
levels. The CAN transmitter is deactivated and RXDC reflects the CAN wake-up status. A  
CAN wake-up event is signalled to the microcontroller by clearing RXDC.  
If the bus stays continuously dominant or recessive for the Off-line time (toff-line), the  
Off-line state will be entered.  
6.7.1.3 On-line Listen mode  
On-line Listen mode behaves similar to On-line mode, but all activity on the CAN-bus, with  
exception of a special global wake-up request, is ignored. The global wake-up request is  
described in Section 6.7.2. Pin RXDC is kept HIGH.  
6.7.1.4 Off-line mode  
Off-line mode is the low-power mode of the CAN transceiver. The CAN transceiver is  
disabled to save supply current and is high-ohmic terminated to ground.  
The CAN off-line time is programmable in two steps with the CAN Off-line Timer Control  
(COTC) bit. When entering On-line (Listen) mode from Off-line mode the CAN off-line time  
is temporarily extended to toff-line(ext)  
.
6.7.2 CAN wake-up  
To wake-up the UJA1065 via CAN it has to be distinguished between a conventional  
wake-up and a global wake-up in case partial networking is enabled (bit CPNC = 1).  
To pass the wake-up filter for a conventional wake-up a dominant, recessive, dominant,  
recessive signal on the CAN-bus is needed; see Figure 9.  
For a global wake-up out of On-line Listen mode two distinct CAN data patterns are  
required:  
In the initial message: C6 - EE - EE - EE - EE - EE - EE - EF (hexadecimal values)  
In the global wake-up message: C6 - EE - EE - EE - EE - EE - EE - 37 (hexadecimal  
values)  
The second pattern must be received within ttimeout after receiving the first pattern. Any  
CAN-ID can be used with these data patterns.  
If the CAN transceiver enters On-line Listen mode directly from Off-line mode the global  
wake-up message is sufficient to wake-up the SBC. This pattern must be received within  
ttimeout after entering On-line Listen mode. Should ttimeout elapse before receiving the  
global wake-up message, then both messages are required for a CAN wake-up.  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
CANH  
CANL  
wake-up  
t
CAN(dom1)  
t
t
CAN(dom2)  
CAN(reces)  
001aad446  
Fig 9. CAN wake-up timing diagram.  
6.7.3 Termination control  
In Active mode, On-line mode and On-line Listen mode, CANH and CANL are terminated  
to 0.5 × VV2 via Ri. In Off-line mode CANH and CANL are terminated to GND via Ri. If V2  
is disabled due to an overload condition both pins become floating.  
6.7.4 Bus, RXD and TXD failure detection  
The UJA1065 can distinguish between bus, RXD and TXD failures as indicated in Table 3.  
All failures are signalled separately in the CANFD bits in the System Diagnosis register.  
Any change (detection and recovery) forces an interrupt to the microcontroller, if this  
interrupt is enabled.  
Table 3.  
Failure  
CAN-bus, RXD and TXD failure detection  
Description  
HxHIGH  
HxGND  
CANH short-circuit to VCC, VBAT14 or VBAT42  
CANH short-circuit to GND  
LxHIGH  
LxGND  
CANL short-circuit to VCC, VBAT14 or VBAT42  
CANL short-circuit to GND  
HxL  
CANH short-circuit to CANL  
Bus dom  
TXDC dom  
RXDC reces  
RXDC dom  
bus is continuously clamped dominant  
pin TXDC is continuously clamped dominant  
pin RXDC is continuously clamped recessive  
pin RXDC is continuously clamped dominant  
6.7.4.1 TXDC dominant clamping  
If the TXDC pin is clamped dominant for longer than tTXDC(dom) the CAN transmitter is  
disabled. After the TXDC pin becomes recessive the transmitter is reactivated  
automatically when detecting bus activity or manually by setting and clearing the CTC bit.  
6.7.4.2 RXDC recessive clamping  
If the RXDC pin is clamped recessive while the CAN-bus is dominant the CAN transmitter  
is disabled. The transmitter is reactivated automatically when RXDC becomes dominant  
or manually by setting and clearing the CTC bit.  
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High-speed CAN/LIN fail-safe system basis chip  
6.7.4.3 GND shift detection  
The SBC can detect ground shifts in reference to the CAN-bus. Two different ground shift  
detection levels can be selected with the GSTHC bit in the Configuration register. The  
failure can be read out in the System Diagnosis register. Any detected or recovered GND  
shift event is signalled with an interrupt, if enabled.  
6.8 LIN transceiver  
The integrated LIN transceiver of the UJA1065 is a LIN 2.0 compliant transceiver. The  
transceiver has the following features:  
SAE J2602 compliant and compatible with LIN revision 1.3  
Fail-safe LIN termination to BAT42 via dedicated RTLIN pin  
Enhanced error handling and reporting of bus and TXD failures; these failures are  
separately identified in the System Diagnosis register  
6.8.1 Mode control  
The controller of the LIN transceiver provides two modes of operation: Active mode and  
Off-line mode; see Figure 10. In Off-line mode the transmitter and receiver do not  
consume current, but wake-up events will be recognized by the separate wake-up  
receiver.  
Active mode  
transmitter: ON/OFF (LTC)  
receiver: ON  
RXDL: bitstream  
RTLIN: ON/75 μA  
SBC enters  
Stand-by, Start-up,  
Restart or Fail-safe mode  
SBC enters  
Normal or Flash mode  
AND LMC = 1  
OR LMC = 0  
Off-line mode  
transmitter: OFF  
receiver: wake-up  
SBC enters  
Fail-safe mode  
power-on  
RXDL: wake-up status  
RTLIN: 75 μA/OFF  
001aad184  
Fig 10. States LIN transceiver  
6.8.1.1 Active mode  
In Active mode the LIN transceiver can transmit data to and receive data from the LIN bus.  
To enter Active mode the LMC bit must be set in the Physical Layer Control register and  
the SBC must be in Normal mode or Flash mode.  
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High-speed CAN/LIN fail-safe system basis chip  
The LTC bit can be used to set the LIN transceiver to a Listen-only mode. The transmitter  
output stage is disabled in this mode.  
When leaving Active mode the LIN transmitter is disabled and the LIN receiver is  
monitoring the LIN-bus for a valid wake-up.  
6.8.1.2 Off-line mode  
Off-line mode is the low-power mode of the LIN transceiver. The LIN transceiver is  
disabled to save supply current. Pin RXDL reflects any wake-up event at the LIN-bus.  
6.8.2 LIN wake-up  
For a remote wake-up via LIN a LIN-bus signal is required as shown in Figure 11.  
LIN  
wake-up  
t
BUS(LIN)  
001aad447  
Fig 11. LIN wake-up timing diagram  
6.8.3 Termination control  
The RTLIN pin is in one of 3 different states: RTLIN = on, RTLIN = off or RTLIN = 75 μA;  
see Figure 12.  
Active mode and receiver dominant > t  
LIN(dom)(det)  
OR Off-line mode  
RTLIN = 75 μA  
RTLIN = ON  
supplied directly  
out of BAT42  
supplied directly  
out of BAT42  
Active mode and receiver recessive > t  
LIN(dom)(rec)  
OR mode change to Active mode  
Off-line mode  
AND receiver recessive > t  
LIN(dom)(rec)  
Off-line mode  
AND receiver dominant > t  
mode change to Active mode  
LIN(dom)(det)  
power-on  
RTLIN = OFF  
001aad183  
Fig 12. States of the RTLIN pin  
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During Active mode, with no short-circuit between the LIN-bus and GND, pin RTLIN  
provides an internal switch to BAT42. For master and slave operation an external resistor,  
1 kΩ or 30 kΩ respectively, can be applied between pins RTLIN and LIN. An external  
diode in series with the termination resistor is not required due to the incorporated internal  
diode.  
6.8.4 LIN slope control  
The LSC bit in the Physical Layer Control register offers a choice between two LIN slope  
times, allowing communication up to 20 kbit/s (normal) or up to 10.4 kbit/s (low slope).  
6.8.5 LIN driver capability  
Setting the LDC bit in the Physical Layer Control register will increase the driver capability  
of the LIN output stage. This feature is used in auto-addressing systems, where the  
standard LIN 2.0 drive capability is insufficient.  
6.8.6 Bus and TXDL failure detection  
The SBC handles and reports the following LIN-bus related failures:  
LIN-bus shorted to ground  
LIN-bus shorted to VBAT14 or VBAT42; the transmitter is disabled  
TXDL clamped dominant; the transmitter is disabled  
These failure events force an interrupt to the microcontroller whenever the status changes  
and the corresponding interrupt is enabled.  
6.8.6.1 TXDL dominant clamping  
If the TXDL pin is clamped dominant for longer than tTXDL(dom)(dis) the LIN transmitter is  
disabled. After the TXDL pin becomes recessive the transmitter is reactivated  
automatically when detecting bus activity or manually by setting and clearing the LTC bit.  
6.8.6.2 LIN dominant clamping  
When the LIN-bus is clamped dominant for longer than tLIN(dom)(det) (which is longer than  
tTXDL(dom)(dis)), the state of the LIN termination is changed according to Figure 12.  
6.8.6.3 LIN recessive clamping  
If the LIN bus pin is clamped recessive while TXDL is driven dominant the LIN transmitter  
is disabled. The transmitter is reactivated automatically when the LIN bus becomes  
dominant or manually by setting and clearing the LTC bit.  
6.9 Inhibit and limp-home output  
The INH/LIMP output pin is a 3-state output pin which can be used either as an inhibit for  
an extra (external) voltage regulator, or as a ‘limp-home’ output. The pin is controlled via  
the ILEN bit and ILC bit in the System Configuration register; see Figure 13.  
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state change via SPI  
OR enter Fail-safe mode  
INH/LIMP:  
HIGH  
INH/LIMP:  
LOW  
ILEN = 1  
ILC = 1  
ILEN = 1  
ILC = 0  
state change via SPI  
state change via SPI  
OR (enter Start-up mode after  
wake-up reset, external reset  
or V1 undervoltage)  
state change via SPI  
OR enter Fail-safe mode  
OR enter Restart mode  
OR enter Sleep mode  
state change via SPI  
state change via SPI  
INH/LIMP:  
floating  
ILEN = 0  
ILC = 1/0  
power-on  
001aad178  
Fig 13. States of the INH/LIMP pin  
When pin INH/LIMP is used as inhibit output, a pull-down resistor to GND ensures a  
default LOW level. The pin can be set to HIGH according to the state diagram.  
When pin INH/LIMP is used as limp-home output, a pull-up resistor to VBAT42 ensures a  
default HIGH level. The pin is automatically set to LOW when the SBC enters Fail-safe  
mode.  
6.10 Wake-up input  
The WAKE input comparator is triggered by negative edges on pin WAKE. Pin WAKE has  
an internal pull-up resistor to BAT42. It can be operated in two sampling modes which are  
selected via the WAKE Sample Control bit (WSC):  
Continuous sampling (with an internal clock) if the bit is set  
Sampling synchronized to the cyclic behavior of V3 if the bit is cleared; see Figure 14.  
This is to save bias current within the external switches in low-power operation. Two  
repetition times are possible, 16 ms and 32 ms.  
If V3 is continuously ON, the WAKE input will be sampled continuously, regardless of the  
level of bit WSC.  
The dedicated bits Edge Wake-up Status (EWS) and WAKE Level Status (WLS) in the  
System Status register reflect the actual status of pin WAKE. The WAKE port can be  
disabled by clearing the WEN bit in the System Configuration register.  
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t
w(CS)  
t
on(CS)  
V
3
approximately 70 %  
t
su(CS)  
sample  
active  
button pushed  
button released  
signal already HIGH  
due to biasing (history)  
V
WAKE  
signal remains LOW  
due to biasing (history)  
flip flop  
V
INTN  
001aac307  
Fig 14. Pin WAKE, cyclic sampling via V3  
6.11 Interrupt output  
Pin INTN is an open-drain interrupt output. It is forced LOW whenever at least one bit in  
the Interrupt register is set. By reading the Interrupt register all bits are cleared. The  
Interrupt register will also be cleared during a system reset (RSTN LOW).  
As the microcontroller operates typically with an edge-sensitive interrupt port, pin INTN  
will be HIGH for at least tINTN after each read-out of the Interrupt register. Without further  
interrupts within tINTN pin INTN stays HIGH, otherwise it will revert to LOW again.  
To prevent the microcontroller from being slowed down by repetitive interrupts, in Normal  
mode some interrupts are only allowed to occur once per watchdog period; see  
Section 6.13.7.  
If an interrupt is not read out within tRSTN(INT) a system reset is performed.  
6.12 Temperature protection  
The temperature of the SBC chip is monitored as long as the microcontroller voltage  
regulator V1 is active. To avoid an unexpected shutdown of the application by the SBC,  
the temperature protection will not switch off any part of the SBC or activate a defined  
system stop of its own accord. If the temperature is too high it generates an interrupt to  
the microcontroller, if enabled, and the corresponding status bit will be set. The  
microcontroller can then decide whether to switch off parts of the SBC to decrease the  
chip temperature.  
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6.13 SPI interface  
The Serial Peripheral Interface (SPI) provides the communication link with the  
microcontroller, supporting multi-slave and multi-master operation. The SPI is configured  
for full duplex data transfer, so status information is returned when new control data is  
shifted in. The interface also offers a read-only access option, allowing registers to be  
read back by the application without changing the register content.  
The SPI uses four interface signals for synchronization and data transfer:  
SCS - SPI chip select; active LOW  
SCK - SPI clock; default level is LOW due to low-power concept  
SDI - SPI data input  
SDO - SPI data output; floating when pin SCS is HIGH  
Bit sampling is performed on the falling clock edge and data is shifted on the rising clock  
edge; see Figure 15.  
SCS  
SCK  
SDI  
01  
02  
03  
04  
15  
16  
sampled  
X
MSB  
14  
14  
13  
13  
12  
12  
01  
01  
LSB  
LSB  
X
MSB  
SDO  
X
floating  
floating  
mce634  
Fig 15. SPI timing protocol  
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To protect against wrong or illegal SPI instructions, the SBC detects the following SPI  
failures:  
SPI clock count failure (wrong number of clock cycles during one SPI access): only  
16 clock periods are allowed within one SCS cycle. Any deviation from the 16 clock  
cycles results in an SPI failure interrupt, if enabled. The access is ignored by the SBC.  
In Start-up and Restart mode a reset is forced instead of an interrupt  
Forbidden mode changes according to Figure 3 result in an immediate system reset  
Illegal Mode register code. Undefined operating mode or watchdog period coding  
results in an immediate system reset; see Section 6.13.3  
6.13.1 SPI register mapping  
Any control bit which can be set by software is readable by the application. This allows  
software debugging as well as control algorithms to be implemented.  
Watchdog serving and mode setting is performed within the same access cycle; this only  
allows an SBC mode change whilst serving the watchdog.  
Each register carries 12 data bits; the other 4 bits are used for register selection and  
read/write definition.  
6.13.2 Register overview  
The SPI interface gives access to all SBC registers; see Table 4. The first two bits (A1 and  
A0) of the message header define the register address, the third bit is the read register  
select bit (RRS) to select one out of two possible feedback registers; the fourth bit (RO)  
allows ‘read only’ access to one of the feedback registers. Which of the SBC registers can  
be accessed also depends on the SBC operating mode.  
Table 4.  
Register  
Register overview  
Operating  
Write access (RO = 0)  
Read access (RO = 0 or RO = 1)  
address bits mode  
(A1, A0)  
Read Register Select  
(RRS) bit = 0  
Read Register Select  
(RRS) bit = 1  
00  
01  
all modes  
Mode register  
System Status register  
System Diagnosis register  
Interrupt register  
Normal mode;  
Standby mode;  
Flash mode  
Interrupt Enable register  
Interrupt Enable Feedback  
register  
Start-up mode; Special Mode register  
Restart mode  
Interrupt Enable Feedback  
register  
Special Mode Feedback  
register  
10  
11  
Normal mode;  
Standby mode register  
System Configuration  
System Configuration  
Feedback register  
General Purpose Feedback  
register 0  
Start-up mode; General Purpose register 0 System Configuration  
Restart mode;  
Flash mode  
General Purpose Feedback  
register 0  
Feedback register  
Normal mode;  
Standby mode register  
Physical Layer Control  
Physical Layer Control  
Feedback register  
General Purpose Feedback  
register 1  
Start-up mode; General Purpose register 1 Physical Layer Control  
General Purpose Feedback  
register 1  
Restart mode;  
Flash mode  
Feedback register  
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6.13.3 Mode register  
In the Mode register the watchdog is defined and re-triggered, and the SBC operating  
mode is selected. The Mode register also contains the global enable output bit (EN) and  
the Software Development Mode (SDM) control bit. During system operation cyclic  
access to the Mode register is required to serve the watchdog. This register can be written  
to in all modes.  
At system start-up the Mode register must be written to within tWD(init) from releasing  
RSTN (HIGH-level on pin RSTN). Any write access is checked for proper watchdog and  
system mode coding. If an illegal code is detected, access is ignored by the SBC and a  
system reset is forced in accordance with the state diagram of the system controller; see  
Figure 3.  
Table 5.  
Bit  
Mode register bit description (bits 15 to 12 and 5 to 0)  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address 00  
select Mode register  
13  
12  
RRS  
RO  
Read Register  
Select  
1
0
1
0
read System Diagnosis register  
read System Status register  
Read Only  
read selected register without writing to Mode register  
read selected register and write to Mode register  
11 to 6  
5 to 3  
NWP[5:0]  
OM[2:0]  
see Table 6  
Operating Mode 001  
Normal mode  
010  
011  
100  
101  
110  
111  
Standby mode  
initialize Flash mode[1]  
Sleep mode  
initialize Normal mode  
leave Flash mode  
Flash mode [1]  
2
SDM  
Software  
Development  
Mode  
1
0
Software development mode enabled[2]  
normal watchdog, interrupt, reset monitoring and fail-safe  
behavior  
1
0
EN  
-
Enable  
1
0
0
EN output pin HIGH  
EN output pin LOW  
reserved  
reserved for future use; should remain cleared to ensure  
compatibility with future functions which might use this bit  
[1] Flash mode can be entered only with the watchdog service sequence ‘Normal mode to Flash mode to Normal mode to Flash mode’,  
while observing the watchdog trigger rules. With the last command of this sequence the SBC forces a system reset, and enters Start-up  
mode to prepare the microcontroller for flash memory download. The four RSS bits in the System Status register reflect the reset source  
information, confirming the Flash entry sequence. By using the Initializing Flash mode (within tWD(init) after system reset) the SBC will  
now successfully enter Flash mode.  
[2] See Section 6.14.1.  
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Table 6.  
Bit  
Mode register bit description (bits 11 to 6)[1]  
Symbol  
Description  
Value  
Time  
Normal  
Standby  
Flash mode Sleep mode  
mode (ms)  
mode (ms)  
(ms)  
(ms)  
11 to 6  
NWP[5:0]  
Nominal  
Watchdog Period  
00 1001  
00 1100  
01 0010  
01 0100  
01 1011  
10 0100  
10 1101  
11 0011  
11 0101  
11 0110  
00 1001  
00 1100  
01 0010  
01 0100  
01 1011  
10 0100  
10 1101  
11 0011  
11 0101  
11 0110  
00 1001  
00 1100  
01 0010  
01 0100  
01 1011  
10 0100  
10 1101  
11 0011  
11 0101  
11 0110  
4
20  
20  
160  
8
40  
40  
320  
WDPRE = 00 (as  
set in the Special  
Mode register)  
16  
32  
40  
48  
56  
64  
72  
80  
6
80  
80  
640  
160  
160  
1024  
2048  
3072  
4096  
6144  
8192  
OFF[3]  
240  
320  
320  
640  
640  
1024  
2048  
4096  
OFF[2]  
30  
1024  
2048  
4096  
8192  
30  
Nominal  
Watchdog Period  
12  
24  
48  
60  
72  
84  
96  
108  
120  
10  
20  
40  
80  
100  
120  
140  
160  
180  
200  
60  
60  
480  
WDPRE = 01 (as  
set in the Special  
Mode register)  
120  
120  
960  
240  
240  
1536  
3072  
4608  
6144  
9216  
12288  
OFF[3]  
400  
480  
480  
960  
960  
1536  
3072  
6144  
OFF[2]  
50  
1536  
3072  
6144  
12288  
50  
Nominal  
Watchdog Period  
100  
100  
800  
WDPRE = 10 (as  
set in the Special  
Mode register)  
200  
200  
1600  
2560  
5120  
7680  
10240  
15360  
20480  
OFF[3]  
400  
400  
800  
800  
1600  
1560  
5120  
10240  
OFF[2]  
1600  
1560  
5120  
10240  
20480  
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Table 6.  
Bit  
Mode register bit description (bits 11 to 6)[1] …continued  
Symbol  
Description  
Value  
Time  
Normal  
Standby  
Flash mode Sleep mode  
mode (ms)  
mode (ms)  
(ms)  
(ms)  
11 to 6  
NWP[5:0]  
Nominal  
Watchdog Period  
00 1001  
00 1100  
01 0010  
01 0100  
01 1011  
10 0100  
10 1101  
11 0011  
11 0101  
11 0110  
14  
70  
70  
560  
28  
140  
140  
1120  
WDPRE = 11 (as  
set in the Special  
Mode register)  
56  
280  
280  
2240  
3584  
7168  
10752  
14336  
21504  
28672  
OFF[3]  
112  
140  
168  
196  
244  
252  
280  
560  
560  
1120  
2240  
3584  
7168  
14336  
OFF[2]  
1120  
2240  
3584  
7168  
14336  
28672  
[1] The nominal watchdog periods are directly related to the SBC internal oscillator. The given values are valid for fosc = 512 kHz.  
[2] See Section 6.4.4.  
[3] The watchdog is immediately disabled on entering Sleep mode, with watchdog OFF behavior selected, because pin RSTN is  
immediately pulled LOW by the mode change. V1 is switched off after pulling pin RSTN LOW to guarantee a safe Sleep mode entry  
without dips on V1; see Section 6.4.4.  
6.13.4 System Status register  
This register allows status information to be read back from the SBC. This register can be  
read in all modes.  
Table 7.  
Bit  
System Status register bit description  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address  
Read Register Select  
Read Only  
00  
0
read System Status register  
13  
12  
RRS  
RO  
1
read System Status register without writing to Mode  
register  
0
read System Status register and write to Mode register  
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Table 7.  
Bit  
System Status register bit description …continued  
Symbol  
Description  
Value  
Function  
11 to 8  
RSS[3:0]  
Reset Source[1]  
0000  
power-on reset; first connection of BAT42 or BAT42 below  
power-on voltage threshold or RSTN was forced LOW  
externally  
0001  
0010  
cyclic wake-up out of Sleep mode  
low V1 supply; V1 has dropped below the selected reset  
threshold  
0011  
0100  
V1 current above threshold within Standby mode while  
watchdog OFF behavior and reset option (V1CMC bit) are  
selected  
V3 voltage is down due to overload occurring during Sleep  
mode  
0101  
0110  
0111  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
1
SBC successfully left Flash mode  
SBC ready to enter Flash mode  
CAN wake-up event  
LIN wake-up event  
local wake-up event (via pin WAKE)  
wake-up out of Fail-safe mode  
watchdog overflow  
watchdog not initialized in time; tWD(init) exceeded  
watchdog triggered too early; window missed  
illegal SPI access  
interrupt not served within tRSTN(INT)  
CAN wake-up detected; cleared upon read  
no CAN wake-up  
7
6
5
4
3
2
1
0
CWS  
LWS  
CAN Wake-up Status  
LIN Wake-up Status  
Edge Wake-up Status  
WAKE Level Status  
0
1
LIN wake-up detected; cleared upon read  
no LIN wake-up  
0
EWS  
WLS  
1
pin WAKE negative edge detected; cleared upon read  
pin WAKE no edge detected  
0
1
pin WAKE above threshold  
0
pin WAKE below threshold  
TWS  
Temperature Warning  
Status  
1
chip temperature exceeds the warning limit  
chip temperature is below the warning limit  
Software Development mode on  
Software Development mode off  
pin EN output activated (V1-related HIGH level)  
pin EN output released (LOW level)  
0
SDMS  
ENS  
Software Development  
Mode Status  
1
0
Enable Status  
1
0
PWONS  
Power-on reset Status  
1
power-on reset; cleared after a successfully entered  
Normal mode  
0
no power-on reset  
[1] The RSS bits are updated with each reset event and not cleared. The last reset event is captured.  
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6.13.5 System Diagnosis register  
This register allows diagnosis information to be read back from the SBC. This register can  
be read in all modes.  
Table 8.  
Bit  
System Diagnosis register bit description  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address  
Read Register Select  
Read Only  
00  
1
read System Diagnosis register  
13  
12  
RRS  
RO  
1
read System Diagnosis register without writing to Mode  
register  
0
1
0
read System Diagnosis register and write to Mode register  
system GND shift is outside selected threshold  
system GND shift is within selected threshold  
pin TXDC is continuously clamped dominant  
pin RXDC is continuously clamped dominant  
the bus is continuously clamped dominant  
pin RXDC is continuously clamped recessive  
reserved  
11  
GSD  
Ground Shift Diagnosis  
10 to 7  
CANFD [3:0] CAN Failure Diagnosis 1111  
1110  
1100  
1101  
1011  
1010  
1001  
1000  
0111  
0110  
0101  
0100  
0011  
0010  
0001  
0000  
reserved  
pin CANH is shorted to pin CANL  
pin CANL is shorted to VCC, VBAT14 or VBAT42  
reserved  
CANH is shorted to GND  
CANL is shorted to GND  
CANH is shorted to VCC, VBAT14 or VBAT42  
reserved  
reserved  
reserved  
no failure  
6 and 5  
LINFD[1:0]  
LIN Failure Diagnosis  
11  
10  
01  
00  
1
TXDL is clamped dominant  
LIN is shorted to GND (dominant clamped)  
LIN is shorted to VBAT (recessive clamped)  
no failure  
4
3
2
V3D  
V2D  
V1D  
V3 Diagnosis  
V2 Diagnosis  
V1 Diagnosis  
OK  
0
fail; V3 is disabled due to an overload situation  
OK[1]  
1
0
fail; V2 is disabled due to an overload situation  
OK; V1 always above VUV(VFI) since last read access  
1
0
fail; V1 was below VUV(VFI) since last read access; bit is set  
again with read access  
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Table 8.  
Bit  
System Diagnosis register bit description …continued  
Symbol  
Description  
Value  
11  
Function  
1 and 0  
CANMD [1:0] CAN Mode Diagnosis  
CAN is in Active mode  
10  
CAN is in On-line mode  
CAN is in On-line Listen mode  
CAN is in Off-line mode, or V2 is not active  
01  
00  
[1] V2D will be set when V2 is reactivated after a failure. See Section 6.6.3.2.  
6.13.6 Interrupt Enable register and Interrupt Enable Feedback register  
These registers allow setting, clearing and reading back the interrupt enable bits of the  
SBC.  
Table 9.  
Bit  
Interrupt Enable and Interrupt Enable Feedback register bit description  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address  
Read Register Select  
01  
1
select the Interrupt Enable register  
read the Interrupt register  
13  
12  
RRS  
RO  
0
read the Interrupt Enable Feedback register  
Read Only  
1
read the register selected by RRS without writing to  
Interrupt Enable register  
0
1
read the register selected by RRS and write to Interrupt  
Enable register  
11  
WTIE  
Watchdog Time-out  
Interrupt Enable[1]  
a watchdog overflow during Standby mode causes an  
interrupt instead of a reset event (interrupt based cyclic  
wake-up feature)  
0
1
no interrupt forced on watchdog overflow; a reset is forced  
instead  
10  
9
OTIE  
Over-Temperature  
Interrupt Enable  
exceeding or dropping below the temperature warning limit  
causes an interrupt  
0
1
no interrupt forced  
GSIE  
Ground Shift Interrupt  
Enable  
exceeding or dropping below the GND shift limit causes an  
interrupt  
0
1
no interrupt forced  
8
SPIFIE  
SPI clock count Failure  
Interrupt Enable  
wrong number of CLK cycles (more than, or less than 16)  
forces an interrupt; from Start-up mode and Restart mode a  
reset is performed instead of an interrupt  
0
no interrupt forced; SPI access is ignored if the number of  
cycles does not equal 16  
7
6
5
BATFIE  
VFIE  
BAT Failure Interrupt  
Enable  
1
0
1
0
1
falling edge at SENSE forces an interrupt  
no interrupt forced  
Voltage Failure Interrupt  
Enable  
clearing of V1D, V2D or V3D forces an interrupt  
no interrupt forced  
CANFIE  
CAN Failure Interrupt  
Enable  
any change of the CAN Failure status bits forces an  
interrupt  
0
1
0
no interrupt forced  
4
LINFIE  
LIN Failure Interrupt  
Enable  
any change of the LIN Failure status bits forces an interrupt  
no interrupt forced  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 9.  
Interrupt Enable and Interrupt Enable Feedback register bit description …continued  
Bit  
Symbol  
Description  
Value  
Function  
3
WIE  
WAKE Interrupt  
Enable[2]  
1
a negative edge at pin WAKE generates an interrupt in  
Normal mode, Flash mode or Standby mode  
0
1
a negative edge at pin WAKE generates a reset in Standby  
mode; no interrupt in any other mode  
2
1
WDRIE  
CANIE  
Watchdog Restart  
Interrupt Enable  
a watchdog restart during watchdog OFF generates an  
interrupt  
0
1
no interrupt forced  
CAN Interrupt Enable  
CAN-bus event results in a wake-up interrupt in Standby  
mode and in Normal or Flash mode (unless CAN is in  
Active mode already)  
0
1
CAN-bus event results in a reset in Standby mode; no  
interrupt in any other mode  
0
LINIE  
LIN Interrupt Enable  
LIN-bus event results in a wake-up interrupt in Standby  
mode and in Normal or Flash mode (unless LIN is in Active  
mode already)  
0
LIN-bus event results in a reset in Standby mode; no  
interrupt in any other mode  
[1] This bit is cleared automatically upon each overflow event. It has to be set in software each time the interrupt behavior is required  
(fail-safe behavior).  
[2] WEN (in the System Configuration register) has to be set to activate the WAKE port function globally.  
6.13.7 Interrupt register  
The Interrupt register allows the cause of an interrupt event to be read. The register is  
cleared upon a read access and upon any reset event. Hardware ensures that no interrupt  
event is lost in case there is a new interrupt forced while reading the register. After reading  
the Interrupt register pin INTN is released for tINTN to guarantee an edge event at pin  
INTN.  
The interrupts can be classified into two groups:  
Timing critical interrupts which require immediate reaction (SPI clock count failure  
which needs a new SPI command to be resent immediately, and a BAT failure which  
needs critical data to be saved immediately into the nonvolatile memory)  
Interrupts which do not require an immediate reaction (overtemperature, Ground Shift,  
CAN and LIN failures, V1, V2 and V3 failures and the wake-ups via CAN, LIN and  
WAKE. These interrupts will be signalled in Normal mode to the microcontroller once  
per watchdog period (maximum); this prevents overloading the microcontroller with  
unexpected interrupt events (e.g. a chattering CAN failure). However, these interrupts  
are reflected in the Interrupt register  
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NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 10. Interrupt register bit description  
Bit  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address  
Read Register Select  
Read Only  
01  
1
read Interrupt register  
13  
12  
RRS  
RO  
1
read the Interrupt register without writing to the Interrupt  
Enable register  
0
1
read the Interrupt register and write to the Interrupt Enable  
register  
11  
WTI  
Watchdog Time-out  
Interrupt  
a watchdog overflow during Standby mode has caused an  
interrupt (interrupt-based cyclic wake-up feature)  
0
1
0
1
0
1
no interrupt  
10  
9
OTI  
OverTemperature  
Interrupt  
the temperature warning status (TWS) has changed  
no interrupt  
GSI  
Ground Shift Interrupt  
the ground shift diagnosis bit (GSD) has changed  
no interrupt  
8
SPIFI  
SPI clock count Failure  
Interrupt  
wrong number of CLK cycles (more than, or less than 16)  
during SPI access  
0
no interrupt; SPI access is ignored if the number of CLK  
cycles does not equal 16  
7
6
5
4
3
2
BATFI  
VFI  
BAT Failure Interrupt  
1
0
falling edge at pin SENSE has forced an interrupt  
no interrupt  
Voltage Failure Interrupt 1  
0
V1D, V2D or V3D has been cleared  
no interrupt  
CANFI  
LINFI  
WI  
CAN Failure Interrupt  
LIN Failure Interrupt  
Wake-up Interrupt  
1
0
1
0
1
0
1
CAN failure status has changed  
no interrupt  
LIN failure status has changed  
no interrupt  
a negative edge at pin WAKE has been detected  
no interrupt  
WDRI  
Watchdog Restart  
Interrupt  
A watchdog restart during watchdog OFF has caused an  
interrupt  
0
1
0
1
0
no interrupt  
1
0
CANI  
LINI  
CAN Wake-up Interrupt  
LIN Wake-up Interrupt  
CAN wake-up event has caused an interrupt  
no interrupt  
LIN wake-up event has caused an interrupt  
no interrupt  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
6.13.8 System Configuration register and System Configuration Feedback register  
These registers allow configuration of the behavior of the SBC, and allow the settings to  
be read back.  
Table 11. System Configuration and System Configuration Feedback register bit description  
Bit  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address  
Read Register Select  
10  
1
select System Configuration register  
read the General Purpose Feedback register 0  
read the System Configuration Feedback register  
13  
12  
RRS  
RO  
0
Read Only  
1
read register selected by RRS without writing to System  
Configuration register  
0
0
read register selected by RRS and write to System  
Configuration register  
11 and 10  
9
-
reserved  
reserved for future use; should remain cleared to ensure  
compatibility with future functions which might use this bit  
GSTHC  
GND Shift Threshold  
Control  
1
Vth(GSD)(cm) widened threshold  
Vth(GSD)(cm) normal threshold  
0
8
RLC  
Reset Length Control  
1[1]  
tRSTNL long reset lengthening time selected  
tRSTNL short reset lengthening time selected  
Cyclic mode 2; tw(CS) long period; see Figure 14  
Cyclic mode 1; tw(CS) short period; see Figure 14  
continuously ON  
0
7 and 6  
V3C[1:0]  
V3 Control  
11  
10  
01  
00  
0
OFF  
5
4
-
reserved  
reserved for future use; should remain cleared to ensure  
compatibility with future functions which might use this bit  
V1CMC  
V1 Current Monitor  
Control  
1
0
an increasing V1 current causes a reset if the watchdog  
was disabled during Standby mode  
an increasing V1 current just reactivates the watchdog  
during Standby mode  
3
2
1
0
WEN  
WSC  
ILEN  
ILC  
Wake Enable[2]  
1
0
1
0
1
0
1
0
WAKE pin enabled  
WAKE pin disabled  
Wake Sample Control  
INH/LIMP Enable  
INH/LIMP Control  
Wake mode cyclic sample  
Wake mode continuous sample  
INH/LIMP pin active (See ILC bit)  
INH/LIMP pin floating  
INH/LIMP pin HIGH if ILEN bit is set  
INH/LIMP pin LOW if ILEN bit is set  
[1] RLC is set automatically with entering Restart mode or Fail-safe mode. This guarantees a safe reset period in case of serious failure  
situations. External reset spikes are lengthened by the SBC until the programmed reset length is reached.  
[2] If WEN is not set, the WAKE port is completely disabled. There is no change of the bits EWS and WLS within the System Status register.  
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NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
6.13.9 Physical Layer Control register and Physical Layer Control Feedback  
register  
These registers allow configuration of the CAN transceiver and LIN transceiver of the SBC  
and allow the settings to be read back.  
Table 12. Physical Layer Control and Physical Layer Control Feedback register bit description  
Bit  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address  
Read Register Select  
11  
1
select Physical Layer Control register  
read the General Purpose Feedback register 1  
read the Physical Layer Control Feedback register  
13  
12  
RRS  
RO  
0
Read Only  
1
read the register selected by RRS without writing to the  
Physical Layer Control register  
0
read the register selected by RRS and write to Physical  
Layer Control register  
11  
10  
V2C  
V2 Control  
1
0
1
V2 remains active in CAN Off-line mode  
V2 is OFF in CAN Off-line mode  
CPNC  
CAN Partial Networking  
Control  
CAN transceiver enters On-line Listen mode instead of  
On-line mode; cleared whenever the SBC enters On-line  
mode or Active mode  
0
1
0
1
0
1
On-line Listen mode disabled  
9
8
7
COTC  
CTC  
CAN Off-line Time  
Control[1]  
toff-line long period (extended to toff-line(ext) after wake-up)  
toff-line short period (extended to toff-line(ext) after wake-up)  
CAN transmitter is disabled  
CAN Transmitter  
Control[2]  
CAN transmitter is enabled  
CRC  
CAN Receiver Control  
TXD signal is forwarded directly to RXD for self-test  
purposes (loopback behavior); only if CTC = 1  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
TXD signal is not forwarded to RXD (normal behavior)  
CAN Active mode (in Normal mode and Flash mode only)  
CAN Active mode disabled  
6
5
4
3
2
1
0
CMC  
CSC  
LMC  
LSC  
CAN Mode Control  
CAN Split Control  
LIN Mode Control  
LIN Slope Control  
LIN Driver Control  
LIN Wake-up Enable  
CAN SPLIT pin active  
CAN SPLIT pin floating  
LIN Active mode (in Normal mode and Flash mode only)  
LIN Active mode disabled  
up to 10.4 kbit/s (low slope)  
up to 20 kbit/s (normal)  
LDC  
LWEN  
LTC  
increased LIN driver current capability  
LIN driver in conformance with the LIN 2.0 standard  
wake-up via the LIN-bus enabled  
wake-up via the LIN-bus disabled  
LIN transmitter is disabled  
LIN Transmitter  
Control[3]  
LIN transmitter is enabled  
[1] For the CAN transceiver to enter Off-Line mode from On-line or On-line Listen mode a minimum time without bus activity is needed. This  
minimum time toff-line is defined by COTC; see Section 6.7.1.4.  
[2] In case of an RXDC / TXDC interfacing failure the CAN transmitter is disabled without setting CTC. Recovery from such a failure is  
automatic when CAN communication (with correct interfacing levels) is received. Manual recovery is also possible by setting and  
clearing the CTC bit under software control.  
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High-speed CAN/LIN fail-safe system basis chip  
[3] In case of an RXDL / TXDL interfacing failure the LIN transmitter is disabled without setting LTC. Recovery from such a failure is  
automatic when LIN communication (with correct interfacing levels) is received. Manual recovery is also possible by setting and clearing  
the LTC bit under software control.  
6.13.10 Special Mode register and Special Mode Feedback register  
These registers allow configuration of global SBC parameters during start-up of a system  
and allow the settings to be read back.  
Table 13. Special Mode register and Special Mode Feedback register bit description  
Bit  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address  
Read Register Select  
01  
0
select Special Mode register  
read the Interrupt Enable Feedback register  
read the Special Mode Feedback register  
13  
12  
RRS  
RO  
1
Read Only  
1
read the register selected by RRS without writing to the  
Special Mode register  
0
0
read the register selected by RRS and write to the  
Special Mode register  
11 and 10  
9
-
reserved  
reserved for future use; should remain cleared to ensure  
compatibility with future functions which might use this bit  
ISDM  
Initialize Software  
Development Mode[1]  
1
0
initialization of software development mode  
normal watchdog interrupt, reset monitoring and fail-safe  
behavior  
8
ERREM  
Error-pin Emulation  
Mode  
1
pin EN reflects the status of the CANFD bits:  
EN is set if CANFD = 0000 (no error)  
EN is cleared if CANFD is not 0000 (error)  
pin EN behaves as an enable pin; see Section 6.5.2  
0
0
7
-
reserved  
reserved for future use; should remain cleared to ensure  
compatibility with future functions which might use this bit  
6 and 5  
WDPRE [1:0] Watchdog Prescaler  
00  
01  
10  
11  
11  
10  
01  
00  
0
watchdog prescale factor 1  
watchdog prescale factor 1.5  
watchdog prescale factor 2.5  
watchdog prescale factor 3.5  
V1 reset threshold = 0.9 × VV1(nom)  
4 and 3  
2 to 0  
V1RTHC [1:0] V1 Reset Threshold  
Control  
[2]  
V1 reset threshold = 0.7 × VV1(nom)  
V1 reset threshold = 0.8 × VV1(nom)  
V1 reset threshold = 0.9 × VV1(nom)  
-
reserved  
reserved for future use; should remain cleared to ensure  
compatibility with future functions which might use this bit  
[1] See Section 6.14.1.  
[2] Not supported in the UJA1065TW/3V3 version.  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
6.13.11 General Purpose registers and General Purpose Feedback registers  
The UJA1065 offers two 12-bit General Purpose registers (and accompanying General  
Purpose Feedback registers) with no predefined bit definition. These registers can be  
used by the microcontroller for advanced system diagnosis or for storing critical system  
status information outside the microcontroller. After Power-up General Purpose register 0  
will contain a ‘Device Identification Code’ consisting of the SBC type and SBC version.  
This code is available until it is overwritten by the microcontroller (as indicated by the DIC  
bit).  
Table 14. General Purpose register 0 and General Purpose Feedback register 0 bit description  
Bit  
Symbol  
A1, A0  
RRS  
Description  
Value  
Function  
15, 14  
13  
register address  
Read Register Select  
10  
1
read the General Purpose Feedback register 0  
read the General Purpose Feedback register 0  
read the System Configuration Feedback register  
0
12  
RO  
Read Only  
1
read the register selected by RRS without writing to the  
General Purpose register 0  
0
read the register selected by RRS and write to the General  
Purpose register 0  
11  
DIC  
Device Identification  
Control[1]  
1
0
General Purpose register 0 contains user-defined bits  
General Purpose register 0 contains the Device  
Identification Code  
10 to 0  
GP0[10:0]  
General Purpose bits[2]  
1
0
user-defined  
user-defined  
[1] The Device Identification Control bit is cleared during power-up of the SBC, indicating that General Purpose register 0 is loaded with the  
Device Identification Code. Any write access to General Purpose register 0 will set the DIC bit, regardless of the value written to DIC.  
[2] During power-up the General Purpose register 0 is loaded with a ‘Device Identification Code’ consisting of the SBC type and SBC  
version, and the DIC bit is cleared.  
Table 15. General Purpose register 1 and General Purpose Feedback register 1 bit description  
Bit  
Symbol  
Description  
Value  
Function  
15 and 14 A1, A0  
register address  
Read Register Select  
11  
1
select General Purpose register 1  
read the General Purpose Feedback register 1  
read the Physical Layer Control Feedback register  
13  
12  
RRS  
RO  
0
Read Only  
1
read the register selected by RRS without writing to the  
General Purpose register 1  
0
read the register selected by RRS and write to the General  
Purpose register  
11 to 0  
GP1[11:0]  
General Purpose bits  
1
0
user-defined  
user-defined  
6.13.12 Register configurations at reset  
At power-on, Start-up and Restart mode the setting of the SBC registers is predefined.  
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NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 16. System Status register: status at reset  
Symbol  
RSS  
Name  
Power-on  
0000 (power-on reset) any value except 1100  
Start-up [1]  
Restart [1]  
Reset Source Status  
CAN Wake-up Status  
0000 or 0010 or 1100 or 1110  
no change  
CWS  
0 (no CAN wake-up)  
1 if reset is caused by a  
CAN wake-up, otherwise  
no change  
LWS  
EWS  
LIN Wake-up Status  
0 (no LIN wake-up)  
1 if reset is caused by a  
LIN wake-up, otherwise no  
change  
no change  
no change  
Edge Wake-up Status 0 (no edge detected)  
1 if reset is caused by a  
wake-up via pin WAKE,  
otherwise no change  
WLS  
TWS  
WAKE Level Status  
actual status  
actual status  
actual status  
actual status  
actual status  
Temperature Warning  
Status  
0 (no warning)  
SDMS  
ENS  
Software Development actual status  
Mode Status  
actual status  
actual status  
Enable Status  
0 (EN = LOW)  
0 if ERREM = 0, otherwise 0 if ERREM = 0, otherwise  
actual CAN failure status  
actual CAN failure status  
PWONS  
Power-on Status  
1 (power-on reset)  
no change  
no change  
[1] Depends on history.  
Table 17. System Diagnosis register: status at reset  
Symbol  
GSD  
Name  
Power-on  
Start-up  
Restart  
Ground Shift Diagnosis 0 (OK)  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
actual status  
CANFD  
LINFD  
V3D  
CAN Failure Diagnosis 0000 (no failure)  
LIN Failure Diagnosis 00 (no failure)  
V3 Diagnosis  
V2 Diagnosis  
V1 Diagnosis  
1 (OK)  
1 (OK)  
0 (fail)  
V2D  
V1D  
CANMD  
CAN Mode Diagnosis 00 (Off-line)  
Table 18. Interrupt Enable register and Interrupt Enable Feedback register: status at reset  
Symbol  
Name  
Power-on  
Start-up  
Restart  
All  
all bits  
0 (interrupt disabled)  
no change  
no change  
Table 19. Interrupt register: status at reset  
Symbol  
Name  
Power-on  
Start-up  
Restart  
All  
all bits  
0 (no interrupt)  
0 (no interrupt)  
0 (no interrupt)  
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High-speed CAN/LIN fail-safe system basis chip  
Table 20. System Configuration register and System Configuration Feedback register: status at reset  
Symbol  
Name  
Power-on  
Start-up  
Restart  
Fail-Safe  
GSTHC  
GND Shift level  
0 (normal)  
no change  
no change  
no change  
Threshold Control  
RLC  
Reset Length Control  
V3 Control  
0 (short)  
00 (off)  
no change  
no change  
no change  
1 (long)  
1 (long)  
V3C  
no change  
no change  
no change  
no change  
V1CMC  
V1 Current Monitor  
Control  
0 (watchdog  
restart)  
WEN  
WSC  
ILEN  
Wake Enable  
1 (enabled)  
no change  
no change  
no change  
no change  
no change  
no change  
Wake Sample Control 0 (control)  
INH/LIMP Enable  
0 (floating)  
see Figure 13  
if ILC = 1,  
0 (floating) if ILC = 1, 1 (active)  
otherwise no change  
otherwise no change  
ILC  
INH/LIMP Control  
0 (LOW)  
no change  
no change  
0 (LOW)  
Table 21. Physical Layer Control register and Physical Layer Control Feedback register: status at reset  
Symbol  
V2C  
Name  
Power-on  
Start-up  
Restart  
Fail-Safe  
V2 Control  
0 (auto)  
no change  
no change  
no change  
0 (auto)  
CPNC  
CAN Partial Networking 0 (On-line Listen  
Control  
0 if reset is caused  
by a CAN wake-up,  
otherwise no change  
0 (On-line Listen  
mode disabled)  
mode disabled)  
1 (long)  
COTC  
CTC  
CAN Off-line Time  
Control  
no change  
no change  
no change  
no change  
no change  
CAN Transmitter  
Control  
0 (on)  
no change  
CRC  
CMC  
CAN Receiver Control 0 (normal)  
no change  
no change  
no change  
no change  
no change  
no change  
CAN Mode Control  
0 (Active mode  
disabled)  
CSC  
LMC  
CAN Split Control  
LIN Mode Control  
0 (off)  
no change  
no change  
no change  
no change  
no change  
no change  
0 (Active mode  
disabled)  
LSC  
LIN Slope Control  
LIN Driver Control  
LIN Wake-up Enable  
0 (normal)  
0 (LIN 2.0)  
1 (enabled)  
no change  
no change  
no change  
no change  
no change  
no change  
no change  
no change  
no change  
no change  
no change  
no change  
LDC  
LWEN  
LTC  
LIN Transmitter Control 0 (on)  
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High-speed CAN/LIN fail-safe system basis chip  
Table 22. Special Mode register: status at reset  
Symbol  
ISDM  
Name  
Power-on  
0 (no)  
Start-up  
Restart  
Initialize Software Development Mode  
Error pin emulation mode  
Watchdog Prescale Factor  
V1 Reset Threshold Control  
no change  
no change  
no change  
no change  
no change  
no change  
no change  
00 (90 %)  
ERREM  
WDPRE  
V1RTHC  
0 (EN function)  
00 (factor 1)  
00 (90 %)  
Table 23. General Purpose register 0 and General Purpose Feedback register 0: status at reset  
Symbol  
DIC  
Name  
Power-on  
Start-up  
Restart  
Device Identification Control  
general purpose bits 10 to 7 (version)  
0 (Device ID)  
Mask version  
no change  
no change  
no change  
no change  
no change  
GP0[10:7]  
GP0[6:0]  
general purpose bits 6 to 0 (SBC type) 000 0101 (UJA1065) no change  
Table 24. General Purpose register 1 and General Purpose Feedback register 1: status at reset  
Symbol  
Name  
Power-on  
Start-up  
Restart  
GP1[11:0]  
general purpose bits 11 to 0  
0000 0000 0000  
no change  
no change  
6.14 Test modes  
6.14.1 Software development mode  
The Software development mode is intended to support software developers in writing  
and pretesting application software without having to work around watchdog triggering  
and without unwanted jumps to Fail-safe mode.  
In Software development mode the following events do not force a system reset:  
Watchdog overflow in Normal mode  
Watchdog window miss  
Interrupt time-out  
Elapsed start-up time  
However, in case of a watchdog trigger failure the reset source information is still provided  
in the System Status register as if there was a real reset event.  
The exclusion of watchdog related resets allows simplified software testing, because  
possible problems in the watchdog triggering can be indicated by interrupts instead of  
resets. The SDM bit does not affect the watchdog behavior in Standby and Sleep mode.  
This allows the cyclic wake-up behavior to be evaluated during Standby and Sleep mode  
of the SBC.  
All transitions to Fail-safe mode are disabled. This allows working with an external  
emulator that clamps the reset line LOW in debugging mode. A V1 undervoltage of more  
than tV1(CLT) is the only exception that results in entering Fail-safe mode (to protect the  
SBC). Transitions from Start-up mode to Restart mode are still possible.  
UJA1065_7  
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Product data sheet  
Rev. 07 — 25 February 2010  
44 of 76  
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
There are two possibilities to enter Software development mode. One is by setting the  
ISDM bit via the Special Mode register; possible only once after a first battery connection  
while the SBC is in Start-up mode. The second possibility to enter Software development  
mode is by applying the correct Vth(TEST) input voltage at pin TEST before the battery is  
applied to pin BAT42.  
To stay in Software development mode the SDM bit in the Mode register has to be set with  
each Mode register access (i.e. watchdog triggering) regardless of how Software  
development mode was entered.  
The Software development mode can be exited at any time by clearing the SDM bit in the  
Mode register. Reentering the Software development mode is only possible by  
reconnecting the battery supply (pin BAT42), thereby forcing a new power-on reset.  
6.14.2 Forced normal mode  
For system evaluation purposes the UJA1065 offers the Forced normal mode. This mode  
is strictly for evaluation purposes only. In this mode the characteristics as defined in  
Section 9 and Section 10 cannot be guaranteed.  
In Forced normal mode the SBC behaves as follows:  
SPI access (writing and reading) is blocked  
Watchdog disabled  
Interrupt monitoring disabled  
Reset monitoring disabled  
Reset lengthening disabled  
All transitions to Fail-safe mode are disabled, except a V1 undervoltage for more than  
tV1(CLT)  
V1 is started with the long reset time tRSTNL. In case of a V1 undervoltage, a reset is  
performed until V1 is restored (normal behavior), and the SBC stays in Forced normal  
mode; in case of an overload at V1 > tV1(CLT) Fail-safe mode is entered  
V2 is on; overload protection active  
V3 is on; overload protection active  
CAN and LIN are in Active mode and cannot switch to Off-line mode  
INH/LIMP pin is HIGH  
SYSINH is HIGH  
EN pin at same level as RSTN pin  
Forced normal mode is activated by applying the correct Vth(TEST) input voltage at the  
TEST pin during first battery connection.  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
45 of 76  
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
7. Limiting values  
Table 25. Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.  
Symbol  
Parameter  
Conditions  
Min  
0.3  
-
Max  
+60  
+60  
Unit  
V
VBAT42  
BAT42 supply voltage  
load dump; t 500 ms  
VBAT42 VBAT14 1 V  
continuous  
V
VBAT14  
BAT14 supply voltage  
0.3  
+33  
+45  
V
V
load dump; t 500 ms  
-
VDC(n)  
DC voltage on pins  
V1 and V2  
0.3  
1.5  
0.3  
0.3  
1.5  
60  
+5.5  
V
V
V
V
V
V
V
V3 and SYSINH  
INH/LIMP  
VBAT42 + 0.3  
VBAT42 + 0.3  
VBAT42 + 1.2  
+60  
SENSE  
WAKE  
CANH, CANL, SPLIT, LIN and RTLIN with respect to any other pin  
+60  
TXDC, RXDC, TXDL, RXDL, SDO,  
SDI, SCK, SCS, RSTN, INTN and  
EN  
0.3  
VV1 + 0.3  
TEST  
0.3  
+15  
V
V
Vtrt  
transient voltage at pins CANH, CANL in accordance with  
150  
+100  
and LIN  
ISO 7637-3  
[1]  
IWAKE  
Tstg  
DC current at pin WAKE  
storage temperature  
ambient temperature  
virtual junction temperature  
electrostatic discharge voltage  
15  
55  
40  
40  
-
mA  
°C  
°C  
°C  
+150  
+125  
+150  
Tamb  
Tvj  
[2]  
[3]  
[4]  
Vesd  
HBM  
at pins CANH, CANL,  
SPLIT, LIN, RTLIN,  
WAKE, BAT42, V3,  
SENSE; with respect to  
GND  
8.0  
+8.0  
kV  
at any other pin  
MM; at any pin  
2.0  
+2.0  
kV  
V
[5]  
200  
+200  
[1] Only relevant if VWAKE < VGND 0.3 V; current will flow into pin GND.  
[2] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd × Rth(vj-amb), where Rth(vj-amb)  
is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and  
ambient temperature (Tamb).  
[3] Human Body Model (HBM): C = 100 pF; R = 1.5 kΩ.  
[4] ESD performance according to IEC 61000-4-2 (C = 150 pF, R = 330 Ω) of pins CANH, CANL, RTH, RTL, LIN, RTLIN, WAKE, BAT42  
and V3 with respect to GND was verified by an external test house. Following results were obtained:  
a) Equal or better than ±4 kV (unaided)  
b) Equal or better than ±20 kV (using external ESD protection: NXP Semiconductors PESD1CAN and PESD1LIN diode)  
[5] Machine Model (MM): C = 200 pF; L = 0.75 μH; R = 10 Ω.  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
46 of 76  
 
 
 
 
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
8. Thermal characteristics  
V1 dissipation  
V2 dissipation  
V3 dissipation  
other dissipation  
T
vj  
6 K/W  
20 K/W  
23 K/W  
6 K/W  
6 K/W  
T
T
(heat sink)  
case  
R
th(c-a)  
amb  
001aac327  
Fig 16. Thermal model of the HTSSOP32 package  
9. Static characteristics  
Table 26. Static characteristics  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Supply; pin BAT42  
IBAT42  
BAT42 supply  
current  
V1, V2 and V3 off;  
CAN and LIN in Off-line  
mode; OTIE = BATFIE = 0;  
ISYSINH = IWAKE = IRTLIN  
ILIN = 0 mA  
=
VBAT42 = 8.1 V to 52 V  
VBAT42 = 5.5 V to 8.1 V  
-
-
-
50  
70  
53  
70  
93  
76  
μA  
μA  
μA  
IBAT42(add)  
additional BAT42  
supply current  
V1 and/or V2 on;  
ISYSINH = 0 mA  
V3 in Cyclic mode; IV3 = 0 mA  
-
-
0
1
μA  
μA  
V3 continuously on;  
IV3 = 0 mA  
30  
50  
Tvj warning enabled;  
OTIE = 1  
-
20  
40  
μA  
SENSE enabled; BATFIE = 1  
-
-
2
7
μA  
μA  
CAN in Active mode;  
CMC = 1  
750  
1500  
LIN in Active mode;  
-
650  
1300  
μA  
LMC = 1; VTXDL = VV1  
IRTLIN = ILIN = 0 mA  
;
LIN in Active mode; LMC = 1;  
TXDL = 0 V (t < tLIN(dom)(det));  
V
IRTLIN = ILIN = 0 mA  
VBAT42 = 12 V  
-
-
1.5  
3
5
mA  
mA  
VBAT42 = 27 V  
10  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
47 of 76  
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 26. Static characteristics …continued  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
4.45  
4.75  
-
Typ  
Max  
5
Unit  
V
VPOR(BAT42)  
BAT42 voltage level for setting PWONS  
for power-on reset  
status bit change  
PWONS = 0; VBAT42 falling  
-
for clearing PWONS  
PWONS = 1; VBAT42 rising  
-
5.5  
5
V
Supply; pin BAT14  
IBAT14  
BAT14 supply  
current  
V1 and V2 off; CAN and LIN  
in Off-line mode;  
2
μA  
ILEN = CSC = 0;  
IINH/LIMP = ISPLIT = 0 mA  
IBAT14(add)  
additional BAT14  
supply current  
V1 on; IV1 = 0 mA  
-
-
200  
150  
300  
200  
μA  
μA  
V1 on; IV1 = 0 mA;  
VBAT14 = 12 V  
V2 on; IV2 = 0 mA  
-
-
200  
200  
320  
250  
μA  
μA  
V2 on; IV2 = 0 mA;  
VBAT14 = 12 V  
INH/LIMP enabled; ILEN = 1;  
-
-
1
5
2
μA  
IINH/LIMP = 0 mA  
CAN in Active mode;  
CMC = 1;  
10  
mA  
ICANH = ICANL = 0 mA  
SPLIT active; CSC = 1;  
-
1
-
2
mA  
V
ISPLIT = 0 mA  
VBAT14  
BAT14 voltage level for normal output current  
capability at V1  
9
6
27  
8
for high output current  
capability at V1  
-
V
Battery supply monitor input; pin SENSE  
Vth(SENSE)  
input threshold low  
battery voltage  
detection  
1
2.5  
-
3
V
release  
1.7  
20  
5
4
V
IIH(SENSE)  
HIGH-level input  
current  
Normal mode; BATFIE = 1  
Standby mode; BATFIE = 1  
50  
10  
0.2  
100  
20  
2
μA  
μA  
μA  
Normal mode or Standby  
mode; BATFIE = 0  
-
Voltage source; pin V1[2]; see also Figure 17 to Figure 23  
Vo(V1)  
output voltage  
VBAT14 = 5.5 V to 18 V;  
IV1 = 120 mA to 5 mA;  
Tj = 25 °C  
VV1(nom)  
0.1  
VV1(nom)  
VV1(nom)  
0.1  
+
+
V
V
VBAT14 = 14 V; IV1 = 5 mA;  
VV1(nom)  
0.025  
VV1(nom)  
VV1(nom)  
0.025  
Tj = 25 °C  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
48 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 26. Static characteristics …continued  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
ΔVV1  
supply voltage  
regulation  
VBAT14 = 9 V to 16 V;  
-
1
25  
mV  
IV1 = 5 mA; Tj = 25 °C  
load regulation  
VBAT14 = 14 V;  
IV1 = 50 mA to 5 mA;  
Tj = 25 °C  
-
-
5
-
25  
mV  
[3]  
voltage drift with  
temperature  
VBAT14 = 14 V; IV1 = 5 mA;  
200  
ppm/K  
Tj = 40 °C to +150 °C  
Vdet(UV)(V1)  
undervoltage  
detection and reset  
activation level  
V
BAT14 = 14 V;  
0.90 ×  
VV1(nom)  
0.92 ×  
VV1(nom)  
0.95 ×  
VV1(nom)  
V
V
V
V
V
V
V
V1RTHC[1:0] = 00 or 11  
VBAT14 = 14 V;  
0.80 ×  
VV1(nom)  
0.82 ×  
VV1(nom)  
0.85 ×  
VV1(nom)  
V1RTHC[1:0] = 01  
VBAT14 = 14 V;  
V1RTHC[1:0] = 10  
0.70 ×  
VV1(nom)  
0.72 ×  
VV1(nom)  
0.75 ×  
VV1(nom)  
Vrel(UV)(V1)  
undervoltage  
detection release  
level  
VBAT14 = 14 V;  
V1RTHC[1:0] = 00 or 11  
-
-
-
0.94 ×  
VV1(nom)  
-
-
-
VBAT14 = 14 V;  
0.84 ×  
VV1(nom)  
V1RTHC[1:0] = 01  
VBAT14 = 14 V;  
V1RTHC[1:0] = 10  
0.74 ×  
VV1(nom)  
VUV(VFI)  
IthH(V1)  
IthL(V1)  
IV1  
undervoltage level  
for generating a VFI  
interrupt  
VBAT14 = 14 V; VFIE = 1  
0.90 ×  
VV1(nom)  
0.93 ×  
VV1(nom)  
0.97 ×  
VV1(nom)  
undercurrent  
threshold for  
watchdog enable  
10  
6  
5  
3  
2  
mA  
mA  
undercurrent  
threshold for  
watchdog disable  
1.5  
output current  
capability  
VBAT14 = 9 V to 27 V;  
δVV1 = 0.05 × VV1(nom)  
200  
135  
120  
-
mA  
mA  
mA  
mA  
Ω
VBAT14 = 9 V to 27 V;  
V1 shorted to GND  
200  
110  
VBAT14 = 8 V to 9 V;  
δVV1 = 0.05 × VV1(nom)  
-
-
-
-
120  
150  
5
VBAT14 = 5.5 V to 8 V;  
-
δVV1 = 0.05 × VV1(nom)  
Zds(on)  
regulator impedance VBAT14 = 4 V to 5 V  
between pins BAT14  
3
and V1  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
49 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 26. Static characteristics …continued  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Voltage source; pin V2[4]  
Vo(V2)  
output voltage  
VBAT14 = 9 V to 16 V;  
4.8  
5.0  
5.2  
5.05  
25  
V
IV2 = 50 mA to 5 mA  
VBAT14 = 14 V; IV2 = 10 mA;  
Tj = 25 °C  
4.95  
5.0  
V
ΔVV2  
supply voltage  
regulation  
VBAT14 = 9 V to 16 V;  
IV2 = 10 mA; Tj = 25 °C  
-
1
mV  
mV  
ppm/K  
mA  
mA  
mA  
mA  
V
load regulation  
VBAT14 = 14 V; IV2 = 50 mA  
to 5 mA; Tj = 25 °C  
-
-
50  
[3]  
voltage drift with  
temperature  
VBAT14 = 14 V; IV2 = 10 mA;  
40 °C < Tj < +150 °C  
-
-
200  
120  
-
IV2  
output current  
capability  
VBAT14 = 9 V to 27 V;  
δVV2 = 300 mV  
200  
300  
-
-
VBAT14 = 9 V to 27 V;  
V2 shorted to GND  
-
VBAT14 = 6 V to 8 V;  
δVV2 = 300 mV  
-
80  
50  
4.8  
VBAT14 = 5.5 V;  
-
-
δVV2 = 300 mV  
Vdet(UV)(V2)  
undervoltage  
VBAT14 = 14 V  
4.5  
4.6  
detection threshold  
Voltage source; pin V3  
VBAT42-V3(drop)  
Idet(OL)(V3)  
IL⎪  
VBAT42 to VV3 voltage VBAT42 = 9 V to 52 V;  
-
-
1.0  
60  
5
V
drop  
IV3 = 20 mA  
overload current  
VBAT42 = 9 V to 52 V  
165  
-
mA  
μA  
detection threshold  
leakage current  
VV3 = 0 V; V3C[1:0] = 00  
-
0
System inhibit output; pin SYSINH  
VBAT42-SYSINH(drop) VBAT42 to VSYSINH  
voltage drop  
ISYSINH = 0.2 mA  
-
-
1.0  
-
2.0  
5
V
IL⎪  
leakage current  
VSYSINH = 0 V  
μA  
Inhibit/limp-home output; pin INH/LIMP  
VBAT14-INH(drop)  
VBAT14 to VINH  
voltage drop  
IINH/LIMP = 10 μA;  
ILEN = ILC = 1  
-
0.7  
1.2  
-
1.0  
2.0  
4
V
IINH/LIMP = 200 μA;  
ILEN = ILC = 1  
-
V
Io(INH/LIMP)  
output current  
capability  
VINH/LIMP = 0.4 V;  
ILEN = 1; ILC = 0  
0.8  
-
mA  
μA  
IL⎪  
leakage current  
VINH/LIMP = 0 V to VBAT14  
ILEN = 0  
;
-
5
Wake input; pin WAKE  
Vth(WAKE) wake-up voltage  
threshold  
pull-up input current VWAKE = 0 V  
2.0  
3.3  
-
5.2  
V
IWAKE(pu)  
25  
1.3  
μA  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
50 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 26. Static characteristics …continued  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Serial peripheral interface inputs; pins SDI, SCK and SCS  
VIH(th)  
VIL(th)  
HIGH-level input  
threshold voltage  
0.7 × VV1  
0.3  
50  
-
VV1 + 0.3  
+0.3 × VV1  
400  
V
LOW-level input  
threshold voltage  
-
V
Rpd(SCK)  
Rpu(SCS)  
ISDI  
pull-down resistor at VSCK = 2 V; VV1 2 V  
pin SCK  
130  
130  
-
kΩ  
kΩ  
μA  
pull-up resistor at  
pin SCS  
VSCS = 1 V; VV1 2 V  
50  
400  
input leakage current VSDI = 0 V to VV1  
at pin SDI  
5  
+5  
Serial peripheral interface data output; pin SDO  
IOH  
HIGH-level output  
current  
VSCS = 0 V; VO = VV1 0.4 V  
50  
1.6  
5  
-
-
-
1.6  
20  
mA  
mA  
μA  
IOL  
LOW-level output  
current  
VSCS = 0 V; VO = 0.4 V  
IOL(off)  
OFF-state output  
leakage current  
VSCS = VV1;VO = 0 V to VV1  
+5  
Reset output with clamping detection; pin RSTN  
IOH  
HIGH-level output  
current  
VRSTN = 0.7 × VV1(nom)  
1000  
-
-
-
-
-
50  
μA  
mA  
V
IOL  
LOW-level output  
current  
VRSTN = 0.9 V  
1
5
VOL  
LOW-level output  
voltage  
VV1 = 1.5 V to 5.5 V;  
pull-up resistor to V1 4 kΩ  
0
0.2 × VV1  
VV1 + 0.3  
+0.3 × VV1  
VIH(th)  
VIL(th)  
HIGH-level input  
threshold voltage  
0.7 × VV1  
0.3  
V
LOW-level input  
threshold voltage  
V
Enable output; pin EN  
IOH HIGH-level output  
VOH = VV1 0.4 V  
VOL = 0.4 V  
20  
1.6  
0
-
-
-
1.6  
20  
mA  
mA  
V
current  
IOL  
LOW-level output  
current  
VOL  
LOW-level output  
voltage  
IOL = 20 μA; VV1 = 1.2 V  
0.4  
Interrupt output; pin INTN  
IOL LOW-level output  
current  
CAN transmit data input; pin TXDC  
VOL = 0.4 V  
1.6  
-
15  
mA  
VIH  
HIGH-level input  
voltage  
0.7 × VV1  
0.3  
-
-
VV1 + 0.3  
V
V
VIL  
LOW-level input  
voltage  
+0.3 × VV1  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
51 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 26. Static characteristics …continued  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
RTXDC(pu)  
TXDC pull-up  
resistor  
VTXDC = 0 V  
5
12  
25  
kΩ  
CAN receive data output; pin RXDC  
IOH  
HIGH-level output  
current  
VOH = VV1 0.4 V  
25  
-
-
1.6  
mA  
mA  
IOL  
LOW-level output  
current  
VOL = 0.4 V  
1.6  
25  
High-speed CAN-bus lines; pins CANH and CANL  
Vo(dom)  
CANH dominant  
output voltage  
Active mode; VTXDC = 0 V;  
V2 = 4.75 V to 5.25 V  
2.85  
0.5  
3.6  
1.4  
-
4.25  
2
V
V
V
V
CANL dominant  
output voltage  
Active mode; VTXDC = 0 V;  
VV2 = 4.75 V to 5.25 V  
Vo(m)(dom)  
matching of  
dominant output  
voltage  
RL = 60 Ω; Vo(m)(dom)  
VV2 VCANH VCANL  
=
0.3  
+0.3  
Vo(dif)  
differential bus  
output voltage  
Active mode; VTXDC = 0 V;  
VV2 = 4.75 V to 5.25 V;  
RL = 45 Ω to 65 Ω  
1.5  
-
3
V
Active mode, On-line mode or  
On-line Listen mode;  
50  
0
+50  
mV  
VTXDC = VV1;  
VV2 = 4.75 V to 5.25 V;  
no load  
VO(reces)  
recessive output  
voltage  
Active mode, On-line mode or  
On-line Listen mode;  
2.25  
2.5  
2.75  
V
VTXDC = VV1  
;
VV2 = 4.75 V to 5.25 V;  
RL = 60 Ω  
Off-line mode; RL = 60 Ω  
0.1  
0
+0.1  
0.9  
V
V
Vth(dif)  
differential receiver  
threshold voltage  
Active mode, On-line mode or  
On-line Listen mode;  
VCAN = 30 V to +30 V;  
RL = 60 Ω  
0.5  
0.7  
Off-line mode;  
0.45  
0.7  
1.15  
V
VCAN = 30 V to +30 V;  
RL = 60 Ω; measured from  
recessive to dominant  
Vth(GSD)(cm)  
common-mode bus Active mode; GSTHC = 0;  
voltage threshold V2 = 5 V; RL = 60 Ω;  
level for ground shift Vcm = 0.5 × (VCANH + VCANL  
0.95  
0.3  
1.75  
1
2.45  
1.5  
V
V
)
)
detection  
Active mode; GSTHC = 1;  
V
VV2 = 5 V; RL = 60 Ω;  
Vcm = 0.5 × (VCANH + VCANL  
Io(CANH)(dom)  
CANH dominant  
output current  
Active mode; t < tTXDC(dom)  
VCANH = 0 V; VTXDC = 0 V;  
VV2 = 5 V  
;
100  
75  
45  
mA  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
52 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 26. Static characteristics …continued  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Io(CANL)(dom)  
CANL dominant  
output current  
Active mode; t < tTXDC(dom)  
;
45  
75  
100  
mA  
VCANL = 5 V; VTXDC = 0 V;  
VV2 = 5 V  
Io(reces)  
recessive output  
current  
all CAN modes; V2D = 1;  
5  
-
-
+5  
mA  
VTXDC = VV1  
;
VCAN = 40 V to +40 V  
Active mode, On-line mode or  
On-line Listen mode;  
10  
+10  
μA  
V2D = 0; VTXDC = VV1  
;
VCAN = 0.5 V to +5 V  
Ri  
input resistance  
Active mode, On-line mode or  
On-line Listen mode;  
9
15  
28  
kΩ  
V2D = 1; VTXDC = VV1  
;
VCAN = 40 V to +40 V  
Off-line mode;  
15  
2  
19  
-
22  
0
40  
+2  
52  
20  
10  
50  
kΩ  
%
VCAN = 40 V to +40 V  
Ri(m)  
input resistance  
matching  
VCANH = VCANL  
Ri(dif)  
Ci(cm)  
Ci(dif)  
Rsc(bus)  
differential input  
resistance  
30  
-
kΩ  
pF  
pF  
Ω
[3]  
[3]  
common-mode input  
capacitance  
differential input  
capacitance  
-
-
detectable  
Active mode; VTXDC = 0 V  
0
-
short-circuit  
resistance between  
bus lines and VV2  
,
VBAT14, VBAT42 and  
GND  
CAN-bus common mode stabilization output; pin SPLIT  
Vo  
output voltage  
Active mode, On-line mode or  
On-line Listen mode;  
CSC = V2D = 1;  
0.3 × VV2 0.5 × VV2 0.7 × VV2  
V
ISPLIT= 500 μA  
IL⎪  
leakage current  
Off-line mode OR CSC = 0;  
10  
0
+10  
μA  
VSPLIT = 40 V to +40 V  
LIN transmit data input; pin TXDL  
VIL  
LOW level input  
voltage  
0.3  
-
+0.3 × VV1  
VV1 + 0.3  
25  
V
VIH  
HIGH-level input  
voltage  
0.7 × VV1  
-
V
RTXDL(pu)  
TXDL pull-up resistor VTXDL = 0 V  
5
12  
kΩ  
LIN receive data output; pin RXDL  
IOH  
HIGH-level output  
current  
VRXDL = VV1 0.4 V  
50  
-
1.6  
mA  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
53 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 26. Static characteristics …continued  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
IOL  
LOW-level output  
current  
VRXDL = 0.4 V  
1.6  
-
20  
mA  
LIN-bus line; pin LIN  
Vo(dom) LIN dominant output Active mode;  
0
-
0.20 ×  
VBAT42  
V
V
voltage  
VBAT42 = 7 V to 18 V;  
LDC = 0; t < tTXDL(dom)(dis)  
TXDL = 0 V;  
;
V
RBAT42-LIN = 500 Ω  
Active mode;  
0.7  
1.4  
2.1  
VBAT42 = 7.6 V to 18 V;  
LDC = 1; t < tTXDL(dom)(dis)  
VTXDL = 0 V; ILIN = 40 mA  
;
ILIH  
HIGH-level input  
leakage current  
VLIN = VBAT42; VTXDL = VV1  
10  
10  
0
-
+10  
+10  
μA  
μA  
VBAT42 = 8 V;  
VLIN = 8 V to 18 V;  
VTXDL = VV1  
ILIL  
LOW-level input  
leakage current  
VBAT42 = 12 V; VLIN = 0 V;  
VTXDL = VV1  
100  
-
-
μA  
Io(sc)  
short-circuit output  
current  
Active mode;  
27  
40  
60  
mA  
VLIN = VBAT42 = 12 V;  
VTXDL = 0 V; t < tTXDL(dom)(dis)  
LDC = 0  
;
;
Active mode;  
40  
-
60  
90  
mA  
VLIN = VBAT42 = 18 V;  
VTXDL = 0 V; t < tTXDL(dom)(dis)  
LDC = 0  
Vth(dom)  
Vth(reces)  
Vth(hyst)  
Vth(cen)  
receiver dominant  
state  
VBAT42 = 7 V to 27 V  
VBAT42 = 7 V to 27 V  
VBAT42 = 7 V to 27 V  
VBAT42 = 7 V to 27 V  
-
-
-
0.4 ×  
VBAT42  
V
receiver recessive  
state  
0.6 ×  
VBAT42  
-
V
receiver threshold  
voltage hysteresis  
0.05 ×  
VBAT42  
0.175 ×  
VBAT42  
V
receiver threshold  
voltage center  
0.475 ×  
VBAT42  
0.500 ×  
VBAT42  
0.525 ×  
VBAT42  
V
[3]  
Ci  
IL  
input capacitance  
leakage current  
-
-
10  
pF  
VLIN = 0 V to 18 V  
VBAT42 = 0 V  
5  
0
0
+5  
μA  
μA  
VGND = VBAT42 = 12 V  
10  
+10  
LIN-bus termination resistor connection; pin RTLIN  
VRTLIN  
RTLIN output  
voltage  
Active mode; IRTLIN = 10 μA;  
VBAT42 = 7 V to 27 V  
VBAT42  
1.0  
VBAT42  
0.7  
VBAT42  
0.2  
V
V
Off-line mode;  
VBAT42  
1.2  
VBAT42  
1.0  
-
IRTLIN = 10 μA;  
VBAT42 = 7 V to 27 V  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
54 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 26. Static characteristics …continued  
Tvj = 40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
ΔVRTLIN  
RTLIN load  
regulation  
Active mode;  
-
0.65  
2
V
IRTLIN = 10 μA to 10 mA;  
VBAT42 = 7 V to 27 V  
IRTLIN(pu)  
RTLIN pull-up  
current  
Active mode;  
VRTLIN = VLIN = 0 V;  
t > tLIN(dom)(det)  
150  
150  
10  
60  
60  
0
35  
35  
+10  
μA  
μA  
μA  
Off-line mode;  
VRTLIN = VLIN = 0 V;  
t < tLIN(dom)(det)  
ILL  
LOW-level leakage  
current  
Off-line mode;  
VRTLIN = VLIN = 0 V;  
t > tLIN(dom)(det)  
TEST input; pin TEST  
Vth(TEST) input threshold  
for entering Software  
development mode;  
Tj = 25 °C  
1
5
8
V
voltage  
for entering Forced normal  
mode; Tj = 25 °C  
2
2
10  
4
13.5  
8
V
R(pd)TEST  
pull-down resistor  
between pin TEST and GND  
kΩ  
Temperature detection  
Tj(warn) high junction  
160  
175  
190  
°C  
temperature warning  
level  
[1] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient  
temperature on wafer level (pretesting). Cased products are 100 % tested at 25 °C ambient temperature (final testing). Both pretesting  
and final testing use correlated test conditions to cover the specified temperature and power supply voltage range.  
[2]  
VV1(nom) is 3.3 V or 5 V, depending on the SBC version.  
[3] Not tested in production.  
[4] V2 internally supplies the SBC CAN transceiver. The supply current needed for the CAN transceiver reduces the pin V2 output  
capability. The performance of the CAN transceiver can be impaired if V2 is also used to supply other circuitry while the CAN transceiver  
is in use.  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
55 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
015aaa055  
6
5
4
3
2
V
V1  
(V)  
type 5V0  
I
=
V1  
100 μA  
50 mA  
120 mA  
250 mA  
type 3V3  
2
3
4
5
6
7
V
(V)  
BAT14  
a. Tj = 25 °C.  
015aaa056  
6
V
V1  
(V)  
type 5V0  
5
4
3
2
I
=
V1  
100 μA  
50 mA  
120 mA  
250 mA  
type 3V3  
2
3
4
5
6
7
V
(V)  
BAT14  
b. Tj = 150 °C.  
Fig 17. V1 output voltage (dropout) as a function of battery voltage  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
56 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
001aaf246  
10  
I  
T = +150 °C  
j
I
BAT14  
V1  
(mA)  
8
6
4
2
0
T = 40 °C  
j
+25 °C  
+150 °C  
+25 °C  
40 °C  
(1)  
(2)  
V
BAT14  
= 8 V  
5.5 V  
0
50  
100  
150  
200  
250  
I
(mA)  
V1  
(1) Types 5V0 and 3V3.  
(2) Type 5V0 only.  
a. At Tj = 40 °C, +25 °C and +150 °C.  
001aaf247  
5
I
I  
V1  
BAT14  
(mA)  
4
3
2
1
0
(1)  
(2)  
V
BAT14  
= 9 V to 27 V  
5.5 V  
0
50  
100  
150  
200  
250  
I
(mA)  
V1  
(1) Types 5V0 and 3V3.  
(2) Type 3V3 only.  
b. At Tj = 40 °C to +150 °C.  
Fig 18. V1 quiescent current as a function of output current  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
57 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
015aaa057  
6
4
2
0
type 5V0  
V
V1  
(V)  
type 3V3  
0
40  
80  
120  
160  
I
(mA)  
V1  
VBAT14 = 9 V to 27 V.  
Tj = 25 °C to 125 °C.  
Fig 19. V1 output voltage as a function of output current  
001aaf248  
160  
PSRR  
(dB)  
V
BAT14  
= 14 V  
14 V  
120  
80  
40  
0
T = 25 °C  
j
150 °C  
5.5 V  
25 °C to 150 °C  
(1)  
5.5 V  
150 °C  
2
3
1
10  
10  
10  
f (Hz)  
IV1 = 120 mA.  
(1) Type 5V0 only.  
Fig 20. V1 power supply ripple rejection as a function of frequency  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
58 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
001aaf250  
16  
200  
V
ΔV  
V1  
(mV)  
BAT14  
(V)  
V
BAT14  
12  
100  
ΔV  
V1  
8
0
4
100  
0
100  
200  
300  
400  
500  
t (μs)  
IV1 = 5 mA; C = 1 μF; ESR = 0.01 Ω; Tj = 25 °C.  
a. Line transient response  
001aaf251  
75  
400  
I
ΔV  
V1  
(mV)  
V1  
(mA)  
25  
200  
I
V1  
ΔV  
V1  
25  
75  
0
200  
0
100  
200  
300  
400  
500  
t (μs)  
VBAT14 = 14 V; C = 1 μF; ESR = 0.01 Ω; Tj = 25 °C.  
b. Load transient response  
Fig 21. V1 transient response as a function of time  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
59 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
001aaf249  
1
ESR  
(Ω)  
1  
2  
3  
10  
10  
10  
stable operation area  
unstable operation area  
0
40  
80  
120  
I
V1  
(mA)  
Fig 22. V1 output stability related to ESR value of output capacitor  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
60 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
I
= 30 mA  
load  
BAT42  
BAT14  
V1  
SBC  
100 μF/  
0.1 Ω  
100  
nF  
47 μF/  
0.1 Ω  
V
BAT  
R
load  
100  
nF  
GND  
001aaf572  
a. Switch-on test circuit.  
015aaa058  
6
type 5V0  
V
V1  
(V)  
4
2
0
V
= 8 V  
BAT  
type 3V3  
V
= 5.5 V  
BAT  
V
BAT  
= 12 V  
0
0.4  
0.8  
1.2  
1.6  
2.0  
t (ms)  
b. Behavior at Tj = 25 °C.  
015aaa059  
6
type 5V0  
V
V1  
(V)  
V
= 8 V  
BAT  
4
2
0
type 3V3  
V
= 5.5 V  
BAT  
V
= 12 V  
BAT  
0
0.4  
0.8  
1.2  
1.6  
2.0  
t (ms)  
c. Behavior at Tj = 85 °C.  
Fig 23. Switch-on behavior of VV1  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
61 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
10. Dynamic characteristics  
Table 27. Dynamic characteristics  
Tvj = 40 °C to +150 °C; VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Serial peripheral interface timing; pins SCS, SCK, SDI and SDO (see Figure 24)[2]  
Tcyc  
tlead  
clock cycle time  
enable lead time  
960  
240  
-
-
-
-
ns  
ns  
clock is LOW when SPI select  
falls  
tlag  
enable lag time  
clock is LOW when SPI select  
rises  
240  
-
-
ns  
tSCKH  
tSCKL  
tsu  
clock HIGH time  
480  
480  
80  
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
clock LOW time  
-
input data setup time  
input data hold time  
output data valid time  
SPI select HIGH time  
-
th  
400  
-
-
tDOV  
tSSH  
pin SDO; CL = 10 pF  
400  
-
480  
CAN transceiver timing; pins CANL, CANH, TXDC and RXDC  
tt(reces-dom)  
tt(dom-reces)  
tPHL  
output transition time  
recessive to dominant  
10 % to 90 %; C = 100 pF;  
R = 60 Ω; see Figure 25 and  
Figure 26  
-
100  
100  
120  
120  
-
-
ns  
ns  
ns  
ns  
ms  
μs  
μs  
output transition time  
dominant to recessive  
90 % to 10 %; C = 100 pF;  
R = 60 Ω; see Figure 25 and  
Figure 26  
-
-
propagation delay TXDC to 50 % VTXDC to 50 % VRXDC  
RXDC (HIGH-to-LOW  
transition)  
;
70  
70  
1.5  
3
220  
C = 100 pF; R = 60 Ω; see  
Figure 25 and Figure 26  
tPLH  
propagation delay TXDC to 50 % VTXDC to 50 % VRXDC  
RXDC (LOW-to-HIGH  
transition)  
;
220  
C = 100 pF; R = 60 Ω; see  
Figure 25 and Figure 26  
tTXDC(dom)  
TXDC permanent dominant Active mode, On-line mode or  
disable time  
6
-
On-line Listen mode;  
VV2 = 5 V; VTXDC = 0 V  
tCANH(dom1)  
tCANL(dom1)  
,
minimum dominant time first Off-line mode  
pulse for wake-up on pins  
CANH and CANL  
-
tCANH(reces)  
tCANL(reces)  
,
minimum recessive time  
pulse (after first dominant)  
for wake-up on pins CANH  
and CANL  
Off-line mode  
1
-
-
tCANH(dom2)  
tCANL(dom2)  
,
minimum dominant time  
second pulse for wake-up on  
pins CANH, CANL  
Off-line mode  
1
-
-
-
μs  
ttimeout  
time-out period between  
wake-up message and  
confirm message  
On-line Listen mode  
115  
285  
ms  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
62 of 76  
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
Table 27. Dynamic characteristics …continued  
Tvj = 40 °C to +150 °C; VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
toff-line  
maximum time before  
entering Off-line mode  
On-line or On-line Listen mode;  
TXDC = VV1; V2D = 1; COTC =  
0; no bus activity  
50  
-
66  
ms  
On-line or On-line Listen mode;  
TXDC = VV1; V2D = 1; COTC =  
1; no bus activity  
200  
400  
-
-
265  
530  
ms  
ms  
toff-line(ext)  
extended minimum time  
before entering Off-line  
mode  
On-line or On-line Listen mode  
after CAN wake-up event;  
TXDC = VV1; V2D = 1; no bus  
activity  
LIN transceiver; pins LIN, TXDL and RXDL[3]  
[4]  
[5]  
[4]  
[5]  
δ1  
δ2  
δ3  
δ4  
duty cycle 1  
duty cycle 2  
duty cycle 3  
duty cycle 4  
Vth(reces)(max) = 0.744 × VBAT42  
;
0.396  
-
-
-
-
-
Vth(dom)(max) = 0.581 × VBAT42  
;
LSC = 0; tbit = 50 μs;  
VBAT42 = 7 V to 18 V  
V
th(reces)(min) = 0.422 × VBAT42  
;
-
0.581  
Vth(dom)(min) = 0.284 × VBAT42  
;
LSC = 0; tbit = 50 μs;  
VBAT42 = 7.6 V to 18 V  
V
th(reces)(max) = 0.778 × VBAT42  
;
0.417  
-
Vth(dom)(max) = 0.616 × VBAT42  
;
LSC = 1; tbit = 96 μs;  
VBAT42 = 7 V to 18 V  
V
th(reces)(min) = 0.389 × VBAT42  
;
-
0.590  
Vth(dom)(min) = 0.251 × VBAT42  
LSC = 1; tbit = 96 μs;  
;
VBAT42 = 7.6 V to 18 V  
tp(rx)  
propagation delay of  
receiver  
CRXDL = 20 pF  
-
-
-
-
6
μs  
μs  
μs  
tp(rx)(sym)  
tBUS(LIN)  
symmetry of receiver  
propagation delay  
rising edge with respect to  
falling edge; CRXDL = 20 pF  
2  
30  
+2  
150  
minimum dominant time for Off-line mode  
wake-up of the  
LIN-transceiver  
tLIN(dom)(det)  
continuously dominant  
clamped LIN-bus detection  
time  
Active mode; LIN = 0 V  
40  
0.8  
20  
-
-
-
160  
2.2  
80  
ms  
ms  
ms  
tLIN(dom)(rec)  
continuously dominant  
clamped LIN-bus recovery  
time  
Active mode  
tTXDL(dom)(dis) TXDL permanent dominant Active mode; TXDL = 0 V  
disable time  
Battery monitoring  
tBAT42(L)  
BAT42 LOW time for setting  
PWONS  
5
5
-
-
20  
20  
μs  
μs  
tSENSE(L)  
BAT42 LOW time for setting  
BATFI  
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High-speed CAN/LIN fail-safe system basis chip  
Table 27. Dynamic characteristics …continued  
Tvj = 40 °C to +150 °C; VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Power supply V1; pin V1  
tV1(CLT) V1 clamped LOW time  
during ramp-up of V1  
Power supply V2; pin V2  
tV2(CLT) V2 clamped LOW time  
during ramp-up of V2  
Power supply V3; pin V3  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Start-up mode; V1 active  
229  
-
283  
ms  
V2 active  
28  
-
36  
ms  
tw(CS)  
cyclic sense period  
V3C[1:0] = 10; see Figure 14  
V3C[1:0] = 11; see Figure 14  
V3C[1:0] = 10; see Figure 14  
V3C[1:0] = 11; see Figure 14  
14  
-
-
-
-
18  
ms  
ms  
μs  
28  
36  
ton(CS)  
cyclic sense on-time  
345  
345  
423  
423  
μs  
Wake-up input; pin WAKE  
tWU(ipf) input port filter time  
VBAT42 = 5 V to 27 V  
VBAT42 = 27 V to 52 V  
5
-
-
-
120  
250  
390  
μs  
μs  
μs  
30  
310  
tsu(CS)  
cyclic sense sample setup  
time  
V3C[1:0] = 11 or 10;  
see Figure 14  
Watchdog  
tWD(ETP)  
earliest watchdog trigger  
point  
programmed Nominal  
Watchdog Period (NWP);  
Normal mode  
0.45 × NWP -  
0.55 × NWP  
1.1 × NWP  
tWD(LTP)  
latest watchdog trigger point programmed nominal  
watchdog period; Normal  
0.9 × NWP  
-
mode, Standby mode and  
Sleep mode  
tWD(init)  
watchdog initializing period watchdog time-out in Start-up  
mode  
229  
1.3  
-
283  
1.7  
ms  
s
Fail-safe mode  
tret  
retention time  
Fail-safe mode; wake-up  
detected  
1.5  
Reset output; pin RSTN  
tRSTN(CHT)  
clamped HIGH time,  
pin RSTN  
RSTN driven LOW internally  
but RSTN pin remains HIGH  
115  
229  
-
-
141  
283  
ms  
ms  
tRSTN(CLT)  
clamped LOW time,  
pin RSTN  
RSTN driven HIGH internally  
but RSTN pin remains LOW  
tRSTN(INT)  
tRSTNL  
interrupt monitoring time  
reset lengthening time  
INTN = 0  
229  
0.9  
-
-
283  
1.1  
ms  
ms  
after internal or external reset  
has been released; RLC = 0  
after internal or external reset  
has been released; RLC =1  
18  
-
22  
ms  
UJA1065_7  
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Product data sheet  
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64 of 76  
UJA1065  
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High-speed CAN/LIN fail-safe system basis chip  
Table 27. Dynamic characteristics …continued  
Tvj = 40 °C to +150 °C; VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 VBAT14 1 V; unless otherwise specified. All  
voltages are defined with respect to ground. Positive currents flow into the IC.[1]  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Interrupt output; pin INTN  
tINTN  
interrupt release  
after SPI has read out the  
Interrupt register  
2
-
-
μs  
Oscillator  
fosc  
oscillator frequency  
460.8  
512  
563.2  
kHz  
[1] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient  
temperature on wafer level (pretesting). Cased products are 100 % tested at 25 °C ambient temperature (final testing). Both pretesting  
and final testing use correlated test conditions to cover the specified temperature and power supply voltage range.  
[2] SPI timing is guaranteed for VBAT42 voltages down to 5 V. For VBAT42 voltages down to 4.5 V the guaranteed SPI timing values double,  
so at these lower voltages a lower maximum SPI communication speed must be observed.  
[3]  
tbit = selected bit time, depends on LSC bit; 50 μs or 96 μs (20 kbit/s or 10.4 kbit/s respectively); bus load conditions (R1/R2/C1):  
1 kΩ/1 kΩ/10 nF; 1 kΩ/2 kΩ/6.8 nF; 1 kΩ/open/1 nF; see Figure 27 and Figure 28.  
tbus(rec)(min)  
[4] δ1, δ3 =  
[5] δ2, δ4 =  
-------------------------------  
2 × tbit  
tbus(rec)(max)  
-------------------------------  
2 × tbit  
SCS  
t
t
t
SSH  
T
cyc  
lead  
lag  
t
t
SCKL  
SCKH  
SCK  
SDI  
t
su  
t
h
MSB  
LSB  
X
X
t
DOV  
floating  
floating  
SDO  
X
MSB  
LSB  
001aaa405  
Fig 24. SPI timing  
UJA1065_7  
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Product data sheet  
Rev. 07 — 25 February 2010  
65 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
BAT42  
RXDC  
BAT14  
CANH  
10 pF  
R
C
SBC  
TXDC  
CANL  
GND  
V2  
C
b
001aac308  
Fig 25. Timing test circuit for CAN transceiver  
HIGH  
LOW  
TXDC  
CANH  
CANL  
dominant  
recessive  
HIGH  
V
o(dif)  
RXDC  
LOW  
t
t
t(dom-reces)  
t(reces-dom)  
t
t
PLH  
PHL  
001aac309  
Fig 26. Timing diagram CAN transceiver  
UJA1065_7  
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Product data sheet  
Rev. 07 — 25 February 2010  
66 of 76  
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
BAT42  
SBC  
GND  
RXDL  
TXDL  
RTLIN  
R1  
R2  
C1  
20 pF  
LIN  
001aad179  
Fig 27. Timing test circuit for LIN transceiver  
t
bit  
t
bit  
t
bit  
V
TXDL  
t
t
bus(rec)(min)  
bus(dom)(max)  
V
BAT42  
V
V
th(reces)(max)  
thresholds of  
receiving node 1  
th(dom)(max)  
LIN BUS  
signal  
V
V
th(reces)(min)  
thresholds of  
receiving node 2  
th(dom)(min)  
t
t
bus(rec)(max)  
bus(dom)(min)  
V
V
RXDL1  
receiving  
node 1  
t
t
p(rx)r  
p(rx)f  
RXDL2  
receiving  
node 2  
t
t
p(rx)f  
p(rx)r  
001aaa346  
Fig 28. Timing diagram LIN transceiver  
11. Test information  
11.1 Quality information  
This product has been qualified in accordance with the Automotive Electronics Council  
(AEC) standard Q100 - Stress test qualification for integrated circuits, and is suitable for  
use in automotive applications.  
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Product data sheet  
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UJA1065  
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High-speed CAN/LIN fail-safe system basis chip  
12. Package outline  
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;  
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad  
SOT549-1  
E
A
D
X
c
H
v
M
A
y
exposed die pad side  
E
D
h
Z
32  
17  
A
(A )  
3
2
E
A
h
A
1
pin 1 index  
θ
L
p
L
detail X  
1
16  
w
M
b
e
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions).  
A
(1)  
(2)  
UNIT  
A
A
A
b
c
D
D
E
E
e
H
L
L
p
v
w
y
Z
θ
1
2
3
p
h
h
E
max.  
8o  
0o  
0.15 0.95  
0.05 0.85  
0.30 0.20 11.1  
0.19 0.09 10.9  
5.1  
4.9  
6.2  
6.0  
3.6  
3.4  
8.3  
7.9  
0.75  
0.50  
0.78  
0.48  
mm  
1.1  
0.65  
1
0.2  
0.25  
0.1  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
03-04-07  
05-11-02  
SOT549-1  
MO-153  
Fig 29. Package outline SOT549-1 (HTSSOP32)  
UJA1065_7  
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Product data sheet  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
13. Soldering of SMD packages  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
13.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached to  
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both  
the mechanical and the electrical connection. There is no single soldering method that is  
ideal for all IC packages. Wave soldering is often preferred when through-hole and  
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
13.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from  
a standing wave of liquid solder. The wave soldering process is suitable for the following:  
Through-hole components  
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
Board specifications, including the board finish, solder masks and vias  
Package footprints, including solder thieves and orientation  
The moisture sensitivity level of the packages  
Package placement  
Inspection and repair  
Lead-free soldering versus SnPb soldering  
13.3 Wave soldering  
Key characteristics in wave soldering are:  
Process issues, such as application of adhesive and flux, clinching of leads, board  
transport, the solder wave parameters, and the time during which components are  
exposed to the wave  
Solder bath specifications, including temperature and impurities  
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Product data sheet  
Rev. 07 — 25 February 2010  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
13.4 Reflow soldering  
Key characteristics in reflow soldering are:  
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus  
reducing the process window  
Solder paste printing issues including smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
Reflow temperature profile; this profile includes preheat, reflow (in which the board is  
heated to the peak temperature) and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder paste  
characteristic). In addition, the peak temperature must be low enough that the  
packages and/or boards are not damaged. The peak temperature of the package  
depends on package thickness and volume and is classified in accordance with  
Table 28 and 29  
Table 28. SnPb eutectic process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
235  
350  
220  
< 2.5  
2.5  
220  
220  
Table 29. Lead-free process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
> 2000  
260  
< 1.6  
260  
250  
245  
1.6 to 2.5  
> 2.5  
260  
245  
250  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 30.  
UJA1065_7  
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Product data sheet  
Rev. 07 — 25 February 2010  
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UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Fig 30. Temperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note AN10365  
“Surface mount reflow soldering description”.  
UJA1065_7  
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Product data sheet  
Rev. 07 — 25 February 2010  
71 of 76  
UJA1065  
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High-speed CAN/LIN fail-safe system basis chip  
14. Revision history  
Table 30. Revision history  
Document ID  
UJA1065_7  
Release date  
Data sheet status  
Change notice  
Supersedes  
20100225  
Product data sheet  
-
UJA1065_6  
Modifications:  
3.0 V version (UJA1065TW/3V0) discontinued  
Section 6.2.5: text of third paragraph revised  
Table 11: text of bit 4, V1CMC, revised  
Section 11.1: text revised  
Section 2.1: text revised  
UJA1065_6  
UJA1065_5  
UJA1065_4  
UJA1065_3  
UJA1065_2  
UJA1065_1  
20071122  
20061116  
20060818  
20060221  
20051216  
20050810  
Product data sheet  
Product data sheet  
Product data sheet  
Preliminary data sheet  
Preliminary data sheet  
Objective data sheet  
-
-
-
-
-
-
UJA1065_5  
UJA1065_4  
UJA1065_3  
UJA1065_2  
UJA1065_1  
-
UJA1065_7  
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Product data sheet  
Rev. 07 — 25 February 2010  
72 of 76  
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
15.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on a weakness or default in the  
customer application/use or the application/use of customer’s third party  
customer(s) (hereinafter both referred to as “Application”). It is customer’s  
sole responsibility to check whether the NXP Semiconductors product is  
suitable and fit for the Application planned. Customer has to do all necessary  
testing for the Application in order to avoid a default of the Application and the  
product. NXP Semiconductors does not accept any liability in this respect.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
15.3 Disclaimers  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Non-automotive qualified products — Unless the data sheet of an NXP  
Semiconductors product expressly states that the product is automotive  
qualified, the product is not suitable for automotive use. It is neither qualified  
nor tested in accordance with automotive testing or application requirements.  
NXP Semiconductors accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
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Product data sheet  
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NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
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Product data sheet  
Rev. 07 — 25 February 2010  
74 of 76  
 
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
17. Contents  
1
General description. . . . . . . . . . . . . . . . . . . . . . 1  
6.7.4  
Bus, RXD and TXD failure detection . . . . . . . 22  
TXDC dominant clamping . . . . . . . . . . . . . . . 22  
RXDC recessive clamping . . . . . . . . . . . . . . . 22  
GND shift detection . . . . . . . . . . . . . . . . . . . . 23  
LIN transceiver. . . . . . . . . . . . . . . . . . . . . . . . 23  
Mode control . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Active mode . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Off-line mode . . . . . . . . . . . . . . . . . . . . . . . . . 24  
LIN wake-up. . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Termination control. . . . . . . . . . . . . . . . . . . . . 24  
LIN slope control . . . . . . . . . . . . . . . . . . . . . . 25  
LIN driver capability . . . . . . . . . . . . . . . . . . . . 25  
Bus and TXDL failure detection . . . . . . . . . . . 25  
TXDL dominant clamping. . . . . . . . . . . . . . . . 25  
LIN dominant clamping . . . . . . . . . . . . . . . . . 25  
LIN recessive clamping . . . . . . . . . . . . . . . . . 25  
Inhibit and limp-home output . . . . . . . . . . . . . 25  
Wake-up input . . . . . . . . . . . . . . . . . . . . . . . . 26  
Interrupt output. . . . . . . . . . . . . . . . . . . . . . . . 27  
Temperature protection . . . . . . . . . . . . . . . . . 27  
SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . 28  
SPI register mapping . . . . . . . . . . . . . . . . . . . 29  
Register overview . . . . . . . . . . . . . . . . . . . . . 29  
Mode register. . . . . . . . . . . . . . . . . . . . . . . . . 30  
System Status register. . . . . . . . . . . . . . . . . . 32  
System Diagnosis register . . . . . . . . . . . . . . . 34  
Interrupt Enable register and Interrupt  
6.7.4.1  
6.7.4.2  
6.7.4.3  
6.8  
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
CAN transceiver . . . . . . . . . . . . . . . . . . . . . . . . 2  
LIN transceiver . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Power management . . . . . . . . . . . . . . . . . . . . . 3  
Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 3  
2.1  
2.2  
2.3  
2.4  
2.5  
6.8.1  
6.8.1.1  
6.8.1.2  
6.8.2  
6.8.3  
6.8.4  
6.8.5  
6.8.6  
6.8.6.1  
6.8.6.2  
6.8.6.3  
6.9  
6.10  
6.11  
6.12  
6.13  
6.13.1  
6.13.2  
6.13.3  
6.13.4  
6.13.5  
6.13.6  
3
4
Ordering information. . . . . . . . . . . . . . . . . . . . . 4  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5  
6
6.1  
6.2  
Functional description . . . . . . . . . . . . . . . . . . . 7  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Fail-safe system controller . . . . . . . . . . . . . . . . 7  
Start-up mode. . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Restart mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Fail-safe mode . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . 10  
Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Flash mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
On-chip oscillator . . . . . . . . . . . . . . . . . . . . . . 12  
Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Watchdog start-up behavior . . . . . . . . . . . . . . 13  
Watchdog window behavior . . . . . . . . . . . . . . 13  
Watchdog time-out behavior. . . . . . . . . . . . . . 14  
Watchdog OFF behavior. . . . . . . . . . . . . . . . . 14  
System reset. . . . . . . . . . . . . . . . . . . . . . . . . . 15  
RSTN pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
EN output . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Power supplies . . . . . . . . . . . . . . . . . . . . . . . . 17  
BAT14, BAT42 and SYSINH. . . . . . . . . . . . . . 17  
SYSINH output . . . . . . . . . . . . . . . . . . . . . . . . 17  
SENSE input. . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Voltage regulators V1 and V2. . . . . . . . . . . . . 17  
Voltage regulator V1 . . . . . . . . . . . . . . . . . . . . 17  
Voltage regulator V2 . . . . . . . . . . . . . . . . . . . . 18  
Switched battery output V3. . . . . . . . . . . . . . . 18  
CAN transceiver . . . . . . . . . . . . . . . . . . . . . . . 19  
Mode control. . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Active mode . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
On-line mode . . . . . . . . . . . . . . . . . . . . . . . . . 21  
On-line Listen mode . . . . . . . . . . . . . . . . . . . . 21  
Off-line mode . . . . . . . . . . . . . . . . . . . . . . . . . 21  
CAN wake-up . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Termination control . . . . . . . . . . . . . . . . . . . . . 22  
6.2.1  
6.2.2  
6.2.3  
6.2.4  
6.2.5  
6.2.6  
6.2.7  
6.3  
6.4  
6.4.1  
6.4.2  
6.4.3  
6.4.4  
6.5  
6.5.1  
6.5.2  
6.6  
6.6.1  
6.6.1.1  
6.6.2  
6.6.3  
6.6.3.1  
6.6.3.2  
6.6.4  
6.7  
6.7.1  
6.7.1.1  
6.7.1.2  
6.7.1.3  
6.7.1.4  
6.7.2  
6.7.3  
Enable Feedback register . . . . . . . . . . . . . . . 35  
Interrupt register. . . . . . . . . . . . . . . . . . . . . . . 36  
System Configuration register and System  
Configuration Feedback register . . . . . . . . . . 38  
Physical Layer Control register and Physical  
6.13.7  
6.13.8  
6.13.9  
Layer Control Feedback register . . . . . . . . . . 39  
6.13.10 Special Mode register and Special Mode  
Feedback register . . . . . . . . . . . . . . . . . . . . . 40  
6.13.11 General Purpose registers and General  
Purpose Feedback registers . . . . . . . . . . . . . 41  
6.13.12 Register configurations at reset . . . . . . . . . . . 41  
6.14  
6.14.1  
6.14.2  
Test modes. . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
Software development mode . . . . . . . . . . . . . 44  
Forced normal mode . . . . . . . . . . . . . . . . . . . 45  
7
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 46  
Thermal characteristics . . . . . . . . . . . . . . . . . 47  
Static characteristics . . . . . . . . . . . . . . . . . . . 47  
Dynamic characteristics. . . . . . . . . . . . . . . . . 62  
Test information . . . . . . . . . . . . . . . . . . . . . . . 67  
Quality information. . . . . . . . . . . . . . . . . . . . . 67  
8
9
10  
11  
11.1  
continued >>  
UJA1065_7  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 07 — 25 February 2010  
75 of 76  
 
UJA1065  
NXP Semiconductors  
High-speed CAN/LIN fail-safe system basis chip  
12  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 68  
13  
Soldering of SMD packages . . . . . . . . . . . . . . 69  
Introduction to soldering . . . . . . . . . . . . . . . . . 69  
Wave and reflow soldering . . . . . . . . . . . . . . . 69  
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 69  
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 70  
13.1  
13.2  
13.3  
13.4  
14  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 72  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 73  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 73  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 73  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 73  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 74  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 74  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 25 February 2010  
Document identifier: UJA1065_7  

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