UJA1069TW/3V3 [NXP]
IC DATACOM, ETHERNET TRANSCEIVER, PDSO32, 6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT549-1, HTSSOP-32, Network Interface;型号: | UJA1069TW/3V3 |
厂家: | NXP |
描述: | IC DATACOM, ETHERNET TRANSCEIVER, PDSO32, 6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT549-1, HTSSOP-32, Network Interface 以太网:16GBASE-T 电信 光电二极管 电信集成电路 |
文件: | 总64页 (文件大小:299K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
UJA1069
LIN fail-safe system basis chip
Rev. 03 — 10 September 2007
Product data sheet
1. General description
The UJA1069 fail-safe System Basis Chip (SBC) replaces basic discrete components
which are common in every Electronic Control Unit (ECU) with a Local Interconnect
Network (LIN) interface. The fail-safe SBC supports all networking applications which
control various power and sensor peripherals by using LIN as a local sub-bus. The
fail-safe SBC contains the following integrated devices:
• LIN transceiver compliant with LIN 2.0 and SAE J2602, and compatible with LIN 1.3
• Advanced independant watchdog
• Dedicated voltage regulator for microcontroller
• Serial peripheral interface (full duplex)
• Local wake-up input port
• Inhibit/limp-home output port
In addition to the advantages of integrating these common ECU functions in a single
package, the fail-safe SBC offers an intelligent combination of system-specific functions
such as:
• Advanced low-power concept
• Safe and controlled system start-up behavior
• Advanced fail-safe system behavior that prevents any conceivable deadlock
• Detailed status reporting on system and sub-system levels
The UJA1069 is designed to be used in combination with a microcontroller and a LIN
controller. The fail-safe SBC ensures that the microcontroller is always started up in a
defined manner. In failure situations the fail-safe SBC will maintain the microcontroller
function for as long as possible, to provide full monitoring and software driven fall-back
operation.
The UJA1069 is designed for 14 V single power supply architectures and for 14 V and
42 V dual power supply architectures.
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
2. Features
2.1 General
I Contains a full set of LIN ECU functions:
N LIN transceiver
N Voltage regulator for the microcontroller (3.0 V, 3.3 V or 5.0 V)
N Enhanced window watchdog with on-chip oscillator
N Serial Peripheral Interface (SPI) for the microcontroller
N ECU power management system
N Fully integrated autonomous fail-safe system
I Designed for automotive applications:
N Supports 14 V and 42 V architectures
N Excellent ElectroMagnetic Compatibility (EMC) performance
N ±8 kV ElectroStatic Discharge (ESD) protection Human Body Model (HBM) for
off-board pins
N ±4 kV ElectroStatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins
N ±60 V short-circuit proof LIN-bus pin
N Battery and LIN-bus pins are protected against transients in accordance with
ISO 7637-3
N Very low sleep current
I Supports remote flash programming via the LIN-bus
I Available in:
N Small 6.4 mm × 7.8 mm HTSSOP24 package with low thermal resistance
N Small 8 mm × 11 mm HTSSOP32 package with low thermal resistance
2.2 LIN transceiver
I LIN 2.0 and SAE J2602 compliant LIN transceiver
I Enhanced error signalling and reporting
I Downward compatible with LIN 1.3 and the TJA1020
2.3 Power management
I Smart operating modes and power management modes
I Cyclic wake-up capability in Standby and Sleep mode
I Local wake-up input with cyclic supply feature
I Remote wake-up capability via the LIN-bus
I External voltage regulators can easily be incorporated in the power supply system
(flexible and fail-safe)
I 42 V battery related high-side switch for driving external loads such as relays and
wake-up switches
I Intelligent maskable interrupt output
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
2 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
2.4 Fail-safe features
I Safe and predictable behavior under all conditions
I Programmable fail-safe coded window and time-out watchdog with on-chip oscillator,
guaranteeing autonomous fail-safe system supervision
I Fail-safe coded 16-bit SPI interface for the microcontroller
I Global enable pin for the control of safety-critical hardware
I Detection and detailed reporting of failures:
N On-chip oscillator failure and watchdog alerts
N Battery and voltage regulator undervoltages
N LIN-bus failures (short-circuits)
N TXD and RXD clamping situations and short-circuits
N Clamped or open reset line
N SPI message errors
N Overtemperature warning
I Rigorous error handling based on diagnostics
I Supply failure early warning allows critical data to be stored
I 23 bits of access-protected RAM is available e.g. for logging of cyclic problems
I Reporting in a single SPI message; no assembly of multiple SPI frames needed
I Limp-home output signal for activating application hardware in case system enters
Fail-safe mode (e.g. for switching on warning lights)
I Fail-safe coded activation of Software development mode and Flash mode
I Unique SPI readable device type identification
I Software-initiated system reset
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
UJA1069TW[1]
HTSSOP32
plastic thermal enhanced thin shrink small outline package; 32 leads; SOT549-1
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
UJA1069TW24[2] HTSSOP24
plastic thermal enhanced thin shrink small outline package; 24 leads; SOT864-1
body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
[1] UJA1069TW/5V0 is for the 5 V version; UJA1069TW/3V3 is for the 3.3 V version; UJA1069TW/3V0 is for the 3 V version.
[2] UJA1069TW24/5V0 is for the 5 V version; UJA1069TW24/3V3 is for the 3.3 V version; UJA1069TW/3V0 is for the 3 V version.
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
3 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
4. Block diagram
31 (23)
SENSE
BAT
MONITOR
32 (24)
BAT42
27 (19)
BAT14
(3) 4
V1
V1
UJA1069
29 (21)
SYSINH
30 (22)
V3
17 (13)
INH/LIMP
INH
V1 MONITOR
7 (6)
INTN
18 (14)
WAKE
TEST
(5) 6
(7) 8
WAKE
RESET/EN
WATCHDOG
OSCILLATOR
RSTN
EN
16 (12)
SBC
FAIL-SAFE
SYSTEM
CHIP
TEMPERATURE
11 (10)
9 (8)
SCK
SDI
SPI
10 (9)
12 (11)
SDO
SCS
26 (18)
25 (17)
3 (2)
RTLIN
LIN
LIN
TXDL
RXDL
5 (4)
23 (15)
GND
BAT42
001aad669
The pin numbers in parenthesis are for the UJA1069TW24 version.
Fig 1. Block diagram
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
4 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
5. Pinning information
5.1 Pinning
1
2
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
n.c.
n.c.
BAT42
SENSE
V3
3
TXDL
V1
4
SYSINH
n.c.
5
RXDL
RSTN
INTN
EN
6
BAT14
RTLIN
LIN
7
8
UJA1069TW
9
SDI
n.c.
10
11
12
13
14
15
16
SDO
SCK
SCS
n.c.
GND
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
WAKE
INH/LIMP
TEST
001aad676
Fig 2. Pin configuration (HTSSOP32)
1
2
24
23
22
21
20
19
n.c.
TXDL
V1
BAT42
SENSE
V3
3
4
RXDL
RSTN
INTN
EN
SYSINH
n.c.
5
6
BAT14
RTLIN
LIN
UJA1069TW24
7
18
17
16
15
14
13
8
SDI
9
SDO
SCK
SCS
TEST
n.c.
10
11
12
GND
WAKE
INH/LIMP
001aad677
Fig 3. Pin configuration (HTSSOP24)
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
5 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
5.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
HTSSOP32 HTSSOP24
n.c.
1
2
3
1
-
not connected
not connected
n.c.
TXDL
2
LIN transmit data input (LOW for dominant, HIGH for
recessive)
V1
4
5
6
7
3
4
5
6
voltage regulator output for the microcontroller (3 V, 3.3 V
or 5 V depending on the SBC version)
RXDL
RSTN
INTN
LIN receive data output (LOW when dominant, HIGH
when recessive)
reset output to microcontroller (active LOW; will detect
clamping situations)
interrupt output to microcontroller (active LOW;
open-drain, wire-AND this pin to other ECU interrupt
outputs)
EN
8
7
enable output (active HIGH; push-pull, LOW with every
reset / watchdog overflow)
SDI
9
8
SPI data input
SDO
SCK
SCS
n.c.
10
11
12
13
14
15
16
17
9
SPI data output (floating when pin SCS is HIGH)
SPI clock input
10
11
-
SPI chip select input (active LOW)
not connected
n.c.
-
not connected
n.c.
-
not connected
TEST
INH/LIMP
12
13
test pin (should be connected to ground in application)
inhibit / limp home output (BAT14 related, push-pull,
default floating)
WAKE
18
14
local wake-up input (BAT42 related, continuous or cyclic
sampling)
n.c.
19
20
21
22
23
24
25
26
27
28
29
-
not connected
n.c.
-
not connected
n.c.
-
not connected
n.c.
-
not connected
GND
n.c.
15
16
17
18
19
20
21
ground
not connected
LIN
LIN bus line (LOW in dominant state)
LIN-bus termination resistor connection
14 V battery supply input
not connected
RTLIN
BAT14
n.c.
SYSINH
system inhibit output (BAT42 related; e.g. for controlling
external DC-to-DC converter)
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
6 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Table 2.
Pin description …continued
Pin
Symbol
Description
HTSSOP32 HTSSOP24
V3
30
22
unregulated 42 V output (BAT42 related; continuous
output, or cyclic mode synchronized with local wake-up
input)
SENSE
BAT42
31
32
23
24
fast battery interrupt / chatter detector input
42 V battery supply input (connect this pin to BAT14 in
14 V applications)
The exposed die pad at the bottom of the package allows better dissipation of heat from
the SBC via the printed-circuit board. The exposed die pad is not connected to any active
part of the IC and can be left floating, or can be connected to GND for the best EMC
performance.
6. Functional description
6.1 Introduction
The UJA1069 combines all peripheral functions around a microcontroller within typical
automotive networking applications into one dedicated chip. The functions are as follows:
• Power supply for the microcontroller
• Switched BAT42 output
• System reset
• Watchdog with Window mode and Time-out mode
• On-chip oscillator
• LIN transceiver for serial communication
• SPI control interface
• Local wake-up input
• Inhibit or limp-home output
• System inhibit output port
• Compatibility with 42 V power supply systems
• Fail-safe behavior
6.2 Fail-safe system controller
The fail-safe system controller is the core of the UJA1069 and is supervised by a
watchdog timer which is clocked directly by the dedicated on-chip oscillator. The system
controller manages the register configuration and controls all internal functions of the
SBC. Detailed device status information is collected and presented to the microcontroller.
The system controller also provides the reset and interrupt signals.
The fail-safe system controller is a state machine. The different operating modes and the
transitions between these modes are illustrated in Figure 4. The following sections give
further details about the SBC operating modes.
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
mode change via SPI
watchdog
trigger
Standby mode
V1: ON
SYSINH: HIGH
LIN: off-line
watchdog: time-out/OFF
INH/LIMP: HIGH/LOW/float
EN: HIGH/LOW
mode change via SPI
mode change via SPI
watchdog
trigger
wake-up detected with its wake-up interrupt disabled
OR mode change to Sleep with pending wake-up
mode change via SPI
OR watchdog time-out with watchdog timeout interrupt disabled
Sleep mode
Normal mode
OR watchdog OFF and I > I
V1
with reset option
thH(V1)
OR interrupt ignored > t
RSTN(INT)
V1: OFF
SYSINH: HIGH/float
LIN: off-line
V1: ON
OR RSTN falling edge detected
OR V1 undervoltage detected
OR illegal Mode register code
SYSINH: HIGH
flash entry enabled (111/001/111 mode sequence)
OR mode change to Sleep with pending wake-up
OR watchdog not properly served
LIN: all modes available
watchdog: window
INH/LIMP: HIGH/LOW/float
EN: HIGH/LOW
watchdog: time-out/OFF
INH/LIMP: LOW/float
RSTN: LOW
OR interrupt ignored > t
RSTN(INT)
OR RSTN falling edge detected
OR V1 undervoltage detected
OR illegal Mode register code
EN: LOW
wake-up detected
OR watchdog time-out
OR V3 overload detected
init Normal mode
via SPI successful
Start-up mode
V1: ON
SYSINH: HIGH
init Normal mode
via SPI successful
supply connected
for the first time
LIN: off-line
watchdog: start-up
INH/LIMP: HIGH/LOW/float
EN: LOW
init Flash mode via SPI
AND flash entry enabled
t > t
WD(init)
OR SPI clock count <> 16
OR RSTN falling edge detected
OR RSTN released and V1 undervoltage detected
OR illegal Mode register code
watchdog
trigger
leave Flash mode code
OR watchdog time-out
OR interrupt ignored > t
RSTN(INT)
OR RSTN falling edge detected
OR V1 undervoltage detected
OR illegal Mode register code
Restart mode
Flash mode
V1: ON
SYSINH: HIGH
LIN: off-line
V1: ON
wake-up detected
AND oscillator ok
SYSINH: HIGH
LIN: all modes available
watchdog: time-out
INH/LIMP: HIGH/LOW/float
EN: HIGH/LOW
AND t > t
ret
watchdog: start-up
INH/LIMP: LOW/float
EN: LOW
t > t
WD(init)
OR SPI clock count <> 16
OR RSTN falling edge detected
OR RSTN released and V1 undervoltage detected
OR illegal Mode register code
Fail-safe mode
V1: OFF
SYSINH: HIGH/float
LIN: off-line
oscillator fail
OR RSTN externally clamped HIGH detected > t
OR RSTN externally clamped LOW detected > t
OR V1 undervoltage detected > t
V1(CLT)
RSTN(CHT)
RSTN(CLT)
from any
mode
watchdog: OFF
INH/LIMP: LOW
RSTN: LOW
EN: LOW
001aad670
Fig 4. Main state diagram
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
6.2.1 Start-up mode
Start-up mode is the ‘home page’ of the SBC. This mode is entered when battery and
ground are connected for the first time. Start-up mode is also entered after any event that
results in a system reset. The reset source information is provided by the SBC to support
different software initialization cycles that depend on the reset event.
It is also possible to enter Start-up mode via a wake-up from Standby mode, Sleep mode
or Fail-safe mode. Such a wake-up can originate either from the LIN-bus or from the local
WAKE pin.
On entering Start-up mode a lengthened reset time tRSTNL is observed. This reset time is
either user-defined (via the RLC bit in the System Configuration register) or defaults to the
value as given in Section 6.12.12. During the reset lengthening time pin RSTN is held
LOW by the SBC.
When the reset time is completed (pin RSTN is released and goes HIGH) the watchdog
timer will wait for initialization. If the watchdog initialization is successful, the selected
operating mode (Normal mode or Flash mode) will be entered. Otherwise the Restart
mode will be entered.
6.2.2 Restart mode
The purpose of the Restart mode is to give the application a second chance to start up,
should the first attempt from Start-up mode fail. Entering Restart mode will always set the
reset lengthening time tRSTNL to the higher value to guarantee the maximum reset length,
regardless of previous events.
If start-up from Restart mode is successful (the previous problems do not reoccur and
watchdog initialization is successful), then the selected operating mode will be entered.
From Restart mode this must be Normal mode. If problems persist or if V1 fails to start up,
then Fail-safe mode will be entered.
6.2.3 Fail-safe mode
Severe fault situations will cause the SBC to enter Fail-safe mode. Fail-safe mode is also
entered if start-up from Restart mode fails. Fail-safe mode offers the lowest possible
system power consumption from the SBC and from the external components controlled by
the SBC.
A wake-up (via the LIN-bus or the WAKE pin) is needed to leave Fail-safe mode. This is
only possible if the on-chip oscillator is running correctly. The SBC restarts from Fail-safe
mode with a defined delay tret, to guarantee a discharged V1 before entering Start-up
mode. Regulator V1 will restart and the reset lengthening time tRSTNL is set to the higher
value; see Section 6.5.1.
6.2.4 Normal mode
Normal mode gives access to all SBC system resources, including LIN, INH/LIMP and
EN. Therefore in Normal mode the SBC watchdog runs in (programmable) Window mode,
for strictest software supervision. Whenever the watchdog is not properly served a system
reset is performed.
UJA1069_3
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Product data sheet
Rev. 03 — 10 September 2007
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Interrupts from SBC to the host microcontroller are also monitored. A system reset is
performed if the host microcontroller does not respond within tRSTN(INT). Entering Normal
mode does not activate the LIN transceiver automatically. The LIN Mode Control (LMC) bit
must be used to activate the LIN medium if required, allowing local cyclic wake-up
scenarios to be implemented without affecting the LIN-bus.
6.2.5 Standby mode
In Standby mode the system is set into a state with reduced current consumption. The
watchdog will, however, continue to monitor the microcontroller (Time-out mode) since it is
powered via pin V1.
In the event that the host microcontroller can provide a low-power mode with reduced
current consumption in its Standby mode or Stop mode, the watchdog can be switched off
entirely in Standby mode of the SBC. The SBC monitors the microcontroller supply current
to ensure that there is no unobserved phase with disabled watchdog and running
microcontroller. The watchdog will remain active until the supply current drops below
IthL(V1). Below this current limit the watchdog is disabled.
Should the current increase to IthH(V1), e.g. as result of a microcontroller wake-up from
application specific hardware, the watchdog will start operating again with the previously
used time-out period. If needed, an interrupt can be issued when the watchdog restarts. If
the watchdog is not triggered correctly, a system reset will occur and the SBC will enter
Start-up mode.
If Standby mode is entered from Normal mode with the selected watchdog OFF option,
the watchdog will use the maximum time-out as defined for Standby mode until the supply
current drops below the current detection threshold; the watchdog is now OFF. If the
current increases again, the watchdog is immediately activated, again using the maximum
watchdog time-out period. If the watchdog OFF option is selected during Standby mode,
the last used watchdog period will define the time for the supply current to fall below the
current detection threshold. This allows the user to align the current supervisor function to
the application needs.
Generally, the microcontroller can be activated from Standby mode via a system reset or
via an interrupt without reset. This allows implementation of differentiated start-up
behavior from Standby mode, depending on the application needs:
• If the watchdog is still running during Standby mode, the watchdog can be used for
cyclic wake-up behavior of the system. A dedicated Watchdog Time-out Interrupt
Enable (WTIE) bit enables the microcontroller to decide whether to receive an
interrupt or a hardware reset upon overflow. The interrupt option will be cleared in
hardware automatically with each watchdog overflow to ensure that a failing main
routine is detected while the interrupt service still operates. So the application
software must set the interrupt behavior each time before a standby cycle is entered.
• Any wake-up via the LIN-bus together with a local wake-up event will force a system
reset event or an interrupt to the microcontroller. So it is possible to exit Standby mode
without any system reset if required.
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Product data sheet
Rev. 03 — 10 September 2007
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
When an interrupt event occurs the application software has to read the Interrupt register
within tRSTN(INT). Otherwise a fail-safe system reset is forced and Start-up mode will be
entered. If the application has read out the Interrupt register within the specified time, it
can decide whether to switch into Normal mode via an SPI access or to stay in Standby
mode.
The following operations are possible from Standby mode:
• Cyclic wake-up by the watchdog via an interrupt signal to the microcontroller (the
microcontroller is triggered periodically and checked for the correct response)
• Cyclic wake-up by the watchdog via a reset signal (a reset is performed periodically;
the SBC provides information about the reset source to allow different start
sequences after reset)
• Wake-up by activity on the LIN-bus via an interrupt signal to the microcontroller
• Wake-up by bus activity on the LIN-bus via a reset signal
• Wake-up by increasing the microcontroller supply current without a reset signal
(where a stable supply is needed for the microcontroller RAM contents to remain valid
and wake-up from an external application not connected to the SBC)
• Wake-up by increasing the microcontroller supply current with a reset signal
• Wake-up due to a falling edge at pin WAKE forcing an interrupt to the microcontroller
• Wake-up due to a falling edge at pin WAKE forcing a reset signal
6.2.6 Sleep mode
In Sleep mode the microcontroller power supply (V1) and the INH/LIMP controlled
external supplies are switched off entirely, resulting in minimum system power
consumption. In this mode, the watchdog runs in Time-out mode or is completely off.
Entering Sleep mode results in an immediate LOW level on pin RSTN, thus stopping any
operation of the microcontroller. The INH/LIMP output is floating in parallel and pin V1 is
disabled. It is also possible for V3 to be ON, OFF or in Cyclic mode to supply external
wake-up switches.
If the watchdog is not disabled in software, it will continue to run and force a system reset
upon overflow of the programmed period time. The SBC enters Start-up mode and pin V1
becomes active again. This behavior can be used for a cyclic wake-up from Sleep mode.
Depending on the application, the following operations can be selected from Sleep mode:
• Cyclic wake-up by the watchdog (only in Time-out mode); a reset is performed
periodically, the SBC provides information about the reset source to allow different
start sequences after reset
• Wake-up by activity on the LIN-bus or falling edge at pin WAKE
• An overload on V3, only if V3 is in a cyclic or in continuously ON mode
6.2.7 Flash mode
Flash mode can only be entered from Normal mode by entering a specific Flash mode
entry sequence. This fail-safe control sequence comprises three consecutive write
accesses to the Mode register, within the legal windows of the watchdog, using the
UJA1069_3
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Product data sheet
Rev. 03 — 10 September 2007
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
operating mode codes 111, 001 and 111 respectively. As a result of this sequence, the
SBC will enter Start-up mode and perform a system reset with the related reset source
information (bits RSS[3:0] = 0110).
From Start-up mode the application software now has to enter Flash mode within tWD(init)
by writing Operating Mode code 011 to the Mode register. This feeds back a successfully
received hardware reset (handshake between the SBC and the microcontroller). The
transition from Start-up mode to Flash mode is possible only once after completing the
Flash entry sequence.
The application can also decide not to enter Flash mode but to return to Normal mode by
using the Operating Mode code 101 for handshaking. This erases the Flash mode entry
sequence.
The watchdog behavior in Flash mode is similar to its time-out behavior in Standby mode,
but Operating Mode code 111 must be used for serving the watchdog. If this code is not
used or if the watchdog overflows, the SBC immediately forces a reset and enters Start-up
mode. Flash mode is properly exited using the Operating Mode code 110 (leave Flash
mode), which results in a system reset with the corresponding reset source information.
Other Mode register codes will cause a forced reset with reset source code ‘illegal Mode
register code’.
6.3 On-chip oscillator
The on-chip oscillator provides the clock signal for all digital functions and is the timing
reference for the on-chip watchdog and the internal timers.
If the on-chip oscillator frequency is too low or the oscillator is not running at all, there is
an immediate transition to Fail-safe mode. The SBC will stay in Fail-safe mode until the
oscillator has recovered to its normal frequency and the system receives a wake-up event.
6.4 Watchdog
The watchdog provides the following timing functions:
• Start-up mode; needed to give the software the opportunity to initialize the system
• Window mode; detects too early and too late accesses in Normal mode
• Time-out mode; detects a too late access, can also be used to restart or interrupt the
microcontroller from time to time (cyclic wake-up function)
• OFF mode; fail-safe shut-down during operation thus preventing any blind spots in the
system supervision
The watchdog is clocked directly by the on-chip oscillator.
To guarantee fail-safe control of the watchdog via the SPI, all watchdog accesses are
coded with redundant bits. Therefore, only certain codes are allowed for a proper
watchdog service.
The following corrupted watchdog accesses result in an immediate system reset:
• Illegal watchdog period coding; only ten different codes are valid
• Illegal operating mode coding; only six different codes are valid
UJA1069_3
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Product data sheet
Rev. 03 — 10 September 2007
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Any microcontroller driven mode change is synchronized with a watchdog access by
reading the mode information and the watchdog period information from the same
register. This enables an easy software flow control with defined watchdog behavior when
switching between different software modules.
6.4.1 Watchdog start-up behavior
Following any reset event the watchdog is used to monitor the ECU start-up procedure. It
observes the behavior of the RSTN pin for any clamping condition or interrupted reset
wire. In case the watchdog is not properly served within tWD(init), another reset is forced
and the monitoring procedure is restarted. In case the watchdog is again not properly
served, the system enters Fail-safe mode (see also Figure 4, Start-up mode and Restart
mode).
6.4.2 Watchdog window behavior
Whenever the SBC enters Normal mode, the Window mode of the watchdog is activated.
This ensures that the microcontroller operates within the required speed; a too fast as well
as a too slow operation will be detected. Watchdog triggering using the Window mode is
illustrated in Figure 5.
period
too early
trigger window
50 %
100 %
trigger
restarts
period
trigger
via SPI
last
trigger point
earliest possible
trigger point
latest possible
trigger point
trigger restarts period
(with different duration if
desired)
50 %
100 %
trigger
window
too early
new period
trigger
via SPI
earliest
possible
trigger
point
latest
possible
trigger
point
mce626
Fig 5. Watchdog triggering using Window mode
The SBC provides 10 different period timings, scalable with a 4-factor watchdog prescaler.
The period can be changed within any valid trigger window. Whenever the watchdog is
triggered within the window time, the timer will be reset to start a new period.
The watchdog window is defined to be between 50 % and 100 % of the nominal
programmed watchdog period. Any too early or too late watchdog access or wrong Mode
register code access will result in an immediate system reset, entering Start-up mode.
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6.4.3 Watchdog time-out behavior
Whenever the SBC operates in Standby mode, in Sleep mode or in Flash mode, the active
watchdog operates in Time-out mode. The watchdog has to be triggered within the actual
programmed period time; see Figure 6. The Time-out mode can be used to provide cyclic
wake-up events to the host microcontroller from Standby mode and Sleep mode.
period
trigger range
time-out
trigger
via SPI
earliest
possible
trigger
point
latest
possible
trigger
point
trigger restarts period
(with different duration if
desired)
trigger range
new period
time-out
mce627
Fig 6. Watchdog triggering using Time-out mode
In Standby and in Flash mode the nominal periods can be changed with any SPI access
to the Mode register.
Any illegal watchdog trigger code results in an immediate system reset, entering Start-up
mode.
6.4.4 Watchdog OFF behavior
In Standby mode and Sleep mode it is possible to switch off the watchdog entirely. For
fail-safe reasons this is only possible if the microcontroller has stopped program
execution. To ensure that there is no program execution, the V1 supply current is
monitored by the SBC while the watchdog is switched off.
When selecting the watchdog OFF code, the watchdog remains active until the
microcontroller supply current has dropped below the current monitoring threshold IthL(V1)
.
After the supply current has dropped below the threshold, the watchdog stops at the end
of the watchdog period. In case the supply current does not drop below the monitoring
threshold, the watchdog stays active.
If the microcontroller supply current increases above IthH(V1) while the watchdog is OFF,
the watchdog is restarted with the last used watchdog period time and a watchdog restart
interrupt is forced, if enabled.
In case of a direct mode change towards Standby mode with watchdog OFF selected, the
longest possible watchdog period is used. It should be noted that in Sleep mode V1
current monitoring is not active.
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6.5 System reset
The reset function of the UJA1069 offers two signals to deal with reset events:
• RSTN; the global ECU system reset
• EN; a fail-safe global enable signal
6.5.1 RSTN pin
The system reset pin (RSTN) is a bidirectional input / output. Pin RSTN is active LOW with
selectable pulse length upon the following events; see Figure 4:
• Power-on (first battery connection) or VBAT42 below power-on reset threshold voltage
• Low V1 supply
• V1 current above threshold during Standby mode while watchdog OFF behavior is
selected
• V3 is down due to short-circuit condition during Sleep mode
• RSTN externally forced LOW, falling edge event
• Successful preparation for Flash mode completed
• Successful exit from Flash mode
• Wake-up from Standby mode via pins LIN or WAKE if programmed accordingly, or any
wake-up event from Sleep mode
• Wake-up event from Fail-safe mode
• Watchdog trigger failures (too early, overflow, wrong code)
• Illegal mode code via SPI applied
• Interrupt not served within tRSTN(INT)
All of these reset events have a dedicated reset source in the System Status register to
allow distinction between the different events.
The SBC will lengthen any reset event to 1 ms or 20 ms to ensure that external hardware
is properly reset. After the first battery connection, a short power-on reset of 1 ms is
provided after voltage V1 is present. Once started, the microcontroller can set the Reset
Length Control (RLC) bit within the System Configuration Register; this allows the reset
pulse to be adjusted for future reset events. With this bit set, all reset events are
lengthened to 20 ms. Due to fail-safe behavior, this bit will be set automatically (to 20 ms)
in Restart mode or Fail-safe mode. With this mechanism it is guaranteed that an
erroneously shortened reset pulse will restart any microcontroller, at least within the
second trial by using the long reset pulse.
The behavior of pin RSTN is illustrated in Figure 7. The duration of tRSTNL depends on the
setting of the RLC bit (defines the reset length). Once an external reset event is detected
the system controller enters the Start-up mode. The watchdog now starts to monitor pin
RSTN as illustrated in Figure 8. If the RSTN pin is not released in time then Fail-safe
mode is entered as shown in Figure 4.
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V1
V
V
rel(UV)(V1)
det(UV)(V1)
time
power-up
under-
voltage
missing
watchdog voltage
access spike
under-
power-
down
V
RSTN
time
t
t
t
RSTNL
RSTNL
RSTNL
coa054
Fig 7. Reset pin behavior
V
RSTN
time
t
RSTNL
t
WD(init)
RSTN
externally
forced LOW
V
RSTN
time
t
RSTNL
t
RSTN externally forced LOW
WD(init)
001aad181
Fig 8. Reset timing diagram
Pin RSTN is monitored for a continuously clamped LOW situation. Once the SBC pulls pin
RSTN HIGH but pin RSTN level remains LOW for longer than tRSTN(CLT), the SBC
immediately enters Fail-safe mode since this indicates an application failure.
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The SBC also detects if pin RSTN is clamped HIGH. If the HIGH-level remains on the pin
for longer than tRSTN(CHT) while pin RSTN is driven internally to a LOW-level by the SBC,
the SBC falls back immediately to Fail-safe mode since the microcontroller cannot be
reset any more. By entering Fail-safe mode, the V1 voltage regulator shuts down and the
microcontroller stops.
Additionally, chattering reset signals are handled by the SBC in such a way that the
system safely falls back to Fail-safe mode with the lowest possible power consumption.
6.5.2 EN output
Pin EN can be used to control external hardware such as power components or as a
general purpose output if the system is running properly. During all reset events, when pin
RSTN is pulled LOW, the EN control bit will be cleared, pin EN will be pulled LOW and will
stay LOW after pin RSTN is released. In Normal mode and Flash mode of the SBC, the
microcontroller can set the EN control bit via the SPI. This results in releasing pin EN
which then returns to a HIGH-level.
6.6 Power supplies
6.6.1 BAT14, BAT42 and SYSINH
The SBC has two supply pins, pin BAT42 and pin BAT14. Pin BAT42 supplies most of the
SBC where pin BAT14 only supplies the linear voltage regulators and the INH/LIMP output
pin. This supply architecture allows different supply strategies including the use of
external DC-to-DC converters controlled by the pin SYSINH.
6.6.1.1 SYSINH output
The SYSINH output is a high-side switch from BAT42. It is activated whenever the SBC
requires supply voltage to pin BAT14, e.g. when V1 is on (see Figure 4 and Figure 8).
Otherwise pin SYSINH is floating. Pin SYSINH can be used to control e.g. an external
step-down voltage regulator to BAT14, to reduce power consumption in low-power modes.
6.6.2 SENSE input
The SBC has a dedicated SENSE pin for dynamic monitoring of the battery contact of an
electronic control unit. Connecting this pin in front of the polarity protection diode of the
ECU provides an early warning if the battery becomes disconnected.
6.6.3 Voltage regulator V1
The UJA1069 has an independent voltage regulator supplied out of the BAT14 pin.
Regulator V1 is intended to supply the microcontroller.
The V1 voltage is continuously monitored to provide the system reset signal when
undervoltage situations occur. Whenever the V1 voltage falls below one of the three
programmable thresholds, a hardware reset is forced.
A dedicated V1 supply comparator (V1 Monitor) observes V1 for undervoltage events
lower than VUV(VFI). This allows the application to receive a supply warning interrupt in
case one of the lower V1 undervoltage reset thresholds is selected.
The V1 regulator is overload protected. The maximum output current available from pin V1
depends on the voltage applied to pin BAT14 according to Table 25. For thermal reasons,
the total power dissipation should be taken into account.
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6.6.4 Switched battery output V3
V3 is a high-side switched BAT42-related output which is used to drive external loads
such as wake-up switches or relays. The features of V3 are as follows:
• Three application controlled modes of operation; ON, OFF or Cyclic mode.
• Two different cyclic modes allow the supply of external wake-up switches; these
switches are powered intermittently, thus reducing the system’s power consumption in
case a switch is continuously active; the wake-up input of the SBC is synchronized
with the V3 cycle time.
• The switch is protected against current overloads. If V3 is overloaded, pin V3 is
automatically disabled. The corresponding Diagnosis register bit is reset and an
interrupt is forced (if enabled). During Sleep mode, a wake-up is forced and the
corresponding reset source code becomes available in the RSS bits of the System
Status register. This signals that the wake-up source via V3 supplied wake-up
switches has been lost.
6.7 LIN transceiver
The integrated LIN transceiver of the UJA1069 is a LIN 2.0 compliant transceiver. The
transceiver has the following features:
• SAE J2602 compliant and compatible with LIN revision 1.3
• Fail-safe LIN termination to BAT42 via dedicated RTLIN pin
• Enhanced error handling and reporting of bus and TXD failures; these failures are
separately identified in the System Diagnosis register
6.7.1 Mode control
The controller of the LIN transceiver provides two modes of operation: Active mode and
Off-line mode; see Figure 9. In Off-line mode the transmitter and receiver do not consume
current, but wake-up events will be recognized by the separate wake-up receiver.
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Active mode
transmitter: ON/OFF (LTC)
receiver: ON
RXDL: bitstream
RTLIN: ON/75 µA
SBC enters
SBC enters
Normal or Flash mode
AND LMC = 1
Stand-by, Start-up,
Restart or Fail-safe mode
OR LMC = 0
Off-line mode
transmitter: OFF
receiver: wake-up
RXDL: wake-up status
RTLIN: 75 µA/OFF
SBC enters
Fail-safe mode
power-on
001aad184
Fig 9. States LIN transceiver
6.7.1.1 Active mode
In Active mode the LIN transceiver can transmit data to and receive data from the LIN bus.
To enter Active mode the LMC bit must be set in the Physical Layer register and the SBC
must be in Normal mode or Flash mode.
The LTC bit can be used to set the LIN transceiver to a Listen-only mode. The transmitter
output stage is disabled in this mode.
When leaving Active mode the LIN transmitter is disabled and the LIN receiver is
monitoring the LIN-bus for a valid wake-up.
6.7.1.2 Off-line mode
Off-line mode is the low-power mode of the LIN transceiver. The LIN transceiver is
disabled to save supply current. Pin RXDL reflects any wake-up event at the LIN-bus.
6.7.2 LIN wake-up
For a remote wake-up via LIN a LIN-bus signal is required as shown in Figure 10.
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LIN
wake-up
t
BUS(LIN)
001aad447
Fig 10. LIN wake-up timing diagram
6.7.3 Termination control
The RTLIN pin is in one of 3 different states: RTLIN = on, RTLIN = off or RTLIN = 75 µA;
see Figure 11.
Active mode and receiver dominant > t
LIN(dom)(det)
OR Off-line mode
RTLIN = 75 µA
RTLIN = ON
supplied directly
out of BAT42
supplied directly
out of BAT42
Active mode and receiver recessive > t
LIN(dom)(rec)
OR mode change to Active mode
Off-line mode
AND receiver recessive > t
LIN(dom)(rec)
Off-line mode
AND receiver dominant > t
mode change to Active mode
LIN(dom)(det)
power-on
RTLIN = OFF
001aad183
Fig 11. States of the RTLIN pin
During Active mode, with no short-circuit between the LIN-bus and GND, pin RTLIN
provides an internal switch to BAT42. For master and slave operation an external resistor,
1 kΩ or 30 kΩ respectively, can be applied between pins RTLIN and LIN. An external
diode in series with the termination resistor is not required due to the incorporated internal
diode.
6.7.4 LIN slope control
The LSC bit in the Physical Layer Control register offers a choice between two LIN slope
times, allowing communication up to 20 kbit/s (normal) or up to 10.4 kbit/s (low slope).
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6.7.5 LIN driver capability
Setting the LDC bit in the Physical Layer Control register will increase the driver capability
of the LIN output stage. This feature is used in auto-addressing systems, where the
standard LIN 2.0 drive capability is insufficient.
6.7.6 Bus and TXDL failure detection
The SBC handles and reports the following LIN-bus related failures:
• LIN-bus shorted to ground
• LIN-bus shorted to VBAT14 or VBAT42; the transmitter is disabled
• TXDL clamped dominant; the transmitter is disabled
These failure events force an interrupt to the microcontroller whenever the status changes
and the corresponding interrupt is enabled.
6.7.6.1 TXDL dominant clamping
If the TXDL pin is clamped dominant for longer than tTXDL(dom)(dis) the LIN transmitter is
disabled. After the TXDL pin becomes recessive the transmitter is reactivated
automatically when detecting bus activity or manually by setting and clearing the LTC bit.
6.7.6.2 LIN dominant clamping
When the LIN-bus is clamped dominant for longer than tLIN(dom)(det) (which is longer than
tTXDL(dom)(dis)), the state of the LIN termination is changed according to Figure 11.
6.7.6.3 LIN recessive clamping
If the LIN bus pin is clamped recessive while TXDL is driven dominant the LIN transmitter
is disabled. The transmitter is reactivated automatically when the LIN bus becomes
dominant or manually by setting and clearing the LTC bit.
6.8 Inhibit and limp-home output
The INH/LIMP output pin is a 3-state output pin which can be used either as an inhibit for
an extra (external) voltage regulator, or as a ‘limp-home’ output. The pin is controlled via
the ILEN bit and ILC bit in the System Configuration register; see Figure 12.
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state change via SPI
OR enter Fail-safe mode
INH/LIMP:
HIGH
INH/LIMP:
LOW
ILEN = 1
ILC = 1
ILEN = 1
ILC = 0
state change via SPI
state change via SPI
OR (enter Start-up mode after
wake-up reset, external reset
or V1 undervoltage)
state change via SPI
OR enter Fail-safe mode
OR enter Restart mode
OR enter Sleep mode
state change via SPI
state change via SPI
INH/LIMP:
floating
ILEN = 0
ILC = 1/0
power-on
001aad178
Fig 12. States of the INH/LIMP pin
When pin INH/LIMP is used as inhibit output, a pull-down resistor to GND ensures a
default LOW level. The pin can be set to HIGH according to the state diagram.
When pin INH/LIMP is used as limp-home output, a pull-up resistor to VBAT42 ensures a
default HIGH level. The pin is automatically set to LOW when the SBC enters Fail-safe
mode.
6.9 Wake-up input
The WAKE input comparator is triggered by negative edges on pin WAKE. Pin WAKE has
an internal pull-up resistor to BAT42. It can be operated in two sampling modes which are
selected via the WAKE Sample Control bit (WSC):
• Continuous sampling (with an internal clock) if the bit is set
• Sampling synchronized to the cyclic behavior of V3 if the bit is cleared; see Figure 13.
This is to save bias current within the external switches in low-power operation. Two
repetition times are possible, 16 ms and 32 ms.
If V3 is continuously ON, the WAKE input will be sampled continuously, regardless of the
level of bit WSC.
The dedicated bits Edge Wake-up Status (EWS) and WAKE Level Status (WLS) in the
System Status register reflect the actual status of pin WAKE. The WAKE port can be
disabled by clearing the WEN bit in the System Configuration register.
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t
w(CS)
t
on(CS)
V
3
approximately 70 %
t
su(CS)
sample
active
button pushed
button released
signal already HIGH
V
WAKE
due to biasing (history)
signal remains LOW
due to biasing (history)
flip flop
V
INTN
001aac307
Fig 13. Pin WAKE, cyclic sampling via V3
6.10 Interrupt output
Pin INTN is an open-drain interrupt output. It is forced LOW whenever at least one bit in
the Interrupt register is set. By reading the Interrupt register all bits are cleared. The
Interrupt register will also be cleared during a system reset (RSTN LOW).
As the microcontroller operates typically with an edge-sensitive interrupt port, pin INTN
will be HIGH for at least tINTN after each read-out of the Interrupt register. Without further
interrupts within tINTN pin INTN stays HIGH, otherwise it will revert to LOW again.
To prevent the microcontroller from being slowed down by repetitive interrupts, in Normal
mode some interrupts are only allowed to occur once per watchdog period; see
Section 6.12.7.
If an interrupt is not read out within tRSTN(INT) a system reset is performed.
6.11 Temperature protection
The temperature of the SBC chip is monitored as long as the microcontroller voltage
regulator V1 is active. To avoid an unexpected shutdown of the application by the SBC,
the temperature protection will not switch off any part of the SBC or activate a defined
system stop of its own accord. If the temperature is too high it generates an interrupt to
the microcontroller, if enabled, and the corresponding status bit will be set. The
microcontroller can then decide whether to switch off parts of the SBC to decrease the
chip temperature.
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6.12 SPI interface
The Serial Peripheral Interface (SPI) provides the communication link with the
microcontroller, supporting multi-slave and multi-master operation. The SPI is configured
for full duplex data transfer, so status information is returned when new control data is
shifted in. The interface also offers a read-only access option, allowing registers to be
read back by the application without changing the register content.
The SPI uses four interface signals for synchronization and data transfer:
• SCS - SPI chip select; active LOW
• SCK - SPI clock; default level is LOW due to low-power concept
• SDI - SPI data input
• SDO - SPI data output; floating when pin SCS is HIGH
Bit sampling is performed on the falling clock edge and data is shifted on the rising clock
edge; see Figure 14.
SCS
SCK
SDI
01
02
03
04
15
16
sampled
X
MSB
14
14
13
13
12
12
01
01
LSB
LSB
X
MSB
SDO
X
floating
floating
mce634
Fig 14. SPI timing protocol
To protect against wrong or illegal SPI instructions, the SBC detects the following SPI
failures:
• SPI clock count failure (wrong number of clock cycles during one SPI access): only
16 clock periods are allowed within one SCS cycle. Any deviation from the 16 clock
cycles results in an SPI failure interrupt, if enabled. The access is ignored by the SBC.
In Start-up and Restart mode a reset is forced instead of an interrupt
• Forbidden mode changes according to Figure 4 result in an immediate system reset
• Illegal Mode register code. Undefined operating mode or watchdog period coding
results in an immediate system reset; see Section 6.12.3
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6.12.1 SPI register mapping
Any control bit which can be set by software is readable by the application. This allows
software debugging as well as control algorithms to be implemented.
Watchdog serving and mode setting is performed within the same access cycle; this only
allows an SBC mode change whilst serving the watchdog.
Each register carries 12 data bits; the other 4 bits are used for register selection and
read/write definition.
6.12.2 Register overview
The SPI interface gives access to all SBC registers; see Table 3. The first two bits (A1 and
A0) of the message header define the register address, the third bit is the read register
select bit (RRS) to select one out of two possible feedback registers; the fourth bit (RO)
allows ‘read only’ access to one of the feedback registers. Which of the SBC registers can
be accessed also depends on the SBC operating mode.
Table 3.
Register overview
Operating
Register
Write access (RO = 0)
Read access (RO = 0 or RO = 1)
address bits mode
(A1, A0)
Read Register Select
(RRS) bit = 0
Read Register Select
(RRS) bit = 1
00
01
all modes
Mode register
System Status register
System Diagnosis register
Interrupt register
Normal mode;
Standby mode;
Flash mode
Interrupt Enable register
Interrupt Enable Feedback
register
Start-up mode; Special Mode register
Restart mode
Interrupt Enable Feedback
register
Special Mode Feedback
register
10
11
Normal mode;
Standby mode register
System Configuration
System Configuration
Feedback register
General Purpose Feedback
register 0
Start-up mode; General Purpose register 0 System Configuration
Restart mode;
Flash mode
General Purpose Feedback
register 0
Feedback register
Normal mode;
Standby mode register
Physical Layer Control
Physical Layer Control
Feedback register
General Purpose Feedback
register 1
Start-up mode; General Purpose register 1 Physical Layer Control
General Purpose Feedback
register 1
Restart mode;
Flash mode
Feedback register
6.12.3 Mode register
In the Mode register the watchdog is defined and re-triggered, and the SBC operating
mode is selected. The Mode register also contains the global enable output bit (EN) and
the Software Development Mode (SDM) control bit. During system operation cyclic access
to the Mode register is required to serve the watchdog. This register can be written to in all
modes.
At system start-up the Mode register must be written to within tWD(init) from releasing
RSTN (HIGH-level on pin RSTN). Any write access is checked for proper watchdog and
system mode coding. If an illegal code is detected, access is ignored by the SBC and a
system reset is forced in accordance with the state diagram of the system controller; see
Figure 4.
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Table 4.
Bit
Mode register bit description (bits 15 to 12 and 5 to 0)
Symbol
Description
Value
Function
15 and 14 A1, A0
register address 00
select Mode register
13
12
RRS
RO
Read Register
Select
1
0
1
0
read System Diagnosis register
read System Status register
Read Only
read selected register without writing to Mode register
read selected register and write to Mode register
11 to 6
5 to 3
NWP[5:0]
OM[2:0]
see Table 5
Operating Mode 001
Normal mode
010
011
100
101
110
111
Standby mode
initialize Flash mode[1]
Sleep mode
initialize Normal mode
leave Flash mode
Flash mode [1]
2
SDM
Software
Development
Mode
1
0
Software development mode enabled[2]
normal watchdog, interrupt, reset monitoring and fail-safe
behavior
1
0
EN
-
Enable
1
0
0
EN output pin HIGH
EN output pin LOW
reserved
reserved for future use; should remain cleared to ensure
compatibility with future functions which might use this bit
[1] Flash mode can be entered only with the watchdog service sequence ‘Normal mode to Flash mode to Normal mode to Flash mode’,
while observing the watchdog trigger rules. With the last command of this sequence the SBC forces a system reset, and enters Start-up
mode to prepare the microcontroller for flash memory download. The four RSS bits in the System Status register reflect the reset source
information, confirming the Flash entry sequence. By using the Initializing Flash mode (within tWD(init) after system reset) the SBC will
now successfully enter Flash mode.
[2] See Section 6.13.1.
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Table 5.
Bit
Mode register bit description (bits 11 to 6)[1]
Symbol
Description
Value
Time
Normal
Standby
Flash mode Sleep mode
mode (ms)
mode (ms)
(ms)
(ms)
11 to 6
NWP[5:0]
Nominal
Watchdog Period
00 1001
00 1100
01 0010
01 0100
01 1011
10 0100
10 1101
11 0011
11 0101
11 0110
00 1001
00 1100
01 0010
01 0100
01 1011
10 0100
10 1101
11 0011
11 0101
11 0110
00 1001
00 1100
01 0010
01 0100
01 1011
10 0100
10 1101
11 0011
11 0101
11 0110
4
20
20
160
8
40
40
320
WDPRE = 00(as
set in the Special
Mode register)
16
32
40
48
56
64
72
80
6
80
80
640
160
160
1024
2048
3072
4096
6144
8192
OFF[3]
240
320
320
640
640
1024
2048
4096
OFF[2]
30
1024
2048
4096
8192
30
Nominal
Watchdog Period
12
24
48
60
72
84
96
108
120
10
20
40
80
100
120
140
160
180
200
60
60
480
WDPRE = 01(as
set in the Special
Mode register)
120
120
960
240
240
1536
3072
4608
6144
9216
12288
OFF[3]
400
480
480
960
960
1536
3072
6144
OFF[2]
50
1536
3072
6144
12288
50
Nominal
Watchdog Period
100
100
800
WDPRE = 10(as
set in the Special
Mode register)
200
200
1600
2560
5120
7680
10240
15360
20480
OFF[3]
400
400
800
800
1600
2560
5120
10240
OFF[2]
1600
2560
5120
10240
20480
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LIN fail-safe system basis chip
Table 5.
Bit
Mode register bit description (bits 11 to 6)[1] …continued
Symbol
Description
Value
Time
Normal
Standby
Flash mode Sleep mode
mode (ms)
mode (ms)
(ms)
(ms)
11 to 6
NWP[5:0]
Nominal
Watchdog Period
00 1001
00 1100
01 0010
01 0100
01 1011
10 0100
10 1101
11 0011
11 0101
11 0110
14
70
70
560
28
140
140
1120
2240
3584
7168
10752
14336
21504
28672
OFF[3]
WDPRE = 11(as
set in the Special
Mode register)
56
280
280
112
140
168
196
224
252
280
560
560
1120
2240
3584
7168
14336
OFF[2]
1120
2240
3584
7168
14336
28672
[1] The nominal watchdog periods are directly related to the SBC internal oscillator. The given values are valid for fosc = 512 kHz.
[2] See Section 6.4.4.
[3] The watchdog is immediately disabled on entering Sleep mode, with watchdog OFF behavior selected, because pin RSTN is
immediately pulled LOW by the mode change. V1 is switched off after pulling pin RSTN LOW to guarantee a safe Sleep mode entry
without dips on V1. See Section 6.4.4.
6.12.4 System Status register
This register allows status information to be read back from the SBC. This register can be
read in all modes.
Table 6.
Bit
System Status register bit description
Symbol
Description
Value
Function
15 and 14 A1, A0
register address
Read Register Select
Read Only
00
0
read System Status register
13
12
RRS
RO
1
read System Status register without writing to Mode
register
0
read System Status register and write to Mode register
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LIN fail-safe system basis chip
Table 6.
Bit
System Status register bit description …continued
Symbol
Description
Value
Function
11 to 8
RSS[3:0]
Reset Source[1]
0000
power-on reset; first connection of BAT42 or BAT42 below
power-on voltage threshold or RSTN was forced LOW
externally
0001
0010
cyclic wake-up out of Sleep mode
low V1 supply; V1 has dropped below the selected reset
threshold
0011
0100
V1 current above threshold within Standby mode while
watchdog OFF behavior and reset option (V1CMC bit) are
selected
V3 voltage is down due to overload occurring during Sleep
mode
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
0
SBC successfully left Flash mode
SBC ready to enter Flash mode
reserved for SBCs with CAN transceiver
LIN wake-up event
local wake-up event (via pin WAKE)
wake-up out of Fail-safe mode
watchdog overflow
watchdog not initialized in time; tWD(init) exceeded
watchdog triggered too early; window missed
illegal SPI access
interrupt not served within tRSTN(INT)
reserved for SBCs with CAN transceiver
LIN wake-up detected; cleared upon read
no LIN wake-up
7
6
-
reserved
LWS
LIN Wake-up Status
1
0
5
4
3
2
1
0
EWS
Edge Wake-up Status
WAKE Level Status
1
pin WAKE negative edge detected; cleared upon read
pin WAKE no edge detected
0
WLS
1
pin WAKE above threshold
0
pin WAKE below threshold
TWS
Temperature Warning
Status
1
chip temperature exceeds the warning limit
chip temperature is below the warning limit
Software Development mode on
Software Development mode off
pin EN output activated (V1-related HIGH level)
pin EN output released (LOW level)
0
SDMS
ENS
Software Development
Mode Status
1
0
Enable Status
1
0
PWONS
Power-on reset Status
1
power-on reset; cleared after a successfully entered
Normal mode
0
no power-on reset
[1] The RSS bits are updated with each reset event and not cleared. The last reset event is captured.
6.12.5 System Diagnosis register
This register allows diagnosis information to be read back from the SBC. This register can
be read in all modes.
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LIN fail-safe system basis chip
Table 7.
Bit
System Diagnosis register bit description
Symbol
Description
Value
Function
15 and 14 A1, A0
register address
Read Register Select
Read Only
00
1
read System Diagnosis register
13
12
RRS
RO
1
read System Diagnosis register without writing to Mode
register
0
read System Diagnosis register and write to Mode register
reserved for SBCs with CAN transceiver
TXDL is clamped dominant
11 to 7
6 and 5
-
reserved
0 0000
LINFD[1:0] LIN failure diagnosis
11
10
01
00
1
LIN is shorted to GND (dominant clamped)
LIN is shorted to VBAT (recessive clamped)
no failure
4
V3D
V3 diagnosis
OK
0
fail; V3 is disabled due to an overload situation
reserved for SBCs with another voltage regulator
OK; V1 always above VUV(VFI) since last read access
3
2
-
reserved
1
V1D
V1 diagnosis
1
0
fail; V1 was below VUV(VFI) since last read access; bit is set
again with read access
1 and 0
-
reserved
00
reserved for SBCs with CAN transceiver
6.12.6 Interrupt Enable register and Interrupt Enable Feedback register
These registers allow setting, clearing and reading back the interrupt enable bits of the
SBC.
Table 8.
Bit
Interrupt Enable and Interrupt Enable Feedback register bit description
Symbol
Description
Value
Function
15 and 14 A1, A0
register address
Read Register Select
01
1
select the Interrupt Enable register
read the Interrupt register
13
12
RRS
RO
0
read the Interrupt Enable Feedback register
Read Only
1
read the register selected by RRS without writing to
Interrupt Enable register
0
1
read the register selected by RRS and write to Interrupt
Enable register
11
10
WTIE
OTIE
Watchdog Time-out
Interrupt Enable[1]
a watchdog overflow during Standby causes an interrupt
instead of a reset event (interrupt based cyclic wake-up
feature)
0
1
no interrupt forced on watchdog overflow; a reset is forced
instead
Over-Temperature
Interrupt Enable
exceeding or dropping below the temperature warning limit
causes an interrupt
0
0
1
no interrupt forced
9
8
-
reserved
reserved for SBCs with CAN transceiver
SPIFIE
SPI clock count Failure
Interrupt Enable
wrong number of CLK cycles (more than, or less than 16)
forces an interrupt; from Start-up mode and Restart mode a
reset is performed instead of an interrupt
0
no interrupt forced; SPI access is ignored if the number of
cycles does not equal 16
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LIN fail-safe system basis chip
Table 8.
Interrupt Enable and Interrupt Enable Feedback register bit description …continued
Bit
Symbol
Description
Value
Function
7
BATFIE
BAT Failure Interrupt
Enable
1
0
1
0
0
1
0
1
falling edge at SENSE forces an interrupt
no interrupt forced
6
VFIE
Voltage Failure Interrupt
Enable
clearing of V1D or V3D forces an interrupt
no interrupt forced
5
4
-
reserved
reserved for SBCs with CAN transceiver
any change of the LIN Failure status bits forces an interrupt
no interrupt forced
LINFIE
LIN Failure Interrupt
Enable
3
WIE
WAKE Interrupt
Enable[2]
a negative edge at pin WAKE generates an interrupt in
Normal mode, Flash mode or Standby mode
0
1
a negative edge at pin WAKE generates a reset in Standby
mode; no interrupt in any other mode
2
WDRIE
Watchdog Restart
Interrupt Enable
a watchdog restart during watchdog OFF generates an
interrupt
0
0
1
no interrupt forced
1
0
-
reserved
reserved for SBCs with CAN transceiver
LINIE
LIN Interrupt Enable
LIN-bus event results in a wake-up interrupt in Standby
mode and in Normal or Flash mode (unless LIN is in Active
mode already)
0
LIN-bus event results in a reset in Standby mode; no
interrupt in any other mode
[1] This bit is cleared automatically upon each overflow event. It has to be set in software each time the interrupt behavior is required
(fail-safe behavior).
[2] WEN (in the System Configuration register) has to be set to activate the WAKE port function globally.
6.12.7 Interrupt register
The Interrupt register allows the cause of an interrupt event to be read. The register is
cleared upon a read access and upon any reset event. Hardware ensures that no interrupt
event is lost in case there is a new interrupt forced while reading the register. After reading
the Interrupt register pin INTN is released for tINTN to guarantee an edge event at pin
INTN.
The interrupts can be classified into two groups:
• Timing critical interrupts which require immediate reaction (SPI clock count failure
which needs a new SPI command to be resent immediately, and a BAT failure which
needs critical data to be saved immediately into the nonvolatile memory)
• Interrupts which do not require an immediate reaction (overtemperature and LIN
failures, V1 and V3 failures and the wake-ups via LIN and WAKE. These interrupts will
be signalled in Normal mode to the microcontroller once per watchdog period
(maximum); this prevents overloading the microcontroller with unexpected interrupt
events (e.g. a chattering LIN failure). However, these interrupts are reflected in the
interrupt register
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LIN fail-safe system basis chip
Table 9.
Bit
Interrupt register bit description
Symbol
Description
Value
Function
15 and 14 A1, A0
register address
Read Register Select
Read Only
01
1
read Interrupt register
13
12
RRS
RO
1
read the Interrupt register without writing to the Interrupt
Enable register
0
1
read the Interrupt register and write to the Interrupt Enable
register
11
10
WTI
OTI
Watchdog Time-out
Interrupt
a watchdog overflow during Standby mode has caused an
interrupt (interrupt-based cyclic wake-up feature)
0
1
0
0
1
no interrupt
OverTemperature
Interrupt
the temperature warning status (TWS) has changed
no interrupt
9
8
-
reserved
reserved for SBCs with CAN transceiver
SPIFI
SPI clock count Failure
Interrupt
wrong number of CLK cycles (more than, or less than 16)
during SPI access
0
no interrupt; SPI access is ignored if the number of CLK
cycles does not equal 16
7
6
BATFI
VFI
BAT Failure Interrupt
1
0
1
0
0
1
0
1
0
1
falling edge at pin SENSE has forced an interrupt
no interrupt
Voltage Failure Interrupt
V1D or V3D has been cleared
no interrupt
5
4
-
reserved
reserved for SBCs with CAN transceiver
LIN failure status has changed
no interrupt
LINFI
LIN Failure Interrupt
3
2
WI
Wake-up Interrupt
a negative edge at pin WAKE has been detected
no interrupt
WDRI
Watchdog Restart
Interrupt
A watchdog restart during watchdog OFF has caused an
interrupt
0
0
1
0
no interrupt
1
0
-
reserved
reserved for SBCs with CAN transceiver
LIN wake-up event has caused an interrupt
no interrupt
LINI
LIN Wake-up Interrupt
6.12.8 System Configuration register and System Configuration Feedback register
These registers allow configuration of the behavior of the SBC, and allow the settings to
be read back.
Table 10. System Configuration and System Configuration Feedback register bit description
Bit
Symbol
Description
Value
Function
15 and 14 A1, A0
register address
Read Register Select
10
1
select System Configuration register
read the General Purpose Feedback register 0
read the System Configuration Feedback register
13
RRS
0
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LIN fail-safe system basis chip
Table 10. System Configuration and System Configuration Feedback register bit description …continued
Bit
Symbol
Description
Value
Function
12
RO
Read Only
1
read register selected by RRS without writing to System
Configuration register
0
read register selected by RRS and write to System
Configuration register
11 and 10
-
reserved
00
reserved for future use; should remain cleared to ensure
compatibility with future functions which might use this bit
9
8
-
reserved
0
1[1]
reserved for SBCs with CAN transceiver
tRSTNL long reset lengthening time selected
tRSTNL short reset lengthening time selected
Cyclic mode 2; tw(CS) long period; see Figure 13
Cyclic mode 1; tw(CS) short period; see Figure 13
continuously ON
RLC
Reset Length Control
0
7 and 6
V3C[1:0]
V3 Control
11
10
01
00
0
OFF
5
4
-
reserved
reserved for future use; should remain cleared to ensure
compatibility with future functions which might use this bit
V1CMC
V1 Current Monitor
Control
1
0
an increasing V1 current causes a reset if the watchdog
was disabled during Standby mode
an increasing V1 current just reactivates the watchdog
during Standby mode, and an interrupt is forced (if enabled)
3
2
1
0
WEN
WSC
ILEN
ILC
Wake Enable[2]
1
0
1
0
1
0
1
0
WAKE pin enabled
WAKE pin disabled
Wake Sample Control
INH/LIMP Enable
INH/LIMP Control
Wake mode cyclic sample
Wake mode continuous sample
INH/LIMP pin active (See ILC bit)
INH/LIMP pin floating
INH/LIMP pin HIGH if ILEN bit is set
INH/LIMP pin LOW if ILEN bit is set
[1] RLC is set automatically with entering Restart mode or Fail-safe mode. This guarantees a safe reset period in case of serious failure
situations. External reset spikes are lengthened by the SBC until the programmed reset length is reached.
[2] If WEN is not set, the WAKE port is completely disabled. There is no change of the bits EWS and WLS within the System Status
register.
6.12.9 Physical Layer Control register and Physical Layer Control Feedback
register
These registers allow configuration of the LIN transceiver of the SBC and allow the
settings to be read back.
Table 11. Physical Layer Control and Physical Layer Control Feedback register bit description
Bit
Symbol
Description
Value
Function
15 and 14 A1, A0
register address
Read Register Select
11
1
select Physical Layer Control register
read the General Purpose Feedback register 1
read the Physical Layer Control Feedback register
13
RRS
0
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LIN fail-safe system basis chip
Table 11. Physical Layer Control and Physical Layer Control Feedback register bit description …continued
Bit
Symbol
Description
Value
Function
12
RO
Read Only
1
read the register selected by RRS without writing to the
Physical Layer Control register
0
read the register selected by RRS and write to Physical
Layer Control register
11 to 5
4
-
reserved
000 0000 reserved for SBCs with CAN transceiver
LMC
LIN Mode Control
1
0
1
0
1
0
0
1
0
LIN Active mode (in Normal mode and Flash mode only)
LIN Active mode disabled
3
2
LSC
LDC
LIN Slope Control
LIN Driver Control
reserved
up to 10.4 kbit/s (low slope)
up to 20 kbit/s (normal)
increased LIN driver current capability
LIN driver in conformance with the LIN 2.0 standard
reserved for SBCs with CAN transceiver
LIN transmitter is disabled
1
0
-
LTC
LIN Transmitter
Control[1]
LIN transmitter is enabled
[1] In case of an RXDL / TXDL interfacing failure the LIN transmitter is disabled without setting LTC. Recovery from such a failure is
automatic when LIN communication (with correct interfacing levels) is received. Manual recovery is also possible by setting and clearing
the LTC bit under software control.
6.12.10 Special Mode register and Special Mode Feedback register
These registers allow configuration of global SBC parameters during start-up of a system
and allow the settings to be read back.
Table 12. Special Mode register and Special Mode Feedback register bit description
Bit
Symbol
Description
Value
Function
15 and 14 A1, A0
register address
Read Register Select
01
0
select Special Mode register
read the Interrupt Enable Feedback register
read the Special Mode Feedback register
13
12
RRS
RO
1
Read Only
1
read the register selected by RRS without writing to the
Special Mode register
0
0
read the register selected by RRS and write to the
Special Mode register
11 and 10
9
-
reserved
reserved for future use; should remain cleared to ensure
compatibility with future functions which might use this bit
ISDM
Initialize Software
Development Mode[1]
1
0
initialization of software development mode
normal watchdog interrupt, reset monitoring and fail-safe
behavior
8
7
-
-
reserved
reserved
0
0
reserved for SBCs with CAN transceiver
reserved for future use; should remain cleared to ensure
compatibility with future functions which might use this bit
6 and 5
WDPRE[1:0]
Watchdog Prescaler
00
01
10
11
watchdog prescale factor 1
watchdog prescale factor 1.5
watchdog prescale factor 2.5
watchdog prescale factor 3.5
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Table 12. Special Mode register and Special Mode Feedback register bit description …continued
Bit
Symbol
Description
Value
11
Function
4 and 3
V1RTHC[1:0] V1 Reset Threshold
Control
V1 reset threshold = 0.9 × VV1(nom)
V1 reset threshold = 0.7 × VV1(nom)
V1 reset threshold = 0.8 × VV1(nom)
V1 reset threshold = 0.9 × VV1(nom)
[2]
[3]
10
01
00
2 to 0
-
reserved
000
reserved for future use; should remain cleared to ensure
compatibility with future functions which might use this bit
[1] See Section 6.13.1.
[2] Not supported for the UJA1069TW/3V0 and UJA1069TW/3V3 version.
[3] Not supported for the UJA1069TW/3V0 version.
6.12.11 General Purpose registers and General Purpose Feedback registers
The UJA1069 offers two 12-bit General Purpose registers (and accompanying General
Purpose Feedback registers) with no predefined bit definition. These registers can be
used by the microcontroller for advanced system diagnosis or for storing critical system
status information outside the microcontroller. After Power-up General Purpose register 0
will contain a ‘Device Identification Code’ consisting of the SBC type and SBC version.
This code is available until it is overwritten by the microcontroller (as indicated by the DIC
bit).
Table 13. General Purpose register 0 and General Purpose Feedback register 0 bit description
Bit
Symbol
A1, A0
RRS
Description
Value
Function
15, 14
13
register address
Read Register Select
10
1
read the General Purpose Feedback register 0
read the General Purpose Feedback register 0
read the System Configuration Feedback register
0
12
RO
Read Only
1
read the register selected by RRS without writing to the
General Purpose register 0
0
read the register selected by RRS and write to the General
Purpose register 0
11
DIC
Device Identification
Control[1]
1
0
General Purpose register 0 contains user-defined bits
General Purpose register 0 contains the Device
Identification Code
10 to 0
GP0[10:0]
General Purpose bits[2]
1
0
user-defined
user-defined
[1] The Device Identification Control bit is cleared during power-up of the SBC, indicating that General Purpose register 0 is loaded with the
Device Identification Code. Any write access to General Purpose register 0 will set the DIC bit, regardless of the value written to DIC.
[2] During power-up the General Purpose register 0 is loaded with a ‘Device Identification Code’ consisting of the SBC type and SBC
version, and the DIC bit is cleared.
Table 14. General Purpose register 1 and General Purpose Feedback register 1 bit description
Bit
Symbol
Description
Value
Function
15 and 14 A1, A0
register address
Read Register Select
11
1
select General Purpose register 1
read the General Purpose Feedback register 1
read the Physical Layer Control Feedback register
13
RRS
0
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LIN fail-safe system basis chip
Table 14. General Purpose register 1 and General Purpose Feedback register 1 bit description …continued
Bit
Symbol
Description
Value
Function
12
RO
Read Only
1
read the register selected by RRS without writing to the
General Purpose register 1
0
read the register selected by RRS and write to the General
Purpose register
11 to 0
GP1[11:0]
General Purpose bits
1
0
user-defined
user-defined
6.12.12 Register configurations at reset
At Power-on, Start-up and Restart mode the setting of the SBC registers is predefined.
Table 15. System Status register: status at reset
Symbol
RSS
Name
Power-on
Start-up[1]
Restart[1]
Reset Source Status
LIN Wake-up Status
0000 (power-on reset)
0 (no LIN wake-up)
any value except 1100
0000 or 0010 or 1100 or 1110
LWS
1 if reset is caused by a no change
LIN wake-up, otherwise
no change
EWS
Edge Wake-up Status 0 (no edge detected)
1 if reset is caused by a no change
wake-up via pin WAKE,
otherwise no change
WLS
TWS
WAKE Level Status
actual status
actual status
actual status
actual status
actual status
Temperature Warning
Status
0 (no warning)
SDMS
Software Development actual status
Mode Status
actual status
actual status
ENS
Enable Status
0 (EN = LOW)
0 (EN = LOW)
no change
0 (EN = LOW)
no change
PWONS
Power-on Status
1 (power-on reset)
[1] Depends on history.
Table 16. System Diagnosis register: status at reset
Symbol
LINFD
V3D
Name
Power-on
Start-up
Restart
LIN Failure Diagnosis 00 (no failure)
actual status
actual status
actual status
actual status
actual status
actual status
V3 Diagnosis
V1 Diagnosis
1 (OK)
0 (fail)
V1D
Table 17. Interrupt Enable register and Interrupt Enable Feedback register: status at reset
Symbol
Name
Power-on
Start-up
Restart
All
all bits
0 (interrupt disabled)
no change
no change
Table 18. Interrupt register: status at reset
Symbol
Name
Power-on
Start-up
Restart
All
all bits
0 (no interrupt)
0 (no interrupt)
0 (no interrupt)
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Table 19. System Configuration register and System Configuration Feedback register: status at reset
Symbol
RLC
Name
Power-on
0 (short)
00 (off)
Start-up
Restart
Fail-Safe
1 (long)
Reset Length Control
V3 Control
no change
no change
no change
1 (long)
V3C
no change
no change
no change
no change
V1CMC
V1 Current Monitor
Control
0 (watchdog
restart)
WEN
WSC
ILEN
Wake Enable
1 (enabled)
no change
no change
no change
no change
no change
no change
Wake Sample Control 0 (control)
INH/LIMP Enable
0 (floating)
see Figure 12
if ILC = 1,
0 (floating) if ILC = 1, 1 (active)
otherwise no change
otherwise no change
ILC
INH/LIMP Control
0 (LOW)
no change
no change
0 (LOW)
Table 20. Physical Layer Control register and Physical Layer Control Feedback register: status at reset
Symbol
Name
Power-on
Start-up
Restart
Fail-Safe
LMC
LIN Mode Control
0 (Active mode
disabled)
no change
no change
no change
LSC
LDC
LTC
LIN Slope Control
LIN Driver Control
0 (normal)
0 (LIN 2.0)
no change
no change
no change
no change
no change
no change
no change
no change
no change
LIN Transmitter Control 0 (on)
Table 21. Special Mode register: status at reset
Symbol
ISDM
Name
Power-on
Start-up
Restart
Initialize Software Development Mode
Watchdog Prescale Factor
V1 Reset Threshold Control
0 (no)
no change
no change
no change
no change
no change
00 (90 %)
WDPRE
V1RTHC
00 (factor 1)
00 (90 %)
Table 22. General Purpose register 0 and General Purpose Feedback register 0: status at reset
Symbol
DIC
Name
Power-on
Start-up
Restart
Device Identification Control
general purpose bits 10 to 7 (version)
0 (Device ID)
Mask version
no change
no change
no change
no change
no change
GP0[10:7]
GP0[6:0]
general purpose bits 6 to 0 (SBC type) 000 1001 (UJA1069) no change
Table 23. General Purpose register 1 and General Purpose Feedback register 1: status at reset
Symbol
Name
Power-on
Start-up
Restart
GP1[11:0]
general purpose bits 11 to 0
0000 0000 0000
no change
no change
UJA1069_3
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
6.13 Test modes
6.13.1 Software development mode
The Software development mode is intended to support software developers in writing
and pretesting application software without having to work around watchdog triggering
and without unwanted jumps to Fail-safe mode.
In Software development mode the following events do not force a system reset:
• Watchdog overflow in Normal mode
• Watchdog window miss
• Interrupt time-out
• Elapsed start-up time
However, in case of a watchdog trigger failure the reset source information is still provided
in the System Status register as if there was a real reset event.
The exclusion of watchdog related resets allows simplified software testing, because
possible problems in the watchdog triggering can be indicated by interrupts instead of
resets. The SDM bit does not affect the watchdog behavior in Standby and Sleep mode.
This allows the cyclic wake-up behavior to be evaluated during Standby and Sleep mode
of the SBC.
All transitions to Fail-safe mode are disabled. This allows working with an external
emulator that clamps the reset line LOW in debugging mode. A V1 undervoltage of more
than tV1(CLT) is the only exception that results in entering Fail-safe mode (to protect the
SBC). Transitions from Start-up mode to Restart mode are still possible.
There are two possibilities to enter Software development mode. One is by setting the
ISDM bit via the Special Mode register; possible only once after a first battery connection
while the SBC is in Start-up mode. The second possibility to enter Software development
mode is by applying the correct Vth(TEST) input voltage at pin TEST before the battery is
applied to pin BAT42.
To stay in Software development mode the SDM bit in the Mode register has to be set with
each Mode register access (i.e. watchdog triggering) regardless of how Software
development mode was entered.
The Software development mode can be exited at any time by clearing the SDM bit in the
Mode register. Reentering the Software development mode is only possible by
reconnecting the battery supply (pin BAT42), thereby forcing a new power-on reset.
UJA1069_3
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Product data sheet
Rev. 03 — 10 September 2007
38 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
6.13.2 Forced normal mode
For system evaluation purposes the UJA1069 offers the Forced normal mode. This mode
is strictly for evaluation purposes only. In this mode the characteristics as defined in
Section 9 and Section 10 cannot be guaranteed.
In Forced normal mode the SBC behaves as follows:
• SPI access (writing and reading) is blocked
• Watchdog disabled
• Interrupt monitoring disabled
• Reset monitoring disabled
• Reset lengthening disabled
• All transitions to Fail-safe mode are disabled, except a V1 undervoltage for more than
tV1(CLT)
• V1 is started with the long reset time tRSTNL. In case of a V1 undervoltage, a reset is
performed until V1 is restored (normal behavior), and the SBC stays in Forced normal
mode; in case of an overload at V1 > tV1(CLT) Fail-safe mode is entered
• V3 is on; overload protection active
• LIN is in Active mode and cannot switch to Off-line mode
• INH/LIMP pin is HIGH
• SYSINH is HIGH
• EN pin at same level as RSTN pin
Forced normal mode is activated by applying the correct Vth(TEST) input voltage at the
TEST pin during first battery connection.
UJA1069_3
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Product data sheet
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39 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
7. Limiting values
Table 24. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol
Parameter
Conditions
Min
−0.3
-
Max
+60
+60
Unit
V
VBAT42
BAT42 supply voltage
load dump; t ≤ 500 ms
V
VBAT14
BAT14 supply voltage
VBAT42 ≥ VBAT14 − 1 V
continuous
−0.3
+33
+45
V
V
load dump; t ≤ 500 ms
-
VDC(n)
DC voltage on pins
V1
−0.3
−1.5
−0.3
−0.3
−1.5
−60
+5.5
V
V
V
V
V
V
V
V3 and SYSINH
INH/LIMP
VBAT42 + 0.3
VBAT42 + 0.3
VBAT42 + 1.2
+60
SENSE
WAKE
LIN and RTLIN
with respect to any other pin
+60
TXDL, RXDL, SDO, SDI, SCK, SCS,
RSTN, INTN and EN
−0.3
VV1 + 0.3
TEST
−0.3
+15
V
V
Vtrt
transient voltage at pin LIN
in accordance with
ISO 7637-3
−150
+100
[1]
IWAKE
Tstg
DC current at pin WAKE
storage temperature
−15
−55
−40
−40
-
mA
°C
°C
°C
+150
+125
+150
Tamb
Tvj
ambient temperature
[2]
[3]
[4]
virtual junction temperature
electrostatic discharge voltage
Vesd
HBM
at pins LIN, RTLIN,
WAKE, BAT42, V3,
SENSE; with respect to
GND
−8.0
+8.0
kV
at any other pin
MM; at any pin
−2.0
+2.0
kV
V
[5]
−200
+200
[1] Only relevant if VWAKE < VGND − 0.3 V; current will flow into pin GND.
[2] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd × Rth(vj-amb), where Rth(vj-amb)
is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and
ambient temperature (Tamb).
[3] Human Body Model (HBM): C = 100 pF; R = 1.5 kΩ.
[4] ESD performance according to IEC 61000-4-2 (C = 150 pF, R = 330 Ω) of pins LIN, RTLIN, WAKE, BAT42 and V3 with respect to GND
was verified by an external test house. Following results were obtained:
a) Equal or better than ±4 kV (unaided)
b) Equal or better than ±20 kV for pin LIN (using external ESD protection: NXP Semiconductors PESD1LIN diode)
[5] Machine Model (MM): C = 200 pF; L = 0.75 µH; R = 10 Ω.
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
40 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
8. Thermal characteristics
V1 dissipation
V3 dissipation
other dissipation
T
vj
6 K/W
23 K/W
6 K/W
6 K/W
T
T
(heat sink)
001aad671
case
R
th(c-a)
amb
Fig 15. Thermal model of the HTSSOP32 package
V1 dissipation
V3 dissipation
other dissipation
T
vj
6 K/W
17 K/W
6 K/W
6 K/W
T
T
(heat sink)
case
R
th(c-a)
amb
001aae136
Fig 16. Thermal model of the HTSSOP24 package
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
41 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
9. Static characteristics
Table 25. Static characteristics
Tvj = −40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply; pin BAT42
IBAT42
BAT42 supply
current
V1 and V3 off; LIN in Off-line
mode; OTIE = BATFIE = 0;
I
I
SYSINH = IWAKE = IRTLIN
LIN = 0 mA
=
VBAT42 = 8.1 V to 52 V
VBAT42 = 5.5 V to 8.1 V
-
-
-
-
-
50
70
53
0
70
93
76
1
µA
µA
µA
µA
µA
IBAT42(add)
additional BAT42
supply current
V1 on; ISYSINH = 0 mA
V3 in Cyclic mode; IV3 = 0 mA
V3 continuously on;
IV3 = 0 mA
30
50
Tvj warning enabled; OTIE = 1
SENSE enabled; BATFIE = 1
LIN in Active mode;
-
-
-
20
2
40
µA
µA
µA
7
650
1300
LMC = 1; VTXDL = VV1
RTLIN = ILIN = 0 mA
;
I
LIN in Active mode; LMC = 1;
VTXDL = 0 V (t < tLIN(dom)(det));
IRTLIN = ILIN = 0 mA
VBAT42 = 12 V
-
-
1.5
3
5
mA
mA
VBAT42 = 27 V
10
VPOR(BAT42)
BAT42 voltage level for setting PWONS
for power-on reset
PWONS = 0; VBAT42 falling
4.45
4.75
-
-
5
V
status bit change
for clearing PWONS
PWONS = 1; VBAT42 rising
-
5.5
5
V
Supply; pin BAT14
IBAT14
BAT14 supply
current
V1 off; LIN in Off-line mode;
ILEN = 0; IINH/LIMP = 0 mA
2
µA
IBAT14(add)additional BAT14 supply current V1 on; IV1 = 0 mA
V1 on; IV1 = 0 mA;
-
-
200
150
300
200
µA
µA
VBAT14 = 12 V
INH/LIMP enabled; ILEN = 1;
IINH/LIMP = 0 mA
-
1
-
2
µA
V
VBAT14
BAT14 voltage level for normal output current
capability at V1
9
6
27
8
for high output current
capability at V1
-
V
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Table 25. Static characteristics …continued
Tvj = −40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Battery supply monitor input; pin SENSE
Vth(SENSE)
input threshold low
battery voltage
detection
1
2.5
-
3
V
release
1.7
20
5
4
V
IIH(SENSE)
HIGH-level input
current
Normal mode; BATFIE = 1
Standby mode; BATFIE = 1
50
10
0.2
100
20
2
µA
µA
µA
Normal mode or Standby
mode; BATFIE = 0
-
Voltage source; pin V1[2]; see also Figure 17 to Figure 23
Vo(V1)
output voltage
VBAT14 = 5.5 V to 18 V;
V1 = −120 mA to −5 mA;
Tj = 25 °C
VV1(nom)
0.1
−
−
VV1(nom)
VV1(nom)
0.1
+
+
V
I
VBAT14 = 14 V; IV1 = −5 mA;
VV1(nom)
0.025
VV1(nom)
VV1(nom)
0.025
V
Tj = 25 °C
∆VV1
supply voltage
regulation
VBAT14 = 9 V to 16 V;
-
1
5
25
mV
mV
I
V1 = −5 mA; Tj = 25 °C
VBAT14 = 14 V;
V1 = −50 mA to −5 mA;
load regulation
-
25
I
Tj = 25 °C
[3]
voltage drift with
temperature
VBAT14 = 14 V; IV1 = −5 mA;
Tj = −40 °C to +150 °C
-
-
200
ppm/K
Vdet(UV)(V1)
undervoltage
detection and reset V1RTHC[1:0] = 00 or 11
activation level
V
BAT14 = 14 V;
0.90 ×
VV1(nom)
0.92 ×
VV1(nom)
0.95 ×
VV1(nom)
V
V
V
V
V
V
V
VBAT14 = 14 V;
V1RTHC[1:0] = 01
0.80 ×
VV1(nom)
0.82 ×
VV1(nom)
0.85 ×
VV1(nom)
VBAT14 = 14 V;
V1RTHC[1:0] = 10
0.70 ×
VV1(nom)
0.72 ×
VV1(nom)
0.75 ×
VV1(nom)
Vrel(UV)(V1)
undervoltage
detection release
level
VBAT14 = 14 V;
-
-
-
0.94 ×
VV1(nom)
-
-
-
V1RTHC[1:0] = 00 or 11
VBAT14 = 14 V;
V1RTHC[1:0] = 01
0.84 ×
VV1(nom)
VBAT14 = 14 V;
V1RTHC[1:0] = 10
0.74 ×
VV1(nom)
VUV(VFI)
IthH(V1)
IthL(V1)
undervoltage level
for generating a VFI
interrupt
VBAT14 = 14 V; VFIE = 1
0.90 ×
VV1(nom)
0.93 ×
VV1(nom)
0.97 ×
VV1(nom)
undercurrent
threshold for
watchdog enable
−10
−6
−5
−3
−2
mA
mA
undercurrent
−1.5
threshold for
watchdog disable
UJA1069_3
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Product data sheet
Rev. 03 — 10 September 2007
43 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Table 25. Static characteristics …continued
Tvj = −40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IV1
output current
capability
VBAT14 = 9 V to 27 V;
δVV1 = 0.05 × VV1(nom)
−200
−135
−120
mA
VBAT14 = 9 V to 27 V;
V1 shorted to GND
−200
−110
-
mA
mA
mA
Ω
VBAT14 = 8 V to 9 V;
δVV1 = 0.05 × VV1(nom)
-
-
-
-
−120
−150
5
VBAT14 = 5.5 V to 8 V;
δVV1 = 0.05 × VV1(nom)
-
Zds(on)
regulator impedance VBAT14 = 4 V to 5 V
between pins BAT14
3
and V1
Voltage source; pin V3
VBAT42-V3(drop)
Idet(OL)(V3)
IL
VBAT42 to VV3 voltage VBAT42 = 9 V to 52 V;
-
-
1.0
−60
5
V
drop
IV3 = −20 mA
overload current
VBAT42 = 9 V to 52 V
−165
-
mA
µA
detection threshold
leakage current
VV3 = 0 V; V3C[1:0] = 00
-
0
System inhibit output; pin SYSINH
VBAT42-SYSINH(drop) VBAT42 to VSYSINH
voltage drop
ISYSINH = −0.2 mA
-
-
1.0
-
2.0
5
V
IL
leakage current
VSYSINH = 0 V
µA
Inhibit/limp-home output; pin INH/LIMP
VBAT14-INH(drop)
VBAT14 to VINH
voltage drop
IINH/LIMP = −10 µA;
ILEN = ILC = 1
-
0.7
1.2
-
1.0
2.0
4
V
IINH/LIMP = −200 µA;
ILEN = ILC = 1
-
V
Io(INH/LIMP)
IL
output current
capability
VINH/LIMP = 0.4 V;
ILEN = 1; ILC = 0
0.8
-
mA
µA
leakage current
VINH/LIMP = 0 V to VBAT14
ILEN = 0
;
-
5
Wake input; pin WAKE
Vth(WAKE) wake-up voltage
threshold
pull-up input current VWAKE = 0 V
Serial peripheral interface inputs; pins SDI, SCK and SCS
2.0
3.3
-
5.2
V
IWAKE(pu)
−25
−1.3
µA
VIH(th)
HIGH-level input
threshold voltage
0.7 × VV1
−0.3
50
-
VV1 + 0.3
+0.3 × VV1
400
V
VIL(th)
LOW-level input
threshold voltage
-
V
Rpd(SCK)
Rpu(SCS)
pull-down resistor at VSCK = 2 V; VV1 ≥ 2 V
pin SCK
130
130
kΩ
kΩ
pull-up resistor at
pin SCS
VSCS = 1 V; VV1 ≥ 2 V
50
400
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
44 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Table 25. Static characteristics …continued
Tvj = −40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ISDI
input leakage current VSDI = 0 V to VV1
at pin SDI
−5
-
+5
µA
Serial peripheral interface data output; pin SDO
IOH
HIGH-level output
current
VSCS = 0 V; VO = VV1 − 0.4 V
−50
1.6
−5
-
-
-
−1.6
20
mA
mA
µA
IOL
LOW-level output
current
VSCS = 0 V; VO = 0.4 V
IOL(off)
OFF-state output
leakage current
VSCS = VV1; VO = 0 V to VV1
+5
Reset output with clamping detection; pin RSTN
IOH
HIGH-level output
current
VRSTN = 0.7 × VV1(nom)
−1000
-
-
-
-
-
−50
µA
mA
V
IOL
LOW-level output
current
VRSTN = 0.9 V
1
5
VOL
LOW-level output
voltage
VV1 = 1.5 V to 5.5 V;
pull-up resistor to V1 ≥ 4 kΩ
0
0.2 × VV1
VV1 + 0.3
+0.3 × VV1
VIH(th)
VIL(th)
HIGH-level input
threshold voltage
0.7 × VV1
−0.3
V
LOW-level input
threshold voltage
V
Enable output; pin EN
IOH HIGH-level output
VOH = VV1 − 0.4 V
VOL = 0.4 V
−20
1.6
0
-
-
-
−1.6
20
mA
mA
V
current
IOL
LOW-level output
current
VOL
LOW-level output
voltage
IOL = 20 µA; VV1 = 1.2 V
0.4
Interrupt output; pin INTN
IOL LOW-level output
current
LIN transmit data input; pin TXDL
VOL = 0.4 V
1.6
-
15
mA
VIL
LOW level input
voltage
−0.3
-
+0.3 × VV1
VV1 + 0.3
25
V
VIH
HIGH-level input
voltage
0.7 × VV1
-
V
RTXDL(pu)
TXDL pull-up
resistor
VTXDL = 0 V
5
12
kΩ
LIN receive data output; pin RXDL
IOH
HIGH-level output
current
VRXDL = VV1 − 0.4 V
−50
-
-
−1.6
mA
mA
IOL
LOW-level output
current
VRXDL = 0.4 V
1.6
20
LIN-bus line; pin LIN
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
45 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Table 25. Static characteristics …continued
Tvj = −40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vo(dom)
LIN dominant output Active mode;
0
-
0.20 ×
V
voltage
V
BAT42 = 7 V to 18 V;
LDC = 0; t < tTXDL(dom)(dis)
TXDL = 0 V;
BAT42-LIN = 500 Ω
VBAT42
;
V
R
Active mode;
0.7
1.4
2.1
V
VBAT42 = 7.6 V to 18 V;
LDC = 1; t < tTXDL(dom)(dis)
;
VTXDL = 0 V; ILIN = 40 mA
ILIH
HIGH-level input
leakage current
VLIN = VBAT42; VTXDL = VV1
−10
−10
0
0
+10
+10
µA
µA
VBAT42 = 8 V;
V
V
LIN = 8 V to 18 V;
TXDL = VV1
ILIL
LOW-level input
leakage current
VBAT42 = 12 V; VLIN = 0 V;
TXDL = VV1
−100
-
-
µA
V
Io(sc)
short-circuit output
current
Active mode;
27
40
60
mA
VLIN = VBAT42 = 12 V;
V
TXDL = 0 V; t < tTXDL(dom)(dis)
;
;
LDC = 0
Active mode;
40
-
60
90
mA
VLIN = VBAT42 = 18 V;
VTXDL = 0 V; t < tTXDL(dom)(dis)
LDC = 0
Vth(dom)
Vth(reces)
Vth(hyst)
Vth(cen)
receiver dominant
state
VBAT42 = 7 V to 27 V
-
-
-
0.4 ×
VBAT42
V
receiver recessive
state
VBAT42 = 7 V to 27 V
VBAT42 = 7 V to 27 V
VBAT42 = 7 V to 27 V
0.6 ×
VBAT42
-
V
receiver threshold
voltage hysteresis
0.05 ×
VBAT42
0.175 ×
VBAT42
V
receiver threshold
voltage center
0.475 ×
VBAT42
0.500 ×
VBAT42
0.525 ×
VBAT42
V
[3]
Ci
IL
input capacitance
leakage current
-
-
10
pF
VLIN = 0 V to 18 V
VBAT42 = 0 V
−5
0
0
+5
µA
µA
VGND = VBAT42 = 12 V
−10
+10
LIN-bus termination resistor connection; pin RTLIN
VRTLIN
RTLIN output
voltage
Active mode; IRTLIN = −10 µA;
BAT42 = 7 V to 27 V
VBAT42
1.0
−
VBAT42
0.7
−
VBAT42
0.2
−
V
V
V
Off-line mode;
RTLIN = −10 µA;
BAT42 = 7 V to 27 V
VBAT42
1.2
−
VBAT42
1.0
−
-
I
V
∆VRTLIN
RTLIN load
regulation
Active mode;
RTLIN = −10 µA to −10 mA;
BAT42 = 7 V to 27 V
-
0.65
2
V
I
V
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
46 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Table 25. Static characteristics …continued
Tvj = −40 °C to +150 °C, VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IRTLIN(pu)
RTLIN pull-up
current
Active mode;
−150
−60
−35
µA
VRTLIN = VLIN = 0 V;
t > tLIN(dom)(det)
Off-line mode;
−150
−10
−60
−35
µA
µA
VRTLIN = VLIN = 0 V;
t < tLIN(dom)(det)
ILL
LOW-level leakage
current
Off-line mode;
0
+10
VRTLIN = VLIN = 0 V;
t > tLIN(dom)(det)
TEST input; pin TEST
Vth(TEST) input threshold
for entering Software
development mode;
Tj = 25 °C
1
5
8
V
voltage
for entering Forced normal
mode; Tj = 25 °C
2
2
10
4
13.5
8
V
R(pd)TEST
pull-down resistor
between pin TEST and GND
kΩ
Temperature detection
Tj(warn) high junction
160
175
190
°C
temperature warning
level
[1] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient
temperature on wafer level (pretesting). Cased products are 100 % tested at 25 °C ambient temperature (final testing). Both pretesting
and final testing use correlated test conditions to cover the specified temperature and power supply voltage range.
[2] VV1(nom) is 3 V, 3.3 V or 5 V, depending on the SBC version.
[3] Not tested in production.
UJA1069_3
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Product data sheet
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47 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
001aaf215
6
5
4
3
2
V
V1
(V)
type 5V0
I
=
V1
−100 µA
−50 mA
−120 mA
−250 mA
type 3V3
type 3V0
2
3
4
5
6
7
V
(V)
BAT14
a. Tj = 25 °C.
001aaf244
6
V
V1
(V)
type 5V0
5
4
3
2
I
=
V1
−100 µA
−50 mA
−120 mA
−250 mA
type 3V3
type 3V0
2
3
4
5
6
7
V
(V)
BAT14
b. Tj = 150 °C.
Fig 17. V1 output voltage (dropout) as a function of battery voltage
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
48 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
001aaf246
10
− I
T = +150 °C
j
I
BAT14
V1
(mA)
8
6
4
2
0
T = −40 °C
j
+25 °C
+150 °C
+25 °C
−40 °C
(1)
(2)
V
= 8 V
BAT14
5.5 V
0
−50
−100
−150
−200
−250
I
(mA)
V1
(1) Types 5V0, 3V3 and 3V0.
(2) Type 5V0 only.
a. At Tj = −40 °C, +25 °C and +150 °C.
001aaf247
5
I
− I
V1
BAT14
(mA)
4
3
2
1
0
(1)
(2)
V
= 9 V to 27 V
BAT14
5.5 V
0
−50
−100
−150
−200
−250
I
(mA)
V1
(1) Types 5V0, 3V3 and 3V0.
(2) Types 3V3 and 3V0.
b. At Tj = −40 °C to +150 °C.
Fig 18. V1 quiescent current as a function of output current
UJA1069_3
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Product data sheet
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
001aaf245
6
4
2
0
type 5V0
V
V1
(V)
type 3V3
type 3V0
0
−40
−80
−120
−160
I
(mA)
V1
VBAT14 = 9 V to 27 V.
Tj = 25 °C to 125 °C.
Fig 19. V1 output voltage as a function of output current
001aaf248
160
PSRR
(dB)
V
= 14 V
14 V
BAT14
120
80
40
0
T = 25 °C
j
150 °C
5.5 V
25 °C to 150 °C
(1)
5.5 V
150 °C
2
3
1
10
10
10
f (Hz)
IV1 = −120 mA.
(1) Type 5V0 only.
Fig 20. V1 power supply ripple rejection as a function of frequency
UJA1069_3
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Product data sheet
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
001aaf250
200
16
V
∆V
V1
(mV)
BAT14
(V)
V
BAT14
12
100
∆V
V1
8
0
4
−100
500
0
100
200
300
400
t (µs)
IV1 = −5 mA; C = 1 µF; ESR = 0.01 Ω; Tj = 25 °C.
a. Line transient response
001aaf251
−75
400
I
∆V
V1
V1
(mA)
(mV)
−25
200
I
V1
∆V
V1
25
75
0
−200
500
0
100
200
300
400
t (µs)
VBAT14 = 14 V; C = 1 µF; ESR = 0.01 Ω; Tj = 25 °C.
b. Load transient response
Fig 21. V1 transient response as a function of time
UJA1069_3
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Product data sheet
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
001aaf249
1
ESR
(Ω)
−1
−2
−3
10
10
10
stable operation area
unstable operation area
0
−40
−80
−120
I
(mA)
V1
Fig 22. V1 output stability related to ESR value of output capacitor
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
I
= 30 mA
load
BAT42
BAT14
V1
SBC
100 µF/
0.1 Ω
100
nF
47 µF/
0.1 Ω
V
R
load
BAT
100
nF
GND
001aaf572
a. Test circuit
001aaf573
6
4
2
0
type 5V0
V
V1
(V)
V
= 8 V
BAT
type 3V3
type 3V0
V
= 5.5 V
BAT
V
= 12 V
BAT
0
0.4
0.8
1.2
1.6
2.0
t (µs)
b. Behavior at Tj = 25 °C
001aaf574
6
type 5V0
V
V1
(V)
V
= 8 V
BAT
4
2
0
type 3V3
type 3V0
V
= 5.5 V
BAT
V
= 12 V
BAT
0
0.4
0.8
1.2
1.6
2.0
t (µs)
c. Behavior at Tj = 85 °C
Fig 23. Switch-on behavior of VV1
UJA1069_3
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Product data sheet
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
10. Dynamic characteristics
Table 26. Dynamic characteristics
Tvj = −40 °C to +150 °C; VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Serial peripheral interface timing; pins SCS, SCK, SDI and SDO (see Figure 24)[2]
Tcyc
tlead
clock cycle time
enable lead time
960
240
-
-
-
-
ns
ns
clock is low when SPI select
falls
tlag
enable lag time
clock is low when SPI select
rises
240
-
-
ns
tSCKH
tSCKL
tsu
clock HIGH time
480
480
80
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
clock LOW time
-
input data setup time
input data hold time
output data valid time
SPI select HIGH time
-
th
400
-
-
tDOV
pin SDO; CL = 10 pF
400
-
tSSH
480
LIN transceiver; pins LIN, TXDL and RXDL[3]
[4]
[5]
[4]
[5]
δ1
δ2
δ3
δ4
duty cycle 1
duty cycle 2
duty cycle 3
duty cycle 4
Vth(reces)(max) = 0.744 × VBAT42
th(dom)(max) = 0.581 × VBAT42
LSC = 0; tbit = 50 µs;
;
0.396
-
-
-
-
-
V
;
V
BAT42 = 7 V to 18 V
th(reces)(min) = 0.422 × VBAT42
th(dom)(min) = 0.284 × VBAT42
V
V
;
-
0.581
;
LSC = 0; tbit = 50 µs;
V
BAT42 = 7.6 V to 18 V
th(reces)(max) = 0.778 × VBAT42
th(dom)(max) = 0.616 × VBAT42
V
V
;
0.417
-
;
LSC = 1; tbit = 96 µs;
V
BAT42 = 7 V to 18 V
th(reces)(min) = 0.389 × VBAT42
th(dom)(min) = 0.251 × VBAT42
V
V
;
-
0.590
;
LSC = 1; tbit = 96 µs;
BAT42 = 7.6 V to 18 V
V
tp(rx)
propagation delay of
receiver
CRXDL = 20 pF
-
-
-
-
6
µs
µs
µs
tp(rx)(sym)
tBUS(LIN)
symmetry of receiver
propagation delay
rising edge with respect to
falling edge; CRXDL = 20 pF
−2
30
+2
150
minimum dominant time for Off-line mode
wake-up of the
LIN-transceiver
tLIN(dom)(det)
continuously dominant
clamped LIN-bus detection
time
Active mode; VLIN = 0 V
40
-
-
160
2.2
ms
ms
tLIN(dom)(rec)
continuously dominant
clamped LIN-bus recovery
time
Active mode
0.8
UJA1069_3
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Product data sheet
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Table 26. Dynamic characteristics …continued
Tvj = −40 °C to +150 °C; VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tTXDL(dom)(dis) TXDL permanent dominant Active mode; VTXDL = 0 V
disable time
20
-
80
ms
Battery monitoring
tBAT42(L)
BAT42 LOW time for
setting PWONS
5
5
-
-
20
20
µs
µs
tSENSE(L)
BAT42 LOW time for
setting BATFI
Power supply V1; pin V1
tV1(CLT) V1 clamped LOW time
during ramp-up of V1
Power supply V3; pin V3
Start-up mode; V1 active
229
-
283
ms
tw(CS)
cyclic sense period
V3C[1:0] = 10; see Figure 13
V3C[1:0] = 11; see Figure 13
V3C[1:0] = 10; see Figure 13
V3C[1:0] = 11; see Figure 13
14
-
-
-
-
18
ms
ms
µs
28
36
ton(CS)
cyclic sense on-time
345
345
423
423
µs
Wake-up input; pin WAKE
tWU(ipf) input port filter time
VBAT42 = 5 V to 27 V
VBAT42 = 27 V to 52 V
5
-
-
-
120
250
390
µs
µs
µs
30
310
tsu(CS)
cyclic sense sample setup V3C[1:0] = 11 or 10;
time
see Figure 13
Watchdog
tWD(ETP)
earliest watchdog trigger
point
programmed Nominal
Watchdog Period (NWP);
Normal mode
0.45 × NWP -
0.55 × NWP
1.1 × NWP
tWD(LTP)
latest watchdog trigger
point
programmed nominal
watchdog period; Normal
mode, Standby mode and
Sleep mode
0.9 × NWP
-
tWD(init)
watchdog initializing period watchdog time-out in Start-up
mode
229
1.3
-
283
1.7
ms
s
Fail-safe mode
tret
retention time
Fail-safe mode; wake-up
detected
1.5
Reset output; pin RSTN
tRSTN(CHT)
clamped HIGH time,
pin RSTN
RSTN driven LOW internally
but RSTN pin remains HIGH
115
229
-
-
141
283
ms
ms
tRSTN(CLT)
clamped LOW time,
pin RSTN
RSTN driven HIGH internally
but RSTN pin remains LOW
tRSTN(INT)
tRSTNL
interrupt monitoring time
reset lengthening time
INTN = LOW
229
0.9
-
-
283
1.1
ms
ms
after internal or external reset
has been released; RLC = 0
after internal or external reset
has been released; RLC =1
18
-
22
ms
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
55 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
Table 26. Dynamic characteristics …continued
Tvj = −40 °C to +150 °C; VBAT42 = 5.5 V to 52 V; VBAT14 = 5.5 V to 27 V; VBAT42 ≥ VBAT14 − 1 V; unless otherwise specified. All
voltages are defined with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Interrupt output; pin INTN
tINTN
interrupt release
after SPI has read out the
Interrupt register
2
-
-
µs
Oscillator
fosc
oscillator frequency
460.8
512
563.2
kHz
[1] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient
temperature on wafer level (pretesting). Cased products are 100 % tested at 25 °C ambient temperature (final testing). Both pretesting
and final testing use correlated test conditions to cover the specified temperature and power supply voltage range.
[2] SPI timing is guaranteed for VBAT42 voltages down to 5 V. For VBAT42 voltages down to 4.5 V the guaranteed SPI timing values double, so
at these lower voltages a lower maximum SPI communication speed must be observed.
[3] tbit = selected bit time, depends on LSC bit; 50 µs or 96 µs (20 kbit/s or 10.4 kbit/s respectively); bus load conditions (R1/R2/C1):
1 kΩ/1 kΩ/10 nF; 1 kΩ/2 kΩ/6.8 nF; 1 kΩ/open/1 nF; see Figure 25 and Figure 26.
tbus(rec)(min)
[4] δ1, δ3 =
[5] δ2, δ4 =
-------------------------------
2 × tbit
tbus(rec)(max)
--------------------------------
2 × tbit
SCS
t
t
t
SSH
T
lead
lag
cyc
t
t
SCKL
SCKH
SCK
SDI
t
t
h
su
MSB
LSB
X
X
t
DOV
floating
floating
SDO
X
MSB
LSB
001aaa405
Fig 24. SPI timing
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
56 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
BAT42
SBC
GND
RXDL
TXDL
RTLIN
LIN
R1
R2
C1
20 pF
001aad179
Fig 25. Timing test circuit for LIN transceiver
t
t
t
bit
bit
bit
V
TXDL
t
t
bus(rec)(min)
bus(dom)(max)
V
BAT42
V
V
th(reces)(max)
th(dom)(max)
thresholds of
receiving node 1
LIN BUS
signal
V
V
th(reces)(min)
th(dom)(min)
thresholds of
receiving node 2
t
t
bus(rec)(max)
bus(dom)(min)
V
V
RXDL1
RXDL2
receiving
node 1
t
t
p(rx)r
p(rx)f
receiving
node 2
t
t
p(rx)f
p(rx)r
001aaa346
Fig 26. Timing diagram LIN transceiver
11. Test information
Immunity against automotive transients (malfunction and damage) in accordance with LIN
EMC Test Specification / Version 1.0; August 1, 2004.
11.1 Quality information
This product has been qualified to the appropriate Automotive Electronics Council (AEC)
standard Q100 or Q101 and is suitable for use in automotive critical applications.
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
57 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
12. Package outline
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT549-1
E
A
D
X
c
H
v
M
A
y
exposed die pad side
E
D
h
Z
32
17
A
(A )
3
2
E
A
h
A
1
pin 1 index
θ
L
p
L
detail X
1
16
w
M
b
e
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
A
(1)
(2)
UNIT
A
A
A
b
c
D
D
E
E
e
H
L
L
p
v
w
y
Z
θ
1
2
3
p
h
h
E
max.
8o
0o
0.15 0.95
0.05 0.85
0.30 0.20 11.1
0.19 0.09 10.9
5.1
4.9
6.2
6.0
3.6
3.4
8.3
7.9
0.75
0.50
0.78
0.48
mm
1.1
0.65
1
0.2
0.25
0.1
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
03-04-07
05-11-02
SOT549-1
MO-153
Fig 27. Package outline SOT549-1 (HTSSOP32)
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
58 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
HTSSOP24: plastic thermal enhanced thin shrink small outline package; 24 leads;
body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
SOT864-1
D
E
A
c
y
X
exposed die pad
M
H
E
v
A
D
H
Z
13
24
(A )
3
A
2
A
E
h
A
1
pin 1 index
θ
L
p
detail X
L
1
12
e
M
w
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
UNIT
A
1
A
2
A
3
b
c
D
D
E
E
e
H
E
L
L
p
v
w
y
Z
θ
p
h
h
max
°
°
0.15 0.95
0.05 0.80
0.30 0.2
0.19 0.1
7.9
7.7
4.3
4.1
4.5
4.3
3.3
3.1
6.6
6.2
0.75
0.50
0.5
0.2
8
0
mm
1.1
0.25
0.65
1
0.2 0.13 0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
04-09-23
05-12-06
SOT864-1
MO-153
Fig 28. Package outline SOT864-1 (HTSSOP24)
UJA1069_3
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Product data sheet
Rev. 03 — 10 September 2007
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
13. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus PbSn soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
UJA1069_3
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UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 29) than a PbSn process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 27 and 28
Table 27. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
235
≥ 350
220
< 2.5
≥ 2.5
220
220
Table 28. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 29.
UJA1069_3
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Product data sheet
Rev. 03 — 10 September 2007
61 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 29. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Revision history
Table 29. Revision history
Document ID
UJA1069_3
Release date
20070910
Data sheet status
Change notice
Supersedes
Product data sheet
-
UJA1069_2
Modifications:
• The symbols LWEN and ERREM have been removed from Table 20 and Table 21 respectively.
• Changes have been made to some values in Table 5, Table 11 and Table 22.
UJA1069_2
UJA1069_1
20070305
Preliminary data sheet
-
UJA1069_1
20051222
Objective data sheet
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-
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
62 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
15.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
16. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
UJA1069_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 10 September 2007
63 of 64
UJA1069
NXP Semiconductors
LIN fail-safe system basis chip
17. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
6.7.6.3
6.8
6.9
6.10
6.11
LIN recessive clamping . . . . . . . . . . . . . . . . . 21
Inhibit and limp-home output . . . . . . . . . . . . . 21
Wake-up input . . . . . . . . . . . . . . . . . . . . . . . . 22
Interrupt output. . . . . . . . . . . . . . . . . . . . . . . . 23
Temperature protection . . . . . . . . . . . . . . . . . 23
SPI interface. . . . . . . . . . . . . . . . . . . . . . . . . . 24
SPI register mapping . . . . . . . . . . . . . . . . . . . 25
Register overview. . . . . . . . . . . . . . . . . . . . . . 25
Mode register . . . . . . . . . . . . . . . . . . . . . . . . . 25
System Status register. . . . . . . . . . . . . . . . . . 28
System Diagnosis register . . . . . . . . . . . . . . . 29
Interrupt Enable register and Interrupt
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
LIN transceiver . . . . . . . . . . . . . . . . . . . . . . . . . 2
Power management . . . . . . . . . . . . . . . . . . . . . 2
Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 3
2.1
2.2
2.3
2.4
6.12
6.12.1
6.12.2
6.12.3
6.12.4
6.12.5
6.12.6
3
4
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Enable Feedback register . . . . . . . . . . . . . . . 30
Interrupt register. . . . . . . . . . . . . . . . . . . . . . . 31
System Configuration register and System
Configuration Feedback register . . . . . . . . . . 32
Physical Layer Control register and Physical
Layer Control Feedback register . . . . . . . . . . 33
6
6.1
6.2
Functional description . . . . . . . . . . . . . . . . . . . 7
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Fail-safe system controller . . . . . . . . . . . . . . . . 7
Start-up mode. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Restart mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Fail-safe mode . . . . . . . . . . . . . . . . . . . . . . . . . 9
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . 10
Sleep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Flash mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
On-chip oscillator . . . . . . . . . . . . . . . . . . . . . . 12
Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Watchdog start-up behavior . . . . . . . . . . . . . . 13
Watchdog window behavior . . . . . . . . . . . . . . 13
Watchdog time-out behavior. . . . . . . . . . . . . . 14
Watchdog OFF behavior. . . . . . . . . . . . . . . . . 14
System reset. . . . . . . . . . . . . . . . . . . . . . . . . . 15
RSTN pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
EN output . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Power supplies . . . . . . . . . . . . . . . . . . . . . . . . 17
BAT14, BAT42 and SYSINH . . . . . . . . . . . . . . 17
SYSINH output . . . . . . . . . . . . . . . . . . . . . . . . 17
SENSE input. . . . . . . . . . . . . . . . . . . . . . . . . . 17
Voltage regulator V1 . . . . . . . . . . . . . . . . . . . . 17
Switched battery output V3. . . . . . . . . . . . . . . 18
LIN transceiver . . . . . . . . . . . . . . . . . . . . . . . . 18
Mode control. . . . . . . . . . . . . . . . . . . . . . . . . . 18
Active mode . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Off-line mode . . . . . . . . . . . . . . . . . . . . . . . . . 19
LIN wake-up . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Termination control . . . . . . . . . . . . . . . . . . . . . 20
LIN slope control. . . . . . . . . . . . . . . . . . . . . . . 20
LIN driver capability . . . . . . . . . . . . . . . . . . . . 21
Bus and TXDL failure detection . . . . . . . . . . . 21
TXDL dominant clamping . . . . . . . . . . . . . . . . 21
LIN dominant clamping. . . . . . . . . . . . . . . . . . 21
6.12.7
6.12.8
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.3
6.12.9
6.12.10 Special Mode register and Special Mode
Feedback register. . . . . . . . . . . . . . . . . . . . . . 34
6.12.11 General Purpose registers and General
Purpose Feedback registers . . . . . . . . . . . . . 35
6.12.12 Register configurations at reset . . . . . . . . . . . 36
6.13
6.13.1
6.13.2
Test modes. . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Software development mode . . . . . . . . . . . . . 38
Forced normal mode . . . . . . . . . . . . . . . . . . . 39
6.4
6.4.1
6.4.2
6.4.3
6.4.4
6.5
6.5.1
6.5.2
6.6
6.6.1
6.6.1.1
6.6.2
6.6.3
6.6.4
6.7
6.7.1
6.7.1.1
6.7.1.2
6.7.2
6.7.3
6.7.4
6.7.5
6.7.6
6.7.6.1
6.7.6.2
7
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 40
Thermal characteristics . . . . . . . . . . . . . . . . . 41
Static characteristics . . . . . . . . . . . . . . . . . . . 42
Dynamic characteristics. . . . . . . . . . . . . . . . . 54
Test information. . . . . . . . . . . . . . . . . . . . . . . . 57
Quality information . . . . . . . . . . . . . . . . . . . . . 57
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 58
8
9
10
11
11.1
12
13
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Introduction to soldering. . . . . . . . . . . . . . . . . 60
Wave and reflow soldering . . . . . . . . . . . . . . . 60
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 60
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 61
13.1
13.2
13.3
13.4
14
Revision history . . . . . . . . . . . . . . . . . . . . . . . 62
15
Legal information . . . . . . . . . . . . . . . . . . . . . . 63
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 63
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 63
15.1
15.2
15.3
15.4
16
17
Contact information . . . . . . . . . . . . . . . . . . . . 63
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 September 2007
Document identifier: UJA1069_3
相关型号:
UJA1069TW/5V0
IC DATACOM, ETHERNET TRANSCEIVER, PDSO32, 6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT549-1, HTSSOP-32, Network Interface
NXP
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